Heat dissipation module utilizing space below circuit board

Abstract

The invention relates to the technical field of circuit boards, in particular to a heat dissipation module utilizing a space below a circuit board, which comprises a machine frame, a baffle is fixedly connected to the front side of the top of the machine frame, a cover plate is arranged at the top of the machine frame, a circuit board is arranged on one side, opposite to the cover plate, of the machine frame, and a port module is electrically connected to the top of the circuit board. The machine frame has the advantage of being long in service life, in the actual use process, external air enters the machine frame through the through holes and makes contact with the protruding blocks along with air circulation, the protruding blocks make close contact with the circuit board, the air circulates upwards through the arc faces formed in the surfaces of the protruding blocks, the air enters the cooling fins through the cooling holes, and the cooling effect is improved. And then the air passes through the gaps among the radiating fins to form the air channels, so that the radiating fins can be cooled, and finally the air is discharged from the rear side of the machine frame, so that the port module can be always kept in a constant-temperature state in a relatively small space, and the service life of the port module is prolonged.

Description

Technical Field

[0001] The invention relates to the technical field of circuit boards, and in particular to a heat dissipation module utilizing the space below a circuit board. Background Art

[0002] Circuit board, full name is printed circuit board, also known as circuit board, PCB board, etc. It is an indispensable component in modern electronic equipment. By integrating electronic components and connecting lines, it realizes the functional integration and signal transmission of electronic products. Circuit boards are divided into three major categories according to the number of layers: single-sided board, double-sided board, and multi-layer circuit board. The first is single-sided board. On the most basic PCB, parts are concentrated on one side and wires are concentrated on the other side. Because the wires only appear on one side, this PCB is called single-sided circuit board. Double-sided board is an extension of single-sided board. Both sides have copper cladding and routing, and the lines between the two layers can be connected through vias to form the required network connection. Multi-layer board refers to a printed board with more than three layers of conductive graphic layers and the insulating materials between them are laminated separately, and the conductive graphics are interconnected as required. Multi-layer circuit board is the product of the development of electronic information technology towards high speed, multi-function, large capacity, small size, thinness and lightweight.

[0003] Existing business cards have height restrictions. The port modules of business cards are close to the height limit, and there is no more height space for heat dissipation. The reduction in heat dissipation efficiency will cause the operating temperature of the business card to gradually increase after long-term use, thereby affecting the performance and stability of the business card. Long-term operation at high temperatures will accelerate the aging of electronic components and shorten their service life. High temperatures may also cause the connections between components to loosen or fail, increasing the failure rate. Summary of the invention

[0004] The purpose of the present invention is to provide a heat dissipation module that utilizes the space below the circuit board, has the advantage of long service life, and solves the problems raised by the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a heat dissipation module utilizing the space below a circuit board, comprising a machine frame, a baffle being fixedly connected to the front side of the top of the machine frame, a cover being provided on the top of the machine frame, a circuit board being provided on the side opposite to the machine frame and the cover, a port module being electrically connected to the top of the circuit board, the front side of the port module penetrating to the outside of the baffle and being fixedly connected to a connector and a fixing block, a heat sink being fixedly connected to the top of the port module, a heat dissipation hole being provided on the top of the circuit board, a through hole being provided on the front side of the baffle, and a bump being fixedly connected to the top of the machine frame.

[0006] Furthermore, as a preferred embodiment of the present invention, an elastic card block is fixedly connected to the top of the port module, and the elastic card block is arranged obliquely.

[0007] Furthermore, as a preferred embodiment of the present invention, positioning blocks are fixedly connected to both sides of the top of the frame, screws are threadedly connected to both sides of the top of the circuit board, and the positioning blocks are adapted to the screws.

[0008] Furthermore, as a preferred embodiment of the present invention, first blocks are fixedly connected to both sides of the back surface of the cover plate, second blocks are fixedly connected to both sides of the back surface of the frame, a first bolt is provided on the rear side of the first block, and the first block and the second block are detachably connected by the first bolt.

[0009] Furthermore, as a preferred embodiment of the present invention, square blocks are fixedly connected on both sides of the front surface of the cover plate, the square blocks are located at the bottom of the baffle plate, second bolts are threadedly connected on both sides of the top of the baffle plate, and the baffle plate and the square blocks are fixedly connected by the second bolts.

[0010] Furthermore, as a preferred embodiment of the present invention, both sides of the top of the protrusion are provided with arc surfaces, and the surfaces of the arc surfaces are smooth, and the top of the protrusion is in contact with the circuit board.

[0011] Furthermore, as a preferred embodiment of the present invention, there are a plurality of heat sinks, and the heat sinks are distributed at equal intervals.

[0012] Furthermore, as a preferred embodiment of the present invention, the heat dissipation hole is located on a side opposite to the heat sink and the port module, and the shape of the heat dissipation hole is rectangular.

