Fault detection method, device and equipment

Abstract

The invention discloses a fault detection method, device and equipment. The method comprises the steps of reading software corresponding to the head-up display system under the condition that an image projected by the head-up display system is abnormal; under the condition that the reading result of the software indicates that the FPC link in the head-up display system is abnormal, at least one assembly in the FPC link is determined, and the at least one assembly comprises a flexible circuit board, a printed circuit board and a connecting socket of the flexible circuit board and the printed circuit board; and determining a fault component with a fault in the at least one component and a fault point in the fault component. According to the embodiment of the invention, the accuracy of fault detection can be improved.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a fault detection method, device and equipment. Background Art

[0002] Currently, many vehicles are equipped with a head-up display (HUD), which projects images into the driver's field of vision. If the image projected by the HUD is abnormal, the HUD needs to be analyzed for faults.

[0003] However, the fault analysis in the related art mainly focuses on performing a separate fault analysis on the printed circuit board in the HUD. This fault analysis method often fails to perform a comprehensive analysis on the HUD to determine the root cause of the problem, resulting in low accuracy of fault detection. Summary of the invention

[0004] The embodiments of the present application provide a fault detection method, apparatus and device, which can solve the problem of low accuracy of existing fault detection.

[0005] In a first aspect, an embodiment of the present application provides a fault detection method, the method comprising:

[0006] In the case where the image projected by the head-up display system is abnormal, reading software corresponding to the head-up display system;

[0007] When the reading result of the software indicates that an abnormality exists in the FPC link in the head-up display system, determining at least one component in the FPC link, the at least one component comprising a flexible circuit board, a printed circuit board, and a connection socket between the flexible circuit board and the printed circuit board;

[0008] A faulty component having a fault is determined in the at least one component, and a fault point in the faulty component.

[0009] In some embodiments, the determining of a faulty component having a fault in the at least one component and a fault point in the faulty component comprises:

[0010] determining whether there is an abnormal point on the housing of the printed circuit board;

[0011] When there is an abnormal point on the housing and there is an abnormality at a position corresponding to the abnormal point on the printed circuit board, the printed circuit board is determined as the faulty component, and the position corresponding to the abnormal point on the printed circuit board is determined as the faulty point.

[0012] In some embodiments, the determining of a faulty component having a fault in the at least one component and a fault point in the faulty component comprises:

[0013] Obtaining a point map corresponding to the printed circuit board;

[0014] Determine whether there is welding abnormality in the device on the printed circuit board according to the point map;

[0015] In the case where there is a device with abnormal welding on the printed circuit board, the printed circuit board is determined as the faulty component, and the device with abnormal welding is determined as the fault point.

[0016] In some embodiments, the determining of a faulty component having a fault in the at least one component and a fault point in the faulty component comprises:

[0017] Determining a plurality of first depth values ​​of a plurality of pins of the flexible circuit board inserted into a first connection socket;

[0018] In the case where the difference between any two first depth values ​​among the plurality of first depth values ​​is less than a first threshold, determining whether there is a lead that is damaged;

[0019] In the case that there is a pin that is damaged, the connection socket is determined as the faulty component, and the damaged pin is determined as the fault point.

[0020] In some embodiments, after determining a plurality of first depth values ​​of the plurality of pins of the flexible circuit board inserted into the first connection socket, the method further comprises:

[0021] When the difference between two first depth values ​​among the plurality of first depth values ​​is greater than the first threshold, the connection socket is determined as the faulty component, and the pin is determined as the faulty point.

[0022] In some embodiments, the determining a faulty component having a fault in the at least one component comprises:

[0023] When the pins of the flexible circuit board are inserted into the connection socket, pressing the flexible circuit board or the connection socket;

[0024] When the flexible circuit board or the connection socket is in a pressed state, if the image projected by the head-up display system is normal, the connection socket is determined to be the faulty component.

[0025] In some embodiments, the determining a faulty component having a fault in the at least one component comprises:

[0026] Get a standard flexible circuit board;

[0027] Replacing the flexible circuit board in the FPC link with the standard flexible circuit board;

[0028] If the image projected by the head-up display system after replacement is normal, the flexible circuit board is determined to be the faulty component.

[0029] In some embodiments, the determining a faulty component having a fault in the at least one component comprises:

[0030] Obtain a standard printed circuit board;

[0031] Replacing the printed circuit board in the FPC link with the standard printed circuit board;

[0032] If the image projected by the head-up display system after replacement is normal, the printed circuit board is determined to be the faulty component.

