A wafer alignment device

Abstract

The present invention discloses a wafer alignment device, comprising: a supporting member, comprising a suction cup part and a supporting body, the supporting body is provided with a connected central airway and an air guide diversion groove, the air guide diversion groove is located at one end of the supporting body away from the suction cup part, the suction cup part has a vacuum adsorption area for adsorbing the wafer; a driving alignment component, used to drive the suction cup part to align with the center of the wafer; a rotating shaft, rotatably connected in the mounting hole, the rotating shaft is fixedly connected to the bottom of the suction cup part, the rotating shaft is provided with a plurality of branch airways along the height direction, the branch airways are uniformly distributed inside the rotating shaft along the circumferential direction, and the rotating shaft is provided with an annular airway along the circumferential direction; a dynamic seal, relatively rotatably sleeved on the outer surface of the rotating shaft and forming a first dynamic sealing annular surface and a second dynamic sealing annular surface. The above scheme is adopted to avoid the phenomenon of wafer falling caused by air pressure leakage resulting in unstable negative pressure.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer transfer equipment, and particularly to a wafer alignment device. Background Art

[0002] In the field of semiconductor wafer manufacturing, the precise positioning of wafers is the core prerequisite for ensuring the yield of key processes such as lithography and etching. The outer edge of a wafer is usually designed with a V-shaped notch or a flat edge as a positioning mark to identify the wafer direction and the reference position of the chip array. When a robotic arm transfers a wafer from a cassette to a processing stage, it is necessary to rotate and align the wafer so that the center of the wafer coincides with the center of the stage and correct its azimuth angle to meet the micron-level positioning requirements of subsequent processes. This process places stringent requirements on the motion accuracy, stability, and reliability of the equipment. Any minor position deviation or accidental displacement may cause a chain of process defects.

[0003] The current mainstream wafer centering device adopts a rotating adsorption stage structure, which fixes the wafer by vacuum adsorption and drives it to rotate to achieve alignment. However, the gas supply system of this structure has inherent defects: when the stage rotates at high speed, the dynamic uniformity of the adsorption force is easily affected by design defects in its internal gas supply or negative pressure air flow path, resulting in fluctuations in the adsorption force in local areas of the wafer, and further causing micron-level offsets. In addition, the part of the existing wafer centering device that supplies gas to the rotating adsorption stage has poor sealing performance, which leads to air leakage and also affects the adsorption force on the wafer.

[0004] Therefore, it is necessary to provide a wafer alignment device to solve the above problems existing in the prior art. Summary of the Invention

[0005] The purpose of the present invention is to provide a wafer alignment device to improve the adsorption stability of the wafer during the centering process and avoid wafer dropping and wafer offset.

[0006] To achieve the above purpose, the technical solution of the present invention is as follows:

[0007] A wafer alignment device includes:

[0008] A supporting member, including a suction cup part and a supporting main body. The supporting main body is provided with a communicating central air passage and a gas guiding and splitting groove. The gas guiding and splitting groove is located at one end of the supporting main body facing away from the suction cup part. The suction cup part has a vacuum adsorption area for adsorbing the wafer;

[0009] A driving and aligning component for driving the suction cup part to align with the center of the wafer, including a lifting plate, and the lifting plate is provided with a mounting hole inside;

[0010] A rotating shaft is rotatably connected within the mounting hole. The rotating shaft is fixedly connected to the bottom of the suction cup portion. The rotating shaft is provided with a plurality of branch air ducts along the height direction, and the branch air ducts are circumferentially distributed within the rotating shaft. The rotating shaft is provided with an annular air duct along the circumference.

[0011] A dynamic seal is relatively rotatably sleeved on the outer surface of the rotating shaft to form a first dynamic seal ring surface and a second dynamic seal ring surface.

[0012] Among them, one end of the plurality of branch air ducts communicates with the air guide and shunt groove, and the other end communicates with the annular air duct. The annular air duct is used for external communication. The first dynamic seal ring surface and the second dynamic seal ring surface are respectively arranged on the upper and lower sides of the annular air duct in the axial direction to form a sealed isolation of the annular air duct.

