Assembling method of switch product

Abstract

The invention discloses an assembling method of a switch product, and belongs to the technical field of low-voltage electrical appliances, and the assembling method of the switch product comprises the following steps: loading a contact on a workbench; controlling a laser to perform laser shock on the surface of the contact so as to ablate and clean attachments on the surface of the contact, and remelting the surface of the contact so as to improve the surface quality of the contact; the contact is assembled in the switch product; and testing the contact resistance of the switch product, and / or testing the on-off of the switch product when the switch product is switched on. According to the assembling method of the switch product, the power-on stability and reliability of the switch product are effectively improved, the service life of the contact is prolonged, the assembling efficiency of the switch product is improved, and the factory yield of the switch product is effectively guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of low-voltage electrical appliances, and in particular to an assembling method of a switch product. Background Art

[0002] During the assembly, production or use of switch products, the switch products may not be powered on, especially for products with small current specifications, such as products below 63A or 32A.

[0003] When the contacts are not cleaned properly or are oxidized and sulfurized due to environmental pollution, the pressure generated by the closing of the switch product on the contacts cannot enable the contacts to overcome or break through the contaminants, oxide films, insulating films and other attachments between the contacts.

[0004] In the related art, before assembling the contacts in the switch product, in order to remove the attachments on the contacts, the processed or welded contacts can be subjected to post-welding treatment. Specifically, pickling, polishing, and cleaning can be performed to improve the cleanliness of the contact parts to ensure that the switch product can be stably switched on and off. However, post-welding treatment of the contacts consumes a lot of time and resources, affecting the assembly efficiency of the switch product. In addition, the surface of the contacts after post-welding treatment may have abnormal conditions such as uneven fine grain structure, cracks, and unevenness, which affect the service life of the contacts. Summary of the invention

[0005] The object of the present invention is to provide an assembly method for a switch product, which can improve the surface quality of the contact while cleaning the contact surface and effectively improve the assembly efficiency of the switch product.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A method for assembling a switch product is provided, comprising the following steps:

[0008] S100, loading the contacts on a workbench;

[0009] S200, controlling the laser to perform laser impact on the surface of the contact to ablate and clean the attachments on the surface of the contact, and remelting the surface of the contact to improve the surface quality of the contact;

[0010] S300, assembling the contact in a switch product;

[0011] S400: Testing the contact resistance of the switch product, and / or testing the on-off state of the switch product when it is closed.

[0012] Optionally, before step S100, the step further includes the following steps: welding the contact point to the contact plate to form the contact head;

[0013] The step S200 specifically includes the following steps: controlling the laser to perform laser impact on the surface of the contact to ablate and clean the attachments on the contact surface, and remelting the contact surface to improve the contact surface quality.

[0014] Optionally, the contact is made of a metal material containing silver elements. In step S200, when the laser performs laser impact on the surface of the contact, the contact is in an environment containing oxygen, and the laser performs laser impact on the surface of the contact, so that a layer of silver oxide is generated on the surface of the contact.

[0015] Optionally, in step S200, when controlling the laser to perform laser impact on the contact surface, a protective gas is sprayed toward the contact to blow the attachment away from the contact.

[0016] Optionally, the relationship between the laser scanning interval L of the laser and the diameter D of the focal spot is: 0.2≤L / D≤6.

[0017] Optionally, the laser parameters of the laser are: wavelength of 100nm-355nm, scanning speed of 800mm / s-4000mm / s, and diameter D of the focal spot of 25μm-125μm.

[0018] Optionally, in step S200, the scanning path of the laser is in a mesh or stripe shape.

[0019] Optionally, in the step S400, the contact resistance of the switch product is tested 3-20 times, and / or the on-off state of the switch product when closed is tested 3-20 times.

[0020] Optionally, in step S400, a multimeter is controlled to test the on / off state of the switch product when it is closed.

