Soil complex impedance three-dimensional monitoring system

Abstract

The invention provides a soil complex impedance three-dimensional monitoring system, which is characterized in that a main control module sends control signals to a signal generation module, a transmitting relay array, a receiving relay array and a multi-path signal synchronous acquisition and processing module; the transmitting relay array controls the plurality of electrodes according to a control signal to send a signal source generated by the signal generation module to soil of a target to-be-detected area, and the receiving relay array controls the plurality of electrodes according to the control signal to acquire multiple paths of voltage signals from the soil of the target to-be-detected area and transmit the multiple paths of voltage signals to the multi-path signal synchronous acquisition and processing module; the current acquisition module transmits an acquired current signal to the multi-channel signal synchronous acquisition processing module, and the multi-channel signal synchronous acquisition processing module buffers and converts the current signal and an acquired voltage signal according to a control signal and then inputs the current signal and the acquired voltage signal to the master control module. The main control module sends the processed data to a remote control terminal for visualization by using the communication module; and the convenience and the monitoring precision of soil monitoring are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of soil monitoring, and in particular to a soil complex impedance three-dimensional monitoring system. Background Art

[0002] Soil refers to the loose surface layer of the land surface that is fertile and can grow plants. Its thickness is generally about 2 meters. Soil not only provides mechanical support for plant growth, but also provides the fertility elements such as water, fertilizer, air, and heat required for plant growth and development. Due to the rapid population growth and rapid industrial development, solid waste is constantly piled and dumped on the soil surface, harmful wastewater is constantly infiltrating into the soil, and harmful gases and floating dust in the atmosphere are constantly falling into the soil with rain, leading to soil pollution. Any substance that hinders the normal function of the soil, reduces crop yield and quality, and indirectly affects human health through food, vegetables, and fruits is called a soil pollutant.

[0003] Pollutants generated by human activities enter the soil and accumulate to a certain extent, causing soil quality to deteriorate, and then causing certain indicators of crops to exceed national standards. This is called soil pollution. There are many ways for pollutants to enter the soil. Pollutants contained in exhaust gas, especially particulate matter, settle to the ground and enter the soil under the action of gravity. Wastewater carries a large amount of pollutants into the soil. Pollutants in solid waste directly enter the soil or their leachate enters the soil. The most important of these is soil pollution caused by sewage irrigation. The large-scale use of pesticides and fertilizers has caused a decrease in soil organic matter content and soil compaction, which is also one of the sources of soil pollution.

[0004] Most of the existing high-density electrical instruments use centralized control, and the electrodes are wired controlled by electronic or mechanical conversion devices, which are complex in structure and low in control efficiency. When controlled by a PC or instrument panel, the instrument has high power consumption, poor human-computer interaction, and low maintainability, making it difficult to achieve long-term continuous real-time monitoring. In addition, it is generally two-dimensional slice imaging, which can only collect geoelectric information at a single level, greatly limiting the monitoring effect. At the same time, there are few high-density electrical instrument designs that have been successfully applied to soil pollution monitoring. The present invention is based on the specific needs of continuous real-time monitoring of soil pollution, has strong pertinence, and has obvious advantages in this field. Summary of the invention

[0005] The invention provides a soil complex impedance three-dimensional monitoring system, the purpose of which is to improve the convenience and monitoring accuracy of soil monitoring.

[0006] In order to achieve the above object, the present invention provides a soil complex impedance three-dimensional monitoring system, including: a monitoring device and a remote control terminal;

[0007] The monitoring device includes a transmitting relay array, a receiving relay array, a multi-channel signal synchronous acquisition and processing module, a current acquisition module, a main control module, a signal generation module, and a communication module;

[0008] A plurality of transmitting electrodes controlled by a transmitting relay array and a plurality of receiving electrodes controlled by a receiving relay array are arranged in the soil of the target area to be tested, and the transmitting electrodes and the receiving electrodes are arranged alternately and in parallel one by one;

[0009] The first output end of the signal generating module is connected to the input end of the transmitting relay array, the second output end of the signal generating module is connected to the first end of the current collecting module and connected to the instrument ground, and the second end of the current collecting module is connected to the first input end of the multi-channel signal synchronous collecting and processing module and connected to the signal ground;

[0010] The control end of the transmitting relay array, the control end of the receiving relay array, the control end of the signal generating module, and the control end of the multi-channel signal synchronous acquisition and processing module are all connected to the output end of the main control module;

[0011] The output end of the receiving relay array is connected to the second input end of the multi-channel signal synchronous acquisition and processing module, and the output end of the multi-channel signal synchronous acquisition and processing module is connected to the input end of the main control module;

[0012] The data transmission end of the main control module is connected to the data transmission end of the remote control terminal through the communication module.

[0013] Further, it also includes a power management module composed of a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip, a sixth power chip, a seventh power chip, a voltage reference chip, a first low voltage difference linear voltage regulator chip, and a second low voltage difference linear voltage regulator chip;

[0014] The input end of the first power chip, the input end of the second power chip, and the input end of the third power chip are all connected to the power supply end;

[0015] The output end of the first power chip is respectively connected to the first power end of the main control module, the first power end of the communication module, and the power end of the signal generating module;

[0016] The output end of the second power supply chip is connected to the input end of the first low voltage difference linear voltage regulator chip and the input end of the second low voltage difference linear voltage regulator chip respectively, the output end of the first low voltage difference linear voltage regulator chip is connected to the positive terminal of the first power supply of the multi-channel signal synchronous acquisition and processing module, and the output end of the second low voltage difference linear voltage regulator chip is connected to the negative terminal of the first power supply of the multi-channel signal synchronous acquisition and processing module;

[0017] The output end of the third power chip is respectively connected to the input end of the fourth power chip, the input end of the fifth power chip, the input end of the sixth power chip, the input end of the voltage reference chip, the fourth power end of the multi-channel signal synchronous acquisition processing module, the power end of the receiving relay array, the second power end of the main control module, and the second power end of the communication module;

[0018] The output end of the fourth power supply chip is connected to the third power supply end of the main control module;

[0019] The output end of the fifth power chip is connected to the input end of the seventh power chip, and the output end of the seventh power chip is connected to the negative terminal of the second power supply of the multi-channel signal synchronous acquisition and processing module;

[0020] The output end of the sixth power chip is connected to the positive end of the second power supply of the multi-channel signal synchronous acquisition and processing module;

[0021] The output end of the voltage reference chip is connected to the third power supply end of the multi-channel signal synchronous acquisition and processing module.

