Vertical pluggable silicon light engine and assembling method thereof

Abstract

The invention discloses a vertical pluggable silicon light engine, which comprises a photoelectric chip assembly, a silicon light engine substrate, an optical fiber array plug, an array optical fiber and a turning reflection lens, and is characterized in that the photoelectric chip assembly is fixed on the bottom surface of the silicon light engine substrate; the turning and reflecting lens is fixed on the bottom surface of the silicon light engine substrate or fixed on the end surface of a silicon light chip coupler in the photoelectric chip assembly, the optical fiber array plug is arranged on the silicon light engine substrate in a pluggable manner, and the array optical fiber is inserted into the optical fiber array plug. The advantages are that the optical fiber and the optical fiber array are connected with the silicon optical engine in a plugging manner, the optical fiber and the optical fiber array are pulled out before the optical engine is welded with the substrate or the circuit board, and the optical fiber and the optical fiber array are plugged back again after the silicon optical engine is fixed through reflow soldering after SMT pasting. The invention further discloses an assembling method of the vertical pluggable silicon light engine, and the method facilitates the SMT welding process.

Description

Technical Field

[0001] The invention relates to a vertical pluggable silicon photonic engine and an assembling method thereof. Background Art

[0002] Silicon photonic chips for communication are currently developing towards higher speeds and higher integration. As the single-channel rate increases to 100G or even 200G, the circuit routing distance is required to be as short as possible. This requires the optoelectronic chip in the optical engine to be as close to the main chip ASIC (such as Serdes, xPU, etc.) as possible or to be sealed with the main chip, which generally requires the optical engine and the main chip ASIC to be soldered on the same substrate. In order to meet the requirements of soldering processes such as reflow soldering and operational convenience, how to achieve the pluggability of silicon photonics optical engines and optical fibers has become a top priority.

[0003] In the past, silicon photonics engines and optical fibers or optical fiber arrays were glued after coupling. During the high-temperature reflow soldering process, the glue was easily ineffective due to high temperature, causing the entire device to be scrapped. During the welding installation, the exposed long optical fiber also caused great trouble for welding assembly. Summary of the invention

[0004] The technical problem to be solved by the present invention is: how to achieve pluggability between a silicon photonics engine and an optical fiber or an optical fiber array.

[0005] In order to solve the above technical problems, the first purpose of the present invention is to propose a vertical pluggable silicon photonics engine, that is, the optical fiber or optical fiber array of the silicon photonics engine can be separated from the silicon photonics engine when in use, so as to realize the plugging and unplugging of the optical fiber or optical fiber array, and its plugging and unplugging direction is perpendicular to the plane of the substrate on which the optical engine is installed. Before the optical engine is welded to the substrate, the optical fiber or optical fiber array is unplugged first, and after the silicon photonics engine is mounted and reflow soldered, the optical fiber or optical fiber array can be re-inserted.

[0006] The specific technical solutions adopted are as follows: A vertical pluggable silicon photonics light engine, comprising an optoelectronic chip assembly, a silicon photonics light engine substrate, an optical fiber array plug, an array optical fiber and a turning reflective lens. The optoelectronic chip assembly is fixed on the bottom surface of the silicon photonic engine substrate, and the turning reflection lens is fixed on the bottom surface of the silicon photonic engine substrate or on the end face of the silicon photonic chip coupler of the optoelectronic chip assembly; the optical fiber array plug is arranged on the silicon photonic engine substrate in a pluggable manner, and the array optical fiber is arranged in the optical fiber array plug; the optical fiber array is aligned with the center position of the optical path groove on the silicon photonic engine substrate; and a lens is arranged in the optical fiber array plug.

[0007] Furthermore, the optoelectronic chip assembly is a silicon photonics optoelectronics hybrid packaging assembly, and one side of the silicon photonics chip of the optoelectronic chip assembly is bonded to the bottom side of the silicon photonics light engine substrate.

[0008] Furthermore, at least two positioning guide holes are provided on the optical fiber array plug, and the positioning guide holes are connected with positioning guide posts protruding from the top surface of the silicon photonic engine substrate. The positioning guide posts are provided to achieve matching and position positioning with the optical fiber array plug.