[0021] Optionally, the step S200 specifically includes the following steps:

[0022] S210, adjusting the laser scanning interval L and the diameter D of the focal spot of the laser so that the focal spot impacts the surface of the contact without overlapping, and controlling the laser to perform laser impact on the surface of the contact to ablate and clean the attachments on the surface of the contact;

[0023] S220, adjusting the laser scanning spacing L and the diameter D of the focal spot of the laser so that the overlap degree of the focal spot impacting the surface of the contact is between 50% and 300%, and controlling the laser to perform laser impact on the surface of the contact to ablate and clean the attachments on the contact surface and remelt the contact surface.

[0024] Beneficial effects: The assembly method of the switch product provided by the present invention controls the laser to perform laser impact on the surface of the contact loaded on the workbench before assembling the contact in the switch product, ablates and cleans the attachments on the contact surface, and remelts the contact surface to improve the contact surface quality, which is convenient for operation, effectively improves the power-on stability and reliability of the switch product, increases the service life of the contact, and effectively improves the assembly efficiency of the switch product. After the contact is assembled in the switch product, the contact resistance of the switch product is tested, and / or the on-off of the switch product when closed is tested to detect whether the switch product is qualified. If qualified, the switch product can be packed and shipped; if unqualified, the contact can be removed from the switch product to effectively ensure the factory yield of the switch product. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a flow chart of the assembly method provided by the present invention;

[0026] Figure 2 is a detailed step flow chart of the assembly method provided by the present invention;

[0027] Figure 3 is a schematic structural diagram of a contact with a textured surface provided by the present invention;

[0028] Figure 4 is a schematic structural diagram of a contact with a striped surface provided by the present invention;

[0029] Figure 5 This is a schematic diagram of the structure of a semi-finished product of a switch product provided by the present invention;

[0030] Figure 6 It is another schematic diagram of the semi-finished structure of the switch product provided by the present invention.

[0031] In the figure:

[0032] 100, contact; 110, contact point; 120, touch plate;

[0033] 210. Pedestal; 220. Base. DETAILED DESCRIPTION

[0034] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0035] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0037] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0038] Reference Figures 1 to 6 As shown, this embodiment provides a method for assembling a switch product, comprising the following steps:

[0039] S100, loading the contact 100 on a workbench;

[0040] S200, controlling a laser (not shown) to perform laser impact on the surface of the contact 100 to ablate and clean the attachments on the surface of the contact 100, and remelting the surface of the contact 100 to improve the surface quality of the contact 100;

[0041] S300, assembling the contact 100 into a switch product;

[0042] S400: Test the contact resistance of the switch product, and / or test the on / off state of the switch product when it is closed.

[0043] In this embodiment, before assembling the contact 100 in the switch product, the laser is controlled to perform laser impact on the surface of the contact 100 loaded on the workbench, ablating and cleaning the attachments on the surface of the contact 100, and remelting the surface of the contact 100 to improve the surface quality of the contact 100, facilitate operation, effectively improve the power-on stability and reliability of the switch product, increase the service life of the contact 100, and effectively improve the assembly efficiency of the switch product. Improving the surface quality of the contact 100 includes but is not limited to removing cracks on the surface of the contact 100, making the fine-grained structure of the surface of the contact 100 uniform, and making the surface of the contact 100 smooth.

[0044] After the contact 100 is assembled in the switch product, the contact resistance of the switch product is tested, and / or the on-off of the switch product when it is closed is tested to detect whether the switch product is qualified. If qualified, the switch product can be packed and shipped; if unqualified, the contact 100 can be removed from the switch product, effectively ensuring the factory yield of the switch product.

[0045] Exemplarily, the contact 100 includes a movable contact and a stationary contact, and at least one of the movable contact and the stationary contact is surface-treated through steps S100 and S200.

[0046] Exemplarily, the switch products include, but are not limited to, motor starters, AC contactors, control and protection switches, small relays, molded case circuit breakers or DC relays.

