Preparation equipment of liquid epoxy resin for semiconductor plastic package

Abstract

The invention discloses preparation equipment of liquid epoxy resin for semiconductor plastic packaging. The preparation equipment comprises a reaction kettle; the cover body is arranged at the top of the reaction kettle; the feeding hole is formed in one side, close to the top, of the reaction kettle; the discharge hole is formed in one side, close to the bottom, of the reaction kettle; the storage structure is arranged at the top of the cover body; the storage structure comprises a storage cylinder and an auxiliary circular plate, the storage cylinder is fixedly connected to the top of the cover body, under the cooperation of the storage structure and the stirring structure, the stirring structure can be stored in the storage cylinder in the storage structure, and meanwhile, a stirring rod on the stirring structure can be unfolded during stirring, so that the stirring effect is improved; the stirring structure is arranged in the reaction kettle and contracts during storage, so that the stirring structure can be cooperatively stored in the storage structure, the stirring structure does not make contact with a solution in the reaction kettle when not in use, accelerated corrosion is avoided, and meanwhile the temperature of the solution is not affected.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid epoxy resin preparation equipment, and specifically provides a preparation equipment for liquid epoxy resin used in semiconductor encapsulation. Background Art

[0002] Liquid epoxy resin is a stable dispersion system formed by dispersing in water in the form of fine particles or droplets. Liquid epoxy resin is a low-molecular-weight epoxy resin with various uses and characteristics. Liquid epoxy resin is often used to reduce the viscosity of coatings and has wide applications in fields such as coatings, adhesives, and electronic materials.

[0003] Considering that in the semiconductor encapsulation process, after the semiconductor is produced, it needs to be encapsulated with a plastic material to protect its internal structure and circuits. During the encapsulation process, liquid epoxy resin is usually injected into a mold, and after the liquid epoxy resin cures, a hard shell is formed outside the semiconductor. Therefore, some preparation equipment for liquid epoxy resin with special structures and functions can be applied.

[0004] Generally, the traditional method for preparing liquid epoxy resin is to prepare it from bisphenol A and epichlorohydrin in a sodium hydroxide solution. Structures such as a reaction kettle and a stirring rod are required in this process. However, the existing stirring rods are generally directly installed inside the reaction kettle and thus come into contact with all the reaction raw materials for a long time. And the stirring rods are immersed in the mixed solution of the reaction kettle for a long time, which is very easy to accelerate corrosion, thereby contaminating the inside of the mixed raw materials. At the same time, the stirring structure generally has a large size, occupies more space in the reaction kettle, affects the temperature control during the actual solution reaction process, and increases energy consumption.

[0005] In summary, it is necessary to propose a preparation equipment for liquid epoxy resin used in semiconductor encapsulation to solve the above problems. Summary of the Invention

[0006] The purpose of the present invention is to provide a preparation equipment for liquid epoxy resin used in semiconductor encapsulation to solve the problems raised in the above background art.

[0007] To achieve the above purpose, the present invention provides the following technical solutions:

[0008] A preparation device for liquid epoxy resin used in semiconductor plastic encapsulation, comprising: a reaction kettle; a cover body, which is arranged on the top of the reaction kettle; a feed inlet, which is arranged near the top on one side of the reaction kettle; a discharge outlet, which is arranged near the bottom on one side of the reaction kettle; a storage structure, which is arranged on the top of the cover body; the storage structure includes a storage cylinder and an auxiliary circular plate, the storage cylinder is fixedly connected to the top of the cover body, a first sealing circular block is fixedly connected to the top of the auxiliary circular plate, an annular plate is fixedly connected to the top of the storage cylinder, and an arc-shaped chamfered connecting circular hole is formed in the inner wall of the cover body; a stirring structure, which is arranged at the bottom of the auxiliary circular plate, the stirring structure includes a stirring rod, and stirring convex rods are fixedly connected to the inner wall of the stirring rod; a cleaning structure, which is arranged on one side of the cover body and the storage cylinder, the cleaning structure includes a water tank and an annular water pipe, and the annular water pipe is communicated with the inside of the storage cylinder through a branch pipe; a connecting structure, which is used to connect the cover body and the reaction kettle.