[0013] Beneficial effects. The technical solution of the present application has the following technical effects: the present invention has the advantage of long service life. During actual use, external air enters the interior of the frame through the through hole. As the air circulates, it will come into contact with the bump. Since the bump is in close contact with the circuit board, the air flows upward through the arc surface opened on the surface of the bump, so that the air enters the interior of the heat sink through the heat dissipation holes, and then the air passes through the gaps between the heat sinks to form an air duct, which can cool the heat sink. The air is finally discharged through the rear side of the frame, so that the port module can always be maintained at a constant temperature in a smaller space, thereby extending the service life of the port module.

[0014] It should be appreciated that all combinations of the foregoing concepts, as well as additional concepts described in greater detail below, may be considered to be part of the inventive subject matter of the present disclosure, provided such concepts are not mutually inconsistent. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0017] Figure 2 It is a schematic diagram of the structural disassembly of the present invention.

[0018] In the figure, the meaning of each figure mark is as follows: 1. frame; 2. baffle; 3. cover plate; 4. circuit board; 5. port module; 6. connector; 7. fixing block; 8. heat sink; 9. heat dissipation hole; 10. through hole; 11. bump; 12. elastic block; 13. positioning block; 14. screw; 15. first block; 16. second block; 17. first bolt; 18. square block; 19. second bolt. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. In order to better understand the technical content of the present invention, specific embodiments are cited and explained in conjunction with the drawings as follows. Various aspects of the present invention are described in this disclosure with reference to the drawings, in which many illustrative embodiments are shown. It should be understood that the various concepts and embodiments introduced above, as well as those described in more detail below, can be implemented in any of many ways. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0020] As attached Figure 1 To Attachment Figure 2 As shown: This embodiment provides a heat dissipation module that utilizes the space below the circuit board, including a machine frame 1, a baffle 2 is fixedly connected to the front side of the top of the machine frame 1, a cover plate 3 is arranged on the top of the machine frame 1, a circuit board 4 is arranged on the side opposite to the machine frame 1 and the cover plate 3, a port module 5 is electrically connected to the top of the circuit board 4, the front side of the port module 5 penetrates to the outside of the baffle 2 and is fixedly connected to a connector 6 and a fixing block 7, a heat sink 8 is fixedly connected to the top of the port module 5, a heat dissipation hole 9 is opened on the top of the circuit board 4, a through hole 10 is opened on the front side of the baffle 2, and a bump 11 is fixedly connected to the top of the machine frame 1.

[0021] Specifically, the top of the port module 5 is fixedly connected with an elastic card block 12, and the elastic card block 12 is arranged obliquely.

[0022] In this embodiment, when the port module 5 penetrates to the outside of the baffle 2, the elastic block 12 can effectively prevent the port module 5 from shaking, making it easier for the user to install and fix it later.

[0023] Specifically, positioning blocks 13 are fixedly connected to both sides of the top of the frame 1 , and screws 14 are threadedly connected to both sides of the top of the circuit board 4 , and the positioning blocks 13 are matched with the screws 14 .

[0024] In this embodiment, the positioning block 13 and the screw 14 are used in combination to position the circuit board 4, thereby preventing the circuit board 4 from being displaced when placed, and improving the stability of the circuit board 4 when placed.

[0025] Specifically, first blocks 15 are fixedly connected to both sides of the back surface of the cover plate 3, second blocks 16 are fixedly connected to both sides of the back surface of the frame 1, a first bolt 17 is provided on the rear side of the first block 15, and the first block 15 and the second block 16 are detachably connected via the first bolt 17.

[0026] In this embodiment, the first stopper 15, the second stopper 16 and the first bolt 17 are used in combination to connect the cover plate 3 and the frame 1. At the same time, the two can be disassembled, which is convenient for users to repair and replace parts inside the frame 1.

[0027] Specifically, square blocks 18 are fixedly connected on both sides of the front surface of the cover plate 3, the square block 18 is located at the bottom of the baffle plate 2, and second bolts 19 are threadedly connected on both sides of the top of the baffle plate 2. The baffle plate 2 and the square block 18 are fixedly connected by the second bolts 19.

[0028] In this embodiment: through the coordinated use of the square block 18 and the second bolt 19, the cover plate 3 and the baffle 2 are fixed, so that the heat sink 8 and the port module 5 can be effectively protected, making it difficult for them to collide with external objects, thereby extending their service life.

[0029] Specifically, both sides of the top of the bump 11 are provided with arc surfaces, and the surfaces of the arc surfaces are smooth, and the top of the bump 11 is in contact with the circuit board 4 .

[0030] In this embodiment: the setting of the arc surface can save manufacturing costs and reduce the economic burden of users. At the same time, the arc surface can guide the air so that the air enters the interior of the heat sink 8 through the heat dissipation holes 9, thereby effectively dissipating the heat inside the heat sink 8.

