A polishing device for processing copper metal materials

Abstract

The present invention relates to the technical field of machining, and specifically to a polishing device for processing copper metal materials, which includes a polishing device installed on a machine shell and a placement table slidably arranged on the machine shell. A sliding seat extending into the interior of the machine shell is fixed to the lower surface of the placement table. A shielding plate for shielding a chute and a collection structure connected to the shielding plate are arranged inside the machine shell. One side of the shielding plate away from the collection structure extends into the sliding seat. A pushing mechanism and a liquid discharging structure are also arranged inside the machine shell. The pushing mechanism is respectively connected to the collection structure and the sliding seat. The collection structure is slidably arranged on the side of the shielding plate away from the sliding seat. Among them, the collection structure realizes collection and lifting achieved by the output of the pushing mechanism. The present invention has the advantages of efficient impurity removal and collection, not only improving the feeding and collection efficiency, reducing pollution, but also being able to protect the equipment, improve the operation convenience and enhance the safety.

Description

Technical Field

[0001] The present invention relates to the technical field of machining, and specifically relates to a polishing device for processing copper metal materials. Background Art

[0002] Before some metal materials are applied, they are usually polished by a polishing device to perform surface polishing and other operations. Therefore, polishing equipment is used for processing copper metal materials.

[0003] Chinese Patent Publication No. CN215919936U discloses "a surface grinder with automatic and accurate positioning, including: a base, the top of the base is fixedly installed with a first motor through screws, a first lead screw is keyway-connected to the output shaft of the first motor, a clamping mechanism is arranged above the first lead screw, and a placement groove is opened on the upper surface of the base. This application makes it have the function of automatic positioning through the cooperation between the first motor and the first lead screw. Users do not need to manually position, and only need to rotate the motor to change the position between the base and the clamping mechanism, so as to achieve the effect of accurate positioning."

[0004] However, the above patent still has the following defects: For example, it lacks the function of shielding the lead screw placement groove. During the polishing process, polishing materials such as abrasives and polishing fluids will splash out. Without the shielding function, these splashes cannot be effectively blocked from entering the lead screw placement groove, resulting in the lead screw track being easily damaged. Moreover, the subsequent cleaning is extremely inconvenient, affecting the service life of the lead screw guide rail.

[0005] Therefore, it is urgent to improve the polishing device to solve the above existing problems. Summary of the Invention

[0006] The purpose of the present invention is to provide a polishing device for processing copper metal materials, which has the advantages of efficient impurity removal and collection, not only improving the feeding and collection efficiency, reducing pollution, but also being able to protect the equipment, improve the operation convenience and enhance the safety.

[0007] To achieve the above purpose, the main technical solutions adopted by the present invention include: a polishing device installed on the machine shell and a placement table slidably arranged on the machine shell. A sliding seat extending into the interior of the machine shell is fixed to the lower surface of the placement table, and a sliding groove for the movement of the placement table is opened inside the machine shell.

[0008] Inside the casing, there is a shielding plate that shields the chute and a collection structure connected to the shielding plate. One side of the shielding plate away from the collection structure extends into the inside of the sliding seat. Inside the casing, there is also a pushing mechanism and a liquid discharging structure. The pushing mechanism is respectively connected to the collection structure and the sliding seat. The collection structure is slidably arranged on the side of the shielding plate away from the sliding seat. Among them, the collection structure collects and realizes lifting through the output of the pushing mechanism, and cooperates with the liquid discharging structure to discharge waste chips and waste liquid.

[0009] Inside the shielding plate, there are a first material guiding groove and a second material guiding groove for guiding materials. The first material guiding groove is communicated with the collection structure.

[0010] Preferably, the first material guiding groove is arranged in an inclined shape, and the number of the second material guiding grooves is two. The two second material guiding grooves are oppositely arranged on both sides of the first material guiding groove.

[0011] Preferably, the collection structure includes a collection shell slidably installed on the side of the shielding plate away from the sliding seat. Inside the collection shell, there are a collection groove and a first through opening. The collection groove and the first material guiding groove are communicated through the first through opening.