[0047] In this embodiment, the following steps are also included before step S100: welding the contact 110 to the contact plate 120 to form the contact 100; step S200 specifically includes the following steps: controlling the laser to perform laser impact on the surface of the contact 110 to ablate and clean the attachments on the surface of the contact 110, and remelting the surface of the contact 110 to improve the surface quality of the contact 110, effectively improving the processing efficiency of the contact 100, and thereby improving the assembly efficiency of the switch product.

[0048] Of course, in step S200 , the laser may also be controlled to perform laser shock on at least a portion of the contact plate 120 to further improve the surface cleanliness and surface quality of the entire contact 100 , which is not limited in this embodiment.

[0049] In some embodiments, the contact 110 is made of a metal material containing silver elements. To further improve the surface quality of the contact 110, in step S200, when the laser performs laser impact on the surface of the contact 110, the contact 110 is in an environment containing oxygen, and the laser performs laser impact on the surface of the contact 110, so that a layer of silver oxide is generated on the surface of the contact 110. Among them, silver oxide has good conductivity, can improve the stability of the contact 110, reduce the performance degradation caused by oxidation and electrolysis, and also has good wear resistance, extending the service life of the contact 110. The silver oxide layer can reduce the generation of uncontrollable insulating materials caused by sulfidation, carbon-containing organic matter, protective agents, etc. on the contact 110, and improve the reliability of power-on. In addition, the thickness of silver oxide is very thin, and even if the silver oxide decomposes at high temperature, it will not affect the performance of the contact 110.

[0050] Exemplarily, the material of the contact 110 includes, but is not limited to, silver tin oxide or silver tin oxide indium oxide.

[0051] In other embodiments, in step S200, when the laser is controlled to perform laser impact on the surface of the contact 110, a protective gas is sprayed toward the contact 110 to blow away the attachments from the contact 110. In this embodiment, when the laser impacts the surface of the contact 110, the attachments are blown away from the contact 110 by the protective gas, which effectively prevents the surface of the contact 110 from being oxidized, and can improve the quality of the surface of the contact 110 after remelting, so that the contact 100 has a good bright surface.

[0052] Illustratively, the shielding gas may be an inert gas, such as argon.

[0053] For example, in step S200 , when the laser is controlled to perform laser shock on at least a partial area of ​​the touch panel 120 , a protective gas may also be sprayed toward the touch panel 120 .

[0054] For example, the shielding gas may be sprayed toward the contact 110 through a nozzle (not shown).

[0055] In this embodiment, refer to Figures 2 to 6 As shown, in step S200, the cleaning of the attachments on the surface of the contact 100 and the remelting of the surface of the contact 100 can be completed in steps to improve the quality of the remelted surface of the contact 100. Exemplarily, S200 specifically includes the following steps:

[0056] S210, adjusting the laser scanning interval L and the diameter D of the focal spot of the laser so that the focal spot impacts the surface of the contact 100 without overlapping, and controlling the laser to perform laser impact on the surface of the contact 100 to ablate and clean the attachments on the surface of the contact 100;

[0057] S220, adjust the laser scanning spacing L and the diameter D of the focal spot of the laser so that the overlap degree of the focal spot impacting the surface of the contact 100 is between 50% and 300%, and control the laser to perform laser impact on the surface of the contact 100 to ablate and clean the attachments on the surface of the contact 100 and remelt the surface of the contact 100.

[0058] Exemplarily, when silver oxide needs to be generated on the surface of the contact 110, in the execution of step S210 and step S220, at least in the execution of step S220, the contact 110 is placed in an environment with oxygen. Preferably, when executing step S210, a protective gas is sprayed toward the contact 110 to blow away the attachments from the contact 110 to prevent the attachments from affecting the molding quality of the silver oxide layer.

[0059] Exemplarily, when it is necessary to prevent the surface of the contact 110 from being oxidized, a protective gas is sprayed toward the contact 110 during the execution of step S210 and step S220 .

