Laser enhanced injection metallization strengthening and repairing synchronization equipment and processing method

Abstract

The invention provides laser enhanced injection metallization strengthening and repairing synchronization equipment and a processing method, and the equipment comprises a first double-laser assembly which comprises at least two first laser output heads and a first pressurization monitoring mechanism, the first pressurization monitoring mechanism comprises a first lifting unit and a first pressing structure provided with a plurality of first probes, and the lifting end of the first lifting unit drives the first pressing structure to lift up and down; the second double-laser assembly comprises at least two second laser output heads and a second pressurization monitoring mechanism, and the second pressurization monitoring mechanism comprises a second lifting unit and a second pressing structure provided with a plurality of second probes; according to the invention, metallization strengthening and repairing can be carried out on the batteries and assemblies, and the stability, the precision, the gain and the yield of production are provided.

Description

Technical Field

[0001] The present invention relates to the field of laser processing technology, and in particular to a laser enhanced injection metallization strengthening and repairing synchronous equipment and a processing method. Background Art

[0002] In the development of photovoltaic cell technology, the traditional high-temperature sintering metallization process requires silver paste etching to open the passivation layer in order to form an ohmic contact. To achieve a good metallization effect, it is necessary to continuously optimize the paste formula to seek a precise balance between the spear and the shield.

[0003] In the conduction mechanism of traditional high-temperature sintered metallized ohmic contacts, direct conduction of silver microcrystals is dominant, supplemented by different types of tunneling indirect conduction. From an electrochemical perspective, the construction of direct conduction channels requires that the Ag+ dissolved in the glass during sintering obtain enough electrons to be reduced to form silver microcrystals. Disadvantages of existing high-temperature sintering metal processes:

[0004] 1. The process efficiency improvement effect is not good, and it cannot make more Ag-Si combine more fully, resulting in higher resistance and the efficiency improvement does not reach the optimal state.

[0005] 2. The equipment cost is high, and the related equipment and maintenance costs are also high.

[0006] 3. The instantaneous current of product processing is not enough. During the processing, the processing area is large, resulting in insufficient instantaneous current intensity in the entire area and insufficient sintering. Summary of the invention

[0007] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a laser-enhanced injection metallization strengthening and repair synchronous equipment and processing method, which has a good efficiency improvement effect, can make more Ag-Si combine more fully, have lower resistance, and fully sintered, can strengthen and repair the metallization of batteries and components, and provide production stability, accuracy, gain and yield.

[0008] The embodiments of the present invention are implemented by the following technical solutions:

[0009] A laser enhanced injection metallization strengthening and repairing synchronous equipment and processing method, comprising:

[0010] A first dual laser assembly, wherein the first dual laser assembly includes at least two first laser output heads and a first pressurization monitoring mechanism, wherein the first pressurization monitoring mechanism includes a first lifting unit and a first pressing structure provided with a plurality of first probes, wherein the lifting end of the first lifting unit drives the first pressing structure to move up and down;

[0011] A second dual laser assembly, wherein the second dual laser assembly includes at least two second laser output heads and a second pressurization monitoring mechanism, wherein the second pressurization monitoring mechanism includes a second lifting unit and a second pressing structure provided with a plurality of second probes, and the lifting end of the second lifting unit drives the second pressing structure to move up and down;

[0012] A turntable is provided with a second voltage loading terminal and a plurality of turntables for placing batteries, the first dual laser assembly is located above one of the turntables, and the second dual laser assembly is located above another of the turntables.

[0013] According to a preferred embodiment, the turntable is provided with a copper plate jig.

[0014] According to a preferred embodiment, a handling assembly is provided on one side of the turntable;

[0015] The number of the turntables includes at least three;

[0016] The first of the turntables is located below the first dual laser assembly;

[0017] The second said turntable is located below the second dual laser assembly;

[0018] The third turntable is located below the transport assembly.

[0019] According to a preferred embodiment, it also includes a visual module;

[0020] The number of the turntables includes at least four;

[0021] Among them, the fourth turntable is located below the visual module.

