Hemispherical harmonic oscillator batch polishing device

Abstract

The invention discloses a batch polishing device for hemispherical harmonic oscillators. The batch polishing device comprises a base, an inner polishing module, an outer polishing module and a clamping module. A plurality of clamping mechanisms of the clamping module are used for clamping the hemispherical harmonic oscillators, and a linear driving mechanism of the outer polishing module drives a base to move in the Z direction, so that a plurality of outer polishing mechanisms abut against the outer spherical surfaces of the corresponding harmonic oscillators and outer anchor rods; a linear driving mechanism of the inner polishing module drives a movable seat to move in the Y direction, so that a plurality of inner polishing mechanisms extend into the corresponding harmonic oscillator spaces and abut between the inner spherical surface of the hemispherical harmonic oscillator and the inner anchor rod; a rotation driving mechanism of the clamping module drives a clamping mechanism to rotate so as to drive the hemispherical harmonic oscillators to rotate in the circumferential direction, so that the outer polishing mechanism polishes the outer spherical surfaces and the outer anchor rods of the corresponding hemispherical harmonic oscillators, and the inner polishing mechanism polishes the inner spherical surfaces and the inner anchor rods of the corresponding hemispherical harmonic oscillators. According to the invention, the processing efficiency can be effectively improved, and the consistency of the morphology of the harmonic oscillator is maintained.

Description

Technical Field

[0001] The invention relates to the technical field of hemispherical gyroscope preparation, and in particular to a hemispherical resonator batch polishing device. Background Art

[0002] The hemispherical resonator gyroscope is an advanced inertial navigation sensor with the characteristics of high reliability, high precision, long life and low noise. It is a type of gyroscope widely used in the navigation, guidance and control systems of various strategic / tactical weapons in the fields of aviation, aerospace, navigation and ground. The hemispherical resonator is the core component of the hemispherical resonator gyroscope. The material is high-purity fused quartz, which has the characteristics of high hardness and brittleness and high surface morphology requirements. The preparation process is time-consuming, the production cost is high, and the processing technology is complex. Therefore, it is difficult to form a stable mass production method, especially in the polishing process of the inner and outer spherical surfaces of the hemispherical resonator. The process requirements are difficult to control, and the consistency of the morphology of the processed resonator is not ideal. Summary of the invention

[0003] In view of the problems in the background technology, the present invention proposes a hemispherical resonator batch polishing device which can effectively improve the processing efficiency and the consistency of the resonator morphology.

[0004] The present invention adopts the following technical solutions:

[0005] A hemispherical resonator batch polishing device comprises: a base, an inner polishing module, an outer polishing module and a clamping module;

[0006] The clamping module includes a rotation driving mechanism and a mounting plate fixed on a base, and a plurality of clamping mechanisms rotatably mounted on the mounting plate, wherein the plurality of clamping mechanisms are arranged at intervals along the X direction, and the clamping mechanisms are used to clamp the hemispherical resonator so that the hemispherical resonator is arranged axially along the Y direction;

[0007] The external polishing module comprises: a Z-direction linear driving mechanism, a base connected to the Z-direction linear driving mechanism, and a plurality of external polishing mechanisms installed on the base, wherein the plurality of external polishing mechanisms are arranged at intervals along the X-direction and correspond to the plurality of clamping mechanisms one by one, the external polishing mechanisms are located below the corresponding clamping mechanisms, and the Z-direction linear driving mechanism is used to drive the base to move along the Z-direction so that the external polishing mechanisms abut against the outer spherical surface and the outer anchor rod of the corresponding resonator;

[0008] The internal polishing module comprises: a Y-direction linear driving mechanism, a movable seat connected to the Y-direction linear driving mechanism, and a plurality of internal polishing mechanisms mounted on the movable seat, wherein the plurality of internal polishing mechanisms are arranged at intervals along the X-direction and correspond to the plurality of clamping mechanisms one by one, and the Y-direction linear driving mechanism is used to drive the movable seat to move along the Y-direction so that the internal polishing mechanism extends into the corresponding resonator space and abuts between the inner spherical surface of the hemispherical resonator and the inner anchor rod;

[0009] The rotation drive mechanism of the clamping module is transmission-connected with a plurality of clamping mechanisms, and is used to drive the clamping mechanisms to rotate to drive the hemispherical resonator to rotate circumferentially, so that the external polishing mechanism polishes the outer spherical surface and outer anchor rod of the corresponding hemispherical resonator, and the internal polishing mechanism polishes the inner spherical surface and inner anchor rod of the corresponding hemispherical resonator.