[0009] Furthermore, at least two positioning guide holes are provided on the optical fiber array plug, and the positioning guide holes are provided in a one-to-one correspondence with the positioning guide posts on the top surface of the silicon photonics light engine substrate. When in use, the positioning guide holes of the optical fiber array plug are aligned one by one with the positioning guide posts on the silicon photonics light engine substrate and inserted downward until the surface of the light engine substrate. The positioning guide holes on the optical fiber array plug are positioned so that after being connected with the positioning guide posts on the light engine substrate, the optical fiber array and the center position of the optical path groove on the silicon photonics light engine substrate are aligned.

[0010] Furthermore, positioning platforms are protruding outwardly provided on both sides of the optical fiber array plug, and elastic hooks with a T-shaped cross section are provided on the top surface of the silicon optical engine substrate corresponding to the positioning platforms. The elastic hooks are made of rubber.

[0011] Furthermore, both sides of the optical fiber array plug are provided with fixing springs, and the silicon optical engine substrate is provided with fixing hooks corresponding to the fixing springs. The fixing hooks are made of rigid material.

[0012] Furthermore, the silicon photonic engine substrate is made of metal, such as tungsten copper, which is used to fix the optoelectronic chip assembly and the optical fiber array plug, as well as to position the two relative to the silicon photonic engine substrate and dissipate heat.

[0013] Furthermore, a heat sink is also provided on the top surface of the silicon photonics optical engine substrate. The purpose is that the tungsten-copper metal substrate is a good thermal conductive material, which can effectively conduct the heat of the optoelectronic chip components and dissipate it into the air. Adding a heat sink on the optical engine substrate can further increase the heat dissipation area, improve the heat dissipation effect, and reduce the operating temperature of the optoelectronic chip.

[0014] Furthermore, the angle between the reflection surface of the turning reflection lens and its bottom surface is 42-48 degrees, the turning reflection lens is made of glass or silicon, and a dust cover is installed on the periphery of the turning reflection lens.

[0015] The purpose of the angle between the reflection surface of the turning reflection lens and its bottom surface is 42-48 degrees. The purpose is that the reflection surface changes the propagation direction of the light beam. The function of the turning reflection lens is to make a 90-degree turn in the propagation direction of the light beam, while avoiding large light reflections that affect the coupling effect. The reflection surface angle is 42-48.

[0016] Furthermore, the turning reflective lens is exposed to the air and is easily contaminated by environmental dust particles, which can block the optical path, increase the insertion loss of the optical path, reduce the input and output optical power, and cause the communication link to be interrupted. Adding a dust cover to the outside of the turning lens can effectively prevent dust particles from contaminating the lens and the end face of the optical component coupler, ensuring a clean optical path.

[0017] Furthermore, a dust cover and a dust plug are provided at the optical path groove on the silicon photonics optical engine substrate, and fixed ear seats are provided on both sides of the dust cover, and screw holes for screw fixing are also provided on the fixed ear seats. When the silicon photonics optical engine is separated from the optical fiber array plug, the dust plug is inserted into the dust cover provided on the silicon photonics optical engine substrate to prevent environmental dust particles from passing through the optical path groove of the silicon photonics optical engine substrate and falling onto the optical path reflection surface of the turning reflection lens fixed on the bottom surface of the silicon photonics optical engine substrate, thereby blocking the optical path, resulting in reduced coupling efficiency with the silicon photonics chip and increased loss. When the optical fiber array plug is connected to the silicon photonics optical engine substrate, the dust cap needs to be removed first.

[0018] Furthermore, the optoelectronic chip assembly is fixed on the bottom surface of the silicon photonic engine substrate by bonding or welding; the turning reflective lens is fixed on the bottom surface of the silicon photonic engine substrate by bonding or welding, or is fixed to the end surface of the silicon photonic chip coupler of the optoelectronic chip assembly by photolithography.

[0019] The second objective of the present invention is to provide an assembly method of a vertical pluggable silicon photonics engine, comprising the following steps:.