[0022] According to a preferred embodiment, the transport assembly includes a transport X-axis moving mechanism, a transport Z-axis moving mechanism and a transport suction cup, the moving end of the transport X-axis moving mechanism can drive the transport suction cup to move in the X-axis direction, and the moving end of the transport Z-axis moving mechanism can drive the transport suction cup to move in the Z-axis direction.

[0023] According to a preferred embodiment, a material unloading mechanism and a material loading mechanism are provided on the left and right sides of the transport assembly;

[0024] The unloading mechanism includes an unloading conveyor belt, an unloading Z-axis moving mechanism, an unloading Y-axis moving mechanism and an unloading suction cup;

[0025] The feeding mechanism comprises a feeding conveyor belt, a feeding Z-axis moving mechanism, a feeding Y-axis moving mechanism and a feeding suction cup.

[0026] According to a preferred embodiment, the first pressing structure and the second pressing structure are both hollow frame structures;

[0027] A plurality of the first probes are arranged on a side of the first pressing structure away from the turntable;

[0028] A plurality of the second probes are arranged on one side of the second pressing structure close to the turntable.

[0029] A processing method for laser-enhanced injection metallization strengthening and repairing synchronous equipment comprises the following steps:

[0030] Step S1: the battery is loaded with voltage, and the first dual laser assembly emits a laser beam to irradiate a part of the surface of the battery, so as to excite carriers on the part of the surface of the battery to form a local high-density current;

[0031] Step S2: moving the battery to the workstation of the second dual laser assembly, the second dual laser assembly emits a laser beam to irradiate another part of the surface of the battery, so as to excite carriers on the other part of the surface of the battery to form a local high-density current.

[0032] According to a preferred embodiment, in step S1, the handling assembly places the battery on a turntable, controls the turntable to rotate, rotates the turntable carrying the battery to directly below the first dual laser assembly, controls the first lifting unit to cause the first pressing structure to press the battery, and the first dual laser assembly emits a laser beam to irradiate a portion of the surface of the battery;

[0033] In step S2, the turntable is controlled to rotate, and the turntable carrying the battery is rotated to directly below the second dual laser assembly, and the second dual laser assembly emits a laser beam to irradiate another part of the surface of the battery.

[0034] According to a preferred embodiment, the loading voltage ranges from 11V to 17V.

[0035] The technical solution of the embodiment of the present invention has at least the following advantages and beneficial effects:

[0036] The process of the present invention has good efficiency improvement effect, can make more Ag-Si combination more fully, has lower resistance, low equipment cost, and related equipment and maintenance costs are also low. The instantaneous current of product processing is sufficient. During the processing, the processing format is large, the instantaneous current intensity in the entire format is sufficient, and the sintering is sufficient. It can strengthen and repair the metallization of batteries and components, and provide production stability, precision, gain and yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0038] Figure 1 A schematic diagram of the structure of a laser-enhanced injection metallization strengthening and repairing synchronization device provided in an embodiment of the present invention;

[0039] Figure 2 A schematic diagram of the structure of a first dual laser assembly, a second dual laser assembly and a turntable provided in an embodiment of the present invention;

[0040] Figure 3 for Figure 2 The main view of

[0041] Figure 4 A schematic structural diagram of a first pressing structure provided in an embodiment of the present invention;

[0042] Figure 5 A schematic diagram of the working state structure of the turntable provided in an embodiment of the present invention.

