Potential determination method, device, equipment, medium and product

Abstract

The invention discloses a potential determination method, device and equipment, a medium and a product, relates to the technical field of pipeline detection, and aims to solve the problem of how to determine the surface potential of a pipeline. The potential determination method comprises the step of determining the current density of a to-be-detected area of a pipeline. And determining the voltage drop of the soil according to the current density and the resistivity of the soil at the position of the pipeline. And determining the surface potential of the to-be-detected area according to the voltage drop of the soil, the instantaneous interruption potential of the pipeline and the solution resistivity. The solution resistivity is the resistivity of the solution between the stripping coating of the pipeline and the pipeline, and the stripping coating is located in the to-be-detected area.

Description

Technical Field

[0001] The present application relates to the technical field of pipeline detection, and in particular to a potential determination method, device, equipment, medium and product. Background Art

[0002] The surface potential of the pipeline has a significant effect on the cathodic stripping of the epoxy coating of the pipeline. A calcium deposit layer will be generated at the damaged part of the epoxy coating under different cathodic protection potentials. For example, the deposit layer generated under the potential of -950mV is complete and dense, which protects the pipeline well. As the cathodic protection potential shifts negatively, the stripping area of ​​the epoxy coating gradually increases. Under the potential of -750mV, the metal substrate of the damaged epoxy coating is underprotected, and under the potential of -1050mV, severe hydrogen evolution occurs, which destroys the integrity of the calcium deposit layer, the surface alkalinity is large, and the coating stripping area is the largest.

[0003] It can be seen that the operation status of the pipeline can be predicted by the surface potential of the pipeline. Therefore, how to determine the surface potential of the pipeline is a technical problem that needs to be solved urgently. Summary of the invention

[0004] The purpose of the present application is to provide a potential determination method, device, equipment, medium and product, aiming to solve the problem of how to determine the surface potential of a pipeline.

[0005] In order to achieve the above objectives, this application adopts the following technical solutions:

[0006] In a first aspect, the present application provides a potential determination method, the method comprising: determining a current density of a region to be detected of a pipeline. Determining a voltage drop of the soil according to the current density and the resistivity of the soil at the location of the pipeline. Determining a surface potential of the region to be detected according to the voltage drop of the soil, the transient potential of the pipeline, and the resistivity of the solution. The resistivity of the solution is the resistivity of the solution between the stripping coating of the pipeline and the pipeline, and the stripping coating is located in the region to be detected.

[0007] The potential determination method provided in the embodiment of the present application can determine the voltage drop of the soil according to the current density of the area to be detected where the coating is peeled off and the resistivity of the soil when the coating is peeled off on the coating of the pipeline. Further, the surface potential of the area to be detected on the pipeline is determined according to the voltage drop of the soil, the transient potential of the pipeline and the resistivity of the solution. Since the current density of the area to be detected, the resistivity of the soil, the resistivity of the solution, the voltage drop of the soil and the transient potential of the pipeline are comprehensively considered, the surface potential of the area to be detected can be accurately determined.

[0008] In some embodiments, determining the current density of the area to be inspected of the pipeline includes: determining the attenuation current of the area to be inspected according to the resistivity of the coating of the pipeline and the resistivity of the soil. The current density is determined according to the attenuation current, the radius of the pipeline, the cathodic protection distance of the pipeline, and the failure threshold of the stripping coating. The current density satisfies the following formula:

[0009]

[0010] Among them, j x is the current density, i x is the decay current, D is the cathodic protection distance, r is the pipeline radius of the pipeline, and CB is the failure threshold of the debonding coating.

[0011] In some embodiments, determining the attenuation current of the area to be detected based on the coating resistivity of the pipeline and the resistivity of the soil includes: determining the current attenuation coefficient of the pipeline based on the coating resistivity of the pipeline and the resistivity of the soil. Determine the attenuation current based on the current attenuation coefficient, the current of a reference discharge point on the pipeline, and a reference distance. The reference distance is the distance between the abnormal point in the area to be detected and the reference point in the area to be detected, and the attenuation current satisfies the following formula:

[0012] i x =i 0 *e -αx

[0013] Among them, i x is the decay current, i 0 is the current at the reference discharge point on the pipeline, α is the attenuation coefficient, x It is the distance from the reference point of the area to be detected to the damaged point of the area to be detected.

[0014] In some embodiments, the current attenuation coefficient of the pipeline is determined according to the coating resistivity of the pipeline and the resistivity of the soil, including: determining the leakage resistance of the pipeline according to the coating resistivity of the pipeline, the thickness of the stripped coating, the coating coverage surface area of ​​the pipeline, the radius of the pipeline and the resistivity of the soil. The leakage resistance satisfies the following formula:

[0015]

[0016] Among them, R L is the leakage resistance, ρ c is the coating resistivity, t is the thickness of the peeled coating, ρ soil is the resistivity of the soil, A S is the surface area covered by the coating and r is the radius of the pipe.

[0017] The current attenuation coefficient is determined based on the leakage resistance and the longitudinal resistance of the pipeline. The current attenuation coefficient satisfies the following formula:

[0018]

[0019] Among them, α is the current attenuation coefficient, R S is the longitudinal resistance, R L is the leakage resistance.

[0020] In some embodiments, the method further comprises: determining the length of the pipeline according to the resistivity of the material of the pipeline, the length of the pipeline and the

[0021] and the cross-sectional area of ​​the pipeline to determine the longitudinal resistance of the pipeline. The longitudinal resistance satisfies the following formula:

[0022]

[0023] Among them, R S is the longitudinal resistance, ρ s is the resistivity of the material, L is the length of the pipeline, A X is the cross-sectional area of ​​the pipe wall.

[0024] In some embodiments, the surface potential of the area to be detected is determined according to the voltage drop of the soil, the instantaneous potential of the coating, and the resistivity of the solution, including: determining the power-on potential of the pipeline according to the voltage drop and the instantaneous potential of the soil. Determining the surface potential of the area to be detected according to the power-on potential and the resistivity of the solution.