[0020] Step 1: The top surface of the silicon photonics light engine substrate faces upward, and a fiber array plug provided with array optical fibers is connected to the positioning guide pillars of the silicon photonics light engine substrate through positioning guide holes; Step 2, with the bottom surface of the silicon photonic engine substrate facing upward, place the optoelectronic chip assembly on the bottom surface of the silicon photonic engine substrate, align the coupler end surface of the silicon photonic chip in the optoelectronic chip assembly with the pre-marked positioning mark line on the bottom surface of the silicon photonic engine substrate, and fix it; Step 3: Adjust the position of the deflection reflective lens on the bottom surface of the silicon photonics light engine substrate, couple the deflection reflective lens with the optoelectronic chip component, and mount it on the bottom surface of the light engine substrate; Step 4: Separate the optical fiber array plug provided with the array optical fiber from the silicon optical engine substrate, insert the dust plug into the dust cover, and then place the assembly formed by the optoelectronic chip assembly, the turning reflective lens and the silicon optical engine substrate on the substrate or circuit board and fix it by reflow soldering; Step 5: Remove the dust plug, reinsert the fiber array plug, insert the positioning guide pins of the silicon photonics optical engine substrate into the positioning guide holes of the fiber array plug, and fix them to the silicon photonics optical engine substrate; Step 6: Fix the heat sink to the silicon photonic engine substrate and the assembly is complete.

[0021] Compared with the prior art, the present invention has the following beneficial effects: In the vertical pluggable silicon photonics optical engine of the present invention, the optical fiber or optical fiber array is pluggable with the silicon photonics optical engine through an optical fiber array plug. When the optical engine is welded to a substrate or a circuit board, the optical fiber array plug is first unplugged, and then the silicon photonics optical engine is welded to the substrate or the circuit board through reflow soldering, and then the optical fiber array plug is reinserted.

[0022] The vertical pluggable silicon photonic engine of the present invention simplifies the design of the pluggable optical interface structure. Compared with the existing disclosed solutions, it has fewer requirements for optical chips, a more stable structure, is easier to manufacture and mass produce, and has lower costs.

[0023] Compared with a non-pluggable optical fiber interface, the assembly method of the vertical pluggable silicon photonic engine of the present invention not only facilitates the SMT welding process, but also avoids the requirement that the optical fiber array and the optical fiber array plug optical path glue must withstand a high temperature of 270 degrees. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a first three-dimensional structural schematic diagram of a vertical pluggable silicon photonics engine according to Embodiment 1 of the present invention; Figure 2 It is a second three-dimensional structural schematic diagram of the vertical pluggable silicon photonics engine of Embodiment 1 of the present invention; Figure 3 is a front view of a vertical pluggable silicon photonics engine according to Embodiment 1 of the present invention; Figure 4 yes Figure 3 Left view of Figure 5 yes Figure 3 A top view of Figure 6 yes Figure 5 AA cut view; Figure 7 yes Figure 6 A magnified view of point B; Figure 8 is a cross-sectional view of Example 1 in which the optical fiber array plug is pulled out and the dust plug is inserted; Fig. 9 is a schematic diagram of the three-dimensional structure of a vertical pluggable silicon photonics engine of Example 3; Fig.10 is a front view of the vertical pluggable silicon photonics engine of Example 3; Among them, 1- optoelectronic chip assembly, 11- bottom solder ball, 2- silicon photonics light engine substrate, 21- pillar, 22- elastic hook, 23- positioning guide column, 24- optical path groove, 25- conical groove, 26- fixed hook, 3- optical fiber array plug, 31- second lens, 32- third lens, 33- fixed ear seat, 34- positioning guide hole, 35- positioning card platform, 36- fixed spring clip, 4- heat sink, 5- array optical fiber, 6- dust cover, 7- dust cover, 8- turning reflective lens, 10- dust plug. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the following Figure 1-Figure 10 The present invention is further described in detail with reference to the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. In addition, the technical features involved in each embodiment of the present invention described below can be combined with each other as long as they do not conflict with each other. Example 1

[0026] like Figure 1-7 As shown, this embodiment is a vertical pluggable silicon photonics light engine, including an optoelectronic chip component 1, a silicon photonics light engine substrate 2, an optical fiber array plug 3, an array optical fiber 5 and a turning reflective lens 8.

