Cleaning assembly and semiconductor equipment

Abstract

The invention discloses a cleaning assembly and semiconductor equipment, and relates to the technical field of semiconductor process equipment. The cleaning assembly comprises a top cover, a fan and a bell jar; the top cover and the bell jar enclose to form a heat dissipation cavity, the top cover is provided with an air inlet hole, a fan channel in the fan is communicated with the air inlet hole to form an air inlet channel, the air inlet channel is communicated with the heat dissipation cavity, and when the fan works, air is driven to enter the heat dissipation cavity through the air inlet channel; an air outlet of the air inlet channel is a first air outlet, the first air outlet faces the bell jar, and the proportion of the area of the first air outlet to the projected area of the bell jar in the direction of the fan ranges from 10% to 20%. By arranging the first air outlet, circulation of airflow in the heat dissipation cavity is facilitated, the airflow dead zone of the top area of the bell jar is reduced, and the temperature of the top area of the bell jar is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor process equipment, and in particular to a cleaning component and semiconductor equipment. Background Art

[0002] In semiconductor process production, the cleanliness of the wafer surface has a crucial impact on the quality and yield of the device. Cleaning components usually remove oxide impurities on the wafer surface through redox reactions or ion bombardment. During ion bombardment, impurity particles are adsorbed by the bell jar to prevent re-deposition. As the cleaning proceeds, the surface temperature of the bell jar rises, the adsorption efficiency of the bell jar decreases, and the bell jar's adsorption capacity for impurity particles decreases, increasing the risk of impurity particles falling off (Peeling phenomenon) and contaminating the wafer; at the same time, the uneven temperature distribution of the bell jar leads to inconsistent thickness of the adsorption layer, reducing the effective adsorption area, and further exacerbating the Peeling phenomenon. Due to the Peeling phenomenon caused by the excessively high surface temperature of the bell jar and the uneven temperature, maintenance personnel need to frequently clean and maintain the bell jar, resulting in a shortened cleaning cycle of the bell jar and reduced working efficiency of semiconductor equipment. Summary of the invention

[0003] The present application provides a cleaning component and a semiconductor device, which can dissipate heat on the surface of the bell jar and maintain a uniform temperature during the wafer cleaning process, which is beneficial to extending the maintenance cycle of the bell jar and improving the working efficiency of the semiconductor equipment.

[0004] In the first aspect, the present application provides a cleaning component, including a top cover, a fan and a bell cover; the top cover and the bell cover enclose a heat dissipation cavity, the top cover is provided with an air inlet hole, the fan channel in the fan and the air inlet hole are connected to form an air inlet channel, the air inlet channel and the heat dissipation cavity are connected, and when the fan is working, air is driven into the heat dissipation cavity through the air inlet channel; the air outlet of the air inlet channel is a first air outlet, the first air outlet faces the bell cover, and the ratio of the area of ​​the first air outlet to the projection area of ​​the bell cover toward the fan direction is in the range of 10% to 20%.

[0005] When the cleaning component is working, air enters the fan channel from the air inlet of the fan, and the fan drives the air to generate high-speed airflow, which enters the heat dissipation cavity through the first air outlet. Since the first air outlet faces the bell jar, the gas and the bell jar can directly carry out convective heat exchange to absorb the heat on the surface of the bell jar; secondly, the ratio of the area of ​​the first air outlet to the projected area of ​​the bell jar toward the fan is in the range of 10% to 20%, which can make most of the gas flow directly to the overheated area on the surface of the bell jar, which is beneficial to the cooling effect of the overheated area. The reduction in the temperature of the top area of ​​the bell jar is conducive to increasing the adsorption efficiency of the bell jar for impurity particles, reducing the risk of Peeling phenomenon, and reducing the number of times maintenance personnel clean and maintain the bell jar, which is conducive to extending the maintenance cycle of the bell jar and improving the working efficiency of semiconductor equipment.

[0006] In a possible implementation, the top cover includes a top plate and a side plate, the top plate and the bell cover are arranged opposite to each other, the side plate is located between the top plate and the bell cover, the top plate, the side plate and the bell cover are enclosed to form a heat dissipation cavity, and the air inlet is arranged on the top plate; the fan is arranged in the heat dissipation cavity, and the air inlet of the fan is connected to the air inlet. Compared with the fan being arranged in the heat dissipation cavity, the fan being arranged in the heat dissipation cavity reduces unnecessary protrusions or gaps, making the overall structure appear more smooth and harmonious, and making the structure of the cleaning component more concise and beautiful in appearance.

[0007] In a possible implementation, the fan includes a housing and blades, the housing encloses a fan channel, the blades are accommodated in the fan channel, the ratio of the rotation area of ​​the blades to the projected area of ​​the bell toward the fan direction is greater than 20%, the air outlet of the fan is the second air outlet, along the direction from the air inlet of the fan channel to the second air outlet, at least part of the inner wall of the housing is inclined in the direction close to the rotation axis of the blades, and the second air outlet is the first air outlet. When the fan is built into the heat dissipation cavity, the fan has a wide rotation range, and it is necessary to tilt part of the inner wall of the housing so as to gather the high-speed airflow generated by the rotation of the fan through the guide, reduce the area of ​​the first air outlet, reduce the airflow loss, and improve the heat dissipation efficiency. The improvement of heat dissipation efficiency is conducive to increasing the adsorption efficiency of the bell jar on impurity particles, reducing the risk of Peeling phenomenon, reducing the number of times maintenance personnel clean and maintain the bell jar, which is conducive to extending the maintenance cycle of the bell jar and improving the working efficiency of semiconductor equipment.

[0008] In a possible implementation, the ratio of the minimum distance between the first air outlet and the bell jar to the height of the top jar is in the range of 5% to 40%. Maintaining a certain distance ratio range between the first air outlet and the bell jar is conducive to the circulation of airflow in the heat dissipation cavity, reducing the airflow dead zone in the top area of ​​the bell jar, and reducing the temperature in the top area of ​​the bell jar. The first air outlet is located at a lower position of the bell jar, which is conducive to the convergence of airflow, which is conducive to improving the heat dissipation efficiency, increasing the adsorption efficiency of the bell jar on impurity particles, reducing the risk of Peeling phenomenon, reducing the number of times maintenance personnel clean and maintain the bell jar, extending the maintenance cycle of the bell jar, and improving the working efficiency of semiconductor equipment.

[0009] In a possible implementation, the top cover includes a top plate and a side plate, the top plate and the bell cover are arranged relative to each other, and the side plate is located between the top plate and the bell cover; the cleaning assembly includes a fixed seat, the fixed seat is connected to the top cover and the bell cover, the fixed seat is connected to the edge of the bell cover, and the top plate, the side plate, the bell cover and the fixed seat are enclosed to form a heat dissipation cavity; the side plate is provided with a first exhaust hole, and the distance between the first exhaust hole and the fixed seat is less than 30% of the height of the top cover. By providing the first exhaust hole, an airflow passage can be formed around the edge of the bell cover in the heat dissipation cavity, reducing the airflow dead zone around the edge of the bell cover, and reducing the temperature of the edge of the bell cover, and the distance between the first exhaust hole and the fixed seat is less than 30% of the height of the top cover, and the first exhaust hole is located below the bell cover, preventing the occurrence of dead zones below the bell cover and at the corners of the fixed seat, ensuring that the wind blown in by the fan can cool down the entire bell cover and the fixed seat. The increase in the cooling coverage area is conducive to increasing the bell jar's adsorption efficiency of impurity particles, reducing the risk of Peeling phenomenon, and reducing the number of times maintenance personnel clean and maintain the bell jar, which is conducive to extending the bell jar maintenance cycle and improving the working efficiency of semiconductor equipment.

