A high-precision single-crystal silicon wafer processing cutting device and cutting method thereof

Abstract

The present invention relates to the technical field of single crystal silicon wafer processing, and provides a high-precision single crystal silicon wafer processing cutting device and a cutting method thereof, comprising a workbench and a mounting seat; a mounting seat is fixed to the top of the workbench, a position moving assembly is fixed to the top of the mounting seat, a clamping structure is provided at the top of the position moving assembly, a driving motor is installed on one side of the clamping structure, a height moving assembly is installed on one side of the top of the workbench, a cutting assembly is installed on one side of the height moving assembly, a tensioning assembly is provided at the rear end of the cutting assembly, the clamping structure comprises a mounting frame, and a mounting frame is installed on one side of the top of the position moving assembly. The present invention is provided with a clamping structure, and when slicing a single crystal silicon rod, the single crystal silicon rod can be initially clamped by using a first clamping plate, and the two sets of second clamping plates can be driven to move to the middle position by the coordinated use of a bidirectional screw and a screw sleeve, thereby performing a secondary clamping on the single crystal silicon rod.

Description

Technical Field

[0001] The present invention relates to the technical field of single crystal silicon wafer processing, and in particular to a cutting device for high-precision single crystal silicon wafer processing and a cutting method thereof. Background Art

[0002] In recent years, with the rapid development of photovoltaic technology and micro-semiconductor inverter technology, the demand for monocrystalline silicon wafers has continued to increase. In particular, in the field of solar cells, monocrystalline silicon solar cells are highly favored due to their high photoelectric conversion efficiency and stable performance. At the same time, with the continuous development of the semiconductor industry, the application of monocrystalline silicon wafers in integrated circuit manufacturing is becoming more and more extensive. When cutting monocrystalline silicon wafers, it is necessary to use cutting equipment for monocrystalline silicon wafer processing.

[0003] However, there are still some problems with traditional cutting equipment for processing single crystal silicon wafers. When processing single crystal silicon wafers, they are usually sliced ​​from single crystal silicon rods. When cutting the single crystal silicon rods, they need to be clamped to ensure that the single crystal silicon rods do not shake during the cutting process to prevent the cutting accuracy from being affected by the shaking. However, although the traditional clamping block clamping structure can clamp the single crystal silicon rods, it is easy to cause the clamping to loosen due to the vibration generated by the cutting during long-term work, affecting the cutting accuracy. Therefore, a high-precision single crystal silicon wafer processing cutting equipment and a cutting method thereof are needed to solve the above problems. Summary of the Invention

[0004] The purpose of the present invention is to provide a high-precision cutting device for processing single crystal silicon wafers and a cutting method thereof, so as to solve the defect that when the existing cutting equipment for processing single crystal silicon wafers slices single crystal silicon rods, although the traditional clamping structure can clamp the single crystal silicon rods, it is easy to loosen the clamping due to the vibration generated by cutting during long-term operation, thereby affecting the cutting accuracy.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: a cutting device for high-precision single crystal silicon wafer processing, comprising a workbench and a mounting seat;

[0006] A mounting seat is fixed on the top of the workbench, a position moving assembly is fixed on the top of the mounting seat, a clamping structure is provided on the top of the position moving assembly, a driving motor is installed on one side of the clamping structure, and a height moving assembly is installed on one side of the top of the workbench;

[0007] A cutting assembly is installed on one side of the height moving assembly, and a tensioning assembly is provided at the rear end of the cutting assembly. The clamping structure includes a mounting frame, a mounting frame is installed on one side of the top of the position moving assembly, and the bottom end of the mounting frame is fixed to the surface of the wire sleeve inside the position moving assembly. A bidirectional screw is installed inside the mounting frame, and a screw sleeve is installed on the outside of the bidirectional screw. A second clamping plate is fixed to the top of the screw sleeve, and a mounting box is fixed on one side of the mounting frame. A worm gear is installed inside the mounting box, and one end of the worm gear is fixed to one end of the bidirectional screw. A worm is installed on one side of the worm gear, and a handle is installed on the top of the worm gear.

[0008] Preferably, a fixing block is installed on one side of the mounting frame, a slider is installed inside the fixing block, a first clamping plate is installed on the top of the slider, and a nut is installed on one side of the top of the slider.

[0009] Preferably, a suction hole is opened on one side of the internal cavity of the first clamping plate, a loop is fixed on one side of the first clamping plate, a piston is installed inside the loop, a fixing frame is installed on one side of the first clamping plate, and one end of the fixing frame is hinged to a connecting plate, one end of the connecting plate is hinged to one side of the piston, and a fixing plate is fixed on one side of the second clamping plate.

[0010] Preferably, a telescopic spring is fixed to one side of the other end of the connecting plate, one end of the telescopic spring is fixed to one side of the first clamping plate, the telescopic spring and one side of the first clamping plate form a telescopic structure, a rubber pad is installed on the other side of the first clamping plate, and a water inlet is installed on one side.

[0011] Preferably, the outer side of the bidirectional screw is provided with an external thread, the inner side of the screw sleeve is provided with an internal thread, and a threaded connection is formed between the screw sleeve and the bidirectional screw.

[0012] Preferably, two groups of the second clamping plates are provided, and the two groups of the second clamping plates are symmetrically distributed at the top of the mounting frame. A connecting rod is installed on one side of the mounting seat, and a connecting plate is installed on one end of the connecting rod. A cleaning sleeve is provided on one side of the connecting rod, and cleaning cotton is installed on one end of the cleaning sleeve. A single crystal silicon rod is inserted into the interior of the cleaning sleeve.