[0025] In some embodiments, the surface potential of the area to be detected is determined according to the power-on potential and the resistivity of the solution, including: when the area to be detected is a cathodic protected area, the surface potential is determined according to the power-on potential, the resistivity of the solution, the open circuit potential of the pipeline, the distance from the reference point of the area to be detected to the damaged point of the area to be detected, and the distance between the stripped coating and the outer surface of the pipeline. When the anti-corrosion layer in the area to be detected has a current shielding effect, the surface potential satisfies the following formula:

[0026]

[0027] Among them, E x is the surface potential, E on is the on-state potential, E OCP is the open circuit potential, x is the distance from the reference point of the area to be detected to the damaged point of the area to be detected, a is the distance between the peeled coating and the outer surface of the pipeline, and c is a dimensionless variable.

[0028] In some embodiments, the dimensionless variable satisfies the following formula:

[0029]

[0030] Where c is a dimensionless variable, a is the distance between the peeling coating and the outer surface of the pipe, and R pis the linear polarization resistance of the area to be detected, and ρ is the resistivity of the solution.

[0031] In some embodiments, the method further comprises: when the anti-corrosion layer in the area to be inspected has no current shielding effect, determining the surface potential according to the solution resistivity, the open circuit potential, the distance from the reference point of the area to be inspected to the damaged point of the area to be inspected, and the distance between the stripped coating and the outer surface of the pipeline. The surface potential satisfies the following formula:

[0032]

[0033] Among them, E x is the surface potential, ρ is the solution resistivity, E OCP is the open circuit potential, x is the distance from the reference point of the area to be detected to the damaged point of the area to be detected, and a is the distance between the peeling coating and the outer surface of the pipeline.

[0034] In a second aspect, the present application provides a potential determination device, the device comprising: a determination unit.

[0035] The determination unit is used to determine the current density of the pipeline in the area to be detected.

[0036] The determination unit is further used to determine the voltage drop in the soil according to the current density and the resistivity of the soil at the location where the pipeline is located.

[0037] The determination unit is further used to determine the surface potential of the area to be detected based on the voltage drop of the soil, the transient potential of the pipeline and the resistivity of the solution. The resistivity of the solution is the resistivity of the solution between the stripping coating of the pipeline and the pipeline, and the stripping coating is located in the area to be detected.

[0038] In some embodiments, the determination unit is specifically used to: determine the attenuation current of the area to be detected according to the resistivity of the coating of the pipeline and the resistivity of the soil. Determine the current density according to the attenuation current, the radius of the pipeline, the cathodic protection distance of the pipeline, and the failure threshold of the peeling coating. The current density satisfies the following formula:

[0039]

[0040] Among them, j x is the current density, i x is the decay current, D is the cathodic protection distance, r is the pipeline radius of the pipeline, and CB is the failure threshold of the debonding coating.

[0041] In some embodiments, the determination unit is specifically used to: determine the current attenuation coefficient of the pipeline according to the coating resistivity of the pipeline and the resistivity of the soil. Determine the attenuation current according to the current attenuation coefficient, the current of the reference discharge point on the pipeline, and the reference distance. The reference distance is the distance between the abnormal point in the area to be detected and the reference point in the area to be detected, and the attenuation current satisfies the following formula:

[0042] i x =i 0 *e -αx

[0043] Among them, i x is the decay current, i 0 is the current at the reference discharge point on the pipeline, α is the attenuation coefficient, x It is the distance from the reference point of the area to be detected to the damaged point of the area to be detected.

[0044] In some embodiments, the determination unit is specifically configured to determine the leakage resistance of the pipeline according to the coating resistivity of the pipeline, the thickness of the stripped coating, the coating coverage surface area of ​​the pipeline, the radius of the pipeline, and the resistivity of the soil. The leakage resistance satisfies the following formula:

[0045]

[0046] Among them, R L is the leakage resistance, ρ c is the coating resistivity, t is the thickness of the peeled coating, ρ soil is the resistivity of the soil, A S is the surface area covered by the coating and r is the radius of the pipe.

[0047] The current attenuation coefficient is determined based on the leakage resistance and the longitudinal resistance of the pipeline. The current attenuation coefficient satisfies the following formula:

[0048]

[0049] Among them, α is the current attenuation coefficient, R S is the longitudinal resistance, R L is the leakage resistance.

[0050] In some embodiments, the determination unit is further used to determine the longitudinal resistance of the pipeline according to the resistivity of the material of the pipeline, the length of the pipeline and the cross-sectional area of ​​the pipeline. The longitudinal resistance satisfies the following formula:

[0051]

[0052] Among them, R S is the longitudinal resistance, ρ s is the resistivity of the material, L is the length of the pipeline, A Xis the cross-sectional area of ​​the pipe wall.

[0053] In some embodiments, the determination unit is specifically used to: determine the on-state potential of the pipeline according to the voltage drop and the transient potential of the soil, and determine the surface potential of the area to be detected according to the on-state potential and the resistivity of the solution.

[0054] In some embodiments, the determination unit is specifically used to: determine the surface potential according to the power-on potential, the resistivity of the solution, the open circuit potential of the pipeline, the distance from the reference point of the area to be detected to the damaged point of the area to be detected, and the distance between the stripped coating and the outer surface of the pipeline when the area to be detected is a cathodic protected area. When the anti-corrosion layer in the area to be detected has a current shielding effect, the surface potential satisfies the following formula:

[0055]

[0056] Among them, E x is the surface potential, E on is the on-state potential, E OCP is the open circuit potential, x is the distance from the reference point of the area to be detected to the damaged point of the area to be detected, a is the distance between the peeled coating and the outer surface of the pipeline, and c is a dimensionless variable.

[0057] In some embodiments, the dimensionless variable satisfies the following formula:

[0058]

[0059] Where c is a dimensionless variable, a is the distance between the peeling coating and the outer surface of the pipe, and R p is the linear polarization resistance of the area to be detected, and ρ is the resistivity of the solution.

[0060] In some embodiments, the determination unit is further used to: when the anti-corrosion layer in the area to be detected has no current shielding effect, determine the surface potential according to the solution resistivity, the open circuit potential, the distance from the reference point of the area to be detected to the damaged point of the area to be detected, and the distance between the stripped coating and the outer surface of the pipeline. The surface potential satisfies the following formula:

[0061]

[0062] Among them, E x is the surface potential, ρ is the solution resistivity, E OCP is the open circuit potential, x is the distance from the reference point of the area to be detected to the damaged point of the area to be detected, and a is the distance between the peeling coating and the outer surface of the pipeline.

