Display module and manufacturing method thereof

Abstract

The application provides a display module, which comprises a display substrate, an adhesive layer and a coil substrate. The display substrate comprises an insulating layer, a first lamp bead and a second lamp bead arranged side by side on one side of the insulating layer, and a first circuit and a second circuit arranged side by side on the other side of the insulating layer, the first lamp bead is electrically connected to the first circuit, and the second lamp bead is electrically connected to the second circuit. The adhesive layer is arranged on the side of the display substrate provided with the first circuit and the second circuit, and the adhesive layer is provided with an opening. The coil substrate is arranged on the side of the adhesive layer away from the first circuit and the second circuit, the coil substrate covers the opening to form a closed cavity, and the coil substrate comprises a coil, a magnetic insulating layer and a suspension. The coil is arranged on the magnetic insulating layer, the suspension is movably arranged in the closed cavity through electromagnetic induction with the coil, and the on-off of the first circuit and the second circuit is realized. In addition, the application also provides a manufacturing method of the display module.

Description

TECHNICAL FIELD

[0001] The present application relates to the display field, and particularly to a display module and a manufacturing method thereof. BACKGROUND

[0002] As a backlight source of a display screen, micro light emitting diodes improve contrast and brightness by increasing the number of backlight partitions and lamp beads. More backlight partitions can achieve delicate brightness control, and more lamp beads can achieve higher brightness and more uniform distribution.

[0003] At present, each increase in a backlight partition requires an increase in independent wiring and parts, resulting in complex circuit board design. When higher resolution is pursued, wiring density and layout become challenges, limiting the increase in the number of lamp beads. SUMMARY

[0004] Therefore, it is necessary to provide a display module that can simplify wiring and reduce parts while increasing the number of lamp beads and improving display performance.

[0005] In addition, it is also necessary to provide a manufacturing method of the display module.

[0006] A manufacturing method of a display module includes the following steps:

[0007] A display substrate is provided, which includes an insulating layer, a first lamp bead, a second lamp bead, a first circuit, and a second circuit. The first lamp bead and the second lamp bead are arranged side by side on one side of the insulating layer, and the first circuit and the second circuit are arranged side by side on the other side of the insulating layer. The first lamp bead is electrically connected to the first circuit, and the second lamp bead is electrically connected to the second circuit.

[0008] An adhesive layer is arranged on the side of the display substrate where the first circuit and the second circuit are arranged. The adhesive layer is provided with an opening, and part of the first circuit and part of the second circuit are exposed to the opening.

[0009] A coil substrate is arranged on the side of the adhesive layer away from the first circuit and the second circuit. The coil substrate covers the opening to form a closed cavity. The coil substrate includes a magnetic insulating layer, a coil, and a suspension. The coil is arranged on the magnetic insulating layer, the magnetic insulating layer has an external magnetic field, and the suspension is movably arranged in the closed cavity. The display module includes a first state and a second state.

[0010] In the first state, the coil is supplied with a first high-frequency current, the levitation member induces the first high-frequency current and generates a first eddy current, the first eddy current forms a first Lorentz force in the external magnetic field, the first Lorentz force is greater than the gravity of the levitation member, so that the two ends of the levitation member are in communication with the first line and the second line respectively, so that the first lamp bead and the second lamp bead are in electrical communication.

[0011] In the second state, the coil is supplied with a second high-frequency current, the second high-frequency current is less than the first high-frequency current, the levitation member induces the second high-frequency current and generates a second eddy current, the second eddy current forms a second Lorentz force in the external magnetic field, the second Lorentz force is less than the gravity of the levitation member, so that the two ends of the levitation member are separated from the first line and the second line respectively, so that the first lamp bead and the second lamp bead are electrically disconnected.

[0012] In some embodiments, the display substrate further comprises a first conductive body and a second conductive body embedded in the insulating layer, the first conductive body connects the first lamp bead and the first line, and the second conductive body connects the second lamp bead and the second line. The manufacturing method of the display substrate comprises the steps of: providing a first copper-clad substrate, the first copper-clad substrate comprising the insulating layer and a first copper foil layer arranged on one side of the insulating layer. Etching the first copper foil layer to form a first line layer, the first line layer comprising the first line and the second line. Etching the insulating layer to form a first opening and a second opening, part of the first line is exposed in the first opening, and part of the second line is exposed in the second opening. The first conductive body is arranged in the first opening, and the first line is connected to one end of the first conductive body. The second conductive body is arranged in the second opening, and the second line is connected to one end of the second conductive body. The first lamp bead and the second lamp bead are arranged on the side of the insulating layer away from the first line layer, the first lamp bead is connected to the other end of the first conductive body, and the second lamp bead is connected to the other end of the second conductive body, thereby obtaining the display substrate.

