Display panel and display device

Abstract

This application relates to the field of display technology, and provides a display panel and a display device. The display panel includes a display area and a non-display area, with the non-display area at least partially surrounding the display area. The display panel also includes a substrate, an organic insulating layer, and a barrier. The organic insulating layer is located on one side of the substrate and in the display area, and includes a first organic insulating layer and a second organic insulating layer, with the second organic insulating layer located on the side of the first organic insulating layer facing away from the substrate. The barrier is located on one side of the substrate and in the non-display area. A first through-slot is formed between the end of the first organic insulating layer near the barrier and the surface of the barrier facing the display area. The maximum width of the first through-slot is a first width, and the minimum distance between the end of the second organic insulating layer near the barrier and the surface of the barrier facing the display area is a second width. The first width is less than the second width, and the first through-slot width is less than 20 μm. The display effect of the display panel provided by this application is improved.

Description

Technical Field

[0001] This application belongs to the field of display technology, and more specifically, relates to a display panel and display device. Background Technology

[0002] Organic light-emitting diode (OLED) display panels are display devices that utilize the self-emissive principle of organic light-emitting materials to achieve display. They have advantages such as fast response speed, high brightness, and wide viewing angle, making them a highly competitive and promising type of display panel.

[0003] However, the display performance of current OLED display products needs improvement. Summary of the Invention

[0004] This application provides a display panel and a display device to improve the display effect of the display panel to at least a certain extent.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: In a first aspect, a display panel is provided, the display panel including a display area and a non-display area, the non-display area at least partially surrounding the display area, the display panel further including a substrate, an organic insulating layer and a barrier, the organic insulating layer being located on one side of the substrate and in the display area, the organic insulating layer including a first organic insulating layer and a second organic insulating layer, the second organic insulating layer being located on the side of the first organic insulating layer facing away from the substrate; the barrier is located on one side of the substrate and in the non-display area, at least partially surrounding the display area, and the end of the first organic insulating layer near the barrier and the surface of the barrier facing the display area form a first through groove;

[0006] Wherein, along the direction parallel to the plane where the substrate is located, the maximum width of the first through groove is the first width, the minimum distance between the end of the second organic insulating layer near the barrier and the side surface of the barrier facing the display area is the second width, the first width is less than the second width and the first width is less than 20μm.

[0007] In the display panel provided in this embodiment, the space formed between the organic insulating layer and the barrier can be used to accommodate encapsulation material in subsequent processes to achieve effective encapsulation of the display area. By adjusting the distribution range of the second organic insulating layer, while ensuring that the second width indicating the distance between the second organic insulating layer and the barrier is always greater than the first width indicating the size of the first through-slot, the first width (i.e., the maximum width of the first through-slot) can be reduced to less than 20 μm. At this time, without changing the arrangement position of the barrier, i.e., without changing the size of the display panel, the width of the display area can be reduced by reducing the width of the first through-slot to less than 20 μm, thereby improving the display effect and visual effect of the display panel.

[0008] Optionally, the orthographic projection of the second organic insulating layer on the substrate is located within the orthographic projection of the first organic insulating layer on the substrate.

[0009] Optionally, the absolute value of the difference between the first width and the second width is greater than 5 μm.

[0010] Optionally, the second width is greater than 25 μm.

[0011] Optionally, the first width is not less than 5 μm.

[0012] Optionally, the second width is no greater than 55 μm;

[0013] Optionally, the material of the second organic insulating layer includes organic materials, and / or the material of the first organic insulating layer includes organic materials.

[0014] Optionally, the organic insulating layer further includes a third organic insulating layer located on the side of the first organic insulating layer opposite to the second organic insulating layer, and the first organic insulating layer covers the surface of the third organic insulating layer opposite to the substrate.

[0015] Optionally, the first organic insulating layer covers the surface of the side wall of the third organic insulating layer at one end of the retaining wall.

[0016] Optionally, the material of the third organic insulating layer includes organic materials.

[0017] Optionally, the second organic insulating layer is provided with a second through groove.

[0018] Optionally, the number of the second perforation slots is at least two.

[0019] Optionally, the display panel further includes a first encapsulation layer, which is disposed on the side of the barrier facing the display area and covers the first through slot.

[0020] Optionally, the orthographic projection of the organic insulating layer on the substrate lies within the orthographic projection of the first encapsulation layer on the substrate.

[0021] Optionally, the material of the first encapsulation layer includes organic materials.

[0022] Optionally, the display panel further includes a second encapsulation layer, the second encapsulation layer being located on the side of the first encapsulation layer facing the substrate;

[0023] The second encapsulation layer extends from the display area to the non-display area, and the orthographic projection of the second encapsulation layer on the substrate covers the orthographic projection of the first encapsulation layer on the substrate and the orthographic projection of the barrier on the substrate.

