Electronic device, manufacturing method thereof and clamp

Abstract

The invention relates to the technical field of electromagnetic shielding, and particularly provides an electronic device and a preparation method and a clamp thereof, and a shielding assembly comprises a shielding cover which is erected on a substrate to surround an electronic device on the substrate; an opening and a shielding frame forming the opening are arranged on one side, deviating from the substrate, of the shielding cover, and a groove is formed in one side, deviating from the substrate, of the shielding frame; the shielding film is arranged at the opening of the shielding cover, covers the opening and the groove in the shielding frame, and is connected with the shielding cover through welding; the groove is arranged to store welding flux used for welding. In this way, the size of the shielding assembly can be reduced.

Description

[0001] This application is a divisional application. The application number of the original application is 202311214207.4, the application date of the original application is September 19, 2023, and the invention name of the original application is "Shielding assembly, method for preparing shielding assembly, electronic device and fixture". The entire contents of the original application are incorporated into this application by reference. Technical Field

[0002] The present invention relates to the technical field of electromagnetic shielding, and in particular to an electronic device and a preparation method and a fixture thereof. Background Art

[0003] In the process of packaging electronic modules in electronic devices (such as mobile phones or tablets), it is usually necessary to perform electromagnetic shielding on the electronic modules to prevent electromagnetic interference from affecting the normal operation of the electronic devices. When packaging electronic modules that require electromagnetic shielding, shielding components are generally used to enclose the electronic devices to achieve the effect of electromagnetic shielding.

[0004] The current shielding components are relatively large in size, which greatly affects the lightweight development of electronic equipment. In addition, the effective accommodation space formed by the shielding components on the substrate is relatively small, and the height arrangement of electronic devices is limited.

[0005] Therefore, how to reduce the volume of the shielding component while ensuring the electromagnetic shielding effect of the shielding component has become a problem that needs to be solved urgently. Summary of the invention

[0006] In view of this, the present invention provides a shielding assembly, a method for preparing the shielding assembly, an electronic device and a fixture, which can reduce the volume of the shielding assembly.

[0007] In order to solve the above technical problems, on the one hand, the present invention provides a shielding assembly, which is applied to an electronic device, wherein the electronic device includes a substrate and an electronic device electrically connected to the substrate, and the shielding assembly is used to electromagnetically shield the electronic device on the substrate, and includes:

[0008] A shielding cover is mounted on a substrate to surround the electronic components on the substrate; the shielding cover is provided with an opening on a side facing away from the substrate and a shielding frame forming the opening, and the shielding frame is provided with a groove on a side facing away from the substrate; a shielding film is arranged at the opening of the shielding cover, covers the opening and the groove on the shielding frame, and is connected to the shielding cover via welding; wherein the groove is arranged to store solder for welding.

[0009] By providing a groove for storing solder on the shielding frame, the conductive adhesive layer is omitted, the thickness of the conductive adhesive layer is reduced, and the shielding cover and the shielding film are connected by welding, so that the connection between the shielding cover and the shielding film is more stable and reliable, which can effectively avoid the problem of shielding leakage. In addition, since the connection stability between the shielding cover and the shielding film is improved, the width requirement of the shielding frame can be further reduced, so that the width of the shielding frame can be reduced according to demand, thereby further reducing the volume of the shielding component, and at the same time expanding the effective accommodation space formed by the shielding component on the substrate, flexibly adapting to electronic devices of various heights, and improving the wide applicability of the shielding component.

[0010] According to some embodiments of the present invention, the groove is an annular groove, which surrounds the opening of the shielding cover and is arranged on a side of the shielding frame facing away from the substrate.

[0011] According to some embodiments of the present invention, a plurality of grooves are provided on a side of the shielding frame facing away from the substrate, and the plurality of grooves are arranged at intervals around the opening on the side of the shielding frame facing away from the substrate.

[0012] According to some embodiments of the present invention, an anti-oxidation layer is provided on the side of the shielding film facing the substrate, and the anti-oxidation layer at least covers the area where the projection of the groove on the shielding frame is located on the shielding film.

[0013] According to some embodiments of the present invention, an anti-oxidation layer is provided on a side of the shielding film facing the substrate, and the anti-oxidation layer covers a region where a projection of a groove on a portion of the shielding frame is located on the shielding film.

[0014] The anti-oxidation layer is used to prevent the surface oxidation of the shielding film, and the anti-oxidation layer also has good welding performance. The anti-oxidation layer can prevent the surface oxidation of the shielding film while ensuring the welding effect of the shielding film and the shielding frame.

[0015] In a second aspect, an embodiment of the present invention provides a method for preparing a shielding assembly, the shielding assembly being used to perform electromagnetic shielding on an electronic device on a substrate in an electronic device, the preparation method comprising the following steps:

[0016] Obtain a shielding cover; mount the shielding cover on a substrate to surround the electronic device on the substrate, wherein the shielding cover is provided with an opening on a side facing away from the substrate and a shielding frame forming the opening, and the shielding frame is provided with a groove on a side facing away from the substrate; fill solder in the groove of the shielding frame; obtain a shielding film; use a clamp to attach the shielding film to the opening of the shielding cover, covering the opening and the groove on the shielding frame; weld the shielding cover to the substrate, and weld the shielding film to the shielding cover to form a shielding assembly.

[0017] According to some embodiments of the present invention, the step of placing a shielding cover on a substrate includes: printing solder around the electronic device on the substrate; and placing the shielding cover on the area of ​​the substrate where the solder is located.

[0018] According to some embodiments of the present invention, the steps of welding the shielding cover and the substrate, and welding the shielding film and the shielding cover include: sending the substrate into a reflow oven and performing reflow oven so that the shielding cover is connected to the substrate through the solder printed on the substrate, and the shielding film is connected to the shielding cover through the solder in the groove on the shielding frame.