[0013] Preferably, a filtering structure is provided at the top of the workbench at the bottom end of the cutting assembly, and the filtering structure includes a filter box, which is installed on one side of the top of the workbench, and support frames are fixed on both sides of the top of the filter box, and a filter frame is installed at the middle position of the support frame, and a ceramic membrane is installed inside the filter frame. A servo motor is installed on one side of the support frame, and the output end of the servo motor is connected to one side of the filter frame.

[0014] Preferably, an extrusion disk is installed on the outside of the output end of the servo motor, a moving block is installed inside one side of the support frame, a guide block is installed on one side of the moving block, a connecting block is fixed on the top of the moving block, an impact plate is installed on one side of the bottom end of the connecting block, and reset springs are installed on both ends of one side of the bottom end of the connecting block, the bottom end of the reset spring is fixed to the top of the support frame, a collecting plate is inserted into the interior of the filter box, and a filter plate is inserted at the bottom end of the interior of the filter box.

[0015] Preferably, two groups of extrusion discs are provided, and the two groups of extrusion discs are symmetrically distributed on the outside of the output end of the connecting block.

[0016] Preferably, the cutting method of the high-precision single crystal silicon wafer cutting equipment comprises the following steps:

[0017] S1. When cutting a single crystal silicon wafer, first pass one end of the single crystal silicon ingot through the interior of the cleaning sleeve, then place it on the top of the mounting frame. After placement, move the first clamping plate so that one side of the first clamping plate is in contact with the outer side of one end of the single crystal silicon ingot. As the first clamping plate moves, it drives the slider to slide inside the fixed block. Once the first clamping plate is in contact, secure the nut to the bolt on the top of the slider, securing the first clamping plate and completing the initial clamping of the single crystal silicon ingot.

[0018] S2. After the initial clamping of the single crystal silicon ingot is completed, the handle is turned. This rotation drives the worm, which in turn rotates the bidirectional screw in conjunction with the worm wheel. The bidirectional screw, in conjunction with the screw sleeve, drives the two sets of second clamping plates toward the center, so that one side of the second clamping plate contacts one end of the single crystal silicon ingot, completing the secondary clamping of the single crystal silicon ingot.

[0019] S3. When the second clamping plate moves to one side, it will push one end of the connecting plate to move to one side and squeeze the telescopic spring to contract. Since the middle of the connecting plate is hinged to the fixed frame, the other end of the connecting plate will move to one side. When the other end of the connecting plate moves to the other side, it will drive the piston to move inside the looper, thereby sucking away the air in the internal cavity of the first clamping plate. At this time, the first clamping plate can form a temporary closed space with the outside of the single crystal silicon rod through the use of the suction hole. Since the air pressure in the closed space is reduced, a pressure difference is generated between it and the external atmospheric pressure. The external atmospheric pressure will firmly squeeze the single crystal silicon rod and the first clamping plate together. After the first clamping plate completes the initial clamping, the first clamping plate The rubber pad on one side will fit with the surface of the single crystal silicon rod. At this time, the staff will inject water into the inside of the rubber pad through the water inlet. When the first clamping plate is vacuum-adsorbed, the rubber pad will be squeezed, causing the water inside the rubber pad to flow out through the small holes on one side. There may be bumps or dust particles invisible to the naked eye on the contact surface between the first clamping plate and the single crystal silicon rod, causing air to penetrate inside. Water can fill these gaps, reducing the gap between the first clamping plate and the single crystal silicon rod, enhancing the sealing, preventing external air from entering the first clamping plate and destroying the vacuum state, and enhancing the adsorption effect, thereby achieving multiple clamping of the single crystal silicon rod, making it less likely for the single crystal silicon rod to move during processing, thereby improving the processing accuracy of the single crystal silicon rod;

[0020] S4. When the single crystal silicon rod is clamped, the external power supply starts the drive motor. After starting, the drive motor will drive the internal screw of the position moving component to rotate. When the screw rotates, it will cooperate with the wire sleeve to move the single crystal silicon rod on the top of the mounting frame to one side. The movement distance of the single crystal silicon rod is controlled by the control panel on the side of the mounting seat. When the drive motor rotates, it will drive the connecting disk to rotate through the belt. When the connecting disk rotates, it will drive the connecting rod to rotate. When the connecting rod rotates, it will drive the cleaning sleeve to rotate through the belt. A limited seat is set at the bottom of the cleaning sleeve to make the cleaning sleeve more stable during rotation. The cleaning sleeve is rotated. When the machine rotates, the dust, oxides and metal ion impurities on the surface of the single crystal silicon rod can be cleaned through the semiconductor blue brush inside. The setting of the semiconductor blue brush prevents the surface of the silicon rod from being contaminated again due to electrostatic adsorption during cleaning. As the single crystal silicon rod moves, the cleaning cotton can perform a secondary cleaning on the cleaned single crystal silicon rod, making the surface of the single crystal silicon rod cleaner during cutting. Cleaning the dust, oxides and metal ion impurities on the surface of the silicon rod can avoid burrs and micro cracks on the cut surface caused by interference from foreign matter during the cutting process, thereby ensuring the smoothness and flatness of the silicon wafer surface and achieving high-precision processing effects.