[0013] The beneficial effect of a wafer alignment device provided by the present invention is that: by using the design of the central air duct, multi-branch air ducts and annular air duct, through shunt and pressure equalization, structure strengthening and dynamic response optimization, the problems of uneven gas distribution and response hysteresis of the traditional single air duct system are solved, and the process stability of precision manufacturing equipment can be significantly improved; the first dynamic seal ring surface and the second dynamic seal ring surface formed by the dynamic seal and the outer surface of the rotating shaft further provide sealed protection for the annular air duct, avoiding the phenomenon of wafer dropping caused by unstable negative pressure due to air pressure leakage.

[0014] Further, the supporting main body is provided with a groove, one end of the rotating shaft has a convex platform, the convex platform is inserted into the groove, and a sealing ring is sleeved outside the convex platform.

[0015] Further, the air guide and shunt groove includes a plurality of diversion areas radially distributed at equal angles along the circumference, and the plurality of diversion areas respectively correspond to and communicate with the plurality of branch air ducts.

[0016] Further, the lifting plate is provided with a first annular groove and a second annular groove along the axial direction of the mounting hole. The dynamic seal includes a first ring and a second ring. The first ring and the second ring are respectively arranged in the first annular groove and the second annular groove. The first ring and the second ring both include an integrally formed inner ring sealing portion and an outer ring holding portion. The outer ring holding portion is arranged in the first annular groove and the second annular groove, and the inner ring sealing portion covers the outer wall of the rotating shaft to form a first dynamic seal ring surface and a second dynamic seal ring surface.

[0017] Further, the lifting plate has an air duct wall, the air duct wall is located between the first annular groove and the second annular groove for blocking the annular air duct, and the air duct wall is provided with air holes penetrating to the outer wall of the lifting plate, and trachea connectors are installed on the air holes.

[0018] Further, a vertical projection of the branch air duct in the height direction coincides with at least a part of the annular air duct, and an end wall of the branch air duct is an exposed part, and the exposed part is concave and exposed to the annular air duct.

[0019] Further, it includes:

[0020] A housing including a top plate, a strip-shaped window is opened in the middle of the top plate, and the supporting member is arranged in the strip-shaped window;

[0021] An optical detection module for detecting the position of a wafer located on the suction cup part;

[0022] A rotating member fixedly connected to the bottom of the rotating shaft for driving the rotating shaft to rotate around its own axis;

[0023] An X-axis translation member connected to the rotating support member for driving the rotating support member to move along the length direction of the strip-shaped window;

[0024] A Z-axis lifting member connected to the rotating support member for driving the carrying member to lift along the Z axis.

[0025] Further, the optical detection module includes opposed sensors vertically arranged along the Z axis, and the opposed sensors emit laser beams in the Z-axis direction to form a vertical detection plane;

[0026] When the wafer is placed on the suction cup part, the edge of the wafer blocks part of the laser beams, and at this time, the opposed sensors can detect the edge coordinate points of the wafer on the suction cup part in a non-contact manner.

[0027] Further, the X-axis translation member includes:

[0028] A translation block located inside the housing and connected to the lifting plate, and a first lead screw nut is arranged inside the translation block;

[0029] A translation lead screw threadedly engaged with the first lead screw nut in the X-axis direction;

[0030] A first guide rod is arranged inside the translation block and fixedly connected to the inner wall of the housing in the X-axis direction.

[0031] Further, the rotating member includes: a first motor having an output shaft, and the output shaft is coaxially arranged and fixedly connected to the rotating shaft.

[0032] Further, the Z-axis lifting member includes:

[0033] A second motor installed inside the housing;

[0034] A second guide rod, one end of which is fixedly connected to the bottom of the lifting plate, and the other end slidably penetrates through the translation block;

[0035] The lifting screw rod is fixedly connected to the output shaft of the second motor. A second screw nut is arranged inside the lifting plate, and the lifting screw rod is in threaded cooperation with the second screw nut;

[0036] Wherein, the translation block is provided with a sunken groove, and the bottom of the lifting plate is provided with a sunken platform, and the sunken platform is in plug-in cooperation with the sunken groove. Description of the Drawings

[0037] Figure 1 It is a schematic diagram of the overall structure of the wafer alignment device according to the embodiment of the present invention;