[0010] In a possible implementation, the number of the first exhaust holes is at least two, and the at least two first exhaust holes are arranged at intervals along the circumferential direction of the side plate to form a first annular exhaust structure. By providing the first annular exhaust structure, more airflow paths can be formed in the circumferential direction of the side plate, thereby improving the heat dissipation efficiency at each edge of the bell jar. The improvement in heat dissipation efficiency is conducive to increasing the adsorption efficiency of the bell jar for impurity particles, reducing the risk of Peeling phenomenon, reducing the number of times maintenance personnel clean and maintain the bell jar, and is conducive to extending the maintenance cycle of the bell jar and improving the working efficiency of semiconductor equipment.

[0011] In one possible implementation, the first annular exhaust structure has at least two circles, and is arranged at intervals along the height direction of the side plate. Multiple first annular exhaust structures can form more airflow paths at the bottom of the bell jar, so that the temperature of the bell jar surface is uniform; at the same time, the heat dissipation efficiency is increased by accelerating the gas circulation. The improvement of heat dissipation efficiency is conducive to increasing the adsorption efficiency of the bell jar on impurity particles, reducing the risk of Peeling phenomenon, reducing the number of times maintenance personnel clean and maintain the bell jar, which is conducive to extending the maintenance cycle of the bell jar and improving the working efficiency of semiconductor equipment.

[0012] In a possible implementation, a second exhaust hole is provided on the top plate; the number of the second exhaust hole is one, and the second exhaust hole is annular to form a second annular exhaust structure, or the number of the second exhaust holes is at least two, and at least two second exhaust holes are arranged in annular intervals to form a second annular exhaust structure; the second annular exhaust structure is located at the periphery of the air inlet. When the air inlet introduces air, the second annular exhaust structure located at the periphery can more effectively discharge the hot air and form a good air circulation channel. This layout helps to reduce air flow resistance and improve air circulation efficiency. The second annular exhaust structure is located at the periphery of the air inlet to ensure that hot air or heat is quickly discharged to avoid accumulation inside the heat dissipation cavity, thereby improving the heat dissipation effect and protecting the cleaning component from overheating damage. The improvement of the heat dissipation effect is conducive to increasing the adsorption efficiency of the bell jar on impurity particles, reducing the risk of Peeling phenomenon, reducing the number of times maintenance personnel clean and maintain the bell jar, and is conducive to extending the maintenance cycle of the bell jar and improving the working efficiency of semiconductor equipment.

[0013] In one possible implementation, the second annular exhaust structure has at least two circles, and is arranged at intervals along the rotation axis direction of the fan. Providing at least two circles of the second annular exhaust structure is conducive to increasing the airflow path in the heat dissipation cavity, forming a larger vortex size at the top of the heat dissipation cavity, thereby improving the heat dissipation efficiency. The improvement of heat dissipation efficiency is conducive to increasing the adsorption efficiency of the bell jar on impurity particles, reducing the risk of Peeling phenomenon, reducing the number of times maintenance personnel clean and maintain the bell jar, and is conducive to extending the maintenance cycle of the bell jar and improving the working efficiency of semiconductor equipment.

[0014] In a possible implementation, the second annular exhaust structure is a circular structure, the projection of the bell toward the fan is circular, the first air outlet is a circular opening, the ratio of the maximum value of the outer diameter of all the second annular exhaust structures arranged on the top plate to the projection diameter of the bell toward the fan is in the range of 80% to 120%, and / or, the ratio of the minimum value of the inner diameter of all the second annular exhaust structures arranged on the top plate to the diameter of the first air outlet is in the range of 200% to 300%. The ratio of the maximum value of the outer diameter of the second annular exhaust structure to the projection diameter of the bell toward the fan in the range of 80% to 120% can ensure that the second annular exhaust structure has a relatively suitable size ratio within the coverage range of the bell, and the airflow generated by the fan is discharged more smoothly through the second annular exhaust structure. The ratio of the minimum inner diameter of all the second annular exhaust structures set on the top plate to the diameter of the first air outlet is in the range of 200% to 300%. The airflow will be effectively dispersed when passing through the second annular exhaust structure, thereby forming a more uniform airflow distribution at the first air outlet, which helps to reduce airflow turbulence and eddy currents and improve exhaust efficiency; the second annular exhaust structure with a larger inner diameter helps to reduce the resistance of the airflow when passing through, allowing the airflow to flow out more smoothly, thereby improving the heat dissipation performance of the cleaning component. The improvement of heat dissipation performance is conducive to increasing the adsorption efficiency of the bell jar on impurity particles, reducing the risk of Peeling phenomenon, reducing the number of times maintenance personnel clean and maintain the bell jar, and is conducive to extending the maintenance cycle of the bell jar and improving the working efficiency of semiconductor equipment.

[0015] In a possible implementation, the cleaning assembly includes a mesh cover, which is fixedly connected to the top cover, and the mesh cover covers the air inlet hole or the air inlet of the fan channel. By providing the mesh cover, foreign matter or pollutants can be reduced from entering the heat dissipation cavity, and workers' clothes, long hair, gloves or other body parts can be prevented from accidentally contacting the high-speed rotating fan blades, thereby reducing the possibility of serious cuts, tears or even entanglement accidents.

[0016] In one possible implementation, the height of the top cover is greater than or equal to 1.5 times the height of the bell cover. The top cover height is set higher, and the space in the heat dissipation cavity is larger, which can increase the size of the vortex formed by the exhaust hole inside the heat dissipation cavity, thereby making the cooling effect of the cleaning component better. The optimization of the cooling effect is conducive to increasing the adsorption efficiency of the bell cover on impurity particles, reducing the risk of Peeling phenomenon, and reducing the number of times maintenance personnel clean and maintain the bell cover, which is conducive to extending the maintenance cycle of the bell cover and improving the working efficiency of semiconductor equipment.