[0031] Specifically, there are a plurality of heat sinks 8 , and the heat sinks 8 are distributed at equal intervals.

[0032] In this embodiment, the heat sink 8 is provided to dissipate heat for the port module 5 , so that the port module 5 can always be kept at a constant temperature in a smaller space, thereby extending the service life of the port module 5 .

[0033] Specifically, the heat dissipation hole 9 is located on a side opposite to the heat sink 8 and the port module 5 , and the heat dissipation hole 9 is in a rectangular shape.

[0034] In this embodiment, the heat dissipation holes 9 are provided to facilitate air circulation, thereby facilitating the discharge of heat energy inside the frame 1 .

[0035] The working principle and usage process of the present invention are as follows: when the port module 5 penetrates to the outside of the baffle 2, the elastic card block 12 is provided to effectively prevent the port module 5 from shaking, which is convenient for the user to install and fix it later. In order to improve the stability of the circuit board 4 when it is placed, the user screws the screw 14 so that the screw 14 penetrates to the bottom of the circuit board 4 and is connected to the positioning block 13, so that the circuit board 4 is not easy to shake when it is placed.

[0036] The user can separate the frame 1 and the cover plate 3 by screwing the first bolt 17 and the second bolt 19 , so that the user can disassemble and repair the components on the surface of the circuit board 4 .

[0037] The heat sink 8 is provided to dissipate heat for the port module 5, so that the port module 5 can always be kept at a constant temperature in a smaller space, thereby extending the service life of the port module 5. At the same time, external air enters the interior of the frame 1 through the through hole 10. As the air circulates, it comes into contact with the bump 11. Since the bump 11 is in close contact with the circuit board 4, the air flows upward through the arc surface opened on the surface of the bump 11, so that the air enters the interior of the heat sink 8 through the heat dissipation hole 9, and then the air passes through the gaps between the heat sinks 8 to form an air duct, thereby cooling the heat sink 8. The air is finally discharged through the rear side of the frame 1, so that the port module 5 can always be kept at a constant temperature in a smaller space, thereby extending the service life of the port module 5.

[0038] It should be noted that, in this document, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

[0039] Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. A person with ordinary knowledge in the technical field to which the present invention belongs may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the claims.

Claims

1. A heat dissipation module utilizing the space below a circuit board, comprising a frame (1), characterized in that: A baffle (2) is fixedly connected to the front side of the top of the frame (1); a cover plate (3) is arranged on the top of the frame (1); a circuit board (4) is arranged on the side opposite to the frame (1) and the cover plate (3); a port module (5) is electrically connected to the top of the circuit board (4); the front side of the port module (5) penetrates to the outside of the baffle (2) and is fixedly connected to a connector (6) and a fixing block (7); a heat sink (8) is fixedly connected to the top of the port module (5); a heat dissipation hole (9) is provided on the top of the circuit board (4); a through hole (10) is provided on the front side of the baffle (2); and a protrusion (11) is fixedly connected to the top of the frame (1).

2. A heat dissipation module utilizing the space below a circuit board according to claim 1, characterized in that: The top of the port module (5) is fixedly connected with an elastic card block (12), and the elastic card block (12) is arranged in an inclined manner.

3. A heat dissipation module utilizing the space below a circuit board according to claim 1, characterized in that: Positioning blocks (13) are fixedly connected to both sides of the top of the frame (1), screws (14) are threadedly connected to both sides of the top of the circuit board (4), and the positioning blocks (13) are compatible with the screws (14).

4. The heat dissipation module using the space below the circuit board according to claim 1, characterized in that: The cover plate (3) is fixedly connected to both sides of the back surface with a first stopper (15), the frame (1) is fixedly connected to both sides of the back surface with a second stopper (16), a first bolt (17) is provided on the rear side of the first stopper (15), and the first stopper (15) and the second stopper (16) are detachably connected via the first bolt (17).

5. The heat dissipation module using the space below the circuit board according to claim 1, characterized in that: Square blocks (18) are fixedly connected to both sides of the front surface of the cover plate (3); the square block (18) is located at the bottom of the baffle plate (2); second bolts (19) are threadedly connected to both sides of the top of the baffle plate (2); the baffle plate (2) and the square block (18) are fixedly connected via the second bolts (19).

6. The heat dissipation module using the space below the circuit board according to claim 1, characterized in that: Both sides of the top of the protrusion (11) are provided with arc surfaces, and the surfaces of the arc surfaces are smooth. The top of the protrusion (11) is in contact with the circuit board (4).

7. The heat dissipation module using the space below the circuit board according to claim 1, characterized in that: The number of the heat sinks (8) is a plurality, and the plurality of heat sinks (8) are distributed at equal intervals.

8. The heat dissipation module utilizing the space below the circuit board according to claim 1, characterized in that: The heat dissipation hole (9) is located on a side opposite to the heat sink (8) and the port module (5), and the shape of the heat dissipation hole (9) is rectangular.

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