[0009] Preferably, the storage structure further includes mounting plates symmetrically and fixedly connected to both sides of the storage cylinder. A first motor is fixedly connected to the bottom of the outer surface of one of the mounting plates, a first screw rod is fixedly connected to the output end of the first motor, a threaded hole block is threadedly connected to the outer surface of the first screw rod, a limiting rod is fixedly connected to the top of the outer surface of the other mounting plate, a limiting slider is slidably connected to the outer surface of the limiting rod, and a connecting arc rod is fixedly connected between the threaded hole block and the limiting slider.

[0010] Preferably, a rectangular connecting block is fixedly connected to the outer surface of the connecting arc rod, a circular connecting rod is fixedly connected to the top of the outer surface of the rectangular connecting block, an auxiliary connecting block is fixedly connected to the top end of the outer surface of the circular connecting rod, a cover plate is fixedly connected to the outer surface of the auxiliary connecting block, and a second sealing circular block is fixedly connected to the bottom of the outer surface of the cover plate.

[0011] Preferably, a second motor is fixedly connected to the top of the outer surface of the cover plate, a transmission rod is fixedly connected to the output end of the second motor, the bottom end of the transmission rod is fixedly connected to the top of the auxiliary circular plate, and the outer surface of the transmission rod is fixedly connected to the inner wall of the first sealing circular block.

[0012] Preferably, the stirring structure further includes a connecting rotating rod fixedly connected to the bottom of the auxiliary circular plate, a connecting block is fixedly connected to the outer surface of the connecting rotating rod, U-shaped plates are symmetrically and fixedly connected to the outer surface of the connecting block, and an auxiliary rotating rod is rotatably connected between the two sides of the inner wall of the U-shaped plate.

[0013] Preferably, an auxiliary rotating block is fixedly connected to the outer surface of the auxiliary rotating rod, the outer surface of the auxiliary rotating block is fixedly connected to the stirring rod, a torsion spring is sleeved on the outer surface of the auxiliary rotating rod, and two ends of the torsion spring are respectively fixedly connected to the auxiliary rotating block and the U-shaped plate.

[0014] Preferably, a connecting circular block is fixedly connected to the bottom end of the outer surface of the auxiliary rotating rod, an auxiliary connecting rod is fixedly connected to the outer surface of the connecting circular block, one end of the auxiliary connecting rod is fixedly connected to an annular brush plate, and bristles are fixedly connected to the outer surface of the annular brush plate.

[0015] Preferably, the cleaning structure further includes an auxiliary plate fixedly connected to the cover body, a water tank is fixedly connected to the top of the outer surface of the auxiliary plate, a water pump is fixedly installed on the top of the outer surface of the water tank, the water inlet and the water outlet of the water pump are respectively communicated with a water inlet pipe and a water outlet pipe, a U-shaped water pipe is fixedly installed on the outer surface of the annular water pipe, the U-shaped water pipe is fixedly installed with the water outlet pipe, and the water inlet pipe is fixedly installed with the water tank.

[0016] Preferably, a second screw rod is fixedly connected to the bottom of the outer surface of the auxiliary plate, a screw hole cylinder is threadedly connected to the outer surface of the second screw rod, a bottom plate is fixedly connected to the bottom of the outer surface of the screw hole cylinder, an operation ring is fixedly connected to the outer surface of the screw hole cylinder, and a rectangular convex plate is fixedly connected to the outer surface of the operation ring.

[0017] Preferably, the connecting structure further includes a second ring plate fixedly connected to the top of the outer surface of the reaction kettle, a first ring plate is fixedly connected to the bottom of the outer surface of the cover body, a first screw hole is formed in the inner wall of the first ring plate, a second screw hole is formed in the inner wall of the second ring plate, and a threaded clamping rod is threadedly connected to the inner walls of the first screw hole and the second screw hole.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: With the cooperation of the storage structure and the stirring structure, the stirring structure can be stored inside the storage cylinder of the storage structure. At the same time, the stirring rod on the stirring structure can be unfolded during stirring and contracted during storage, and then can be cooperatively stored inside the storage structure, so that when the stirring structure is not in use, it can be not in contact with the solution inside the reaction kettle, thereby avoiding accelerated corrosion and not affecting the temperature of the solution, and avoiding increased energy consumption. Under the action of the cleaning structure, the inner wall of the storage cylinder and the stirring structure stored inside the storage cylinder can be cleaned. Under the action of the connecting structure, the cover plate and the reaction kettle can be disassembled and assembled. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram showing the overall structure of the preparation equipment for liquid epoxy resin used in semiconductor encapsulation;