[0021] S5. When the single crystal silicon rod moves to the bottom of the cutting assembly, the cutting assembly is started. After starting, the cutting assembly will drive the diamond wire to rotate at high speed through the motor. When the diamond wire rotates, the height moving assembly is started to drive the cutting assembly downward to slice the single crystal silicon rod. During slicing, an external cooling pipe can be connected to spray coolant to cool the cut part of the single crystal silicon rod. When the single crystal silicon rod produces cooling waste liquid during slicing, it will fall into the inside of the filter frame. At this time, the use of ceramic membrane can filter the cooling waste liquid. The cooling waste liquid contains diamond grinding chips generated by the wear of the diamond wire and the single crystal silicon rod. Silicon chips generated by slicing, when treating the cooling waste liquid of silicon wafer cutting, the particle size of diamond chips is usually >0.5μm and the particle size of silicon chips is <0.3μm, so the ceramic membrane has a pore size of 0.4μm, which can filter the diamond chips and leave them on the surface of the ceramic membrane, while the silicon chips continue to fall into the interior of the filter box and are then filtered by the filter plate. The filter plate is a ceramic membrane with a pore size of 0.2μm, so the silicon chips can be filtered out, realizing the separation and filtration of diamond chips and silicon chips. The filtered cooling waste liquid is discharged through the drainage hole of the filter box and collected for secondary utilization;

[0022] S6. When it is necessary to collect diamond grinding chips, insert the collection plate into the interior of the filter box. After the insertion is completed, start the servo motor. After starting, the servo motor will drive the filter frame to slowly flip 180 degrees. When the filter frame is rotating, the servo motor will also drive the extrusion plate to rotate 180 degrees. When the extrusion plate rotates, it will squeeze the moving block to move upward. One side of the extrusion moving block is set with an arc, and one side of the extrusion plate is also set with an arc, so when it is squeezed, the moving block will move upward. When the moving block moves upward, it pushes the connecting block to move upward under the limit of the guide block. When the connecting block moves, it will drive the impact plate to move upward. When the filter frame rotates 180°, the moving block will be pulled back by the reset spring and inserted into the middle position of the two sets of extrusion disks. When the reset spring is pulled back, it will pull the impact plate back to its original position and hit both sides of the filter frame, causing the filter frame to vibrate violently, thereby vibrating the diamond chips filtered by the ceramic membrane to the surface of the collecting plate, completing the collection of the diamond chips. At this time, the collecting plate and the filter plate are pulled out to complete the separation, filtration and collection of the diamond chips and silicon chips, and finally complete the slicing of the single crystal silicon wafers.

[0023] The present invention provides a high-precision cutting device for processing single-crystal silicon wafers and a cutting method thereof. The advantages are: the provision of a clamping structure enables multiple clamping of single-crystal silicon rods, preventing the single-crystal silicon rods from easily moving during cutting; and the provision of a filtering structure enables the separation and filtration of diamond grinding chips and silicon chips in cooling wastewater, thereby achieving better separation and filtration effects.

[0024] By providing a clamping structure, when slicing a single crystal silicon rod, the first clamping plate can be used to initially clamp the single crystal silicon rod, and the two sets of second clamping plates can be driven to move to the middle position by the cooperation of the bidirectional screw and the screw sleeve, thereby performing a secondary clamping of the single crystal silicon rod;

[0025] Furthermore, when the second clamping plate moves, it pushes one end of the connecting plate to one side, causing the other end to move to the other side, thereby driving the piston to move inside the looper and sucking out the air in the internal cavity of the first clamping plate. At this time, the first clamping plate can form a temporary closed space with the outside of the single crystal silicon rod through the use of the suction hole. Since the air pressure in the closed space is reduced, a pressure difference is generated between it and the external atmospheric pressure. The external atmospheric pressure will firmly squeeze the single crystal silicon rod and the first clamping plate together, thereby achieving the final clamping of the single crystal silicon rod, making it difficult for the single crystal silicon rod to move around during clamping and affect the accuracy of slicing.

[0026] Furthermore, when the driving motor rotates, it drives the cleaning sleeve to rotate through the connecting rod. When the cleaning sleeve rotates, it can clean the dust, oxides and metal ion impurities on the surface of the single crystal silicon rod through the semiconductor blue brush inside it. The setting of the semiconductor blue brush prevents the surface of the silicon rod from being polluted again due to electrostatic adsorption during cleaning. As the single crystal silicon rod moves, the cleaning cotton can be used to perform secondary cleaning on the cleaned single crystal silicon rod, so that the surface of the single crystal silicon rod is cleaner during cutting. By cleaning the dust, oxides and metal ion impurities on the surface of the silicon rod, burrs and micro cracks on the cut surface caused by interference from foreign matter during the cutting process can be avoided, thereby ensuring the smoothness and flatness of the silicon wafer surface, achieving high-precision processing effects, and thus improving the cutting accuracy.