[0017] In a second aspect, the present application further provides a semiconductor device, including any of the above-mentioned cleaning components, and also including a housing and a process base, wherein the housing and the bell cover of the cleaning component enclose a main cavity, the process base is located in the main cavity, and the process base is used to carry a wafer. The wafer cleaning reaction in the main cavity generates a large amount of heat, and the cleaning component can take away the heat on the bell cover in time, thereby facilitating the continuous progress of the cleaning reaction. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a cleaning component provided in an embodiment of the present application;

[0019] Figure 2 The bell housing and the fixing seat provided in the embodiment of the present application;

[0020] Figure 3 is a front view of a cleaning component provided in an embodiment of the present application;

[0021] Figure 4 yes Figure 3 Schematic diagram of the cross section at AA in the middle;

[0022] Figure 5 is a front view of a cleaning component provided in an embodiment of the present application;

[0023] Figure 6 yes Figure 5 Schematic diagram of the cross section at the middle BB;

[0024] Figure 7 is a front view of a cleaning component provided in an embodiment of the present application;

[0025] Figure 8 yes Figure 7 Schematic diagram of the cross section at CC;

[0026] Fig. 9 is a top view of a fan blade provided in an embodiment of the present application;

[0027] Fig.10 It is a cleaning component provided in an embodiment of the present application;

[0028] Fig.11 yes Fig.10 Magnified image of the place;

[0029] Fig.12 It is a cleaning component provided in an embodiment of the present application;

[0030] Fig.13 is a front view of a cleaning component provided in an embodiment of the present application;

[0031] Fig.14 yes Fig.13 Schematic diagram of the cross section at DD in the middle;

[0032] Fig.15 is a top view of a cleaning component provided in an embodiment of the present application;

[0033] Fig.16 It is a cleaning component provided in an embodiment of the present application;

[0034] Fig.17 A semiconductor device is provided in an embodiment of the present application. DETAILED DESCRIPTION

[0035] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0036] For ease of understanding, the English abbreviations and related technical terms involved in the embodiments of the present application are explained and described below.

[0037] It should be clear that the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0038] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0039] It should be understood that the term "and / or" used in this article is only a description of the same field of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0040] It should be understood that the terms “first”, “second”, etc. used in the present application are only used for the purpose of distinguishing the description, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying an order.

[0041] In the description of this application, the Z direction is the height direction of the cleaning component, the X direction is perpendicular to the Z direction and the Y direction, the Y direction is perpendicular to the Z direction and the X direction, and the XY plane is parallel to the bottom surface of the cleaning component.

[0042] In the description of the present application, the terms "upper", "lower", "front", "back", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0043] When used in this application, “within the range of…”, unless it is separately specified that an end value is not included, it is assumed that both end values ​​of the range are included. For example, in the range of 1 to 5, the two values ​​1 and 5 are included.

[0044] In the description of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms, "connectivity" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, a conflicting connection or an integrated connection. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0045] The cleaning process is one of the important factors that affect the performance and yield of semiconductor devices. During the manufacturing process of semiconductor devices, any contamination may affect the performance of semiconductor devices and even cause failure. Therefore, a cleaning process is required before and after almost every step in the manufacturing of semiconductor devices to remove surface contaminants and ensure the cleanliness of the wafer surface. The cleaning component usually removes oxide impurities on the surface of the wafer through methods such as redox or ion bombardment. Among them, under ion bombardment, most of the impurity particles are adsorbed and fixed by the lower surface of the bell jar of the cleaning component to prevent them from being re-deposited on the wafer.

[0046] As the cleaning process progresses, the temperature of the bell jar surface gradually increases. High temperature will cause changes in the physical and chemical properties of the bell jar surface, thereby affecting its ability to adsorb impurity particles. On the one hand, high temperature may destroy the adsorption sites on the bell jar surface, making these sites unable to effectively combine with impurity particles. On the other hand, high temperature may also increase the thermal motion energy of impurity particles, making it easier for them to fall off the bell jar surface, which is the Peeling phenomenon. The Peeling phenomenon not only causes the wafer surface to be re-contaminated, but also affects the cleaning effect.

[0047] In addition, the uneven temperature distribution of the bell jar is also a problem that needs to be solved urgently. Uneven temperature distribution will lead to differences in the adsorption capacity of different areas on the surface of the bell jar. The uneven adsorption layer will reduce the effective adsorption area of ​​the bell jar, thereby reducing its overall adsorption capacity for impurity particles. The uneven adsorption layer will also aggravate the Peeling phenomenon. Areas with higher temperatures are more likely to fall off, and the fallen impurity particles will be deposited on the wafer surface again, causing contamination.

[0048] Due to the decrease in adsorption efficiency caused by the increase in bell jar temperature and the reduction in effective adsorption area caused by uneven temperature distribution, existing pre-cleaning components face the challenge of significantly shortening the bell jar maintenance cycle in practical applications. In order to maintain the cleanliness of the wafer surface and the quality of the device, the bell jar needs to be maintained and replaced regularly. However, with the increase in the number of cleaning times and the increase in temperature, the adsorption capacity of the bell jar will gradually decrease, resulting in maintenance personnel needing to frequently clean and maintain the bell jar, shortening the bell jar maintenance cycle, and reducing semiconductor work efficiency. This not only increases production costs, but may also affect the stability and efficiency of the production line.

[0049] In summary, as the wafers are continuously cleaned, the increase in the surface temperature of the bell jar and the uneven temperature distribution will have an adverse effect on the adsorption efficiency of the bell jar, thereby increasing the risk of impurity particles falling off and the occurrence of the Peeling phenomenon. In order to meet these challenges, it is necessary to continuously optimize the cleaning process, improve the bell jar material and design, strengthen cooling measures, etc., in order to extend the maintenance cycle of the bell jar and improve the cleaning effect, thereby improving the working efficiency of semiconductor equipment.

[0050] The present application provides a cleaning component 100, which is used to clean oxide impurities on the surface of a wafer.

[0051] See also Figure 1 and Figure 2 In this embodiment, the cleaning assembly 100 includes a top cover 2, a fan 3 and a bell cover 4.

[0052] See also Figure 4 The top cover 2 and the bell cover 4 are enclosed to form a heat dissipation cavity 5, and the top cover 2 completely covers the surface of the bell cover 4 along the positive direction of the Z axis. The heat dissipation cavity 5 arranged on the periphery of the bell cover 4 can prevent the introduction of impurities into the bell cover 4 during the heat dissipation process and affect the wafer cleaning while ensuring the heat dissipation function. There are many options for connecting the top cover 2 and the bell cover 4, such as welding connection, slot connection, screw connection, lock connection, hinge connection or other connection methods.

[0053] The bell jar 4 is used for wafer cleaning. Since a large amount of heat is generated during the cleaning reaction, the heat will be thermally conducted and radiated with the bell jar surface. In order to facilitate the continuous reaction, the bell jar 4 is usually made of high temperature resistant materials, such as heat-resistant stainless steel and heat-resistant alloy steel. Of course, other suitable materials can also be used. The bell jar 4 can be flexibly selected in shape according to different reaction types, such as sphere, cylinder, truncated cone, cube, cuboid or other shapes.

[0054] The shape of the top cover 2 can be flexibly selected according to the shape of the bell cover 4, such as a cylinder, a truncated cone, a cube, a cuboid or other shapes.