[0022] Further, the multi-channel signal synchronous acquisition and processing module includes an operational amplifier buffer circuit and a conversion circuit;

[0023] The positive terminal of the operational amplifier buffer circuit is connected to the output terminal of the first low voltage difference linear voltage regulator chip, and the negative terminal of the operational amplifier buffer circuit is connected to the output terminal of the second low voltage difference linear voltage regulator chip;

[0024] The first power positive terminal of the conversion circuit is connected to the output terminal of the sixth power chip, the first power negative terminal of the conversion circuit is connected to the output terminal of the seventh power chip, the second power terminal of the conversion circuit is connected to the output terminal of the third power chip, and the third power terminal of the conversion circuit is connected to the output terminal of the voltage reference chip;

[0025] The first input end of the operational amplifier buffer circuit is connected to the second end of the current acquisition module, and the second input end of the operational amplifier buffer circuit is connected to the output end of the receiving relay array;

[0026] The output end of the operational amplifier buffer circuit is connected to the input end of the conversion circuit, and the output end of the conversion circuit is connected to the input end of the main control module.

[0027] Specifically, the op amp buffer circuit includes one set of current processing subcircuits and five sets of voltage processing subcircuits:

[0028] Among them, the current processing subcircuit and all voltage processing subcircuits include:

[0029] Operational amplifier chip, a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, an eighth resistor, a ninth resistor, a tenth resistor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor, a sixth capacitor, a seventh capacitor, and an eighth capacitor;

[0030] The positive electrode of the operational amplifier chip is connected to the second end of the first resistor;

[0031] The first end of the first resistor in all the voltage processing sub-circuits is the first input end of the operational amplifier buffer circuit, and is connected to the output end of the receiving relay array;

[0032] The first end of the first resistor in the current processing subcircuit is the second input end of the operational amplifier buffer circuit, and is connected to the second end of the current acquisition module;

[0033] The negative electrode of the operational amplifier chip is connected to the output terminal of the operational amplifier chip;

[0034] The first power supply terminal of the operational amplifier chip is respectively connected to the output terminal of the first low voltage difference linear voltage regulator chip, the first terminal of the first capacitor, and the first terminal of the second capacitor, and the second terminal of the first capacitor is connected to the second terminal of the second capacitor and is grounded;

[0035] The second power supply terminal of the operational amplifier chip is respectively connected to the output terminal of the second low voltage difference linear voltage regulator chip, the first terminal of the third capacitor, and the first terminal of the fourth capacitor, and the second terminal of the third capacitor is connected to the second terminal of the fourth capacitor and is grounded;

[0036] The output end of the operational amplifier chip is connected to the first section of the second resistor, the first end of the fifth capacitor, and the first end of the third resistor;

[0037] The second end of the second resistor is respectively connected to the second end of the fifth capacitor, the second end of the fourth resistor, the second end of the sixth resistor, and the first end of the eighth resistor and is grounded;

[0038] The second end of the third resistor is connected to the first end of the fourth resistor, the first end of the fifth resistor, and the first end of the seventh resistor respectively, and the second end of the fifth resistor is connected to the first end of the sixth resistor and is grounded;

[0039] The second end of the seventh resistor is connected to the first end of the sixth capacitor and the first end of the ninth resistor respectively, and the second end of the sixth capacitor is connected to the first end of the seventh capacitor and is grounded;

[0040] The second end of the ninth resistor in the current processing subcircuit and all the voltage processing subcircuits is connected to the first end of the eighth capacitor and the input end of the conversion circuit respectively;

[0041] The second end of the eighth resistor is connected to the second end of the seventh capacitor and the first end of the tenth resistor respectively;

[0042] The second end of the tenth resistor in the current processing sub-circuit and all the voltage processing sub-circuits is connected to the second end of the eighth capacitor and the input end of the conversion circuit respectively.

[0043] Further, the conversion circuit is composed of 6 groups of ADC conversion sub-circuits;

[0044] The input ends of five groups of ADC conversion subcircuits are connected to the second ends of the tenth resistors in the five groups of voltage processing subcircuits in a one-to-one correspondence, and the output end of the remaining group of ADC conversion subcircuits is connected to the second end of the tenth resistor in the current processing subcircuit;

[0045] The positive power terminal of the first power supply of each group of ADC conversion sub-circuits is connected to the output terminal of the sixth power supply chip, the negative power terminal of the first power supply of each group of ADC conversion sub-circuits is connected to the output terminal of the seventh power supply chip, the second power supply terminal of each group of ADC conversion sub-circuits is connected to the output terminal of the third power supply chip, and the third power supply terminal of each group of ADC conversion sub-circuits is connected to the output terminal of the voltage reference chip;

[0046] The control end of each group of ADC conversion sub-circuits is connected to the output end of the main control module, and the output end of each group of ADC conversion sub-circuits is connected to the input end of the main control module.

[0047] Specifically, the main control module includes:

[0048] Controller, control unit;

[0049] The first power supply terminal of the controller is connected to the output terminal of the third power supply chip, and the second power supply terminal of the controller is connected to the output terminal of the fourth power supply chip;

[0050] The first power supply terminal of the control unit is connected to the output terminal of the third power supply chip, and the second power supply terminal of the control unit is connected to the output terminal of the first power supply chip;

[0051] The input end of the controller is respectively connected to the output end of each group of ADC conversion sub-circuits;

[0052] The output end of the controller is connected to the input end of the signal generating module and the control end of each group of ADC conversion sub-circuits;

[0053] The data transmission end of the controller is connected to the first data transmission end of the control unit;

[0054] The second data transmission end of the control unit is connected to the data transmission end of the remote control terminal through the communication module.

[0055] Specifically, the communication module includes:

[0056] A Bluetooth communication unit for transmitting commands and a WiFi communication unit for transmitting data;

[0057] The control unit communicates wirelessly with the remote control terminal via the Bluetooth communication unit and the WiFi communication unit.

[0058] Further, the receiving relay array includes an IO expansion interface and a plurality of output interfaces;

[0059] The receiving relay array is connected to the output end of the third power supply chip through the IO expansion interface, and the receiving relay array is connected to the signal transmission end of the control unit through the IO expansion interface;

[0060] The output interface of the receiving relay array is connected to the input end of the voltage processing subcircuit in a one-to-one correspondence.

[0061] Further, the transmitting relay array includes an IO expansion interface;

[0062] The transmitting relay array is connected to the output end of the third power supply chip and the signal transmission end of the control unit respectively through the IO expansion interface.