[0027] In traditional silicon photonics component packaging, optical fibers or optical fiber arrays are directly glued to the end faces of silicon photonics chip couplers using adhesive coupling. Figure 1-7 As shown, the silicon photonic chip in the optoelectronic chip assembly 1 is fixed on the bottom surface of the silicon photonic light engine substrate 2, and the array optical fiber 5 in the optical fiber array plug 3 can be vertically plugged in and out on the top surface of the silicon photonic light engine substrate 2.

[0028] like Figure 1 and 2 As shown, the optoelectronic chip assembly 1 is fixed on the bottom surface of the silicon photonic engine substrate 2, and the turning reflection lens 8 is fixed on the bottom surface of the silicon photonic engine substrate 2 or fixed on the end face of the silicon photonic chip coupler of the optoelectronic chip assembly 1; the optical fiber array plug 3 is arranged on the silicon photonic engine substrate 2 in a vertically pluggable manner, and the array optical fiber 5 is arranged in the optical fiber array plug 3; the optical fiber array 5 is aligned with the center position of the optical path groove 24 on the silicon photonic engine substrate 2; and a lens is arranged in the optical fiber array plug 3.

[0029] At the transmitting end of the silicon photonics light engine, the horizontal light emitted by the optoelectronic chip assembly 1 is transformed into collimated light and reflected by the deflection reflective lens 8. The reflected collimated light enters the optical fiber array plug 3 through the optical path groove 24 provided on the silicon photonics light engine substrate 2. The lens provided in the optical fiber array plug 3 focuses the received collimated light into the array optical fiber 5 provided in the optical fiber array plug 3. The array optical fiber 5 is connected to the external transmission optical fiber to transmit the optical signal. At the receiving end of the silicon photonics light engine, the external input optical signal enters the array optical fiber 5 arranged in the optical fiber array plug 3, and is converted into collimated light by the lens arranged in the optical fiber array plug 3. The collimated light is incident on the turning reflection lens 8 through the optical path groove 24 opened on the silicon photonics light engine substrate 2, and then reflected and focused in the coupler waveguide of the silicon photonics chip of the optoelectronic chip assembly 1.

[0030] like Figure 2 As shown, in this embodiment, the optoelectronic chip assembly 1 is a packaging assembly known to those skilled in the art. The optoelectronic chip assembly 1 is a 2.5D / 3D silicon photonic optoelectronic hybrid packaging assembly. The optoelectronic chip assembly 1 includes a silicon photonic chip, an electric chip, an electrical connection layer for interconnecting the silicon photonic chip and the electric chip, and a bottom solder ball 11. The optoelectronic chip assembly 1 is fixed on the silicon photonic light engine substrate 2 by gluing or welding, and the bottom surface of the silicon photonic light engine substrate 2 is bonded to one side of the silicon photonic chip in the optoelectronic chip assembly 1; the silicon photonic light engine substrate 2 also plays a role in heat dissipation for the optoelectronic chip assembly 1.

[0031] In this embodiment, the silicon photonics light engine substrate 2 is preferably made of tungsten copper, which is used to fix the optoelectronic chip assembly 1 and the optical fiber array plug 3, and to position the two relative to the silicon photonics light engine substrate 2 and to dissipate heat.

[0032] The deflection reflective lens 8 is fixed on the bottom surface of the silicon photonic light engine substrate 2 or integrated into the end surface of the silicon photonic chip coupler of the optoelectronic chip assembly 1 by photolithography.

[0033] The deflection reflective lens 8 is directly fixed on the silicon photonic engine substrate 2, which requires active coupling alignment and gluing or welding. The whole process is relatively complicated and time-consuming. This method is currently a common method in the industry.

[0034] The end face of the silicon photonic chip coupler is directly integrated with the lens through photolithography, which requires special manufacturing equipment, but can save the complicated lens active coupling. This solution can divide the turning reflection lens into two devices, the reflection prism and the lens. Only the lens is integrated into the optical chip through photolithography, while the prism is mounted on the bottom surface of the light engine substrate 2. The coupling mounting of the prism is relatively simple. The lens is integrated by photolithography, which saves the complicated, time-consuming and costly lens coupling step.