[0055] The top cover 2 is provided with an air inlet 211 and a second exhaust hole 212. The air inlet 211 transfers the gas outside the top cover 2 into the heat dissipation cavity 5. The gas circulates in the heat dissipation cavity 5 and is output to the outside of the top cover 2 through the second exhaust hole 212. The air inlet 211 and the second exhaust hole 212 form an air flow path in the heat dissipation cavity 5, which is beneficial to the heat dissipation of the surface of the bell cover 4. The shape of the air inlet 211 can be flexibly selected, such as circular, triangular, rectangular or other shapes.

[0056] The fan housing 31 encloses a fan channel 33, and the fan blades 32 are accommodated in the fan channel 33. The fan channel 33 and the air inlet hole 211 form an air inlet channel 6, and the air inlet channel 6 is connected to the heat dissipation cavity 5. The air outlet of the air inlet channel 6 is a first air outlet 61. The shape of the first air outlet 61 can be flexibly selected, such as circular, triangular, rectangular or other shapes.

[0057] In one embodiment, see Figure 3 and Figure 4 , the air inlet 211 is located at the top of the fan housing 31 (along the positive direction of the Z axis), and the edge of the air inlet 211 is connected to the edge of the air inlet of the fan housing 31. At this time, the air outlet of the fan housing 31 is the first air outlet 61, and the air enters the fan channel 33 from the air inlet 211. The fan 3 drives the air to generate a high-speed airflow, and the airflow flows from the first air outlet 61 to the heat dissipation cavity 5.

[0058] In one embodiment, see Figure 5 and Figure 6 , the fan housing 31 passes through the air inlet 211, and the air inlet 211 is not located at the top or bottom of the fan housing 31, but at the middle. At this time, air enters the fan channel 33 from the air inlet of the fan housing 31, and the fan 3 drives the air to generate a high-speed airflow, which flows from the first air outlet 61 to the heat dissipation cavity 5.

[0059] In one embodiment, see Figure 7 and Figure 8 The air inlet 211 is located at the bottom of the fan housing 31 (in the opposite direction of the Z axis), and the edge of the air inlet 211 is connected to the edge of the air outlet of the fan housing 31. At this time, the air inlet 211 is the first air outlet 61, and the air enters the fan channel 33 from the air inlet of the fan housing 31. The fan 3 drives the air to generate a high-speed airflow, and the airflow passes from the air inlet 211 to the heat dissipation cavity 5.

[0060] Since there are multiple positions of the fan channel 33 and the air inlet hole 211, there are also multiple options for the position relationship between the fan 3 and the heat dissipation cavity 5, such as the fan 3 is completely located inside the heat dissipation cavity 5, the fan 3 is partially located inside the heat dissipation cavity 5, or the fan 3 is completely located outside the heat dissipation cavity 5.

[0061] The number of fans 3 can be one or more, for example, one, two or three fans 3. It should be noted that the number of fans 3 should be designed according to the space in the fan channel 33, and multiple factors such as aerodynamic principles, space design, the influence of the number of fans 3, and ensuring wind efficiency should be considered comprehensively. Through scientific design and optimization, the best ventilation effect, energy efficiency and noise control can be achieved.

[0062] The first air outlet 61 faces the bell housing 4 (along the Z-axis direction). When the fan 3 is working, it drives the air to generate a high-speed airflow, and directly flows to the bell housing 4 through the air inlet channel 6, forming convection heat exchange. Convection heat exchange refers to the heat transfer phenomenon between the fluid and the solid surface when the fluid flows through the solid surface. This heat transfer method mainly depends on the movement of the fluid. The hot particles in the fluid will transfer heat to the solid through contact with the solid surface, or absorb heat from the solid surface.

[0063] The ratio of the area of ​​the first air outlet 61 to the projected area of ​​the raised surface 41 of the bell jar toward the direction of the fan 3 is in the range of 10% to 20%. The area of ​​the first air outlet 61 is the cross-sectional area on the XY plane (when the first air outlet 61 is a special-shaped shape, the area of ​​the first air outlet 61 is also the cross-sectional area of ​​its XY plane), and the projected area of ​​the bell jar 4 toward the direction of the fan 3 is the projected area of ​​the bell jar 4 toward the positive direction of the Z axis. This ratio range can be achieved by regulating the area of ​​the first air outlet 61. By controlling the area of ​​the first air outlet 61, it is beneficial to concentrate the high-speed airflow generated by the fan 3 to the overheated area of ​​the bell jar 4, absorb the heat of the over-temperature area of ​​the bell jar 4, and facilitate the continuous cleaning of the wafers in the bell jar 4.

[0064] See also Figure 3 , Figure 4 and Figure 5 When the cleaning assembly is working, air enters the fan channel 33 from the air inlet of the fan 3, and the fan 3 drives the air to generate a high-speed airflow, which enters the heat dissipation chamber 5 through the first air outlet 61. Since the first air outlet 61 faces the bell jar 4, the gas and the bell jar 4 can directly conduct convection heat exchange and absorb the heat on the surface of the bell jar 4; and the ratio of the area of ​​the first air outlet 61 to the projected area of ​​the bell jar convex surface 41 toward the fan 3 is in the range of 10% to 20%, so that most of the gas can flow directly to the overheated area on the surface of the bell jar 4, which is beneficial to the cooling effect of the overheated area. The reduction in the temperature of the top area of ​​the bell jar 4 is conducive to increasing the adsorption efficiency of the bell jar 4 on impurity particles, reducing the risk of Peeling phenomenon, and reducing the number of times maintenance personnel clean and maintain the bell jar 4, which is conducive to extending the maintenance cycle of the bell jar 4 and improving the working efficiency of semiconductor equipment.

[0065] In one embodiment, see Figure 4 As shown, the top cover 2 includes a top plate 21 and a side plate 22 .

[0066] The top plate 21 and the bell jar 4 are arranged relative to each other, that is, the top plate 21 and the bell jar 4 are relative to each other along the Z-axis direction. The shape of the top plate 21 can be selected in many ways, such as circular, triangular, rectangular, polygonal or other shapes. In the present embodiment, the shape of the top plate 21 is circular.

[0067] The side panel 22 is located between the top panel 21 and the bell jar 4. One end of the side panel 22 along the Z-axis direction is fixed to the top panel 21, and the fixing method can be flexibly selected, such as welding, slot fixing, screw fixing or other fixing methods; the side panel 22 can also be integrally formed with the top panel 21. The top panel 21 and the side panel 22 are usually made of the same material, such as stainless steel, metal, alloy, non-metal or other materials. The other end of the side panel 22 along the Z-axis direction is connected to the bell jar 4, and the connection method can be flexibly selected, such as welding, slot connection, screw connection, lock connection, hinge connection or other fixing methods.

[0068] In this embodiment, the side panels 22 are arranged perpendicular to the top panel 21, and the top panel 21 and the side panels 22 form a cylindrical top cover 2. It is understandable that the shape of the side panels 22 after unfolding can be flexibly selected, such as a rectangle, a trapezoid or other shapes. At the same time, since the shapes of the side panels 22 and the top panel 21 can be flexibly selected, the shape of the top cover 2 can also be various, such as a cylinder, a truncated cone, a cube, a cuboid or other shapes.

