Probe card OS test device and test method

Abstract

The embodiment of the invention discloses a probe card OS test device and a test method. The device comprises: a base; the probe card mounting assembly is mounted on the base; the movable carrying table is mounted on the base, and a conductive block and an insulating block are arranged on the movable carrying table; the movable carrying table is configured to drive the conductive block and the insulating block to move, so that the conductive block or the insulating block is in contact with each probe of a probe card on the probe card mounting assembly to form a plurality of test paths in one-to-one correspondence with the probes or to enable the top ends of the probes to be mutually insulated; and the open / short circuit test module is respectively connected with the conductive block and each probe of the probe card, and the open / short circuit test module is configured to be conducted with the test path or each probe according to a preset mode so as to carry out open / short circuit test on each probe of the probe card. According to the embodiment of the invention, the open / short circuit test of each probe of the probe card is realized.

Description

Technical Field

[0001] The present application relates to the field of chip testing technology, and in particular to a probe card OS testing device and testing method. Background Art

[0002] In the semiconductor packaging test process, the probe card plays the role of connecting the chip and the ATE test bench. The probe card is usually composed of a probe card head, MLO (Multi-Layer Organic), PCB, etc., where the probe card head is composed of probes arranged according to the pins of the chip to be tested.

[0003] The open / short contact test (Open / Short, O / S test) is used to confirm that all signal pins are electrically connected to the corresponding channels of the test system during device testing, and no signal pin is short-circuited with other signal pins, power supply or ground. The contact test can quickly detect whether the chip under test has electrical and physical defects, so as to find and eliminate them as early as possible, so it is the first step in the test.

[0004] The open / short circuit test is closely related to the performance of the probe card itself. In theory, after the probes of the probe card touch the chip pins, there will be no short circuit between each other and no open circuit with the chip pins. However, in practice, due to the production level of the probe card and the service life of the probe card, the probe card probes may short-circuit themselves or open circuit with the chip pins when in contact, which will exaggerate the chip test failure rate and inaccurate test results, causing huge economic losses. Therefore, the performance of the probe card itself is crucial to the final chip test. However, the existing method usually uses the probe card to directly test the chip, ignoring the performance test of the probe card itself. Summary of the invention

[0005] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a probe card OS test device and a test method to implement an open / short circuit test on each probe of the probe card itself.

[0006] In a first aspect, the present application provides a probe card OS testing device, comprising:

[0007] Pedestal;

[0008] a probe card mounting assembly mounted on the base, the probe card mounting assembly being configured to mount a probe card to be tested;

[0009] A movable stage is mounted on the base, and a conductive block and an insulating block are arranged on the movable stage; the movable stage is configured to drive the conductive block and the insulating block to move, so that the conductive block or the insulating block contacts each probe of the probe card on the probe card mounting assembly, so as to form a plurality of test paths corresponding to each probe one by one or to insulate the top ends of each probe from each other;

[0010] The open / short circuit test module is respectively connected to the conductive block and each probe of the probe card, and the open / short circuit test module is configured to be connected to the test path or each probe in a preset manner to perform an open / short circuit test on each probe of the probe card.

[0011] In one embodiment of the above-mentioned probe card OS test device,

[0012] The open-short circuit test module is configured to conduct with each of the test paths and apply voltage separately when the conductive block contacts the probes, so as to perform an open circuit test on each probe of the probe card.

[0013] In one embodiment of the above-mentioned probe card OS test device,

[0014] The open-short circuit test module is configured to conduct two ends of the probes and apply a single-ended voltage to the conducted probes when the insulating block contacts the probes, so as to perform a short circuit test on the probes of the probe card.

[0015] In one embodiment of the above-mentioned probe card OS test device,

[0016] The open-short circuit test module comprises:

[0017] power supply;

[0018] At least one switch, a first end of each switch is connected to the positive end of the power supply, and a second end of each switch is connected to each probe of the probe card one by one; a negative end of the power supply is connected to the conductive block and the insulating block respectively;

[0019] The controller is configured to control the on / off of each switch to control the on / off of the power supply and the test path or each probe in a preset manner.