[0012] Preferably, two guide blocks are fixed on the side of the shielding plate close to the collection shell. A guiding groove adapted to the guide blocks is opened on the side of the collection shell close to the shielding plate. A filtering structure is embedded in the collection groove.

[0013] Preferably, the filtering structure includes a filtering frame detachably installed inside the collection groove. A second through opening adapted to the first through opening is opened on one side of the filtering frame. A number of filter holes are opened inside the filtering frame. Two handles are bolted on the outer surface of the filtering frame. A maintenance plate for disassembling and assembling the filtering structure is hinged on the upper surface of the casing.

[0014] Preferably, an abutting structure for cooperating with the pushing mechanism is fixed on the side of the collection shell away from the shielding plate. The abutting structure includes a wheel frame, an abutting roller installed inside the wheel frame through a bearing, and a sleeve and a telescopic rod fixed on the side of the wheel frame away from the abutting roller. One end of the telescopic rod extends into the sleeve, and the other end of the telescopic rod is bolted and fixed to the outer surface of the wheel frame. A buffer spring is fixed inside the sleeve. One end of the telescopic rod extending into the sleeve is connected and fixed to the buffer spring.

[0015] Preferably, the number of the abutting structures is two. The pushing mechanism includes a mounting seat slidably arranged inside the casing, a connecting shaft fixed on the upper surface of the mounting seat, and a double-shaft cylinder fixed inside the casing. One output end of the double-shaft cylinder is hinged to the outer surface of the connecting shaft, and a pushing arm is hinged between the outer surface of the connecting shaft and the lower surface of the collection shell. The pushing arm is arranged in an inclined shape.

[0016] Preferably, a connecting seat is fixed on the other output shaft of the double-axis cylinder. The connecting seat is fixed to the lower surface of the sliding seat by bolts. The sliding seat realizes displacement adjustment through the telescopic movement of the other output shaft of the double-axis cylinder. The collection shell is located on the mounting seat and is closer to the inner wall of the casing. The output of the double-axis cylinder drives the mounting seat, and at the same time drives the collection shell to displace. The abutting structure on the collection shell abuts against the inner wall of the casing. At this time, the collection shell realizes lifting under the action of the abutting roller and the pushing arm.

[0017] Preferably, two guiding structures are fixed inside the casing. The guiding structures are distributed on both sides of the mounting seat to realize the limiting and guiding of the mounting seat. The liquid discharge structure includes a valve pipe and a valve shell fixed inside the casing. The valve shell is communicated with the valve pipe. A diaphragm is elastically installed inside the valve shell. Two check valves are elastically hinged inside the valve pipe. Both the upper and lower ends of the valve pipe are fixedly communicated with a communicating pipe. The communicating pipe at the top is fixed to the lower surface of the collection shell and is communicated with the collection tank. The communicating pipe at the bottom extends outside the casing.

[0018] Preferably, a connecting rod extending outside the valve shell is fixed on one side of the diaphragm. The other end of the connecting rod is threadedly installed with an abutting block that intermittently abuts against the mounting seat. A circular plate is fixed on the outer surface of the connecting rod, and a return spring surrounding the connecting rod is fixed between the circular plate and the valve shell. A valve seat welded to the outer surface of the valve shell is fixed to the inner bottom wall of the casing.

[0019] The present invention at least has the following beneficial effects:

[0020] 1. For the polishing device for processing copper metal materials, through the design of the shielding plate and the collection structure, it can avoid their pollution to the working area. The shielding plate also plays a role in protecting the sliding groove, preventing waste chips and waste liquid from entering the inside of the sliding groove, causing blockage or damage, and ensuring the smooth operation of the polishing device. At the same time, through the design of the shielding plate, the first material guiding groove and the second material guiding groove, waste chips and waste liquid can be effectively guided into the collection structure, avoiding the pollution of the working environment. The setting of the filtering structure ensures that impurities in the waste liquid are removed, improving the recycling value of the waste liquid or the environmental protection of the discharge.