[0063] In a third aspect, the present application provides an electronic device comprising: a processor and a memory; wherein the memory is used to store one or more programs, and the one or more programs include computer execution instructions. When the electronic device is running, the processor executes the computer execution instructions stored in the memory to enable the electronic device to perform the method of the first aspect.

[0064] In a fourth aspect, the present application provides a computer-readable storage medium. When the computer-executable instructions stored in the computer-readable storage medium are executed by a processor of a pipeline risk assessment device, the pipeline risk assessment device can perform the method of the first aspect.

[0065] In a fifth aspect, the present application provides a computer program product, which includes: a computer program or instructions, when the computer program or instructions are run on a computer, the computer executes the method of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0067] Figure 1 A schematic diagram of a potential determination system shown in an exemplary embodiment provided in the present application;

[0068] Figure 2 One of the flow charts of a method for determining electric potential shown in an exemplary embodiment provided by the present application;

[0069] Figure 3 A schematic diagram of surface potential change shown for an exemplary embodiment provided in this application;

[0070] Figure 4 A second flow chart of a method for determining electric potential is shown in an exemplary embodiment provided in the present application;

[0071] Figure 5 A schematic diagram of current decay for different coating types is shown for an exemplary embodiment provided by the present application;

[0072] Figure 6 A schematic diagram of a potential determination device shown in an exemplary embodiment provided by the present application;

[0073] Figure 7 The present invention is a schematic diagram of an electronic device according to an exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0074] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0075] In the description of this application, it should be understood that the terms "upper", "lower", "left", "right", "front", "back", "inside", "outside", etc. indicate directions or positional relationships based on the directions or relative positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on this application. Unless otherwise specified, the above-mentioned directional description can be flexibly set in the process of actual application under the condition that the relative positional relationship shown in the accompanying drawings is met.

[0076] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0077] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. It can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0078] In the present application, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, article or device including the element.

[0079] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0080] External stress corrosion cracking (SCC) of pipelines usually occurs under debonding coatings, depending on environmental, design and operating factors. Intergranular SCC, also known as high pH (pondus hydrogenii, pH) SCC, occurs when the pH under debonding is alkaline, the potential is in a relatively narrow range that is more positive than the cathodic protection potential, and when the carbonate / bicarbonate concentration is relatively high. Transgranular SCC, also known as near-neutral pH SCC, occurs in dilute environments with pH close to neutral pH, in a wide potential range close to the open circuit potential, which can also cause severe corrosion. Stress corrosion cracking (SCC) poses a serious threat to pipeline infrastructure. The potential of the pipeline coating surface has a significant impact on the cathodic debonding of the pipeline's epoxy coating, and a calcareous deposit layer will be generated at the damage of the epoxy coating under different cathodic protection potentials. For example, the deposit layer generated under the potential of -950mV is complete and dense, which protects the pipeline well. As the cathodic protection potential shifts negatively, the epoxy coating peeling area gradually increases. Under the potential of -750 mV, the metal substrate of the damaged epoxy coating is underprotected, and under the potential of -1050 mV, serious hydrogen evolution occurs, which destroys the integrity of the calcium deposit layer, the surface alkalinity is relatively large, and the coating peeling area is the largest.

[0081] Therefore, the various reactions that may occur under the stripped coating on the buried pipeline are highly dependent on the surface potential of the stripped area. That is, the probability of SCC type and the SCC crack growth rate depend on the surface potential. This means that changes in surface potential can affect the mechanism of SCC: at different surface potentials, SCC may occur through different mechanisms, such as anodic dissolution or hydrogen embrittlement. Therefore, surface potential is an important factor affecting the susceptibility to SCC. How to determine the surface potential is a technical problem that needs to be solved urgently.

[0082] In order to solve the above technical problems, an embodiment of the present application provides a potential determination method, which includes: determining the current density of the pipeline area to be detected and the resistivity of the soil where the pipeline is located. Further, according to the current density and the resistivity of the soil, the voltage drop of the soil is determined, and according to the voltage drop of the soil, the instantaneous potential of the pipeline and the resistivity of the solution, the surface potential of the area to be detected is determined; the resistivity of the solution is the resistivity of the stripping coating of the pipeline and the solution between the pipeline, and the stripping coating is located in the area to be detected.

[0083] According to the above technical means, when the coating on the pipeline is peeled off, the voltage drop of the soil is determined according to the current density of the area to be detected where the peeled coating is located and the resistivity of the soil. Further, the surface potential of the area to be detected on the pipeline is determined according to the voltage drop of the soil, the transient potential of the pipeline and the resistivity of the solution. Since the current density of the area to be detected, the resistivity of the soil, the resistivity of the solution, the voltage drop of the soil and the transient potential of the pipeline are comprehensively considered, the surface potential of the area to be detected can be accurately determined.

[0084] like Figure 1 As shown, Figure 1 A potential determination system 100 is provided in an embodiment of the present application. The potential determination system 100 may include an electronic device 101, a plurality of pipelines ( Figure 1 In the figure, three pipelines are shown as an example: pipeline 1, pipeline 2 and pipeline 3. In actual applications, there may be more or fewer pipelines, which is not limited in the embodiments of the present application) and multiple rectifiers ( Figure 1 Schematically, three rectifiers are shown: rectifier 1, rectifier 2 and rectifier 3, with one rectifier corresponding to one pipeline).

[0085] In the embodiment of the present application, the electronic device 101 is used to determine the current density of the area to be detected of the pipeline and the resistivity of the soil where the pipeline is located. Further, the electronic device 101 is also used to determine the voltage drop of the soil according to the current density and the resistivity of the soil, and determine the surface potential of the area to be detected according to the voltage drop of the soil, the transient potential of the pipeline and the resistivity of the solution.

[0086] In some embodiments, the electronic device 101 is further used to store the resistivity of the soil at the location of each of the multiple pipelines and the resistivity of the coating of each pipeline. The electronic device 101 is further used to store the position information of each rectifier in the multiple rectifiers, the position information of the drainage point of each pipeline, and the position information of each pipeline.

[0087] In the embodiment of the present application, the pipeline is a pipeline under a cathodic protection system. The pipeline may be pipeline 1, pipeline 2 or pipeline 3 in the potential determination system 100 .