[0020] In one embodiment of the above-mentioned probe card OS test device,

[0021] The mobile stage comprises a bearing platform and a driving mechanism, wherein the driving mechanism is mounted on the base, and the bearing platform is mounted on the driving end of the driving mechanism; the conductive block and the insulating block are mounted on the bearing platform;

[0022] The driving mechanism is configured to drive the carrying platform to move horizontally and / or vertically, so that the conductive block or the insulating block is in full contact with each probe of the probe card on the probe card mounting assembly.

[0023] In one embodiment of the above-mentioned probe card OS test device,

[0024] The driving mechanism includes an X-axis module, a Y-axis module and a Z-axis lifting device; the X-axis module is arranged on the base, the Y-axis module is installed at the driving end of the X-axis module, and the X-axis module is configured to drive the Y-axis module to move along the X direction;

[0025] The Z-axis lifting device includes a sliding seat and a Z-axis driving member, the sliding seat is installed on the driving end of the Y-axis module, and the Y-axis module is configured to drive the sliding seat to move along the Y-axis direction; the Z-axis driving member is installed on the sliding seat and the driving end of the Z-axis driving member is connected to the supporting platform, and the Z-axis driving member is configured to drive the supporting platform to move along the Z direction.

[0026] In one embodiment of the above-mentioned probe card OS test device,

[0027] The movable platform is also provided with a needle grinding device, and the movable platform is further configured to drive the needle grinding device to move so as to grind the probes of the probe card on the probe card mounting assembly.

[0028] In one embodiment of the above-mentioned probe card OS test device,

[0029] The probe card mounting assembly includes a mounting frame and a mounting plate disposed on the mounting frame, wherein the mounting frame is mounted on the base, the mounting plate is disposed above the movable stage, and the mounting plate is configured to fix the probe card to be tested toward the direction of the movable stage.

[0030] In a second aspect, the present application provides a testing method based on the probe card OS testing device as described in any one of the first aspects, the method comprising:

[0031] Controlling the movable stage to drive the conductive block and the insulating block to move, so that the conductive block or the insulating block contacts the probes of the probe card on the probe card mounting assembly, so as to form a plurality of test paths corresponding to the probes one by one or to insulate the top ends of the probes from each other;

[0032] The open / short circuit test module is controlled to be connected to the test path or each probe in a preset manner, so as to perform an open / short circuit test on each probe of the probe card.

[0033] In one embodiment of the above test method,

[0034] The method further includes: when the conductive block contacts the probes, controlling the open-short circuit test module to be connected to each of the test paths and applying voltage separately; if the current value of the connected test path is zero, the probe corresponding to the test path is open.

[0035] In one embodiment of the above test method,

[0036] The method further includes: when the conductive block contacts the probes, controlling each switch to be turned on individually so that the power supply applies voltage to the turned-on test path; if the current value of the turned-on test path is zero, the probe corresponding to the test path is open.

[0037] In one embodiment of the above test method,

[0038] The method further includes: when each of the test paths is turned on and a voltage is applied separately, measuring whether the resistance value of the probe in the corresponding turned-on test path is within a normal range.

[0039] In one embodiment of the above test method,

[0040] The method further includes: when the insulating block contacts the probes, controlling the open-short circuit test module and the same end of the probes to be connected in pairs and applying a single-ended voltage to the connected probes; if the current values ​​of the two connected probes are not zero, the corresponding two probes are short-circuited.

[0041] In one embodiment of the above test method,

[0042] The method further includes: when the insulating block contacts the probes, controlling the switches to be turned on in pairs, so that the power supply applies a single-ended voltage to the two turned-on probes; if the current values ​​of the two turned-on probes are not zero, the corresponding two probes are short-circuited.

