Chip assembly, control method thereof and electronic equipment

Abstract

The invention discloses a chip assembly, a control method thereof and electronic equipment, and belongs to the technical field of electronic equipment. The chip assembly comprises a chip, the chip comprises a welding part, and the welding part is used for being welded to a circuit board; the temperature-sensitive element is used for exchanging heat with the welding part; wherein the temperature-sensitive unit is further used for being connected to a detection assembly, and the detection assembly is used for detecting parameters of the temperature-sensitive element and determining the temperature of the welding part according to the parameters of the temperature-sensitive element.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to a chip component and a control method thereof, and electronic equipment. Background Art

[0002] With the rapid development of semiconductor integrated circuit technology, more and more transistors can be integrated on a single chip, providing a wide space for chip design. As a result, the heat density will become higher and higher within a limited volume, causing the heat dissipation problem of high-power semiconductor devices to become more and more serious. Figure 1 As shown, in electronic products, chips are usually connected to circuit boards through solders such as solder balls. However, the chip solder balls crack due to thermal problems, that is, the solder used for soldering to the circuit board cracks, resulting in an increasingly high chip defect rate.

[0003] In the related art, the temperature detection of the chip can only be achieved by setting a temperature sensor and combining related software to realize the temperature detection of the central processing unit (CPU), graphics processing unit (GPU) and other components inside the chip, but the detection of the solder temperature cannot be achieved. Therefore, how to accurately detect the solder temperature of the chip has become a technical problem that needs to be solved urgently. Summary of the invention

[0004] The present application aims to provide a chip assembly and a control method thereof, and an electronic device, which can solve the technical problem in the related art that the solder temperature of the chip cannot be accurately detected.

[0005] In a first aspect, an embodiment of the present application provides a chip component, including:

[0006] The chip includes a welding portion, and the welding portion is used for welding with the circuit board;

[0007] A temperature-sensitive element, which is used for heat exchange with the welding part;

[0008] The temperature-sensitive element is also used to be connected to a detection component, and the detection component is used to detect parameters of the temperature-sensitive element and determine the temperature of the welding part according to the parameters of the temperature-sensitive element.

[0009] In a second aspect, an embodiment of the present application provides a control method of a chip component, which is used for the chip component of the first aspect. The control method includes:

[0010] Get the parameters of the temperature-sensitive element;

[0011] Determine the temperature of the welding part according to the parameters of the temperature-sensitive element;

[0012] When the temperature of the soldering portion is greater than or equal to the temperature threshold, the chip operation is controlled according to the temperature of the soldering portion.

[0013] In a third aspect, an embodiment of the present application provides an electronic device, including:

[0014] Circuit boards;

[0015] As in the chip assembly of the first aspect, the chip assembly is connected to a circuit board.

[0016] The chip assembly of the embodiment of the present application is provided with a temperature-sensitive element and a detection assembly. Through the temperature-sensitive element, heat exchange with the welding part of the chip can be realized during the operation of the chip. The parameters of the temperature-sensitive element will change with the change of its own temperature. Further, the temperature-sensitive element can be connected to the detection assembly. By detecting the parameters of the temperature-sensitive element through the detection assembly, the temperature of the temperature-sensitive element can be determined. Since the temperature change of the temperature-sensitive element is caused by the temperature change of the welding part, the temperature of the welding part can be detected while determining the temperature of the temperature-sensitive element. Therefore, when the temperature of the welding part is too high, the operation process of the chip can be controlled to avoid problems such as cracking due to excessive temperature of the welding part, thereby avoiding chip failure.

[0017] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 A schematic diagram showing the structure of the solder of a chip in the related art is shown;

[0020] Figure 2 One of the structural schematic diagrams of the chip assembly of an embodiment of the present application is shown;

[0021] Figure 3 The second structural schematic diagram of the chip assembly of the embodiment of the present application is shown;

[0022] Figure 4 The third structural schematic diagram of the chip assembly of the embodiment of the present application is shown;

[0023] Figure 5 A fourth structural schematic diagram of a chip assembly according to an embodiment of the present application is shown;

[0024] Figure 6 A schematic flow chart showing a method for controlling a chip assembly according to an embodiment of the present application is shown;

[0025] Figure 7 A schematic structural diagram of an electronic device according to an embodiment of the present application is shown.