[0063] Further, it also includes a calibration self-check module;

[0064] The negative terminal of the first power supply of the calibration self-test module is connected to the output terminal of the seventh power supply chip;

[0065] The positive terminal of the first power supply of the calibration self-test module is connected to the output terminal of the sixth power supply chip;

[0066] The second power supply terminal of the calibration self-test module and the output terminal of the third power supply chip;

[0067] The input end of the calibration self-check module is connected to the output end of the controller;

[0068] The output end of the calibration self-check module is respectively connected to the input end of the current processing sub-circuit and the input ends of all the voltage processing sub-circuits.

[0069] The above scheme of the present invention has the following beneficial effects:

[0070] The soil complex impedance three-dimensional monitoring system designed by the present invention comprises a transmitting relay array, a receiving relay array, a multi-channel signal synchronous acquisition processing module, a current acquisition module, a main control module, a signal generating module, a communication module, and a remote control terminal; a control signal is sent to the signal generating module, the transmitting relay array, the receiving relay array, and the multi-channel signal synchronous acquisition processing module through the main control module; the transmitting relay array controls a plurality of electrodes according to the control signal to send the signal source generated by the signal generating module to the soil of the target area to be tested; the receiving relay array controls a plurality of electrodes according to the control signal to collect a plurality of voltage signals from the soil of the target area to be tested and transmits them to the multi-channel signal synchronous acquisition processing module; the current acquisition module transmits the collected current signals to the multi-channel signal synchronous acquisition processing module; the multi-channel signal synchronous acquisition processing module buffers and converts the current signals and the collected voltage signals according to the control signal and then inputs them into the main control module; the main control module uses the communication module to send the processed data to the remote control terminal for visualization; compared with the prior art, the present invention realizes three-dimensional real-time dynamic monitoring by high-precision synchronous acquisition and processing of multi-channel data to improve the convenience and monitoring accuracy of soil monitoring.

[0071] Other beneficial effects of the present invention will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0072] Figure 1 is a system block diagram of an embodiment of the present invention;

[0073] Figure 2 A structural diagram of a power management module in an embodiment of the present invention;

[0074] Figure 3 is a circuit schematic diagram of a current processing subcircuit in an embodiment of the present invention;

[0075] Figure 4 is a circuit schematic diagram of a voltage processing sub-circuit in an embodiment of the present invention;

[0076] Figure 5 is a structural block diagram of a controller in an embodiment of the present invention;

[0077] Figure 6 FIG. 4 is a specific connection diagram of the calibration self-check module in an embodiment of the present invention. DETAILED DESCRIPTION

[0078] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will be described in detail with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0079] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0080] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a locking connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0081] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0082] In view of the existing problems, the present invention provides a soil complex impedance three-dimensional monitoring system.

[0083] like Figure 1 As shown, an embodiment of the present invention provides a soil complex impedance three-dimensional monitoring system, comprising:

[0084] Transmitting relay array, receiving relay array, multi-channel signal synchronous acquisition and processing module, current acquisition module, main control module, signal generation module, communication module, remote control terminal;

[0085] A plurality of transmitting electrodes controlled by a transmitting relay array and a plurality of receiving electrodes controlled by a receiving relay array are arranged in the soil of the target area to be tested, and the transmitting electrodes and the receiving electrodes are arranged alternately and in parallel one by one;

[0086] The first output end of the signal generating module is connected to the input end of the transmitting relay array, the second output end of the signal generating module is connected to the first end of the current collecting module and connected to the instrument ground, and the second end of the current collecting module is connected to the first input end of the multi-channel signal synchronous collecting and processing module and connected to the signal ground;

[0087] The control end of the transmitting relay array, the control end of the receiving relay array, the control end of the signal generating module, and the control end of the multi-channel signal synchronous acquisition and processing module are all connected to the output end of the main control module;

[0088] The output end of the receiving relay array is connected to the second input end of the multi-channel signal synchronous acquisition and processing module, and the output end of the multi-channel signal synchronous acquisition and processing module is connected to the input end of the main control module;

[0089] The data transmission end of the main control module is connected to the data transmission end of the remote control terminal through the communication module.

[0090] The working principle of the embodiment of the present invention is as follows: a control signal is sent to a transmitting relay array, a signal generating module, a receiving relay array, and a multi-channel signal synchronous acquisition and processing module through a main control module; the transmitting relay array controls a plurality of electrodes according to the control signal to send the signal source generated by the signal generating module to the soil of the target area to be tested; the receiving relay array controls a plurality of electrodes according to the control signal to collect a plurality of voltage signals from the soil of the target area to be tested and transmit the signals to the multi-channel signal synchronous acquisition and processing module; the current acquisition module transmits the collected current signals to the multi-channel signal synchronous acquisition and processing module; the multi-channel signal synchronous acquisition and processing module buffers and converts the current signals and the collected voltage signals according to the control signal and then inputs the signals into the main control module; the main control module uses the communication module to send the processed data to the remote control terminal for visualization.

[0091] In an embodiment of the present invention, the multiple electrodes connected to the transmitting relay array and the receiving relay array are all micro-electrodes. Before data collection begins, electrodes are first arranged in the target area to be measured. The electrodes can be flexibly arranged according to different application scenarios and the size of the measurement area. The multiple micro-electrodes are connected to a pin interface as a group through wires, and then connected to the transmitting relay array and the receiving relay array through a high-density multi-core cable. The main control module controls the relays in the transmitting relay array and the receiving relay array, and then performs gating control on each micro-electrode and orderly transmission of signals. Each electrode belt in the multiple micro-electrodes can be arranged as an electrode measurement line individually, or multiple electrodes can be arranged together as an electrode measurement line. The measurement line spacing can be freely selected according to the size of the target area to be measured.

[0092] The arrangement of the electrodes in the embodiment of the present invention is relatively simple, and each micro-electrode can be driven into the soil in sequence. The transmitting electrode and the receiving electrode can be arranged alternately in parallel. For example, the first electrode strip is determined as the transmitting electrode, the second electrode strip is determined as the receiving electrode, and the third electrode strip is determined as the transmitting electrode, and so on. The flexible transformation of the acquisition array can be achieved through automatic running electrode measurement, ensuring the uniform acquisition and monitoring of the soil complex impedance data of different profiles and different depths in the target area to be measured.

[0093] It should be noted that the specific distribution of the power supply line and the electrode belt can be ignored when laying out the electrodes. The distribution can be determined after the electrode belt is laid out. Once determined, the electrode belt is used as a specific power supply or receiving electrode. The high-density multi-core cable determines the specific number of the transmitting electrode or receiving electrode after being connected to the main control module.