[0021] 2. For the polishing device for processing copper metal materials, through the use of the double-axis cylinder, the lifting of the collection structure and the movement of the placing table are realized, improving the automation level of the polishing process. The design of the liquid discharge structure realizes the intelligent discharge of waste liquid and reduces the operation difficulty.

[0022] 3. For the polishing device for processing copper metal materials, through the inclined setting of the first material guiding groove, it can ensure that waste chips and waste liquid smoothly flow into the collection structure under the action of gravity. This design reduces the retention of waste chips and waste liquid in the working area and improves the collection efficiency.

[0023] 4. The polishing device for processing copper metal materials has two second material guiding grooves, which are oppositely arranged on both sides of the first material guiding groove, further expanding the material guiding area, enabling waste chips and waste liquid to be more evenly distributed and collected, helping to prevent the accumulation of waste chips and waste liquid on the shielding plate, and keeping the working area clean.

[0024] 5. The polishing device for processing copper metal materials realizes the solid-liquid separation of waste liquid and waste residue through the embedding of a filtering structure. The waste liquid flows into the bottom of the collection tank through the filter holes, while the waste residue is intercepted by the filter frame, improving the collection efficiency of the waste residue and facilitating the subsequent separate treatment of the waste liquid and waste residue.

[0025] 6. The polishing device for processing copper metal materials, through the design of the abutting structure, especially the use of abutting rollers, enables the collection shell to smoothly contact the inner side wall of the machine shell during the lifting process, reducing friction and resistance, thus ensuring the stability of the lifting. The combination of the telescopic rod and the buffer spring provides additional support and buffering for the abutting rollers, further enhancing the stability during the lifting process.

[0026] 7. The polishing device for processing copper metal materials realizes the automatic discharge of waste liquid through the design of the liquid discharge structure. When the double-shaft cylinder drives the mounting seat, it will push the abutting block to move, causing the connecting rod to drive the diaphragm to compress the space in the valve housing. The movement of the diaphragm opens the check valve in the valve tube, and the waste liquid is discharged from the valve tube through the connecting pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings described herein are used to provide a further understanding of the present application and form a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0028] Figure 1 is a three-dimensional view of the overall structure of the present invention;

[0029] Figure 2 is a sectional view of the structure of the machine shell in the present invention;

[0030] Figure 3 In the present invention Figure 2 is an enlarged schematic view of the structure of A shown;

[0031] Figure 4 is a schematic view of the structure of the collection structure and the pushing mechanism in the present invention;

[0032] Figure 5 is a schematic view of the structure of the pushing mechanism in the present invention;

[0033] Figure 6 is a schematic view of the structure of the shielding plate in the present invention;

[0034] Figure 7 This is a schematic structural diagram of the driving mechanism in the present invention;

[0035] Figure 8 This is a schematic structural diagram of the collection structure in the present invention;

[0036] Figure 9 This is a schematic structural diagram of the filtering structure in the present invention;

[0037] Figure 10 This is a schematic structural diagram of the abutting structure in the present invention;

[0038] Figure 11 This is a sectional structural view of the liquid discharging structure in the present invention;

[0039] Figure 12 This is a front elevational view of the liquid discharging structure in the present invention.

[0040] In the figure, 1, machine housing; 2, polishing equipment; 3, placing table; 31, sliding seat; 4, sliding groove; 5, baffle; 51, first material guiding groove; 52, second material guiding groove; 53, guiding block; 6, collection structure; 61, collection shell; 62, collection tank; 63, first through port; 64, abutting structure; 641, wheel frame; 642, abutting roller; 643, sleeve; 644, telescopic rod; 645, buffer spring; 65, filtering structure; 651, filtering frame; 652, second through port; 653, filtering hole; 654, handle; 66, guiding groove; 7, driving mechanism; 71, mounting seat; 72, connecting shaft; 73, double-acting cylinder; 74, connecting seat; 75, driving arm; 8, liquid discharging structure; 81, valve pipe; 82, valve housing; 83, diaphragm; 84, check valve; 85, communicating pipe; 86, connecting rod; 87, abutting block; 88, circular plate; 89, return spring; 810, valve seat; 9, maintenance plate; 10, guiding structure. Detailed Description of the Invention

[0041] The technical solutions of the present invention will be further described in detail below in conjunction with the specific embodiments.