[0024] Optionally, the material of the second encapsulation layer includes inorganic materials.

[0025] Optionally, the display panel further includes a third encapsulation layer located on the side of the first encapsulation layer facing away from the substrate;

[0026] The third encapsulation layer extends from the display area to the non-display area, and the orthographic projection of the third encapsulation layer on the substrate covers the orthographic projection of the first encapsulation layer on the substrate and the orthographic projection of the barrier on the substrate.

[0027] Optionally, the orthographic projection of the third encapsulation layer on the substrate overlaps the orthographic projection of the second encapsulation layer on the substrate.

[0028] Optionally, the material of the third encapsulation layer includes inorganic materials.

[0029] Optionally, the display panel further includes a light-emitting functional layer located on the side of the organic insulating layer facing away from the substrate, and the first encapsulation layer covers the surface of the light-emitting functional layer facing away from the substrate.

[0030] Optionally, along the thickness direction of the substrate, a driving circuit layer is disposed between the second organic insulating layer and the substrate, wherein the outer contour of the orthographic projection of the driving circuit layer on the substrate is located within the outer contour of the orthographic projection of the second organic insulating layer on the substrate.

[0031] Optionally, the light-emitting functional layer includes an anode layer that covers the side of the second organic insulating layer facing away from the substrate.

[0032] In a second aspect, this application also provides a display device including the display panel described in any of the preceding claims.

[0033] The display device provided in this application includes the above-mentioned display panel. Therefore, the display device has the beneficial effects of including at least one or more of the above-mentioned display panels. The specific effects are as described above and will not be repeated here.

[0034] The beneficial effects of the display panel and display device provided in this application are as follows: Compared with related technologies, the display panel provided in this application can achieve the goal of compressing the size of the first through-groove in the direction parallel to the plane of the substrate without reducing the size of the space used to accommodate the encapsulation material, by adjusting the distribution range of the first organic insulating layer and the second organic insulating layer to be different, with the distribution range of the first organic insulating layer being larger than that of the second organic insulating layer. This allows for the simultaneous consideration of the narrow bezel of the display panel and the prevention of encapsulation material overflow without changing the relevant manufacturing process. This solution can effectively reduce the size of the non-display area of ​​the display panel without increasing the difficulty of the processing technology, and effectively improve the display effect and visual viewing effect of the display panel. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 This is a schematic diagram of the structure of a display panel in related technologies;

[0037] Figure 2 This is a schematic diagram of the planar structure of the display panel provided in an embodiment of this application;

[0038] Figure 3 for Figure 2 The diagram shows a sectional view of the display panel along line AA.

[0039] Figure 4 for Figure 3 Enlarged view of the structure of region B in the middle;

[0040] Figure 5 for Figure 2 Another AA-direction cross-sectional view of the display panel shown;

[0041] Figure 6 for Figure 2 Another AA-direction sectional view of the display panel shown;

[0042] Figure 7 This is a schematic diagram of the planar structure of the display device provided in the embodiments of this application.

[0043] The following are the labeling elements in the figure:

[0044] 1. Substrate; 2. Organic insulating layer; 21. First organic insulating layer; 22. Second organic insulating layer; 2201. Second through-slot; 24. Third organic insulating layer; 3. Barrier; 4. First through-slot; 5. First encapsulation layer; 6. Second encapsulation layer; 7. Third encapsulation layer; 8. Light-emitting functional layer; 81. Anode layer; 9. Driving circuit layer;

[0045] 10. Display panel; 110. Display area; 120. Non-display area; 100. Display device. Detailed Implementation

[0046] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0047] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0048] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0050] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0051] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0052] In this application, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0053] As used herein, the term "substrate" refers to a material on which subsequent material layers are added to provide a support substrate for the layers above. In some embodiments, the substrate may be flexible, stretchable, foldable, bendable, or rollable, such that the display panel may be flexible, stretchable, foldable, bendable, or rollable. The substrate material may be formed from any suitable insulating material that is flexible, such as polyimide (PI), polycarbonate (P), polyethersulfone (PES), or polymeric materials such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyaryl compounds (PR), or glass fiber reinforced plastic (FRP). The substrate may be transparent, translucent, or opaque. In other embodiments, the substrate may also be rigid, made of a rigid insulating material, such as metal, ultrathin glass, plastic, or sapphire wafer. The substrate itself may be patterned. The material added to the substrate can be patterned, or it can remain unpatterned.