[0094] It should be noted that when connecting the second end of the high-density multi-core cable to the micro-electrode, it is necessary to connect them in sequence after determining the electrode number. The wires leading out from the second end of each high-density multi-core cable are numbered, and several wires are connected to a socket in a group. If the first end of the cable is connected to the first input end of the multi-channel signal synchronous acquisition and processing module, the second end of the cable corresponds to the electrodes with connection numbers 1-48; if the first end of the cable is connected to the second input end of the multi-channel signal synchronous acquisition and processing module, the second end of the cable corresponds to the electrodes with connection numbers 49-96, and the number 1 on the wire at the second end of the cable corresponds to electrode 49, and the number 48 corresponds to electrode 96, and so on. This is very important and is an important means to ensure that the electrode numbers in the remote control terminal can correspond one-to-one with the actual physical electrodes. If they cannot correspond one-to-one, then the specific acquisition array combination cannot be controlled, and the collected data will lose its explanatory meaning.

[0095] After completing the electrode layout and connection work, the power output from the power supply end is connected to the soil complex impedance three-dimensional monitoring system.

[0096] It should be noted that the signal ground described in the embodiment of the present invention is a floating ground, which is used as the reference point of the voltage of each measuring point. It is short-circuited with the instrument ground on the receiving relay array, and the B / N pole at the infinite end is led out from one end of the current sampling module; and "infinity" is a relative concept: if the potential generated by the B pole at point M and the potential generated by the A pole at point N are negligible relative to the potential generated by the A pole at point M, it can be considered that the B pole or the N pole is located at "infinity". Therefore, SGND is regarded as the B / N pole at the "infinity end" here, which is also the signal reference point.

[0097] like Figure 2 As shown, it is most preferred that the soil complex impedance three-dimensional monitoring system also includes a power management module composed of a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip, a sixth power chip, a seventh power chip, a voltage reference chip, a first low voltage difference linear voltage regulator chip, and a second low voltage difference linear voltage regulator chip, and the power management module is used to convert the power output by the power supply end into the voltage required by each module;

[0098] The input end of the first power chip, the input end of the second power chip, and the input end of the third power chip are all connected to the power supply end, and are used to receive the power output by the power supply end;

[0099] The output end of the first power chip is respectively connected to the first power end of the main control module, the first power end of the communication module, and the power end of the signal generating module, and is used to provide 5V power to the main control module, the communication module, and the signal generating module;

[0100] The output end of the second power supply chip is respectively connected to the input end of the first low voltage difference linear voltage regulator chip and the input end of the second low voltage difference linear voltage regulator chip, the output end of the first low voltage difference linear voltage regulator chip is connected to the positive terminal of the first power supply of the multi-channel signal synchronous acquisition and processing module, and the output end of the second low voltage difference linear voltage regulator chip is connected to the negative terminal of the first power supply of the multi-channel signal synchronous acquisition and processing module, so as to provide a stable ±14V power supply to the multi-channel signal synchronous acquisition and processing module;

[0101] The output end of the third power chip is respectively connected to the input end of the fourth power chip, the input end of the fifth power chip, the input end of the sixth power chip, the input end of the voltage reference chip, the fourth power end of the multi-channel signal synchronous acquisition processing module, the power end of the receiving relay array, the second power end of the main control module, and the second power end of the communication module, and is used to provide 3.3V power to the multi-channel signal synchronous acquisition processing module, the receiving relay array, the main control module, and the communication module;

[0102] The output end of the fourth power supply chip is connected to the third power supply end of the main control module, and is used to provide 1.2V power supply to the main control module;

[0103] The output end of the fifth power chip is connected to the input end of the seventh power chip, the output end of the seventh power chip is connected to the negative end of the second power supply of the multi-channel signal synchronous acquisition and processing module, and the output end of the sixth power chip is connected to the positive end of the second power supply of the multi-channel signal synchronous acquisition and processing module, so as to provide ±2.5V power supply for the multi-channel signal synchronous acquisition and processing module;

[0104] The output end of the voltage reference chip is connected to the third power supply end of the multi-channel signal synchronous acquisition and processing module, and is used to provide a 2.5V reference voltage for the multi-channel signal synchronous acquisition and processing module.

[0105] It should be noted that the power supply end is a portable external rechargeable mobile power source.

[0106] In an embodiment of the present invention, the model of the first power supply chip is TPS62133, the model of the second power supply chip is URAURA2415YMD-15WR3, the model of the third power supply chip is TPS62162DSGR, the model of the fourth power supply chip is TPS62232, the model of the fifth power supply chip is LM2660, the model of the sixth power supply chip is TPS79225DBVR, the model of the seventh power supply chip is TPS79225DBVR, the model of the voltage reference chip is REF5050IDGKT, the model of the first low voltage difference linear regulator chip is MIC5209YM-TR, and the model of the second low voltage difference linear regulator chip is MIC5271YM5-TR.

[0107] Specifically, the multi-channel signal synchronous acquisition and processing module includes an operational amplifier buffer circuit and a conversion circuit;

[0108] The positive terminal of the operational amplifier buffer circuit is connected to the output terminal of the first low voltage difference linear voltage regulator chip, and the negative terminal of the operational amplifier buffer circuit is connected to the output terminal of the second low voltage difference linear voltage regulator chip, for receiving ±14V power supply;

[0109] The first power positive terminal of the conversion circuit is connected to the output terminal of the sixth power chip, and the first power negative terminal of the conversion circuit is connected to the output terminal of the seventh power chip, for receiving ±2.5V power, the second power terminal of the conversion circuit is connected to the output terminal of the third power chip, for receiving 3.3V power, and the third power terminal of the conversion circuit is connected to the output terminal of the voltage reference chip, for receiving a 2.5V reference voltage;

[0110] The first input end of the operational amplifier buffer circuit is connected to the second end of the current acquisition module for receiving the current signal, and the second input end of the operational amplifier buffer circuit is connected to the output end of the receiving relay array for receiving the multi-channel voltage signal;

[0111] The output end of the operational amplifier buffer circuit is connected to the input end of the conversion circuit, and the output end of the conversion circuit is connected to the input end of the main control module, so as to input the voltage signal and the current signal after buffering and conversion processing into the main control module.