[0010] As a further improvement of the above technical solution:

[0011] The outer polishing mechanism includes an outer polishing base and an outer polishing skin. The upper surface of the outer polishing base forms an outer profiling surface, which cooperates with 1 / 8-1 / 5 of the outer circumferential wall of the hemispherical resonator. The outer polishing skin is bonded to the outer profiling surface, which includes an outer anchor rod bonding portion bonded to the outer anchor rod of the hemispherical resonator and an outer spherical surface bonding portion bonded to the outer spherical surface of the hemispherical resonator. The outer anchor rod bonding portion and the outer spherical surface bonding portion are connected by a rounded transition.

[0012] A plurality of grooves are provided on the upper surface of the base, and the plurality of grooves correspond to the plurality of external polishing mechanisms one by one. The lower part of the external polishing base is clamped in the grooves, and the external polishing base is fixedly connected to the base by fasteners.

[0013] There are two Z-direction linear drive mechanisms, which are arranged at both ends of the base in the X direction. The Z-direction linear drive mechanism includes a Z-direction screw rod and an adjusting nut. The base and the adjusting nut are passed through the Z-direction screw rod, and the base is supported on the adjusting nuts of the two Z-direction linear drive mechanisms.

[0014] The inner polishing mechanism includes an inner polishing base and an inner polishing skin. The inner polishing base forms an inner profiling surface on one end surface facing the hemispherical resonator. The inner profiling surface cooperates with 1 / 8-1 / 5 of the inner circumference of the hemispherical resonator. The inner polishing skin is bonded to the inner profiling surface, which includes an inner anchor rod bonding portion bonded to the inner anchor rod of the hemispherical resonator and an inner spherical surface bonding portion bonded to the inner spherical surface of the hemispherical resonator. The inner anchor rod bonding portion and the inner spherical surface bonding portion are connected with each other through a rounded transition at one end facing the hemispherical resonator.

[0015] The inner polishing module also includes a plurality of mold seats, which are fixed on the movable seat, and one end of the inner polishing substrate away from the hemispherical resonator is fixed on the corresponding mold seat.

[0016] The Y-axis linear drive mechanism includes a direct-drive motor and a slide rail installed on a base, and a Y-axis lead screw connected to the direct-drive motor. The Y-axis lead screw and the slide rail are arranged along the Y direction. The movable seat is slid on the slide rail and is threadedly connected to the Y-axis lead screw. The direct-drive motor is used to drive the Y-axis lead screw to rotate so that the movable seat slides on the slide rail.

[0017] The clamping mechanism includes a main shaft, a clamp and a rotating rod, the main shaft passes through the mounting plate and is rotatably connected to the mounting plate through a bearing;

[0018] The clamp comprises a mounting portion and a clamping portion. A mounting hole is provided at one end of the clamping portion facing the hemispherical resonator, and the mounting hole matches with the end of the outer anchor rod of the hemispherical resonator. A plurality of side grooves connected with the mounting hole are provided on the side wall of the clamping portion. The plurality of side grooves are arranged at intervals along the circumference of the clamp. The side grooves penetrate the end surface of the clamping portion facing the hemispherical resonator in the axial direction, so that the clamping portion is composed of a plurality of clamping blocks.

[0019] The end face of the main shaft facing one end of the hemispherical resonator is provided with a receiving groove that cooperates with the clamp, and the clamp is located in the receiving groove. The outer wall of the clamping part forms a first conical surface, and the outer diameter of the first conical surface gradually decreases from the end close to the hemispherical resonator to the end far away from the hemispherical resonator. The side groove wall of the receiving groove and the corresponding part of the clamping part form a second conical surface that cooperates with the first conical surface. The rotating rod is connected to the main shaft for rotation, and its upper part passes through the main shaft and then extends into the receiving groove and is threadedly connected with the mounting part. When the rotating rod rotates, it drives the clamp to move along the Y direction until the clamping part extends out or extends into the receiving groove, so that the multiple clamping blocks are retracted or opened to clamp or loosen the hemispherical resonator.

[0020] The rotating drive mechanism includes a rotating motor, a main pulley, a belt and multiple slave pulleys. The multiple slave pulleys correspond to the multiple clamps one by one. The slave pulley is passed through the end of the corresponding main shaft facing away from the hemispherical resonator and is detachably fixed to the main shaft. The main pulley is transmission-connected to the rotating motor, and the belt is tensioned between the main pulley and the multiple slave pulleys.

[0021] It also includes a coolant module, which includes a liquid tank opened on the base, a water pump installed in the liquid tank, and a plurality of spray pipe mechanisms connected to the water pump. The plurality of spray pipe mechanisms correspond one to one with the plurality of clamping mechanisms. The spray pipe mechanisms are fixed on the mounting plate, and the liquid outlets thereof are aligned with the hemispherical resonators on the corresponding clamping mechanisms.