[0033] In a second aspect, an embodiment of the present application provides a fault detection device, the device comprising:

[0034] A reading module, used for reading the software corresponding to the head-up display system when the image projected by the head-up display system is abnormal;

[0035] A first determination module, configured to determine at least one component in the FPC link when the reading result of the software indicates that an abnormality exists in the FPC link in the head-up display system, wherein the at least one component includes a flexible circuit board, a printed circuit board, and a connection socket between the flexible circuit board and the printed circuit board;

[0036] The second determining module is used to determine a faulty component and a fault point in the faulty component in the at least one component.

[0037] In a third aspect, an embodiment of the present application provides a fault detection device, the device comprising: a processor and a memory storing computer program instructions;

[0038] The above fault detection method is implemented when the processor executes computer program instructions.

[0039] In a fourth aspect, an embodiment of the present application provides a computer storage medium, on which computer program instructions are stored, and when the computer program instructions are executed by a processor, the above fault detection method is implemented.

[0040] In a fifth aspect, an embodiment of the present application provides a computer program product, which includes computer program instructions, and the computer program instructions implement the above fault detection method when executed by a processor.

[0041] In this application, when the image of the head-up display system is abnormal, the system software is first read to determine whether the problem is related to the FPC link. If the software detects that the FPC link is abnormal, fault detection is performed on each component in the FPC link, and the faulty component and its fault point are finally determined. In this way, all relevant components in the FPC link can be fully checked to ensure that all hardware factors that may cause abnormal images of the head-up display system are covered, including flexible circuit boards, printed circuit boards, and connecting plug-ins. By accurately locating the faulty components and fault points, omissions or misjudgments can be avoided, thereby effectively improving the accuracy of fault analysis. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0043] Figure 1 is a flowchart of a fault detection method provided by an embodiment of the present application;

[0044] Figure 2 is a structural schematic diagram of a fault detection device provided by an embodiment of the present application;

[0045] Figure 3 It is a schematic diagram of the hardware structure of a fault detection device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0046] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0047] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0048] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The embodiments will be described in detail below in conjunction with the accompanying drawings.

[0049] Specifically, in order to solve the problems in the prior art, the embodiments of the present application provide a fault detection method, device and equipment. The fault detection method provided by the embodiments of the present application is first introduced below.

[0050] Figure 1 A schematic diagram of a fault detection method provided by an embodiment of the present application is shown. The method comprises the following steps:

[0051] S110, when the image projected by the head-up display system is abnormal, reading software corresponding to the head-up display system.

[0052] In this embodiment, when the image projected by the head-up display system is abnormal, the impedance test file of the multimeter can be used to check whether there is a short circuit between the power pin and the ground pin in the head-up display system.

[0053] If the impedance obtained by the impedance test file is 0 or close to 0, it can be considered that there is a short circuit between the power supply and the ground, and it is necessary to stop powering on the head-up display system to avoid circuit damage. If the impedance obtained by the test is normal, it can be considered that there is no short circuit between the power supply and the ground, and you can continue to power on and read the software corresponding to the head-up display system.

[0054] The status of the head-up display system can be detected by reading the software to confirm whether the system can operate normally. In this way, it can be determined whether there is a fault related to the FPC link. If the system operates normally, the faults in the power supply and ground parts can be ruled out, and it can be determined that there is an abnormality in the FPC link part. Among them, the FPC link refers to the connection between the flexible printed circuit (FPC) and the printed circuit board (PCB). If the FPC link fails, it may cause signal transmission interruption or instability.

[0055] S120, when the reading result of the software indicates that there is an abnormality in the FPC link in the head-up display system, determine at least one component in the FPC link, and the at least one component includes a flexible circuit board, a printed circuit board, and a connection socket between the flexible circuit board and the printed circuit board.

[0056] In this embodiment, during the process of reading the status through the software, if the software detects that the FPC link is abnormal, it means that a part of the FPC link has a problem, and it is necessary to further check the hardware in the FPC link to determine the faulty component and the fault point of the faulty component. The FPC link is usually composed of a flexible circuit board and multiple printed circuit boards connected.

[0057] Specifically, a printed circuit board is a hard circuit board used to support and connect electronic components; a flexible circuit board is used to connect multiple printed circuit boards, and a connecting socket is a hardware component used to connect a printed circuit board and a flexible circuit board; through the connecting socket, the pins of the flexible circuit board can be connected to the contact points on the printed circuit board, thereby completing the transmission of electrical signals.

[0058] Therefore, when the software reading result indicates that there is an abnormality in the FPC link in the head-up display system, fault detection can be performed on the flexible circuit board, the printed circuit board and the connecting socket.

[0059] S130: Determine a faulty component and a fault point in the faulty component in the at least one component.