[0027] By setting up a filtering structure, when recycling the cooling waste water, the cooling waste liquid can be filtered through the use of ceramic membrane. Since there are diamond grinding chips (particle size is usually >0.5μm) and silicon chips (particle size <0.3μm), the ceramic membrane has a pore size of 0.4μm, so the diamond grinding chips are filtered and remain on the surface of the ceramic membrane, while the silicon chips continue to fall into the interior of the filter box and are then filtered by the filter plate. The filter plate has a pore size of 0.2μm, so the silicon chips can be filtered down, realizing the separation and filtration of diamond grinding chips and silicon chips, thereby completing the filtration work. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention;

[0029] Figure 2 A schematic top view of the three-dimensional structure of the present invention;

[0030] Figure 3This is a schematic diagram of the three-dimensional structure of the present invention when viewed from above;

[0031] Figure 4 This is a schematic diagram of the three-dimensional structure of the clamping structure of the present invention;

[0032] Figure 5 For the present invention Figure 4 A in the middle is a partial enlarged schematic diagram of the three-dimensional structure;

[0033] Figure 6 This is a schematic diagram of a partial three-dimensional structure of the clamping structure of the present invention;

[0034] Figure 7 This is a schematic diagram of a partial cross-section of the three-dimensional structure of the clamping structure of the present invention;

[0035] Figure 8 For the present invention Figure 7 A partial enlarged schematic diagram of the three-dimensional structure at point B in the middle;

[0036] Figure 9 This is a schematic diagram of the three-dimensional structure of the clamping structure of the present invention from a top view;

[0037] Figure 10 This is a schematic diagram of the three-dimensional structure of the handle of the present invention in a side view;

[0038] Figure 11 This is a schematic diagram of the three-dimensional structure of the filtering structure of the present invention;

[0039] Figure 12 This is a schematic diagram of a three-dimensional structure of a front cross-section of the filtering structure of the present invention;

[0040] Figure 13 It is a schematic diagram of the three-dimensional structure of the side cross-section of the filtering structure of the present invention;

[0041] Figure 14 A schematic diagram of the three-dimensional structure of the squeeze disk of the present invention from a side view;

[0042] Figure 15 This is a schematic side view of the three-dimensional structure of the first clamping plate of the present invention.

[0043] Explanation of the reference numerals in the figure: 1. workbench; 2. mounting base; 3. drive motor; 4. clamping structure; 401. mounting frame; 402. cleaning sleeve; 403. cleaning cotton; 404. connecting rod; 405. connecting plate; 406. bidirectional screw; 407. fixing block; 408. nut; 409. first clamping plate; 4010. slider; 4011. suction hole; 4012. second clamping plate; 4013. screw sleeve; 4014. fixing plate; 4015. telescopic spring; 4016. connecting plate; 4017. fixing frame; 4018. piston; 4019. slip sleeve ;4020, handle; 4021, worm gear; 4022, worm; 4023, installation box; 5, position moving assembly; 6, filtering structure; 601, servo motor; 602, support frame; 603, connecting block; 604, return spring; 605, impact plate; 606, filter frame; 607, ceramic membrane; 608, moving block; 609, extrusion plate; 6010, collecting plate; 6011, filter plate; 6012, guide block; 6013, filter box; 7, cutting assembly; 8, height moving assembly; 9, tensioning assembly; 10, rubber pad; 11, water inlet. DETAILED DESCRIPTION

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0045] See also Figures 1-15 The present invention provides a high-precision cutting equipment for single crystal silicon wafer processing and a cutting method thereof, which include a workbench 1 and a mounting base 2; the mounting base 2 is fixed to the top of the workbench 1, the top of the mounting base 2 is fixed to a position moving component 5, the top of the position moving component 5 is provided with a clamping structure 4, a driving motor 3 is installed on one side of the clamping structure 4, a height moving component 8 is installed on one side of the top of the workbench 1; a cutting component 7 is installed on one side of the height moving component 8, and a tensioning component 9 is provided at the rear end of the cutting component 7.

[0046] The clamping structure 4 includes a mounting frame 401, a mounting frame 401 is installed on one side of the top of the position moving component 5, the bottom end of the mounting frame 401 is fixed to the surface of the internal thread sleeve of the position moving component 5, a bidirectional screw 406 is installed inside the mounting frame 401, a screw sleeve 4013 is installed on the outside of the bidirectional screw 406, a second clamping plate 4012 is fixed to the top of the screw sleeve 4013, a mounting box 4023 is fixed on one side of the mounting frame 401, a worm gear 4021 is installed inside the mounting box 4023, one end of the worm gear 4021 is fixed to one end of the bidirectional screw 406, and the worm gear A worm 4022 is installed on one side of 4021, a handle 4020 is installed on the top of the worm 4022, a fixed block 407 is installed on one side of the mounting frame 401, a slider 4010 is installed inside the fixed block 407, a first clamping plate 409 is installed on the top of the slider 4010, a nut 408 is installed on one side of the top of the slider 4010, a suction hole 4011 is opened on one side of the internal cavity of the first clamping plate 409, a looper 4019 is fixed on one side of the first clamping plate 409, a piston 4018 is installed inside the looper 4019, and a first clamping plate 409 is installed on one side. There is a fixing frame 4017, and one end of the fixing frame 4017 is hinged to a connecting plate 4016, one end of the connecting plate 4016 is hinged to one side of the piston 4018, a fixing plate 4014 is fixed to one side of the second clamping plate 4012, and a telescopic spring 4015 is fixed to one side of the other end of the connecting plate 4016, one end of the telescopic spring 4015 is fixed to one side of the first clamping plate 409, and the telescopic spring 4015 and one side of the first clamping plate 409 form a telescopic structure, and a rubber pad 10 is installed on the other side of the first clamping plate 409, and a water injection port is installed on one side of the rubber pad 10 11. The outer side of the bidirectional screw 406 is provided with an external thread, and the inner side of the screw sleeve 4013 is provided with an internal thread. The screw sleeve 4013 and the bidirectional screw 406 are threadedly connected. Two sets of second clamping plates 4012 are provided, and the two sets of second clamping plates 4012 are symmetrically distributed at the top of the mounting frame 401. A connecting rod 404 is installed on one side of the mounting seat 2, and a connecting plate 405 is installed at one end of the connecting rod 404. A cleaning sleeve 402 is provided on one side of the connecting rod 404, and a cleaning cotton 403 is installed at one end of the cleaning sleeve 402. A single crystal silicon rod is inserted into the interior of the cleaning sleeve 402;