[0043] One or more of the above embodiments of the present application have at least one or more of the following beneficial effects:

[0044] In the technical solution for implementing the present application, the probe card to be tested is installed on the mounting assembly through the probe card OS test device, and the conductive block or the insulating block is brought into contact with the probes of the probe card to be tested by moving the carrier to form a number of corresponding test paths or to insulate the top ends of the probes from each other, thereby connecting in succession in a preset manner to achieve open and short circuit tests on the probes of the probe card. Testing the probe card using the probe card OS test device of the present application is simple and quick, and since the various components of the device, such as the conductive block and the insulating block, are easy to obtain and the materials are simple, the overall cost of the test device is low, and the open and short circuit conditions of the probe card itself can be effectively tested at a low cost, and it has high economy. At the same time, the method for testing the probe card using the probe card OS test device of the present application is simple in steps and easy to operate, which can effectively improve the test accuracy and ensure the quality of the probe card itself.

[0045] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The disclosure of the present application will become more easily understood with reference to the accompanying drawings. It is easy for those skilled in the art to understand that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present application. In addition, similar numbers in the drawings are used to represent similar components, among which:

[0047] Figure 1 This is a schematic diagram of the structure of a probe card OS test device according to one embodiment of the present application;

[0048] Figure 2 It is a schematic diagram of the side structure of a probe card OS test device according to one embodiment of the present application;

[0049] Figure 3 This is a schematic diagram of the driving mechanism structure of a probe card OS test device according to one embodiment of the present application;

[0050] Figure 4 This is a schematic diagram of the test circuit principle of the probe card OS test device of one embodiment of the present application (K11-K1 n, K2 are all in the open state);

[0051] Figure 5 This is a schematic diagram of the test circuit principle of the probe card OS test device of one embodiment of the present application (K11 is turned on, K2 is both in the on state);

[0052] Figure 6 This is a schematic diagram of the test circuit principle of the probe card OS test device of one embodiment of the present application (K11 and K12 are turned on, and K2 is in the open state);

[0053] Figure 7 This is a schematic diagram of the test circuit principle of the probe card OS test device of one of the embodiments of the present application (K11 and K12 are turned on, K2 is in the open state, and the two probes are short-circuited).

[0054] Description of reference numerals:

[0055] 100, base; 200, probe card mounting assembly; 201, mounting frame; 202, mounting plate;

[0056] 300, mobile stage; 301, conductive block; 302, insulating block; 303, carrying platform; 304, X-axis module; 305, Y-axis module; 306, sliding seat; 307, Z-axis driving member;

[0057] 400. probe card; 401. probe; 500. needle grinding device. DETAILED DESCRIPTION

[0058] Some embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the protection scope of the present application.

[0059] As described in the background technology, the performance test of the probe card itself is currently ignored. When the number of probes is small, such as a few or dozens, a manual multimeter can be used to measure whether the probe needle tails are disconnected. However, when the number of chip pins increases to several thousand and the number of probes on the entire probe card is tens of thousands, the only way to measure whether the probe card is short-circuited is through machine measurement. Existing machine measurement methods, such as PRVX (PrecisionWoRx VX4, probe card test and analysis system) test probe card open and short circuits. During the test, the power supply is pressurized and a certain current (typical value is ±100μA) is applied to the pin of each device under test, and then the corresponding voltage is measured. If the absolute value of the measured voltage value is higher than the absolute value upper limit of a certain voltage range (such as -1.5~-0.2V or 0.2~1.5V), it can be considered that the contact between the pin and the tester is disconnected, representing an open circuit; if the absolute value of the measured voltage value is lower than the absolute value lower limit of a certain voltage range, it is considered that there is a short circuit between the pin and the tester. However, PRVX is expensive, and the test process is complicated by measuring specific voltage values. There are many uncertain factors in the system, such as the influence of the system itself, resulting in low accuracy of the test results. The overall test is time-consuming, labor-intensive, and wastes the test machine, with high cost, low efficiency, and poor accuracy. Based on this, the present application proposes a probe card OS test device to achieve simple, economical, fast and accurate OS testing of each probe of the probe card.