[0054] The terms "layer" or "element" used in this document can refer to a structural or functional layer of a certain thickness and covering a certain area, composed of different materials that make up the structure of a display panel. A layer or element can extend over a complete layer or element structure located below or above, or have a smaller extent than the layer or element structure located below or above. It should be noted that the dimensions of layers and areas may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when a layer or element is referred to as being "on" another layer or element, it can be directly on the other layer or element, or it can be a layer located between two structures. Additionally, it is understood that when a layer or element is referred to as being "below" another layer or element, it can be directly below the other layer or element, or it can be more than one intermediate layer or element. It is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between two layers or two elements, or it can be more than one intermediate layer or element. Moreover, a layer or element can be a region of a homogeneous or non-homogeneous continuous structure with a thickness less than the thickness of that continuous structure. For example, the layer may be located between the top and bottom surfaces of the continuous structure or between any pair of lateral planes at the top and bottom surfaces. The layer may extend laterally, vertically, and / or along a tapered surface. The substrate may be a layer, and may include one or more layers. For example, the interconnect layer may include one or more conductor and contact layers (forming contacts, interconnects, and / or vias therein) and one or more dielectric layers.

[0055] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0056] In related technologies, an organic insulating film layer 2' is generally disposed within the display area 110' of the display panel 10' to support the light-emitting element and provide a certain degree of insulation between the light-emitting element and the substrate 1'. To prevent corrosion from water, oxygen, etc., a certain gap is generally formed between the aforementioned organic insulating film layer 2' and the barrier 3' located in the non-display area 120', creating a groove 4'. In subsequent processes, the encapsulation layer 5' can fill the groove 4' to effectively encapsulate the display area 110' of the display panel 10'. Please refer to [link to relevant documentation]. Figure 1 .

[0057] With technological advancements, the requirements for the bezel portion of display panels have become increasingly stringent. Current research and development focuses on narrowing the bezel width (i.e., the non-display area 120'), pursuing a narrow bezel design. To achieve this, it's generally necessary to directly compress the width of the groove 4' mentioned earlier, which mates with the encapsulation layer 5'. However, this can negatively impact other aspects of the display panel's performance, such as reducing its encapsulation effectiveness. If encapsulation material overflows or is insufficiently filled, encapsulation or even panel failure can easily occur.

[0058] Based on this, embodiments of this application provide a display panel 10 and a display device 100 to at least alleviate or improve the above-mentioned technical problems to a certain extent.

[0059] This application provides a display panel 10, which includes a display area 110 and a non-display area 120, wherein at least a portion of the non-display area 120 is disposed around the display area 110. Of course, when the display panel 10 is a punch-hole panel, the punch-hole area is also a non-display area 120, and the display area 110 is disposed around a portion of the non-display area 120.

[0060] For example, please refer to Figure 2 The structure of the display panel 10 will be further explained below, taking the non-display area 120 as the border area surrounding the display area 110 as an example.

[0061] Specifically, the display panel 10 includes a substrate 1, an organic insulating layer 2, and a barrier 3. The organic insulating layer 2 is located on one side of the substrate 1 and in the display area 110. The organic insulating layer 2 has a stacked structure, including a first organic insulating layer 21 and a second organic insulating layer 22 stacked together. The second organic insulating layer 22 is located on the side of the first organic insulating layer 21 facing away from the substrate 1. The barrier 3 is located on one side of the substrate 1 and in the non-display area 120. The barrier 3 is at least partially surrounding the display area 110. The end of the first organic insulating layer 21 near the barrier 3 and the surface of the barrier 3 facing the display area 110 form a first through groove 4.

[0062] Please see Figure 3 The outer contour of the orthographic projection of the second organic insulating layer 22 on the substrate 1 lies within the outer contour of the orthographic projection of the first organic insulating layer 21 on the substrate 1. Therefore, the surface portion of the first organic insulating layer 21 facing away from the substrate 1 is partially covered by the second organic insulating layer 22, while a portion is exposed relative to the second organic insulating layer 22. At least a portion of the surface of the first organic insulating layer 21 exposed relative to the second organic insulating layer 22 is closer to the barrier wall 3 than the unexposed area.

[0063] In this embodiment, the outer contour refers to the projection of the outer peripheral edge of the film layer onto the substrate. The outer contour of the orthographic projection of the second organic insulating layer 22 on the substrate 1 is located within the outer contour of the orthographic projection of the first organic insulating layer 21 on the substrate 1, meaning that the outer contour of the orthographic projection of the second organic insulating layer 22 on the substrate 1 falls within the closed pattern area enclosed by the outer contour of the orthographic projection of the first organic insulating layer 21 on the substrate 1.

[0064] The portion of the surface of the first organic insulating layer 21 facing away from the substrate 1 that is exposed relative to the second organic insulating layer 22 can mate with the first through groove 4 and be used to support and accommodate the encapsulation material in subsequent processes.