[0026] Reference numerals:

[0027] 100 chip assembly, 102 chip, 104 welding part, 106 temperature-sensitive element, 108 detection assembly, 110 packaging layer, 112 functional module, 114 temperature-sensitive film, 116 thermal conductive element, 118 temperature-sensitive resistor, 120 power module, 122 detection module, 124 digital-to-analog converter, 126 switch element, 128 wiring layer, 200 electronic device, 202 circuit board, 204 housing. DETAILED DESCRIPTION

[0028] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0029] The features of the terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, the meaning of "plurality" is two or more.

[0030] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, fixed connection, detachable connection, or integral connection; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, and internal communication between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] Combine the following Figures 2 to 7 A chip component and a control method thereof, and an electronic device according to an embodiment of the present application are described.

[0032] In some embodiments of the present application, a chip assembly is provided. Figure 2 FIG. 1 shows one of the structural schematic diagrams of the chip assembly of an embodiment of the present application; Figure 2As shown, the chip assembly 100 includes: a chip 102, the chip 102 includes a soldering portion 104, the soldering portion 104 is used for soldering with a circuit board 202; a temperature-sensitive element 106, the temperature-sensitive element 106 is used for heat exchange with the soldering portion 104; the temperature-sensitive element 106 is also used to connect to a detection assembly 108, the detection assembly 108 is used to detect parameters of the temperature-sensitive element 106, and determine the temperature of the soldering portion 104 according to the parameters of the temperature-sensitive element 106.

[0033] In the embodiment of the present application, the chip assembly 100 may include a chip 102, a temperature-sensitive element 106, and a detection assembly 108, wherein the chip 102 includes a welding portion 104, through which the chip 102 may be welded to the circuit board 202. Specifically, the welding portion 104 may be a solder ball, and during the welding process, the solder ball is heated to at least partially melt, and then the melted solder ball is fused with the solder joint on the circuit board 202, and after waiting for the solder ball to cool and solidify, the welding of the chip 102 may be completed.

[0034] Furthermore, the temperature-sensitive element 106 can realize heat exchange with the soldering portion 104, that is, during the operation of the chip 102, the heat generated by the soldering portion 104 can be transferred to the temperature-sensitive element 106, thereby increasing the temperature of the temperature-sensitive element 106. At the same time, the parameters of the temperature-sensitive element 106 can change with the change of its own temperature, for example, the resistance value and other parameters of the temperature-sensitive element 106. When the temperature of the temperature-sensitive element 106 changes, the parameters of the temperature-sensitive element 106 can be detected by the detection component 108, so that the temperature change of the temperature-sensitive element 106 can be determined. Since the temperature change of the temperature-sensitive element 106 is caused by the temperature change of the soldering portion 104, the temperature change of the soldering portion 104 can be determined by detecting the parameter change of the temperature-sensitive element 106.

[0035] The chip assembly 100 itself may include a detection assembly 108, so that the data detected by the detection assembly 108 is directly processed through the chip 102 of the chip assembly 100, so that the detection assembly 108 detects the parameters of the temperature-sensitive element 106. Alternatively, the detection assembly 108 may also be a separate detection device outside the chip assembly 100. During the operation of the chip assembly 100, the temperature change of the temperature-sensitive element 106 is collected through the external detection assembly 108 to detect the parameters of the temperature-sensitive element 106.

[0036] For example, Figure 2 As shown, the temperature sensitive element 106 can be arranged inside the chip, that is, Figure 2The temperature sensitive element 106 can be placed at position A in the middle of the circuit board 202, so that it can directly contact the soldering portion 104, and then directly exchange heat with the soldering portion 104. Alternatively, when the chip assembly 100 is placed on the circuit board 202, the temperature sensitive element 106 can be placed at a position away from the chip assembly 100 on the circuit board 202, that is, Figure 2 The temperature sensitive element is placed at position B, so that the temperature sensitive element can perform indirect heat exchange with the soldering portion 104 through the heat exchange element on the circuit board 202 .