[0060] See attached Figure 1-Figure 3In one or more embodiments, a probe card OS test device of the present application includes: a base 100; a probe card mounting assembly 200, mounted on the base 100, the probe card mounting assembly 200 being configured to mount a probe card 400 to be tested; a movable platform 300, mounted on the base 100, a conductive block 301 and an insulating block 302 being provided on the movable platform 300; the movable platform 300 being configured to drive the conductive block 301 and the insulating block 302 to move, so that the conductive block 301 or the insulating block 302 contacts each probe 401 of the probe card 400 on the probe card mounting assembly 200, so as to form a number of test paths corresponding to each probe 401 one by one or to insulate the top ends of each probe from each other; an open / short circuit test module, respectively connecting the conductive block 301 and each probe 401 of the probe card 400, the open / short circuit test module being configured to conduct with the test path or each probe 401 in a preset manner, so as to perform an open / short circuit test on each probe 401 of the probe card 400.

[0061] In an embodiment of the present application, the probe card to be tested is installed on the mounting assembly through the probe card OS test device, and the conductive block 301 or the insulating block 302 is made to contact the probes 401 of the probe card to be tested by moving the carrier 300 to form a number of corresponding test paths or to insulate the top ends of the probes 401 from each other, so as to be connected in succession in a preset manner to implement an open and short circuit test on the probes 401 of the probe card 400. Testing the probe card 400 using the probe card OS test device of the present application is simple and quick, and because the components of the device, such as the conductive block 301 and the insulating block 302, are easy to obtain, the materials are simple, and the overall cost of the test device is low, the open and short circuit conditions of the probe card 400 itself can be effectively tested at a low cost, and it has high economy. At the same time, the method for testing the probe card 400 using the probe card OS test device of the present application is simple in steps and easy to operate, which can effectively improve the test accuracy and ensure the quality of the probe card itself.

[0062] In one embodiment, based on the above-mentioned probe card OS test device, when performing an open circuit test: the conductive block 301 is driven by the movable carrier 300 to contact each probe 401 of the probe card 400 to be tested on the probe card mounting assembly 200, and the open and short circuit test module is respectively connected to each test path and applies voltage separately to perform an open circuit test on each probe of the probe card 400. Specifically, each test path is separately turned on and voltage is applied. Since each probe 401 contacts the conductive block 301 to form a conductive path, it is possible to determine whether the corresponding probe in the test path is open by measuring whether there is a current value in the test path. Under normal circumstances, if the current value in this test path is a normal value, the corresponding probe can be turned on normally. If the current value is zero, it indicates that the corresponding probe is open.

[0063] In one embodiment, based on the above-mentioned probe card OS test device, when performing a short circuit test: the insulating block 302, driven by the moving carrier 300, contacts each probe 401 of the probe card 400 to be tested on the probe card mounting assembly 200, and the open short circuit test module is connected to the same end of each probe 401 in pairs and a single-ended voltage is applied to the connected probes. By measuring whether there is a current value in the two connected probes, it can be determined whether there is a short circuit between the two probes. Under normal circumstances, under the action of the insulating block 302, the current values ​​of the two probes should both be zero. If the current values ​​of the two probes are not zero, it indicates that there is a short circuit between the two probes.

[0064] In one embodiment, the open / short circuit test module includes: a power supply; at least one switch, wherein the first end of each switch is connected to the positive terminal of the power supply, and the second end of each switch is connected to each probe of the probe card 400 in a one-to-one correspondence; the negative terminal of the power supply is respectively connected to the conductive block 301 and the insulating block 302; and a controller configured to control the on or off of each switch to control the on or off of the power supply and the test path or each probe 401 in a preset manner, thereby performing an open / short circuit test.