[0065] Please see Figure 3 Along the direction parallel to the plane where the substrate 1 is located, the maximum width of the first through groove 4 is the first width, and the minimum distance between the end of the second organic insulating layer 22 pointing to the baffle 3 and the side surface of the baffle 3 facing the display area 110 is the second width. The first width is less than the second width and the first width is less than 20μm.

[0066] It should be noted that the first width and the second width mentioned above both correspond to the same area of ​​the retaining wall 3. With the retaining wall 3 surrounding the display area 110, a first groove 4 exists between the section of the first organic insulating layer 21 pointing towards the retaining wall 3 and the surface of the retaining wall 3 facing the display area 110, and the maximum width of the first groove 4 is the first width; correspondingly, the minimum distance between the second organic insulating layers 22 pointing towards the same surface of the retaining wall 3 is the second width. Please refer to [link to relevant documentation]. Figure 2 and Figure 3 .

[0067] Since the first width is always smaller than the second width, along the extension direction of the retaining wall 3, the outer contour of the second organic insulating layer 22 near the end of the retaining wall 3 is always located inside the outer contour of the first organic insulating layer 21.

[0068] Understandably, the space formed between the organic insulating layer 2 and the barrier 3 is used to accommodate encapsulation materials in subsequent processes to achieve effective encapsulation of the display area 110.

[0069] Without changing the spatial dimensions of the encapsulation material formed by the relevant film layers, the smaller the size of the first groove 4 formed between the first organic insulating layer 21 and the barrier 3, i.e., the smaller the first width, the smaller the width of the bezel area of ​​the display panel 10, which manifests as a narrowing of the width of the non-display area 120. At this time, the area ratio of the display area 110 on the display panel 10 increases, resulting in a better visual and display effect for the display panel 10.

[0070] By adjusting the distribution range of the second organic insulating layer 22, the first width (i.e., the maximum width of the first through slot 4) can be reduced while ensuring that the second width is always greater than the first width. This allows for the improvement of the display effect and visual effect of the display panel 10 by adjusting the width of the first through slot 4 to be less than 20μm without changing the arrangement position of the retaining wall 3.

[0071] It should be noted that in this embodiment, the area corresponding to the first slot 4 belongs to the non-display area 120.

[0072] In some embodiments, the absolute value of the difference between the first width and the second width can be set to be greater than 5 μm.

[0073] Since the first width is always smaller than the second width, the absolute value of the difference between the first width and the second width can be increased to be greater than 5μm. At this time, relative to the outer edge of the first organic insulating layer 21 pointing towards the barrier 3, the second organic insulating layer 22 pointing towards the barrier 3 is moderately moved inward toward the center of the display area 110. This ensures that the size of the space used to accommodate the encapsulation material is not reduced, and may even be increased to a certain extent. This improves the impact of narrowing the width of the non-display area 120 on the encapsulation process and encapsulation effect, thereby improving the display effect of the display panel 10 and also enhancing its reliability and performance.

[0074] By adjusting the direction of the second organic insulating layer 22 pointing towards the baffle 3 relative to the direction of the first organic insulating layer 21 pointing towards the baffle 3, the maximum width of the first through slot 4 can be reduced without shrinking the aforementioned space. Ultimately, without changing the arrangement of the baffle 3, i.e., without changing the size of the display panel 10, it helps to reduce the bezel width of the display area 110, thereby improving the display effect and visual appeal of the display panel 10.

[0075] Specifically, the first width of the first through slot 4 can be reduced while the second width is increased.

[0076] Please see Figure 3 After the second organic insulating layer 22 is moved inward relative to the barrier 3 toward the center of the display area 110, the width of the non-display area 120 can be narrowed by reducing the first width.

[0077] Considering that the display area 110 has the function of emitting light when powered on, in order to ensure the normal operation of the display area 110 and to avoid the second organic insulating layer 22 moving inward from affecting the light-emitting function of the display area 110, it is necessary to limit it.

[0078] The display panel 10 also includes a light-emitting functional layer 8, which is located on the side of the organic insulating layer 2 facing away from the substrate 1. An encapsulation material covers the surface of the light-emitting functional layer 8 facing away from the substrate 1 to encapsulate the light-emitting functional layer 8 and prevent water and oxygen from corroding the light-emitting functional layer 8.

[0079] Simultaneously, the display panel 10 also includes a driving circuit layer 9 connected to the light-emitting functional layer 8 and used to control the signal conduction of the light-emitting functional layer 8. The driving circuit layer 9 is located on the side of the second organic insulating layer 22 opposite to the light-emitting functional layer 8, and the outer contour of the orthographic projection of the driving circuit layer 9 on the substrate 1 lies within the outer contour of the orthographic projection of the second organic insulating layer 22 on the substrate 1. (See [link to relevant documentation]). Figure 4 .