[0043] Icons: 1. First laser output head; 2. First lifting unit; 3. First pressing structure; 4. First probe; 5. Second laser output head; 6. Second lifting unit; 7. Second pressing structure; 8. Second probe; 9. Turntable; 10. Turntable; 11. Copper plate fixture; 12. X-axis moving mechanism for transport; 13. Z-axis moving mechanism for transport; 14. Transport suction cup; 15. Unloading mechanism; 16. Loading mechanism; 17. Visual module. DETAILED DESCRIPTION

[0044] For better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0045] In the description of the present invention, it should be noted that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0047] Example

[0048] Please refer to Figures 1 to 5 , a laser enhanced injection metallization strengthening and repair synchronization equipment and processing method, including: a first dual laser assembly, the first dual laser assembly includes at least two first laser output heads 1 and a first pressure monitoring mechanism, the first pressure monitoring mechanism includes a first lifting unit 2 and a first pressing structure 3 provided with a plurality of first probes 4, the lifting end of the first lifting unit 2 drives the first pressing structure 3 to move up and down; a second dual laser assembly, the second dual laser assembly includes at least two second laser output heads 5 and a second pressure monitoring mechanism, the second pressure monitoring mechanism includes a second lifting unit 6 and a second pressing structure 7 provided with a plurality of second probes 8, the lifting end of the second lifting unit 6 drives the second pressing structure 7 to move up and down; a turntable 9, the turntable 9 is provided with a second voltage loading end and a plurality of turntables 10 for placing batteries, the first dual laser assembly is located above one turntable 10, and the second dual laser assembly is located above another turntable 10.

[0049] Preferably, the turntable 10 is provided with a copper plate jig 11 .

[0050] Preferably, a handling assembly is provided on one side of the turntable 9;

[0051] The number of the turntables 10 includes at least three;

[0052] The first turntable 10 is located below the first dual laser assembly;

[0053] The second turntable 10 is located below the second dual laser assembly;

[0054] The third turntable 10 is located below the transport assembly.

[0055] Preferably, it also includes a visual module 17;

[0056] The number of the turntables 10 includes at least four;

[0057] The fourth turntable 10 is located below the visual module 17 .

[0058] Preferably, the transport assembly includes a transport X-axis moving mechanism 12, a transport Z-axis moving mechanism 13 and a transport suction cup 14. The moving end of the transport X-axis moving mechanism 12 can drive the transport suction cup 14 to move in the X-axis direction, and the moving end of the transport Z-axis moving mechanism 13 can drive the transport suction cup 14 to move in the Z-axis direction.

[0059] Preferably, a material unloading mechanism 15 and a material loading mechanism 16 are provided on the left and right sides of the transport assembly;

[0060] The unloading mechanism 15 includes an unloading conveyor belt, an unloading Z-axis moving mechanism, an unloading Y-axis moving mechanism and an unloading suction cup;

[0061] The feeding mechanism 16 includes a feeding conveyor belt, a feeding Z-axis moving mechanism, a feeding Y-axis moving mechanism and a feeding suction cup.

[0062] Preferably, the first pressing structure 3 and the second pressing structure 7 are both hollow frame structures;

[0063] A plurality of first probes 4 are arranged on a side of the first pressing structure 3 away from the turntable 9;

[0064] A plurality of second probes 8 are disposed on one side of the second pressing structure 7 close to the turntable 9 .

[0065] A processing method for laser-enhanced injection metallization strengthening and repairing synchronous equipment, comprising the following steps: Step S1: a battery is loaded with voltage, and a first dual laser assembly emits a laser beam to irradiate a part of the surface of the battery, so as to excite carriers on the part of the surface of the battery to form a local high-density current;

[0066] Step S2: Move the battery to the workstation of the second dual laser assembly, and the second dual laser assembly emits a laser beam to irradiate another part of the surface of the battery, so as to excite carriers on the other part of the surface of the battery to form a local high-density current.

[0067] Preferably, in step S1, the handling assembly places the battery on the turntable 10, controls the turntable 9 to rotate, rotates the turntable 10 carrying the battery to directly below the first dual laser assembly, controls the first lifting unit 2 to cause the first pressing structure 3 to press the battery, and the first dual laser assembly emits a laser beam to irradiate a part of the surface of the battery;

[0068] In step S2, the turntable 9 is controlled to rotate, and the turntable 10 carrying the battery is rotated to just below the second dual laser assembly, and the second dual laser assembly emits a laser beam to irradiate another part of the surface of the battery.

[0069] According to a preferred embodiment, the loading voltage ranges from 11V to 17V.