[0022] Compared with the prior art, the advantages of the present invention are:

[0023] The present invention can effectively realize the synchronous and batch polishing of the inner and outer surfaces of the hemispherical resonator, which not only effectively improves the work efficiency, but also greatly improves the consistency of the morphology of the batch-processed resonators; and, the inner and outer surfaces (including the inner anchor rod, the inner spherical surface, the outer anchor rod and the outer spherical surface) are synchronously polished, the coaxiality of the hemispherical resonator is better, and its Q value can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to make the present invention more easily understood, the present invention will be described in more detail by referring to the specific embodiments shown in the accompanying drawings. These drawings only depict typical embodiments of the present invention and should not be considered as limiting the scope of protection of the present invention.

[0025] Figure 1 It is a schematic diagram of the three-dimensional structure of a hemispherical resonator batch polishing device according to an embodiment of the present invention.

[0026] Figure 2 This is a schematic perspective view of another angle of the batch polishing device for hemispherical resonators according to an embodiment of the present invention.

[0027] Figure 3 This is a schematic partial sectional view of the batch polishing device for hemispherical resonators according to an embodiment of the present invention.

[0028] Figure 4 This is a schematic view of the external polishing mechanism.

[0029] Figure 5 This is a schematic view of the external polishing module.

[0030] Figure 6 This is a schematic view of the Z-direction screw rod.

[0031] Figure 7 This is a schematic view of the internal polishing mechanism.

[0032] Figure 8 This is a schematic view of the internal polishing module.

[0033] Figure 9 This is a schematic perspective view of the clamping module.

[0034] Figure 10 This is a schematic perspective view of another angle of the clamping module.

[0035] Figure 11 This is a schematic view of the hemispherical resonator to be polished.

[0036] Figure 12 This is a schematic perspective view of the fixture.

[0037] Figure 13 This is a schematic sectional view of the fixture.

[0038] Figure 14 This is a schematic perspective view of the base.

[0039] Reference numerals:

[0040] 230, base; 220, mounting plate; 210, base; 210-1, groove; 201, movable seat; 103, outer polished base; 105, outer polished skin; 1051, outer anchor rod fitting part; 1052, outer spherical fitting part; 211, fastener; 212, Z-axis screw rod; 213, adjusting nut; 102, inner polished base; 104, inner polished skin; 1041, inner anchor rod fitting part; 1042, inner spherical fitting part; 106, mold base; 207, direct drive motor; 202, slide rail; 203, Y-axis screw rod; 109, spindle; 109-1, accommodating groove; 109-2, second conical surface; 110, fixture; 110-1, mounting hole; 110-2, mounting part; 110-3, clamping part; 110-4, side groove;

[0041] 110-5, first conical surface; 111, rotating rod; 112, bearing; 240, rotating motor; 247, main pulley; 241, belt; 113, slave pulley; 230-2, liquid tank; 244, water pump; 242, spray pipe mechanism; DETAILED DESCRIPTION

[0042] The following describes the implementation modes of the present invention with reference to the accompanying drawings so that those skilled in the art can better understand the present invention and implement it. However, the enumerated embodiments are not intended to limit the present invention. In the absence of conflict, the following embodiments and the technical features in the embodiments may be combined with each other, wherein the same components are represented by the same figure marks.

[0043] like Figures 1 - 14 As shown, the hemispherical resonator batch polishing device of this embodiment includes: a base 230, an inner polishing module, an outer polishing module and a clamping module;

[0044] The clamping module includes a rotation driving mechanism and a mounting plate 220 fixed on a base 230, and a plurality of clamping mechanisms rotatably mounted on the mounting plate 220, wherein the plurality of clamping mechanisms are arranged at intervals along the X direction, and the clamping mechanisms are used to clamp the hemispherical resonator so that the axial direction of the hemispherical resonator is arranged along the Y direction;

[0045] The external polishing module includes: a Z-direction linear driving mechanism, a base 210 connected to the Z-direction linear driving mechanism, and a plurality of external polishing mechanisms installed on the base 210, wherein the plurality of external polishing mechanisms are arranged at intervals along the X-direction and correspond to the plurality of clamping mechanisms one by one, and the external polishing mechanisms are located below the corresponding clamping mechanisms, and the Z-direction linear driving mechanism is used to drive the base 210 to move along the Z-direction so that the external polishing mechanisms abut against the outer spherical surface and the outer anchor rod of the corresponding resonator;

[0046] The internal polishing module comprises: a Y-direction linear driving mechanism, a movable seat 201 connected to the Y-direction linear driving mechanism, and a plurality of internal polishing mechanisms mounted on the movable seat 201, wherein the plurality of internal polishing mechanisms are arranged at intervals along the X-direction and correspond one to one with the plurality of clamping mechanisms, and the Y-direction linear driving mechanism is used to drive the movable seat 201 to move along the Y-direction, so that the internal polishing mechanism extends into the corresponding resonator space and abuts between the inner spherical surface of the hemispherical resonator and the inner anchor rod;

[0047] The rotation drive mechanism of the clamping module is transmission-connected with a plurality of clamping mechanisms, and is used to drive the clamping mechanisms to rotate to drive the hemispherical resonator to rotate circumferentially, so that the external polishing mechanism polishes the outer spherical surface and outer anchor rod of the corresponding hemispherical resonator, and the internal polishing mechanism polishes the inner spherical surface and inner anchor rod of the corresponding hemispherical resonator.

