Dielectric waveguide interconnection structure, manufacturing method and communication equipment

Abstract

The invention discloses a dielectric waveguide interconnection structure, a manufacturing method and communication equipment, and relates to the technical field of communication. A cavity structure exists in the dielectric plate; the cavity structure is filled with air to form a hollow dielectric waveguide; the hollow dielectric waveguide is used for transmitting electromagnetic waves. The cavity structure is arranged in the dielectric plate, and the hollow dielectric waveguide formed by filling the cavity structure with air is used for transmitting the electromagnetic waves, so that compared with the prior art that the electromagnetic waves are transmitted through the dielectric plate, the space of the hollow dielectric waveguide for transmitting the electromagnetic waves is smaller than that of the dielectric plate, the influence of lateral radiation is reduced, and the loss is effectively reduced; and the transmission performance is improved.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a dielectric waveguide interconnection structure, a manufacturing method and a communication device. Background Art

[0002] In communication systems, interconnect structures used to connect different components or nodes to achieve the transmission of electromagnetic wave signals are an indispensable key component in integrated circuits. As data transmission rates become faster and faster, signal integrity requirements for high-speed interconnect technology are also increasing. Planar interconnect structures such as microstrip lines and coplanar waveguides have the characteristics of simple manufacturing processes and easy integration with active and passive circuits. They are widely used as interconnect structures in communication systems.

[0003] However, the existing interconnect structure transmits electromagnetic waves through its dielectric plate. The transmission area of ​​the electromagnetic waves is large and faces serious lateral radiation problems. When the operating frequency is high, such as reaching sub-terahertz (0.1–0.3 THz), the loss will increase, affecting the transmission performance. Summary of the invention

[0004] The main purpose of the present application is to provide a dielectric waveguide interconnect structure, which aims to solve the technical problem that the prior art faces serious lateral radiation problems, which will increase losses and affect transmission performance.

[0005] To achieve the above-mentioned object, the present application provides a dielectric waveguide interconnection structure, the dielectric waveguide interconnection structure comprising: a dielectric plate; There is a cavity structure inside the dielectric plate; The cavity structure is filled with air to form a hollow dielectric waveguide; Wherein, the hollow dielectric waveguide is used to transmit electromagnetic waves.

[0006] In one embodiment, the hollow dielectric waveguide is a rectangular waveguide.

[0007] In one embodiment, the dielectric plate includes an air layer; The air layer comprises: a first air layer and a second air layer which are symmetrical to each other; The symmetry axis regions of the first air layer and the second air layer are the cavity structures.

[0008] In one embodiment, air holes perpendicular to the propagation direction of the electromagnetic wave are provided in the dielectric plate regions on both sides of the air layer.

[0009] In one embodiment, the dielectric plate further comprises: a first cladding structure and a second cladding structure; The first cladding structure and the second cladding structure are arranged on both sides of the air layer; A plurality of the air holes are formed in both the first cladding structure and the second cladding structure; The air holes in the first cladding structure are symmetric with the air holes in the second cladding structure based on the air layer.

[0010] In one embodiment, each of the air holes is arranged along the electromagnetic wave propagation direction.

[0011] In addition, to achieve the above object, the present application further provides a method for manufacturing a dielectric waveguide interconnection structure, the method for manufacturing the dielectric waveguide interconnection structure including the following steps: Obtain a dielectric plate; Open a cavity structure inside the dielectric plate; Fill air into the cavity structure to form a hollow dielectric waveguide for transmitting electromagnetic waves.

[0012] In one embodiment, the step of opening a cavity structure inside the dielectric plate includes: Divide the dielectric plate into an air layer composed of a symmetric first air layer and a second air layer; Determine a symmetry axis region between the first air layer and the second air layer in the air layer; Open a cavity structure in the symmetry axis region.

[0013] In one embodiment, after the step of filling air into the cavity structure to form a hollow dielectric waveguide for transmitting electromagnetic waves, the method further includes: Determine the dielectric plate regions on both sides of the air layer; Open a plurality of air holes perpendicular to the electromagnetic wave propagation direction in the dielectric plate regions, and each of the air holes is arranged along the electromagnetic wave propagation direction.