[0038] Figure 2 It is an internal structure diagram of the wafer alignment device according to the embodiment of the present invention;

[0039] Figure 3 It is an exploded view of the supporting member according to the embodiment of the present invention;

[0040] Figure 4 It is a schematic diagram of the structure of the rotating shaft according to the embodiment of the present invention;

[0041] Figure 5 It is a cross-sectional view of the rotating shaft and the lifting plate according to the embodiment of the present invention;

[0042] Figure 6 It is a schematic diagram of the structure of the dynamic seal according to the embodiment of the present invention;

[0043] Figure 7 It is a cross-sectional view of the dynamic seal according to the embodiment of the present invention;

[0044] Figure 8 It is a schematic diagram of the structure of the lifting plate according to the embodiment of the present invention;

[0045] Figure 9 It is a schematic diagram of the structure of the lifting member according to the embodiment of the present invention;

[0046] Figure 10 It is a schematic diagram of the structure of the X-axis translation member according to the embodiment of the present invention;

[0047] Figure 11 It is a schematic diagram of the structure of the translation block according to the embodiment of the present invention.

[0048] Reference numerals: 100, carrier; 101, suction cup part; 102, carrier body; 103, central air duct; 104, air guide diversion groove; 200, rotating shaft; 201, branch air duct; 202, annular air duct; 203, boss; 204, exposed part; 205, sealing ring; 300, dynamic seal; 301, first ring; 302, second ring; 303, inner ring seal part; 304, outer ring holding part; 400, lifting plate; 401, air duct wall; 402, air pipe joint; 403, air hole; 500, housing; 510, strip window; 520, opposed sensor; 530, X-axis translation part; 531, translation block; 532, translation lead screw; 533, first guide rod; 534, third motor; 535, X-axis guide mounting plate; 540, Z-axis lifting part; 541, second motor; 542, second guide rod; 543, lifting lead screw; 544, sinking groove; 550, rotating part; 551, first motor. Detailed implementation manners

[0049] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art belonging to the field of the present invention. The words such as "including" used herein mean that the elements or items appearing before this word cover the elements or items listed after this word and their equivalents, without excluding other elements or items.

[0050] The following combines the attached Figure 1 -attached Figure 11 , and makes a further detailed description of the specific implementation manners of the present invention.

[0051] Referring to Figures 1 - 5 , a wafer alignment device includes a carrier 100, a driving alignment assembly, a rotating shaft 200 and a dynamic seal 300.

[0052] Referring to Figures 3 - 5The supporting member 100 includes a coaxially arranged suction cup portion 101 and a supporting body 102. The supporting body 102 is provided with a central air channel 103 and a gas diversion groove 104 which are interconnected. The gas diversion groove 104 is located at the end of the supporting body 102 away from the suction cup portion 101. The upper surface of the suction cup portion 101 has a vacuum adsorption area for adsorbing wafers, and the central air channel 103 is interconnected with the vacuum adsorption area. In some specific embodiments of the present invention, the suction cup portion 101 is columnar, and a vacuum adsorption array which is concentric with the suction cup portion 101 and evenly distributed circumferentially is provided on the vacuum adsorption area of the upper table.

[0053] The driving alignment assembly is used to drive the suction cup part 101 to align with the center of the wafer and includes a lifting plate 400, and a mounting hole is opened in the lifting plate 400. In some specific embodiments of the present invention, the rotating shaft 200 is rotatably connected in the mounting hole, the rotating shaft 200 is fixedly connected to the bottom of the suction cup part 101, and the rotating shaft 200 is provided with a plurality of branch air passages 201 along the height direction, and the branch air passages 201 are uniformly distributed inside the rotating shaft 200 along the circumferential direction, and the rotating shaft 200 is provided with an annular air passage 202 along the circumferential direction.