[0080] In some embodiments, the driving circuit layer 9 may be located between the second organic insulating layer 22 and the substrate 1, or the driving circuit layer 9 may be further located between the second organic insulating layer 22 and the first organic insulating layer 21.

[0081] When the second organic insulating layer 22 moves inward toward the center of the display area 110 relative to the barrier wall 3, it is necessary to ensure that the second organic insulating layer 22 always covers the driving circuit layer 9 and that the driving circuit layer 9 and the light-emitting functional layer 8 do not become conductive on the side of the second organic insulating layer 22 pointing toward the barrier wall 3, so as not to affect the normal operation of the driving circuit layer 9 and the light-emitting functional layer 8.

[0082] In some embodiments, the light-emitting functional layer 8 includes an anode layer 81, which is attached to the side surface of the second organic insulating layer 22 facing away from the substrate 1.

[0083] The anode layer 81 covers the side surface of the second organic insulating layer 22 facing away from the substrate 1 and the side surface of the second organic insulating layer 22 pointing towards the barrier 3. At this time, the second organic insulating layer 22 serves to block the anode layer 81 and the drive circuit layer 9. (See [link to relevant documentation]). Figure 4 The second organic insulating layer 22 is made of insulating material. Of course, the light-emitting functional layer 8, in addition to the anode layer 81, also includes a cathode layer and a light-emitting material layer, which will not be described in detail here.

[0084] For example, the aforementioned driving circuit layer 9 may include a gate on array (GOA) circuit of a thin-film transistor, or a dimming circuit (Emission circuit, EM) for controlling the emission time of the light-emitting functional layer 8. The specific structure, function, and conduction position and conduction method of the aforementioned circuit have been disclosed in related technologies and will not be repeated here.

[0085] Under the premise that the distribution range and distribution area of ​​the driving circuit layer 9 remain unchanged, the maximum value of the distribution range and the second width of the second organic insulating layer 22 can be limited by this range, that is, to ensure that the orthogonal projection of the driving circuit layer 9 on the substrate 1 is always within the orthogonal projection range of the second organic insulating layer 22 on the substrate 1, so as to limit the maximum range of the second organic insulating layer 22 end relative to the barrier 3 towards the center of the display area 110.

[0086] Please see Figure 3 The absolute value of the difference between the first width and the second width is greater than 5μm.

[0087] Specifically, the first width is less than 20μm, and the second width is greater than 25μm.

[0088] In some embodiments, the first width may be limited to not less than 5 μm.

[0089] Specifically, the first width ranges from 5μm to 19μm.

[0090] For example, the first width dimension can be any value from parameters such as 5μm, 7μm, 9μm, 11μm, 13μm, 15μm, 17μm, 19μm, or other values ​​not listed but falling within this range. The specific numerical range can be adaptively adjusted according to actual design requirements.

[0091] In other embodiments, the second width may be limited to no more than 55 μm.

[0092] For example, the second width can be any value from parameters such as 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, 55μm, or other values ​​not listed but within this range. The specific numerical range can be adjusted adaptively according to actual design requirements.

[0093] In some embodiments, the material of the second organic insulating layer 22 includes an organic material, and / or the material of the first organic insulating layer 21 includes an organic material.

[0094] Of course, other film structures may exist between the second organic insulating layer 22 and the first organic insulating layer 21. These other film structures formed between the first organic insulating layer 21 and the second organic insulating layer 22 may be film structures including at least one of inorganic materials and metallic materials. Their structure and uses have been disclosed in related technologies and will not be described in detail here.

[0095] Please see Figure 4 , Figure 4 The first organic insulating layer 21 and the second organic insulating layer 22 are shown as single-layer structures for illustrative purposes only. In actual fabrication, the first organic insulating layer 21 is a stacked structure made of different materials, and the second organic insulating layer 22 can be a single-layer structure or a stacked structure.

[0096] Please see Figure 3 and Figure 4 In some embodiments, the organic insulating layer 2 further includes a third organic insulating layer 24.

[0097] The third organic insulating layer 24 is located on the side of the first organic insulating layer 21 that is away from the second organic insulating layer 22, and the first organic insulating layer 21 covers the surface of the third organic insulating layer 24 that is away from the substrate 1.

[0098] In actual preparation, the distribution range of the third organic insulating layer 24 is slightly smaller than that of the first organic insulating layer 21. Therefore, the side of the third organic insulating layer 24 pointing towards the barrier wall 3 is covered by the first organic insulating layer 21.

[0099] Specifically, the first organic insulating layer 21 covers the surface of the third organic insulating layer 24 pointing to one end of the side wall of the retaining wall 3.