[0088] The type of coating on the pipeline in the embodiments of the present application is not specifically limited. For example, the coating on the main part of the pipeline can be asphalt, coal tar enamel, 3-layer polyethylene, tape packaging or fused epoxy resin, and the coating of the girth weld between the pipelines can be tape, thermoplastic material, liquid epoxy resin or wax, etc.

[0089] In the embodiment of the present application, the rectifier provides cathodic protection current for the pipeline.

[0090] For ease of understanding, the potential determination method provided in the present application is specifically introduced below with reference to the accompanying drawings.

[0091] Figure 2 According to a schematic flow chart of a method for determining electric potential according to an exemplary embodiment, the method includes: S201-S203.

[0092] S201, determining the current density of the area to be inspected in the pipeline.

[0093] As a possible implementation method, the electronic device determines the attenuation current of the area to be detected based on the coating resistivity of the pipeline and the resistivity of the soil. Further, the electronic device determines the current density based on the attenuation current, the radius of the pipeline and the coating failure threshold. This step is detailed in the following steps and will not be repeated here.

[0094] In the embodiment of the present application, the resistivity of the soil and the resistivity of the coating of the pipeline may be pre-stored in the electronic device, may be detected by the staff in real time, or may be determined based on the resistivity of the reference soil and the resistivity of the reference coating, and the embodiment of the present application does not limit this.

[0095] In some embodiments, the resistivity of the soil and the resistivity of the coating of the pipeline are obtained according to the resistivity data pre-stored in the electronic device to obtain the current weather information, and obtain the resistivity of the soil and the resistivity of the coating of the pipeline that match the current weather information. The weather information includes temperature and / or humidity.

[0096] As another possible implementation, the electronic device determines the current density of the area to be detected based on the state information of the area to be detected and the reference current density. The state information may include the peeling area of ​​the coating and the distance between the area to be detected and the target rectifier.

[0097] S202: Determine the voltage drop of the soil according to the current density and the resistivity of the soil where the pipeline is located.

[0098] In some embodiments, the electronic device determines the voltage drop of the soil according to the resistivity of the soil and the current density when obtaining the current density.

[0099] Exemplarily, the voltage drop of the soil satisfies the following formula 1.

[0100] IR=ρ soil *j x *dFormula 1

[0101] Where IR is the voltage drop of the soil, ρ soil is the resistivity of the soil, j xis the current density, and d is the distance between the pipeline and the reference electrode (in meters).

[0102] In the embodiment of the present application, the reference electrode is pre-configured at a position at a preset distance from the pipeline. The preset distance can be adjusted according to the type of pipeline and the location of the pipeline, and the embodiment of the present application does not limit the specific value of the preset distance.

[0103] S203, determining the surface potential of the area to be detected according to the voltage drop of the soil, the transient potential of the pipeline and the resistivity of the solution.

[0104] The solution resistivity is the resistivity of the solution between the stripping coating of the pipeline and the pipeline, and the stripping coating is located in the area to be detected.

[0105] In some embodiments, the electronic device inputs the voltage drop of the soil, the transient potential of the pipeline, and the resistivity of the solution into a potential determination model, and outputs the surface potential of the area to be detected.

[0106] It should be noted that the potential determination model is a pre-configured model.

[0107] In some embodiments, the electronic device determines the on-state potential of the pipeline according to the voltage drop and the transient potential of the soil, and determines the surface potential of the area to be detected according to the on-state potential and the resistivity of the solution. This step is described in detail in the following embodiments and will not be repeated here.

[0108] Subsequently, the electronic device predicts the probability of SCC type and crack growth rate based on the surface potential of the pipe.

[0109] The potential determination method provided in the embodiment of the present application brings at least the following beneficial effects: when the coating is peeled off on the coating of the pipeline, the voltage drop of the soil is determined according to the current density of the area to be detected where the peeled coating is located and the resistivity of the soil. Further, the surface potential of the area to be detected on the pipeline is determined according to the voltage drop of the soil, the transient potential of the pipeline and the resistivity of the solution. Since the current density of the area to be detected, the resistivity of the soil, the resistivity of the solution, the voltage drop of the soil and the transient potential of the pipeline are comprehensively considered, the surface potential of the area to be detected can be accurately determined.

[0110] In some embodiments, in order to obtain accurate current density, the above S201 includes:

[0111] S2011-S2012.

[0112] S2011. Determine the attenuation current of the area to be detected based on the coating resistivity of the pipeline and the resistivity of the soil.

[0113] In some embodiments, the electronic device determines the current attenuation coefficient of the pipeline according to the resistivity of the coating of the pipeline and the resistivity of the soil, and determines the attenuation current according to the current attenuation coefficient, the current of the reference discharge point on the pipeline, and the reference distance. The reference distance is the distance between the abnormal point in the area to be detected and the reference point in the area to be detected. This step is described in detail in the following embodiment and will not be repeated here.

[0114] In other embodiments, the electronic device determines the decay current based on the resistivity of the coating, the thickness of the coating, the resistivity of the soil, the current at the reference drain point, and the resistivity of the material of the pipe.

[0115] The decay current in the embodiment of the present application is the current that reaches the area to be detected after the initial current decays.

[0116] S2012. Determine the current density according to the attenuation current, the radius of the pipeline, the cathodic protection distance of the pipeline, and the failure threshold of the debonding coating.

[0117] Exemplarily, the current density satisfies the following formula 2.

[0118]

[0119] Among them, j x is the current density, i x is the decay current, D is the cathodic protection distance, r is the pipeline radius of the pipeline, and CB is the failure threshold of the debonding coating.

[0120] It should be noted that the failure threshold is a pre-configured value. The cathodic protection distance can be understood as the distance of the pipeline affected by the rectifier or the length of the pipeline under cathodic protection.

[0121] It can be understood that the attenuation current of the area to be detected is determined based on the resistivity of the coating and the resistivity of the soil. Further, the current density is determined based on the attenuation current, the radius of the pipeline and the coating failure threshold. In this way, considering that the current will attenuate when passing through the pipeline, the real current of the cathodic protection current to the area to be detected after attenuation is determined based on the factors affecting the current attenuation, and the current density is determined based on the real current of the area to be detected, so that a more accurate current density can be obtained.

[0122] In some embodiments, in order to obtain the current of the area to be detected, the above S2011 includes:

[0123] S301-S302.

[0124] S301. Determine the current attenuation coefficient of the pipeline according to the coating resistivity of the pipeline and the resistivity of the soil.