[0019] According to some embodiments of the present invention, the clamp includes an adsorption plate and a transfer plate placed on the upper surface of the adsorption plate, and a plurality of vacuum channels penetrating the upper and lower surfaces are provided inside the transfer plate and the adsorption plate; the adsorption plate is used to adsorb the shielding film through its own vacuum channel, and the transfer plate is used to adsorb the adsorption plate through its own vacuum channel and carry the adsorption plate to move; when the shielding film is attached to the opening of the shielding cover by using the clamp so that the shielding film covers the opening and the groove on the shielding frame, the adsorption plate is released through the vacuum channel of the transfer plate, so that the shielding film is fixed to the shielding frame by using the adsorption plate, and then the step of sending the substrate into the reflow oven is performed.

[0020] Before sending the substrate into the reflow oven, the above-mentioned fixture can be used to realize the three processes of absorption, lamination and placement of the shielding film. The adsorption plate in the fixture is used as a pressure block to avoid the displacement of the shielding film or the wrinkling of the shielding film, thereby improving the effect of subsequent welding. At the same time, it can save the process of placing the pressure block separately, making the preparation process more streamlined.

[0021] According to some embodiments of the present invention, the groove on the side of the shielding frame facing away from the substrate is punched using a stamping technique, wherein during the stamping process, a support plate is used to support the side of the shielding frame close to the substrate.

[0022] Compared with other processing methods such as etching or laser engraving, stamping technology has higher processing efficiency. In addition, by setting up a support plate, it can effectively prevent the deformation of the shielding frame during the stamping process, ensure the flatness of the shielding frame, and facilitate the subsequent welding between the shielding frame and the shielding film.

[0023] According to some embodiments of the present invention, corresponding to the area where the groove is located on the shielding frame, a plurality of detection holes are opened on the side of the shielding film away from the shielding frame, so as to detect the welding effect between the shielding film and the shielding frame through the detection holes.

[0024] By opening a detection hole on the shielding film to detect the welding effect between the shielding film and the shielding frame, intuitive and non-destructive inspection of the welding effect of the shielding film can be achieved.

[0025] In a third aspect, an embodiment of the present invention provides an electronic device, comprising: a substrate; an electronic device electrically connected to the substrate; and a shielding assembly such as the above technical solution, the shielding assembly being mounted on the substrate to form a shielding space for accommodating the electronic device.

[0026] In the fourth aspect, an embodiment of the present invention provides a clamp for implementing the method for preparing a shielding assembly of the above-mentioned technical solution; the clamp includes an adsorption plate and a transfer plate placed on the upper surface of the adsorption plate, and both the transfer plate and the adsorption plate are provided with multiple vacuum channels running through the upper and lower surfaces; the adsorption plate is used to adsorb the shielding film in the shielding assembly through its own vacuum channel, and the transfer plate is used to adsorb the adsorption plate through its own vacuum channel and carry the adsorption plate to move. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic diagram of an electronic device including a shielding assembly according to an embodiment;

[0028] Figure 2 is a schematic diagram of an electronic device including a shielding component according to an embodiment of the present invention;

[0029] Figure 3a A schematic diagram of a groove on a shielding frame in a shielding assembly according to an embodiment of the present invention;

[0030] Figure 3b A schematic diagram of a groove on a shielding frame in a shielding assembly according to another embodiment of the present invention;

[0031] Figure 3c A schematic diagram of a groove on a shielding frame in a shielding assembly according to another embodiment of the present invention;

[0032] Figure 3d A cross-sectional view of a groove on a shielding frame in a shielding assembly according to an embodiment of the present invention;

[0033] Figure 4 A schematic diagram of a shielding assembly provided with an anti-oxidation layer according to an embodiment of the present invention;

[0034] Figure 5 A schematic diagram of an anti-oxidation layer on a shielding film in a shielding assembly according to an embodiment of the present invention;

[0035] Figure 6 It is a schematic diagram of a process of locally coating an anti-oxidation layer on a shielding film according to an embodiment of the present invention;

[0036] Figure 7 A flowchart of a method for preparing a shielding assembly according to an embodiment of the present invention;

[0037] Figure 8 It is a schematic diagram of the process of obtaining a groove by impact in a method for preparing a shielding component according to an embodiment of the present invention;

[0038] Fig. 9 A schematic diagram of a common groove cross-sectional shape obtained by impact in a method for preparing a shielding assembly according to an embodiment of the present invention;

[0039] Fig.10 It is a schematic diagram of fixing a shielding film on a shielding frame by using a pressing block in a method for preparing a shielding assembly according to an embodiment of the present invention;

[0040] Fig.11 is a schematic diagram of a clamp according to an embodiment of the present invention;

[0041] Fig.12 A top view of a clamp according to an embodiment of the present invention;

[0042] Fig.13 It is a schematic diagram of fixing a shielding film on a shielding frame by using an adsorption plate in a fixture in a method for preparing a shielding assembly according to an embodiment of the present invention;

[0043] Fig.14a A schematic diagram of opening a detection hole on a shielding film according to an embodiment of the present invention;

[0044] Fig.14b It is an enlarged schematic diagram of the detection hole on the shielding film according to an embodiment of the present invention. DETAILED DESCRIPTION

[0045] The specific implementation of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0046] In the process of packaging electronic modules in electronic devices (such as mobile phones or tablets and other terminal devices), it is usually necessary to perform electromagnetic shielding on the electronic modules to prevent electromagnetic interference from affecting the normal operation of the electronic devices. Among them, the electronic module may include a substrate and an electronic device electrically connected to the substrate, and the substrate is a printed circuit board (PCB). When packaging an electronic module that needs to be electromagnetically shielded, a metal shell is generally used to enclose the electronic device to achieve the effect of electromagnetic shielding. The metal shell is the "shielding component" mentioned in this article. The shielding component is used to form a closed shielding space for accommodating electronic devices to electromagnetically shield the electronic devices, thereby encapsulating an electronic device including an electronic module and a corresponding shielding component.