[0100] In this embodiment, the material of the third organic insulating layer 24 includes organic materials. Figure 3 and Figure 4 The single-layer third organic insulating layer 24 shown is for illustrative purposes only. In actual fabrication, the third organic insulating layer 24 is a stacked structure made of different materials.

[0101] Similarly, other film structures may exist between the third organic insulating layer 24 and the first organic insulating layer 21. These other film structures formed between the first organic insulating layer 21 and the third organic insulating layer 24 may be film structures including at least one of inorganic materials and metallic materials. Their structure and uses have been disclosed in related technologies and will not be described in detail here.

[0102] In some embodiments, the display panel 10 includes a first encapsulation layer 5, which is disposed on the side of the barrier 3 facing the display area 110 and covers the first through slot 4.

[0103] Please see Figure 3 The first encapsulation layer 5 can not only cover the first through groove 4 formed between the first organic insulating layer 21 and the barrier 3, but also cover the area exposed on the side of the first organic insulating layer 21 facing away from the substrate 1 relative to the second organic insulating layer 22.

[0104] Specifically, the first encapsulation layer 5 covers the side surface of the light-emitting functional layer 8 facing away from the substrate 1 to achieve encapsulation of the light-emitting functional layer 8.

[0105] For example, the total amount of encapsulation material constituting the first encapsulation layer 5 is 134 μm. 3 The first width is 5μm, and the second width is 55μm. When the structures such as the second organic insulating layer 22 and the barrier 3 remain unchanged, reducing only the first width will cause some of the encapsulation material constituting the first encapsulation layer 5 to overflow relative to the barrier 3. At this time, without changing the structure of the barrier 3 or the total amount of encapsulation material constituting the first encapsulation layer 5, increasing the second width allows the excess encapsulation material to fill the space formed by the second organic insulating layer 22, the first organic insulating layer 21, and the barrier 3, thereby overcoming the problem of encapsulation material overflow.

[0106] Specifically, the orthographic projection of the organic insulating layer 2 on the substrate 1 is located within the orthographic projection of the first encapsulation layer 5 on the substrate 1.

[0107] To further improve the encapsulation effect of the first encapsulation layer 5, in some embodiments, the material used for the first encapsulation layer 5 includes organic materials.

[0108] For example, the first encapsulation layer 5 can be prepared by inkjet printing (IJP) technology. The first encapsulation layer 5 prepared by IJP can achieve uniform film spreading and has good leveling performance. It can effectively cover and fill the complex film morphology with unevenness formed by the inward retreat of the first organic insulating layer 21 and the second organic insulating layer 22, improve the flatness of the surface of the display panel 10, and help improve the encapsulation effect and reliability of the display panel 10.

[0109] Please see Figure 3 The display panel 10 also includes a second encapsulation layer 6 and a third encapsulation layer 7, with the first encapsulation layer 5 located between the second encapsulation layer 6 and the third encapsulation layer 7.

[0110] Specifically, the second encapsulation layer 6 is located on the side of the first encapsulation layer 5 facing the substrate 1.

[0111] The second encapsulation layer 6 extends from the display area 110 to the non-display area 120, and the orthographic projection of the second encapsulation layer 6 on the substrate 1 covers the orthographic projection of the first encapsulation layer 5 on the substrate 1 and the orthographic projection of the barrier 3 on the substrate 1.

[0112] The second encapsulation layer 6 also covers the first through-groove 4. The first encapsulation layer 5 is located on the side of the second encapsulation layer 6 facing away from the substrate 1 and fills the first through-groove 4.

[0113] In some embodiments, the material of the second encapsulation layer 6 includes inorganic materials.

[0114] In some embodiments, the second encapsulation layer 6 can be prepared by chemical vapor deposition (CVD).

[0115] The second encapsulation layer 6 prepared by chemical vapor deposition has good adhesion and step coverage, and can better cover the film surface with complex morphology, so as to ensure that the surface of the prepared display panel 10 can be uniformly encapsulated and protected.

[0116] In addition, the films prepared by chemical vapor deposition have the advantages of relatively uniform thickness and good density, which can effectively block the intrusion of external water vapor, oxygen, impurities, etc., and help improve the stability and reliability of the device.

[0117] After covering the surface of the first through-groove 4, organic insulating layer 2 and barrier 3 facing away from the substrate 1 with the second encapsulation layer 6, the first encapsulation layer 5 is prepared on the surface of the second encapsulation layer 6 facing away from the substrate 1 to fill and cover the surface of the second encapsulation layer 6, thereby achieving a better encapsulation effect.