[0054] Reference Figure 3 and Figure 4 In some specific embodiments, the central airway 103 and the branch airway 201 are in the shape of holes, and the aperture of the central airway 103 is larger than the aperture of the branch airway 201. One end of the multiple branch airways 201 is connected to the gas guide diversion groove 104, and the other end is connected to the annular airway 202, and the annular airway 202 is used to communicate with the outside. The design of the central airway 103, the multiple branch airways 201 and the annular airway 202 solves the problems of uneven gas distribution and delayed response of the traditional single airway system through diversion and pressure equalization, structural reinforcement, and dynamic response optimization, which can significantly improve the process stability of precision manufacturing equipment;

[0055] Reference Figures 5 - 7 The dynamic seal 300 is relatively rotatably sleeved on the outer surface of the rotating shaft 200 and forms a first dynamic seal ring surface and a second dynamic seal ring surface. The first dynamic seal ring surface and the second dynamic seal ring surface are respectively arranged on the upper and lower sides of the annular airway 202 in the axial direction to form a seal isolation for the annular airway 202. The first dynamic seal ring surface and the second dynamic seal ring surface formed by the dynamic seal 300 and the outer surface of the rotating shaft 200 further seal and protect the annular airway 202 to avoid the phenomenon of air pressure leakage causing negative pressure instability and chip falling.

[0056] Reference Figure 8, in some specific embodiments of the present invention, the lifting plate 400 is axially provided with a first annular groove and a second annular groove along the mounting hole of the rotating shaft 200. The dynamic seal 300 includes a first ring 301 and a second ring 302. The first ring 301 and the second ring 302 are respectively arranged in the first annular groove and the second annular groove. Both the first ring 301 and the second ring 302 include an integrally formed inner ring sealing portion 303 and an outer ring holding portion 304. The outer ring holding portion 304 is fixedly arranged in the first annular groove and the second annular groove. The inner ring sealing portion 303 wraps around the outer wall of the rotating shaft 200 and forms a first dynamic seal ring surface and a second dynamic seal ring surface.

[0057] Referring to Figure 6 and Figure 7 , specifically, the outer ring holding portion 304 adopts a spherical cross-section annular structure, which is elastic and the curved surface profile is fixedly connected to the contact surfaces of the first annular groove and the second annular groove. A clearance margin is formed between the outer ring holding portion 304 and the inner ring sealing portion 303. The outer ring holding portion 304 and the inner ring sealing portion 303 are integrally injection-molded with a flexible sealing material. Its inner diameter forms an interference fit with the outer wall of the rotating shaft 200, and tightly wraps around the rotating shaft 200 through radial elastic deformation to form a double dynamic sealing interface. With the above technical solution, the first seal ring and the second seal ring are integrated in the first annular groove and the second annular groove, further improving the sealing effect while saving installation space.

[0058] Referring to Figure 3 , in some embodiments of the present invention, the supporting body 102 is provided with a groove. One end of the rotating shaft 200 has a boss 203, and the boss 203 is inserted into the groove. A sealing ring 205 is sleeved outside the boss 203. By connecting the rotating shaft 200 and the supporting body 102, the boss 203 is inserted and sealed with the cooperation of the sealing ring 205. Compared with the traditional connection method, the sealing effect is better. Specifically, the end face of the boss 203 is closely attached to the bottom surface of the groove, and the elastic deformation of the sealing ring 205 is used to fill the microscopic gap. Compared with the traditional flat flange connection that only relies on axial compression and is prone to sealing failure due to vibration, the sealing effect of this embodiment is better.

[0059] Referring to Figure 3 , in some embodiments of the present invention, the air guiding and splitting groove 104 includes a plurality of diversion areas radially distributed at equal angles in the circumferential direction, and the plurality of diversion areas respectively correspond to and communicate with a plurality of branch air passages 201. The air guiding and splitting groove 104 is designed with a plurality of radially distributed diversion areas, and each diversion area directly corresponds to a branch air passage 201. This structure enables the air flow to be more evenly distributed into each branch air passage 201, avoiding the problem of air pressure imbalance caused by different lengths of air flow paths in the traditional design.

[0060] Referring to Figure 3, in some embodiments of the present invention, the air guiding and splitting groove 104 has three diversion zones, the branch air ducts 201 have three, and the air guiding and splitting zone is strip-shaped and interconnected. Specifically, the air guiding and splitting groove 104 adopts a three-leaf-shaped flow channel design, including three radially distributed diversion zones equally divided at 120° circumferentially. Each diversion zone is a tapered streamline channel, and its extending direction forms a continuous air flow guiding angle with the axis of the corresponding branch air duct 201. At the same time, the radial layout shortens the air flow transmission distance, enabling a faster reaction during vacuum pumping or air supply and more stable adsorption of the wafer. The precise correspondence between the diversion zones and the branch air ducts 201 also reduces the situation of chaotic air flow, making the wafer adsorption more uniform and reliable, especially suitable for semiconductor manufacturing scenarios that require rapid and precise alignment.