[0060] In this embodiment, the faulty component refers to the specific hardware part that caused the problem. In an FPC link, the faulty component may be a flexible circuit board, a printed circuit board, or a connector. The fault point refers to the electrical or physical location that specifically caused the fault in the determined faulty component. The fault point may be a poorly connected pin, a damaged chip, or a crack, etc.

[0061] Therefore, when a component in the FPC link is determined to have a problem through fault detection, the component can be identified as a faulty component, and then the location where the problem occurs in the faulty component can be further located as the specific fault point. In this way, through step-by-step analysis, the source of the fault can be found and the specific location of the problem can be determined to ensure accurate repair.

[0062] In addition, during the troubleshooting process, after determining the faulty component and the point of failure, a series of steps can be used to finally determine the root cause of the failure and conduct in-depth analysis. First, the single point of failure can be determined through troubleshooting, that is, the only cause of the failure can be found. If the source of the failure is a chip, it is necessary to further determine whether the failure is caused by a usage scenario problem (such as excessive current, temperature, etc.) or a production process problem (such as manufacturing defects), which is usually performed through chip-level failure analysis. If the source of the failure is a printed circuit board, it is necessary to lock the specific location and analyze the causes such as circuit paths, welding problems, or component failures. Through this comprehensive fault location and analysis, it can ensure that the source of the fault is accurately determined and effective repair measures are taken.

[0063] In an embodiment of the present application, when an abnormality occurs in the image of the head-up display system, the system software is first read to determine whether the problem is related to the FPC link. If the software detects that the FPC link is abnormal, fault detection is performed on each component in the FPC link, and finally the faulty component and its fault point are determined through the detection results. In this way, all relevant components in the FPC link can be comprehensively checked to ensure that all hardware factors that may cause abnormal images of the head-up display system are covered, including flexible circuit boards, printed circuit boards, and connecting plug-ins. By accurately locating the faulty components and fault points, omissions or misjudgments can be avoided, thereby effectively improving the accuracy of fault analysis.

[0064] As an optional embodiment, the determining a faulty component having a fault in the at least one component and a fault point in the faulty component includes:

[0065] determining whether there is an abnormal point on the housing of the printed circuit board;

[0066] When there is an abnormal point on the housing and there is an abnormality at a position corresponding to the abnormal point on the printed circuit board, the printed circuit board is determined as the faulty component, and the position corresponding to the abnormal point on the printed circuit board is determined as the faulty point.

[0067] In this embodiment, during the fault detection of the printed circuit board, the outer shell of the printed circuit board may be checked first to find out whether there are any physical abnormalities on the outer shell, such as cracks, damage, wear, etc. The outer shell abnormality may indicate that the internal components are damaged or there is a risk of failure due to external factors.

[0068] If an abnormality is detected on the outer shell, and further testing finds that the internal location on the printed circuit board corresponding to the abnormal point also has a problem. For example, the problem at the internal location may include a damaged solder joint, a broken circuit, etc. Then it can be confirmed that the printed circuit board is the faulty component, and the internal location with the problem is determined to be the fault point. According to this process, the printed circuit board is determined to be the faulty component, and the specific location corresponding to the abnormal point on its outer shell is determined to be the fault point, indicating the root location of the problem.

[0069] For example, when checking the internal position corresponding to the outer shell on the printed circuit board, high-precision equipment such as electron microscopes and X-rays can be used for internal inspection. These methods can check the internal circuits, components and solder joints of the printed circuit board without disassembling the equipment, and determine whether there are cracks, breaks, open circuits and other problems.

[0070] In the embodiment of the present application, when an abnormal point is found on the housing of a printed circuit board, the abnormality at the corresponding position on the printed circuit board is further located, and the faulty component and the fault point on the faulty component can be accurately determined.

[0071] As an optional embodiment, the determining a faulty component having a fault in the at least one component and a fault point in the faulty component includes:

[0072] Obtaining a point map corresponding to the printed circuit board;

[0073] Determine whether there is welding abnormality in the device on the printed circuit board according to the point map;

[0074] In the case where there is a device with abnormal welding on the printed circuit board, the printed circuit board is determined as the faulty component, and the device with abnormal welding is determined as the fault point.

[0075] In this embodiment, the point map is a reference map of the arrangement and welding positions of components in the printed circuit board design, through which it can be confirmed whether the position of the soldering point is correct.

[0076] Abnormal welding refers to the poor quality of welding when connecting electronic devices to printed circuit boards. It usually manifests as missing or cold welding. Abnormal welding will cause the FPC link to be blocked. Specifically, missing welding means that the solder joint of a certain device does not form an effective connection. Cold welding means that the solder joint appears to be connected on the surface, but no stable electrical connection is formed inside.