[0037] That is, by detecting the parameter changes of the temperature-sensitive element 106, it is possible to accurately detect whether the temperature of the welding portion 104 is too high. Furthermore, when the temperature of the welding portion 104 is too high, the operation process of the chip 102 can be controlled to avoid problems such as cracking caused by excessive temperature of the welding portion 104, thereby avoiding failure of the chip 102.

[0038] In addition, it should be noted that the chip 102 may include multiple soldering parts 104, and accordingly, a temperature-sensitive element 106 may be provided for each soldering part 104 to detect the temperature of each soldering part 104. Alternatively, a temperature-sensitive element 106 may be provided for a specific soldering part 104 that is prone to heat and cracking among the multiple soldering parts 104 to detect the temperature of the soldering part 104 that is prone to heat and cracking.

[0039] The chip component 100 of the embodiment of the present application is provided with a temperature-sensitive element 106 and a detection component 108. Through the temperature-sensitive element 106, heat exchange can be achieved with the welding part 104 of the chip 102 during the operation of the chip 102. The parameters of the temperature-sensitive element 106 will change with the change of its own temperature. Further, the temperature-sensitive element 106 can be connected to the detection component 108. The parameters of the temperature-sensitive element 106 can be detected by the detection component 108 to determine the temperature of the temperature-sensitive element 106. Since the temperature change of the temperature-sensitive element 106 is based on the temperature change of the welding part 104, while determining the temperature of the temperature-sensitive element 106, the temperature of the welding part 104 is also detected. Therefore, when the temperature of the welding part 104 is too high, the operation process of the chip 102 can be controlled to avoid problems such as cracking due to excessive temperature of the welding part 104, thereby avoiding failure of the chip 102.

[0040] In some embodiments of the present application, Figure 3 The second structural schematic diagram of the chip assembly of the embodiment of the present application is shown; Figure 3As shown, the chip 102 includes: a packaging layer 110; a functional module 112, which is arranged in the packaging layer 110, wherein a portion of the welding portion 104 is located in the packaging layer 110 and is electrically connected to the functional module 112; the temperature-sensitive element 106 includes: a temperature-sensitive film 114, which is arranged in the packaging layer 110 and is attached to the welding portion 104, and the temperature-sensitive film 114 is connected to the detection component 108.

[0041] In the embodiment of the present application, the chip 102 may include a packaging layer 110 and a functional module 112 disposed inside the packaging layer 110. It is understood that the functional module 112 may be a structure such as a transistor, a logic gate circuit, etc., to implement the main logic computing function of the chip 102. Through the packaging layer 110, the functional module 112 of the chip 102 can be integrated and protected to ensure the miniaturized design and structural integrity of the chip 102.

[0042] Part of the soldering part 104 is located inside the packaging layer 110 to achieve electrical connection between the soldering part 104 and the functional module 112 inside the packaging layer 110, while another part of the soldering part 104 can be located on the surface of the packaging layer 110 to achieve soldering with the circuit board 202. In this way, when the chip 102 is soldered on the circuit board 202, the functional module 112 inside the chip 102 can be electrically connected to the wiring on the circuit board 202 through the soldering part 104, thereby achieving the control function of the chip 102. Specifically, the soldering part 104 can be electrically connected to the functional module 112 through the wiring layer 128 inside the packaging layer 110.

[0043] Furthermore, the temperature-sensitive element 106 may include a temperature-sensitive film 114, which may be disposed inside the encapsulation layer 110 of the chip 102 and fit with the portion of the soldering portion 104 located inside the encapsulation layer 110, thereby achieving heat exchange with the soldering portion 104. At the same time, the temperature-sensitive film 114 is also connected to the detection component 108, so that the detection component 108 can detect the parameters of the temperature-sensitive film 114, thereby achieving the detection of the temperature of the soldering portion 104.