[0048] Therefore, the hemispherical resonator batch polishing device of this embodiment can effectively realize the synchronous and batch polishing of the inner and outer surfaces of the hemispherical resonator, which not only effectively improves the work efficiency, but also greatly improves the consistency of the morphology of the batch-processed resonators; and, the inner and outer surfaces (including the inner anchor rod, the inner spherical surface, the outer anchor rod and the outer spherical surface) are polished synchronously, the coaxiality of the hemispherical resonator is better, and its Q value can be improved.

[0049] In this embodiment, Figure 4 As shown, the outer polishing mechanism includes an outer polishing base 103 and an outer polishing skin 105. The upper surface of the outer polishing base 103 forms an outer profiling surface, which cooperates with 1 / 8-1 / 5 of the outer peripheral wall of the hemispherical resonator. The outer polishing skin 105 is attached to the outer profiling surface, which includes an outer anchor rod attachment portion 1051 attached to the outer anchor rod of the hemispherical resonator, and an outer spherical surface attachment portion 1052 attached to the outer spherical surface of the hemispherical resonator. The outer anchor rod attachment portion 1051 and the outer spherical surface attachment portion 1052 are connected by a rounded transition.

[0050] The outer polishing base 103 of the resonator adopts a lathe tool profiling directional design, so that it can be in vertical direction and can well contact the outer spherical surface and outer anchor column of the resonator, so as to perform polishing work. The manufacturing method is that the outer polishing skin 105 is bonded to the outer polishing base 103, so that it is combined into a new integral tool, which can not only meet the polishing of the outer spherical surface of the resonator but also complete the polishing of the outer anchor rod cylinder, thereby effectively solving the defect that the transition between the outer anchor rod cylinder and the outer spherical surface cannot be accurately polished in the existing process.

[0051] In this embodiment, Figure 5 As shown, the upper surface of the base 210 is provided with a plurality of grooves 210 - 1 , which correspond one-to-one to the plurality of external polishing mechanisms. The lower portion of the external polishing base 103 is clamped in the groove 210 - 1 , and the external polishing base 103 is fixedly connected to the base 210 by fasteners 211 .

[0052] In this embodiment, there are two Z-direction linear driving mechanisms, which are respectively arranged at both ends of the base 210 in the X direction. The Z-direction linear driving mechanism includes a Z-direction screw rod 212 and an adjusting nut 213. The base 210 and the adjusting nut 213 are sleeved on the Z-direction screw rod 212, and the base 210 is supported on the adjusting nuts 213 of the two Z-direction linear driving mechanisms.

[0053] The assembly process of the outer polishing module is as follows:

[0054] Position a plurality of outer polishing substrates 103 in the corresponding grooves 210-1 of the base 210 and fix them to the base 210 through fasteners 211. Then, put the base 210 into the Z-direction screw rod 212 and perform effective adjustment in the up and down direction through the adjusting nut 213, so that the outer polishing leather 105 contacts the outer spherical surface and the outer anchor rod of the hemispherical resonator 101, and the polishing work is completed. The main innovation is reflected in the multi-purpose of one mold and the matching with the inner spherical surface polishing module, which can effectively improve the work efficiency, reduce the time cost, and reduce the risk, etc.

[0055] In addition, a positioning boss 212-1 is added to the Z-direction screw rod 212 in the structural design, and its main function is for the precision assembly of the outer polishing module to ensure its position accuracy.

[0056] In this embodiment, as Figure 7 shown, the inner polishing mechanism includes an inner polishing substrate 102, an inner polishing leather 104. One end surface of the inner polishing substrate 102 facing the hemispherical resonator forms an inner profiling surface, which cooperates with the 1 / 8-1 / 5 inner peripheral wall of the hemispherical resonator. The inner polishing leather 104 is attached to the inner profiling surface, and it includes an inner anchor rod attaching portion 1041 that fits with the inner anchor rod of the hemispherical resonator and an inner spherical surface attaching portion 1042 that fits with the inner spherical surface of the hemispherical resonator. The ends of the inner anchor rod attaching portion 1041 and the inner spherical surface attaching portion 1042 facing the hemispherical resonator are connected by a rounded corner transition.