[0070] Working principle of the present invention:

[0071] In this embodiment, electrochemical effect: the laser beam irradiates the battery surface, and the laser carrier (electron) injection compensates for the lack of surface electrons, promoting the reduction of Ag+ to silver microcrystals. Thermal effect: under the guidance of bias voltage, the photogenerated carriers form a local high-density current, and the heat generated promotes the local Ag-Si interdiffusion, forming an extremely low-resistance AgS ix alloyed contact. The first dual laser assembly and the second dual laser assembly are both selected to use laser temperature measurement and coaxial setting, and are processed by the coaxial temperature control system, which is convenient for precise thermal management and improves the quality of metallurgical bonding. Real-time temperature feedback is possible: an infrared temperature measurement module (response time ≤ 200ns) is integrated in the coaxial optical system to directly monitor the surface temperature of the silicon wafer in the laser action area (range: 100-2500℃), and the laser power and reverse voltage are dynamically adjusted in combination with the PID algorithm to avoid overburning (excessive ablation) or insufficient processing temperature (failure to form good crystals). In the gradient temperature control process, the temperature curve is preset for different processing areas within the format. For example, the temperature is quickly raised to the normal power + 10% above the point of material modification at the initial stage of processing around the periphery and the center, and then reduced to normal power to maintain a stable processing effect and ensure that the interface metallurgical bonding is sufficient. In this embodiment, the heat affected zone (HAZ) and the localized residual stress can be reduced and the temperature can be precisely controlled: through the constraint layer (such as argon curtain) and the temperature control system, the heat is concentrated on the surface (the depth of the heat affected zone ≤ 100μm) to ensure the coarsening of the silicon matrix material grains, which is especially suitable for batteries after screen printing. Synchronous cooling: After completing the processing of the corresponding area, enter the next area for processing, and quickly cool the processed area (the cooling rate reaches 300℃ / ms) to inhibit the precipitation of brittle phases and improve battery characteristics.

[0072] In this embodiment, the first dual laser assembly is provided with two first laser output heads 1, and the second dual laser assembly is provided with two second laser output heads 5. Figure 5As shown, a battery on the turntable 10 can be divided into four areas A, B, C, and D. Several first probes 4 of the first pressing structure 3 can be driven to rise and fall by the first lifting unit 2, so that several first probes 4 are in contact with the battery. At the same time, the copper plate fixture 11 is in contact with the battery to achieve electrical connection between the two poles of the battery. The copper plate fixture 11 on the turntable 10 can be connected to an external electrical connection end, and the external electrical connection end is located at the bottom of the turntable 9. In this embodiment, in addition to the copper plate fixture 11, other connecting elements can be selected so that the battery on the turntable 10 can be connected to the two electrical connection ends respectively, so that voltage can be applied to the battery, and the battery after voltage is applied is then laser processed. After laser irradiation processing is performed on the A and B areas of the battery, the turntable 9 rotates, and the battery rotates from the E position to the F position. At this time, the two second laser output heads 5 perform laser processing on the C and D areas of the battery, and the laser processing of the same battery after voltage is applied is completed. In this embodiment, the circular spot, rectangular spot or strip spot that can be processed can be customized according to the application needs. The smallest spot range is 20um, and the largest rectangular spot can reach 230*1.2mm. The visual module 17 can be composed of four cameras, respectively connected to the attached Figure 5 The four areas A, B, C, and D correspond one to one, and each area of ​​the battery can be detected and monitored.

[0073] In this embodiment, the first laser output head 1 and the second laser output head 5 both adopt the solution of infrared continuous laser, the main band is 750-1400nm, and can also be used as green laser solution, the green laser band is between 500-570nm, and is also compatible with ultraviolet laser: the device is compatible with pulsed laser or continuous laser, and is also compatible with laser splitting solution. The laser has power feedback function and can also be used for laser processing of components. The component series welding process of PERC, TOPCON, HJT, and XBC can be used. The process solution is not limited to laser welding, laser removal, laser cutting, laser scribing and other processes. In addition, in this embodiment, a dual-path power negative feedback system can be selected to detect after output and feedback to the first dual laser component and the second dual laser component for power regulation.