[0042] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0043] As Figure 1 and Figure 2As shown in the figure, the polishing device for copper metal materials provided in this embodiment includes a polishing device 2 installed on a machine housing 1 and a placement table 3 slidably arranged on the machine housing 1. A sliding seat 31 extending into the interior of the machine housing 1 is fixed to the lower surface of the placement table 3, and a sliding groove 4 for the movement of the placement table 3 is provided inside the machine housing 1. Among them, a storage groove is provided inside the sliding seat 31. Two symmetrically distributed fixing structures for copper metal materials are arranged on the upper surface of the placement table 3. The polishing device 2 is located above the placement table 3.

[0044] To improve the protection effect, as Figure 1 - Figure 12 shown in the figure, a shielding plate 5 for shielding the sliding groove 4 and a collecting structure 6 connected to the shielding plate 5 are provided inside the machine housing 1. One side of the shielding plate 5 away from the collecting structure 6 extends into the interior of the sliding seat 31, and the length of the storage groove is adapted to the adjustment distance of the shielding plate 5. A pushing mechanism 7 and a liquid discharging structure 8 are also provided inside the machine housing 1. The pushing mechanism 7 is respectively connected to the collecting structure 6 and the sliding seat 31. The collecting structure 6 is slidably arranged on the side of the shielding plate 5 away from the sliding seat 31. Among them, the collecting structure 6 realizes collection and lifting through the output of the pushing mechanism 7, and cooperates with the liquid discharging structure 8 to discharge waste chips and waste liquid; as Figure 1 - Figure 6 shown in the figure, a first material guiding groove 51 and a second material guiding groove 52 for guiding materials are provided inside the shielding plate 5. The first material guiding groove 51 is communicated with the collecting structure 6. It should be noted that the first material guiding groove 51 is inclined, which can ensure that waste chips and waste liquid smoothly flow into the collecting structure 6 under the action of gravity. This design reduces the retention of waste chips and waste liquid in the working area and improves the collection efficiency. The number of the second material guiding grooves 52 is two, and the two second material guiding grooves 52 are oppositely arranged on both sides of the first material guiding groove 51, further expanding the material guiding area, so that waste chips and waste liquid can be more evenly distributed and collected. This helps to prevent waste chips and waste liquid from accumulating on the shielding plate 5 and keeps the working area clean.

[0045] Specifically, through the design of the shielding plate 5 and the collecting structure 6, waste chips and waste liquid are effectively guided to the collection area, avoiding their pollution to the working area. This helps to keep the device clean and extends its service life. The shielding plate 5 also plays a role in protecting the sliding groove 4, preventing waste chips and waste liquid from entering the interior of the sliding groove 4 and causing blockage or damage. This ensures the smooth operation of the polishing device.

[0046] As Figure 4 , Figure 6 , Figure 8 - Figure 10 shown in the figure, the collecting structure 6 includes a collecting shell 61 slidably installed on the side of the shielding plate 5 away from the sliding seat 31. A collecting groove 62 and a first through port 63 are provided inside the collecting shell 61. The collecting groove 62 and the first material guiding groove 51 are communicated through the first through port 63. To ensure the stable lifting of the collecting shell 61, asFigure 4 , Figure 6 and Figure 8 As shown in Figure 4 , Figure 6 and Figure 8 , two guide blocks 53 are fixed on one side of the baffle 5 close to the collection shell 61, and a guide groove 66 adapted to the guide blocks 53 is provided on one side of the collection shell 61 close to the baffle 5. The collection shell 61 is adapted to the guide blocks 53 on the baffle 5 through the guide groove 66, ensuring the stability of the collection shell 61 during the lifting process. This design prevents the collection shell 61 from shifting or shaking during lifting, ensuring that waste chips and waste liquid can be accurately guided into the collection tank 62. It should be noted that teeth engaging with the guide blocks 53 are fixed inside the guide groove 66, and the teeth and the guide blocks 53 are arranged along the X-Y axis, facilitating the movement of the baffle 5 driven by the displacement of the collection shell 61. The lifting height of the collection shell 61 is adapted to the output distance of the double-axis cylinder 73.