[0047] like Figure 1 The electronic device including the shielding assembly in one embodiment shown in the figure includes a substrate, an electronic device electrically connected to the substrate, and the shielding assembly. It can be understood that Figure 1The memory chip, system-level chip, and modules C, R, and L shown in the figure are used to represent electronic devices on the substrate, where the memory chip can be a DDR chip (Double Data Rate SDRAM), the system-level chip can be a SOC chip (System on Chip), and the devices C, R, and L are used to refer to other types of electronic devices, such as capacitors, inductors, resistors, or chips.

[0048] The shielding assembly may include a shielding cover 11 and a shielding layer 12. The shielding cover 11 is mounted on the substrate to surround the electronic device on the substrate. The shielding cover 11 is provided with an opening and a shielding frame 111 forming the opening on a side away from the substrate. The shielding frame 111 is Figure 1 The portion shown in the dotted box, "the shielding frame 111 forms an opening" can be understood as that there is an opening in the middle of the planar portion of the shielding cover 11 parallel to the substrate, and the shielding frame 111 surrounds the opening. In other words, the portion of the shielding cover 11 extending toward the opening and parallel to the substrate is the shielding frame 111.

[0049] The shielding layer 12 is arranged at the opening of the shielding cover 11, covering the opening and the shielding frame 111. The shielding layer 12 includes a stacked shielding film 121 and a conductive adhesive layer 122, and the conductive adhesive layer 122 is arranged close to the shielding frame 111, and the shielding film 121 is connected to the shielding cover 11 through the conductive adhesive layer 122. The above-mentioned shielding assembly forms a closed shielding space for accommodating electronic devices, and performs electromagnetic shielding on the electronic devices on the substrate.

[0050] The electronic device may further include a thermally conductive adhesive 13, which covers the memory chip and is used to dissipate heat from the electronic device.

[0051] The shielding film 121 in the shielding layer 12 can be a metal film layer, which is used to achieve electromagnetic shielding of electronic devices. The shielding film 121 is generally a copper foil (thickness of about 12um). The conductive adhesive layer 122 stacked with the shielding film 121 is used to bond the shielding film 121 and the shielding cover 11, which is generally a pressure-sensitive adhesive doped with metal particles (thickness of about 30um). Because the bonding effect of the conductive adhesive layer 122 is easily affected by the lamination process used and the cleanliness of the material surface, in order to ensure the bonding reliability of the conductive adhesive layer 122, the width of the shielding frame 111 is generally set larger (greater than or equal to 2mm).

[0052] As can be seen from the above content, the shielding assembly in the above embodiment is relatively large, which affects the lightweight development of electronic equipment. The volume of the shielding assembly is limited by the thickness of the shielding layer 12 on the one hand, and by the width of the shielding frame 111 on the other hand. Moreover, the wider shielding frame 111 may also cause the higher electronic devices (such as capacitors) on the substrate to be unable to be placed close to the edge of the shielding cover 11, that is, the effective accommodation space formed by the shielding assembly on the substrate is small, and the height arrangement of the electronic devices is limited.

[0053] However, if the thickness of the shielding film 121 and / or the conductive adhesive layer 122 in the shielding layer 12 is reduced, the bonding effect between the shielding cover 11 and the shielding film 121 may be affected, thereby affecting the electromagnetic shielding effect of the shielding assembly. If the width of the shielding frame 111 is reduced, the area of ​​the bonding interface between the conductive adhesive layer 122 and the shielding frame 111 will be reduced, so that the micro gaps on the bonding interface will cause shielding leakage, thereby greatly affecting the electromagnetic shielding effect of the shielding assembly.

[0054] Therefore, how to reduce the volume of the shielding component while ensuring the electromagnetic shielding effect of the shielding component has become a problem that needs to be solved urgently.

[0055] In order to solve the problem of the large volume of the above-mentioned shielding assembly, an embodiment of the present application proposes a shielding assembly, which includes a shielding cover and a shielding film. The shielding cover is mounted on a substrate to surround the electronic devices on the substrate. The shielding cover is provided with an opening on the side facing away from the substrate and a shielding frame forming the opening, and the shielding frame is provided with a groove on the side facing away from the substrate; the shielding film is arranged at the opening of the shielding cover, covering the opening and the groove on the shielding frame, and is connected to the shielding cover via welding; wherein the groove is configured to store solder for welding.

[0056] By providing a groove for storing solder on the shielding frame, the conductive adhesive layer is omitted, the thickness of the conductive adhesive layer is reduced, and the shielding cover and the shielding film are connected by welding, so that the connection between the shielding cover and the shielding film is more stable and reliable, which can effectively avoid the problem of shielding leakage. In addition, since the connection stability between the shielding cover and the shielding film is improved, the width requirement of the shielding frame can be further reduced, so that the width of the shielding frame can be reduced according to demand (such as reduced to 0.6mm~1mm), thereby further reducing the volume of the shielding component, and at the same time expanding the effective accommodation space formed by the shielding component on the substrate, flexibly adapting to electronic devices of various heights, and improving the wide applicability of the shielding component.

[0057] The shielding assembly and the electronic device proposed in the embodiments of the present application are described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0058] like Figure 2As shown, an electronic device including a shielding assembly according to an embodiment of the present invention includes a substrate, an electronic device, and a shielding assembly proposed in an embodiment of the present application. The electronic device is electrically connected to the substrate, and the shielding assembly is mounted on the substrate to form a shielding space for accommodating the electronic device. The shielding assembly is described in detail in the following embodiments and will not be described in detail here.

[0059] in, Figure 2 The memory chip shown in the figure may be a DDR chip, the system-on-chip may be a SOC chip, and the components C, R, and L may be used to refer to other types of electronic components, such as capacitors, inductors, resistors, or chips. Figure 2 It is worth noting that the shielding assembly in the embodiment of the present application can be flexibly applied to electronic modules containing various electronic devices, and the number, type and arrangement of the electronic devices disposed on the substrate are not limited here.