[0074] In this embodiment, the first dual laser component and the second dual laser component are strengthened and repaired through laser enhanced injection metallization. Because high power density can provide higher energy per unit area, higher energy per unit area can quickly promote the strengthening effect of the electrode. At the same time, high energy can prompt the silver electrode layer to pass through the dielectric layer to reach the silicon base layer to form a bonding layer of silver and silicon. The higher the laser energy, the stronger the mutual penetration of silver and silicon. Under the condition of a certain unit energy, the mutual penetration of silver and silicon can be enhanced to form a metallurgical bonding layer interface of a certain depth. Under the effect of strengthening, the metallurgical bonding interface layer of the battery can be repaired. At the same time, a battery is divided into 4 areas for processing. Two areas can be processed simultaneously at a time or in steps. While two areas (such as A and B) are processed simultaneously, the interface bonding layer of the other two areas (such as C and D) can be repaired more accurately. During asynchronous processing, the laser will irradiate the battery, and current will be generated near the grid line inside the battery, which will gather near the grid line to generate carriers. The carriers will carry out fine repair and optimization of the defects at the junction, thereby reducing the resistance of the bonding layer, making the bonding layer more uniform, more sufficient and more stable.

[0075] This embodiment is compatible with 10-1000W power lasers, can more accurately achieve power control at 0.1W, can also achieve splitting of multiple lasers to emit light together, and can achieve simultaneous control of multiple low-power lasers. A single battery can achieve a reverse voltage of 1-30V at the same time, which can be accurately controlled at 0.1V. It can also achieve a power supply to divide the voltage at the same time to supply each battery voltage separately. This solution is to process 4 areas at the same time, not limited to splitting 4 times and passing the reverse voltage 4 times.

[0076] This embodiment can be used for the laser enhanced injection metallization strengthening and repair of photovoltaic crystalline silicon cells (TOPCON / HJT / XBC) simultaneously, and can also be used for laser enhanced injection metallization strengthening and repair of new processes such as stacked grid and half-cell passivation cells. Photovoltaic crystalline silicon cells greatly improve the efficiency of the cell gain through this equipment, and the process solution can increase the gain effect by 0.2-0.3%, while ensuring the yield and stability of the overall product.

[0077] The first pressing structure 3 and the second pressing structure 7 are both hollow frame structures and are adapted to the size of the battery. Therefore, the first pressing structure 3 and the second pressing structure 7 can fit and press the battery after being raised or lowered, and the first probe 4 or the second probe 8 can make electrical signal contact connection to the corresponding battery.

[0078] Transport components as attached Figure 1As shown, the unloading Z-axis moving mechanism and the unloading Y-axis moving mechanism can realize the movement of the unloading suction cup along the Z-axis direction and the Y-axis direction. The moving end of the unloading Y-axis moving mechanism can be connected to the unloading suction cup. At this time, the moving end of the unloading Z-axis moving mechanism is connected to the unloading Y-axis moving mechanism; when the moving end of the unloading Z-axis moving mechanism is connected to the unloading suction cup, the moving end of the unloading Y-axis moving mechanism can drive the Z-axis moving mechanism to be connected; in addition, the unloading X-axis moving mechanism can also be set to realize the movement of the unloading suction cup in the X-axis direction. Similarly, the loading mechanism 16 of the handling assembly has the same structure as the unloading mechanism 15, so it will not be repeated.

[0079] The technical means disclosed in the scheme of the present invention are not limited to the technical means disclosed in the above-mentioned implementation mode, but also include technical schemes composed of any combination of the above-mentioned technical features. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications are also regarded as the protection scope of the present invention.