[0077] In this embodiment, after obtaining the point map corresponding to the printed circuit board, it is possible to check whether there are any welding abnormalities in the devices on the printed circuit board based on the point map. If a device with welding abnormalities is detected on the printed circuit board, the printed circuit board can be determined as a faulty component, and the device with welding abnormalities can be determined as a fault point.

[0078] In this way, by using the point map, the position of each component can be accurately located and checked for welding anomalies. This can quickly identify components with poor welding, thereby improving the accuracy of fault location.

[0079] As an optional embodiment, the determining a faulty component having a fault in the at least one component and a fault point in the faulty component includes:

[0080] Determining a plurality of first depth values ​​of a plurality of pins of the flexible circuit board inserted into a first connection socket;

[0081] In the case where the difference between any two first depth values ​​among the plurality of first depth values ​​is less than a first threshold, determining whether there is a lead that is damaged;

[0082] In the case that there is a pin that is damaged, the first connection socket is determined as the faulty component, and the damaged pin is determined as the fault point.

[0083] In this embodiment, the connection socket is located on the printed circuit board, and the pins on the flexible circuit board are inserted into the connection socket, so that the flexible circuit board and the connection socket are in contact, completing the connection between the flexible circuit board and the printed circuit board, thereby completing signal transmission or power connection.

[0084] Taking the first connection socket as an example, there are multiple pins on the flexible circuit board. After these pins are inserted into the first connection socket, multiple first depth values ​​can be obtained by detecting the insertion depth of each pin. The multiple first depth values ​​can be compared to evaluate the contact between the pins and the socket.

[0085] Specifically, if the difference between any two first depth values ​​is less than a preset first threshold, it means that the insertion depths of all pins are relatively consistent and meet the contact standard. Then, it is further checked whether each pin is damaged. If there is a pin that is damaged, the first connection socket may have poor contact or unstable connection due to the damaged pin. Therefore, if a pin is found to be damaged, the first connection socket can be regarded as a faulty component, and the damaged pin can be regarded as a fault point.

[0086] For example, the first threshold value can be 100um, and an electron microscope can be used to accurately measure and calibrate the insertion depth and insertion angle of the first connection socket. If there are four measurable points on the first connection socket, four first depth values ​​can be determined. If the distance deviation between any two of the four first depth values ​​does not exceed 100um, it is considered that the insertion depth is relatively consistent, and the insertion angles of the four pins are further checked. The insertion angle check mainly focuses on the degree of contact between the pin and the socket. If there are pins that are damaged or warped due to insertion angle problems, the first connection socket can be determined as a faulty component, and the damaged or warped pins can be determined as fault points.

[0087] In the embodiment of the present application, the insertion depth of the pins of the flexible circuit board into the connection socket can be accurately measured to ensure the consistency of the pin insertion depth, thereby avoiding poor contact or electrical problems caused by improper insertion or excessive depth differences. If the depth difference is less than the set threshold, the problem of poor insertion can be effectively eliminated; if the pin is found to be damaged, the faulty component and fault point can be directly located, thereby improving the accuracy of fault analysis.

[0088] As an optional embodiment, after determining a plurality of first depth values ​​of the plurality of pins of the flexible circuit board inserted into the first connection socket, the method further includes:

[0089] When the difference between two first depth values ​​among the plurality of first depth values ​​is greater than the first threshold, the connection socket is determined as the faulty component, and the pin is determined as the faulty point.

[0090] In this embodiment, since the first depth value is the insertion depth of the same first connection socket on the same side of the flexible circuit board, when the flexible circuit board is inserted into the first connection socket, it is possible to determine whether there is a fault by measuring the insertion depth of multiple pins on the same side. If the difference between the first depth values ​​of two pins among the first depth values ​​of the multiple pins on the same side measured is greater than the set first threshold, it means that some pins are not inserted correctly, which may cause poor contact or interruption of signal transmission. At this time, the connection socket is determined as a faulty component, and the pin with abnormal depth is determined as a fault point.

[0091] In addition, in some embodiments, the flexible circuit board is connected to multiple printed circuit boards, and there is a connection socket on each printed circuit board, so the pins of the flexible circuit board will be inserted into multiple connection sockets on different sides. If the difference between the insertion depths of the pins on two different sides is greater than the set second threshold, it may also indicate that some pins are not inserted correctly, which may cause poor contact or interruption of signal transmission. At this time, the connection socket is determined as a faulty component, and the pin with abnormal depth is determined as a fault point. Among them, the second threshold is greater than the first threshold. For example, the first threshold can be 100um and the second threshold can be 300um.