[0047] To achieve solid-liquid separation and better collect waste residues, as Figure 8 and Figure 9 shown, a filtering structure 65 is embedded in the collection tank 62. The filtering structure 65 includes a filtering frame 651 detachably installed inside the collection tank 62. A second through-port 652 adapted to the first through-port 63 is provided on one side of the filtering frame 651. A number of filter holes 653 are provided inside the filtering frame 651. Two handles 654 are bolted to the outer surface of the filtering frame 651. The embedding of the filtering structure 65 realizes the solid-liquid separation of waste liquid and waste residues. The waste liquid flows into the bottom of the collection tank 62 through the filter holes 653, while the waste residues are intercepted by the filtering frame 651. This design improves the collection efficiency of waste residues, facilitates the subsequent separate treatment of waste liquid and waste residues, and the second through-port 652 on the filtering frame 651 is adapted to the first through-port 63, ensuring that waste chips and waste liquid can smoothly enter the filtering structure 65, further improving the collection efficiency. A maintenance plate 9 for disassembling and assembling the filtering structure 65 is hinged on the upper surface of the machine shell 1. The maintenance plate 9 hinged on the upper surface of the machine shell 1 provides convenience for the disassembly and assembly of the filtering structure 65. When it is necessary to clean or replace the filtering frame 651, the filtering structure 65 can be easily accessed by simply opening the maintenance plate 9, without having to disassemble the entire collection structure 6.

[0048] To ensure the stable lifting of the collection shell 61, as Figure 4 and Figure 10As shown, on the side of the collection shell 61 away from the shielding plate 5, there is a contact structure 64 fixed for cooperating with the pushing mechanism 7. The contact structure 64 includes a wheel frame 641, a contact roller 642 with a bearing installed inside the wheel frame 641, a sleeve 643 and a telescopic rod 644 fixed on the side of the wheel frame 641 away from the contact roller 642. One end of the telescopic rod 644 extends into the inside of the sleeve 643, and the other end of the telescopic rod 644 is bolt-fixed to the outer surface of the wheel frame 641. A buffer spring 645 is fixed inside the sleeve 643, and the end of the telescopic rod 644 extending into the sleeve 643 is connected and fixed to the buffer spring 645. The sleeve 643 is bolt-fixed to the outer surface of the collection shell 61. Through the design of the contact structure 64, especially the use of the contact roller 642, the collection shell 61 can smoothly contact the inner wall of the machine shell 1 during the lifting process, reducing friction and resistance, thereby ensuring the stability of the lifting. The combination of the telescopic rod 644 and the buffer spring 645 provides additional support and buffering for the contact roller 642, further enhancing the stability during the lifting process. Specifically, the number of the contact structures 64 is two. As Figure 2 , Figure 4 - Figure 7 shown, the pushing mechanism 7 includes a mounting seat 71 slidably arranged inside the machine shell 1, a connecting shaft 72 fixed on the upper surface of the mounting seat 71, and a double-acting cylinder 73 fixed inside the machine shell 1. One output end of the double-acting cylinder 73 is hinged to the outer surface of the connecting shaft 72, and a pushing arm 75 is hinged between the outer surface of the connecting shaft 72 and the lower surface of the collection shell 61. The pushing arm 75 is inclined. The number of the connecting shafts 72 is two, and the number of the pushing arms 75 is four.

[0049] As Figure 5 and Figure 7 shown, specifically, a connecting seat 74 is fixed on the other output shaft of the double-acting cylinder 73. The connecting seat 74 is fixed to the lower surface of the sliding seat 31 by bolts. The sliding seat 31 realizes displacement adjustment through the telescopic movement of the other output shaft of the double-acting cylinder 73. The collection shell 61 is located on the mounting seat 71 and is closer to the inner wall of the machine shell 1. By driving the mounting seat 71 through the output of the double-acting cylinder 73, the collection shell 61 is driven to displace at the same time. The contact structure 64 on the collection shell 61 abuts against the inner wall of the machine shell 1. At this time, the collection shell 61 realizes lifting under the action of the contact roller 642 and the pushing arm 75. It should be noted that the numbers of the collection structure 6, the shielding plate 5, the pushing mechanism 7, the liquid discharge structure 8 and the inspection plate 9 are all two, and the two shielding plates 5, the two collection structures 6, the pushing mechanism 7, the liquid discharge structure 8 and the inspection plate 9 are all symmetrically arranged left and right.