[0035] like Figure 6 and 7As shown, in this embodiment, preferably, the deflection reflective lens 8 can be bonded or welded to the bottom surface of the silicon light engine substrate 2; the bottom surface of the deflection reflective lens 8 is bonded to the bottom surface of the silicon light engine substrate 2. The silicon light engine substrate 2 also plays a role in heat dissipation. After the optoelectronic chip assembly 1 and the deflection reflective lens 8 are fixed to the silicon light engine substrate 2, the outgoing light of the optoelectronic chip assembly 1 becomes collimated light after passing through the deflection reflective lens 8.

[0036] like Figure 7 As shown, in this embodiment, the angle between the reflective surface of the turning reflective lens 8 and its bottom surface is 42-48 degrees, the material of the turning reflective lens 8 is glass or silicon, and a dust cover 6 is installed on the periphery of the turning reflective lens 8. The dust cover 6 covers the bottom surface of the silicon light engine substrate 2 and is fixed with screws.

[0037] like Figure 6 and 7 As shown, in the silicon photonics light engine of this embodiment, at the transmitting end of the silicon photonics light engine, the horizontal light emitted by the optoelectronic chip assembly 1 is transformed into collimated light and produces a 90-degree reflection after passing through the deflection reflective lens 8. The reflected collimated light enters the optical fiber array plug 3 through the optical path groove 24 provided on the silicon photonics light engine substrate 2. The lens provided in the optical fiber array plug 3 focuses the received collimated light onto the array optical fiber 5 provided in the optical fiber array plug 3, and the array optical fiber 5 is connected to the external transmission optical fiber. Further, in this embodiment, the array optical fiber 5 is connected to the transmission optical fiber through an optical fiber interface, such as: MPO / MTP / SN-MT, to transmit the optical signal to other network devices.

[0038] like Figure 6 and 7 As shown, at the receiving end of the silicon photonics light engine, the external input optical signal enters the array optical fiber 5 in the optical fiber array plug 3, and is converted into collimated light by the lens arranged in the optical fiber array plug 3. The collimated light passes through the optical path groove 24 opened on the silicon photonics light engine substrate 2 and is incident on the turning reflection lens 8 and then focused in the coupler waveguide of the silicon photonics chip in the optoelectronic chip assembly 1.

[0039] In this embodiment, the optical fiber array plug 3 can be manufactured by resin injection molding, and the array optical fiber injection molding in the optical array plug has optical fiber holes matching multiple array optical fibers 5, and has a second lens 31 and a third lens 32 built in, wherein the third lens 32 can be omitted. The lens material can be glass or other materials such as silicon.

[0040] like Figure 7 As shown, the second lens 31 and the third lens 32 are respectively located at the end face of the optical fiber array in the optical fiber array plug 3 and the end face of the optical fiber array plug 3. The second lens 31 and the third lens 32 are used to convert the divergent light from the optical fiber array 5 into collimated light, or to focus the collimated light from the turning reflection lens 8 into the optical fiber array 5.

[0041] like Figure 7 As shown, in this embodiment, a tapered groove 25 is designed on the silicon photonic light engine substrate 2 at a position close to the third lens 32 to avoid the third lens 32 .

[0042] In this embodiment, the manufacturing method of the optical fiber array plug 3 with the array optical fiber 5 is known to those skilled in the art, and is preferably manufactured by integrated injection molding of resin.

[0043] like Figure 6-8 As shown, in this embodiment, the optical fiber array plug 3 is vertically inserted into the silicon photonic engine substrate 2, and the array optical fiber 5 cooperates with the positioning guide post 23 on the top surface of the silicon photonic engine substrate 2 through the positioning guide hole 31 in the optical fiber array plug 3, so as to realize the relative positioning of the optical fiber array 5 and the center of the optical path groove 24 on the silicon photonic engine substrate 2.