[0060] It can be understood that the embodiments of the present application Figure 2 The following figures are all illustrated by taking the provision of thermal conductive adhesive 20 as an example, but the present application is not limited thereto. Specifically, the thermal conductive adhesive 20 can be selectively covered on the electronic device according to actual heat dissipation requirements.

[0061] Please continue reading Figure 2 , a shielding component according to an embodiment of the present invention is introduced below. The shielding component may include a shielding cover 21 and a shielding film 22.

[0062] The shielding cover 21 is mounted on the substrate to surround the electronic device on the substrate. The shielding cover 21 is provided with an opening and a shielding frame 211 forming the opening on the side facing away from the substrate, and a groove 212 is provided on the side facing away from the substrate of the shielding frame 211. The shielding film 22 is arranged at the opening of the shielding cover 21, covers the opening and the groove 212 on the shielding frame 211, and is connected to the shielding cover 21 via welding. Among them, the groove 212 is configured to store solder for welding.

[0063] Among them, the shielding frame 211 is Figure 2 The portion shown in the dotted box, “the shielding frame 211 forms an opening” can be understood as an opening in the middle of the planar portion of the shielding cover 21 parallel to the substrate, and the shielding frame 211 surrounds the opening. In other words, the portion of the shielding cover 21 extending toward the opening and parallel to the substrate is the shielding frame 211.

[0064] In one embodiment, the shielding film 22 and the shielding cover 21 can be connected by welding methods such as furnace reflow soldering, pressure welding or laser welding. The solder stored in the groove 212 can be solder or conductive glue, etc., and the welding method and solder type are not limited here.

[0065] By providing a groove 212 for storing solder on the shielding frame 211, the provision of a conductive adhesive layer is omitted, thereby reducing the thickness occupied by the conductive adhesive layer. At the same time, the shielding cover 21 and the shielding film 22 are connected by welding, so that the connection between the shielding cover 21 and the shielding film 22 can be made more stable and reliable, and the problem of shielding leakage can be effectively avoided. Furthermore, since the connection stability between the shielding cover 21 and the shielding film 22 is improved, the width requirement of the shielding frame 211 can be further reduced, so that the width of the shielding frame 211 can be reduced as needed. In this way, the volume of the shielding component can be further reduced, while the effective accommodation space formed by the shielding component on the substrate can be expanded, and electronic devices of various heights can be flexibly adapted to improve the wide applicability of the shielding component.

[0066] In one embodiment, if Figure 3a As shown, the groove 212 on the shielding frame 211 may be an annular groove, which surrounds the opening of the shielding cover 21 and is arranged on a side of the shielding frame 211 away from the substrate (also referred to as Figure 2 The top surface of the shielding frame 211 in the state shown).

[0067] In one embodiment, if Figure 3b As shown, a plurality of grooves 212 may be provided on the side of the shielding frame 211 facing away from the substrate, and the plurality of grooves 212 are arranged around the opening at intervals on the side of the shielding frame 211 facing away from the substrate. In other words, the plurality of grooves 212 on the shielding frame 211 are independent and separated from each other, presenting the form of discrete grooves. There is a preset interval between adjacent grooves 212. It can be understood that the interval between adjacent grooves 212 may be less than or equal to 0.5 mm to ensure the welding effect between the shielding film 22 and the shielding cover 21, thereby further ensuring the electromagnetic shielding effect of the shielding assembly.

[0068] It can be understood that the above embodiment is only illustrated by taking the cross-sectional shape of the groove 212 as a rectangle as an example. In other embodiments, the cross-sectional shape of the groove 212 can also be circular or elliptical, etc., which is not limited here. In the case where a plurality of grooves 212 are provided on the side of the shielding frame 211 away from the substrate, the cross-sectional shape and / or size of each groove 212 can be the same or different, and can be set according to actual needs. In general, each groove 212 can be set to the same size and cross-sectional shape for ease of production, which is not limited here.

[0069] like Figure 3cAs shown, in one embodiment, a plurality of grooves 212 are provided on the side of the shielding frame 211 facing away from the substrate, and the plurality of grooves 212 are arranged around the opening at intervals on the side of the shielding frame 211 facing away from the substrate, and the cross-sectional shapes of the plurality of grooves 212 may not be exactly the same, and the cross-sectional shape of some of the grooves 212 may be elliptical, and the cross-sectional shape of some of the grooves 212 may be rectangular.

[0070] By making the cross-sectional shapes of the plurality of grooves 212 not completely identical, welding surfaces of different shapes can be formed between the shielding film 22 and the shielding frame 211, and then different welding strengths can be combined through the welding surfaces of different shapes, thereby achieving a better welding effect. In addition, the cross-sectional shape of each groove 212 can be adaptively adjusted according to the solder supply and the capacity of the groove 212 under each cross-sectional shape, so as to ensure the welding effect between the shielding film 22 and the shielding frame 211 under various processing conditions (such as limited solder consumption).

[0071] In actual application scenarios, the thickness of the shielding film 22 can be in the range of 6um to 50um, usually set to 9um, the depth of the groove 212 can be selected in the range of 0.02mm to 0.1mm, and the width of the groove 212 can be selected in the range of 0.2mm to 0.5mm. The specific size can be selected according to actual needs and is not limited here.

[0072] By reasonably limiting the range of the depth and width of the groove 212, the flatness of the side of the shielding frame 211 away from the substrate can be ensured, and at the same time, excess solder can be prevented from overflowing from the groove 212, thereby improving the welding quality of the shielding assembly. If the groove 212 is too deep or too wide, it may affect the flatness of the side of the shielding frame 211 away from the substrate, resulting in poor subsequent welding between the shielding frame 211 and the shielding film 22. If the groove 212 is too shallow or too narrow, the groove 212 may not be able to accommodate a sufficient amount of solder, resulting in excess solder overflowing and contaminating surrounding devices. Therefore, by reasonably limiting the range of the depth and width of the groove 212, the above-mentioned situation where the groove 212 is too deep, too wide, too shallow or too narrow can be avoided, thereby effectively improving the welding quality of the shielding assembly.