[0069] The top plate 21 is provided with an air inlet 211, and the shape of the air inlet 211 can be flexibly selected, such as circular, triangular, rectangular or other shapes. In this embodiment, the top plate 21 and the air inlet 211 are coaxial circles.

[0070] For further information, see Figure 4 The top plate 21, the side plate 22 and the bell jar 4 enclose a heat dissipation cavity 5, the fan 3 is arranged in the heat dissipation cavity 5, the air inlet of the fan 3 is connected to the air inlet hole 211, when the fan is turned on, the air enters the fan channel 33 from the air inlet hole 211, the air inlet hole 211 and the fan channel 33 form an air inlet channel 6, and the high-speed airflow generated by the rotation of the fan flows from the first air outlet 61 to the heat dissipation cavity 5. In this embodiment, the air inlet of the fan 3 and the air inlet hole 211 are circular with uniform size.

[0071] In this embodiment, the fan 3 is arranged in the heat dissipation cavity 5. Compared with the fan 3 being arranged outside the heat dissipation cavity 5, the fan 3 is arranged in the heat dissipation cavity 5 to directly cool the bell jar 4 in the heat dissipation cavity 5, and the airflow generated by the fan 3 accelerates the airflow in the heat dissipation cavity 5, takes away the heat faster, reduces the thermal resistance, and then discharges it through the second exhaust hole 212, thereby improving the heat dissipation efficiency. In one embodiment, please refer to Figure 4The fan includes a fan housing 31, fan blades 32 and a transmission shaft (not shown). The fan housing 31 encloses a fan channel 33, and the fan blades 32 are accommodated in the fan channel 33. In this embodiment, the fan 3 is arranged in the heat dissipation cavity 5, and the airflow generated by the fan blades 32 flows to the heat dissipation cavity 5 through the fan channel 33.

[0072] In one embodiment, the fan housing 31 includes a first fan housing 311, a second fan housing 312, and a third fan housing 313. The first fan housing 311 is used to fix the fan blades 32, and the upper end of the first fan housing 311 is fixed to the top plate 21; the upper end of the second fan housing 312 is fixed to the top plate 21, the inner edge of the second fan housing 312 is fixed to the outer edge of the first fan housing 311, and the lower end of the second fan housing 312 is fixed to the upper end of the third fan housing 313; a part of the upper end of the third fan housing 313 is fixed to the bottom of the first fan housing 311, and the other part is fixed to the bottom of the second fan housing 312. The fixing method can be flexibly selected, such as welding, slot fixing, screw fixing, lock fixing or other fixing methods.

[0073] See also Fig. 9 , the graphic area formed by the outermost path when the fan blade 32 rotates is the fan blade rotation area 321.

[0074] In this embodiment, the ratio of the fan blade rotation area 321 to the projection area of ​​the bell housing convex surface 41 toward the fan 3 is greater than 20%. It can be understood that the projection area of ​​the bell housing 4 toward the fan 3 is the projection area of ​​the bell housing 4 toward the positive direction of the Z axis. Figure 6 As shown, the air outlet of the fan 3 is the second air outlet 62. At this time, at least part of the fan housing 31 is inclined along the direction of the rotation axis of the fan blade 32, and the rotation axis of the fan blade 32 is Figure 4L1 line in. It is understandable that the fan housing 31 can be partially or completely close to the tilt. It is understandable that the shape of the fan housing 31 can be flexibly selected, such as a straight plate surface, an arc surface or other shaped surface, or several different shapes form the fan housing 31. By tilting at least part of the fan housing 31 along the direction of the rotation axis of the fan blade 32, the area of ​​the second air outlet 62 can be reduced to 10% to 20% of the projection area of ​​the bell jar 4 in the positive direction of the Z axis. The second air outlet 62 is the first air outlet 61, so that the airflow generated by the fan blade 32 driven by the transmission shaft (not shown) gathers toward the top of the bell jar 4, reduces the temperature of the overheating area of ​​the bell jar 4, and improves the heat dissipation efficiency. The material for preparing the fan housing 31 can be flexibly selected, such as at least one of resin, metal and non-metallic materials. The improvement of heat dissipation efficiency is conducive to increasing the adsorption efficiency of the bell jar 4 on impurity particles, reducing the risk of Peeling phenomenon, reducing the number of times maintenance personnel clean and maintain the bell jar 4, and is conducive to extending the maintenance cycle of the bell jar 4 and improving the working efficiency of semiconductor equipment.

[0075] In one embodiment, see Figure 4 The second fan housing 312 includes a first inner wall surface 71 and a second inner wall surface 72. The cross-section of the first inner wall surface along the X-axis direction is a rectangle. The cross-section of the second inner wall surface 72 along the X-axis direction is an arc, and the concave surface of the arc faces the side plate 22. The opening of the second inner wall surface 72 along the Z-axis direction close to the bell jar 4 is the second air outlet 62. By setting the arc segment, the size of the second air outlet 62 can be controlled. By setting the first inner wall surface 71 and the second inner wall surface 72, the high-speed airflow generated by the end of the fan blade 32 is gathered to the top of the bell jar 4, thereby reducing the airflow dead zone in the top area of ​​the bell jar 4 and lowering the temperature in the top area of ​​the bell jar 4.

[0076] In the embodiments of this application, please continue to refer to Figure 4 . The ratio of the minimum distance between the first air outlet 61 and the bell jar 4 to the height of the top cover 2 can be set in the range of 5% to 40%. Maintaining a certain distance ratio range between the first air outlet 61 and the bell jar 4 is conducive to the circulation of airflow in the heat dissipation cavity 5, reducing the airflow dead zone in the top area of ​​the bell jar 4, and reducing the temperature in the top area of ​​the bell jar 4. The first air outlet 61 is located at a lower position of the bell jar 4, which is conducive to the convergence of airflow, which is conducive to improving the heat dissipation efficiency, increasing the adsorption efficiency of the bell jar 4 on impurity particles, reducing the risk of Peeling phenomenon, reducing the number of times maintenance personnel clean and maintain the bell jar 4, extending the maintenance cycle of the bell jar 4, and improving the working efficiency of semiconductor equipment.

[0077] It is understandable that when the bell jar has only one highest point (the point with the largest displacement along the positive direction of the Z axis), the minimum distance between the first air outlet 61 and the bell jar 4 refers to the vertical distance from the highest point of the bell jar 4 to the plane where the first air outlet 61 is located along the positive direction of the Z axis; when the bell jar 4 has more than one highest point, the minimum distance between the first air outlet 61 and the bell jar 4 refers to the minimum distance between the plane where the multiple highest points of the bell jar 4 are located and the plane where the first air outlet 61 is located. It is understandable that since there are many choices for the shape of the top cover 2, the height of the top cover 2 also has different definitions. For example, when the top cover 2 is a regular cylinder, the height of the top cover 2 is the height of the side of the regular cylinder.

[0078] In one embodiment, see Figure 4 The cleaning assembly 100 further includes a fixing seat 8. The bell jar 4 includes a raised surface 41 and an edge 42. The fixing seat 8 connects the top cover 2 and the bell jar 4, and the fixing seat 8 is connected to the bell jar edge 42, so that the top plate 21, the side plate 22, the bell jar 4 and the fixing seat 8 enclose a heat dissipation cavity 5.