[0061] Refer to Figure 7 , in some embodiments of the present invention, the lifting plate 400 has an airway wall 401. The airway wall 401 is located between the first annular groove and the second annular groove. Air holes 403 penetrating through to the outer wall of the lifting plate 400 are formed on the airway wall 401, and tracheal connectors 402 are installed on the air holes 403. The airway wall 401 adopts a stepped sealing structure, and its axis is arranged between the first annular groove and the second annular groove to form a closed side wall of the annular airway 202. The airway wall 401 is radially provided with a stepped air hole 403 channel. The inner end of this channel communicates with the annular airway 202, and the outer end extends to the outer peripheral surface of the lifting plate 400 and integrates a quick-connect tracheal interface. This structure realizes the shortest path connection of the air circuit while ensuring the independent operation of the dynamic seal through the orthogonal layout of the axial sealing surface and the radial air circuit.

[0062] Refer to Figure 3 , in some embodiments of the present invention, the vertical projection of the branch air duct 201 in the height direction at least partially coincides with the annular airway 202, and the end wall of the branch air duct 201 is an exposed part 204, and the exposed part 204 is recessed and exposed to the annular airway 202. Specifically, by adopting the above technical solution, the vertical projection of the branch air duct at least partially coincides with the annular airway 202, expanding the volume of the annular gas buffer cavity and increasing the negative pressure buffer time at the seal.

[0063] Refer to Figure 2, in some embodiments of the present invention, the wafer alignment device further includes a housing 500, an optical detection module, a rotating member 550, an X-axis translation member 530, and a Z-axis lifting member 540. The housing 500 includes a top plate, side covers, and a base. A strip-shaped window 510 is formed in the middle of the top plate, and the supporting member 100 is arranged in the strip-shaped window 510. The optical detection module is used to detect the position of the wafer located on the suction cup portion 101. In some specific embodiments, the optical detection module includes a through-beam sensor 520 vertically arranged along the Z-axis. The through-beam sensor 520 is mounted on the top plate through a bracket. The through-beam sensor 520 emits a laser beam along the Z-axis direction to form a vertical detection plane; the through-beam sensor 520 includes a transmitting sensor and a receiving sensor, and the transmitting sensor and the receiving sensor are respectively mounted at the upper and lower ends of the bracket. A sensor outer cover is provided on the outer periphery of the through-beam sensor 520 located at the upper end. When the wafer is placed on the suction cup portion 101, the edge of the wafer blocks part of the laser beam. At this time, the through-beam sensor 520 can non-contact detect the edge coordinate points of the wafer on the suction cup portion 101. By adopting the above technical solution, the vertical detection plane formed by the optical detection module is used to perform non-contact position detection on the wafer, making the detection more accurate and not causing interference to the wafer.

[0064] Referring to Figure 9 , in some embodiments of the present invention, the rotating member 550 is fixedly connected to the bottom of the rotating shaft 200 and is used to drive the rotating shaft 200 to rotate around its own axis. In some embodiments, the rotating member 550 includes a first motor 551. The first motor 551 has an output shaft. A shaft hole is formed at the bottom of the rotating shaft 200, and the shaft hole is fixedly connected to the output shaft of the first motor 551. The specific connection method can be key connection, etc., which is not limited here.

[0065] Referring to Figure 10 , in some embodiments of the present invention, the X-axis translation member 530 is connected to the rotating support member 100 and is used to drive the rotating support member 100 to move along the length direction of the strip-shaped window 510. The Z-axis lifting member 540 is connected to the rotating support member 100 and is used to drive the bearing member to lift along the Z-axis. By using the rotating member 550 and the strip-shaped window 510, the degrees of freedom required by the alignment device are reduced, and the alignment of the wafer can be achieved only by X-axis translation and Z-axis translation. The X-axis translation member 530 includes an X-axis guiding and mounting plate 535. Among them, the first lead screw is driven by a third motor 534.