[0044] like Figure 1 , 2 As shown in FIG4 , in this embodiment, the optical fiber array plug 3 is vertically inserted into the silicon optical engine substrate 2 and fixed. Specifically: The optical fiber array plug 3 is inserted vertically, and positioning platforms 35 are protrudingly provided at the lower ends of both side surfaces of the optical fiber array plug 3. An elastic hook 22 with a T-shaped cross-section is provided on the top surface of the silicon photonic engine substrate 2 corresponding to the positioning platform 35. During the descending process of the optical fiber array plug 3, the two elastic hooks 22 are squeezed and deformed until the optical fiber array plug 3 descends to contact the top surface of the silicon photonic engine substrate 2. At this time, the positioning platform 35 passes over the elastic hook 22. After the elastic hook 22 is reset, it clamps the positioning platform 35.

[0045] The elastic hook 22 is made of rubber. There are many ways to install the elastic hook 22. In this embodiment, preferably, a groove is made on the silicon photonic engine substrate 2, and the bottom size of the elastic hook 22 is slightly larger than the groove size. The elastic hook 22 is pressed into the silicon photonic engine substrate 2 by mechanical force and fixed by friction and mechanical force.

[0046] like Figure 8As shown, in this embodiment, a dust cover 7 and a dust plug 10 are provided at the optical path groove 24 on the silicon photonic light engine substrate 2, and a fixing ear seat 33 is provided at the lower end of the two side surfaces of the dust cover 7, and a screw hole for screw fixing is provided on the fixing ear seat 33, and the dust cover 7 is fixed to the silicon photonic light engine substrate 2 by screwing a screw into the screw hole. When the silicon photonic light engine is separated from the optical fiber array plug 3, the dust plug 10 is inserted into the dust cover 7 provided on the silicon photonic light engine substrate 2 to prevent environmental dust particles from passing through the optical path groove 24 of the silicon photonic light engine substrate 2 and falling onto the optical path reflection surface of the turning reflection lens 8 fixed on the bottom surface of the silicon photonic light engine substrate 2, thereby blocking the optical path, resulting in a decrease in coupling efficiency with the silicon photonic chip and an increase in loss. When the optical fiber array plug 3 is connected and matched with the silicon photonic light engine substrate 2, the dust plug 10 needs to be removed first.

[0047] like Figure 8 As shown, the dust plug 10 replaces the original fiber array plug 3 to prevent dust. After the silicon photonics optical engine passes the reflow soldering, the dust plug 10 is unplugged, and the fiber array plug 3 with the array optical fiber is replugged. Therefore, in the vertical pluggable silicon photonics optical engine of this embodiment, the fiber array plug 3 can use ordinary UV glue and optical resin, and does not need to withstand reflow soldering at about 270 degrees.

[0048] like Figure 1-8 As shown, in this embodiment, a heat sink 4 is provided on the top surface of the silicon photonic engine substrate 2 to further enhance the heat dissipation effect. In this embodiment, the light engine is equipped with a heat sink, which is suitable for the scene of assembling and using a single silicon photonic engine. The heat sink can be configured together with the silicon photonic engine; when multiple silicon photonic engines are required to be placed side by side or sealed with ASIC chips (such as switch chips, xPU chips), a single silicon photonic engine does not need to be equipped with a heat sink separately. The equipment manufacturer will uniformly design and install heat sinks for the heat dissipation of multiple light engines according to the system structure requirements. Example 2