Claims

1. A laser-enhanced injection metallization strengthening and repair synchronization device, characterized in that: include: A first dual laser assembly, wherein the first dual laser assembly includes at least two first laser output heads and a first pressurization monitoring mechanism, wherein the first pressurization monitoring mechanism includes a first lifting unit and a first pressing structure provided with a plurality of first probes, wherein the lifting end of the first lifting unit drives the first pressing structure to move up and down; A second dual laser assembly, the second dual laser assembly includes at least two second laser output heads and a second pressurization monitoring mechanism, the second pressurization monitoring mechanism includes a second lifting unit and a second pressing structure provided with a plurality of second probes, the lifting end of the second lifting unit drives the second pressing structure to move up and down; A turntable is provided with a second voltage loading terminal and a plurality of turntables for placing batteries, the first dual laser assembly is located above one of the turntables, and the second dual laser assembly is located above another of the turntables.

2. The laser-enhanced injection metallization strengthening and repairing synchronous equipment according to claim 1, characterized in that: The turntable is provided with a copper plate jig.

3. The laser-enhanced injection metallization strengthening and repairing synchronous equipment according to claim 1, characterized in that: A transport assembly is provided on one side of the turntable; The number of the turntables includes at least three; The first of the turntables is located below the first dual laser assembly; The second said turntable is located below the second dual laser assembly; The third turntable is located below the transport assembly.

4. The laser-enhanced injection metallization strengthening and repairing synchronous equipment according to claim 3 is characterized in that: Also included is located in the visual module; The number of the turntables includes at least four; Among them, the fourth turntable is located below the visual module.

5. The laser-enhanced injection metallization strengthening and repairing synchronous equipment according to claim 3, characterized in that: The transport assembly includes a transport X-axis moving mechanism, a transport Z-axis moving mechanism and a transport suction cup. The moving end of the transport X-axis moving mechanism can drive the transport suction cup to move in the X-axis direction, and the moving end of the transport Z-axis moving mechanism can drive the transport suction cup to move in the Z-axis direction.

6. The laser-enhanced injection metallization strengthening and repairing synchronous equipment according to claim 5, characterized in that: The left and right sides of the transport assembly are provided with a material unloading mechanism and a material loading mechanism; The unloading mechanism includes an unloading conveyor belt, an unloading Z-axis moving mechanism, an unloading Y-axis moving mechanism and an unloading suction cup; The feeding mechanism comprises a feeding conveyor belt, a feeding Z-axis moving mechanism, a feeding Y-axis moving mechanism and a feeding suction cup.

7. The laser-enhanced injection metallization strengthening and repairing synchronous equipment according to claim 5, characterized in that: The first pressing structure and the second pressing structure are both hollow frame structures; A plurality of the first probes are arranged on a side of the first pressing structure away from the turntable; A plurality of the second probes are arranged on one side of the second pressing structure close to the turntable.

8. The processing method of laser enhanced injection metallization strengthening and repairing synchronous equipment according to claim 1 is characterized in that: The following steps are involved: Step S1: the battery is loaded with voltage, and the first dual laser assembly emits a laser beam to irradiate a part of the surface of the battery, so as to excite carriers on the part of the surface of the battery to form a local high-density current; Step S2: moving the battery to the workstation of the second dual laser assembly, the second dual laser assembly emits a laser beam to irradiate another part of the surface of the battery, so as to excite carriers on the other part of the surface of the battery to form a local high-density current.

9. The processing method of the laser enhanced injection metallization strengthening and repairing synchronous equipment according to claim 8 is characterized in that: In step S1, the handling assembly places the battery on the turntable, controls the turntable to rotate, rotates the turntable carrying the battery to directly below the first dual laser assembly, controls the first lifting unit to cause the first pressing structure to press the battery, and the first dual laser assembly emits a laser beam to irradiate a portion of the surface of the battery; In step S2, the turntable is controlled to rotate, and the turntable carrying the battery is rotated to directly below the second dual laser assembly, and the second dual laser assembly emits a laser beam to irradiate another part of the surface of the battery.

10. The processing method of laser enhanced injection metallization strengthening and repairing synchronous equipment according to claim 8, characterized in that: The loading voltage ranges from 11V to 17V.

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