[0112] Specifically, the op amp buffer circuit includes a set of Figure 3 The current processing subcircuit shown and the 5 groups are as follows Figure 4 The voltage processing subcircuit shown:

[0113] Among them, the current processing subcircuit and all voltage processing subcircuits include:

[0114] Operational amplifier chip, first resistor R1, second resistor R2, third resistor R3, fourth resistor R4, fifth resistor R5, sixth resistor R6, seventh resistor R7, eighth resistor R8, ninth resistor R9, tenth resistor R10, first capacitor C1, second capacitor C2, third capacitor C3, fourth capacitor C4, fifth capacitor C5, sixth capacitor C6, seventh capacitor C7, eighth capacitor C8;

[0115] The positive electrode of the operational amplifier chip is connected to the second end of the first resistor R1;

[0116] The first end of the first resistor R1 in all the voltage processing sub-circuits is the first input end of the operational amplifier buffer circuit, and is connected to the output end of the receiving relay array;

[0117] The first end of the first resistor R1 in the current processing subcircuit is the second input end of the operational amplifier buffer circuit, and is connected to the second end of the current acquisition module;

[0118] The negative electrode of the operational amplifier chip is connected to the output terminal of the operational amplifier chip;

[0119] The first power supply terminal of the operational amplifier chip is respectively connected to the output terminal of the first low voltage difference linear voltage regulator chip, the first terminal of the first capacitor C1, and the first terminal of the second capacitor C2, and the second terminal of the first capacitor C1 is connected to the second terminal of the second capacitor C2 and is grounded;

[0120] The second power supply terminal of the operational amplifier chip is respectively connected to the output terminal of the second low voltage difference linear voltage regulator chip, the first terminal of the third capacitor C3, and the first terminal of the fourth capacitor C4, and the second terminal of the third capacitor C3 is connected to the second terminal of the fourth capacitor C4 and is grounded;

[0121] The output end of the operational amplifier chip is connected to the first section of the second resistor R2, the first end of the fifth capacitor C5, and the first end of the third resistor R3;

[0122] The second end of the second resistor R2 is respectively connected to the second end of the fifth capacitor C5, the second end of the fourth resistor R4, the second end of the sixth resistor R6, and the first end of the eighth resistor R8 and is grounded;

[0123] The second end of the third resistor R3 is connected to the first end of the fourth resistor R4, the first end of the fifth resistor R5, and the first end of the seventh resistor R7 respectively, and the second end of the fifth resistor R5 is connected to the first end of the sixth resistor R6 and is grounded;

[0124] The second end of the seventh resistor R7 is connected to the first end of the sixth capacitor C6 and the first end of the ninth resistor R9 respectively, and the second end of the sixth capacitor C6 is connected to the first end of the seventh capacitor C7 and is grounded;

[0125] The second end of the ninth resistor R9 in the current processing subcircuit and all the voltage processing subcircuits is connected to the first end of the eighth capacitor C8 and the input end of the conversion circuit respectively;

[0126] The second end of the eighth resistor R8 is connected to the second end of the seventh capacitor C7 and the first end of the tenth resistor R10 respectively;

[0127] The second end of the tenth resistor R10 in the current processing sub-circuit and all the voltage processing sub-circuits is connected to the second end of the eighth capacitor C8 and the input end of the conversion circuit respectively.

[0128] Specifically, the conversion circuit is composed of 6 groups of ADC conversion sub-circuits;

[0129] The input ends of five groups of ADC conversion subcircuits are connected to the second ends of the tenth resistors R10 in the five groups of voltage processing subcircuits in a one-to-one correspondence, and the output end of the remaining group of ADC conversion subcircuits is connected to the second end of the tenth resistor R10 in the current processing subcircuit;

[0130] The positive power terminal of the first power supply of each group of ADC conversion sub-circuits is connected to the output terminal of the sixth power supply chip, the negative power terminal of the first power supply of each group of ADC conversion sub-circuits is connected to the output terminal of the seventh power supply chip, the second power supply terminal of each group of ADC conversion sub-circuits is connected to the output terminal of the third power supply chip, and the third power supply terminal of each group of ADC conversion sub-circuits is connected to the output terminal of the voltage reference chip;

[0131] The control end of each group of ADC conversion sub-circuits is connected to the output end of the main control module, and the output end of each group of ADC conversion sub-circuits is connected to the input end of the main control module.

[0132] In the embodiment of the present invention, the conversion chip used in each group of ADC conversion sub-circuits is an ADS1282 high-precision analog-to-digital conversion chip. The synchronization function of the chip is controlled by a SYNC pin, and there are two synchronization modes: word pulse synchronization and continuous synchronization. The continuous synchronization mode has higher precision, but the corresponding power consumption is also higher, which limits the outdoor working time of the system. Therefore, the embodiment of the present invention uses a single pulse synchronization mode, and the main control module is connected to the synchronization configuration input terminal of ADS1282. The main control module sends a second pulse signal synchronization command to the SYNC pin of ADS1282 to achieve acquisition synchronization.

[0133] Since the multi-channel signal synchronous acquisition and processing modules in the embodiment of the present invention are all single-ended inputs, while ADS1282 is differential input, differential input has better performance than single-ended input when facing noise interference, but the circuit structure is complex. The pseudo-differential circuit is a signal circuit between the two. By connecting the signal ground to the negative analog input terminal of the ADC to achieve a similar differential connection, the influence of the ground potential difference between the signal source and the device can be minimized without significantly increasing the complexity of the circuit. Under comprehensive consideration, an op amp buffer circuit is added to the input front stage of the ADC to convert the single-ended signal input into a pseudo-differential signal input. While enhancing the anti-interference ability, the input impedance of the instrument can be significantly improved, and the sensitivity of the instrument to weak electrical signals can be improved.

[0134] Specifically, the main control module includes:

[0135] Controller, control unit;

[0136] The first power supply terminal of the controller is connected to the output terminal of the third power supply chip, and the second power supply terminal of the controller is connected to the output terminal of the fourth power supply chip;

[0137] The first power supply terminal of the control unit is connected to the output terminal of the third power supply chip, and the second power supply terminal of the control unit is connected to the output terminal of the first power supply chip;

[0138] The input end of the controller is respectively connected to the output end of each group of ADC conversion sub-circuits;

[0139] The output end of the controller is connected to the input end of the signal generating module and the control end of each group of ADC conversion sub-circuits;

[0140] The data transmission end of the controller is connected to the first data transmission end of the control unit;

[0141] The second data transmission end of the control unit is connected to the data transmission end of the remote control terminal through the communication module.

[0142] In the embodiment of the present invention, the controller is an FPGA chip, the core voltage input terminal of the chip is connected to the output terminal of the fourth power chip TPS62232, and the BANK voltage input terminal is connected to the output terminal of the third power chip TPS62162DSGR. Figure 5As shown in the figure, inside the FPGA chip, the command parsing module is connected to the command receiving module and the ADS1282 configuration module, the DDS transmission control module, and the power management module, and is responsible for receiving, parsing, and distributing tasks; the ADS1282 data receiving module is connected to the data sending module after passing through the FIFO (First In First Out) cache module, and is responsible for data transfer and uploading; the phase-locked loop (PLL) clock management module is connected to the external crystal oscillator, and is responsible for providing a high-precision clock signal for the FPGA. The command receiving module in the FPGA chip is connected to one of the output ends of the control unit, and the data sending module is connected to the input end of the control unit. The data sent by the ADS1282 will be immediately packaged and sent to the control unit through the SPI bus after passing through the FPGA chip.