[0020] Figure 2Cross-sectional view showing a preparation device for liquid epoxy resin used in semiconductor encapsulation;

[0021] Figure 3 Schematic structural diagram at the cover of the preparation device for liquid epoxy resin used in semiconductor encapsulation;

[0022] Figure 4 Schematic structural diagram at the auxiliary plate of the preparation device for liquid epoxy resin used in semiconductor encapsulation;

[0023] Figure 5 Schematic structural diagram at the transmission part of the preparation device for liquid epoxy resin used in semiconductor encapsulation;

[0024] Figure 6 Schematic diagram showing the preparation device for liquid epoxy resin used in semiconductor encapsulation Figure 5 Enlarged view at position A in;

[0025] Figure 7 Schematic structural diagram at the cover plate of the preparation device for liquid epoxy resin used in semiconductor encapsulation;

[0026] Figure 8 Schematic diagram at the stirring rod of the preparation device for liquid epoxy resin used in semiconductor encapsulation;

[0027] Figure 9 Schematic diagram showing the preparation device for liquid epoxy resin used in semiconductor encapsulation Figure 8 Enlarged view at position B in;

[0028] Figure 10 Schematic structural diagram at the water tank of the preparation device for liquid epoxy resin used in semiconductor encapsulation;

[0029] Figure 11 Schematic structural diagram at the reaction kettle of the preparation device for liquid epoxy resin used in semiconductor encapsulation.

[0030] In the figure:

[0031] 1. Reaction kettle; 2. Cover body; 3. Feed inlet; 4. Discharge outlet;

[0032] 5. Storage structure; 51. Storage cylinder; 52. Connecting round hole; 53. Annular plate; 54. Mounting plate; 55. First motor; 56. First screw; 57. Screw hole block; 58. Limiting rod; 59. Limiting slider; 510. Connecting arc rod; 511. Rectangular connecting block; 512. Circular connecting rod; 513. Auxiliary connecting block; 514. Cover plate; 515. Second motor; 516. Transmission rod; 517. Auxiliary circular plate; 518. First sealing circular block; 519. Second sealing circular block;

[0033] 6. Stirring structure; 61. Connecting rotating rod; 62. Connecting block; 63. U-shaped plate; 64. Auxiliary rotating rod; 65. Auxiliary rotating block; 66. Torsion spring; 67. Stirring rod; 68. Stirring convex rod; 69. Connecting round block; 610. Auxiliary connecting rod; 611. Annular brush plate;

[0034] 7. Cleaning structure; 71. Annular water pipe; 72. U-shaped water pipe; 73. Auxiliary plate; 74. Water tank; 75. Water pump; 76. Water inlet pipe; 77. Water outlet pipe; 78. Second screw rod; 79. Screw hole cylinder; 710. Bottom plate; 711. Operation ring; 712. Rectangular convex plate;

[0035] 8. Connecting structure; 81. First ring plate; 82. First screw hole; 83. Second ring plate; 84. Second screw hole; 85. Threaded clamping rod. Detailed implementation manners

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0037] Please refer to Figures 1 to 11 , the present invention provides a technical solution:

[0038] A preparation device for liquid epoxy resin used in semiconductor encapsulation, comprising: a reaction kettle 1; a cover body 2, the cover body 2 is arranged on the top of the reaction kettle 1; a feed inlet 3, the feed inlet 3 is arranged at a position near the top on one side of the reaction kettle 1; a discharge outlet 4, the discharge outlet 4 is arranged at a position near the bottom on one side of the reaction kettle 1; a storage structure 5, the storage structure 5 is arranged on the top of the cover body 2; the storage structure 5 includes a storage cylinder 51 and an auxiliary circular plate 517, the storage cylinder 51 is fixedly connected to the top of the cover body 2, the top of the auxiliary circular plate 517 is fixedly connected with a first sealing circular block 518, the top of the storage cylinder 51 is fixedly connected with an annular plate 53, and an inner wall of the cover body 2 is provided with a connecting round hole 52, and the connecting round hole 52 is in an arc chamfer shape; a stirring structure 6, the stirring structure 6 is arranged at the bottom of the auxiliary circular plate 517, and the stirring structure 6 includes a stirring rod 67, and a stirring convex rod 68 is fixedly connected to an inner wall of the stirring rod 67; a cleaning structure 7, the cleaning structure 7 is arranged on one side of the cover body 2 and the storage cylinder 51, and the cleaning structure 7 includes a water tank 74 and an annular water pipe 71, and the annular water pipe 71 is communicated with the inside of the storage cylinder 51 through a branch pipe; a connecting structure 8, the connecting structure 8 is used for connecting the cover body 2 and the reaction kettle 1;

[0039] With the cooperation of the storage structure 5 and the stirring structure 6, the stirring structure 6 can be stored inside the storage cylinder 51 within the storage structure 5. At the same time, the stirring rod 67 on the stirring structure 6 can be extended during stirring and contracted during storage, and then can be stored inside the storage structure 5 in cooperation. When the stirring structure 6 is not in use, it can be not in contact with the solution inside the reaction kettle 1, thus avoiding accelerated corrosion and not affecting the temperature of the solution, and avoiding increased energy consumption. Under the action of the cleaning structure 7, the inner wall of the storage cylinder 51 and the stirring structure 6 stored inside the storage cylinder 51 can be cleaned. Under the action of the connection structure 8, the cover body 2 and the reaction kettle 1 can be disassembled and assembled.

[0040] Reference Figures 3 - 6 , the storage structure 5 further includes mounting plates 54 symmetrically and fixedly connected to both sides of the storage cylinder 51. At the bottom of the outer surface of one of the mounting plates 54, a first motor 55 is fixedly connected. The output end of the first motor 55 is fixedly connected to a first screw rod 56. A threaded hole block 57 is threadedly connected to the outer surface of the first screw rod 56. At the top of the outer surface of the other mounting plate 54, a limiting rod 58 is fixedly connected. A limiting slider 59 is slidably connected to the outer surface of the limiting rod 58. A connecting arc rod 510 is fixedly connected between the threaded hole block 57 and the limiting slider 59;

[0041] By setting the first screw rod 56 and the threaded hole block 57, the limiting slider 59 and the connecting arc rod 510 can be driven to move, and then can cooperate with other components for auxiliary transmission.

[0042] Reference Figures 5 - 7 , a rectangular connecting block 511 is fixedly connected to the outer surface of the connecting arc rod 510. A circular connecting rod 512 is fixedly connected to the top of the outer surface of the rectangular connecting block 511. An auxiliary connecting block 513 is fixedly connected to the top end of the outer surface of the circular connecting rod 512. A cover plate 514 is fixedly connected to the outer surface of the auxiliary connecting block 513. A second sealing circular block 519 is fixedly connected to the bottom of the outer surface of the cover plate 514;

[0043] By setting the circular connecting rod 512, the cover plate 514 can be driven to move, so that the second sealing circular block 519 can cooperate with the annular plate 53 for sealing.

[0044] Reference Figures 5 - 7 , a second motor 515 is fixedly connected to the top of the outer surface of the cover plate 514. The output end of the second motor 515 is fixedly connected to a transmission rod 516. The bottom end of the transmission rod 516 is fixedly connected to the top of an auxiliary circular plate 517. The outer surface of the transmission rod 516 is fixedly connected to the inner wall of the first sealing circular block 518;

[0045] By setting the transmission rod 516, the auxiliary circular plate 517 can be driven to rotate, and then can cooperate with components for rotational transmission.

[0046] Reference Figure 5 、 Figure 6 、 Figure 8 and Figure 9 ,The stirring structure 6 further includes a connecting rotating rod 61 fixedly connected to the bottom of the auxiliary circular plate 517. A connecting block 62 is fixedly connected to the outer surface of the connecting rotating rod 61. U-shaped plates 63 are symmetrically and fixedly connected to the outer surface of the connecting block 62. An auxiliary rotating rod 64 is rotatably connected between the two sides of the inner wall of the U-shaped plate 63;

[0047] By providing the connecting block 62 and the U-shaped plate 63, they can rotate under the action of the connecting rotating rod 61, and the auxiliary rotating rod 64 can rotate on the inner wall of the U-shaped plate 63, and can cooperate with other components to play a role.