[0044] It is understandable that the resistance value of the temperature-sensitive film 114 can change with the change of its own temperature. During the operation of the chip 102, when the temperature of the welding part 104 changes, the temperature of the temperature-sensitive film 114 also changes accordingly. At the same time, the resistance value of the temperature-sensitive film 114 changes. The resistance value of the temperature-sensitive film 114 is detected by the detection component 108 to determine the temperature of the welding part 104. At the same time, due to the small volume of the temperature-sensitive film 114, the temperature-sensitive film 114 can be set inside the packaging layer 110 of the chip 102, and the miniaturization design of the chip 102 will not be affected while the temperature of the welding part 104 is accurately detected.

[0045] In some embodiments of the present application, the temperature sensitive film 114 includes a polysilicon film or a silicon nitride film.

[0046] In the embodiment of the present application, the temperature-sensitive film 114 can be a polysilicon film or a silicon oxide film, that is, the temperature-sensitive film 114 can be made of polysilicon material or silicon oxide material. It is understandable that the resistance value of polysilicon material and silicon oxide material can change with their own temperature, and then the temperature of the welding part 104 can be detected by detecting the resistance value of the polysilicon film or the silicon nitride film while performing heat exchange with the welding part 104.

[0047] In addition, by setting the temperature-sensitive film 114 to a polysilicon film or a silicon nitride film, the same semiconductor process as that used for components such as the CUP in the chip 102 can be used to integrate the polysilicon film or the silicon nitride film into the packaging layer 110 of the chip 102, without adding additional R&D costs for the integration of the temperature-sensitive film 114.

[0048] In some embodiments of the present application, Figure 5 FIG. 4 shows a fourth structural diagram of a chip assembly according to an embodiment of the present application; Figure 5 As shown, the chip assembly 100 further includes: a heat conductor 116 , which is disposed on the circuit board 202 and fits the soldering portion 104 ; the temperature-sensitive element 106 includes: a thermistor 118 , which fits the heat conductor 116 and is connected to the detection assembly 108 .

[0049] In the embodiment of the present application, the temperature-sensitive element 106 may further include a temperature-sensitive resistor 118 , and heat exchange between the temperature-sensitive resistor 118 and the welding portion 104 is achieved through the heat-conducting member 116 .

[0050] Specifically, the chip assembly 100 may include a heat-conducting member 116, which may be disposed on the circuit board 202. When the chip 102 is soldered on the circuit board 202, the heat-conducting member 116 may be attached to the soldering portion 104 of the chip 102 to ensure that when the temperature of the soldering portion 104 rises, the heat can be transferred to the heat-conducting member 116. Further, the temperature-sensitive resistor 118 may also be disposed on the circuit board 202, and the temperature-sensitive resistor 118 may be attached to the heat-conducting member 116, so that when the temperature of the heat-conducting member 116 rises, the temperature of the temperature-sensitive resistor 118 also rises. In this way, by detecting the parameters of the temperature-sensitive resistor 118 through the detection assembly 108, the temperature of the soldering portion 104 can be determined, thereby realizing the detection of the temperature of the soldering portion 104.

[0051] By providing a heat conductor 116 and achieving heat exchange between the thermistor 118 and the welding portion 104 through the heat conductor 116, the thermistor 118 does not need to be integrated into the packaging layer 110 of the chip 102, and the temperature of the welding portion 104 of the chip 102 can be detected without changing the structure of the chip 102 itself.

[0052] Specifically, the heat conducting member 116 can be made of metal copper, which has a thermal conductivity of 401 W / (m·K) and has good thermal conductivity. Alternatively, the heat conducting member 116 can also be made of other materials with good thermal conductivity to ensure that the heat conducting member 116 can effectively transfer the heat generated by the welding portion 104 to the temperature sensitive resistor 118. In addition, the temperature sensitive resistor 118 can also be replaced by other temperature sensors, which can effectively sense the temperature of the welding portion 104 when the temperature of the heat conducting member 116 changes.