[0050] To ensure the stable movement of the mounting seat 71, as Figure 2 and Figure 7As shown in the figure, two guiding structures 10 are fixed inside the casing 1. The guiding structures 10 are distributed on both sides of the mounting seat 71 to realize the limiting and guiding of the mounting seat 71. The arrangement of the guiding structures 10 limits and guides the mounting seat 71, preventing its offset or shaking during movement. This design improves the movement accuracy and stability of the mounting seat 71, thus ensuring the lifting accuracy of the collection shell 61.

[0051] To achieve waste liquid discharge, as Figure 1 , Figure 2 , Figure 11 and Figure 12 shown, the liquid discharge structure 8 includes a valve pipe 81 and a valve housing 82 fixed inside the casing 1. The valve housing 82 is communicated with the valve pipe 81. A diaphragm 83 is elastically installed inside the valve housing 82. Two check valves 84 are elastically hinged inside the valve pipe 81. Both the upper and lower ends of the valve pipe 81 are fixedly communicated with a communicating pipe 85. The upper communicating pipe 85 is fixed to the lower surface of the collection shell 61, and the communicating pipe 85 is communicated with the collection tank 62. The lower communicating pipe 85 extends outside the casing 1. Among them, a connecting rod 86 extending outside the valve housing 82 is fixed on one side of the diaphragm 83. The other end of the connecting rod 86 is threadedly installed with an abutting block 87 that intermittently abuts against the mounting seat 71. A circular plate 88 is fixed on the outer surface of the connecting rod 86, and a return spring 89 surrounding the connecting rod 86 is fixed between the circular plate 88 and the valve housing 82. The combination of the return spring 89 and the circular plate 88 provides a return force for the diaphragm 83 and the connecting rod 86, ensuring that the liquid discharge structure 8 can return to its initial state after waste liquid discharge and is ready for the next discharge. A valve seat 810 welded to the outer surface of the valve housing 82 is fixed to the inner bottom wall of the casing 1. When the double-axis cylinder 73 drives the mounting seat 71, it will push the abutting block 87 to move, causing the connecting rod 86 to drive the diaphragm 83 to compress the space inside the valve housing 82. The movement of the diaphragm 83 opens the check valve 84 inside the valve pipe 81, and the waste liquid is discharged from the valve pipe 81 through the communicating pipe 85.

[0052] It is worth mentioning that in this application, the chute 4 is blocked by the baffle 5, and impurities are discharged through the first material guiding groove 51 and the second material guiding groove 52, collected by the collection shell 61, and at the same time, the filtering structure 65 performs solid-liquid separation. When slag discharge is required, first, the double-axis cylinder 73 drives the mounting seat 71 to reciprocate by short-distance telescoping. The mounting seat 71 intermittently fits with the abutting block 87 during reciprocating movement, causing the connecting rod 86 to drive the diaphragm 83 to compress the space inside the valve housing 82, cooperating with the opening and closing of the two check valves 84 to pump and discharge the waste liquid in the collection tank 62. After the waste liquid pumping and discharging is completed, the output distance of the double-axis cylinder 73 is extended, and the collection shell 61 is lifted by the rotation of the pushing arm 75, and then the collection shell 61 is pushed below the maintenance plate 9. The maintenance plate 9 is opened, and the filter frame 651 can be picked up for cleaning.