[0125] In some embodiments, the electronic device determines the leakage resistance of the pipeline according to the coating resistivity of the pipeline, the thickness of the stripped coating, the radius of the pipeline, and the resistivity of the soil, and determines the current attenuation coefficient according to the leakage resistance and the longitudinal resistance of the pipeline. This step is described in detail in the following embodiment and will not be repeated here.

[0126] In other embodiments, the electronic device inputs the coating resistivity of the pipeline, the thickness of the stripped coating, the radius of the pipeline, the resistivity of the soil, and the resistivity of the material of the pipeline into the attenuation coefficient determination algorithm to obtain the current attenuation coefficient. It should be noted that the attenuation coefficient determination algorithm is pre-configured.

[0127] It can be understood that when the attenuation coefficient is larger, the current decays faster along the line.

[0128] S302: Determine an attenuated current according to a current attenuation coefficient, a current at a reference discharge point on the pipeline, and a reference distance.

[0129] The reference distance is the distance between the abnormal point in the area to be detected and the reference point in the area to be detected.

[0130] In some embodiments, the electronic device determines the attenuation current according to the current attenuation coefficient, the current at a reference discharge point on the pipeline, and the reference distance when the current attenuation coefficient is obtained.

[0131] Exemplarily, the decay current of the coating satisfies the following formula three.

[0132] i x =i 0 *e -αx Formula 3

[0133] Among them, i x is the decay current, i 0 is the current at the reference discharge point on the pipeline, α is the attenuation coefficient, x is the reference distance.

[0134] In the embodiment of the present application, the reference point in the area to be detected can be any point in the area to be detected. For example, the reference point in the area to be detected is the center point of the area to be detected. The area to be detected can be of any shape. For example, the area to be detected can be a rectangle, a square, or a triangle, which is not limited in the embodiment of the present application.

[0135] It can be understood that according to the above method, the current of the area to be detected under different combinations of soil resistivity and coating resistivity can be calculated.

[0136] In some embodiments, in order to obtain an accurate current attenuation coefficient, the above S301 includes:

[0137] S3011-S3012.

[0138] S3011. Determine the leakage resistance of the pipeline based on the coating resistivity of the pipeline, the thickness of the stripped coating, the coating coverage surface area of ​​the pipeline, the radius of the pipeline, and the resistivity of the soil.

[0139] Exemplarily, the leakage resistance satisfies the following formula 4.

[0140]

[0141] Among them, R L is the leakage resistance, ρ c is the coating resistivity, t is the thickness of the peeled coating (in meters), ρ soil is the resistivity of the soil, A S is the surface area covered by the coating (in square meters m 2 ), r is the radius of the pipeline (in meters).

[0142] S3012. Determine the current attenuation coefficient based on the leakage resistance and the longitudinal resistance of the pipeline.

[0143] Exemplarily, the current attenuation coefficient satisfies the following formula 5.

[0144]

[0145] Among them, α is the current attenuation coefficient, R S is the longitudinal resistance, R L is the leakage resistor.

[0146] In some embodiments, the longitudinal resistance of the pipeline is determined based on the resistivity of the material of the pipeline, the length of the pipeline, and the cross-sectional area of ​​the pipeline.

[0147] Exemplarily, the longitudinal resistance satisfies the following formula six.

[0148]

[0149] Among them, R S is the longitudinal resistance, ρ s is the resistivity of the pipeline, L is the length of the pipeline (in meters), A X is the cross-sectional area of ​​the pipe wall (in m 2 ). The resistivity of the pipeline can be understood as the resistivity of the target pipeline body. For example, if the pipeline body is made of steel, the resistivity of the pipeline is the resistivity of the steel.

[0150] It can be understood that the leakage resistance of the pipeline is determined based on pipeline parameters such as coating resistivity, coating thickness, pipeline radius, and soil resistivity. Then, the current attenuation coefficient is determined based on the leakage resistance. In this way, a more accurate current attenuation coefficient can be obtained based on multiple pipeline parameters.

[0151] In some embodiments, in order to obtain accurate surface potential of the area to be detected, the above S203 includes: S2031-S2032.

[0152] S2031. Determine the pipeline's energized potential based on the soil's voltage drop and transient potential.

[0153] Exemplarily, the power-on potential satisfies the following formula 7.

[0154] E on =E off +IR formula seven

[0155] Among them, E off is the instantaneous potential, E on is the on-state potential and IR is the voltage drop across the soil.

[0156] It should be noted that the instantaneous power-off potential is the instantaneous power-off potential.

[0157] S2032. Determine the surface potential of the area to be detected based on the power-on potential and the resistivity of the solution.

[0158] In some embodiments, when obtaining the power-on potential, the electronic device determines whether the area to be detected is a cathodic protection area. If the area to be detected is a cathodic protection area, the electronic device determines the surface potential based on the power-on potential, the solution resistivity, the open circuit potential of the pipeline, and the distance between the stripping coating and the outer surface of the pipeline. Otherwise, if the area to be detected is an area with shielded cathodic protection, the electronic device determines the surface potential based on the solution resistivity, the open circuit potential, and the distance between the stripping coating and the outer surface of the pipeline. This step is detailed in the following steps and will not be repeated here.

[0159] It can be understood that the accurate on-state potential is obtained based on the voltage drop of the soil at the location of the pipeline, and further, the accurate surface potential is obtained based on the on-state potential and the resistivity of the solution.

[0160] In some embodiments, in order to accurately obtain the surface potential, the above S2032 includes: S401.

[0161] S401. When the area to be inspected is a cathodic protected area, the surface potential is determined according to the power-on potential, the resistivity of the solution, the open circuit potential of the pipeline, the distance from the reference point of the area to be inspected to the damaged point of the area to be inspected, and the distance between the stripped coating and the outer surface of the pipeline, when the anti-corrosion layer in the area to be inspected has a current shielding effect.

[0162] Exemplarily, when the area to be detected is a cathodic protected area, the surface potential determination formula satisfies the following formula eight.

[0163]

[0164] Among them, E x is the surface potential, E on is the on-state potential, E OCP is the open circuit potential, x is the distance from the reference point of the area to be detected to the damaged point of the area to be detected; a is the distance between the peeling coating and the outer surface of the pipeline, and c is a dimensionless variable.

[0165] In some embodiments, the dimensionless variable c satisfies the following Formula 9.