[0066] Referring to Figure 10 and Figure 11, in some embodiments of the present invention, the X-axis translation member 530 has a translation block 531. The translation block 531 is rigidly connected to the lifting plate 400 by bolts and integrates a first lead screw nut inside. The translation lead screw 532 extends horizontally along the X-axis and forms a high-precision ball screw thread fit with the first lead screw nut. The first guide rod 533 penetrates the translation block 531 along the X-axis direction, and both ends are fixedly connected to the inner wall of the housing 500 through the X-axis guide mounting plate 535 to form a double-rail guiding system. A guide sleeve is arranged outside the first guide rod 533. Through the synergistic effect of screw drive and guide rod constraint, the above structure realizes the linear motion of the translation block 531 along the length direction of the strip window 510.

[0067] In some embodiments of the present invention, the Z-axis lifting adopts a modular drive design. The second motor 541 is fixed to the bottom of the housing 500 through a mounting bracket, and its output shaft is coaxially connected to the lifting lead screw 543 through a coupling. The second guide rod 542 vertically penetrates the translation block 531, and the upper end is fixedly connected to the bottom of the lifting plate 400 through a locking nut. The second lead screw nut embedded inside the lifting plate 400 forms a bidirectional screw transmission pair with the lifting lead screw 543. Particularly, a rectangular sunken groove 544 is machined on the top surface of the translation block 531, and a stepped sunken platform is correspondingly provided at the bottom of the lifting plate 400. The two achieve axial positioning through a precisely machined insertion surface, forming a radial anti-deflection constraint during the Z-axis lifting process. This insertion structure effectively disperses the lateral load during the lifting process while ensuring the motion accuracy.

[0068] The beneficial effects of a wafer alignment device provided by the present invention are as follows: By using the designs of the central air duct 103, multi-branch air ducts 201, and annular air duct 202, through flow distribution and pressure equalization, structure strengthening, and dynamic response optimization, the problems of uneven gas distribution and response hysteresis of the traditional single air duct system are solved, and the process stability of precision manufacturing equipment can be significantly improved. Moreover, the first dynamic seal ring surface and the second dynamic seal ring surface formed by the dynamic seal 300 and the outer surface of the rotating shaft 200 further seal and protect the annular air duct 202, avoiding the phenomenon of wafer dropping caused by unstable negative pressure due to air pressure leakage.

[0069] Although the embodiments of the present invention have been described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are all within the scope and spirit of the present invention described in the claims. Moreover, the present invention described herein can have other embodiments and can be implemented or realized in various ways.

Claims

1. A wafer alignment device, characterized in that, include: A supporting member (100) comprises a suction cup portion (101) and a supporting body (102), wherein the supporting body (102) is provided with a central air channel (103) and an air guide flow diversion groove (104) which are connected to each other, wherein the air guide flow diversion groove (104) is located at an end of the supporting body (102) away from the suction cup portion (101), and the suction cup portion (101) has a vacuum adsorption area for adsorbing wafers; A driving alignment component, used for driving the suction cup portion (101) to align with the center of a wafer, comprising a lifting plate (400), wherein a mounting hole is provided in the lifting plate (400); A rotating shaft (200) is rotatably connected in the mounting hole, the rotating shaft (200) is fixedly connected to the bottom of the suction cup portion (101), the rotating shaft (200) is provided with a plurality of branch air passages (201) along a height direction, the branch air passages (201) are evenly distributed inside the rotating shaft (200) along a circumferential direction, and the rotating shaft (200) is provided with an annular air passage (202) along a circumferential direction; A dynamic seal (300) is relatively rotatably sleeved on the outer surface of the rotating shaft (200) and forms a first dynamic seal ring surface and a second dynamic seal ring surface; One end of each of the plurality of branch airways (201) is connected to the air guide diversion groove (104), and the other end is connected to the annular airway (202); the annular airway (202) is used to communicate with the outside; the first dynamic sealing ring surface and the second dynamic sealing ring surface are respectively arranged on the upper and lower sides of the annular airway (202) in the axial direction to form a sealed isolation for the annular airway (202).