[0118] The third encapsulation layer 7 is located on the side of the first encapsulation layer 5 facing away from the substrate 1, and also extends from the display area 110 to the non-display area 120. The orthographic projection of the third encapsulation layer 7 on the substrate 1 covers the orthographic projection of the first encapsulation layer 5 on the substrate 1 and the orthographic projection of the barrier 3 on the substrate 1.

[0119] The distribution range of the third encapsulation layer 7 on the display panel 10 is substantially the same as the distribution range of the second encapsulation layer 6. In some embodiments, the orthographic projection of the third encapsulation layer 7 on the substrate 1 covers the orthographic projection of the second encapsulation layer 6 on the substrate 1, or the orthographic projection of the third encapsulation layer 7 on the substrate 1 exactly coincides with the orthographic projection of the second encapsulation layer 6 on the substrate 1, or the orthographic projection of the third encapsulation layer 7 on the substrate 1 at least partially coincides with the orthographic projection of the second encapsulation layer 6 on the substrate 1.

[0120] Please see Figure 3 Above the side surface of the barrier 3 facing away from the substrate 1, the side surface of the second encapsulation layer 6 facing away from the substrate 1 is in contact with the side surface of the third encapsulation layer 7 facing the substrate 1.

[0121] To further enhance the diversity of the preparation of the space used to accommodate the encapsulation material, in some embodiments, the second organic insulating layer 22 is provided with a second through groove 2201.

[0122] Please see Figure 5 The second through groove 2201 is a through structure that penetrates the second organic insulating layer 22 along the thickness direction of the substrate 1, and the orthographic projection of the second through groove 2201 on the substrate 1 is located within the outer contour of the orthographic projection of the second organic insulating layer 22 on the substrate 1.

[0123] In other similar embodiments, the second through-groove 2201 can also be configured as an opening structure extending along the thickness direction of the substrate 1 from the side surface of the second organic insulating layer 22 facing away from the substrate towards the side surface closer to the substrate 1. This opening structure can be a non-through structure. In this case, the thickness of the second organic insulating layer 22 located in the orthogonal projection area of ​​the second through-groove 2201 on the substrate 1 is reduced to a certain extent compared to the second organic insulating layer located in other areas.

[0124] In some embodiments, the number of second through slots 2201 is at least one; in other embodiments, the number of second through slots 2201 may be two or more. When the number of second through slots 2201 is at least two, the orthogonal projections of the plurality of second through slots 2201 on the substrate 1 are arranged at intervals.

[0125] The second through-groove 2201 can be obtained by patterning the second organic insulating layer 22.

[0126] For example, the second organic insulating layer 22 can be patterned by photolithography or other similar methods to prepare the second through-groove 2201 on the second organic insulating layer 22.

[0127] Taking the second through-groove 2201 penetrating the second organic insulating layer 22 as an example, the second through-groove 2201 can include regularly or irregularly distributed dot-shaped grooves, strip-shaped grooves, block-shaped grooves, etc., or it can be annular grooves nested in sequence. The various through-grooves cooperate with each other, which can improve the fluidity of the encapsulation material constituting the first encapsulation layer 5 within a certain range, thereby helping to improve its leveling effect and thus improving the flatness of the surface of the first encapsulation layer 5 facing away from the substrate 1. In addition, due to the enhanced fluidity of the encapsulation material, this structural design can also improve the fabrication efficiency of the first encapsulation layer 5 to a certain extent.

[0128] The above-described patterning process can adjust the second width formed between the second organic insulating layer 22 and the barrier 3. Please refer to [link / reference]. Figure 5 At this time, the end of the second organic insulating layer 22 near the barrier wall 3 is moved inward relative to the first organic insulating layer 21 toward the center of the display area 110.

[0129] In other similar embodiments, the above-described patterning process can also be configured to etch only the non-edge regions of the second organic insulating layer 22, in which case the dimension of the second width formed between the second organic insulating layer 22 and the barrier 3 remains unchanged. Please refer to... Figure 6 The size (i.e. the second width) of the second organic insulating layer 22 facing the retaining wall 3 in the organic insulating layer 2 has not changed (at this time, the absolute value of the difference between the first width and the second width can be equal to or less than 5μm).

[0130] Based on the same inventive concept, this application also provides a display device 100, including the display panel 10 described in any of the above claims. Please refer to [link to relevant documentation]. Figure 7 .

[0131] For details regarding the specific structure of the display panel 10, please refer to the specific description in the foregoing embodiments, which will not be repeated here.

[0132] The display device 100 provided in this embodiment can be a mobile phone, laptop, tablet computer, smartwatch, smart bracelet, navigator, monitor, personal digital assistant (PDA), or other products or components with display functions.

[0133] Since the display device 100 has the aforementioned display panel 10, the display device 100 has at least the beneficial effects of any one or more of the aforementioned display panels 10. The specific effects are as described above and will not be repeated here.