[0047] Reference Figures 1-10 and Figure 15As shown: when cutting a single crystal silicon wafer, first pass one end of the single crystal silicon rod through the interior of the cleaning sleeve 402, and then place one end of the single crystal silicon rod on the top of the mounting frame 401. After placing it, move the first clamping plate 409 so that one side of the first clamping plate 409 is in contact with the outer side of one end of the single crystal silicon rod. When the first clamping plate 409 moves, it will drive the slider 4010 to slide inside the fixed block 407. When the first clamping plate 409 is in contact, fix the nut 408 on the bolt at the top of the slider 4010 to fix the first clamping plate 409, thereby completing the preliminary clamping of the single crystal silicon rod. When the preliminary clamping of the single crystal silicon rod is completed, turn the handle 4020. When the handle 4020 is turned When the worm 4022 is rotated, the worm 4022 drives the bidirectional screw 406 to rotate by cooperating with the worm wheel 4021. When the bidirectional screw 406 rotates, it can drive the two sets of second clamping plates 4012 to move to the middle position by cooperating with the screw sleeve 4013, so that one side of the second clamping plate 4012 is attached to one end of the single crystal silicon rod, completing the secondary clamping of the single crystal silicon rod. When the second clamping plate 4012 moves to one side, it pushes one end of the connecting plate 4016 to move to one side and squeezes the telescopic spring 4015 to contract. Since the middle of the connecting plate 4016 is hinged to the fixing frame 4017, the other end of the connecting plate 4016 will move to one side. When the other end of the connecting plate 4016 moves to the other side, it will drive the piston 4018 to move inside the looper 4019, thereby sucking away the air in the internal cavity of the first clamping plate 409. At this time, the first clamping plate 409 can form a temporary closed space with the outside of the single crystal silicon rod through the use of the suction hole 4011. Since the air pressure in the closed space is reduced, a pressure difference is generated between the air pressure and the external atmospheric pressure. The external atmospheric pressure will firmly squeeze the single crystal silicon rod and the first clamping plate 409 together. After the first clamping plate 409 completes the initial clamping, the rubber pad 10 on one side of the first clamping plate 409 will fit with the surface of the single crystal silicon rod. At this time, the staff will pour water through the water inlet. 11 is injected into the interior of the rubber pad 10. When the first clamping plate 409 is vacuum-adsorbed, the rubber pad 10 is squeezed, causing the water inside the rubber pad 10 to flow out through the small holes on one side. The contact surface between the first clamping plate 409 and the single crystal silicon rod may have bumps or dust particles that are invisible to the naked eye, causing air to penetrate into the interior. The water can fill these gaps, reducing the gap between the first clamping plate 409 and the single crystal silicon rod, enhancing the sealing, preventing external air from entering the first clamping plate 409 and destroying the vacuum state, and enhancing the adsorption effect, thereby achieving multiple clamping of the single crystal silicon rod, making it less likely for the single crystal silicon rod to move during processing, thereby improving the processing accuracy of the single crystal silicon rod;

[0048] When the single crystal silicon rod is clamped, the external power supply starts the driving motor 3. After starting, the driving motor 3 will drive the internal screw of the position moving component 5 to rotate. When the screw rotates, it will move the single crystal silicon rod on the top of the mounting bracket 401 to one side through the cooperation with the wire sleeve. The moving distance of the single crystal silicon rod is controlled by the control panel on the side of the mounting seat 2. When the driving motor 3 rotates, it will drive the connecting disk 405 to rotate through the belt. When the connecting disk 405 rotates, it will drive the connecting rod 404 to rotate. When the connecting rod 404 rotates, it will drive the cleaning sleeve 402 to rotate through the belt. A limited seat is set at the bottom end of the cleaning sleeve 402, so that the cleaning sleeve 402 can be more stable when rotating. The cleaning sleeve 402 is more stable. When the cleaning sleeve 402 rotates, the semiconductor blue brush inside it can clean the dust, oxides and metal ion impurities on the surface of the single crystal silicon rod. The setting of the semiconductor blue brush prevents the surface of the silicon rod from being contaminated by electrostatic adsorption during cleaning. As the single crystal silicon rod moves, the cleaning cotton 403 can perform a secondary cleaning on the cleaned single crystal silicon rod, making the surface of the single crystal silicon rod cleaner during cutting. By cleaning the dust, oxides and metal ion impurities on the surface of the silicon rod, burrs and micro cracks on the cut surface caused by interference from foreign matter during the cutting process can be avoided, thereby ensuring the smoothness and flatness of the silicon wafer surface and achieving high-precision processing effects.