[0013] In some embodiments, the coil substrate further comprises an active element disposed on a side of the magnetic insulation layer away from the closed cavity, the active element electrically connected to the coil. The manufacturing method of the coil substrate comprises the steps of: providing a second copper clad substrate, the second copper clad substrate comprising a second carrier plate and a second copper foil layer disposed on a side of the second carrier plate. Etching the second copper foil layer to form a second circuit layer, the second circuit layer comprising the coil, the coil having a coil slot, and part of the second carrier plate exposed in the coil slot. Disposing the magnetic insulation layer on the second circuit layer, part of the magnetic insulation layer filling the coil slot. Removing the second carrier plate so that the coil is exposed on a side of the magnetic insulation layer. Disposing the suspension on the coil, and disposing the active element on a side of the magnetic insulation layer away from the suspension to obtain the coil substrate.

[0014] In some embodiments, after the step of "removing the first carrier plate" and before the step of "disposing the suspension on the coil", the method further comprises: disposing a second carrier plate on a side of the magnetic insulation layer away from the suspension. After the step of "disposing the coil substrate on a side of the adhesive layer away from the first circuit and the second circuit", the method further comprises: removing the second carrier plate so that the magnetic insulation layer is exposed. Disposing a slot on a side of the magnetic insulation layer away from the suspension, part of the coil being exposed in the slot, and disposing the active element on the magnetic insulation layer, the active element comprising a body and a pin connected to the body, the pin being inserted into the slot to electrically connect to the coil.

[0015] In some embodiments, the active element comprises a control chip.

[0016] In some embodiments, the material of the suspension is graphene.

[0017] A display module includes a display substrate, an adhesive layer, and a coil substrate. The display substrate includes an insulating layer, a first lamp bead, a second lamp bead, a first circuit, and a second circuit. The first lamp bead and the second lamp bead are arranged side by side on one side of the insulating layer. The first circuit and the second circuit are arranged side by side on the other side of the insulating layer. The first lamp bead is electrically connected to the first circuit. The second lamp bead is electrically connected to the second circuit. The adhesive layer is arranged on the side of the display substrate on which the first circuit and the second circuit are arranged. The adhesive layer is provided with an opening. Part of the first circuit and part of the second circuit are exposed to the opening. The coil substrate is arranged on the side of the adhesive layer away from the first circuit and the second circuit. The coil substrate covers the opening to form an enclosed cavity. The coil substrate includes a coil, a magnetic insulating layer, and a floating element. The coil is arranged on the magnetic insulating layer. The magnetic insulating layer has an external magnetic field. The floating element is movably arranged in the enclosed cavity. The display module includes a first state and a second state.

[0018] In the first state, the coil is supplied with a first high-frequency current. The floating element induces the first high-frequency current and generates a first eddy current. The first eddy current forms a first Lorentz force in the external magnetic field. The first Lorentz force is greater than the gravity of the floating element. The two ends of the floating element are respectively in communication with the first circuit and the second circuit. The first lamp bead and the second lamp bead are electrically connected.

[0019] In the second state, the coil is supplied with a second high-frequency current. The second high-frequency current is smaller than the first high-frequency current. The floating element induces the second high-frequency current and generates a second eddy current. The second eddy current forms a second Lorentz force in the external magnetic field. The second Lorentz force is smaller than the gravity of the floating element. The two ends of the floating element are respectively separated from the first circuit and the second circuit. The first lamp bead and the second lamp bead are electrically disconnected.

[0020] In some embodiments, the coil substrate further includes an active element. The active element is arranged on the side of the magnetic insulating layer away from the enclosed cavity. The active element is electrically connected to the coil.

[0021] In some embodiments, the side of the magnetic insulating layer away from the enclosed cavity is provided with a slot. Part of the coil is exposed to the slot. The active element includes a main body and a pin connected to the main body. The main body is arranged on the side of the magnetic insulating layer away from the enclosed cavity. The pin is inserted into the slot and electrically connected to the coil.