[0057] The inner polishing substrate 102 of the resonator is designed by copying the shape with a turning tool in a directional manner, so that it can be in a horizontal direction and can well contact the inner spherical surface and the inner anchor rod of the resonator, thereby performing the polishing work. The production method is that the inner polishing leather 104 is bonded to the inner polishing substrate 102 to form a new integral tool, which can not only meet the polishing of the inner spherical surface of the resonator but also complete the polishing of the inner anchor rod cylindrical surface, thus effectively solving the defect that the transition between the inner anchor rod cylindrical surface and the inner spherical surface in the existing process cannot be precisely polished.

[0058] The inner polishing module further includes a plurality of mold bases 106. The mold bases 106 are fixed on the movable seat 201, and one end of the inner polishing substrate 102 away from the hemispherical resonator is fixed in the corresponding mold bases 106.

[0059] In this embodiment, as Figures 1 - 3As shown, the Y-axis linear drive mechanism includes a direct-drive motor 207 and a slide rail 202 installed on a base 230, and a Y-axis lead screw 203 transmission-connected to the direct-drive motor 207. The Y-axis lead screw 203 and the slide rail 202 are both arranged along the Y-direction. The movable seat 201 is slidably disposed on the slide rail 202 and is threadedly connected to the Y-axis lead screw 203. The direct-drive motor 207 is used to drive the Y-axis lead screw 203 to rotate so that the movable seat 201 slides on the slide rail 202.

[0060] The assembly process of the internal polishing module is as follows:

[0061] Multiple mold bases 106 are installed on the movable base 201, mainly positioned by the positioning groove 106-2 on the movable base 201, and then fastened by the mold base fixing screw 107, and then the inner polishing base 102 is installed in the slot of the mold base 106, fit through the mold base installation base surface 106-1, and then fixed by the adjustment screw 108 to complete the installation. The main innovation is reflected in the multi-purpose of one mold, which can effectively improve work efficiency, reduce time cost, reduce risks, etc.

[0062] In this embodiment, Figure 9 and Figure 10 As shown, the clamping mechanism includes a main shaft 109, a clamp 110 and a rotating rod 111. The main shaft 109 passes through the mounting plate 220 and is rotatably connected to the mounting plate 220 through a bearing 112;

[0063] In this embodiment, Figure 11 As shown, a process clamp 101-1 is added to the shape design of the hemispherical resonator before polishing, which is used for the assembly relationship of the fixture 110, so that it can well maintain the requirements during rotation and the coaxial accuracy of the resonator itself.

[0064] like Figure 12 and Figure 13 As shown, the clamp 110 includes a mounting portion 110-2 and a clamping portion 110-3. The clamping portion 110-3 is provided with a mounting hole 110-1 at one end thereof facing the hemispherical resonator. The mounting hole 110-1 matches with the process clamping position 101-1 of the hemispherical resonator. The side wall of the clamping portion 110-3 is provided with a plurality of side grooves 110-4 connected with the mounting hole 110-1. The plurality of side grooves 110-4 are arranged at intervals along the circumference of the clamp 110. The side grooves 110-4 penetrate the end surface of the clamping portion 110-3 in the axial direction facing the hemispherical resonator, so that the clamping portion 110-3 is divided into a plurality of clamping blocks.

[0065] The end surface of the main shaft 109 facing the hemispherical resonator is provided with a receiving groove 109-1 matched with the clamp 110, and the clamp 110 is located in the receiving groove 109-1. The outer wall of the clamping portion 110-3 forms a first conical surface 110-5. The outer diameter of the first conical surface 110-5 gradually decreases from the end close to the hemispherical resonator to the end far from the hemispherical resonator. The side groove wall of the receiving groove 109-1 and the corresponding part of the clamping portion 110-3 form a first conical surface 110-5. The second conical surface 109-2 is formed to match the first conical surface 110-5, and the rotary rod 111 is rotatably connected to the main shaft 109. The upper part of the rotary rod 111 passes through the main shaft 109 and extends into the accommodating groove 109-1 and is threadedly connected to the mounting portion 110-2. When the rotary rod 111 rotates, it drives the clamp 110 to move along the Y direction until the clamping portion 110-3 extends out or extends into the accommodating groove 109-1, so that the multiple clamping blocks are retracted or opened to clamp or loosen the hemispherical resonator.

[0066] A mounting hole 110-1 is designed and added on the basis of the fixture 110, so that it can be effectively and precisely assembled with the hemispherical resonator, and is mainly used to position the depth and size of the resonator during clamping to achieve an overall effect.

[0067] The mounting plate 220 adopts an L-shaped structural design, which mainly includes a bearing hole 220-3, a limiting T-slot 220-1, and a faucet fixing hole 220-2. It is fixed to the base 230 by the mainboard fastening screws 221. The limiting column 222 can be adjusted up and down through the limiting T-slot 220-1, and is mainly used to protect and limit the travel space of the outer spherical polishing module so that it reaches a critical point.