[0166]

[0167] Where c is a dimensionless variable, a is the distance between the peeling coating and the outer surface of the pipe, and R p is the linear polarization resistance of the pipe surface in the peeling area.

[0168] It can be understood that the dimensionless variable c is used to measure the importance of solution resistance to polarization resistance. The larger the solution resistance is relative to the linear polarization resistance, the lower the ability of the cathodic protection current to penetrate the area to be inspected. It should be noted that the defect point is the damaged point of the pipeline in the area to be inspected. The cathodic protection area is the area where there is no shielding cathodic protection.

[0169] In some embodiments, when the anti-corrosion layer in the area to be detected has no current shielding effect, the surface potential is determined according to the solution resistivity, the open circuit potential, the distance from the reference point of the area to be detected to the damaged point of the area to be detected, and the distance between the stripping coating and the outer surface of the pipeline. Exemplarily, the target potential determination formula corresponding to the stripping coating with shielding cathodic protection satisfies the following formula 10.

[0170]

[0171] Among them, E x is the surface potential, ρ is the solution resistivity, E OCP is the open circuit potential, x is the distance from the defect point to the area to be detected, and a is the distance between the peeling coating and the outer surface of the pipe.

[0172] In some embodiments, R p The target position may be any position in the area to be detected, or a position that is greater than a preset distance from the edge line of the area to be detected, which is not limited in the embodiment of the present application.

[0173] For example, Figure 3 A schematic diagram of the surface potential change is shown in FIG. Figure 3 In the figure, the horizontal axis is the distance ratio (x / a) and the vertical axis is the surface potential. Figure 3 The open circuit potential E OCP Under stable conditions, there are three surface potential change curves: the surface potential change curve of c1=0.04, the surface potential change curve of c2=0.06, and the surface potential change curve of c3=0.08.

[0174] In order to better understand the potential determination method provided in the embodiments of the present application, Figure 4 As shown, a schematic diagram of a potential determination process is shown, including: S501-S506.

[0175] S501, obtaining the resistivity of the coating, the rectifier distance, and the resistivity of the soil.

[0176] In some embodiments, the resistance of the coating to be evaluated is obtained, and the resistivity of the coating is determined based on the resistance of the coating, the cross-sectional area of ​​the coating, and the length of the coating. In other embodiments, coating parameters of the coating are obtained, and the coating parameters are input into a resistivity determination model to output the resistivity of the coating. The embodiments of the present application do not specifically limit the method for obtaining the resistivity of the coating.

[0177] Accordingly, the resistivity of the soil can be determined by referring to the method for determining the resistivity of the coating, which will not be described in detail in the embodiments of the present application.

[0178] In some embodiments, the position of the rectifier is acquired, and the rectifier distance is determined according to the position of the rectifier and the position of the area to be detected.

[0179] It should be noted that the resistivity determination model is pre-configured.

[0180] In the embodiment of the present application, the coating type can be determined according to the resistivity of the coating. For example, the coating type is determined according to the resistivity of the coating and the target correspondence relationship. The target correspondence relationship includes multiple resistivities and the coating type corresponding to each resistivity.

[0181] For example, if the resistivity of the coating is less than 10 -7 Ω·cm, then according to the resistivity of the coating and the target correspondence, the coating is determined to be a poor coating. It can be understood that the smaller the resistivity of the coating, the worse the coating.

[0182] It should be noted that the specific classification of coating types in the embodiments of the present application is not limited. For example, coating types can be divided into high-quality coatings, ordinary coatings, and poor coatings.

[0183] For example, Figure 5 A schematic diagram of the current decay for different coating types is shown. Figure 5 In the figure, the horizontal axis represents the rectifier distance, and the vertical axis represents the current attenuation value. Figure 5 The current decay curves corresponding to the high-quality coating, the ordinary coating and the poor coating are also shown. Among them, the resistivity of the high-quality coating is greater than that of the ordinary coating, and the resistivity of the ordinary coating is greater than that of the poor coating.

[0184] S502: Determine the attenuation current.

[0185] This step is detailed in S2011, S301-S302 above.

[0186] S503: Determine current density.

[0187] This step is detailed in S201, S2011-S2012 above.

[0188] S504: Determine the voltage drop of the soil.

[0189] This step is detailed in S202 above.

[0190] S505: Determine the power-on potential.

[0191] This step is detailed in S2031 above.

[0192] S506: Determine the surface potential.

[0193] This step is detailed in the above S203, S2031-S2032 and S401.

[0194] The above mainly introduces the solution provided by the embodiment of the present application from the perspective of the method. In order to achieve the above functions, the communication device includes a hardware structure and / or software module corresponding to each function. It should be easily appreciated by those skilled in the art that, in combination with the units and algorithm steps of each example described in the embodiments disclosed herein, the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a function is executed in the form of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present application.

[0195] Figure 6FIG. 6 is a potential determination device 60 according to an exemplary embodiment. Figure 6 , the potential determining device 60 includes: a determining unit 601.

[0196] The determination unit 601 is used to determine the current density of the area to be detected of the pipeline.

[0197] The determination unit 601 is further configured to determine the voltage drop of the soil according to the current density and the resistivity of the soil at the location of the pipeline.

[0198] The determination unit 601 is further used to determine the surface potential of the area to be detected based on the voltage drop of the soil, the transient potential of the pipeline and the resistivity of the solution. The resistivity of the solution is the resistivity of the solution between the stripping coating of the pipeline and the pipeline, and the stripping coating is located in the area to be detected.

[0199] In some embodiments, the determination unit 601 is specifically used to: determine the attenuation current of the area to be detected according to the coating resistivity of the pipeline and the resistivity of the soil. Determine the current density according to the attenuation current, the radius of the pipeline, the cathodic protection distance of the pipeline, and the failure threshold of the peeling coating. The current density satisfies the following formula:

[0200]

[0201] Among them, j x is the current density, i x is the decay current, D is the cathodic protection distance, r is the pipeline radius of the pipeline, and CB is the failure threshold of the debonding coating.