[0049] A filter structure 6 is provided at the top of the workbench 1 at the bottom of the cutting assembly 7. The filter structure 6 includes a filter box 6013. The filter box 6013 is installed on one side of the top of the workbench 1. Support frames 602 are fixed on both sides of the top of the filter box 6013. A filter frame 606 is installed in the middle of the support frame 602. A ceramic membrane 607 is installed inside the filter frame 606. A servo motor 601 is installed on one side of the support frame 602. The output end of the servo motor 601 is connected to one side of the filter frame 606; an extrusion disk 609 is installed on the outside of the output end of the servo motor 601, and a ceramic membrane 607 is installed inside one side of the support frame 602. It is equipped with a moving block 608, a guide block 6012 is installed on one side of the moving block 608, a connecting block 603 is fixed to the top of the moving block 608, an impact plate 605 is installed on one side of the bottom end of the connecting block 603, and return springs 604 are installed on both ends of one side of the bottom end of the connecting block 603. The bottom end of the return spring 604 is fixed to the top of the support frame 602. A collecting plate 6010 is inserted into the interior of the filter box 6013, and a filter plate 6011 is inserted into the bottom end of the interior of the filter box 6013; two groups of extrusion disks 609 are provided, and the two groups of extrusion disks 609 are symmetrically distributed on the outside of the output end of the connecting block 603.

[0050] Reference Figure 11-14As shown: when the single crystal silicon rod moves to the bottom end of the cutting assembly 7, the cutting assembly 7 is started. After starting, the cutting assembly 7 will drive the diamond wire to rotate at high speed through the motor. When the diamond wire rotates, the height moving assembly 8 is started to drive the cutting assembly 7 to move downward to slice the single crystal silicon rod. During slicing, an external cooling pipe can be connected to spray coolant to cool the cut part of the single crystal silicon rod. When the single crystal silicon rod generates cooling waste liquid during slicing, it will fall into the inside of the filter frame 606. At this time, the use of ceramic membrane 607 can filter the cooling waste liquid. The cooling waste liquid contains diamond grinding chips generated by the wear of the diamond wire and silicon chips generated by the single crystal silicon rod during slicing. When the cooling waste liquid of silicon wafer cutting is processed, the diamond grinding The particle size of chips is usually >0.5μm and the particle size of silicon chips is <0.3μm, so the ceramic membrane 607 has a pore size of 0.4μm, which can filter the diamond chips and make the diamond chips remain on the surface of the ceramic membrane 607, while the silicon chips continue to fall into the interior of the filter box 6013 and are then filtered by the filter plate 6011. The filter plate 6011 is a ceramic membrane with a pore size of 0.2μm, so the silicon chips can be filtered down to achieve separation and filtration of diamond chips and silicon chips. The filtered cooling waste liquid is discharged through the drainage hole of the filter box 6013 and collected for secondary utilization. When it is necessary to collect the diamond chips, the collection plate 6010 is inserted into the interior of the filter box 6013. The insertion is completed Then start the servo motor 601. After starting, the servo motor 601 will drive the filter frame 606 to slowly flip 180 degrees. When the filter frame 606 is rotating, the servo motor 601 will also drive the extrusion disk 609 to rotate 180 degrees. When the extrusion disk 609 rotates, it will squeeze the moving block 608 to move upward. One side of the extrusion moving block 608 is provided with an arc, and one side of the extrusion disk 609 is also provided with an arc, so when it is squeezed, the moving block 608 will move upward. When the moving block 608 moves upward, it pushes the connecting block 603 to move upward under the limit of the guide block 6012. When the connecting block 603 moves, it will drive the impact plate 605 to move upward. When the impact plate 605 moves upward, When the filter frame 606 rotates 180 degrees, the moving block 608 is inserted into the middle position of the two sets of extrusion disks 609 under the pull of the returning spring 604. When the returning spring 604 is pulled back, the impact plate 605 is pulled back to its original position and hits the two sides of the filter frame 606, causing the filter frame 606 to vibrate violently, thereby vibrating the diamond grinding chips filtered by the ceramic membrane 607 to fall to the surface of the collecting plate 6010, completing the collection of the diamond grinding chips. At this time, the collecting plate 6010 and the filter plate 6011 are pulled out to complete the separation, filtration and collection of the diamond grinding chips and silicon chips, and finally complete the slicing of the single crystal silicon wafer.

[0051] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-precision single crystal silicon wafer processing cutting device, characterized by: It includes a workbench (1) and a mounting base (2); A mounting seat (2) is fixed to the top of the workbench (1), a position moving assembly (5) is fixed to the top of the mounting seat (2), a clamping structure (4) is provided at the top of the position moving assembly (5), a driving motor (3) is installed on one side of the clamping structure (4), and a height moving assembly (8) is installed on one side of the top of the workbench (1); A cutting assembly (7) is installed on one side of the height moving assembly (8), and a tensioning assembly (9) is provided at the rear end of the cutting assembly (7). The clamping structure (4) includes a mounting frame (401), and a mounting frame (401) is installed on one side of the top of the position moving assembly (5). The bottom end of the mounting frame (401) is fixed to the surface of the inner thread sleeve of the position moving assembly (5). A bidirectional screw (406) is installed inside the mounting frame (401), and a screw sleeve (4013) is installed on the outer side of the bidirectional screw (406). The screw sleeve (401 3) is fixed with a second clamping plate (4012) at the top, a mounting box (4023) is fixed to one side of the mounting frame (401), a worm wheel (4021) is installed inside the mounting box (4023), one end of the worm wheel (4021) is fixed to one end of the bidirectional screw (406), a worm (4022) is installed on one side of the worm wheel (4021), a handle (4020) is installed on the top of the worm (4022), a fixing block (407) is installed on one side of the mounting frame (401), and the fixing block (407) is installed inside. A slider (4010) is installed, a first clamping plate (409) is installed on the top of the slider (4010), a suction hole (4011) is opened on one side of the internal cavity of the first clamping plate (409), a looper (4019) is fixed on one side of the first clamping plate (409), a piston (4018) is installed inside the looper (4019), a fixing frame (4017) is installed on one side of the first clamping plate (409), and one end of the fixing frame (4017) is hinged to a connecting plate (4016), and one end of the connecting plate (4016) is hinged to the One side of the piston (4018) is hinged, a fixing plate (4014) is fixed to one side of the second clamping plate (4012), a telescopic spring (4015) is fixed to one side of the other end of the connecting plate (4016), one end of the telescopic spring (4015) is fixed to one side of the first clamping plate (409), the telescopic spring (4015) and one side of the first clamping plate (409) form a telescopic structure, a rubber pad (10) is installed on the other side of the first clamping plate (409), and a water inlet (11) is installed on one side of the rubber pad (10).