[0053] In some embodiments of the present application, Figure 5 As shown, the welding portion 104 is welded to one side of the circuit board 202, one end of the heat conductor 116 is in contact with the welding portion 104, the other end of the heat conductor 116 passes through the circuit board 202 and is located on the other side of the circuit board 202, and the thermistor 118 is arranged on the other side of the circuit board 202.

[0054] In the embodiment of the present application, the soldering portion 104 of the chip 102 can be soldered to one side of the circuit board 202, that is, the chip 102 is disposed on one side of the circuit board 202. At the same time, one end of the heat conducting member 116 is attached to the soldering portion 104, and the other end of the heat conducting member 116 passes through the circuit board 202 and is located on the other side of the circuit board 202.

[0055] That is, the entire heat-conducting member 116 passes through the circuit board 202, and one end of the heat-conducting member 116 is located on the side of the circuit board 202 where the chip 102 is disposed, while the other end of the heat-conducting member 116 is disposed on the other side of the circuit board 202. In this way, the temperature-sensitive resistor 118 can be disposed on the side of the circuit board 202 where the chip 102 is not disposed, and on the basis of realizing heat exchange between the temperature-sensitive resistor 118 and the welding portion 104 through the heat-conducting member 116, the temperature-sensitive resistor 118 does not need to be disposed on the side of the circuit board 202 where the chip 102 is disposed, thereby saving layout space on the circuit board 202.

[0056] In some embodiments of the present application, Figure 4 The third structural diagram of the chip assembly of the embodiment of the present application is shown as follows: Figure 4 As shown, the chip component 100 also includes: a power module 120, one end of the temperature-sensitive element 106 is connected to the power module 120; the detection component 108 includes a detection module 122, the detection module 122 is connected to the other end of the temperature-sensitive element 106, and the detection module 122 is used to determine the temperature of the welding part 104 according to the voltage value of the temperature-sensitive element 106.

[0057] In the embodiment of the present application, the chip assembly 100 may further include a power module 120 (VCC), and one end of the temperature sensitive element 106 is connected to the power module 120. Through the power module 120, a voltage may be applied to the temperature sensitive element 106, thereby causing a current to flow through the temperature sensitive element 106.

[0058] Furthermore, the detection component 108 may include a detection module 122, which is connected to the other end of the temperature-sensitive element 106. Through the detection module 122, the voltage value of the temperature-sensitive element 106 can be detected, and then the resistance value of the temperature-sensitive element 106 can be determined according to the voltage value of the temperature-sensitive element 106 and the voltage value provided by the power module 120. Then, according to the resistance value of the temperature-sensitive element 106, the current temperature value of the temperature-sensitive element 106 can be determined. Since the temperature change of the temperature-sensitive element 106 is based on the temperature change of the welding part 104, after determining the temperature value of the temperature-sensitive element 106, the temperature value of the welding part 104 can also be determined, thereby realizing the detection of the temperature of the welding part 104.

[0059] In some embodiments of the present application, Figure 4 As shown, the detection component 108 also includes: a digital-to-analog converter 124, which is connected between the temperature-sensitive element 106 and the detection module 122 and is used to convert the analog signal of the voltage value of the temperature-sensitive element 106 into a digital signal.

[0060] In the embodiment of the present application, the detection component 108 may further include an analog to digital converter 124 (ADC), one end of the analog to digital converter 124 is connected to the temperature-sensitive element 106, and the other end of the analog to digital converter 124 may be connected to the detection module 122, that is, the analog to digital converter 124 is arranged between the temperature-sensitive element 106 and the detection module 122. Through the analog to digital converter 124, the analog signal of the voltage value of the temperature-sensitive element 106 can be converted into a digital signal, and the digital signal obtained after the conversion is transmitted to the detection module 122, so that the detection module 122 can calculate the resistance value of the temperature-sensitive element 106 according to the digital signal of the voltage value of the temperature-sensitive element 106.

[0061] In some embodiments of the present application, Figure 4 As shown, the detection assembly 108 further includes: a switch 126 , one end of which is connected to the power module 120 , and the other end of which is connected to one end of the temperature-sensitive element 106 .