[0065] Specifically, refer to Figure 4 , the OS test circuit is composed of an open-short circuit test module, Us is a DC power supply, R is a resistor, K11-K1 n represents a switch, K2 represents whether each probe 401 is in contact with the conductive block 301 or the insulating block 302; A1-An represents the current value of the probe connected to the switch. In the initial state, switches K11-K1 n are all in the open state, and each probe 401 of the probe card 400 is not in contact with the conductive block 301 or the insulating block 302, and K2 is all in the open state. At this time, the current values ​​of A1-An are all 0; the probe card OS test device can be connected to a cooling and heating system to simulate the three-temperature environment of the actual chip test, specifically extreme high temperature, extreme low temperature and normal temperature cycle test. In this application, the open / short circuit test process or method for each probe is the same under the three-temperature state;

[0066] When performing an open circuit test, refer to Figure 5 , the conductive block 301 is driven by the moving stage 300 to contact each probe 401 of the probe card 400 to be tested on the probe card installation assembly 200, K2 is in the on state, and each probe is tested separately. Taking K11 as an example, when K11 is turned on, if the A1 current value is a normal value, the probe corresponding to this channel is turned on normally and there is no open circuit; when K11 is turned on and the A1 current value is 0, it means that the probe corresponding to this path is open circuit; through the above method, K11-K1 n are turned on separately to determine whether each corresponding probe is short-circuited; test principle: when the probe is broken, the probe needle tail is in virtual contact with the MLO, the MLO is disconnected from the PCB circuit, etc., after the probe contacts the conductive block 301, there is no current value in the circuit, thereby determining that the probe in this circuit is open circuit;

[0067] When performing a short circuit test, refer to Figure 6 , the insulating block 302 is driven by the moving stage 300 to contact each probe 401 of the probe card 400 to be tested on the probe card installation assembly 200. Since K2 is the probe in contact with the insulating block 302, the insulating block makes one end of the probe disconnected, that is, K2 is disconnected, and each probe 401 is tested in pairs. Taking K11 and K12 as an example, when K12 and K12 are both in the on state, under normal circumstances, since one end of the probe is insulated, that is, K2 is disconnected, the current values ​​of A1 and A2 are both 0, indicating that the probes corresponding to K11 and K12 are not short-circuited; when K12 and K12 are both in the on state, the two connected probes are short-circuited, refer to Figure 7 At this time, the circuit forms a loop, and the current values ​​of A1 and A2 are not 0, indicating that the two probes are short-circuited. Through the above method, K11-K1n are turned on in pairs in a non-repetitive manner to determine whether there is a short circuit between each two probes. Test principle: When the probes are short-circuited, the current in the test circuit is not zero.

[0068] In one embodiment, reference Figure 1-Figure 3 The movable carrier 300 includes a carrying platform 303 and a driving mechanism, the driving mechanism is installed on the base 100, and the carrying platform 303 is installed on the driving end of the driving mechanism; the conductive block 301 and the insulating block 302 are installed on the carrying platform 303; the driving mechanism is configured to drive the carrying platform 303 to move horizontally and / or vertically, so that the conductive block 301 or the insulating block 302 is in full contact with each probe 401 of the probe card 400 on the probe card mounting assembly 200.