[0068] In this embodiment, the rotating drive mechanism includes a rotating motor 240, a main pulley 247, a belt 241 and multiple slave pulleys 113. The multiple slave pulleys 113 correspond one by one to the multiple clamps 110. The slave pulleys 113 are passed through the end of the corresponding main shaft 109 that is away from the hemispherical resonator and are detachably fixed to the main shaft 109. The main pulley 247 is connected to the rotating motor 240 by transmission, and the belt 241 is tensioned between the main pulley 247 and the multiple slave pulleys 113.

[0069] In this embodiment, a cooling liquid module is also included, which includes a liquid tank 230-2 opened on the base 230, a water pump 244 installed in the liquid tank 230-2, and a plurality of spray pipe mechanisms 242 connected to the water pump 244. The plurality of spray pipe mechanisms 242 correspond one-to-one to the plurality of clamping mechanisms. The spray pipe mechanisms 242 are fixed on the mounting plate 220, and the liquid outlets thereof are aligned with the hemispherical resonators on the corresponding clamping mechanisms.

[0070] like Figure 14As shown in the figure, on the base 230, there are a spindle motor mounting platform 230-1, a direct drive bearing block mounting station 230-3, an external polishing module mounting platform 230-4, a clamping module mounting platform 230-5, a slide rail mounting area 230-6, and a direct drive motor mounting platform 230-7. It can effectively load each module, thus realizing an integrated whole machine device.

[0071] The assembly process of the device of the present invention is as follows:

[0072] Step 1: First, install the main body part. Install the bearing 112 on the spindle 109, keep the protruding length of the spindle consistent, then insert the transmission key 114 into the keyway of the spindle 109, align the belt pulley with the position of the transmission key 114 and insert the driven belt pulley 113 again. Then, install the above combined part into the mounting plate 220 as a whole through the bearing 112 to realize the rotational connection between the spindle 109 and the mounting plate 220. Then, install the whole together on the main board mounting platform 230-5 of the base 230 and complete the fixation through the main board fastening screw 221. Then, put one end of the transmission belt 241 onto the main belt pulley 247 of the rotating motor 240, and the other end is sleeved and tensioned on each driven belt pulley 113 so that each spindle 109 can rotate simultaneously, and then complete the fixation through the spindle motor fixing screw 243. Then, insert the rotating rod 111 and the fixture 110 into the spindle 109 in sequence. By rotating the rotating rod 111, the clamping force of the fixture 110 can be effectively controlled. So far, the main body part has been assembled.

[0073] Step 2: Then, install the internal polishing module part. First, install the slide rail 202 on the slide rail mounting area 230-6 and fix it through the slide rail fixing screw 204. Then, insert multiple mold bases 106 into the positioning slots 106-2 of the movable seat 201 in sequence and complete the fixation through the mold base fixing screw 107. One end of the movable seat 201 facing the Y-direction linear driving mechanism is provided with a threaded hole 201-1, and then install the whole onto the Y-direction lead screw 203 and the slide rail 202. Then, continue to install the direct drive motor 207 on the direct drive motor mounting platform 230-7 and complete the fixation through the direct drive motor fixing screw 206. In addition, a limit switch 205 is installed on the base to ensure that the movable seat 201 slides along the Y-direction on the slide rail 202 until it abuts against the connection between the inner spherical surface of the hemispherical resonator and the inner anchor rod at the front end of the internal polishing mechanism and then stops running to avoid crushing the hemispherical resonator 101. Then, install the internal polishing base body 102 together with the internal polishing leather 104 onto the mold base mounting base surface 106-1 to make its mounting surface in zero contact. Finally, install the adjusting screw 108 to fasten the internal spherical surface polishing base body 102 to complete the assembly.

[0074] Step 3: Next, install the external polishing module part. First, install the Z-axis lead screw 212 on the external polishing module installation platform 230-4 and complete the assembly through the lead screw fastening screw 214. Then, insert the external polishing base body 103 together with the external polishing leather 105 into the groove 210-1 of the base 210, and sequentially tighten each external polishing base body 103 through the fastener 211 to complete the installation. Then, install the adjusting nut 213 onto the Z-axis lead screw 212, then put the base 210 onto the Z-axis lead screw 212 as a whole, and finally insert the limit post 222 into the limit T-shaped groove 220-1 for adjustment to complete the assembly.

[0075] Step 4: Finally, install the coolant module. First, install multiple spray pipe mechanisms 242 on the corresponding nozzle fixing holes 220-2, then cover the cover plate 231, and finally connect the water pump 244.

[0076] The specific process of realizing batch internal and external polishing of the hemispherical resonator by the device of the present invention is as follows:

[0077] 1) Load the hemispherical resonator 101 to be polished into the fixture 110, which can be achieved by rotating the rotating rod 111 to complete the installation.

[0078] 2) Adjust the base 210 upward through the adjusting nut 213 so that the external polishing leather 105 contacts the external area of the hemispherical resonator 101.