[0073] The depth and width of the groove 212 can be referred to as Figure 3d A cross-sectional view of the groove 212 is shown.

[0074] In one embodiment, if Figure 4 As shown, an anti-oxidation layer 23 is provided on the side of the shielding film 22 facing the substrate, and the anti-oxidation layer 23 at least covers the area where the projection of the groove 212 on the shielding frame 211 on the shielding film 22 is located ( Figure 4Take the area where the projection of the groove 212 on the shielding frame 211 covered by the anti-oxidation layer 23 on the shielding film 22 is located as an example), wherein the anti-oxidation layer 23 is an organic solder-preserving film or a metal film formed by electroplating or chemical plating, and the metal film may include a tin-plated film, a nickel-gold-plated film, or a gold-plated film. The anti-oxidation layer 23 is used to prevent the surface oxidation of the shielding film 22, and the anti-oxidation layer 23 also has good welding performance. The setting of the anti-oxidation layer 23 can prevent the surface oxidation of the shielding film 22 while ensuring the welding effect between the shielding film 22 and the shielding frame 211.

[0075] Specifically, "the anti-oxidation layer 23 at least covers the area where the projection of the groove 212 on the shielding frame 211 on the shielding film 22 is located" includes three situations. The first situation is that the anti-oxidation layer 23 completely covers the side of the shielding film 22 facing the substrate. The second situation is that the anti-oxidation layer 23 only covers the area where the projection of the groove 212 on the shielding frame 211 on the shielding film 22 is located (such as Figure 4 As shown); Taking the case where the groove 212 on the shielding frame 211 is a continuous annular groove as an example, the projection of the anti-oxidation layer 23 on the shielding film 22 is also annular, and completely overlaps with the projection of the annular groove on the shielding film 22. The third case is that the anti-oxidation layer 23 covers the area where the projection of the groove 212 on the shielding frame 211 on the shielding film 22 is located and the peripheral area of ​​the shielding film 22, wherein the size of the peripheral area of ​​the shielding film 22 can be set according to actual conditions and is not limited here.

[0076] In one embodiment, the anti-oxidation layer 23 may also cover a portion of the area where the projection of the groove 212 on the shielding frame 211 is located on the shielding film 22. In other words, the projection of the anti-oxidation layer 23 on the shielding film 22 partially overlaps with the projection of the groove 212 on the shielding film 22. Figure 5 As shown, when the groove 212 on the shielding frame 211 is a continuous annular groove, corresponding to the projection area of ​​the groove 212 on the shielding film 22, the anti-oxidation layer 23 can be set as four anti-oxidation areas with gaps on the shielding film 22.

[0077] It can be understood that the size of the overlapping area between the projection of the anti-oxidation layer 23 on the shielding membrane 22 and the projection of the groove 212 on the shielding membrane 22 can be at least larger than a preset threshold, wherein the preset threshold can be determined based on the minimum coverage area of ​​the anti-oxidation layer 23 required to improve the welding effect of the shielding membrane 22, and is not limited here.

[0078] In actual application scenarios, the thickness of the anti-oxidation layer 23 can be in the range of 0.03um to 5um, generally 1um to 2um. The cross-sectional shape of the anti-oxidation layer 23 can be rectangular or elliptical. The specific cross-sectional shape and size can be selected according to actual needs and are not limited here.

[0079] In actual application scenarios, before plating the anti-oxidation layer 23, the surface of the shielding film 22 may be cleaned, polished, and degreased, and then the anti-oxidation layer 23 may be plated on the entire or partial surface of the shielding film 22 facing the substrate. Taking the anti-oxidation layer 23 as a tin-plated film, and the anti-oxidation layer 23 is plated on the side of the shielding film 22 facing the substrate by chemical plating as an example, the process of plating the anti-oxidation layer 23 can be roughly divided into the following eight process steps: (1) degreasing; (2) polishing; (3) water washing; (4) micro-etching by soaking in hydrochloric acid; (5) water washing; (6) soaking in a tin plating solution for chemical tin plating; (7) water washing; (8) drying.

[0080] Among them, Figure 6 As shown in FIG. 1 , when the anti-oxidation layer 23 is partially plated on the side of the shielding film 22 facing the substrate, the surface of the shielding film 22 may be cleaned, polished, and degreased, and then a process protection film 31 may be applied to the side of the shielding film 22 facing the substrate. Then, a window is opened on the process protection film 31 to form a process protection film 31 as shown in FIG. Figure 6 The window area shown in the figure is formed to expose part of the shielding film 22. Then, an anti-oxidation layer 23 is plated on the exposed local area of ​​the shielding film 22 through the window area, and finally the process protection film 31 is removed to obtain a shielding film 22 partially plated with an anti-oxidation layer 23.

[0081] like Figure 7 As shown, a method for preparing a shielding assembly according to an embodiment of the present invention, the shielding assembly is the shielding assembly in the above embodiment, which is used to perform electromagnetic shielding on an electronic device on a substrate in an electronic device, and the method for preparing the shielding assembly includes:

[0082] Step 110: Obtain a shielding cover.

[0083] Step 120: Mount a shielding cover on the substrate to surround the electronic components on the substrate.

[0084] A shielding cover 21 is obtained and mounted on the substrate to surround the electronic device on the substrate. The shielding cover 21 is provided with an opening and a shielding frame 211 forming the opening on a side away from the substrate, and a groove 212 is provided on a side of the shielding frame 211 away from the substrate.

[0085] In one embodiment, the step of mounting the shielding cover 21 on the substrate, i.e., step 120, may include: printing solder around the electronic device on the substrate, and mounting the shielding cover 21 on the area of ​​the substrate where the solder is located; in other words, the shielding cover 21 and the substrate may be welded using SMT patch technology.