2. The high-precision single crystal silicon wafer processing cutting device according to claim 1, characterized in that: A nut (408) is installed on one side of the top end of the slider (4010).

3. The high-precision single crystal silicon wafer processing cutting device according to claim 1, characterized in that: The outer side of the bidirectional screw (406) is provided with an external thread, and the inner side of the screw sleeve (4013) is provided with an internal thread, and a threaded connection is formed between the screw sleeve (4013) and the bidirectional screw (406).

4. The high-precision single crystal silicon wafer processing cutting device according to claim 1, characterized in that: Two groups of the second clamping plates (4012) are provided, and the two groups of the second clamping plates (4012) are symmetrically distributed at the top of the mounting frame (401). A connecting rod (404) is installed on one side of the mounting seat (2), and a connecting plate (405) is installed on one end of the connecting rod (404). A cleaning sleeve (402) is provided on one side of the connecting rod (404), and cleaning cotton (403) is installed on one end of the cleaning sleeve (402). A single crystal silicon rod is inserted into the interior of the cleaning sleeve (402).

5. The high-precision single crystal silicon wafer processing cutting device according to claim 4, characterized in that: A filtering structure (6) is provided at the top of the workbench (1) at the bottom end of the cutting assembly (7), and the filtering structure (6) comprises a filtering box (6013). The filtering box (6013) is mounted on one side of the top of the workbench (1), and supporting frames (602) are fixed on both sides of the top of the filtering box (6013). A filtering frame (606) is mounted at the middle position of the supporting frame (602), and a ceramic membrane (607) is mounted inside the filtering frame (606). A servo motor (601) is mounted on one side of the supporting frame (602), and an output end of the servo motor (601) is connected to one side of the filtering frame (606).

6. The high-precision single crystal silicon wafer processing cutting device according to claim 5, characterized in that: An extrusion disk (609) is installed on the outside of the output end of the servo motor (601), a moving block (608) is installed inside one side of the support frame (602), a guide block (6012) is installed on one side of the moving block (608), a connecting block (603) is fixed to the top end of the moving block (608), an impact plate (605) is installed on one side of the bottom end of the connecting block (603), return springs (604) are installed at both ends of one side of the bottom end of the connecting block (603), the bottom end of the return spring (604) is fixed to the top end of the support frame (602), a collecting plate (6010) is inserted into the interior of the filter box (6013), and a filter plate (6011) is inserted into the bottom end of the interior of the filter box (6013).

7. The high-precision single crystal silicon wafer processing cutting device according to claim 6, characterized in that: Two groups of the extrusion discs (609) are provided, and the two groups of the extrusion discs (609) are symmetrically distributed outside the output end of the connection block (603).