[0143] In an embodiment of the present invention, the control unit is an embedded control system, and the chip used is an STM32 series single-chip processing chip; the input end of the embedded control system is connected to the first data output end of the communication module, the command information sent is obtained, and the command is parsed and processed and then sent to the FPGA chip; the output end is connected to the first data input end of the communication module, the status information of the instrument is uploaded, and the two communicate through the UART bus; the output end is connected to the second data input end of the communication module, and the collected data is uploaded in real time, and the two communicate through the SPI bus. The communication module communicates wirelessly with the remote control terminal to transmit commands and data. The power supply end of the embedded main control chip is connected to the first power supply input end of the communication module through a pin row and the output end of the third power supply chip TPS62162DSGR, and the second power supply input end of the communication module is connected to the output end of the first power supply chip TPS62133 through a pin row. The communication module and each bus interface are driven by the bottom driver module in the embedded control system.

[0144] Specifically, the communication module includes:

[0145] A Bluetooth communication unit for transmitting commands and a WiFi communication unit for transmitting data;

[0146] The control unit communicates wirelessly with the remote control terminal via the Bluetooth communication unit and the WiFi communication unit.

[0147] In an embodiment of the present invention, the second output terminal of the command transceiver module in the embedded control system is connected to the data input terminal of the Bluetooth communication unit to upload the status information of the system, and the two communicate through the UART bus; the output terminal of the data transceiver module in the embedded control system is connected to the data input terminal of the WiFi communication unit to upload the collected data in real time, and the two communicate through the SPI bus. The Bluetooth communication unit and the WiFi communication unit communicate wirelessly with the remote control terminal to transmit commands and data. The power input terminal of the embedded main control chip and the WiFi communication unit are connected to the output terminal of the third power chip TPS62162DSGR through a pin header, and the power input terminal of the Bluetooth communication unit is connected to the output terminal of the first power chip TPS62133 through a pin header. The Bluetooth communication unit, the WiFi communication unit and each bus interface are driven by the bottom driver module of the embedded control system.

[0148] Further, the receiving relay array includes an IO expansion interface and a plurality of output interfaces;

[0149] The receiving relay array is connected to the output end of the third power chip and the signal transmission end of the control unit respectively through the IO expansion interface;

[0150] The output interface of the receiving relay array is connected to the input end of the voltage processing subcircuit in a one-to-one correspondence.

[0151] Further, the transmitting relay array includes an IO expansion interface;

[0152] The transmitting relay array is connected to the output end of the third power supply chip and the signal transmission end of the control unit respectively through the IO expansion interface.

[0153] It should be noted that the embedded control system communicates with the transmitting relay array and the receiving relay array through the I2C bus. Since the number of relays to be controlled is large and the I2C peripheral resources of the embedded control system are limited, the IO expansion chip MCP23017-E / SO is used as the IO expansion interface in the embodiment of the present invention. This chip supports 16-bit IO port expansion, which can easily control the relays in the relay array under the premise of limited IO ports of the embedded control system.

[0154] It should be noted that the signal generating module is a sine wave signal generator, which has a large amplitude span range and can realize gear adjustment and arbitrary frequency configuration, and supports high-resolution, multi-frequency, multi-amplitude constant current and constant voltage signal transmission.

[0155] It should be noted that the current sampling module can sample the current signal by using a sampling resistor.

[0156] Most preferably, it also includes a calibration self-check module;

[0157] The negative terminal of the first power supply of the calibration self-test module is connected to the output terminal of the seventh power supply chip;

[0158] The positive terminal of the first power supply of the calibration self-test module is connected to the output terminal of the sixth power supply chip;

[0159] The second power supply terminal of the calibration self-test module and the output terminal of the third power supply chip;

[0160] The input end of the calibration self-check module is connected to the output end of the controller;

[0161] The output end of the calibration self-check module is respectively connected to the input end of the current processing sub-circuit and the input ends of all the voltage processing sub-circuits.

[0162] It should be noted that the calibration in the calibration self-test module is to eliminate the errors existing in the ADC itself, thereby improving the quality of the collected data; the self-test is to send a known waveform and then observe the response of the entire system to determine whether the system can work normally.

[0163] Specifically, if Figure 6 As shown, the calibration self-test module includes a DAC chip and an electronic switch. The DAC chip uses DAC1282. The configuration input terminal of DAC1282 is connected to the DAC configuration output terminal of the FPGA chip. The digital working voltage is 3.3V, which is connected from the third power chip. The positive and negative analog working voltages are respectively connected to the output terminals of the sixth power chip TPS79225DBVR and the seventh power chip TPS72325DBVR.

[0164] Since calibration is extremely sensitive to external noise signals, in order to reduce the impact of noise, the full-bias or short-circuit signal generated by the DAC chip is directly input to another channel of the ADC conversion subcircuit. Self-testing does not require high noise, and self-testing needs to include all modules of the system as much as possible. Therefore, the calibration signal is connected to the input end of the multi-channel signal synchronous acquisition and processing module through an electronic switch to include all functional modules. The mode switching between the calibration and self-test of the DAC chip is completed by an electronic switch. The first end of the electronic switch is connected to the positive signal output end of the DAC chip and the AINP2 end of the ADC conversion subcircuit, the second end of the electronic switch is connected to the negative signal output end of the DAC chip and the AINN2 end of the ADC conversion subcircuit, the third end of the electronic switch is connected to the positive signal input end of the multi-channel signal synchronous acquisition and processing module, and the fourth end of the electronic switch is connected to the negative signal input end of the multi-channel signal synchronous acquisition and processing module.

[0165] In an embodiment of the present invention, the remote control terminal is a control APP mounted on the mobile phone. When the monitoring device is powered on and initialized, connect to WiFi before opening the control APP, then open the control APP, and a prompt "socket connection successful" pops up. After entering the main interface of the software, click the connection button in the upper right corner to connect to Bluetooth. After the connection is successful, the log bar pops up a prompt that the file system is successfully mounted, indicating that the control APP is loaded successfully and establishes communication with the monitoring device. Click the parameter setting interface in the control APP to start setting the acquisition parameters, and fill in the configuration information according to the test needs. The acquisition configuration interface of the control APP is divided into three parts: project settings, measurement control, and calibration methods. The project settings are customized by the user. It is recommended to modify the project name or project number each time the measurement is performed so that different storage files can be found in the file later. The measurement control shows the main settings of this measurement. The monitoring device provided in the embodiment of the present invention supports the use of constant current and constant voltage modes for acquisition control, and different measurement methods can be selected as needed. In addition, the remote control terminal can also set the maximum and minimum measurement times, perform relative error calculations, support repeated measurements, and perform multiple measurements when the error exceeds the threshold value to ensure the accuracy of the data. After completing the parameter settings, click the Save button and the software will pop up “Configuration information has been sent”, indicating that the host configuration is successful.