[0069] In one possible implementation, reference Figure 2 and Figure 3The driving mechanism includes an X-axis module 304, a Y-axis module 305 and a Z-axis lifting device; the X-axis module 304 is arranged on the base 100, the Y-axis module 305 is installed at the driving end of the X-axis module 304, and the X-axis module 304 is configured to drive the Y-axis module 305 to move along the X direction; the Z-axis lifting device includes a sliding seat 306 and a Z-axis driving member 307, the sliding seat 306 is installed on the driving end of the Y-axis module 305, and the Y-axis module 305 is configured to drive the sliding seat 306 to move along the Y-axis direction; the Z-axis driving member 307 is installed on the sliding seat 306 and the Z-axis driving member The driving end of the component 307 is connected to the carrier platform 303, and the Z-axis driving component 307 is configured to drive the carrier platform 303 to move along the Z direction. The mobile platform 300 moves in the X direction, the Y direction and the Z direction through the X-axis module 304, the Y-axis module 305 and the Z-axis lifting device, so that the conductive block 301 or the insulating block 302 is in contact with each probe 401 of the probe card 400. In order to ensure that each probe 401 is in full contact with the conductive block 301 or the insulating block 302, the driving mechanism is used to make each probe and the conductive block 301 or the insulating block 302 overpressure a certain distance to ensure full contact. In the present application, the X-axis module 304 and the Y-axis module 305 are both linear modules, using servo motors, and the Z-axis driving component 307 can be a cylinder, and the entire driving mechanism has high control accuracy.

[0070] In one embodiment, reference Figure 3 A needle grinding device 500 is also provided on the movable platform 300, and the movable platform 300 is also configured to drive the needle grinding device 500 to move so as to grind the probes of the probe card 400 on the probe card mounting assembly 200. The driving method of the needle grinding device 500 refers to the above-mentioned driving method of the conductive block 301 or the insulating block 302. The needle grinding device 500 can be a frosting block, and the needle grinding process can ensure that the needle tips of each probe 401 are at the same level.

[0071] In one embodiment, reference Figure 1 and Figure 2 The probe card mounting assembly 200 includes a mounting frame 201 and a mounting plate 202 disposed on the mounting frame 201. The mounting frame 201 is mounted on the base 100, and the mounting plate 202 is disposed above the movable stage 300. The mounting plate 202 is configured to fix the probe card 400 to be tested in the direction of the movable stage 300, so that each probe 401 of the probe card 400 to be tested faces downward to the movable stage 300. When the conductive block 301 or the insulating block 302 needs to contact each probe 401, the conductive block 301 or the insulating block 302 can be moved to the probe position by the movable stage 300.

[0072] Further, refer to Figure 1-Figure 7 The present application provides a testing method based on the above-mentioned probe card OS testing device, the method comprising:

[0073] Control the movable stage 300 to drive the conductive block 301 and the insulating block 302 to move, so that the conductive block 301 or the insulating block 302 contacts the probes 401 of the probe card 400 on the probe card mounting assembly 200, so as to form a plurality of test paths corresponding to the probes 401 one by one or to insulate the top ends of the probes 401 from each other;

[0074] The open / short circuit test module is controlled to be connected to the test path or each probe 401 in a preset manner, so as to perform an open / short circuit test on each probe 401 of the probe card 400 .

[0075] In one embodiment, an open circuit test is performed based on the probe card OS test device as described above: when the conductive block 301 contacts each probe 401, the open and short circuit test module is controlled to be connected to each test path respectively and voltage is applied separately; if the current value of the turned-on test path is zero, the probe corresponding to the test path is an open circuit.

[0076] Specifically, when the conductive block 301 contacts each probe 401, each switch is controlled to be turned on individually so that the power supply applies voltage to the turned-on test path; if the current value of the turned-on test path is zero, the probe corresponding to the test path is open circuit. Specifically, refer to the description of the open circuit test in the above-mentioned device implementation method, and the repeated parts will not be repeated.

[0077] In one possible implementation, a test can be performed to determine whether the resistance value from the PCB to the probe exceeds the design requirements. Specifically, when each test path is turned on and a voltage is applied separately, the resistance value of the probe in the corresponding turned-on test path is measured to determine whether it is within the normal range. If the resistance value is not within the normal range, it may cause problems such as probe heating, affecting normal use. Furthermore, when measuring resistance, the resistance value of each probe can be measured for comparison. If they are basically within the same range, it indicates that they are all normal. If the resistance value of a probe exceeds the resistance value of other probes by too much, there is a problem with the probe.