[0079] In one embodiment, see Fig.10 and Fig.11 The fixing seat 8 has a platform 83, and the platform is used to connect the bell cover edge 42. The fixing seat 8 is connected to the side panel through a hinge 81 and a lock 82, and the hinge 81 and the lock 82 are used to fix the side panel 22 and the fixing seat 8. When the cleaning assembly 100 needs to be repaired, the lock 82 is opened, and the side panel 22 is opened through the hinge 81, which is convenient for the maintenance personnel to operate. The hinge 81 can be an outer hinge or an inner hinge, and the number of the hinge 81 and the lock 82 can be one or more.

[0080] In one embodiment, see Fig.12 The side plate 22 is provided with a first exhaust hole 222. The cross-sectional shape of the first exhaust hole 222 along the X-axis direction can be flexibly selected, such as square, circle, triangle, polygon or other shapes; the cross-sectional shape of the first exhaust hole 222 along the Z-axis direction can be flexibly selected, such as rectangle, trapezoid, inverted trapezoid, rectangle with chamfer or other shapes.

[0081] In this embodiment, the cross section of the first exhaust hole 222 is circular, and the longitudinal section of the first exhaust hole 222 is rectangular.

[0082] For further information, see Fig.13 and Fig.14, the distance between the highest point of the first exhaust hole 222 along the positive direction of the Z axis and the highest point of the fixing seat 8 along the Z axis, that is, the maximum distance between the first exhaust hole 222 and the fixing seat 8 is less than 30% of the height of the top cover 2. In this embodiment, the height of the top cover 2 is the height of the side plate 22. It can be understood that since there are many choices for the shape of the top cover 2, the height of the top cover 2 is also defined differently. For example, when the top cover 2 is a regular cylinder, the height of the top cover 2 is the height of the side of the regular cylinder, that is, the length of the side plate 22 along the Z axis. In addition, the distance between the first exhaust hole and the fixing seat is less than 30% of the height of the top cover. The first exhaust hole is located below the bell cover to prevent dead zones from appearing below the bell cover and at the corners of the fixing seat, ensuring that the wind blown in by the fan can cool the entire bell cover and the fixing seat. The increase in the cooling coverage area is conducive to increasing the adsorption efficiency of the bell cover 4 on impurity particles, reducing the risk of Peeling phenomenon, and reducing the number of times maintenance personnel clean and maintain the bell cover 4, which is conducive to extending the maintenance cycle of the bell cover 4 and improving the working efficiency of semiconductor equipment.

[0083] By providing the first exhaust hole 222 , an air flow passage can be formed around the bell jar edge 42 in the heat dissipation cavity 5 , thereby reducing the air flow dead zone around the bell jar edge 42 and lowering the temperature of the bell jar edge 42 .

[0084] In one embodiment, see Fig.14 The number of the first exhaust holes 222 is at least two, for example, the number of the first exhaust holes 222 is two, three, four or more. At least two first exhaust holes 222 form more airflow paths at the edge 42 of the bell jar, which is beneficial to the heat dissipation of the surface of the bell jar 4.

[0085] At least the first exhaust holes 222 are arranged at intervals along the circumferential direction of the side plate 22 to form a first annular exhaust structure 223, and the first annular exhaust structure 223 is parallel to the top plate 21 along the Z-axis direction. By providing the first annular exhaust structure 223, more airflow paths can be formed in the circumferential direction of the side plate 22, thereby improving the heat dissipation efficiency around the edge 42 of the bell jar. The improvement of heat dissipation efficiency is conducive to increasing the adsorption efficiency of the bell jar 4 on impurity particles, reducing the risk of Peeling phenomenon, reducing the number of times maintenance personnel clean and maintain the bell jar 4, and is conducive to extending the maintenance cycle of the bell jar 4 and improving the working efficiency of semiconductor equipment.

[0086] See also Fig.15 , Fig.15 To clean the projection of the assembly along the XZ plane, in this embodiment, the top cover 2 is a cylinder, the side plate 22 is unfolded into a rectangle, and the first annular exhaust structure 223 is a circular ring structure.

[0087] It can be understood that the shape of the first annular exhaust structure 223 can be flexibly changed according to the shape of the top cover 2, including but not limited to circle, triangle, rectangle and polygon.

[0088] In one embodiment, see Figure 8 The first annular exhaust structure 223 includes two circles, which are arranged at intervals along the height direction of the side plate 22, and the height direction of the side plate 22 is along the positive direction of the Z axis.

[0089] The first annular exhaust structure 223 has at least two circles, for example, the number of the first annular exhaust structure 223 is two, three, four or more circles.

[0090] In this embodiment, the first annular exhaust structure 223 has two circles, and the two circles of the first annular exhaust structure 223 are arranged in an array, that is, the first exhaust holes 222 in the first annular exhaust structure 223 are arranged along the X-axis direction according to a certain rule, such as equal spacing, equal angles, etc., to ensure the stability and coordination of the overall structure.

[0091] In one embodiment, the arrangement of the first annular exhaust structure 223 is an oblique arrangement, that is, the arrangement between the first exhaust holes 222 in the first annular exhaust structure 223 is neither horizontal nor vertical, but arranged along a certain inclination angle, for example, arranged at intervals in a direction inclined at 30 degrees to the Z axis. The oblique arrangement helps to improve the gas discharge effect. When the gas moves upward, an airflow will be formed. The oblique arrangement of the first annular exhaust structure 223 can improve the distribution of the airflow in the heat dissipation cavity 5, avoid the situation where the local airflow is too large or too small, and the oblique arrangement can accelerate the gas discharge speed, so that the gas is discharged from the heat dissipation cavity 5 faster, and reduce the residence time in the heat dissipation cavity 5. In one embodiment, the arrangement of the first annular exhaust structure 223 is a mixed arrangement, that is, the first exhaust holes 222 in the first annular exhaust structure 223 are all arranged irregularly along the X-axis direction.

[0092] The plurality of first annular exhaust structures 223 can form more airflow paths at the bottom of the bell jar 4, so that the temperature of the bell jar 4 surface is uniform; at the same time, the heat dissipation efficiency is increased by accelerating the gas circulation. The improvement of the heat dissipation effect is conducive to increasing the adsorption efficiency of the bell jar 4 on impurity particles, reducing the risk of Peeling phenomenon, reducing the number of times maintenance personnel clean and maintain the bell jar 4, and is conducive to extending the maintenance cycle of the bell jar 4 and improving the working efficiency of semiconductor equipment.

[0093] In one embodiment, see Fig.15, a second exhaust hole 212 is provided on the top plate 21, the cross section of the second exhaust hole 212 along the X-axis direction is circular, and the cross section of the second exhaust hole 212 along the Z-axis direction is rectangular. It can be understood that the cross section shape of the second exhaust hole 212 along the X-axis direction can be flexibly selected, such as square, circular, triangular, polygonal or other shapes; the cross section shape of the second exhaust hole 212 along the Z-axis direction can be flexibly selected, such as rectangular, trapezoidal, inverted trapezoidal, rectangular with chamfers or other shapes.