[0022] In some embodiments, the levitation element includes a levitation body and two contacts disposed on one side of the levitation body, the two contacts being disposed on the side of the levitation body facing away from the coil.

[0023] The manufacturing method of the display module provided in this application confines the suspended component within a closed cavity and controls the position of the suspended component using electromagnetic induction and the Lorentz principle, thereby achieving connection control of the first and second LED chips. Simultaneously, the design separates the coil substrate controlling the first and second LED chips from the display substrate on different layers, which simplifies wiring and reduces the number of components, while also increasing the space available for arranging the first and second LED chips, or increasing the LED chip arrangement density, thereby improving the performance of the display module. Attached Figure Description

[0024] Figure 1 This is a cross-sectional schematic diagram of a first copper-clad substrate provided in an embodiment of this application.

[0025] Figure 2 For etching Figure 1 The diagram shows a cross-sectional view of the first copper foil layer after it has been used to form the first circuit layer.

[0026] Figure 3 for Figure 2 The diagram shows a cross-sectional view of the insulating layer after the first and second openings are provided.

[0027] Figure 4 for Figure 3 The diagram shows a cross-section after a first conductor is installed in the first opening and a second conductor is installed in the second opening.

[0028] Figure 5 for Figure 4 The diagram shows a cross-sectional view of a display substrate formed by connecting a first conductor to a first LED and a second conductor to a second LED.

[0029] Figure 6 This is a cross-sectional schematic diagram of a second copper-clad substrate provided in an embodiment of this application.

[0030] Figure 7 For etching Figure 6 The diagram shows a cross-sectional view of the second copper foil layer after it has been used to form the second circuit layer.

[0031] Figure 8 for Figure 7 The diagram shows a cross-section of the second circuit layer after a magnetic insulating layer has been installed.

[0032] Figure 9 To remove Figure 8 The diagram shows a cross-section of the first carrier plate.

[0033] Figure 10 Fig. 8 is a cross-sectional view of the display module in the first state. Figure 9 Fig. 9 is a cross-sectional view of the display module after the second carrier plate is arranged on the magnetic insulation layer shown in Fig. 8.

[0034] Figure 11 Fig. 10 is a cross-sectional view of the coil substrate intermediate formed after the coil is arranged on the levitatable body shown in Fig. 9. Figure 10 Fig. 11 is a cross-sectional view of the coil intermediate and the adhesive laminated after the coil intermediate shown in Fig. 10 and the adhesive are laminated.

[0035] Figure 12 Fig. 12 is a cross-sectional view of the display substrate shown in Fig. 8, the coil intermediate shown in Fig. 11, and the adhesive laminated after the coil intermediate and the adhesive are laminated. Figure 5 Fig. 13 is a cross-sectional view of the coil substrate after the slot is arranged on the magnetic insulation layer of the coil substrate shown in Fig. 12. Figure 11

[0036] Figure 13 Fig. 14 is a cross-sectional view of the coil intermediate after the second carrier plate is removed from the coil intermediate shown in Fig. 13. Figure 12

[0037] Figure 14 Fig. 15 is a cross-sectional view of the display module in the second state after the active element is arranged on the magnetic insulation layer shown in Fig. 14. Figure 13

[0038] Figure 15 Fig. 16 is a cross-sectional view of the display module in the first state after the active element is arranged on the magnetic insulation layer shown in Fig. 15. Figure 14

[0039] Figure 16 Fig. 17 is a cross-sectional view of the display module in the second state after the active element is arranged on the magnetic insulation layer shown in Fig. 16. Figure 15

[0040] Main component symbol explanation

[0041]

[0042] The following detailed description will further describe the present application in conjunction with the above-mentioned drawings. Detailed description

[0043] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all.

[0044] It should be noted that when one component is considered to be "arranged on" another component, it can be directly arranged on the other component or there can be a middle component.

[0045] Please refer to Figures 1 to 15 An embodiment of the present application provides a manufacturing method of a display module 100, which can be applied to a display screen of an electronic product, and the manufacturing method specifically comprises:

[0046] S1: Please refer to Figures 1 to 5 ​​​​​The display substrate 10 includes an insulating layer 11, a first lamp bead 12, a second lamp bead 13, a first line 14 and a second line 15. The first lamp bead 12 and the second lamp bead 13 are arranged side by side on one side of the insulating layer 11. The first line 14 and the second line 15 are arranged side by side on the other side of the insulating layer 11. The first lamp bead 12 is electrically connected to the first line 14, and the second lamp bead 13 is electrically connected to the second line 15.