[0078] In one embodiment, an open circuit test is performed based on the probe card OS test device as described above: when the insulating block 302 contacts each probe 401, the open and short circuit test module is controlled to be connected to the same end of each probe and a single-ended voltage is applied to the connected probes; if the current value of the two connected probes is not zero, the corresponding two probes are short-circuited.

[0079] Specifically, when the insulating block 302 contacts each probe 401, the switches are controlled to be turned on in pairs, so that the power supply applies a single-ended voltage to the two turned-on probes; if the current value of the two turned-on probes is not zero, the corresponding two probes are short-circuited. Specifically, refer to the description of the short-circuit test in the above device implementation, and the repeated parts will not be repeated.

[0080] refer to Figure 1-Figure 7Based on the above implementation, a possible testing method of the probe card OS testing device of the embodiment of the present application specifically includes:

[0081] Control the X-axis module 304, the Y-axis module 305 and the Z-axis driving device to make the needle grinding device 500 contact each probe 401, and control the X-axis module 304, the Y-axis module 305 and the Z-axis driving device to grind the needle tip of each probe 401;

[0082] Control the X-axis module 304, the Y-axis module 305 and the Z-axis driving device to make the conductive block 301 contact with each probe 401, and overpress upward for a certain distance to ensure that the needle tip of each probe 401 is fully in contact with the conductive block 301. At this time, K2 in the test circuit is in the on state;

[0083] Single circuit test, taking K11 as an example, when K11 is turned on, the A1 current value is normal, and the probe corresponding to K11 is turned on normally; when K11 is turned on, the A1 current value is 0, indicating that this probe is open circuit; according to this method of judging the open circuit, turn on each circuit of K11-K1 n separately, and perform the open circuit test of each probe 401;

[0084] Control the X-axis module 304, the Y-axis module 305 and the Z-axis driving device to separate the conductive block 301 from each probe 401, then move the insulating block 302 to contact each probe 401, and overpress upward for a certain distance to ensure that the needle tip of each probe 401 is fully in contact with the insulating block 302, and K2 is in the disconnected state;

[0085] Two-by-two connectivity test, taking K11 and K12 as an example, when K11 and K12 are turned on, the two probes are not short-circuited under the pressed state, and the current values ​​of A1 and A2 are 0; when K11 and K12 are turned on, the corresponding two probes are in contact and short-circuited, the current values ​​of A1 and A2 are not 0, indicating that these two probes are short-circuited; according to this short-circuit judgment method, the arrangement is not repeated and K11-K1 n are turned on two by two, and each probe 401 is short-circuited.

[0086] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0087] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0088] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A probe card OS test device, characterized in that: include: Pedestal; a probe card mounting assembly mounted on the base, the probe card mounting assembly being configured to mount a probe card to be tested; A movable stage is mounted on the base, and a conductive block and an insulating block are arranged on the movable stage; the movable stage is configured to drive the conductive block and the insulating block to move, so that the conductive block or the insulating block contacts each probe of the probe card on the probe card mounting assembly, so as to form a plurality of test paths corresponding to each probe one by one or to insulate the top ends of each probe from each other; The open / short circuit test module is respectively connected to the conductive block and each probe of the probe card, and the open / short circuit test module is configured to be connected to the test path or each probe in a preset manner to perform an open / short circuit test on each probe of the probe card.

2. The probe card OS testing device according to claim 1, characterized in that: The open-short circuit test module is configured to conduct with each of the test paths and apply voltage separately when the conductive block contacts the probes, so as to perform an open circuit test on each probe of the probe card.

3. The probe card OS testing device according to claim 1, characterized in that: The open-short circuit test module is configured to conduct two ends of the probes and apply a single-ended voltage to the conducted probes when the insulating block contacts the probes, so as to perform a short circuit test on the probes of the probe card.