[0202] In some embodiments, the determination unit 601 is specifically used to: determine the current attenuation coefficient of the pipeline according to the coating resistivity of the pipeline and the resistivity of the soil. Determine the attenuation current according to the current attenuation coefficient, the current of the reference discharge point on the pipeline, and the reference distance. The reference distance is the distance between the abnormal point in the area to be detected and the reference point in the area to be detected, and the attenuation current satisfies the following formula:

[0203] i x =i 0 *e -αx

[0204] Among them, i x is the decay current, i 0 is the current at the reference discharge point on the pipeline, α is the attenuation coefficient, x It is the distance from the reference point of the area to be detected to the damaged point of the area to be detected.

[0205] In some embodiments, the determination unit 601 is specifically used to determine the leakage resistance of the pipeline according to the coating resistivity of the pipeline, the thickness of the stripped coating, the coating coverage surface area of ​​the pipeline, the radius of the pipeline and the resistivity of the soil. The leakage resistance satisfies the following formula:

[0206]

[0207] Among them, R L is the leakage resistance, ρ c is the coating resistivity, t is the thickness of the peeled coating, ρ soil is the resistivity of the soil, A S is the surface area covered by the coating and r is the radius of the pipe.

[0208] The current attenuation coefficient is determined based on the leakage resistance and the longitudinal resistance of the pipeline. The current attenuation coefficient satisfies the following formula:

[0209]

[0210] Among them, α is the current attenuation coefficient, R S is the longitudinal resistance, R L is the leakage resistance.

[0211] In some embodiments, the determination unit 601 is further used to determine the longitudinal resistance of the pipeline according to the resistivity of the material of the pipeline, the length of the pipeline and the cross-sectional area of ​​the pipeline. The longitudinal resistance satisfies the following formula:

[0212]

[0213] Among them, R S is the longitudinal resistance, ρ s is the resistivity of the material, L is the length of the pipeline, A X is the cross-sectional area of ​​the pipe wall.

[0214] In some embodiments, the determination unit 601 is specifically used to: determine the on-state potential of the pipeline according to the voltage drop and the transient potential of the soil, and determine the surface potential of the area to be detected according to the on-state potential and the resistivity of the solution.

[0215] In some embodiments, the determination unit 601 is specifically used to: determine the surface potential according to the power-on potential, the resistivity of the solution, the open circuit potential of the pipeline, the distance from the reference point of the area to be detected to the damaged point of the area to be detected, and the distance between the stripped coating and the outer surface of the pipeline when the area to be detected is a cathodic protected area. When the anti-corrosion layer in the area to be detected has a current shielding effect, the surface potential satisfies the following formula:

[0216]

[0217] Among them, E x is the surface potential, E on is the on-state potential, E OCP is the open circuit potential, x is the distance from the reference point of the area to be detected to the damaged point of the area to be detected, a is the distance between the peeled coating and the outer surface of the pipeline, and c is a dimensionless variable.

[0218] In some embodiments, the dimensionless variable satisfies the following formula:

[0219]

[0220] Where c is a dimensionless variable, a is the distance between the peeling coating and the outer surface of the pipe, and R p is the linear polarization resistance of the area to be detected, and ρ is the resistivity of the solution.

[0221] In some embodiments, the determination unit 601 is further used to: determine the surface potential according to the solution resistivity, the open circuit potential, the distance from the reference point of the area to be detected to the damaged point of the area to be detected, and the distance between the stripped coating and the outer surface of the pipeline when the anti-corrosion layer in the area to be detected has no current shielding effect. The surface potential satisfies the following formula:

[0222]

[0223] Among them, E x is the surface potential, ρ is the solution resistivity, E OCP is the open circuit potential, x is the distance from the reference point of the area to be detected to the damaged point of the area to be detected, and a is the distance between the peeling coating and the outer surface of the pipeline.

[0224] In some embodiments, Figure 6 As shown, the potential determination device 60 further includes a display unit 602. The display unit 602 is used to display the surface potential.

[0225] Figure 7 FIG. 1 is a schematic diagram of an electronic device according to an exemplary embodiment. Figure 7 As shown, the electronic device includes but is not limited to: a processor 701 and a memory 702 .

[0226] The memory 702 is used to store executable instructions of the processor 701. It can be understood that the processor 701 is configured to execute instructions to implement the model training method and SOC estimation method in the above embodiment.

[0227] It should be noted that those skilled in the art can understand that Figure 7 The electronic device structure shown in the figure does not constitute a limitation on the electronic device, and the electronic device may include Figure 7More or fewer components may be shown, or certain components may be combined, or the components may be arranged differently.

[0228] The processor 701 is the control center of the electronic device. It uses various interfaces and lines to connect various parts of the entire electronic device. By running or executing software programs and / or modules stored in the memory 702, and calling data stored in the memory 702, it performs various functions of the electronic device and processes data, thereby monitoring the electronic device as a whole. The processor 701 may include one or more processing units. Optionally, the processor 701 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, and the modem processor mainly processes wireless communications. It is understandable that the above-mentioned modem processor may not be integrated into the processor 701.

[0229] The memory 702 may be used to store software programs and various data. The memory 702 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application program required by at least one functional module (such as a determination unit, a processing unit, etc.), etc. In addition, the memory 702 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0230] In an exemplary embodiment, a computer-readable storage medium including instructions is also provided, such as a memory 702 including instructions. The above instructions can be executed by a processor 701 of an electronic device to implement the method in the above embodiment.

[0231] Optionally, the computer-readable storage medium may be a non-temporary computer-readable storage medium, for example, the non-temporary computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0232] In an exemplary embodiment, the present application also provides a computer program product including one or more instructions, and the one or more instructions can be executed by the processor 701 of the electronic device to complete the method in the above embodiment.

[0233] It should be noted that when the instructions in the above-mentioned computer-readable storage medium or one or more instructions in the computer program product are executed by the processor of the electronic device, the various processes of the above-mentioned method embodiment are implemented, and the same technical effect as the above-mentioned method can be achieved. To avoid repetition, they will not be repeated here.

[0234] Through the description of the above implementation methods, technical personnel in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0235] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of modules or units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0236] The units described as separate components may or may not be physically separated, and the components shown as units may be one physical unit or multiple physical units, that is, they may be located in one place or distributed in multiple different places. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0237] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0238] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, the technical solution of the embodiment of the present application is essentially or the part that contributes to the prior art or the full classification part or part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium, including a number of instructions to enable a device (which can be a single-chip microcomputer, chip, etc.) or a processor (processor) to execute the full classification part or part of the steps of each embodiment method of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, ROM, RAM, disk or CD and other media that can store program code.