[0047] In the embodiment, the manufacturing method of the display substrate 10 specifically includes the following steps:

[0048] S11: Please refer to Figure 1 A first copper-clad substrate 16 is provided, which is a single-sided copper-clad substrate. The first copper-clad substrate 16 includes the insulating layer 11 and a first copper foil layer 162 arranged on one side of the insulating layer 11.

[0049] In the embodiment, the material of the insulating layer 11 in step S1 includes at least one of polyimide (PI), liquid crystal polymer (LCP), phenolic epoxy resin (EP), poly tetra fluoroethylene (PTFE), polyetheretherketone (PEEK), polyphenylene oxide (PPO), polyimide (PI), polyethyleneterephthalate (PET) and polyethylene naphthalate (PEN). Preferably, the material of the insulating layer 11 is polyimide.

[0050] S12: Please refer to Figure 2 The first copper foil layer 162 is etched to form a first line layer 17, which includes two spaced-apart first lines 14 and two spaced-apart second lines 15. Adjacent first lines 14 and second lines 15 are electrically isolated.

[0051] In the embodiment, the first line layer 17 in step S2 is made by using dry film, exposure and development, chemical etching and other processes. It can be understood that in other embodiments of the present application, the first line layer 17 can be made by machine tool processing, laser etching and other methods.

[0052] S13: Please refer to Figure 3S1: Please refer to

[0053] In the embodiment, the first opening 111 and the second opening 112 are formed by dry film, exposure and development, and etching. It can be understood that in other embodiments of the present application, the first opening 111 and the second opening 112 can be made by machine tool processing, laser etching, etc.

[0054] S14: Please refer to Figure 4 A first conducting body 18 is arranged in the first opening 111, and a second conducting body 19 is arranged in the second opening 112. One end of the first conducting body 18 is connected to the first line 14. One end of the second conducting body 19 is connected to the second line 15. The first conducting body 18 and the second conducting body 19 are both tin paste. It can be understood that in other embodiments of the present application, the first conducting body 18 and the second conducting body 19 can also be conductive glue.

[0055] S15: Please refer to Figure 5 The first lamp bead 12 and the second lamp bead 13 are arranged on the side of the insulating layer 11 away from the first line layer 17. The first lamp bead 12 is connected to the other end of the first conducting body 18. The second lamp bead 13 is connected to the other end of the second conducting body 19, obtaining the display substrate 10. That is, the first lamp bead 12 is connected to the first line 14 through the first conducting body 18, and the second lamp bead 13 is connected to the second line 15 through the second conducting body 19, so as to improve the stability of the connection of the first lamp bead 12 and the second lamp bead 13 to the first conducting body 18 and the second conducting body 19, respectively. The first lamp bead 12 and the second lamp bead 13 are both micro light emitting diodes.

[0056] S2: Please refer to Figure 12 An adhesive layer 20 is arranged on the side of the display substrate 10 provided with the first line layer 17. The adhesive layer 20 is provided with an opening 21, and part of the first line 14 and part of the second line 15 are exposed to the opening 21. The adhesive layer 20 includes one of epoxy glue, acrylic glue, silicone glue, and polyurethane glue. The adhesive layer 20 can realize stable connection with the display substrate 10 and the coil substrate intermediate 30.

[0057] S3: Please refer to Figure 12A coil substrate intermediate body 30 is arranged on the side of the adhesive layer 20 away from the first circuit layer 17. The coil substrate intermediate body 30 covers the opening 21 to form a closed cavity 22. The coil substrate intermediate body 30 includes a magnetic insulation layer 33, a coil 31, and a levitator 32. The coil 31 is embedded in the magnetic insulation layer 33 and exposed to the closed cavity 22, and the levitator 32 is movably arranged in the closed cavity 22. The coil 31 is used to pass high-frequency current. The magnetic insulation layer 33 is used to generate an external magnetic field, and the levitator 32 can sense the high-frequency current and generate eddy current. According to the Lorentz Principle, the eddy current can generate Lorentz force acting on the levitator 32 in the external magnetic field. The Lorentz force and gravity jointly act on the levitator 32 and are in opposite directions. In this way, by controlling the size of the high-frequency current in the coil 31, the size relationship between the Lorentz force and gravity can be changed, and thus the position of the levitator 32 in the closed cavity 22 can be controlled. Specifically, the frequency of the high-frequency current is generally between hundreds of kilohertz (kHz) and several megahertz (MHz).