[0014] In addition, to achieve the above object, the present application further provides a communication device, the communication device including the dielectric waveguide interconnection structure described above.

[0015] One or more technical solutions proposed by the present application have at least the following technical effects: The dielectric waveguide interconnection structure disclosed in the present application includes: a dielectric plate; a cavity structure exists inside the dielectric plate; the cavity structure is filled with air to form a hollow dielectric waveguide; wherein, the hollow dielectric waveguide is used for transmitting electromagnetic waves. By providing a cavity structure in the dielectric plate and transmitting electromagnetic waves through the hollow dielectric waveguide formed by filling air into the cavity structure, compared with the prior art of transmitting electromagnetic waves through a dielectric plate, the space of the hollow dielectric waveguide for transmitting electromagnetic waves in the present application is smaller than that of the dielectric plate, reducing the influence of lateral radiation, effectively reducing losses, and improving transmission performance. Description of the Drawings

[0016] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 A schematic diagram of the three-dimensional structure of a dielectric waveguide interconnection structure provided in an embodiment of the present application; Figure 2 A front view of a dielectric waveguide interconnect structure provided in an embodiment of the present application; Figure 3 A top view of a dielectric waveguide interconnect structure provided in an embodiment of the present application; Figure 4 This is a schematic diagram of a flow chart of an embodiment of a method for manufacturing a dielectric waveguide interconnect structure of the present application.

[0019] The purpose, features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0020] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not used to limit the present application.

[0021] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0022] The main solution of the embodiment of the present application is: a cavity structure exists inside the dielectric plate of the dielectric waveguide interconnection structure; the cavity structure is filled with air to form a hollow dielectric waveguide; wherein the hollow dielectric waveguide is used to transmit electromagnetic waves.

[0023] Since the existing interconnection structure transmits electromagnetic waves through its dielectric plate, the transmission area of ​​the electromagnetic waves is large, and it will face the problem of serious lateral radiation, which will increase the loss and affect the transmission performance.

[0024] The present application transmits electromagnetic waves through a hollow dielectric waveguide formed by setting a cavity structure in a dielectric plate and filling the cavity structure with air. Compared with the prior art in which electromagnetic waves are transmitted through a dielectric plate, the space of the hollow dielectric waveguide for transmitting electromagnetic waves in the present application is smaller than the dielectric plate, thereby reducing the influence of lateral radiation, effectively reducing losses, and improving transmission performance.

[0025] Based on this, the first embodiment of the present application is proposed. In the first embodiment, a dielectric waveguide interconnection structure is provided. Figure 1 , Figure 1 A schematic diagram of the three-dimensional structure of the dielectric waveguide interconnection structure provided in an embodiment of the present application, Figure 1 The structure shown is located in the xyz space coordinate system.

[0026] In this embodiment, the dielectric waveguide interconnection structure includes: a dielectric plate 10 .

[0027] It should be noted that the dielectric plate 10 may be made of a material with a high dielectric constant, and is used to limit the propagation of electromagnetic waves on a specific path.

[0028] A cavity structure 101 exists inside the dielectric plate 10 .

[0029] In a specific implementation, the cavity structure 101 may be a structure in the inner space of the dielectric plate 10. A cavity for filling air or other materials with a low dielectric constant (such as nitrogen or argon) may be opened inside the dielectric plate 10 to form the cavity structure 101.

[0030] The shape and size of the cavity structure 101 can be designed according to specific application requirements, such as rectangular or circular, and the size of the cavity structure 101 can match the geometric size of the dielectric waveguide interconnect structure and the frequency of the electromagnetic wave to ensure effective transmission of the electromagnetic wave.

[0031] The cavity structure 101 is filled with air to form a hollow dielectric waveguide.

[0032] Wherein, the hollow dielectric waveguide is used to transmit electromagnetic waves.