[0062] In the embodiment of the present application, the detection component 108 may further include a switch 126, one end of the switch 126 is connected to the power module 120, and the other end of the switch 126 is connected to the temperature sensitive element 106. That is, the switch 126 is disposed between the power module 120 and the temperature sensitive element 106.

[0063] By setting the switch 126, it is possible to actively set whether to detect the temperature of the soldering portion 104, that is, when it is necessary to detect the temperature of the soldering portion 104, the switch 126 is controlled to be closed, so that the power module 120 can supply power to the temperature-sensitive element 106, and then the voltage value of the temperature-sensitive element 106 is detected by the detection module 122 to detect the temperature of the soldering portion 104. On the contrary, when it is not necessary to detect the temperature of the soldering portion 104, for example, when the chip assembly 100 is not running, or the running power is low, and there is no possibility that the soldering portion 104 is damaged due to excessive temperature, the switch 126 can be disconnected, and at this time, the power module 120 does not supply power to the temperature-sensitive element 106, thereby reducing the power consumption of the chip assembly 100.

[0064] In some embodiments of the present application, the chip component 100 also includes: a power module 120, the temperature-sensitive element 106 and the welding part 104 are both connected to the power module 120; the detection component 108 is connected to the welding part 104, and the detection component 108 is used to detect the voltage value of the welding part 104, and determine the voltage value of the temperature-sensitive element 106 according to the voltage value of the welding part 104, so as to determine the temperature of the welding part 104 according to the voltage value of the temperature-sensitive element 106.

[0065] In the embodiment of the present application, the chip assembly 100 further includes a power module 120, and the power module 120 can be connected to the temperature-sensitive element 106 and the welding part 104 at the same time. At the same time, the detection assembly 108 can be connected to the welding part 104, so as to detect the voltage value of the welding part 104, and then, according to the voltage value of the welding part 104, the voltage value of the temperature-sensitive element 106 can be determined, and then according to the voltage value of the temperature-sensitive element 106 and the voltage value provided by the power module 120, the resistance value of the temperature-sensitive element 106 can be determined, and then according to the resistance value of the temperature-sensitive element 106, the current temperature value of the temperature-sensitive element 106 can be determined, and since the temperature change of the temperature-sensitive element 106 is caused by the temperature change of the welding part 104, after determining the temperature value of the temperature-sensitive element 106, the temperature value of the welding part 104 can also be determined, thereby realizing the detection of the temperature of the welding part 104.

[0066] It can be understood that the temperature-sensitive element 106 and the welding part 104 are both connected to the power module 120, so the temperature-sensitive element 106 and the welding part 104 constitute two voltage-dividing circuits of the power module 120, and the detection component 108 can directly detect the voltage value of the temperature-sensitive element 106 to determine the resistance value of the temperature-sensitive element 106. The voltage value of the welding part 104 can also be detected, and then the voltage value of the temperature-sensitive element 106 can be determined according to the principle of the voltage-dividing circuit.

[0067] It should be noted that when the resistance value of the temperature-sensitive element 106 itself is very small, for example, when the temperature-sensitive element 106 is a temperature-sensitive film 114, the voltage value of the temperature-sensitive element 106 will also be very small. At this time, the detection component 108 may not be able to effectively detect the voltage value of the temperature-sensitive element 106, or the detected voltage value of the temperature-sensitive element 106 may have a large error. Compared with the temperature-sensitive film 114, the resistance value of the welding part 104 is relatively large, and thus the voltage value of the welding part 104 is also relatively large. At this time, detecting the voltage value of the welding part 104 can effectively ensure the accuracy of the voltage value detection, and then determine the voltage value of the temperature-sensitive film 114 according to the voltage value of the welding part 104, that is, ensure the accuracy of the voltage value detection of the temperature-sensitive film 114, and then ensure the accuracy of the temperature detection of the welding part 104.