[0058] In the embodiment, referring to Figures 6 to 11 , the coil substrate intermediate body 30 in step S3 further includes a first carrier plate 341. The first carrier plate 341 is arranged on the side of the magnetic insulation layer 33 away from the closed cavity 22. The first carrier plate 341 is used to support the coil 31 and the magnetic insulation layer 33. Specifically, the manufacturing method of the coil substrate intermediate body 30 includes the following steps:

[0059] S31: Referring to Figure 6 , a second copper-clad substrate 34 is provided. The second copper-clad substrate 34 includes a first carrier plate 341 and a second copper foil layer 342 arranged on one side of the first carrier plate 341. The first carrier plate 341 includes a first carrier layer 341a and a first protective layer 341b. The first carrier layer 341a can be separated from the second copper foil layer 342, and the first protective layer 341b is used to protect the first carrier layer 341a. The first carrier layer 341a includes one of FR-4 with a release layer, an aluminum substrate, polyimide, and polyester film. The material of the first protective layer 341b includes one of glass fiber reinforced epoxy resin, polyimide, and polytetrafluoroethylene.

[0060] S32: Referring to Figure 7 , the second copper foil layer 342 is etched to form a second circuit layer 35, and the second circuit layer 35 includes the coil 31. The coil 31 is generally in a spiral shape, and the coil 31 has a coil slot 352, and part of the first carrier layer 341a is exposed to the coil slot 352.

[0061] In the present embodiment, the second copper foil layer 342 is formed by processes such as dry film, exposure and development, and chemical etching. It can be understood that in other embodiments of the present application, the second copper foil layer 342 can be formed by machine tool processing or laser ablation.

[0062] S33: Please refer to Figure 8 , the magnetic insulation layer 33 is arranged on the second circuit layer 35, and part of the magnetic insulation layer 33 fills the coil groove 352. Specifically, the magnetic insulation layer 33 is a magnetic insulation material, and the magnetic insulation layer 33 is ferrite.

[0063] S34: Please refer to Figure 9 , the first carrier plate 341 is removed, so that one side of the coil 31 is exposed to one side of the magnetic insulation layer 33.

[0064] S35: Please refer to Figure 10 , a second carrier plate 37 is arranged on the other side of the magnetic insulation layer 33, and the second carrier plate 37 includes a second carrier layer 371 and a second protective layer 372. The second carrier layer 371 is arranged between the second protective layer 372 and the magnetic insulation layer 33. The second carrier plate 37 is used to provide necessary support and stability for the coil 31, and reduce the risk of damage to the coil 31 caused by the pressing process in step S3. It can be understood that in other embodiments of the present application, if the structural stability of the coil 31 itself is sufficient to resist deformation and other damage in the pressing process in step S3, step S35 can be omitted.

[0065] S35: Please refer to Figure 11 , the suspension 32 is arranged on the exposed coil 31 to obtain the coil substrate intermediate 30. The suspension 32 is a graphene sheet. It can be understood that in other embodiments of the present application, the suspension 32 can be other materials that can induce high-frequency current and generate eddy current, such as copper, aluminum, ferrite, nickel-iron alloy, iron, etc.

[0066] In the present embodiment, the suspension 32 is generally in the form of a sheet, and the suspension 32 includes a suspension body 321 and two contact bodies 322 arranged on one side of the suspension body 321. The two contact bodies 322 are arranged on the side of the suspension body 321 away from the coil 31. The thickness of the suspension body 321 is 5-30 microns, and the thickness of the contact body 322 is 1-5 microns. The two contact bodies 322 are used to connect the first circuit 14 and the second circuit 15 respectively, thereby realizing the connection between the first circuit 14 and the second circuit 15.

[0067] In the embodiment, the manufacturing method of the display module 100 further comprises the following steps:

[0068] S4: Please refer to Figure 13 , the second carrier plate 37 is removed, so that the magnetic insulation layer 33 is exposed on the side away from the closed cavity 22. Among them, the magnetic insulation layer 33, the second circuit layer 35 and the suspension 32 together form a coil substrate 38.