[0239] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto, and any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for determining potential, characterized in that: The method comprises: Determine the current density of the pipeline area to be inspected; Determining a voltage drop in the soil based on the current density and the resistivity of the soil at the location where the pipeline is located; The surface potential of the area to be detected is determined according to the voltage drop of the soil, the transient potential of the pipeline and the resistivity of the solution; the resistivity of the solution is the resistivity of the solution between the stripping coating of the pipeline and the pipeline, and the stripping coating is located in the area to be detected.

2. The method according to claim 1, characterized in that The step of determining the current density of the area to be inspected in the pipeline includes: Determining the attenuation current of the area to be detected according to the coating resistivity of the pipeline and the resistivity of the soil; The current density is determined according to the decay current, the radius of the pipeline, the cathodic protection distance of the pipeline, and the failure threshold of the stripping coating; the current density satisfies the following formula: Among them, j x is the current density, i x is the attenuation current, D is the cathodic protection distance, r is the pipeline radius of the pipeline, and CB is the failure threshold of the debonding coating.

3. The method according to claim 2, characterized in that The step of determining the attenuation current of the area to be detected according to the coating resistivity of the pipeline and the resistivity of the soil includes: Determining a current attenuation coefficient of the pipeline according to the coating resistivity of the pipeline and the resistivity of the soil; The attenuation current is determined according to the current attenuation coefficient, the current of the reference discharge point on the pipeline, and the reference distance; the reference distance is the distance between the abnormal point in the area to be detected and the reference point in the area to be detected, and the attenuation current satisfies the following formula: I x =i0*e -αx Among them, i x is the attenuation current, i0 is the current at the reference discharge point on the pipeline, α is the attenuation coefficient, x is the reference distance.

4. The method according to claim 3, characterized in that Determining the current attenuation coefficient of the pipeline according to the coating resistivity of the pipeline and the resistivity of the soil includes: The leakage resistance of the pipeline is determined according to the coating resistivity of the pipeline, the thickness of the stripping coating, the coating coverage surface area of ​​the pipeline, the radius of the pipeline and the resistivity of the soil; the leakage resistance satisfies the following formula: Among them, R L is the leakage resistance, ρ c is the coating resistivity, t is the thickness of the peeling coating, ρ soil is the resistivity of the soil, A S is the surface area covered by the coating, and r is the radius of the pipe; The current attenuation coefficient is determined according to the leakage resistance and the longitudinal resistance of the pipeline; the current attenuation coefficient satisfies the following formula: Wherein, α is the current attenuation coefficient, R S is the longitudinal resistance, R L is the leakage resistance.

5. The method according to any one of claims 1 to 4, characterized in that The method further comprises: The longitudinal resistance of the pipeline is determined according to the resistivity of the material of the pipeline, the length of the pipeline and the cross-sectional area of ​​the pipeline; the longitudinal resistance satisfies the following formula: Among them, R S is the longitudinal resistance, ρ s is the resistivity of the material, L is the length of the pipeline, A X is the cross-sectional area of ​​the pipe wall.

6. The method according to any one of claims 1 to 4, characterized in that The step of determining the surface potential of the area to be detected according to the voltage drop of the soil, the instantaneous potential of the coating and the resistivity of the solution comprises: Determining the energization potential of the pipeline according to the voltage drop of the soil and the instantaneous potential; The surface potential of the area to be detected is determined according to the power-on potential and the solution resistivity.

7. The method according to claim 6, characterized in that The step of determining the surface potential of the area to be detected according to the power-on potential and the solution resistivity includes: In the case where the area to be inspected is a cathodic protected area, the surface potential is determined according to the power-on potential, the solution resistivity, the open circuit potential of the pipeline, the distance from the reference point of the area to be inspected to the damaged point of the area to be inspected, and the distance between the stripping coating and the outer surface of the pipeline; when the anti-corrosion layer in the area to be inspected has a current shielding effect, the surface potential satisfies the following formula: Among them, E x is the surface potential, E on is the power-on potential, E OCP is the open circuit potential, x is the distance from the reference point of the area to be detected to the damaged point of the area to be detected, a is the distance between the peeling coating and the outer surface of the pipeline, and c is a dimensionless variable.

8. The method according to claim 7, characterized in that The dimensionless variable satisfies the following formula: Wherein, c is the dimensionless variable, a is the distance between the release coating and the outer surface of the pipe, R p is the linear polarization resistance of the area to be detected, and ρ is the resistivity of the solution.

9. The method according to claim 7, characterized in that: The method further comprises: When the anti-corrosion layer in the area to be detected has no current shielding effect, the surface potential is determined according to the solution resistivity, the open circuit potential, the distance from the reference point of the area to be detected to the damaged point of the area to be detected, and the distance between the stripping coating and the outer surface of the pipeline; the surface potential satisfies the following formula: Among them, E x is the surface potential, ρ is the solution resistivity, E OCP is the open circuit potential, x is the distance from the reference point of the area to be detected to the damaged point of the area to be detected, and a is the distance between the release coating and the outer surface of the pipeline.

10. A potential determination device, characterized in that: The device comprises: a determination unit; The determination unit is used to determine the current density of the area to be detected in the pipeline; The determination unit is further configured to determine a voltage drop of the soil according to the current density and the resistivity of the soil at the location where the pipeline is located; The determination unit is further used to determine the surface potential of the area to be detected based on the voltage drop of the soil, the transient potential of the pipeline and the resistivity of the solution; the resistivity of the solution is the resistivity of the solution between the stripping coating of the pipeline and the pipeline, and the stripping coating is located in the area to be detected.

11. An electronic device, characterized in that: include: A processor and a memory; wherein the memory is used to store one or more programs, and the one or more programs include computer-executable instructions. When the electronic device is running, the processor executes the computer-executable instructions stored in the memory to enable the electronic device to perform the method described in any one of claims 1 to 9.

12. A computer-readable storage medium, characterized in that: When the computer-executable instructions stored in the computer-readable storage medium are executed by a processor of a pipeline risk assessment device, the pipeline risk assessment device can perform the method according to any one of claims 1 to 9.

13. A computer program product, characterized in that The computer program product comprises: a computer program or instructions, and when the computer program or instructions are run on a computer, the computer is caused to perform the method according to any one of claims 1 to 9.

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