[0068] In some embodiments of the present application, a control method of a chip component is proposed, which is used for a chip component as in any of the above embodiments. Figure 6 A schematic diagram showing a flow chart of a control method of a chip assembly according to an embodiment of the present application is shown; Figure 6 As shown, the control method of the chip component includes:

[0069] Step 302, obtaining parameters of the temperature sensitive element;

[0070] Step 304, determining the temperature of the welding portion according to the parameters of the temperature sensitive element;

[0071] Step 306, when the temperature of the welding part is greater than or equal to the temperature threshold, control the operation of the chip according to the temperature of the welding part.

[0072] In the embodiment of the present application, by detecting the parameter change of the temperature-sensitive element, and then determining the temperature of the welding part according to the parameter of the temperature-sensitive element, it is possible to accurately detect whether the temperature of the welding part is too high, that is, to determine whether the temperature of the welding part is greater than or equal to the temperature threshold. Furthermore, when the temperature of the welding part is greater than or equal to the temperature threshold, by controlling the operation process of the chip, problems such as cracking caused by too high temperature of the welding part can be avoided, and chip failure can be avoided.

[0073] Specifically, the temperature threshold can be determined according to the temperature of the welding part and the fault situation during the operation test of the chip.

[0074] The control method of the chip component in the embodiment of the present application can realize heat exchange with the welding part of the chip during the operation of the chip through the temperature-sensitive element. The parameters of the temperature-sensitive element will change with the change of its own temperature. Further, by detecting the parameters of the temperature-sensitive element by the detection component, the temperature of the temperature-sensitive element can be determined. Since the temperature change of the temperature-sensitive element is caused by the temperature change of the welding part, while determining the temperature of the temperature-sensitive element, the temperature of the welding part is also detected. When the temperature of the welding part is too high, the operation process of the chip can be controlled according to the temperature of the welding part, avoiding problems such as cracking caused by too high temperature of the welding part and chip failure.

[0075] In some embodiments of the present application, when the temperature of the welding part is greater than or equal to the temperature threshold, controlling the operation of the chip according to the temperature of the welding part includes: determining the target operating frequency of the chip according to the temperature of the welding part; controlling the operating frequency of the chip to switch from the current operating frequency to the target operating frequency; wherein, the target operating frequency is less than the current operating frequency.

[0076] In the embodiment of the present application, when the temperature of the welding part is greater than or equal to the temperature threshold, the operation of the chip can be controlled by gradually reducing the power according to the specific temperature of the welding part. In this way, not only can the temperature of the welding part be reduced to prevent the welding part from cracking, but also the chip does not need to be directly controlled to stop running, ensuring the operation progress of the chip.

[0077] Specifically, determine the target operating power of the corresponding chip according to the specific temperature of the welding part. For example, when the temperature of the welding part is relatively high, the target operating power can be set to a relatively low operating power. If the temperature of the welding part exceeds the temperature threshold but does not reach a relatively high level, the target operating power can be set to a relatively high operating power at this time.

[0078] In some embodiments of the present application, the chip includes multiple operating cores, and the control method further includes: when the temperature of the welding portion is greater than or equal to the temperature threshold, reducing the number of operating cores in operation.

[0079] In an embodiment of the present application, the operating temperature of the chip can be lowered by reducing the number of running cores of the chip, that is, lowering the temperature of the welding part. In this way, the temperature of the welding part can be lowered to prevent cracking of the welding part, and the operation progress of the chip can be guaranteed without directly controlling the chip to stop running.

[0080] It is understandable that a chip may generally include multiple operating cores, such as 4 cores, 8 cores, 16 cores, etc. When the temperature of the soldering part is detected to be high, one or more of the multiple operating cores may be stopped, and only a few operating cores may be kept running. For example, when the temperature of the soldering part is high, the large core or medium core with stronger computing power among the multiple operating cores may be stopped. After the temperature of the soldering part is reduced, the operation of the large core and the medium core is resumed, and the operation of the small core among the multiple operating cores is stopped. This reduces the operating temperature of the chip.

[0081] In some embodiments, when it is detected that the temperature of the welding part is too high, other control strategies can be used to control the operation of the chip. For example, an external air-cooled heat dissipation device or a water-cooled heat dissipation device can be used to dissipate heat from the chip to reduce the chip temperature. Alternatively, when the chip is connected to the network, the operation of the chip can be reduced by controlling the modem (Mondem) to reduce the frequency of network data transmission and reception, switch the network format, or cut off the network connection, thereby reducing the temperature of the chip.