[0053] As Figure 1 -Figure 12 As shown in the figure, the principle of the polishing device for copper metal materials provided in this embodiment is as follows:

[0054] First, the polishing equipment 2 polishes the copper metal material placed on the placement table 3. The waste chips and waste liquid generated during the polishing process fall on the shielding plate 5. The waste chips and waste liquid enter the collection tank 62 of the collection structure 6 through the first material guiding groove 51 and the second material guiding groove 52 on the shielding plate 5. The filtering structure 65 filters the waste liquid. The waste chips are left on the filtering frame 651, and the filtered waste liquid flows into the bottom of the collection tank 62;

[0055] The double-axis cylinder 73 works. One output shaft drives the lifting of the collection shell 61 through the connecting shaft 72 and the pushing arm 75, and the other output shaft can drive the sliding seat 31 and the placement table 3 to move through the connecting seat 74 to realize the adjustment of the polishing position;

[0056] When the double-axis cylinder 73 drives the mounting seat 71, it will push the abutting block 87 to move, so that the connecting rod 86 drives the diaphragm 83 to compress the space in the valve housing 82. The movement of the diaphragm 83 opens the check valve 84 in the valve pipe 81, and the waste liquid is discharged from the valve pipe 81 through the communicating pipe 85;

[0057] When it is necessary to discharge the granular waste residue, the double-axis cylinder 73 drives the mounting seat 71 again. The mounting seat 71 drives the displacement of the collection shell 61 through the pushing arm 75. At this time, the collection shell 61 first abuts against the inner side wall of the machine shell 1. Under the continuous output of the double-axis cylinder 73, the pushing arm 75 hinged between the connecting shaft 72 and the collection shell 61 rotates, and then will lift the collection shell 61. Then, open the maintenance plate 9, and it is convenient to remove the filtering structure 65 from the collection shell 61 and the machine shell 1;

[0058] In addition, when the collection shell 61 abuts against the inner side wall of the machine shell 1, the abutting roller 642 in the abutting structure 64 rolls on the inner side wall of the machine shell 1 to reduce friction, and provides buffering through the buffer spring 645. At the same time, it is convenient for the pushing mechanism 7 to lift the collection shell 61 for waste residue discharge.

[0059] As used in the specification and claims, certain terms are used to refer to specific components. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. The specification and claims do not use the difference in names as a way to distinguish components, but use the difference in functions of components as a criterion for distinction. As mentioned throughout the specification and claims, "comprising" is an open-ended term, so it should be interpreted as "including but not limited to". "Substantially" means within an acceptable error range. Those skilled in the art can solve technical problems within a certain error range and basically achieve the technical effect.