[0048] Reference Figure 9 ,An auxiliary rotating block 65 is fixedly connected to the outer surface of the auxiliary rotating rod 64. The outer surface of the auxiliary rotating block 65 is fixedly connected to the stirring rod 67. A torsion spring 66 is sleeved on the outer surface of the auxiliary rotating rod 64. The two ends of the torsion spring 66 are respectively fixedly connected to the auxiliary rotating block 65 and the U-shaped plate 63;

[0049] By providing the auxiliary rotating block 65 and the stirring rod 67, they can rotate under the action of the torsion spring 66. When storing, the torsion spring 66 can be deformed, and when unfolding, it can be reset under the action of the torsion spring 66.

[0050] Reference Figure 5 ,A connecting circular block 69 is fixedly connected to the bottom end of the outer surface of the auxiliary rotating rod 64. An auxiliary connecting rod 610 is fixedly connected to the outer surface of the connecting circular block 69. One end of the auxiliary connecting rod 610 is fixedly connected to an annular brush plate 611. Brush hairs are fixedly connected to the outer surface of the annular brush plate 611;

[0051] By providing the auxiliary connecting rod 610 and the annular brush plate 611, the annular brush plate 611 can be driven to move up and down and rotate, and thus the inner wall of the reaction kettle 1 can be cleaned when moving up and down.

[0052] Reference Figure 4 and Figure 10 ,The cleaning structure 7 further includes an auxiliary plate 73 fixedly connected to the cover body 2. A water tank 74 is fixedly connected to the top of the outer surface of the auxiliary plate 73. A water pump 75 is fixedly installed on the top of the outer surface of the water tank 74. The water inlet and the water outlet of the water pump 75 are respectively communicated with a water inlet pipe 76 and a water outlet pipe 77. A U-shaped water pipe 72 is fixedly installed on the outer surface of the annular water pipe 71. The U-shaped water pipe 72 is fixedly installed with the water outlet pipe 77. The water inlet pipe 76 is fixedly installed with the water tank 74;

[0053] By providing structures such as the water tank 74, water can be transported to the inside of the storage cylinder 51 for cleaning.

[0054] Reference Figure 4and Figure 10 At the bottom of the outer surface of the auxiliary plate 73, a second screw rod 78 is fixedly connected. The outer surface of the second screw rod 78 is threadedly connected with a screw hole cylinder 79. At the bottom of the outer surface of the screw hole cylinder 79, a bottom plate 710 is fixedly connected. The outer surface of the screw hole cylinder 79 is fixedly connected with an operation ring 711. The outer surface of the operation ring 711 is fixedly connected with a rectangular convex plate 712;

[0055] By providing the operation ring 711, it is convenient to rotate the screw hole cylinder 79, and then the bottom plate 710 can be driven to contact the ground for support.

[0056] Reference Figure 3 、 Figure 4 and Figure 11 Also, the connecting structure 8 further includes a second ring plate 83 fixedly connected to the top of the outer surface of the reaction kettle 1, and a first ring plate 81 fixedly connected to the bottom of the outer surface of the cover body 2. A first screw hole 82 is provided on the inner wall of the first ring plate 81, a second screw hole 84 is provided on the inner wall of the second ring plate 83, and a threaded clamping rod 85 is threadedly connected to the inner walls of the first screw hole 82 and the second screw hole 84;

[0057] By providing the threaded clamping rod 85, the reaction kettle 1 and the cover body 2 can be assisted in disassembly and assembly.