[0092] In the embodiment of the present application, by comparing the differences in insertion depths, the problem of abnormal insertion depth can be effectively identified, and the faulty component and fault point can be quickly located.

[0093] As an optional embodiment, the determining a faulty component having a fault in the at least one component includes:

[0094] When the pins of the flexible circuit board are inserted into the connection socket, pressing the flexible circuit board or the connection socket;

[0095] When the flexible circuit board or the connection socket is in a pressed state, if the image projected by the head-up display system is normal, the connection socket is determined to be the faulty component.

[0096] In this embodiment, if the flexible circuit board does not have the problem of abnormal insertion depth or damage, it can be further checked whether there is a poor contact between the flexible circuit board and the connection socket.

[0097] Specifically, you can use an insulating tool to press the flexible circuit board or the connection socket, and observe whether the current fault can be restored by pressing. If the head-up display system can project images normally after pressing the flexible circuit board or the connection socket, it means that the original fault may be caused by poor contact between the flexible circuit board and the connection socket. If the projected image does not return to normal after pressing: then the fault may not be due to poor contact, but due to a failure of a device on the FPC link, causing the system to fail to work properly.

[0098] Therefore, if the flexible circuit board or the connection socket is in a pressed state and the image can be restored to normal display, it means that the problem may be with the connection socket, so it is confirmed as a faulty component and further analyzed and repaired later.

[0099] In the embodiment of the present application, the flexible circuit board and the connection socket can be pressed to quickly verify whether there is a poor contact problem, thereby quickly locating the source of the fault. If the image returns to normal after pressing, the fault scope can be effectively narrowed down, and the connection socket can be confirmed as a faulty component, which reduces invalid troubleshooting steps and improves the efficiency and accuracy of fault location.

[0100] As an optional embodiment, the determining a faulty component having a fault in the at least one component includes:

[0101] Get a standard flexible circuit board;

[0102] Replacing the flexible circuit board in the FPC link with the standard flexible circuit board;

[0103] If the image projected by the head-up display system after replacement is normal, the flexible circuit board is determined to be the faulty component.

[0104] In this embodiment, AB Comparison Analysis (ABA) can be used to check whether the flexible circuit board in the FPC link has a fault. In the AB comparison analysis, A represents a suspicious part, which refers to a component suspected of having a fault, and B represents a standard part, which refers to a standard and fully functional component. The AB comparison analysis can effectively determine the faulty component by replacing and comparing A and B to observe whether the fault will follow the transfer of the suspicious part.

[0105] Specifically, a standard and well-functioning standard flexible circuit board can be obtained, and then the original flexible circuit board in the FPC link can be removed as a suspicious part, and the flexible circuit board in the original FPC link can be replaced with the standard flexible circuit board. If the image projected by the head-up display system is normal after the replacement, it can be considered that the original flexible circuit board is faulty, that is, the flexible circuit board can be identified as a faulty component. Next, the failure analysis of the flexible circuit board will be performed to locate the specific fault point.

[0106] In addition, the flexible circuit board in the FPC link can be removed and installed in another normal standard HUD system. If the standard HUD system fails after installation, the flexible circuit board can be considered as the root cause of the failure. The flexible circuit board can also be identified as a faulty component, and a failure analysis of the flexible circuit board can be performed to locate the specific fault point.

[0107] In addition, if the connection socket is suspicious, the connection and disconnection of each pin after the flexible circuit board is inserted into the connection socket can be tested for further analysis. Specifically, the connection at both ends of the socket can be tested to ensure that there is no poor contact or electrical problem.

[0108] In the embodiment of the present application, the AB comparison analysis method can be used to determine the source of the fault by replacing and comparing the original flexible circuit board with a standard flexible circuit board with normal functions. By observing the projected image after replacement, it is possible to accurately determine whether the flexible circuit board is a faulty component. This improves the efficiency and accuracy of troubleshooting.

[0109] As an optional embodiment, the determining a faulty component having a fault in the at least one component includes:

[0110] Obtain a standard printed circuit board;

[0111] Replacing the printed circuit board in the FPC link with the standard printed circuit board;

[0112] If the image projected by the head-up display system after replacement is normal, the printed circuit board is determined to be the faulty component.

[0113] In this embodiment, similarly, AB comparison analysis can be used to check whether there is a fault in the printed circuit board in the FPC link.