[0049] A method for assembling a vertical pluggable silicon photonics engine comprises the following steps: Step 1: The top surface of the silicon light engine substrate 2 faces upward, and the optical fiber array plug 3 is connected to the positioning guide column 23 on the silicon light engine substrate 2 through the positioning guide hole 34; the elastic hook 22 on the top surface of the silicon light engine substrate 2 and the positioning card platform 35 on both sides of the optical fiber array plug 3 cooperate to fix the optical fiber array plug 3 and the silicon light engine substrate 2; Step 2, with the bottom surface of the silicon photonic engine substrate 2 facing upward, place the optoelectronic chip assembly 1 on the bottom surface of the silicon photonic engine substrate 2, align the coupler end surface of the silicon photonic chip in the optoelectronic chip assembly 1 with the pre-marked positioning mark line on the bottom surface of the silicon photonic engine substrate 2, and fix them by gluing or welding; Step 3, adjusting the position of the deflection reflective lens 8 on the bottom surface of the silicon photonic light engine substrate 2, coupling the deflection reflective lens 8 with the optoelectronic chip assembly 1 and mounting them on the bottom surface of the light engine substrate; The steps are as follows: S31, insert the array optical fiber 5 into the optical fiber array plug 3, connect the array optical fiber 5 in the optical fiber array plug 3 to the external light source and optical power meter; connect the optical engine test fixture to the bottom solder ball or bump of the optoelectronic chip assembly 1, and then power on the optoelectronic chip assembly 1, the light source and the optical power meter respectively; S32, coupling and mounting the turning reflection lens 8 and the optoelectronic chip assembly 1, adjusting the position of the turning reflection lens 8 on the bottom surface of the silicon photonics light engine substrate 2, so that the optical power of the light beam from the optical fiber array coupled into the optoelectronic chip assembly through the turning reflection lens is maximized, and the optical power of the light emitted by the optoelectronic chip assembly 1 entering the array optical fiber 5 in the optical fiber array plug through the turning reflection lens 8 is maximized, and fixing the turning reflection lens 8 to the bottom surface of the silicon photonics light engine substrate 2; Step 4, separate the optical fiber array plug 3 provided with the array optical fiber from the silicon optical light engine substrate 2, insert the dust plug 10 into the dust cover 7, and then place the assembly formed by the optoelectronic chip assembly 1, the turning reflective lens 8 and the silicon optical light engine substrate 2 on the substrate or circuit board and fix it by reflow soldering; Step 5, remove the dust plug 10, reinsert the optical fiber array plug 3, insert the positioning guide pin 23 of the optical engine substrate into the positioning guide hole of the optical fiber array plug 3, and fix it to the silicon photonics optical engine substrate 2; Step 6: Fix the heat sink 4 to the silicon photonic engine substrate 2, and the assembly is completed. Example 3

[0050] Based on the embodiment 1, the present embodiment is different from the embodiment 1 in that the optical fiber array plug 3 and the silicon photonics engine substrate 2 are quickly plugged in and out of the structure.

[0051] like Fig. 9 and 10 As shown, specifically: in this embodiment, both sides of the optical fiber array plug 3 are provided with fixing springs 36, and the silicon photonic engine substrate 2 is provided with fixing hooks 26 corresponding to the fixing springs 36, and the fixing hooks 26 are rigid parts.

[0052] In this embodiment, the optical fiber array plug 3 is vertically inserted into the silicon optical engine substrate 2 and fixed. Specifically: The positioning guide hole of the optical fiber array plug 3 is aligned with the positioning guide column on the optical engine substrate 2 and inserted vertically downward. The fixed spring pieces on the optical engine substrate squeeze the fixed spring pieces 36 on both sides of the optical fiber array plug 3, so that the fixed spring pieces 36 are close to the two side edges of the optical fiber array plug 3. At this time, the size of the optical fiber array plug 3 is smaller than the distance between the two fixed hooks 26 until it contacts the top surface of the silicon photonics optical engine substrate 2. At this time, the fixed spring pieces 36 on both sides of the optical fiber array plug 3 are restored and the fixed hooks 26 are clamped.

[0053] It will be easily understood by those skilled in the art that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A vertical pluggable silicon photonics engine, characterized in that: The silicon photonics light engine comprises an optoelectronic chip assembly (1), a silicon photonics light engine substrate (2), an optical fiber array plug (3), an array optical fiber (5) and a deflection reflection lens (8); the optoelectronic chip assembly (1) is fixed on the bottom surface of the silicon photonics light engine substrate (2); the deflection reflection lens (8) is fixed on the bottom surface of the silicon photonics light engine substrate (2) or on the end surface of the silicon photonics chip coupler of the optoelectronic chip assembly (1); the optical fiber array plug (3) is arranged on the silicon photonics light engine substrate (2) in a pluggable manner, and the array optical fiber (5) is arranged in the optical fiber array plug (3); the optical fiber array (5) is aligned with the center position of the optical path groove (24) on the silicon photonics light engine substrate (2); and a lens is arranged in the optical fiber array plug (3).