[0079] 3) Control the linear motion of the movable seat 201 through the direct drive motor 207 so that the internal polishing leather 104 contacts the internal area of the hemispherical resonator 101.

[0080] 4) Turn on the water pump 244 so that the spray pipe mechanism 242 sprays evenly on the surface of the hemispherical resonator 101.

[0081] 5) Turn on the rotating motor 240, drive the driven pulley 113 by the belt 241, and then drive multiple main shafts to rotate simultaneously, thus realizing an efficient method of multi-station and multi-batch and simultaneously completing the internal and external area polishing of the hemispherical resonator 101 at one time.

[0082] The above-described embodiments are only relatively preferred specific implementation manners of the present invention. The present specification uses phrases such as "in one embodiment", "in another embodiment", "in yet another embodiment", or "in other embodiments", which may all refer to one or more of the same or different embodiments according to the present disclosure. Ordinary changes and substitutions made by those skilled in the art within the scope of the technical solution of the present invention should be included in the protection scope of the present invention.

Claims

1. A hemispherical resonator batch polishing device, characterized in that: include: A base (230), an inner polishing module, an outer polishing module and a clamping module; The clamping module comprises a rotation driving mechanism and a mounting plate (220) fixed on a base (230), and a plurality of clamping mechanisms rotatably mounted on the mounting plate (220), the plurality of clamping mechanisms being arranged at intervals along the X direction, and the clamping mechanisms being used to clamp the hemispherical resonator so that the axial direction of the hemispherical resonator is arranged along the Y direction; The external polishing module comprises: a Z-direction linear drive mechanism, a base (210) connected to the Z-direction linear drive mechanism in a transmission manner, and a plurality of external polishing mechanisms mounted on the base (210), wherein the plurality of external polishing mechanisms are arranged at intervals along the X-direction and correspond one-to-one to the plurality of clamping mechanisms, the external polishing mechanisms are located below the corresponding clamping mechanisms, and the Z-direction linear drive mechanism is used to drive the base (210) to move along the Z-direction so that the external polishing mechanisms abut against the outer spherical surface and the outer anchor rod of the corresponding resonator; The internal polishing module comprises: a Y-direction linear driving mechanism, a movable seat (201) connected to the Y-direction linear driving mechanism, and a plurality of internal polishing mechanisms mounted on the movable seat (201), wherein the plurality of internal polishing mechanisms are arranged at intervals along the X-direction and correspond one to one with the plurality of clamping mechanisms, and the Y-direction linear driving mechanism is used to drive the movable seat (201) to move along the Y-direction so that the internal polishing mechanism extends into the corresponding resonator space and abuts against the inner spherical surface of the hemispherical resonator and the inner anchor rod; The rotation drive mechanism of the clamping module is transmission-connected with a plurality of clamping mechanisms, and is used to drive the clamping mechanisms to rotate to drive the hemispherical resonator to rotate circumferentially, so that the external polishing mechanism polishes the outer spherical surface and outer anchor rod of the corresponding hemispherical resonator, and the internal polishing mechanism polishes the inner spherical surface and inner anchor rod of the corresponding hemispherical resonator.

2. The hemispherical resonator batch polishing device according to claim 1 is characterized in that: The outer polishing mechanism comprises an outer polishing base (103) and an outer polishing skin (105); the upper surface of the outer polishing base (103) forms an outer profiling surface, the outer profiling surface cooperates with 1 / 8-1 / 5 of the outer peripheral wall of the hemispherical resonator; the outer polishing skin (105) is attached to the outer profiling surface, and comprises an outer anchor rod attaching portion (1051) attached to the outer anchor rod of the hemispherical resonator, and an outer spherical surface attaching portion (1052) attached to the outer spherical surface of the hemispherical resonator; the outer anchor rod attaching portion (1051) and the outer spherical surface attaching portion (1052) are connected by a fillet transition.

3. The hemispherical resonator batch polishing device according to claim 2, characterized in that: The upper surface of the base (210) is provided with a plurality of grooves (210-1), the plurality of grooves (210-1) correspond one-to-one to the plurality of external polishing mechanisms, the lower portion of the external polishing base (103) is clamped in the grooves (210-1), and the external polishing base (103) and the base (210) are fixedly connected via fasteners (211).

4. The hemispherical resonator batch polishing device according to claim 1, characterized in that: Two Z-direction linear drive mechanisms are provided, and the two Z-direction linear drive mechanisms are respectively arranged at two ends of the base (210) in the X direction. The Z-direction linear drive mechanisms include a Z-direction screw rod (212) and an adjusting nut (213). The base (210) and the adjusting nut (213) are passed through the Z-direction screw rod (212), and the base (210) is supported on the adjusting nuts (213) of the two Z-direction linear drive mechanisms.