[0060] In this embodiment, the workbench and the laser can be part of the laser device, that is, the laser device includes the workbench and the laser. In this embodiment, the laser device can adjust the output parameters of the laser, such as laser wavelength, scanning speed, focal spot diameter D, laser scanning spacing L and other output parameters.

[0061] Exemplarily, to ensure the cleanliness and surface quality of the contact 100 surface, the laser parameters of the laser are: wavelength of 100nm-355nm, scanning speed of 800mm / s-4000mm / s, and diameter D of the focal spot of 25μm-125μm. The diameter D of the focal spot can also be other values. For example, in step S210, the diameter D of the focal spot can be adjusted to 150μm to quickly ablate and clean the attachments on the surface of the contact 100, thereby improving the cleaning efficiency of the attachments on the surface of the contact 100. When the scanning speed is 1000mm / s-2000mm / s, the heat generated when the laser impacts the surface of the contact 100 can make the surface of the contact 100 remelt with good quality.

[0062] Exemplarily, to ensure the cleanliness of the surface of the contact 100 , the relationship between the laser scanning interval L of the laser and the diameter D of the focal spot is: 0.2≤L / D≤6.

[0063] Illustratively, in step S200, the laser device may adopt a method in which the laser remains stationary while the workbench moves.

[0064] For example, to ensure the cleanliness and surface quality of the contact 100, in step S200, the scanning path of the laser can be a mesh or stripe shape. In this embodiment, after the contact 110 is surface treated in step S200, the contact 110 can be obtained without further surface processing through a mold. Figure 3 The textured surface of the contact 110 shown or Figure 4 The striped surface of the contact 110 shown improves the suitability of surface processing of the contact 110 .

[0065] Exemplarily, when the scanning path of the laser is a mesh shape, L / D>1, which effectively improves the power-on stability and reliability of the switch product.

[0066] Exemplarily, the laser equipment can be installed on an automated production line for assembling complete switch products. Specifically, it can be installed after the rotating disk loading process of each contact 100 and before any assembly process where the surface of the contact 100 is visible. The laser equipment can laser impact the contact 100 to clean the oxide film generated by the mutual friction of the contacts 100 during the rotating loading process, and remelt the surface of the contact 110, which can reduce the temperature rise of the contact 100 when the switch product is opened and closed, thereby improving the reliability of the switch product.

[0067] In some embodiments, the workbench may load at least one contact 100 via a carrier (not shown) and perform laser shock on the contact 100 .

[0068] In other embodiments, the workbench can also load the switch product assembled into a semi-finished product, and perform laser shock on the contact 100, effectively reducing the pollution during the assembly process of the contact 100. For example, taking the motor starter as an example, the semi-finished product can be as follows: Figure 5 As shown, the static contact is assembled into a semi-finished product in the base 210; the semi-finished product can also be Figure 6 As shown, the moving contact is assembled into a semi-finished product in the base 220 .

[0069] Exemplarily, lasers include but are not limited to YAG lasers, fiber lasers, CO2 lasers, nanosecond lasers, and femtosecond lasers. Preferably, the laser equipment can be a laser equipment with a fully solid-state nanosecond laser, i.e., a purple light marking machine, which has low investment cost, simple implementation, and high efficiency, and can be installed on an automated production line for complete assembly of switch products, or on a semi-automatic assembly line for switch products or in a single machine operation.

[0070] For example, the parameters of the purple light marking machine can be specifically shown in the following table:

[0071]

[0072] In some embodiments, in step S400, the contact resistance of the switch product is tested 3-20 times to ensure the reliability of the test result. Exemplarily, the contact resistance of the switch product may be tested 6 times, 8 times, 12 times or 15 times.

[0073] In some embodiments, in step S400, the switch product is tested for 3-20 times when it is switched on to ensure the reliability of the test result. Exemplarily, the number of times the switch product is tested for 6, 8, 12 or 15 times when it is switched on can be.