[0058] The working principle of the above whole is as follows:

[0059] During use, start the second motor 515, so that the transmission rod 516 can drive the auxiliary circular plate 517 to rotate, and then the first sealing circular block 518 can be driven to rotate. At the same time, the connecting rotating rod 61 can be driven to rotate, and then components such as the stirring rod 67 can be driven to rotate;

[0060] When storage is required, at this time, start the first motor 55, so that the first screw rod 56 can drive the screw hole block 57 to move, and then the limit slider 59 can be driven to slide on the outer surface of the limit rod 58, and then the connecting arc rod 510 can be driven to move, so that the circular connecting rod 512 can drive the cover plate 514 to move, and then the transmission rod 516 can be driven to move upward. Then components such as the connecting rotating rod 61 move upward. When the stirring rod 67 abuts against the edge of the connecting round hole 52, the auxiliary rotating block 65 and the auxiliary rotating rod 64 can be driven to rotate, and then the torsion spring 66 can be deformed, so that the stirring rod 67 is stored inside the storage cylinder 51. When the first sealing circular block 518 is clamped with the annular plate 53, stop;

[0061] During the upward movement of the connecting rotating rod 61, components such as the auxiliary connecting rod 610 and the annular brush plate 611 will be driven to move upward, and then the inner wall of the reaction kettle 1 can be cleaned;

[0062] When it is necessary to clean the interior of the storage cylinder 51 (the reactor 1 is not in use during cleaning), the water pump 75 is started at this time, so that water flows from the water tank 74 to the U-shaped water pipe 72 and the annular water pipe 71, and then can flow to the storage cylinder 51;

[0063] When it is necessary to support the auxiliary plate 73, the operation ring 711 is rotated at this time, so that the screw hole cylinder 79 can drive the bottom plate 710 to move along the second screw rod 78, and then the bottom plate 710 contacts the ground;

[0064] When it is necessary to disassemble the cover body 2, the threaded clamping rod 85 is separated from the first screw hole 82 and the second screw hole 84 at this time, and the first ring plate 81 is separated from the second ring plate 83 to complete the disassembly.

[0065] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A preparation device for liquid epoxy resin for semiconductor plastic packaging, characterized in that: include: Reactor (1); A cover body (2), wherein the cover body (2) is arranged on the top of the reaction kettle (1); A feed inlet (3), the feed inlet (3) being arranged on one side of the reaction vessel (1) near the top; A discharge port (4), the discharge port (4) being arranged on one side of the reaction kettle (1) near the bottom; A storage structure (5), the storage structure (5) being arranged on the top of the cover body (2); the storage structure (5) comprising a storage cylinder (51) and an auxiliary circular plate (517); the storage cylinder (51) being fixedly connected to the top of the cover body (2); the top of the auxiliary circular plate (517) being fixedly connected to a first sealing circular block (518); the top of the storage cylinder (51) being fixedly connected to an annular plate (53); the inner wall of the cover body (2) being provided with a connecting circular hole (52); the connecting circular hole (52) being in an arc-shaped chamfered shape; A stirring structure (6), the stirring structure (6) being arranged at the bottom of the auxiliary circular plate (517), the stirring structure (6) comprising a stirring rod (67), the inner wall of the stirring rod (67) being fixedly connected with a stirring protruding rod (68); A cleaning structure (7), the cleaning structure (7) being arranged on one side of the cover body (2) and the storage cylinder (51), the cleaning structure (7) comprising a water tank (74) and an annular water pipe (71), the annular water pipe (71) being connected to the interior of the storage cylinder (51) through a branch pipe; A connecting structure (8), wherein the connecting structure (8) is used to connect the cover body (2) and the reaction kettle (1).

2. The preparation device of liquid epoxy resin for semiconductor plastic packaging according to claim 1, characterized in that: The storage structure (5) further comprises a mounting plate (54) symmetrically fixedly connected to both sides of the storage cylinder (51), wherein a first motor (55) is fixedly connected to the bottom of the outer surface of the mounting plate (54) on one side, a first screw rod (56) is fixedly connected to the output end of the first motor (55), a screw hole block (57) is threadedly connected to the outer surface of the first screw rod (56), and a limiting rod (58) is fixedly connected to the top of the outer surface of the mounting plate (54) on the other side, a limiting slider (59) is slidably connected to the outer surface of the limiting rod (58), and a connecting arc rod (510) is fixedly connected between the screw hole block (57) and the limiting slider (59).