2. The vertical pluggable silicon photonics engine according to claim 1, characterized in that: The optoelectronic chip assembly (1) is a silicon-photonics-optoelectronics hybrid packaging assembly, wherein one side of the silicon-photonics chip of the optoelectronic chip assembly (1) is bonded to the bottom side of a silicon-photonics light engine substrate (2).

3. The vertical pluggable silicon photonics engine according to claim 1, characterized in that: At least two positioning guide holes (34) are arranged on the optical fiber array plug (3), and the positioning guide holes (34) are matched and connected with positioning guide pillars (23) protruding from the top surface of the silicon photonic engine substrate (2).

4. The vertical pluggable silicon photonics engine according to claim 1, characterized in that: Positioning platforms (35) are protrudingly provided on both sides of the optical fiber array plug (3), and an elastic hook (22) with a T-shaped cross section is provided on the top surface of the silicon photonic engine substrate (2) corresponding to the positioning platforms (35).

5. The vertical pluggable silicon photonics engine according to claim 1, characterized in that: Both sides of the optical fiber array plug (3) are provided with fixing springs (36), and the silicon photonic engine substrate (2) is provided with fixing hooks (26) corresponding to the fixing springs (36).

6. The vertical pluggable silicon photonics engine according to claim 1, characterized in that: The silicon photonics light engine substrate (2) is made of metal; a heat sink (4) is arranged on the top surface of the silicon photonics light engine substrate (2).

7. The vertical pluggable silicon photonics engine according to claim 1, characterized in that: The angle between the reflection surface of the turning reflection lens (8) and its bottom surface is 42-48 degrees. The turning reflection lens (8) is made of glass or silicon. A dust cover plate (6) is installed on the periphery of the turning reflection lens (8).

8. The vertical pluggable silicon photonics engine according to claim 1, characterized in that: A dustproof cover (7) and a dustproof plug (10) are arranged at the optical path groove (24) on the silicon photonic engine substrate (2), and fixing ear seats (33) are arranged on both sides of the dustproof cover (7), and screw holes for screw fixing are also provided on the fixing ear seats (33).

9. The vertical pluggable silicon photonics engine according to claim 1, characterized in that: The optoelectronic chip assembly (1) is fixed on the bottom surface of a silicon photonic engine substrate (2) by bonding or welding; the turning reflection lens (8) is fixed on the bottom surface of the silicon photonic engine substrate (2) by bonding or welding, or is fixed to the end surface of a silicon photonic chip coupler of the optoelectronic chip assembly by photolithography.

10. The method for assembling a vertical pluggable silicon photonics engine according to any one of claims 1 to 9, characterized in that: The steps include: Step 1: The top surface of the silicon photonics light engine substrate (2) faces upwards, and the optical fiber array plug (3) provided with the array optical fiber (5) is connected to the positioning guide column (23) of the silicon photonics light engine substrate (2) through the positioning guide hole (34); Step 2: With the bottom surface of the silicon photonic engine substrate (2) facing upward, place the optoelectronic chip assembly (1) on the bottom surface of the silicon photonic engine substrate (2), align the coupler end surface of the silicon photonic chip in the optoelectronic chip assembly (1) with the pre-marked positioning mark line on the bottom surface of the silicon photonic engine substrate (2), and fix them; Step 3: adjusting the position of the deflection reflective lens (8) on the bottom surface of the silicon photonics light engine substrate (2), coupling the deflection reflective lens (8) with the optoelectronic chip assembly (1), and mounting the deflection reflective lens (8) on the bottom surface of the light engine substrate; Step 4, separating the optical fiber array plug (3) provided with the array optical fiber from the silicon photonics light engine substrate (2), inserting the dust plug (10) into the dust cover (7), and then placing the assembly formed by the optoelectronic chip assembly (1), the turning reflective lens (8) and the silicon photonics light engine substrate (2) on the substrate or circuit board and fixing it by reflow soldering; Step 5, remove the dust plug (10), reinsert the optical fiber array plug (3), insert the positioning guide post (23) of the silicon photonics optical engine substrate (2) into the positioning guide hole of the optical fiber array plug (3) and fix it to the silicon photonics optical engine substrate (2); Step 6: Fix the heat sink (4) to the silicon photonic engine substrate (2) to complete the assembly.

Images