[0033] In a specific implementation, the cavity structure 101 may be filled with air or other materials with a low dielectric constant to form a hollow dielectric waveguide for transmitting electromagnetic waves.

[0034] It should be understood that the dielectric constant of the filling material in the hollow dielectric waveguide is lower than that of the dielectric plate 10. For example, the dielectric constant of air is relatively low, about 1, which is much lower than the dielectric constant of the dielectric plate 10 formed by the solid medium. Therefore, by transmitting electromagnetic waves through the hollow dielectric waveguide, the dielectric constant of the entire dielectric waveguide interconnection structure can be effectively reduced, thereby reducing the propagation loss of the electromagnetic wave.

[0035] In this embodiment, the hollow dielectric waveguide is a rectangular waveguide.

[0036] In a specific implementation, the hollow dielectric waveguide can be set as a rectangular structure. The internal electric field distribution of the rectangular hollow dielectric waveguide is relatively uniform, so under the same input power, its power capacity is large, it can withstand high voltage and high current, and effectively avoid the occurrence of discharge and breakdown.

[0037] It should be understood that the length of the rectangular cavity determines the propagation time of the electromagnetic wave in it, which in turn affects the resonant frequency. By changing the length of the hollow dielectric waveguide, the resonant frequency can be adjusted, thereby controlling the frequency band. The width and height also affect the reflection characteristics of the electromagnetic wave on the cavity wall, thereby affecting the resonant frequency. By adjusting the width and height of the hollow dielectric waveguide, the frequency band can be further optimized.

[0038] Furthermore, by changing the size of the hollow dielectric waveguide, the mode distribution of the electromagnetic wave can be adjusted, thereby affecting the bandwidth. A larger cavity size generally supports a wider bandwidth, while a smaller cavity size supports a narrower bandwidth. And by optimizing the size of the cavity, the mode conversion loss and radiation loss of the electromagnetic wave can be reduced, thereby reducing the overall loss.

[0039] The dielectric waveguide interconnection structure of the present embodiment includes: a dielectric plate; a cavity structure exists inside the dielectric plate; the cavity structure is filled with air to form a hollow dielectric waveguide; wherein the hollow dielectric waveguide is used to transmit electromagnetic waves. The present embodiment transmits electromagnetic waves by arranging a cavity structure in the dielectric plate and by filling the cavity structure with air to form a hollow dielectric waveguide. Compared with the prior art of transmitting electromagnetic waves through a dielectric plate, the space of the hollow dielectric waveguide for transmitting electromagnetic waves in the present embodiment is smaller than the dielectric plate, which reduces the influence of lateral radiation, effectively reduces the loss, and improves the transmission performance.

[0040] Based on the first embodiment of the present application, the second embodiment of the present application is proposed. In the second embodiment of the present application, the same or similar contents as those of the first embodiment can be referred to the above introduction, and will not be repeated in the following.

[0041] This embodiment can continue to refer to Figure 1 In this embodiment, the dielectric plate 10 includes an air layer.

[0042] It should be noted that the air layer may be a portion of the dielectric plate 10 surrounding the cavity structure 101 .

[0043] Further, refer to Figure 2 , Figure 2 This is a front view of the dielectric waveguide interconnect structure provided in an embodiment of the present application. Figure 2 The structure shown is located in the xyz space coordinate system. Figure 2 In the embodiment, the air layer includes a first air layer 201 and a second air layer 202 which are symmetrical to each other.

[0044] The symmetry axis region of the first air layer 201 and the second air layer 202 is the cavity structure 101 .

[0045] It should be noted that the first air layer 201 and the second air layer 202 can support the hollow dielectric waveguide to keep the hollow dielectric waveguide in a stable state. In addition, the first air layer 201 and the second air layer 202 are symmetrical based on the cavity structure 101, i.e., the hollow dielectric waveguide, so that the hollow dielectric waveguide is located in the central area of ​​the dielectric plate 10.