[0114] Specifically, a standard and well-functioning standard printed circuit board can be obtained, and then the original printed circuit board in the FPC link can be removed as a suspicious part, and the printed circuit board in the original FPC link can be replaced with the standard printed circuit board. If the image projected by the head-up display system is normal after the replacement, it can be considered that the original printed circuit board is faulty, that is, the printed circuit board can be identified as a faulty component. Next, the printed circuit board will be subjected to failure analysis to locate the specific fault point.

[0115] In addition, the printed circuit board in the FPC link can be removed and installed in another normal standard HUD system. If the standard HUD system fails after installation, the printed circuit board can be considered as the root cause of the failure. The printed circuit board can also be identified as the faulty component, and a failure analysis can be performed on the printed circuit board to locate the specific fault point.

[0116] If the PCB is determined to be the faulty component, AB analysis can be performed on each device on the PCB to determine the specific device that has failed. In addition, the time domain reflection test (TDR) is used to detect whether there is a problem with the impedance line of the PCB. The TDR test can accurately measure the impedance of the signal transmission line to determine whether there is an impedance mismatch or signal reflection problem, thereby effectively identifying the part of the circuit with abnormal impedance and ensuring the stability and reliability of signal transmission.

[0117] In the embodiment of the present application, the AB comparison analysis method can be used to determine the source of the fault by replacing and comparing the original printed circuit board with a standard printed circuit board with normal functions. By observing the projected image after replacement, it is possible to accurately determine whether the printed circuit board is a faulty component. This improves the efficiency and accuracy of troubleshooting.

[0118] Based on the fault detection method provided in the above embodiment, the present application also provides a specific implementation of the fault detection device. Please refer to the following embodiment.

[0119] See first Figure 2 The fault detection device 200 provided in the embodiment of the present application includes the following modules:

[0120] A reading module 201, configured to read the software corresponding to the head-up display system when the image projected by the head-up display system is abnormal;

[0121] A first determination module 202, configured to determine at least one component in the FPC link when the reading result of the software indicates that an abnormality exists in the FPC link in the head-up display system, wherein the at least one component includes a flexible circuit board, a printed circuit board, and a connection socket between the flexible circuit board and the printed circuit board;

[0122] The second determining module 203 is used to determine a faulty component and a fault point in the faulty component in the at least one component.

[0123] In this application, when the image of the head-up display system is abnormal, the system software is first read to determine whether the problem is related to the FPC link. If the software detects that the FPC link is abnormal, fault detection is performed on each component in the FPC link, and the faulty component and its fault point are finally determined. In this way, all relevant components in the FPC link can be fully checked to ensure that all hardware factors that may cause abnormal images of the head-up display system are covered, including flexible circuit boards, printed circuit boards, and connecting plug-ins. By accurately locating the faulty components and fault points, omissions or misjudgments can be avoided, thereby effectively improving the accuracy of fault analysis.

[0124] As an implementation of the present application, the second determining module 203 may include:

[0125] A first determining unit, configured to determine whether there is an abnormal point on the housing of the printed circuit board;

[0126] The second determination unit is used to determine the printed circuit board as the faulty component and determine the position corresponding to the abnormal point on the printed circuit board as the faulty point when there is an abnormal point on the housing and there is an abnormality at a position corresponding to the abnormal point on the printed circuit board.

[0127] As an implementation of the present application, the second determining module 203 may include:

[0128] A first acquisition unit, used to acquire a point map corresponding to the printed circuit board;

[0129] A third determining unit, configured to determine whether there is welding abnormality in the device on the printed circuit board according to the point map;

[0130] The fourth determining unit is used to determine the printed circuit board as the faulty component and determine the device with abnormal welding as the fault point when there is a device with abnormal welding on the printed circuit board.

[0131] As an implementation of the present application, the second determining module 203 may include:

[0132] A fifth determining unit, configured to determine a plurality of first depth values ​​of the plurality of pins of the flexible circuit board inserted into the first connecting socket;

[0133] A sixth determining unit, configured to determine whether there is a pin that is damaged if a difference between any two of the plurality of first depth values ​​is less than a first threshold;

[0134] The seventh determining unit is used to determine the connection socket as the faulty component and the damaged pin as the fault point when there is a damaged pin.

[0135] As an implementation of the present application, the second determining module 203 may further include:

[0136] An eighth determining unit is configured to determine the connection socket as the faulty component and the pin as the fault point if a difference between two first depth values ​​among the multiple first depth values ​​is greater than the first threshold.

[0137] As an implementation of the present application, the second determining module 203 may further include:

[0138] A pressing unit, used for pressing the flexible circuit board or the connecting socket when the pins of the flexible circuit board are inserted into the connecting socket;

[0139] A ninth determining unit is configured to determine the connecting socket as the faulty component if the image projected by the head-up display system is normal when the flexible circuit board or the connecting socket is in a pressed state.