[0074] Of course, in step S400, both the contact resistance of the switch product can be tested 3-20 times, and the on-off state of the switch product when it is closed can be tested 3-20 times.

[0075] In this embodiment, testing the contact resistance of the switch product and testing the on-off state of the switch product when it is closed are in line with the trend of energy saving and cost reduction and product quality control requirements.

[0076] For example, in step S400, the contact resistance test can be completed by a contact resistance tester (not shown), which is convenient for operation. The contact resistance tester is a prior art and will not be described in detail in this embodiment.

[0077] Exemplarily, in step S400, a multimeter (not shown) is controlled to test the on-off of the switch product when it is closed, which is convenient for operation. The multimeter can use a voltage of 9V, 6V or lower for power-on testing. Of course, the on-off test of the switch product when it is closed can also be completed through a test circuit with a buzzer and / or indicator light.

[0078] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A method for assembling a switch product, characterized in that: The following steps are involved: S100, loading the contact (100) on a workbench; S200, controlling a laser to perform laser impact on the surface of the contact (100) to ablate and clean the attachments on the surface of the contact (100), and remelting the surface of the contact (100) to improve the surface quality of the contact (100); S300, assembling the contact (100) into a switch product; S400: Testing the contact resistance of the switch product, and / or testing the on-off state of the switch product when it is closed.

2. The assembly method of a switch product according to claim 1, characterized in that: Before step S100, the method further includes the following steps: welding the contact point (110) to the contact plate (120) to form the contact head (100); The step S200 specifically includes the following steps: controlling the laser to perform laser impact on the surface of the contact (110) to ablate and clean the attachments on the surface of the contact (110), and remelting the surface of the contact (110) to improve the surface quality of the contact (110).

3. The assembly method of a switch product according to claim 2, characterized in that: The contact (110) is made of a metal material containing silver elements. In the step S200, when the laser performs laser impact on the surface of the contact (110), the contact (110) is in an environment containing oxygen, and the laser performs laser impact on the surface of the contact (110), so that a layer of silver oxide is generated on the surface of the contact (110).

4. The assembly method of a switch product according to claim 2, characterized in that: In step S200, while controlling the laser to perform laser impact on the surface of the contact (110), a protective gas is sprayed toward the contact (110) to blow the attached matter away from the contact (110).

5. The method for assembling a switch product according to claim 1, characterized in that: The relationship between the laser scanning interval L and the diameter D of the focal spot of the laser is: 0.2≤L / D≤6.

6. The method for assembling a switch product according to claim 1, characterized in that: The laser parameters of the laser are: wavelength of 100nm-355nm, scanning speed of 800mm / s-4000mm / s, and diameter D of the focal spot of 25μm-125μm.

7. The assembly method of a switch product according to claim 1, characterized in that: In the step S200, the scanning path of the laser is in a mesh or stripe shape.

8. The method for assembling a switch product according to claim 1, characterized in that: In the step S400, the contact resistance of the switch product is tested 3-20 times, and / or the on-off state of the switch product when closed is tested 3-20 times.

9. The method for assembling a switch product according to claim 1, characterized in that: In the step S400, the multimeter is controlled to test the on-off state of the switch product when it is closed.

10. The method for assembling a switch product according to claim 1, characterized in that: The step S200 specifically includes the following steps: S210, adjusting the laser scanning interval L and the diameter D of the focal spot of the laser so that the focal spot impacts the surface of the contact (100) without overlapping, and controlling the laser to perform laser impact on the surface of the contact (100) to ablate and clean the attachments on the surface of the contact (100); S220, adjusting the laser scanning spacing L and the diameter D of the focal spot of the laser so that the overlap degree of the focal spot impacting the surface of the contact (100) is between 50% and 300%, and controlling the laser to perform laser impact on the surface of the contact (100) to ablate and clean the attachments on the surface of the contact (100) and remelt the surface of the contact (100).

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