2. The wafer alignment device according to claim 1, characterized in that, The supporting body (102) is provided with a groove, one end of the rotating shaft (200) is provided with a boss (203), the boss (203) is inserted into the groove, and a sealing ring (205) is provided on the outer cover of the boss (203).

3. A wafer alignment device according to claim 1, characterized in that, The air guiding flow dividing groove (104) comprises a plurality of guiding areas radially distributed at equal angles along the circumference, and the plurality of guiding areas respectively correspond to and are connected to a plurality of branch airways (201).

4. A wafer alignment device according to claim 1, wherein, The lifting plate (400) is provided with a first annular groove and a second annular groove along the axial direction of the mounting hole. The dynamic seal (300) comprises a first ring (301) and a second ring (302). The first ring (301) and the second ring (302) are respectively arranged in the first annular groove and the second annular groove. The first ring (301) and the second ring (302) both comprise an inner ring sealing portion (303) and an outer ring retaining portion (304) formed integrally. The outer ring retaining portion (304) is arranged in the first annular groove and the second annular groove. The inner ring sealing portion (303) covers the outer wall of the rotating shaft (200) and forms a first dynamic sealing annular surface and a second dynamic sealing annular surface.

5. A wafer alignment device according to claim 4, characterized in that, The lifting plate (400) has an airway wall (401) located between the first annular groove and the second annular groove for sealing the annular airway (202). The airway wall (401) is provided with air holes (403) penetrating through to the outer wall of the lifting plate (400), and a tracheal connector (402) is installed on the air holes (403).

6. A wafer alignment device according to claim 1, characterized in that The vertical projection of the branch airway (201) in the height direction coincides with at least a part of the annular airway (202). The end pipe wall of the branch airway (201) is an exposed part (204), and the exposed part (204) is concave and exposed to the annular airway (202).

7. A wafer alignment device according to claim 1, wherein Comprising: A housing (500) including a top plate with a strip-shaped window (510) opened in the middle thereof, and the supporting member (100) is arranged in the strip-shaped window (510); An optical detection module for detecting the position of the wafer located on the suction cup part (101); A rotating member (550) fixedly connected to the bottom of the rotating shaft (200) for driving the rotating shaft (200) to rotate around its own axis; An X-axis translation member (530) connected to the supporting member (100) for driving the supporting member (100) to move along the length direction of the strip-shaped window (510); A Z-axis lifting member (540) connected to the supporting member (100) for driving the supporting member (100) to lift along the Z-axis.

8. A wafer alignment device according to claim 7, characterized in that, The optical detection module includes opposed sensors (520) vertically arranged along the Z-axis. The opposed sensors (520) emit laser beams along the Z-axis direction to form a vertical detection plane; When the wafer is placed on the suction cup part (101), the edge of the wafer blocks part of the laser beams. At this time, the opposed sensors (520) can non-contact detect the edge coordinate points of the wafer on the suction cup part (101).

9. The wafer alignment device according to claim 7, wherein The X-axis translation member (530) includes: A translation block (531) located inside the housing (500) and connected to the lifting plate (400). A first lead screw nut is arranged inside the translation block (531); A translation lead screw (532) threadedly engaged with the first lead screw nut along the X-axis direction; A first guide rod (533) passing through the inside of the translation block (531) and fixedly connected to the inner wall of the housing (500) along the X-axis direction.

10. A wafer alignment device according to claim 9, characterized in that, The rotating member (550) includes: a first motor (551) having an output shaft, and the output shaft is coaxially arranged and fixedly connected to the rotating shaft (200).

11. A wafer alignment device according to claim 9, characterized in that, The Z-axis lifting member (540) includes: A second motor (541) installed inside the housing (500); A second guide rod (542) with one end fixedly connected to the bottom of the lifting plate (400) and the other end slidably passing through the translation block (531); A lifting lead screw (543) fixedly connected to the output shaft of the second motor (541). A second lead screw nut is arranged inside the lifting plate (400), and the lifting lead screw (543) is threadedly engaged with the second lead screw nut; Wherein, the translation block (531) is provided with a sunken groove (544), the bottom of the lifting plate (400) is provided with a sunken platform, and the sunken platform is inserted and matched with the sunken groove (544).

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