[0086] In one embodiment, the groove 212 on the side of the shielding frame 211 facing away from the substrate is obtained by stamping using a stamping technique, wherein during the stamping process, a support plate can be used to support the side of the shielding frame 211 close to the substrate. Compared with other processing methods such as etching or laser engraving, stamping technology has higher processing efficiency, and by providing a support plate, it can effectively prevent the shielding frame 211 from being deformed during the stamping process, ensure the flatness of the shielding frame 211, and facilitate the subsequent welding between the shielding frame 211 and the shielding film 22.

[0087] In one embodiment, during the stamping process, multiple cutters may be used to stamp the side of the shielding frame 211 facing away from the substrate to obtain a groove 212, wherein each cutter may be provided with a tip, thereby further improving the flatness of the shielding frame 211 while ensuring that the groove 212 is processed and formed.

[0088] like Figure 8 As shown, the support plate 32 can be used to support the side of the shielding frame 211 close to the substrate, and three cutters are used in sequence to punch the side of the shielding frame 211 away from the substrate, wherein the middle of the first cutter is the tip, the left end of the second cutter is the tip, and the right end of the third cutter is the tip. The three cutters are used in sequence to punch, and a groove 212 with a cross section similar to a rectangle can be formed on the side of the shielding frame 211 away from the substrate. It can be understood that by superimposing the punching operations of different cutters, grooves 212 with different cross-sectional shapes can be punched out. The cross-sectional shape of the common punched groove 212 is as follows: Fig. 9 As shown, the present application is not limited to this and can be configured according to actual needs and is not limited here.

[0089] Step 130: Fill the groove of the shield frame with solder.

[0090] The groove 212 of the shielding frame 211 is filled with solder, and the solder is used to weld the shielding film 22 and the shielding cover 21 .

[0091] Step 140: Obtain a shielding film.

[0092] Step 150: Use a clamp to attach the shielding film to the opening of the shielding cover, covering the opening and the groove on the shielding frame.

[0093] Step 160: Weld the shielding cover and the substrate, and weld the shielding film and the shielding cover to form a shielding assembly.

[0094] In this embodiment, the shielding cover 21 is first mounted on the substrate, and then solder is filled in the groove 212 of the shielding frame 211. The shielding film 22 is then attached to the opening of the shielding cover 21 to cover the opening and the groove 212 on the shielding frame 211. The shielding cover 21 and the substrate as well as the shielding film 22 and the shielding cover 21 are then welded simultaneously. In this way, the preparation process of the shielding component can be simplified, the preparation efficiency can be improved, and the mass production performance of the shielding component can be improved.

[0095] In one embodiment, the steps of welding the shielding cover 21 to the substrate, welding the shielding film 22 to the shielding cover 21, i.e., step 160, may include: sending the substrate into a reflow oven, and performing reflow oven so that the shielding cover 21 is connected to the substrate through the solder printed on the substrate, and the shielding film 22 is connected to the shielding cover 21 through the solder in the groove 212 on the shielding frame 211. Compared with other welding methods (such as hot pressing or laser welding), reflow oven has higher welding stability and better welding quality. In actual application scenarios, before the substrate is sent into the reflow oven, high temperature resistant thermal conductive material can be selectively coated in the reflow oven according to needs, which is not limited here.

[0096] The preparation process of the shielding component in the above embodiment is compared with four other feasible preparation processes, wherein the preparation process in this embodiment can be divided into the following four process steps: (1) shielding cover SMT patch (corresponding to step 110-step 120); (2) storing solder in groove 212 (corresponding to step 130); (3) bonding shielding film 22 (corresponding to step 140-step 150); (4) reflow soldering (corresponding to step 160).

[0097] Other preparation process 1 can be divided into the following six steps: (1) solder is stored in the groove 212; (2) solder is heated and fused; (3) shielding cover SMT patch; (4) flux is applied; (5) shielding film 22 is attached; (6) reflow soldering. In other words, different from the preparation process in this embodiment, in other preparation process 1, the solder is first stored in the groove 212, then the shielding cover SMT patch is performed, then the shielding film 22 is attached, and finally the reflow soldering is performed.

[0098] Other preparation processes 2 can be divided into the following five steps: (1) solder is stored in the groove 212; (2) shielding film 22 is attached; (3) solder is heated and fused; (4) shielding cover SMT is attached; (5) reflow is performed. In other words, different from the preparation process in this embodiment, in other preparation processes 2, the shielding film 22 and the shielding cover 21 are first welded, then the shielding cover SMT is attached, and then reflow is performed.

[0099] The other preparation process 3 can be divided into the following five steps: (1) SMT mounting of shielding cover; (2) reflow soldering of shielding cover 21; (3) soldering in groove 212; (4) bonding shielding film 22; (5) reflow soldering of shielding film 22. In other words, different from the preparation process in this embodiment, in the other preparation process 3, reflow soldering is performed once on shielding cover 21 and shielding film 22 respectively.

[0100] Other preparation processes 4 can be divided into the following five steps: (1) SMT patching of shielding cover; (2) reflow soldering of shielding cover 21; (3) soldering in groove 212; (4) bonding shielding film 22; (5) hot pressing welding or laser welding. In other words, different from the preparation process in this embodiment, in other preparation processes 4, shielding cover 21 and shielding film 22 are welded once respectively, wherein reflow soldering is used to weld shielding cover 21 and substrate, and hot pressing welding or laser welding is used to weld shielding film 22 and shielding cover 21.

[0101] By comparing the performance of the preparation process of the shielding assembly in this embodiment with four other feasible preparation processes from the aspects of process steps, automatic optical inspection (AOI), and methods, equipment and materials required for each process, a comparison table as shown in Table 1 below is obtained.