[0082] In some embodiments of the present application, Figure 7 A schematic diagram of the structure of an electronic device according to an embodiment of the present application is shown. Figure 7 As shown, an electronic device 200 is proposed, including: a circuit board 202; and a chip assembly 100 as in any one of the above embodiments, wherein the chip assembly 100 is connected to the circuit board 202.

[0083] In addition, the electronic device 200 further includes a housing 204 , and the circuit board 202 and the chip assembly 100 are both disposed in the housing 204 , so that the circuit board 202 and the chip assembly 100 are protected by the housing 204 .

[0084] The electronic device 200 provided in the embodiment of the present application has the chip assembly 100 as in any of the above embodiments, and thus has the beneficial effects of any of the above embodiments, which are not described in detail here.

[0085] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0086] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A chip assembly, characterized in that: include: A chip, wherein the chip comprises a welding portion, and the welding portion is used for welding with a circuit board; A temperature-sensitive element, the temperature-sensitive element being used for heat exchange with the welding portion; The temperature-sensitive element is also used to be connected to a detection component, and the detection component is used to detect parameters of the temperature-sensitive element and determine the temperature of the welding portion according to the parameters of the temperature-sensitive element.

2. The chip assembly according to claim 1, characterized in that: The chip comprises: Encapsulation layer; A functional module is disposed in the packaging layer, wherein a portion of the welding portion is located in the packaging layer and is electrically connected to the functional module; The temperature sensitive element comprises: The temperature-sensitive film is arranged in the packaging layer and adheres to the welding portion. The temperature-sensitive film is connected to the detection component.

3. The chip assembly according to claim 2, characterized in that: The temperature sensitive film includes a polysilicon film or a silicon nitride film.

4. The chip assembly according to claim 1, characterized in that: The chip assembly also includes: A heat conducting member, the heat conducting member is disposed on the circuit board and is in contact with the welding portion; The temperature sensitive element comprises: The temperature-sensitive resistor is fitted with the heat-conducting component and is connected to the detection component.

5. The chip assembly according to claim 4, characterized in that: The welding part is welded to one side of the circuit board, one end of the heat conductor is in contact with the welding part, the other end of the heat conductor passes through the circuit board and is located at the other side of the circuit board, and the thermistor is arranged at the other side of the circuit board.

6. The chip assembly according to any one of claims 1 to 5, characterized in that: The chip assembly also includes: A power module, the temperature-sensitive element and the welding portion are both connected to the power module; The detection component is connected to the welding part, and is used to detect the voltage value of the welding part, and determine the voltage value of the temperature sensitive element according to the voltage value of the welding part, so as to determine the temperature of the welding part according to the voltage value of the temperature sensitive element.

7. A control method for a chip assembly, used for the chip assembly according to any one of claims 1 to 6, characterized in that: The control method comprises: Obtaining parameters of the temperature-sensitive element; Determining the temperature of the welding part according to the parameters of the temperature-sensitive element; When the temperature of the soldering portion is greater than or equal to a temperature threshold, the chip is controlled to operate according to the temperature of the soldering portion.

8. The control method according to claim 7, characterized in that: When the temperature of the soldering portion is greater than or equal to a temperature threshold, controlling the chip to operate according to the temperature of the soldering portion includes: determining a target operating frequency of the chip according to the temperature of the soldering portion; Controlling the operating frequency of the chip to switch from the current operating frequency to the target operating frequency; Wherein, the target operating frequency is less than the current operating frequency.

9. The control method according to claim 7, characterized in that: The chip includes multiple operating cores, and the control method further includes: When the temperature of the soldering portion is greater than or equal to a temperature threshold, the number of the running cores is reduced.

10. An electronic device, characterized in that: include: Circuit boards; The chip assembly according to any one of claims 1 to 6, wherein the chip assembly is connected to the circuit board.

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