[0069] S5: Please refer to Figure 14 , a slot 361 is arranged on the side of the magnetic insulation layer 33 away from the closed cavity 22, and part of the coil 31 is exposed in the slot 331.

[0070] S6: Please refer to Figure 15 , an active element 50 is arranged on the side of the magnetic insulation layer 33 away from the closed cavity 22, and the display module 100 is obtained. Among them, the active element 50 includes a main body 51 and a pin 52 connected to the main body 51. The pin 52 is inserted into the slot 361 to electrically connect the coil 31. The active element 50 is used to control the size of the high-frequency current in the coil 31, thereby realizing the control of the position of the suspension 32. Specifically, the active element 50 includes a control chip. The control chip can realize the control of the high-frequency current in the coil 31 through adjusting the current source, pulse width modulation and other technologies.

[0071] Compared with the prior art, the manufacturing method of the display module 100 provided by the present application has the following advantages:

[0072] (1) By limiting the suspension 32 in the closed cavity 22 and using electromagnetic induction and Lorentz principle to control the position of the suspension 32, the connection control of the first lamp bead 12 and the second lamp bead 13 in the upper layer is realized. At the same time, by designing the coil substrate 38 of the first lamp bead 12 and the second lamp bead 13 to be separated from the display substrate 10 in different layers, the wiring and parts can be simplified, which is conducive to improving the space available for the arrangement of the first lamp bead 12 and the second lamp bead 13, improving the arrangement density of the lamp beads, and improving the performance of the display module 100.

[0073] (2) By arranging the magnetic insulation layer 33 in the coil 31 and allowing part of the magnetic insulation layer 33 to fill into the coil groove 352 of the coil 31, the relative position of the magnetic insulation layer 33 and the coil 31 is fixed, and the magnetic insulation layer 33 and the coil 31 are exposed at the bottom of the closed cavity 22. At the same time, the suspension 32 is limited in the closed cavity 22, so that the suspension 32 is not easy to deviate, which is conducive to improving the accuracy of the position control of the suspension 32.

[0074] Please refer toFigure 15 and Figure 16 The application also provides a display module 100, comprising a display substrate 10, an adhesive layer 20 and a coil substrate 38.

[0075] The display substrate 10 comprises an insulating layer 11, a first lamp bead 12, a second lamp bead 13, a first circuit 14 and a second circuit 15. The first lamp bead 12 and the second lamp bead 13 are arranged side by side on one side of the insulating layer 11. The first circuit 14 and the second circuit 15 are arranged side by side on the other side of the insulating layer 11. The first lamp bead 12 is electrically connected to the first circuit 14, and the second lamp bead 13 is electrically connected to the second circuit 15.

[0076] The adhesive layer 20 is arranged on the side of the display substrate 10 where the first circuit 14 and the second circuit 15 are arranged. The adhesive layer 20 is provided with an opening 21, and part of the first circuit 14 and part of the second circuit 15 are exposed to the opening 21.

[0077] The coil substrate 38 is arranged on the side of the adhesive layer 20 away from the first circuit 14 and the second circuit 15. The coil substrate 38 covers the opening 21 to form an enclosed cavity 22. The coil substrate 38 comprises a coil 31, a floating piece 32 and a magnetic insulating layer 33. The coil 31 is embedded in the magnetic insulating layer 33 and exposed to the enclosed cavity 22. The magnetic insulating layer 33 is used to generate an external magnetic field, and the floating piece 32 is movably arranged in the enclosed cavity 22.

[0078] Specifically, the coil substrate 38 comprises a first state A and a second state B. Please refer to Figure 16 In the first state A, the coil 31 passes a first high-frequency current, and the floating piece 32 induces a first eddy current from the first high-frequency current. The floating piece 32 with the first eddy current generates a first Lorentz force in the external magnetic field. The direction of the first Lorentz force is opposite to the direction of the gravity of the floating piece 32, and the first Lorentz force is greater than the gravity of the floating piece 32. Therefore, the floating piece 32 moves towards the first circuit 14 and the second circuit 15 until the two contact bodies 322 of the floating piece 32 are in communication with the first circuit 14 and the second circuit 15, respectively. In this way, the first lamp bead 12 and the second lamp bead 13 are in series communication.