Claims

1. A polishing device for copper metal material processing, comprising a polishing device (2) mounted on a housing (1) and a storage table (3) slidably arranged on the housing (1), characterized in that: A slide seat (31) extending into the interior of the housing (1) is fixed to the lower surface of the storage table (3); a slide groove (4) for moving the storage table (3) is provided inside the housing (1); The housing (1) is provided with a shielding plate (5) for shielding the slide groove (4) and a collecting structure (6) connected to the shielding plate (5); the shielding plate (5) extends to the inside of the slide seat (31) on a side away from the collecting structure (6); a pushing mechanism (7) and a liquid discharge structure (8) are also provided inside the housing (1); the pushing mechanism (7) is connected to the collecting structure (6) and the slide seat (31) respectively; the collecting structure (6) is slidably arranged on a side of the shielding plate (5) away from the slide seat (31); wherein the collecting structure (6) realizes collection and lifting through the output of the pushing mechanism (7), and cooperates with the liquid discharge structure (8) to realize the discharge of waste chips and waste liquid; A first material guiding groove (51) and a second material guiding groove (52) for guiding materials are provided inside the shielding plate (5), and the first material guiding groove (51) is connected to the collecting structure (6); The collecting structure (6) comprises a collecting shell (61) slidably mounted on a side of the shielding plate (5) away from the sliding seat (31); a collecting groove (62) and a first opening (63) are provided inside the collecting shell (61); the collecting groove (62) and the first material guide groove (51) are connected via the first opening (63); An abutment structure (64) used in conjunction with the pushing mechanism (7) is fixed to the side of the collecting shell (61) away from the shielding plate (5), the abutment structure (64) comprising a wheel frame (641), an abutment roller (642) whose bearing is mounted on the inner side of the wheel frame (641), and a sleeve (643) and a telescopic rod (644) fixed to the side of the wheel frame (641) away from the abutment roller (642), one end of the telescopic rod (644) extending into the inside of the sleeve (643), and the other end of the telescopic rod (644) is bolted to the outer surface of the wheel frame (641), a buffer spring (645) is fixed to the inside of the sleeve (643), and one end of the telescopic rod (644) extending into the sleeve (643) is connected and fixed to the buffer spring (645); The number of the abutment structures (64) is two, and the pushing mechanism (7) comprises a mounting seat (71) slidably arranged inside the housing (1), a connecting shaft (72) fixed to the upper surface of the mounting seat (71), and a double-axis cylinder (73) fixed to the inside of the housing (1), one output end of the double-axis cylinder (73) is hinged to the outer surface of the connecting shaft (72), and a pushing arm (75) is hinged between the outer surface of the connecting shaft (72) and the lower surface of the collection shell (61), and the pushing arm (75) is arranged in an inclined state; A connecting seat (74) is fixed on the other output shaft of the double-axis cylinder (73); the connecting seat (74) is fixed to the lower surface of the slide seat (31) by bolts; the slide seat (31) is adjusted in displacement by telescoping the other output shaft of the double-axis cylinder (73); the collecting shell (61) is located on the mounting seat (71) and is closer to the inner wall of the casing (1); the mounting seat (71) is driven by the output of the double-axis cylinder (73), and the collecting shell (61) is driven to move at the same time; the abutting structure (64) on the collecting shell (61) abuts against the inner wall of the casing (1); at this time, the collecting shell (61) is lifted or lowered by the abutting roller (642) and the pushing arm (75); Two guide structures (10) are fixed inside the casing (1), and the guide structures (10) are distributed on both sides of the mounting seat (71) to achieve position limiting guidance for the mounting seat (71). The liquid discharge structure (8) comprises a valve tube (81) and a valve shell (82) fixed inside the casing (1), the valve shell (82) being connected to the valve tube (81), a diaphragm (83) being elastically installed inside the valve shell (82), and two check valves (84) being elastically hinged inside the valve tube (81), and a connecting tube (85) being fixedly connected at both upper and lower ends of the valve tube (81), the connecting tube (85) being fixed at the top to the lower surface of the collecting shell (61), and being connected to the collecting tank (62), and the connecting tube (85) at the bottom extending out of the casing (1).

2. The polishing device for copper metal material processing according to claim 1, characterized in that: The first material inlet groove (51) is arranged in an inclined shape, and the number of the second material inlet grooves (52) is two, and the two second material inlet grooves (52) are arranged opposite to each other on both sides of the first material inlet groove (51).

3. The polishing device for copper metal material processing according to claim 1, characterized in that: Two guide blocks (53) are fixed to one side of the shielding plate (5) close to the collecting shell (61); a guide groove (66) matching the guide blocks (53) is provided on one side of the collecting shell (61) close to the shielding plate (5); and a filtering structure (65) is embedded in the collecting groove (62).

4. The polishing device for copper metal material processing according to claim 3, characterized in that: The filter structure (65) comprises a filter frame (651) detachably mounted inside the collection tank (62); a second opening (652) matching the first opening (63) is provided on one side of the filter frame (651); a plurality of filter holes (653) are provided inside the filter frame (651); two handles (654) are bolted to the outer surface of the filter frame (651); and an inspection plate (9) for disassembling and assembling the filter structure (65) is hingedly connected to the upper surface of the housing (1).

5. The polishing device for copper metal material processing according to claim 1, characterized in that: A connecting rod (86) extending to the outside of the valve housing (82) is fixed to one side of the diaphragm (83); an abutment block (87) intermittently abutting against the mounting seat (71) is threadedly mounted on the other end of the connecting rod (86); a circular sheet (88) is fixed to the outer surface of the connecting rod (86); a return spring (89) surrounding the outside of the connecting rod (86) is fixed between the circular sheet (88) and the valve housing (82); and a valve seat (810) fixed to the inner bottom wall of the housing (1) is welded to the outer surface of the valve housing (82).

Images