8. A cutting method using the high-precision single crystal silicon wafer cutting device according to any one of claims 6 or 7, comprising the following steps, characterized in that: S1. When cutting a single crystal silicon wafer, first pass one end of the single crystal silicon rod through the inside of the cleaning sleeve (402), then place one end of the single crystal silicon rod on the top of the mounting frame (401), and after placing it, move the first clamping plate (409) so that one side of the first clamping plate (409) is attached to the outside of one end of the single crystal silicon rod. When the first clamping plate (409) moves, it drives the slider (4010) to slide inside the fixed block (407). When the first clamping plate (409) is attached, fix the nut (408) on the bolt at the top of the slider (4010) to fix the first clamping plate (409), thereby completing the preliminary clamping of the single crystal silicon rod; S2. After the initial clamping of the single crystal silicon rod is completed, the handle (4020) is rotated. The handle (4020) drives the worm (4022) to rotate when the handle (4020) is rotated. The worm (4022) drives the bidirectional screw (406) to rotate by cooperating with the worm wheel (4021). The bidirectional screw (406) drives the two sets of second clamping plates (4012) to move to the middle position by cooperating with the screw sleeve (4013) when the bidirectional screw (406) rotates, so that one side of the second clamping plate (4012) is attached to one end of the single crystal silicon rod, thereby completing the secondary clamping of the single crystal silicon rod; S3. When the second clamping plate (4012) moves to one side, it pushes one end of the connecting plate (4016) to move to one side and squeezes the telescopic spring (4015) to contract. Since the middle of the connecting plate (4016) is hinged to the fixing frame (4017), the other end of the connecting plate (4016) moves to one side. When the other end of the connecting plate (4016) moves to the other side, it drives the piston (4018) to move inside the looper (4019), thereby sucking away the air in the internal cavity of the first clamping plate (409). At this time, the first clamping plate (409) can form a temporary closed space with the outside of the single crystal silicon rod through the use of the suction hole (4011). As the air pressure in the closed space decreases, pressure is generated between it and the external atmospheric pressure. The outside atmospheric pressure will firmly squeeze the single crystal silicon rod and the first clamping plate (409) together. After the first clamping plate (409) completes the initial clamping, the rubber pad (10) on one side of the first clamping plate (409) will fit with the surface of the single crystal silicon rod. At this time, the staff injects water into the inside of the rubber pad (10) through the water injection port (11). When the first clamping plate (409) is vacuum-adsorbed, the rubber pad (10) will be squeezed, and the water inside the rubber pad (10) will flow out through the small hole on one side, preventing external air from entering the first clamping plate (409) to destroy the vacuum state, thereby enhancing the adsorption effect, thereby realizing multiple clamping of the single crystal silicon rod, making it difficult for the single crystal silicon rod to move during the processing, thereby improving the processing accuracy of the single crystal silicon rod; S4. When the single crystal silicon rod is clamped, the external power supply starts the driving motor (3). After starting, the driving motor (3) drives the internal screw of the position moving component (5) to rotate. When the screw rotates, the single crystal silicon rod at the top of the mounting bracket (401) moves to one side through the cooperation with the screw sleeve. The distance moved by the single crystal silicon rod is controlled by the control panel on the side of the mounting bracket (2). When the driving motor (3) rotates, the connecting disk (405) is driven to rotate through the belt. When the connecting disk (405) rotates, the connecting rod (404) is driven to rotate. When the connecting rod (404) rotates, the cleaning sleeve (402) is driven to rotate through the belt. A limit seat is set at the bottom of the cleaning sleeve (402) so that the cleaning sleeve (402) can be cleaned. The sorting sleeve (402) is more stable when rotating. The cleaning sleeve (402) can clean the dust, oxide and metal ion impurities on the surface of the single crystal silicon rod through the semiconductor blue brush inside it when rotating. The setting of the semiconductor blue brush prevents the surface of the silicon rod from being polluted again due to electrostatic adsorption during cleaning. As the single crystal silicon rod moves, the cleaning cotton (403) can perform a secondary cleaning on the cleaned single crystal silicon rod, so that the surface of the single crystal silicon rod is cleaner when cutting. The dust, oxide and metal ion impurities on the surface of the silicon rod are cleaned, and the problems of burrs and micro cracks on the cut surface caused by interference from foreign matter during the cutting process can be avoided, thereby ensuring the smoothness and flatness of the silicon wafer surface and achieving high-precision processing effects. S5. When the single crystal silicon rod moves to the bottom of the cutting assembly (7), the cutting assembly (7) is started. After starting, the cutting assembly (7) drives the diamond wire to rotate at high speed through the motor. When the diamond wire rotates, the height moving assembly (8) is started to drive the cutting assembly (7) to move downward to slice the single crystal silicon rod. During slicing, an external cooling pipe is connected to spray coolant to cool the cut part of the single crystal silicon rod. When the single crystal silicon rod generates cooling waste liquid during slicing, it will fall into the inside of the filter rack (606). At this time, the use of the ceramic membrane (607) can filter the cooling waste liquid. The cooling waste liquid contains the diamond wire. The ceramic membrane (607) has a pore size of 0.4 μm, which can filter the diamond grinding chips and make them remain on the surface of the ceramic membrane (607). The silicon chips continue to fall into the interior of the filter box (6013) and are then filtered by the filter plate (6011). The filter plate (6011) is a ceramic membrane with a pore size of 0.2 μm, so the silicon chips can be filtered out, thereby achieving separation and filtration of the diamond grinding chips and silicon chips. The filtered cooling waste liquid is discharged through the drainage hole of the filter box (6013) and collected for secondary utilization. S6. When it is necessary to collect diamond grinding chips, the collection plate (6010) is inserted into the interior of the filter box (6013). After the insertion is completed, the servo motor (601) is started. After starting, the servo motor (601) will drive the filter frame (606) to slowly flip 180 degrees. When the filter frame (606) is rotating, the servo motor (601) will also drive the extrusion disk (609) to rotate 180 degrees. One side of the extrusion moving block (608) is provided with an arc, and one side of the extrusion disk (609) is also provided with an arc, so when it is squeezed, the moving block (608) will move upward. When the extrusion disk (609) rotates, it will squeeze the moving block (608) to move upward. When the moving block (608) moves upward, it pushes the connecting block (603) to move upward under the limit of the guide block (6012). When the connecting block (603) moves, it will The movable impact plate (605) moves upward, and the impact plate (605) drives the return spring (604) to stretch when moving upward. When the filter frame (606) rotates 180 degrees, the movable block (608) is inserted into the middle position of the two sets of squeeze plates (609) under the pullback of the return spring (604). When the return spring (604) pulls back, it pulls the impact plate (605) back to its original position and hits both sides of the filter frame (606), causing the filter frame (606) to vibrate violently, thereby vibrating the diamond grinding chips filtered by the ceramic membrane (607) to fall onto the surface of the collection plate (6010), completing the collection of the diamond grinding chips. At this time, the collection plate (6010) and the filter plate (6011) are pulled out, and the separation, filtration and collection of the diamond grinding chips and silicon chips can be completed, and finally the slicing of the single crystal silicon wafer is completed.

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