[0079] Please refer to Figure 15In the second state B, the coil 31 is supplied with a second high-frequency current, the second high-frequency current is smaller than the first high-frequency current, the levitation member 32 induces the second high-frequency current and generates a second eddy current, the levitation member 32 with the second eddy current generates a second Lorentz force in the external magnetic field, the direction of the second Lorentz force is opposite to the direction of the gravity of the levitation member 32, the second Lorentz force is smaller than the gravity of the levitation member 32, and the levitation member 32 is disconnected from the first line 14 and the second line 15, respectively. In this way, the first lamp bead 12 and the second lamp bead 13 are electrically disconnected.

[0080] Please refer to Figure 15 and Figure 16 In the embodiment, the coil substrate 38 further comprises a magnetic insulation layer 33, the coil 31 is embedded in the magnetic insulation layer 33, the active element 50 is arranged on the side of the magnetic insulation layer 33 away from the closed cavity 22, and the active element 50 is electrically connected to the coil 31. The magnetic insulation layer 33 is a magnetic insulation layer, and the magnetic insulation layer 33 can be used to provide an external magnetic field.

[0081] Those skilled in the art should understand that the above embodiments are only used to illustrate the present application, and are not used as a limitation to the present application, and as long as the above embodiments are within the spirit and scope of the present application, any suitable changes and modifications to the above embodiments are within the scope of the present application.

Claims

1. A manufacturing method of a display module, characterized by, The method comprises the steps of: providing a display substrate, the display substrate comprising an insulating layer, a first lamp bead, a second lamp bead, a first circuit and a second circuit, the first lamp bead and the second lamp bead being arranged side by side on one side of the insulating layer, the first circuit and the second circuit being arranged side by side on the other side of the insulating layer, the first lamp bead being electrically connected to the first circuit, and the second lamp bead being electrically connected to the second circuit; providing an adhesive layer on the side of the display substrate where the first circuit and the second circuit are arranged, the adhesive layer being provided with an opening, and part of the first circuit and part of the second circuit being exposed to the opening; providing a coil substrate on the side of the adhesive layer away from the first circuit and the second circuit, the coil substrate covering the opening to form an enclosed cavity, the coil substrate comprising a magnetic insulating layer, a coil and a levitation piece, the coil being arranged on the magnetic insulating layer, the magnetic insulating layer having an external magnetic field, and the levitation piece being movably arranged in the enclosed cavity, wherein the display module comprises a first state and a second state, in the first state, the coil is supplied with a first high-frequency current, the levitation piece induces the first high-frequency current and generates a first eddy current, the first eddy current forms a first Lorentz force in the external magnetic field, the first Lorentz force is greater than the gravity of the levitation piece, so that the two ends of the levitation piece are respectively in communication with the first circuit and the second circuit, so that the first lamp bead and the second lamp bead are in electrical communication; in the second state, the coil is supplied with a second high-frequency current, the second high-frequency current being smaller than the first high-frequency current, the levitation piece induces the second high-frequency current and generates a second eddy current, the second eddy current forms a second Lorentz force in the external magnetic field, the second Lorentz force is smaller than the gravity of the levitation piece, so that the two ends of the levitation piece are respectively separated from the first circuit and the second circuit, so that the first lamp bead and the second lamp bead are electrically disconnected.

2. The production method according to claim 1, wherein The display substrate further comprises a first conductive body and a second conductive body embedded in the insulating layer, the first conductive body connecting the first lamp bead and the first circuit, and the second conductive body connecting the second lamp bead and the second circuit, and the manufacturing method of the display substrate comprises the steps of: providing a first copper-clad substrate, the first copper-clad substrate comprising the insulating layer and a first copper foil layer arranged on one side of the insulating layer; etching the first copper foil layer to form a first circuit layer, the first circuit layer comprising the first circuit and the second circuit; etching the insulating layer to form a first opening and a second opening, part of the first circuit being exposed to the first opening, and part of the second circuit being exposed to the second opening; arranging the first conductive body in the first opening, and the first circuit connecting one end of the first conductive body; arranging the second conductive body in the second opening, and the second circuit connecting one end of the second conductive body; The first lamp bead is connected to the other end of the first conductive body, and the second lamp bead is connected to the other end of the second conductive body, so as to obtain the display substrate.