3. The preparation device of liquid epoxy resin for semiconductor plastic packaging according to claim 2, characterized in that: The outer surface of the connecting arc rod (510) is fixedly connected to a rectangular connecting block (511), the top of the outer surface of the rectangular connecting block (511) is fixedly connected to a circular connecting rod (512), the top of the outer surface of the circular connecting rod (512) is fixedly connected to an auxiliary connecting block (513), the outer surface of the auxiliary connecting block (513) is fixedly connected to a cover plate (514), and the bottom of the outer surface of the cover plate (514) is fixedly connected to a second sealing circular block (519).

4. The preparation device of liquid epoxy resin for semiconductor plastic packaging according to claim 3, characterized in that: A second motor (515) is fixedly connected to the top of the outer surface of the cover plate (514), a transmission rod (516) is fixedly connected to the output end of the second motor (515), a bottom end of the transmission rod (516) is fixedly connected to the top of the auxiliary circular plate (517), and an outer surface of the transmission rod (516) is fixedly connected to the inner wall of the first sealing circular block (518).

5. The preparation equipment of liquid epoxy resin for semiconductor plastic packaging according to claim 1, characterized in that: The stirring structure (6) further comprises a connecting rotating rod (61) fixedly connected to the bottom of the auxiliary circular plate (517); the outer surface of the connecting rotating rod (61) is fixedly connected to a connecting block (62); the outer surface of the connecting block (62) is symmetrically fixedly connected to a U-shaped plate (63); and an auxiliary rotating rod (64) is rotatably connected between the two sides of the inner wall of the U-shaped plate (63).

6. The preparation equipment of liquid epoxy resin for semiconductor plastic packaging according to claim 5, characterized in that: The outer surface of the auxiliary rotating rod (64) is fixedly connected to an auxiliary rotating block (65), and the outer surface of the auxiliary rotating block (65) is fixedly connected to the stirring rod (67). The outer surface of the auxiliary rotating rod (64) is sleeved with a torsion spring (66), and the two ends of the torsion spring (66) are respectively fixedly connected to the auxiliary rotating block (65) and the U-shaped plate (63).

7. The equipment for preparing liquid epoxy resin for semiconductor plastic packaging according to claim 5, characterized in that: The bottom end of the outer surface of the auxiliary rotating rod (64) is fixedly connected to a connecting round block (69), the outer surface of the connecting round block (69) is fixedly connected to an auxiliary connecting rod (610), one end of the auxiliary connecting rod (610) is fixedly connected to an annular brush plate (611), and the outer surface of the annular brush plate (611) is fixedly connected to bristles.

8. The preparation equipment of liquid epoxy resin for semiconductor plastic packaging according to claim 1, characterized in that: The cleaning structure (7) further comprises an auxiliary plate (73) fixedly connected to the cover body (2); the top of the outer surface of the auxiliary plate (73) is fixedly connected to the water tank (74); a water pump (75) is fixedly mounted on the top of the outer surface of the water tank (74); the water inlet and the water outlet of the water pump (75) are respectively connected to a water inlet pipe (76) and a water outlet pipe (77); a U-shaped water pipe (72) is fixedly mounted on the outer surface of the annular water pipe (71); the U-shaped water pipe (72) is fixedly mounted to the water outlet pipe (77); and the water inlet pipe (76) is fixedly mounted to the water tank (74).

9. The equipment for preparing liquid epoxy resin for semiconductor plastic packaging according to claim 8, characterized in that: A second screw rod (78) is fixedly connected to the bottom of the outer surface of the auxiliary plate (73); a screw hole tube (79) is threadedly connected to the outer surface of the second screw rod (78); a bottom plate (710) is fixedly connected to the outer surface of the screw hole tube (79); an operating ring (711) is fixedly connected to the outer surface of the screw hole tube (79); and a rectangular convex plate (712) is fixedly connected to the outer surface of the operating ring (711).

10. The preparation equipment of liquid epoxy resin for semiconductor plastic packaging according to claim 1, characterized in that: The connection structure (8) also includes a second ring plate (83) fixedly connected to the top of the outer surface of the reactor (1), and a first ring plate (81) fixedly connected to the bottom of the outer surface of the cover body (2), the inner wall of the first ring plate (81) is provided with a first screw hole (82), the inner wall of the second ring plate (83) is provided with a second screw hole (84), and the inner walls of the first screw hole (82) and the second screw hole (84) are threadedly connected with a threaded clamping rod (85).

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