[0140] As an implementation of the present application, the second determining module 203 may further include:

[0141] A second acquisition unit, used for acquiring a standard flexible circuit board;

[0142] A first replacement unit, used to replace the flexible circuit board in the FPC link with the standard flexible circuit board;

[0143] A tenth determining unit is configured to determine the flexible circuit board as the faulty component if the image projected by the head-up display system after replacement is normal.

[0144] As an implementation of the present application, the second determining module 203 may further include:

[0145] A third acquisition unit, used for acquiring a standard printed circuit board;

[0146] A second replacement unit, used to replace the printed circuit board in the FPC link with the standard printed circuit board;

[0147] An eleventh determining unit is configured to determine the printed circuit board as the faulty component if the image projected by the head-up display system after replacement is normal.

[0148] The fault detection device provided in the embodiment of the present invention can implement each step in the above method embodiment, and will not be described again here to avoid repetition.

[0149] Figure 3 A schematic diagram of the hardware structure of a fault detection device provided in an embodiment of the present application is shown.

[0150] The fault detection device may include a processor 1001 and a memory 1002 storing computer program instructions.

[0151] Specifically, the processor 1001 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.

[0152] The memory 1002 may include a large capacity memory for data or instructions. By way of example and not limitation, the memory 1002 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive or a combination of two or more of these. In appropriate cases, the memory 1002 may include a removable or non-removable (or fixed) medium. In appropriate cases, the memory 1002 may be inside or outside the integrated gateway disaster recovery device. In a specific embodiment, the memory 1002 is a non-volatile solid-state memory.

[0153] The memory may include read-only memory (ROM), random access memory (RAM), magnetic disk storage media devices, optical storage media devices, flash memory devices, electrical, optical or other physical / tangible memory storage devices. Thus, typically, the memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described with reference to the method according to an aspect of the present disclosure.

[0154] The processor 1001 implements any one of the fault detection methods in the above embodiments by reading and executing computer program instructions stored in the memory 1002 .

[0155] In one example, the fault detection device may further include a communication interface 1003 and a bus 1010. Figure 3 As shown, the processor 1001, the memory 1002, and the communication interface 1003 are connected via a bus 1010 and communicate with each other.

[0156] The communication interface 1003 is mainly used to implement communication between various modules, devices, units and / or equipment in the embodiments of the present application.

[0157] Bus 1010 includes hardware, software or both, and the parts of fault detection equipment are coupled to each other.For example, but not limitation, bus may include accelerated graphics port (AGP) or other graphics bus, enhanced industrial standard architecture (EISA) bus, front side bus (FSB), hypertransport (HT) interconnection, industrial standard architecture (ISA) bus, infinite bandwidth interconnection, low pin count (LPC) bus, memory bus, micro channel architecture (MCA) bus, peripheral component interconnection (PCI) bus, PCI-Express (PCI-X) bus, serial advanced technology attachment (SATA) bus, video electronics standard association local (VLB) bus or other suitable bus or two or more of these combinations. In suitable cases, bus 1010 may include one or more buses. Although the present application embodiment describes and shows a specific bus, the application considers any suitable bus or interconnection.

[0158] The fault detection device may be based on the above embodiment, thereby realizing the fault detection method and apparatus combined with the above embodiment.

[0159] In addition, in combination with the fault detection method in the above embodiment, the embodiment of the present application may provide a computer storage medium for implementation. The computer storage medium stores computer program instructions; when the computer program instructions are executed by the processor, any one of the fault detection methods in the above embodiment is implemented, and the same technical effect can be achieved. To avoid repetition, it will not be repeated here. Among them, the above-mentioned computer-readable storage medium may include a non-transitory computer-readable storage medium, such as a read-only memory (Read-Only Memory, referred to as ROM), a random access memory (Random Access Memory, referred to as RAM), a disk or an optical disk, etc., which is not limited here.

[0160] In addition, an embodiment of the present application further provides a computer program product, including computer program instructions, which can implement the steps and corresponding contents of the aforementioned method embodiment when the computer program instructions are executed by a processor.

[0161] It should be clear that the present application is not limited to the specific configuration and processing described above and shown in the figures. For the sake of simplicity, a detailed description of the known method is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present application is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps after understanding the spirit of the present application.

[0162] The functional blocks shown in the above block diagram can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, etc. When implemented in software, the elements of the present application are programs or code segments that are used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or a communication link by a data signal carried in a carrier wave. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, etc. The code segment can be downloaded via a computer network such as the Internet, an intranet, etc.