[0166] After the parameter configuration is completed, switch to the acquisition control interface, click the start acquisition button, and the monitoring device will start working according to the set parameters. The data acquisition method is serial multi-channel synchronous acquisition. Each time a transmitting electrode is switched, a group of high-density receiving electrodes are collected in sequence, and the acquisition efficiency is high. The relay control module in the embedded control system will control the automatic pole acquisition, and the collected data will also be sent to the control App in real time through the communication module and displayed in a graph. After the collected data is sent to the control App, it will first be stored and backed up, and then the phase and apparent resistance data will be calculated by Fourier transform and adding device coefficients, and the result map will be displayed in real time.

[0167] It should be noted that the result map mainly includes raw data graphs showing multi-channel voltage and a set of current, using dual-axis display, with the left Y-axis for voltage, the right Y-axis for current, and the X-axis for points. The six sets of data are distinguished by different colors. The six sets of original voltage and current are divided after Fourier transformation to obtain phase data, and multiplied by the corresponding device coefficient to obtain apparent resistance data. The left Y-axis is the apparent resistance, the right Y-axis is the phase, and the X-axis is the corresponding acquisition electrode. To facilitate real-time monitoring of data, the control APP updates the chart once every time a set of multi-channel voltage data and a set of current data are measured, and the apparent resistance and phase data are updated accordingly to achieve real-time monitoring of the electrical properties of the soil in the measurement area. The stored monitoring data can also be exported from the mobile phone for further forward and inverse processing.

[0168] The soil complex impedance three-dimensional monitoring system designed in the embodiment of the present invention comprises a transmitting relay array, a receiving relay array, a multi-channel signal synchronous acquisition processing module, a current acquisition module, a main control module, a signal generating module, a communication module, and a remote control terminal; a control signal is sent to the transmitting relay array, the signal generating module, the receiving relay array, and the multi-channel signal synchronous acquisition processing module through the main control module; the transmitting relay array controls a plurality of electrodes according to the control signal to send the signal source generated by the signal generating module to the soil of the target area to be tested; the receiving relay array controls a plurality of electrodes according to the control signal to collect a plurality of voltage signals from the soil of the target area to be tested and transmits them to the multi-channel signal synchronous acquisition processing module; the current acquisition module transmits the collected current signals to the multi-channel signal synchronous acquisition processing module; the multi-channel signal synchronous acquisition processing module buffers and converts the current signals and the collected voltage signals according to the control signal and then inputs them to the main control module; the main control module uses the communication module to send the processed data to the remote control terminal for visualization; compared with the prior art, the present invention realizes three-dimensional real-time dynamic monitoring by high-precision synchronous acquisition and processing of multi-channel data to improve the convenience and monitoring accuracy of soil monitoring.

[0169] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A soil complex impedance three-dimensional monitoring system, characterized in that: include: Transmitting relay array, receiving relay array, multi-channel signal synchronous acquisition and processing module, current acquisition module, main control module, signal generation module, communication module, remote control terminal; The multiple transmitting electrodes controlled by the transmitting relay array and the multiple receiving electrodes controlled by the receiving relay array are arranged in the soil of the target area to be tested, and the transmitting electrodes and the receiving electrodes are arranged alternately and in parallel one by one; The first output end of the signal generating module is connected to the input end of the transmitting relay array, the second output end of the signal generating module is connected to the first end of the current acquisition module and connected to the instrument ground, and the second end of the current acquisition module is connected to the first input end of the multi-channel signal synchronous acquisition processing module and connected to the signal ground; The control end of the transmitting relay array, the control end of the receiving relay array, the control end of the signal generating module, and the control end of the multi-channel signal synchronous acquisition and processing module are all connected to the output end of the main control module; The output end of the receiving relay array is connected to the second input end of the multi-channel signal synchronous acquisition and processing module, and the output end of the multi-channel signal synchronous acquisition and processing module is connected to the input end of the main control module; The data transmission end of the main control module is connected to the data transmission end of the remote control terminal through the communication module.

2. The soil complex impedance three-dimensional monitoring system according to claim 1 is characterized in that: It also includes a power management module consisting of a first power chip, a second power chip, a third power chip, a fourth power chip, a fifth power chip, a sixth power chip, a seventh power chip, a voltage reference chip, a first low voltage difference linear voltage regulator chip, and a second low voltage difference linear voltage regulator chip; The input end of the first power chip, the input end of the second power chip, and the input end of the third power chip are all connected to the power supply end; The output end of the first power chip is respectively connected to the first power end of the main control module, the first power end of the communication module, and the power end of the signal generating module; The output end of the second power supply chip is respectively connected to the input end of the first low voltage difference linear voltage regulator chip and the input end of the second low voltage difference linear voltage regulator chip, the output end of the first low voltage difference linear voltage regulator chip is connected to the positive terminal of the first power supply of the multi-channel signal synchronous acquisition and processing module, and the output end of the second low voltage difference linear voltage regulator chip is connected to the negative terminal of the first power supply of the multi-channel signal synchronous acquisition and processing module; The output end of the third power chip is respectively connected to the input end of the fourth power chip, the input end of the fifth power chip, the input end of the sixth power chip, the input end of the voltage reference chip, the fourth power end of the multi-channel signal synchronous acquisition and processing module, the power end of the receiving relay array, the second power end of the main control module, and the second power end of the communication module; The output end of the fourth power chip is connected to the third power end of the main control module; The output end of the fifth power chip is connected to the input end of the seventh power chip, and the output end of the seventh power chip is connected to the negative terminal of the second power supply of the multi-channel signal synchronous acquisition and processing module; The output end of the sixth power chip is connected to the positive end of the second power supply of the multi-channel signal synchronous acquisition and processing module; The output end of the voltage reference chip is connected to the third power supply end of the multi-channel signal synchronous acquisition and processing module.