[0134] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized by, The display panel (10) includes a display area (110) and a non-display area (120), the non-display area (120) at least partially surrounding the display area (110), and the display panel (10) further includes: Substrate (1); An organic insulating layer (2) is located on one side of the substrate (1) and in the display area (110). The organic insulating layer (2) includes a first organic insulating layer (21) and a second organic insulating layer (22). The second organic insulating layer (22) is located on the side of the first organic insulating layer (21) facing away from the substrate (1). A barrier (3) is located on one side of the substrate (1) and in the non-display area (120). At least a portion of the barrier (3) is arranged around the display area (110). The first organic insulating layer (21) near the end of the barrier (3) forms a first through groove (4) between the end of the barrier (3) and the surface of the barrier (3) facing the display area (110). Wherein, along the direction parallel to the plane where the substrate (1) is located, the maximum width of the first through groove (4) is the first width, the minimum distance between the end of the second organic insulating layer (22) near the barrier (3) and the side surface of the barrier (3) facing the display area (110) is the second width, the first width is less than the second width and the first width is less than 20μm.

2. The display panel according to claim 1, characterized in that, The outer contour of the second organic insulating layer (22) projected onto the substrate (1) is located within the outer contour of the first organic insulating layer (21) projected onto the substrate (1).

3. The display panel according to claim 1, characterized in that, The absolute value of the difference between the first width and the second width is greater than 5 μm.

4. The display panel according to claim 1, characterized in that, At least one of the following conditions must be met: The second width is greater than 25 μm; The first width is not less than 5μm; The second width is no greater than 55 μm.

5. The display panel according to claim 1, characterized in that, The organic insulating layer (2) further includes a third organic insulating layer (24), which is located on the side of the first organic insulating layer (21) facing away from the second organic insulating layer (22), and the first organic insulating layer (21) covers the surface of the third organic insulating layer (24) facing away from the substrate (1).

6. The display panel according to claim 5, characterized in that, The first organic insulating layer (21) covers the surface of the side wall of the third organic insulating layer (24) pointing towards the retaining wall (3).

7. The display panel according to any one of claims 1-6, characterized in that, The second organic insulating layer (22) is provided with a second through groove (2201).

8. The display panel according to claim 7, characterized in that, The number of the second through slot (2201) is at least two.

9. The display panel according to claim 1, characterized in that, The display panel (10) further includes a first encapsulation layer (5), which is disposed on the side of the barrier (3) facing the display area (110) and covers the first through slot (4).

10. The display panel according to claim 9, characterized in that, The orthographic projection of the organic insulating layer (2) on the substrate (1) lies within the orthographic projection of the first encapsulation layer (5) on the substrate (1).

11. The display panel according to claim 9 or 10, characterized in that, The display panel (10) further includes a second encapsulation layer (6), which is located on the side of the first encapsulation layer (5) facing the substrate (1); The second encapsulation layer (6) extends from the display area (110) to the non-display area (120), and the orthographic projection of the second encapsulation layer (6) on the substrate (1) covers the orthographic projection of the first encapsulation layer (5) on the substrate (1) and the orthographic projection of the barrier (3) on the substrate (1).

12. The display panel according to claim 11, characterized in that, The display panel (10) further includes a third encapsulation layer (7), which is located on the side of the first encapsulation layer (5) facing away from the substrate (1); The third encapsulation layer (7) extends from the display area (110) to the non-display area (120), and the orthographic projection of the third encapsulation layer (7) on the substrate (1) covers the orthographic projection of the first encapsulation layer (5) on the substrate (1) and the orthographic projection of the barrier (3) on the substrate (1).

13. The display panel according to claim 12, characterized in that, The orthographic projection of the third encapsulation layer (7) on the substrate (1) overlaps the orthographic projection of the second encapsulation layer (6) on the substrate (1).

14. The display panel according to claim 9, characterized in that, The display panel (10) further includes a light-emitting functional layer (8), which is located on the side of the organic insulating layer (2) facing away from the substrate (1), and the first encapsulation layer (5) covers the surface of the light-emitting functional layer (8) facing away from the substrate (1).

15. The display panel according to claim 14, characterized in that, Along the thickness direction of the substrate (1), a driving circuit layer (9) is provided between the second organic insulating layer (22) and the substrate (1), and the outer contour of the orthographic projection of the driving circuit layer (9) on the substrate (1) is located within the outer contour of the orthographic projection of the second organic insulating layer (22) on the substrate (1).

16. The display panel according to claim 15, characterized in that, The light-emitting functional layer (8) includes an anode layer (81) that covers the side of the second organic insulating layer (22) facing away from the substrate (1).

17. A display device, characterized in that, The display panel (10) includes any one of claims 1-16.

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