4. The probe card OS testing device according to claim 1, characterized in that: The open-short circuit test module comprises: power supply; At least one switch, a first end of each switch is connected to the positive end of the power supply, and a second end of each switch is connected to each probe of the probe card one by one; a negative end of the power supply is connected to the conductive block and the insulating block respectively; The controller is configured to control the on / off of each switch to control the on / off of the power supply and the test path or each probe in a preset manner.

5. The probe card OS testing device according to claim 1, characterized in that: The mobile stage comprises a bearing platform and a driving mechanism, wherein the driving mechanism is mounted on the base, and the bearing platform is mounted on the driving end of the driving mechanism; the conductive block and the insulating block are mounted on the bearing platform; The driving mechanism is configured to drive the carrying platform to move horizontally and / or vertically, so that the conductive block or the insulating block is in full contact with each probe of the probe card on the probe card mounting assembly.

6. The probe card OS testing device according to claim 5, characterized in that: The driving mechanism includes an X-axis module, a Y-axis module and a Z-axis lifting device; the X-axis module is arranged on the base, the Y-axis module is installed at the driving end of the X-axis module, and the X-axis module is configured to drive the Y-axis module to move along the X direction; The Z-axis lifting device includes a sliding seat and a Z-axis driving member, the sliding seat is installed on the driving end of the Y-axis module, and the Y-axis module is configured to drive the sliding seat to move along the Y-axis direction; the Z-axis driving member is installed on the sliding seat and the driving end of the Z-axis driving member is connected to the supporting platform, and the Z-axis driving member is configured to drive the supporting platform to move along the Z direction.

7. The probe card OS testing device according to claim 1, characterized in that: The movable platform is also provided with a needle grinding device, and the movable platform is further configured to drive the needle grinding device to move so as to grind the probes of the probe card on the probe card mounting assembly.

8. The probe card OS testing device according to claim 1, characterized in that: The probe card mounting assembly includes a mounting frame and a mounting plate disposed on the mounting frame, wherein the mounting frame is mounted on the base, the mounting plate is disposed above the movable stage, and the mounting plate is configured to fix the probe card to be tested toward the direction of the movable stage.

9. A testing method based on the probe card OS testing device according to any one of claims 1 to 8, characterized in that: The method comprises: Controlling the movable stage to drive the conductive block and the insulating block to move, so that the conductive block or the insulating block contacts the probes of the probe card on the probe card mounting assembly, so as to form a plurality of test paths corresponding to the probes one by one or to insulate the top ends of the probes from each other; The open / short circuit test module is controlled to be connected to the test path or each probe in a preset manner, so as to perform an open / short circuit test on each probe of the probe card.

10. The testing method according to claim 9, characterized in that: The method further includes: when the conductive block contacts the probes, controlling the open-short circuit test module to be connected to each of the test paths and applying voltage separately; if the current value of the connected test path is zero, the probe corresponding to the test path is open.

11. The testing method according to claim 9, characterized in that: The method further includes: when the conductive block contacts the probes, controlling each switch to be turned on individually so that the power supply applies voltage to the turned-on test path; if the current value of the turned-on test path is zero, the probe corresponding to the test path is open.

12. The testing method according to claim 10 or 11, characterized in that: The method further includes: when each of the test paths is turned on and a voltage is applied separately, measuring whether the resistance value of the probe in the corresponding turned-on test path is within a normal range.

13. The testing method according to claim 9, characterized in that: The method further includes: when the insulating block contacts the probes, controlling the open-short circuit test module and the same end of the probes to be connected in pairs and applying a single-ended voltage to the connected probes; if the current values ​​of the two connected probes are not zero, the corresponding two probes are short-circuited.

14. The testing method according to claim 9, characterized in that: The method further includes: when the insulating block contacts the probes, controlling the switches to be turned on in pairs, so that the power supply applies a single-ended voltage to the two turned-on probes; if the current values ​​of the two turned-on probes are not zero, the corresponding two probes are short-circuited.

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