[0046] It should be understood that arranging the hollow dielectric waveguide at the center of the dielectric plate 10 can optimize the propagation path of the electromagnetic wave, reduce lateral radiation and mode conversion losses, and thus reduce the overall loss. In addition, by adjusting the size of the hollow dielectric waveguide, the frequency band and bandwidth can be controlled, and the hollow dielectric waveguide at the center can more effectively adjust the distribution of the resonance points of the electromagnetic wave, thereby optimizing the frequency band and bandwidth.

[0047] Based on the first and second embodiments of the present application, the third embodiment of the present application is proposed. In the third embodiment of the present application, the same or similar contents as those of the first and second embodiments can be referred to the above introduction, and will not be repeated in the following.

[0048] This embodiment can continue to refer to Figure 1 The dielectric plate regions on both sides of the air layer are provided with air holes 30 perpendicular to the propagation direction of the electromagnetic wave.

[0049] It should be noted that there may be multiple air holes 30 for connecting other multi-layer planar circuits to achieve integration.

[0050] In a specific implementation, the electromagnetic wave is transmitted in the central control dielectric waveguide along the y direction, and a plurality of air holes 30 are provided in the areas on both sides of the dielectric plate 10 along the direction perpendicular to the electromagnetic wave propagation direction, that is, the z direction. Figure 2 The air holes 30 are opened on both sides of the first air layer 201 and the second air layer 202 in the z direction.

[0051] Reference Figure 2 The dielectric plate 10 further includes: a first cladding structure 301 and a second cladding structure 302 .

[0052] It should be noted that both the first cladding structure 301 and the second cladding structure 302 may be dielectric plate regions for opening the air holes 30 .

[0053] The first cladding structure 301 and the second cladding structure 302 are disposed on both sides of the air layer.

[0054] In a specific implementation, the air layer, i.e., the area on both sides of the first air layer 201 and the second air layer 202, can be divided into a first cladding structure 301 and a second cladding structure 302. The space sizes of the first cladding structure 301 and the second cladding structure 302 are consistent and can be set according to specific requirements.

[0055] A plurality of air holes 30 are provided in each of the first cladding structure 301 and the second cladding structure 302 .

[0056] The air holes 30 in the first cladding structure 301 and the air holes 30 in the second cladding structure 302 are symmetrical based on the air layer.

[0057] In a specific implementation, a number of air holes 30 may be respectively opened in the z direction of the first cladding structure 301 and the second cladding structure 302. The number of air holes 30 in the first cladding structure 301 and the second cladding structure 302 is the same, and the first cladding structure 301 including the air holes 30 and the second cladding structure 302 including the air holes 30 are symmetrical based on the air layer in the middle.

[0058] The air holes 30 are arranged along the propagation direction of the electromagnetic wave.

[0059] It should be noted that, refer to Figure 3 , Figure 3 A top view of a dielectric waveguide interconnect structure provided in an embodiment of the present application, Figure 3 The structure shown is located in the xyz space coordinate system. Figure 3 In the embodiment, the electromagnetic wave propagates in the hollow dielectric waveguide along the y direction, and the air holes 30 in the first cladding structure 301 and the second cladding structure 302 are arranged along the propagation direction of the electromagnetic wave, that is, the y direction.

[0060] For example, a feasible actual size is used as an example. The dielectric waveguide interconnection structure of this embodiment can use PCB process Rogers 5880 material (dielectric constant 2.2, dielectric loss tangent 0.0009). Figure 2 , the thickness b of the dielectric plate 10 1 =1.905mm, the width of the dielectric plate 10 is b 2 =2.6mm, the width of the first air layer 201 and the second air layer 202 are the same, both are w 1 =1.5mm, the heights of the first air layer 201 and the second air layer 202 are the same, both are h 2 = 0.889 mm, the height of the hollow dielectric waveguide h 1 =0.127mm, the width of the hollow dielectric waveguide is w 2 =1.8mm. Reference Figure 3 , the length of the dielectric plate 10 is b 3 =2.7 mm, the radius of the air hole 30 in the first cladding structure 301 and the second cladding structure 302 is r 1 =0.05mm, the hole edge spacing between adjacent air holes 30 is g 1=0.1 mm, and the distances between the first cladding structure 301 and the second cladding structure 302 and the air layer in the x direction are both w 3 =0.65.