[0102] Table 1 Comparison table

[0103]

[0104]

[0105] It can be seen from Table 1 above that the process steps in the preparation process of the shielding component in this embodiment only require four steps. Compared with the other four preparation processes, the preparation process in this embodiment is more simplified. Moreover, except for the preparation process of the shielding component in this embodiment, the other four preparation processes have corresponding disadvantages. For example, the method of printing solder on the suspended steel mesh adopted in other preparation processes 1-4 may have the risk of the shielding cover 21 being displaced; the method of prefabricated tin adopted in other preparation process 1 may have the risk of solder oxidation or affecting the flatness, and it is necessary to increase the step of spraying flux and increase the flux spraying equipment; the hot pressing welding or laser welding method adopted in other preparation process 3 has poor welding effect, and it is necessary to increase hot pressing welding equipment or laser welding equipment; the method of integrating the shielding film 22 and the shielding cover 21 into a material patch (that is, first welding the shielding film 22 and the shielding cover 21, and then SMT patching the shielding cover) adopted in other preparation process 2 is easy to cause the shielding cover 21 to be damaged or displaced, and the process of completing the welding of the shielding cover 21 and the shielding film 22 in advance has high process requirements for the hardware factory and is difficult to implement.

[0106] In summary, in this embodiment, the preparation process of the shielding component has the highest comprehensive ranking in terms of mass production, the highest preparation efficiency and mass production performance, so as to ensure the best electromagnetic shielding performance of the prepared shielding component.

[0107] In one embodiment, as Fig.10 shown, when using a fixture to attach the shielding film 22 to the opening of the shielding cover 21 so that the shielding film 22 covers the opening and the groove 212 on the shielding frame 211, a pressing block 33 can be placed on the side of the shielding film 22 away from the substrate to fix the shielding film 22 on the shielding frame 211 by using the pressing block 33, and then the step of feeding the substrate into the reflow soldering furnace is performed. Through the setting of the pressing block 33, the shielding film 22 can be made to fit the shielding frame 211 more closely, thereby preventing the shielding film 22 from experiencing micro-rebound and warping during the process of passing through the furnace for reflow soldering due to reasons such as the small self-weight of the shielding film 22 and the small adhesion force of the solder, thus ensuring the welding effect.

[0108] As Fig.11 shown, a fixture in an embodiment of the present invention, the fixture 40 is used to implement the preparation method of the shielding component described in the above embodiment, and is specifically used to attach the shielding film 22 to the opening of the shielding cover 21 to cover the opening and the groove 212 on the shielding frame 211.

[0109] The fixture 40 includes an adsorption plate 41 and a transfer plate 42 placed on the upper surface of the adsorption plate 41. A plurality of vacuum channels penetrating the upper and lower surfaces are provided inside both the transfer plate 42 and the adsorption plate 41. The vacuum channels inside the transfer plate 42 are called the first vacuum channels, and the vacuum channels inside the adsorption plate 41 are called the second vacuum channels. The adsorption plate 41 is used to adsorb the shielding film 22 through its own vacuum channels (i.e., the second vacuum channels), and the transfer plate 42 is used to adsorb the adsorption plate 41 through its own vacuum channels (i.e., the first vacuum channels) and carry the adsorption plate 41 to move.

[0110] It can be understood that, from Fig.12 the top view of the fixture 40 shown, the projections of the first vacuum channels and the second vacuum channels on the adsorption plate 41 do not overlap, enabling independent control of the first vacuum channels and the second vacuum channels, thereby realizing the adsorption / release of the transfer plate 42 to the adsorption plate 41 and the adsorption / release of the adsorption plate 41 to the shielding film 22. The opening / closing of the first vacuum channels and the second vacuum channels can be controlled by corresponding vacuum control modules. The vacuum control module for controlling the opening / closing of the first vacuum channels is called the first vacuum control module, and the vacuum control module for controlling the opening / closing of the second vacuum channels is called the second vacuum control module.

[0111] Specifically, before the shielding film 22 is attached to the opening of the shielding cover 21 by using the clamp 40 to cover the opening and the groove 212 on the shielding frame 211, the first vacuum control module can control the first vacuum channel to open, evacuate the air in the first vacuum channel, so as to form a high-pressure vacuum environment in the first vacuum channel, so that the transfer plate 42 adsorbs the adsorption plate 41. When the shielding film 22 is attached to the opening of the shielding cover 21 by using the clamp 40 to cover the opening and the groove 212 on the shielding frame 211, the second vacuum control module can control the second vacuum channel to open, evacuate the air in the second vacuum channel, so as to form a high-pressure vacuum environment in the second vacuum channel, so that the adsorption plate 41 absorbs the shielding film 22 from the material strip, and then the transfer plate 42 is used to carry the adsorption plate 41 to the opening of the shielding cover 21, completing the operation of attaching the shielding film 22 to the opening of the shielding cover 21, covering the opening and the groove 212 on the shielding frame 211.

[0112] In one embodiment, when the shielding film 22 is attached to the opening of the shielding cover 21 by using the clamp 40 so that the shielding film 22 covers the opening and the groove 212 on the shielding frame 211, the adsorption plate 41 can be released through the vacuum channel (i.e., the first vacuum channel) of the transfer plate 42, so as to fix the shielding film 22 on the shielding frame 211 by using the adsorption plate 41. Subsequently, the step of sending the substrate into the reflow oven is performed. That is to say, before the step of sending the substrate into the reflow oven, the above-mentioned clamp 40 can be used to realize the three processes of absorbing, attaching and placing the pressing block 33 of the shielding film 22, and the adsorption plate 41 in the clamp 40 is used as the pressing block 33 to avoid the displacement of the shielding film 22 or the wrinkling of the shielding film 22 caused by placing the pressing block 33 alone, thereby improving the effect of subsequent welding. At the same time, the process of placing the pressing block 33 alone can be saved, making the preparation process more streamlined.

[0113] In one embodiment, if Fig.13 As shown, a positioning column 43 for supporting the adsorption plate 41 may be provided below the adsorption plate 41. When the adsorption plate 41 is used as a pressing block 33, a positioning hole 44 matching the positioning column 43 may be pre-dug on the substrate. When the adsorption plate 41 is carried to the opening of the shielding cover 21 by the transfer plate 42, the positioning column 43 may be inserted into the corresponding positioning hole 44. Such a setting can, on the one hand, play a positioning role, and on the other hand, can also fix the position of the adsorption plate 41, ensuring that the shielding film 22 will not be displaced during the process of releasing the adsorption plate 41 on the shielding film 22.