3. The production method according to claim 1, wherein The coil substrate further comprises an active element, which is arranged on the side of the magnetic insulation layer away from the closed cavity and electrically connected to the coil. A second copper-clad substrate is provided, which comprises a first carrier plate and a second copper foil layer arranged on one side of the first carrier plate; The second copper foil layer is etched to form a second circuit layer, which comprises the coil, and part of the first carrier plate is exposed in the coil slot; The magnetic insulation layer is arranged on the second circuit layer, and part of the magnetic insulation layer fills the coil slot; The first carrier plate is removed, so that the coil is exposed on one side of the magnetic insulation layer; The suspension is arranged on the coil, and The active element is arranged on the side of the magnetic insulation layer away from the suspension, so as to obtain the coil substrate.

4. The production method according to claim 3, wherein After the step of "removing the first carrier plate" and before the step of "arranging the suspension on the coil", a second carrier plate is arranged on the side of the magnetic insulation layer away from the suspension. After the step of "arranging the coil substrate on the side of the adhesive layer away from the first circuit and the second circuit", further comprising: The second carrier plate is removed, so that the magnetic insulation layer is exposed; A slot is arranged on the side of the magnetic insulation layer away from the suspension, and part of the coil is exposed in the slot, and The active element is arranged on the magnetic insulation layer, which comprises a body and a pin connected to the body, and the pin is inserted into the slot to electrically connect the coil.

5. The production method according to claim 3, wherein The active element comprises a control chip.

6. The production method according to claim 1, wherein The material of the suspension is graphene.

7. A display module, characterized by The display substrate comprises an insulation layer, a first lamp bead, a second lamp bead, a first circuit and a second circuit, the first lamp bead and the second lamp bead are arranged side by side on one side of the insulation layer, the first circuit and the second circuit are arranged side by side on the other side of the insulation layer, the first lamp bead is electrically connected to the first circuit, and the second lamp bead is electrically connected to the second circuit; The adhesive layer is arranged on the side of the display substrate provided with the first circuit and the second circuit, and the adhesive layer is provided with an opening, and part of the first circuit and part of the second circuit are exposed in the opening; The coil substrate is arranged on the side of the adhesive layer away from the first circuit and the second circuit, and covers the opening to form a closed cavity, the coil substrate comprises a coil, a magnetic insulation layer and a suspension, the coil is arranged on the magnetic insulation layer, the magnetic insulation layer has an external magnetic field, and the suspension is movably arranged in the closed cavity, wherein the display module comprises a first state and a second state, ​ In the first state, the coil is supplied with a first high-frequency current, the levitation member induces the first high-frequency current and generates a first eddy current, the first eddy current forms a first Lorentz force in the external magnetic field, the first Lorentz force is greater than the gravity of the levitation member, so that the two ends of the levitation member are in communication with the first line and the second line respectively, so that the first lamp bead and the second lamp bead are in electrical communication; In the second state, the coil is supplied with a second high-frequency current, the second high-frequency current is less than the first high-frequency current, the levitation member induces the second high-frequency current and generates a second eddy current, the second eddy current forms a second Lorentz force in the external magnetic field, the second Lorentz force is less than the gravity of the levitation member, so that the two ends of the levitation member are separated from the first line and the second line respectively, so that the first lamp bead and the second lamp bead are electrically disconnected.

8. The display module of claim 7, wherein the display module is configured to be mounted to a display module mounting surface of a display module mounting structure. The coil substrate further comprises an active element, the active element is arranged on the side of the magnetic insulation layer away from the closed cavity, and the active element is electrically connected to the coil.

9. The display module of claim 8, wherein the display module is configured to be mounted to a display module mounting surface of a display module mounting structure. The side of the magnetic insulation layer away from the closed cavity is provided with a slot, part of the coil is exposed to the slot, the active element comprises a main body part and a pin connected to the main body part, the main body part is arranged on the side of the magnetic insulation layer away from the closed cavity, and the pin is inserted into the slot and electrically connected to the coil.

10. The display module of claim 8, wherein the display module is configured to be mounted to a display module mounting surface of a display module mounting structure. The levitation member comprises a levitation body and two contact bodies arranged on one side of the levitation body, and the two contact bodies are arranged on the side of the levitation body away from the coil.

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