[0094] In one embodiment, the number of the second exhaust hole 212 is one, and the second exhaust hole 212 is annular to form a second annular exhaust structure 213 . The second annular exhaust structure 213 is consistent with the shape of the top plate 21 , and the second annular exhaust structure 213 is coaxially arranged with the top plate 21 .

[0095] In one embodiment, the number of the second exhaust hole 212 is one, and the second exhaust hole 212 is annular to form a second annular exhaust structure 213 . The second annular exhaust structure 213 is consistent with the shape of the top plate 21 , and the second annular exhaust structure 213 and the top plate 21 are concentric circles.

[0096] In one embodiment, the number of the second exhaust holes 212 is at least two, for example, the number of the second exhaust holes 212 is two, three, four or more. At least two second exhaust holes 212 are arranged in an annular manner to form a second annular exhaust structure 213, and the second annular exhaust structure 213 is consistent with the shape of the top plate 21, and the second annular exhaust structure 213 is coaxially arranged with the top plate 21.

[0097] In one embodiment, the number of the second exhaust holes 212 is at least two, for example, the number of the second exhaust holes 212 is two, three, four or more. At least two second exhaust holes 212 are arranged in an annular manner to form a second annular exhaust structure 213, and the second annular exhaust structure 213 is consistent with the shape of the top plate 21, and the second annular exhaust structure 213 and the top plate 21 are concentric circles.

[0098] Further, whether it is a second annular exhaust structure 213 formed by a single second exhaust hole 212 or a second annular exhaust structure 213 formed by two or more second exhaust holes 212, the second annular exhaust structure 213 is located at the periphery of the air inlet 211. When the cleaning component 100 is working, the fan blade 32 drives the air to generate airflow, and the airflow enters the heat dissipation cavity 5 from the air inlet channel 6. The airflow absorbs and takes away the heat on the surface of the bell jar 4. The second annular exhaust structure 213 is located at the periphery of the air inlet 211, which can more effectively discharge the hot air and form a good air circulation channel. This layout helps to reduce air flow resistance and improve air circulation efficiency; and the second annular exhaust structure 213 is located at the periphery of the air inlet 211 to ensure that hot air or heat is quickly discharged, avoiding accumulation inside the heat dissipation cavity 5, thereby improving the heat dissipation effect and protecting the cleaning component 100 from overheating damage. The improvement of the heat dissipation effect is conducive to increasing the adsorption efficiency of the bell jar 4 on impurity particles, reducing the risk of Peeling phenomenon, reducing the number of times maintenance personnel clean and maintain the bell jar 4, and is conducive to extending the maintenance cycle of the bell jar 4 and improving the working efficiency of semiconductor equipment.

[0099] In one embodiment, see Fig.15 The top plate 21 is provided with second exhaust holes 212, and the number of the second exhaust holes 212 is at least two, for example, the number of the second exhaust holes 212 is two, three, four or more. At least two second exhaust holes 212 are arranged in an annular manner to form a second annular exhaust structure 213, and the second annular exhaust structure 213 is consistent with the shape of the top plate 21, and the second annular exhaust structure 213 is coaxially arranged with the top plate 21.

[0100] The second annular exhaust structure 213 has at least two circles, for example, the number of the second annular exhaust structure 213 is two, three, four or more circles, and at least two circles of the second annular exhaust structure 213 are arranged at intervals along the direction of the rotation axis of the fan blade 32, and the rotation axis of the fan blade 32 is Figure 3 Line A in.

[0101] In this embodiment, the second annular exhaust structure 213 has two circles, and the two circles of the second annular exhaust structure 213 are arranged in an array, that is, the second exhaust holes 212 in the second annular exhaust structure 213 are arranged in a certain direction according to a certain rule, such as equal spacing, equal angles, etc., to ensure the stability and coordination of the overall structure. Providing at least two circles of the second annular exhaust structure 213 is conducive to increasing the airflow path in the heat dissipation cavity 5, forming a larger vortex size at the top of the heat dissipation cavity 5, thereby improving the heat dissipation efficiency. The improvement of heat dissipation performance is conducive to increasing the adsorption efficiency of the bell jar 4 for impurity particles, reducing the risk of Peeling phenomenon, reducing the number of times maintenance personnel clean and maintain the bell jar 4, and is conducive to extending the maintenance cycle of the bell jar 4 and improving the working efficiency of semiconductor equipment.

[0102] In one embodiment, the second annular exhaust structure 213 is arranged in an oblique arrangement, that is, the arrangement between the second exhaust holes 212 in the second annular exhaust structure 213 is neither horizontal nor vertical, but arranged along a certain inclination angle, for example, arranged at intervals in a direction inclined at 30 degrees to the X-axis.

[0103] In one embodiment, the second annular exhaust structure 213 is arranged in a mixed arrangement, that is, the second exhaust holes 212 in the second annular exhaust structure 213 are arranged irregularly along the X-axis direction.

[0104] In one embodiment, see Fig.15 , the second annular exhaust structure 213 is a circular ring structure, and the ratio of the maximum outer diameter of all the second annular exhaust structures 213 arranged on the top plate 21 to the projected diameter of the bell jar 4 toward the fan 3 is in the range of 80% to 120%. This arrangement can ensure that the second annular exhaust structure 213 has a relatively suitable size ratio within the coverage range of the bell jar 4, and the airflow generated by the fan 3 is discharged relatively smoothly through the second annular exhaust structure 213. If the outer diameter of the second annular exhaust structure 213 is too small, it will limit the exhaust path of the gas, causing the gas to accumulate inside the equipment and reduce the air circulation efficiency; and if the outer diameter of the second annular exhaust structure 213 is too large, it may cause the cleaning component 100 to have an unreasonable structure, increase unnecessary space occupation, and may also affect the layout of other components inside the cleaning component 100 and the effective guidance of air.

[0105] In one embodiment, the ratio of the minimum inner diameter of all the second annular exhaust structures 213 provided on the top plate 21 to the diameter of the first air outlet 61 is in the range of 200% to 300%. The airflow will be effectively dispersed when passing through the second annular exhaust structure 213, thereby forming a more uniform airflow distribution at the first air outlet 61, which helps to reduce airflow turbulence and eddy currents and improve exhaust efficiency; the second annular exhaust structure 213 with a larger inner diameter helps to reduce the resistance of the airflow when passing through, so that the airflow can flow out more smoothly, thereby improving the heat dissipation performance of the cleaning component 100. The improvement of heat dissipation performance is conducive to increasing the adsorption efficiency of the bell jar 4 for impurity particles, reducing the risk of Peeling phenomenon, reducing the number of times maintenance personnel clean and maintain the bell jar 4, and is conducive to extending the maintenance cycle of the bell jar 4 and improving the working efficiency of semiconductor equipment.