[0061] The above parameters are for illustration only and do not limit the present invention.

[0062] It should be understood that the first cladding structure 301 and the second cladding structure 302 including air holes 30 are opened on both sides of the dielectric plate 10, and other multi-layer planar circuits can be connected through the air holes 30 to achieve substrate-free planar integration. At the same time, the first cladding structure 301 and the second cladding structure 302 including the air holes 30 can suppress crosstalk, thereby achieving substrate-free planar integration while ensuring stable transmission of electromagnetic waves.

[0063] It should be noted that the above examples are only used to understand the present application and do not constitute a limitation on the dielectric waveguide interconnect structure of the present application. More simple transformations based on this technical concept are all within the protection scope of the present application.

[0064] In addition, in order to achieve the above-mentioned purpose, the present application also proposes a method for manufacturing a dielectric waveguide interconnect structure, referring to Figure 4 , Figure 4 This is a schematic diagram of a flow chart of an embodiment of a method for manufacturing a dielectric waveguide interconnect structure of the present application.

[0065] like Figure 4 As shown, in this embodiment, the method for manufacturing the dielectric waveguide interconnection structure includes steps S10 to S30: Step S10, obtaining a medium plate.

[0066] Step S20: opening a cavity structure inside the dielectric plate.

[0067] Step S30, filling air into the cavity structure to form a hollow dielectric waveguide for transmitting electromagnetic waves.

[0068] In a specific implementation, a dielectric plate made of a material with a high dielectric constant may be obtained, and then a cavity for filling air or other materials with a low dielectric constant (such as nitrogen or argon) may be opened inside the dielectric plate to form a cavity structure. Furthermore, air or other materials with a low dielectric constant may be filled in the cavity structure to form a hollow dielectric waveguide for transmitting electromagnetic waves.

[0069] Among them, the hollow dielectric waveguide can be set as a rectangular structure. The internal electric field distribution of the rectangular hollow dielectric waveguide is relatively uniform, so under the same input power, its power capacity is large, it can withstand high voltage and high current, and effectively avoid the occurrence of discharge and breakdown.

[0070] In a feasible implementation manner, step S20 includes steps S201 to S203: Step S201 : dividing the dielectric plate into air layers consisting of a first air layer and a second air layer that are symmetrical to each other.

[0071] Step S202: determining a symmetry axis region between the first air layer and the second air layer in the air layer.

[0072] Step S203: opening a cavity structure in the symmetry axis region.

[0073] In a specific implementation, two air layers can be divided in the central area of ​​the dielectric plate, one of which is used as the first air layer and the other as the second air layer, and the first air layer and the second air layer on both sides are symmetrical. Then, a symmetry axis region is determined so that the first air layer and the second air layer form a symmetric relationship, and a cavity structure is opened in the symmetry axis region, so that the hollow dielectric waveguide is located in the central area of ​​the dielectric plate, so as to optimize the propagation path of the electromagnetic wave, reduce lateral radiation and mode conversion loss, and thus reduce the overall loss.

[0074] In a feasible implementation manner, step S30 further includes steps S40 to S50: Step S40, determining the dielectric plate areas on both sides of the air layer.

[0075] Step S50, a plurality of air holes perpendicular to the propagation direction of the electromagnetic wave are opened in the dielectric plate region, and the air holes are arranged along the propagation direction of the electromagnetic wave.

[0076] In a specific implementation, electromagnetic waves are transmitted along the hollow dielectric waveguide, and the vertical direction of the hollow dielectric waveguide can be determined. Then, multiple air holes are opened along the vertical direction in the dielectric plate area on both sides of the dielectric plate, and the opened air holes are arranged along the propagation direction of the electromagnetic wave. Each air hole can be used to connect other multi-layer planar circuits to achieve integration.