[0114] In one embodiment, if Fig.14a As shown, corresponding to the area where the groove 212 on the shielding frame 211 is located, a plurality of detection holes 221 ( Fig.14aSix detection holes 221 are used as an example to detect the welding effect between the shielding film 22 and the shielding frame 211. By opening the detection holes 221 on the shielding film 22 to detect the welding effect between the shielding film 22 and the shielding frame 211, the intuitive and non-destructive inspection of the welding effect of the shielding film 22 can be achieved.

[0115] It is understandable that a plurality of detection holes 221 may be distributed around the shielding film 22, and generally 6 to 8 detection holes 221 may be provided to ensure the comprehensiveness of the inspection. The cross-sectional shape of the detection hole 221 may include but is not limited to a circle, an ellipse or a rectangle. Fig.14b As shown, the width of the detection hole 221 can be larger than the width of the groove 212. Generally, the width of the detection hole 221 can be 0.05mm to 0.15mm larger than the width of the groove 212. The number, size and shape of the detection holes 221 are not limited here and can be set according to actual needs.

[0116] The above are preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. An electronic device, It is characterized in that include: substrate; an electronic device electrically connected to the substrate; A shielding assembly, the shielding assembly comprising a shielding cover and a shielding film, the shielding assembly being used to perform electromagnetic shielding on the electronic device on the substrate; The shielding cover is mounted on the substrate to surround the electronic device on the substrate; the shielding cover is provided with an opening and a shielding frame forming the opening on a side away from the substrate, and the shielding frame is provided with a groove on a side away from the substrate; The shielding film is arranged at the opening of the shielding cover, covers the opening and the groove on the shielding frame, and is connected to the shielding cover via welding.

2. The electronic device according to claim 1, It is characterized in that The groove is an annular groove, which surrounds the opening of the shielding cover and is arranged on a side of the shielding frame away from the substrate.

3. The electronic device according to claim 1 or 2, It is characterized in that A plurality of grooves are provided on a side of the shielding frame away from the substrate, and the plurality of grooves are arranged at intervals around the opening on the side of the shielding frame away from the substrate.

4. The electronic device according to any one of claims 1 to 3, It is characterized in that An anti-oxidation layer is provided on a side of the shielding film facing the substrate, and the anti-oxidation layer at least covers an area where a projection of the groove on the shielding frame is located on the shielding film.

5. The electronic device according to any one of claims 1 to 4, It is characterized in that An anti-oxidation layer is disposed on a side of the shielding film facing the substrate, and the anti-oxidation layer covers a portion of the area where the projection of the groove on the shielding frame is located on the shielding film.

6. The electronic device according to any one of claims 1 to 5, It is characterized in that The shielding film is copper foil.

7. The electronic device according to any one of claims 1 to 6, It is characterized in that The groove is used for storing the solder for welding.

8. A method for preparing an electronic device, It is characterized in that The preparation method comprises the following steps: providing a substrate; electrically connecting an electronic device to the substrate; A shielding cover is mounted on the substrate to surround the electronic device on the substrate, wherein the shielding cover is provided with an opening and a shielding frame forming the opening on a side away from the substrate, and a groove is provided on a side of the shielding frame away from the substrate; Filling solder in the groove of the shielding frame; Provide shielding film; Using a clamp to attach the shielding film to the opening of the shielding cover, covering the opening and the groove on the shielding frame; The shielding cover and the substrate are welded, and the shielding film and the shielding cover are welded to form the electronic device.

9. The method for preparing an electronic device according to claim 8, It is characterized in that The step of mounting the shielding cover on the substrate comprises: printing solder on the substrate around the electronic device; The shielding cover is mounted on the substrate in an area where the solder is located.

10. The method for preparing an electronic device according to claim 9, It is characterized in that The step of welding the shielding cover and the substrate, and welding the shielding film and the shielding cover comprises: The substrate is sent into a reflow oven for reflow, so that the shielding cover is connected to the substrate through the solder printed on the substrate, and the shielding film is connected to the shielding cover through the solder in the groove on the shielding frame.

11. The method for preparing an electronic device according to claim 10, It is characterized in that The fixture comprises an adsorption plate and a transfer plate placed on the upper surface of the adsorption plate, wherein the transfer plate and the adsorption plate are both provided with a plurality of vacuum channels penetrating the upper and lower surfaces; the adsorption plate is used to adsorb the shielding film through its own vacuum channel, and the transfer plate is used to adsorb the adsorption plate through its own vacuum channel and carry the adsorption plate to move; When the shielding film is attached to the opening of the shielding cover by using the clamp so that the shielding film covers the opening and the groove on the shielding frame, the adsorption plate is released through the vacuum channel of the transfer plate to fix the shielding film on the shielding frame by using the adsorption plate, and then the step of sending the substrate into the reflow oven is performed.

12. The method for preparing an electronic device according to claim 8, It is characterized in that The groove on the side of the shielding frame facing away from the substrate is obtained by punching using a stamping technology, wherein during the punching process, a support plate is used to support the side of the shielding frame close to the substrate.

13. The method for preparing an electronic device according to claim 8, It is characterized in that The method further comprises: Corresponding to the area where the groove on the shielding frame is located, a plurality of detection holes are opened on the side of the shielding film away from the shielding frame, so as to detect the welding effect between the shielding film and the shielding frame through the detection holes.

14. A clamp, It is characterized in that A method for manufacturing an electronic device according to any one of claims 8 to 13; The fixture comprises an adsorption plate and a transfer plate placed on the upper surface of the adsorption plate, wherein the transfer plate and the adsorption plate are both provided with a plurality of vacuum channels penetrating the upper and lower surfaces; The adsorption plate is used to adsorb the shielding film in the shielding assembly through its own vacuum channel, and the transfer plate is used to adsorb the adsorption plate through its own vacuum channel and carry the adsorption plate to move.

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