5. The hemispherical resonator batch polishing device according to claim 1, characterized in that: The inner polishing mechanism comprises an inner polishing base (102) and an inner polishing skin (104); an inner profiling surface is formed on the surface of one end of the inner polishing base (102) facing the hemispherical resonator, and the inner profiling surface cooperates with 1 / 8-1 / 5 of the inner circumference of the hemispherical resonator; the inner polishing skin (104) is attached to the inner profiling surface and comprises an inner anchor rod attaching portion (1041) attached to the inner anchor rod of the hemispherical resonator, and an inner spherical surface attaching portion (1042) attached to the inner spherical surface of the hemispherical resonator; the inner anchor rod attaching portion (1041) and the inner spherical surface attaching portion (1042) are connected at one end facing the hemispherical resonator through a rounded transition.

6. The hemispherical resonator batch polishing device according to claim 5, characterized in that: The internal polishing module also includes a plurality of mold seats (106), wherein the mold seats (106) are fixed on the movable seat (201), and an end of the internal polishing base (102) away from the hemispherical resonator is fixed on a corresponding mold seat (106).

7. The hemispherical resonator batch polishing device according to claim 1, characterized in that: The Y-direction linear drive mechanism comprises a direct drive motor (207) and a slide rail (202) installed on a base (230), and a Y-direction screw rod (203) connected to the direct drive motor (207) in a transmission manner. The Y-direction screw rod (203) and the slide rail (202) are both arranged along the Y direction. The movable seat (201) is slidably arranged on the slide rail (202) and is threadedly connected to the Y-direction screw rod (203). The direct drive motor (207) is used to drive the Y-direction screw rod (203) to rotate so that the movable seat (201) slides on the slide rail (202).

8. The hemispherical resonator batch polishing device according to claim 1, characterized in that: The clamping mechanism comprises a main shaft (109), a clamp (110) and a rotating rod (111); the main shaft (109) passes through the mounting plate (220) and is rotationally connected to the mounting plate (220) via a bearing (112); The clamp (110) comprises a mounting portion (110-2) and a clamping portion (110-3); a mounting hole (110-1) is provided at one end of the clamping portion (110-3) facing the hemispherical resonator; the mounting hole (110-1) matches the end of an outer anchor rod of the hemispherical resonator; a plurality of side grooves (110-4) in communication with the mounting hole (110-1) are provided on a side wall of the clamping portion (110-3); the plurality of side grooves (110-4) are arranged at intervals along the circumference of the clamp (110); the side grooves (110-4) penetrate the end surface of the clamping portion (110-3) in the axial direction facing the hemispherical resonator, so that the clamping portion (110-3) is divided into a plurality of clamping blocks; The end surface of the main shaft (109) facing one end of the hemispherical resonator is provided with a receiving groove (109-1) matched with the clamp (110), the clamp (110) is located in the receiving groove (109-1), the outer wall of the clamping portion (110-3) forms a first conical surface (110-5), the outer diameter of the first conical surface (110-5) gradually decreases from the end close to the hemispherical resonator to the end far from the hemispherical resonator, and the side groove wall of the receiving groove (109-1) and the part corresponding to the clamping portion (110-3) form a first conical surface (110-5). The second conical surface (109-2) is formed to match the first conical surface (110-5), the rotating rod (111) is rotatably connected to the main shaft (109), the upper part of which passes through the main shaft (109) and then extends into the receiving groove (109-1) and is threadedly connected to the mounting portion (110-2), and when the rotating rod (111) rotates, it drives the clamp (110) to move along the Y direction until the clamping portion (110-3) partially extends out or extends into the receiving groove (109-1), so that the multiple clamping blocks are retracted or opened to clamp or loosen the hemispherical resonator.

9. The hemispherical resonator batch polishing device according to claim 8, characterized in that: The rotation driving mechanism comprises a rotating motor (240), a main pulley (247), a belt (241) and a plurality of slave pulleys (113); the plurality of slave pulleys (113) correspond to the plurality of clamps (110) one by one; the slave pulleys (113) are passed through one end of the corresponding main shaft (109) which is away from the hemispherical resonator and are detachably fixedly connected to the main shaft (109); the main pulley (247) is transmission-connected to the rotating motor (240); and the belt (241) is tensioned between the main pulley (247) and the plurality of slave pulleys (113).

10. The hemispherical resonator batch polishing device according to any one of claims 1 to 9, characterized in that: The invention also includes a cooling liquid module, which includes a liquid tank (230-2) opened on the base (230), a water pump (244) installed in the liquid tank (230-2), and a plurality of spray pipe mechanisms (242) connected to the water pump (244), wherein the plurality of spray pipe mechanisms (242) correspond to the plurality of clamping mechanisms one by one, and the spray pipe mechanisms (242) are fixed on the mounting plate (220), and the liquid outlets thereof are aligned with the hemispherical resonators on the corresponding clamping mechanisms.

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