[0077] In this embodiment, a dielectric plate is obtained; a cavity structure is opened inside the dielectric plate; and air is filled into the cavity structure to form a hollow dielectric waveguide for transmitting electromagnetic waves. Since this embodiment transmits electromagnetic waves through the hollow dielectric waveguide formed by opening a cavity structure in the dielectric plate and filling the cavity structure with air, compared with the prior art of transmitting electromagnetic waves through a dielectric plate, the space of the hollow dielectric waveguide for transmitting electromagnetic waves in this embodiment is smaller than the dielectric plate, which reduces the influence of lateral radiation, effectively reduces losses, and improves transmission performance.

[0078] The present application also provides a communication device, which includes the dielectric waveguide interconnection structure described above.

[0079] The communication device provided by the present application adopts the dielectric waveguide interconnection structure in the above-mentioned embodiment, which can solve the problem of serious lateral radiation faced by the prior art, increase loss, and affect the technical problem of transmission performance. Compared with the prior art, the beneficial effects of the communication device provided by the present application are the same as the beneficial effects of the dielectric waveguide interconnection structure provided by the above-mentioned embodiment, and other technical features in the communication device are the same as the features disclosed in the above-mentioned dielectric waveguide interconnection structure embodiment, which will not be repeated here.

[0080] The above descriptions are only some embodiments of the present application, and are not intended to limit the patent scope of the present application. All equivalent structural changes made using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect applications in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A dielectric waveguide interconnect structure, characterized in that: The dielectric waveguide interconnection structure comprises: a dielectric plate; There is a cavity structure inside the dielectric plate; The cavity structure is filled with air to form a hollow dielectric waveguide; Wherein, the hollow dielectric waveguide is used to transmit electromagnetic waves.

2. The dielectric waveguide interconnect structure according to claim 1, characterized in that: The hollow dielectric waveguide is a rectangular waveguide.

3. The dielectric waveguide interconnect structure according to claim 2, characterized in that: The dielectric plate includes an air layer; The air layer comprises: a first air layer and a second air layer which are symmetrical to each other; The symmetry axis regions of the first air layer and the second air layer are the cavity structures.

4. The dielectric waveguide interconnect structure according to claim 3, characterized in that: The dielectric plate regions on both sides of the air layer are provided with air holes perpendicular to the propagation direction of the electromagnetic waves.

5. The dielectric waveguide interconnect structure according to claim 4, characterized in that: The dielectric plate further comprises: a first cladding structure and a second cladding structure; The first cladding structure and the second cladding structure are arranged on both sides of the air layer; A plurality of air holes are provided in the first cladding structure and the second cladding structure; The air holes in the first cladding structure and the air holes in the second cladding structure are symmetrical based on the air layer.

6. The dielectric waveguide interconnect structure according to claim 5, characterized in that: The air holes are arranged along the propagation direction of the electromagnetic wave.

7. A method for manufacturing a dielectric waveguide interconnect structure, characterized in that: The method for manufacturing the dielectric waveguide interconnect structure comprises the following steps: Get the media board; A cavity structure is provided inside the dielectric plate; The cavity structure is filled with air to form a hollow dielectric waveguide for transmitting electromagnetic waves.

8. The method for manufacturing a dielectric waveguide interconnect structure according to claim 7, wherein: The step of opening a cavity structure inside the dielectric plate comprises: Dividing the dielectric plate into air layers consisting of a first air layer and a second air layer that are symmetrical to each other; determining, in the air layer, a symmetry axis region between the first air layer and the second air layer; A cavity structure is provided in the region of the symmetry axis.

9. The method for manufacturing a dielectric waveguide interconnect structure according to claim 8, characterized in that: After the step of filling the cavity structure with air to form a hollow dielectric waveguide for transmitting electromagnetic waves, the method further includes: Determining the dielectric plate areas on both sides of the air layer; A plurality of air holes perpendicular to the propagation direction of the electromagnetic wave are opened in the dielectric plate area, and the air holes are arranged along the propagation direction of the electromagnetic wave.

10. A communication device, characterized in that: The communication device comprises the dielectric waveguide interconnection structure according to any one of claims 1 to 6.

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