[0106] In one embodiment, see Fig.16The cleaning assembly 100 further includes a mesh cover 9, which is fixedly connected to the top plate 21. The fixing method can be flexibly selected, such as welding, slot fixing, screw fixing or other fixing methods. In this embodiment, the mesh cover 9 covers the air inlet 211, which can reduce dust from entering the heat dissipation cavity and prevent workers' clothes, long hair, gloves or other body parts from accidentally contacting the high-speed rotating fan blades, thereby reducing the possibility of serious cuts, tears or even entanglement accidents.

[0107] It is understandable that when the fan 3 is located outside the heat dissipation cavity 5 , the mesh cover 9 will cover the air inlet of the fan channel 33 .

[0108] In one embodiment, see Figure 3 and Fig. 9 In the cleaning assembly 100, the height of the top cover 2 is greater than or equal to 1.5 times the height of the bell cover 4. The height of the bell cover 4 refers to the vertical distance from the highest point of the bell cover raised surface 41 along the Z-axis direction to the horizontal plane where the bell cover edge 42 is located. It can be understood that since there are many choices for the shape of the top cover 2, the height of the top cover 2 also has different definitions. For example, when the top cover 2 is a regular cylinder, the height of the top cover 2 is the height of the side of the regular cylinder.

[0109] The top cover 2 is relatively high, and the space in the heat dissipation cavity 5 is relatively large, so that the size of the vortex formed by the second exhaust hole 212 inside the heat dissipation cavity can be increased, thereby achieving a better cooling effect for the cleaning component. The optimization of the cooling effect is conducive to increasing the adsorption efficiency of the bell cover 4 on impurity particles, reducing the risk of Peeling phenomenon, reducing the number of times maintenance personnel clean and maintain the bell cover 4, and is conducive to extending the maintenance cycle of the bell cover 4 and improving the working efficiency of semiconductor equipment.

[0110] The present application also provides a semiconductor device. Fig.17 The semiconductor device includes a housing 200, a process base 300 and a cleaning component 100 of any one of the above embodiments. The housing 200 and the bell jar 4 are enclosed to form a main cavity 210, and the process base 300 is accommodated in the main cavity 210. The process base 300 is used to hold wafers. The wafer cleaning reaction in the main cavity 210 generates a large amount of heat. The cleaning component 100 is arranged outside the housing 200, which can take away the heat on the bell jar 4 in time, thereby facilitating the continuous cleaning reaction.

[0111] See also Fig.17 In one embodiment, the semiconductor device further includes a vacuum pump 400. When the semiconductor device is working, the vacuum pump 400 pumps the main chamber 210 into a vacuum environment, which is beneficial to the cleaning of the wafer in the main chamber 210.

[0112] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A cleaning component, applied to semiconductor equipment, characterized in that: Includes top cover, fan and bell cover; The top cover and the bell cover enclose a heat dissipation cavity, the top cover is provided with an air inlet hole, the fan channel in the fan is connected with the air inlet hole to form an air inlet channel, the air inlet channel is connected with the heat dissipation cavity, and when the fan is working, the air is driven to enter the heat dissipation cavity through the air inlet channel; The air outlet of the air inlet channel is a first air outlet, the first air outlet faces the bell cover, and the ratio of the area of ​​the first air outlet to the projection area of ​​the bell cover toward the fan is in the range of 10% to 20%.

2. The cleaning assembly according to claim 1, characterized in that: The top cover comprises a top plate and a side plate, the top plate and the bell cover are arranged opposite to each other, the side plate is located between the top plate and the bell cover, the top plate, the side plate and the bell cover enclose the heat dissipation cavity, and the air inlet is arranged on the top plate; The fan is arranged in the heat dissipation cavity, and the air inlet of the fan is connected to the air inlet hole.

3. The cleaning assembly according to claim 2, characterized in that: The fan includes a shell and fan blades, the shell encloses the fan channel, the fan blades are accommodated in the fan channel, the ratio of the rotation area of ​​the fan blades to the projection area of ​​the bell cover toward the fan direction is greater than 20%, the air outlet of the fan is the second air outlet, along the direction from the air inlet of the fan channel to the second air outlet, at least part of the inner wall of the shell is inclined in the direction close to the rotation axis of the fan blades, and the second air outlet is the first air outlet.

4. The cleaning assembly according to any one of claims 1 to 3, characterized in that: The ratio of the minimum distance between the first air outlet and the bell jar to the height of the top jar is in the range of 5% to 40%.

5. The cleaning assembly according to any one of claims 1 to 4, characterized in that: The top cover comprises a top plate and a side plate, the top plate and the bell cover are arranged opposite to each other, and the side plate is located between the top plate and the bell cover; The cleaning assembly includes a fixing seat, the fixing seat is connected to the top cover and the bell cover, the fixing seat is connected to the edge of the bell cover, and the top plate, the side plate, the bell cover and the fixing seat are enclosed to form the heat dissipation cavity; The side plate is provided with a first exhaust hole, and the distance between the first exhaust hole and the fixing seat is less than 30% of the height of the top cover.

6. The cleaning assembly according to claim 5, characterized in that: The number of the first exhaust holes is at least three, and the at least three first exhaust holes are arranged at intervals along the circumferential direction of the side plate to form a first annular exhaust structure.

7. The cleaning assembly according to claim 6, characterized in that: The first annular exhaust structure has at least two circles, and is arranged at intervals along the height direction of the side plate.

8. The cleaning assembly according to claim 5, characterized in that: The top plate is provided with a second exhaust hole; The number of the second exhaust holes is one, and the second exhaust holes are in an annular shape to form a second annular exhaust structure; or, the number of the second exhaust holes is at least two, and the at least two second exhaust holes are arranged in an annular shape and spaced apart to form a second annular exhaust structure; The second annular exhaust structure is located at the periphery of the air inlet.

9. The cleaning assembly according to claim 8, characterized in that: The second annular exhaust structure has at least two circles, and is arranged at intervals along the rotation axis direction of the fan.

10. The cleaning assembly according to claim 8 or 9, characterized in that: The second annular exhaust structure is a circular ring structure, the projection of the bell cover toward the fan is circular, the first air outlet is a circular opening, the maximum value of the outer diameter of the second annular exhaust structure arranged on the top plate and the projection diameter of the bell cover toward the fan are in the range of 80% to 120%, and / or the minimum value of the inner diameter of the second annular exhaust structure arranged on the top plate and the diameter of the first air outlet are in the range of 200% to 300%.

11. The cleaning assembly according to any one of claims 1 to 4, characterized in that: The cleaning component comprises a mesh cover, the mesh cover is fixedly connected to the top cover, and the mesh cover covers the air inlet hole or the air inlet of the fan channel.

12. The cleaning assembly according to any one of claims 1 to 4, characterized in that: The height of the top cover is greater than or equal to 1.5 times the height of the bell cover.

13. A semiconductor device, characterized in that: The cleaning component comprises the cleaning component as described in any one of claims 1 to 12, and further comprises a casing and a process base, wherein the casing and the bell cover of the cleaning component enclose a main cavity, the process base is located in the main cavity, and the process base is used to carry wafers.

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