3. The soil complex impedance three-dimensional monitoring system according to claim 2 is characterized in that: The multi-channel signal synchronous acquisition processing module includes an operational amplifier buffer circuit and a conversion circuit; The positive terminal of the operational amplifier buffer circuit is connected to the output terminal of the first low voltage difference linear voltage regulator chip, and the negative terminal of the operational amplifier buffer circuit is connected to the output terminal of the second low voltage difference linear voltage regulator chip; The first positive power terminal of the conversion circuit is connected to the output terminal of the sixth power chip, the first negative power terminal of the conversion circuit is connected to the output terminal of the seventh power chip, the second power terminal of the conversion circuit is connected to the output terminal of the third power chip, and the third power terminal of the conversion circuit is connected to the output terminal of the voltage reference chip; The first input end of the operational amplifier buffer circuit is connected to the second end of the current acquisition module, and the second input end of the operational amplifier buffer circuit is connected to the output end of the receiving relay array; The output end of the operational amplifier buffer circuit is connected to the input end of the conversion circuit, and the output end of the conversion circuit is connected to the input end of the main control module.

4. The soil complex impedance three-dimensional monitoring system according to claim 3 is characterized in that: The operational amplifier buffer circuit includes a group of current processing sub-circuits and 5 groups of voltage processing sub-circuits: Wherein, the current processing subcircuit and all voltage processing subcircuits include: Operational amplifier chip, a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, an eighth resistor, a ninth resistor, a tenth resistor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor, a sixth capacitor, a seventh capacitor, and an eighth capacitor; The positive electrode of the operational amplifier chip is connected to the second end of the first resistor; The first end of the first resistor in all the voltage processing sub-circuits is the first input end of the operational amplifier buffer circuit, and is connected to the output end of the receiving relay array; The first end of the first resistor in the current processing subcircuit is the second input end of the operational amplifier buffer circuit, and is connected to the second end of the current acquisition module; The cathode of the operational amplifier chip is connected to the output terminal of the operational amplifier chip; The first power supply end of the operational amplifier chip is respectively connected to the output end of the first low voltage difference linear voltage regulator chip, the first end of the first capacitor, and the first end of the second capacitor, and the second end of the first capacitor is connected to the second end of the second capacitor and is grounded; The second power supply terminal of the operational amplifier chip is respectively connected to the output terminal of the second low voltage difference linear voltage regulator chip, the first terminal of the third capacitor, and the first terminal of the fourth capacitor, and the second terminal of the third capacitor is connected to the second terminal of the fourth capacitor and is grounded; The output end of the operational amplifier chip is connected to the first section of the second resistor, the first end of the fifth capacitor, and the first end of the third resistor; The second end of the second resistor is respectively connected to the second end of the fifth capacitor, the second end of the fourth resistor, the second end of the sixth resistor, and the first end of the eighth resistor and is grounded; The second end of the third resistor is connected to the first end of the fourth resistor, the first end of the fifth resistor, and the first end of the seventh resistor respectively, and the second end of the fifth resistor is connected to the first end of the sixth resistor and is grounded; The second end of the seventh resistor is connected to the first end of the sixth capacitor and the first end of the ninth resistor respectively, and the second end of the sixth capacitor is connected to the first end of the seventh capacitor and is grounded; The second end of the ninth resistor in the current processing subcircuit and all the voltage processing subcircuits is connected to the first end of the eighth capacitor and the input end of the conversion circuit respectively; The second end of the eighth resistor is connected to the second end of the seventh capacitor and the first end of the tenth resistor respectively; The second end of the tenth resistor in the current processing sub-circuit and all the voltage processing sub-circuits is connected to the second end of the eighth capacitor and the input end of the conversion circuit respectively.

5. The soil complex impedance three-dimensional monitoring system according to claim 4 is characterized in that: The conversion circuit is composed of 6 groups of ADC conversion sub-circuits; The input ends of five groups of ADC conversion subcircuits are connected to the second ends of the tenth resistors in the five groups of voltage processing subcircuits in a one-to-one correspondence, and the output end of the remaining group of ADC conversion subcircuits is connected to the second end of the tenth resistor in the current processing subcircuit; The positive power terminal of the first power supply of each group of ADC conversion sub-circuits is connected to the output end of the sixth power supply chip, the negative power terminal of the first power supply of each group of ADC conversion sub-circuits is connected to the output end of the seventh power supply chip, the second power supply terminal of each group of ADC conversion sub-circuits is connected to the output end of the third power supply chip, and the third power supply terminal of each group of ADC conversion sub-circuits is connected to the output end of the voltage reference chip; The control end of each group of ADC conversion sub-circuits is connected to the output end of the main control module, and the output end of each group of ADC conversion sub-circuits is connected to the input end of the main control module.

6. The soil complex impedance three-dimensional monitoring system according to claim 5, characterized in that: The main control module comprises: Controller, control unit; The first power supply terminal of the controller is connected to the output terminal of the third power supply chip, and the second power supply terminal of the controller is connected to the output terminal of the fourth power supply chip; The first power supply terminal of the control unit is connected to the output terminal of the third power supply chip, and the second power supply terminal of the control unit is connected to the output terminal of the first power supply chip; The input end of the controller is respectively connected to the output end of each group of ADC conversion sub-circuits; The output end of the controller is connected to the input end of the signal generating module and the control end of each group of ADC conversion sub-circuits; The data transmission end of the controller is connected to the first data transmission end of the control unit; The second data transmission end of the control unit is connected to the data transmission end of the remote control terminal through the communication module.

7. The soil complex impedance three-dimensional monitoring system according to claim 6, characterized in that: The communication module comprises: A Bluetooth communication unit for transmitting commands and a WiFi communication unit for transmitting data; The control unit communicates wirelessly with the remote control terminal via the Bluetooth communication unit and the WiFi communication unit.

8. The soil complex impedance three-dimensional monitoring system according to claim 7, characterized in that: The receiving relay array includes an IO expansion interface and a plurality of output interfaces; The receiving relay array is connected to the output end of the third power chip and the signal transmission end of the control unit respectively through the IO expansion interface; The output interface of the receiving relay array is connected to the input end of the voltage processing sub-circuit in a one-to-one correspondence.

9. The soil complex impedance three-dimensional monitoring system according to claim 8, characterized in that: The transmitting relay array includes an IO expansion interface; The transmitting relay array is connected to the output end of the third power supply chip and the signal transmission end of the control unit respectively through the IO expansion interface.

10. The soil complex impedance three-dimensional monitoring system according to claim 9, characterized in that: Also includes a calibration self-check module; The negative terminal of the first power supply of the calibration self-test module is connected to the output terminal of the seventh power supply chip; The positive terminal of the first power supply of the calibration self-test module is connected to the output terminal of the sixth power supply chip; The second power supply terminal of the calibration self-test module and the output terminal of the third power supply chip; The input end of the calibration self-check module is connected to the output end of the controller; The output end of the calibration self-check module is connected to the input end of the current processing sub-circuit and the input ends of all the voltage processing sub-circuits respectively.

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