[0163] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiment, or in a different order from the embodiment, or several steps can be performed simultaneously.

[0164] Aspects of the present disclosure are described above with reference to the flowchart and / or block diagram of the method, device and computer program product according to the embodiment of the present disclosure. It should be understood that each box in the flowchart and / or block diagram and the combination of each box in the flowchart and / or block diagram can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device to produce a machine so that these instructions executed by the processor of the computer or other programmable data processing device enable the implementation of the function / action specified in one or more boxes of the flowchart and / or block diagram. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field programmable logic circuit. It can also be understood that each box in the block diagram and / or flowchart and the combination of boxes in the block diagram and / or flowchart can also be implemented by dedicated hardware that performs a specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions.

[0165] The above are only specific implementation methods of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims

1. A fault detection method, characterized in that: The method comprises: In the case where the image projected by the head-up display system is abnormal, reading software corresponding to the head-up display system; When the reading result of the software indicates that an abnormality exists in the FPC link in the head-up display system, determining at least one component in the FPC link, the at least one component comprising a flexible circuit board, a printed circuit board, and a connection socket between the flexible circuit board and the printed circuit board; A faulty component having a fault is determined in the at least one component, and a fault point in the faulty component.

2. The fault detection method according to claim 1, characterized in that: The determining of a faulty component having a fault in the at least one component and a fault point in the faulty component comprises: determining whether there is an abnormal point on the housing of the printed circuit board; When there is an abnormal point on the housing and there is an abnormality at a position corresponding to the abnormal point on the printed circuit board, the printed circuit board is determined as the faulty component, and the position corresponding to the abnormal point on the printed circuit board is determined as the faulty point.

3. The fault detection method according to claim 1, characterized in that: The determining of a faulty component having a fault in the at least one component and a fault point in the faulty component comprises: Obtaining a point map corresponding to the printed circuit board; Determine whether there is welding abnormality in the device on the printed circuit board according to the point map; In the case that there is a device with abnormal welding on the printed circuit board, the printed circuit board is determined as the faulty component, and the device with abnormal welding is determined as the fault point.

4. The fault detection method according to claim 1, characterized in that: The determining of a faulty component having a fault in the at least one component and a fault point in the faulty component comprises: Determining a plurality of first depth values ​​of a plurality of pins of the flexible circuit board inserted into a first connection socket; In the case where the difference between any two first depth values ​​among the plurality of first depth values ​​is less than a first threshold, determining whether there is a lead that is damaged; In the case that there is a pin that is damaged, the connection socket is determined as the faulty component, and the damaged pin is determined as the fault point.

5. The fault detection method according to claim 4, characterized in that: After determining a plurality of first depth values ​​of the plurality of pins of the flexible circuit board inserted into the first connection socket, the method further comprises: When the difference between two first depth values ​​among the plurality of first depth values ​​is greater than the first threshold, the connection socket is determined as the faulty component, and the pin is determined as the faulty point.

6. The fault detection method according to claim 1, characterized in that: The determining of a faulty component having a fault in the at least one component comprises: When the pins of the flexible circuit board are inserted into the connection socket, pressing the flexible circuit board or the connection socket; When the flexible circuit board or the connection socket is in a pressed state, if the image projected by the head-up display system is normal, the connection socket is determined to be the faulty component.

7. The fault detection method according to claim 1, characterized in that: The determining of a faulty component having a fault in the at least one component comprises: Get a standard flexible circuit board; Replacing the flexible circuit board in the FPC link with the standard flexible circuit board; If the image projected by the head-up display system after replacement is normal, the flexible circuit board is determined to be the faulty component.

8. The fault detection method according to claim 1, characterized in that: The determining of a faulty component having a fault in the at least one component comprises: Obtain a standard printed circuit board; Replacing the printed circuit board in the FPC link with the standard printed circuit board; If the image projected by the head-up display system after replacement is normal, the printed circuit board is determined to be the faulty component.

9. A fault detection device, characterized in that: The device comprises: A reading module, used for reading the software corresponding to the head-up display system when the image projected by the head-up display system is abnormal; A first determination module, configured to determine at least one component in the FPC link when the reading result of the software indicates that an abnormality exists in the FPC link in the head-up display system, wherein the at least one component includes a flexible circuit board, a printed circuit board, and a connection socket between the flexible circuit board and the printed circuit board; The second determining module is used to determine a faulty component and a fault point in the faulty component in the at least one component.

10. A fault detection device, characterized in that: The fault detection device comprises: a processor and a memory storing computer program instructions; when the processor executes the computer program instructions, the fault detection method as described in claims 1-8 is implemented.

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