Heat exchanger and energy storage equipment
By designing a heat exchanger that integrates refrigerant substrate, condensation plate replacement and evaporation plate replacement, the problem of large space and complex assembly of energy storage power stations in large cooling scenarios is solved, and more efficient heat exchange and energy storage management is achieved.
Patent Information
- Application Number
- CN202311613907.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-27
- Publication Date
- 2025-05-27
AI Technical Summary
Existing energy storage power stations take up a lot of space in large cooling scenarios and are complex in assembly, making it difficult to effectively utilize existing heat exchangers.
A heat exchanger is designed, including a refrigerant substrate, multiple condensing plate replacement and multiple evaporation plate replacement. The condensing plate replacement and evaporation plate replacement are arranged on the same side of the refrigerant substrate, which improves the refrigeration capacity of the heat exchanger. By optimizing the layout and diversion structure of the refrigerant flow path, the space occupied and assembly complexity of the energy storage power station is reduced.
It improves the refrigeration capacity of the heat exchanger, reduces the space occupied by the energy storage power station, and simplifies the assembly process, achieving more efficient heat exchange and energy storage management.
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Figure CN120043281A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of heat exchange technology, and in particular to a heat exchanger and an energy storage device. Background Art
[0002] With the vigorous development of new energy technologies, energy storage technology has also received more and more attention. It is usually necessary to set up a heat exchanger in the energy storage device to heat or dissipate heat to ensure the performance and safety of the energy storage device. Reusing existing heat exchangers to perform heat exchange in large cooling scenarios such as energy storage power stations will make the energy storage power station occupy a larger space and make the assembly more complicated. Summary of the invention
[0003] The present application provides a heat exchanger and an energy storage device, which can improve the cooling capacity of the heat exchanger. Reusing the heat exchanger can reduce the occupied space of the energy storage power station in a large cooling capacity scenario and simplify the assembly process of the energy storage power station.
[0004] In a first aspect, a heat exchanger is provided, the heat exchanger comprising a refrigerant substrate, a plurality of condensing plates and a plurality of evaporating plates, wherein each condensing plate and each evaporating plate are arranged on the same side of the refrigerant substrate along a first direction. The side of each condensing plate facing the refrigerant substrate comprises a condensing refrigerant inlet and a condensing refrigerant outlet, the side of each evaporating plate facing the refrigerant substrate comprises an evaporating refrigerant inlet and an evaporating refrigerant outlet, and the refrigerant substrate comprises two condensing refrigerant flow channels and two evaporating refrigerant flow channels. Among them, one of the two condensing refrigerant flow channels is used to connect the condensing refrigerant inlet of each condensing plate, the other condensing refrigerant flow channel is used to connect the condensing refrigerant outlet of each condensing plate, one of the two evaporating refrigerant flow channels is used to connect the other condensing refrigerant flow channel and the evaporating refrigerant inlet of each evaporating plate, and the other evaporating refrigerant flow channel is used to connect the evaporating refrigerant outlet of each evaporating plate.
[0005] In the heat exchanger provided in the embodiment of the present application, multiple condensing plate exchangers and multiple evaporating plate exchangers are integrated on the refrigerant substrate, thereby improving the cooling capacity of the heat exchanger. In addition, each condensing plate exchanger and each evaporating plate exchanger are arranged on the same side of the refrigerant substrate, making the heat exchanger layout simple and compact. Furthermore, the reuse of the heat exchanger can reduce the occupied space of the energy storage power station in the large cooling capacity scenario and simplify the assembly process of the energy storage power station.
[0006] In one implementation, another condensing refrigerant flow channel and an evaporating refrigerant flow channel are respectively distributed between one condensing refrigerant flow channel and another evaporating refrigerant flow channel. In this way, one condensing refrigerant flow channel for transmitting high-temperature and high-pressure refrigerant and another evaporating refrigerant flow channel are arranged on one side of the edge of the condensing substrate, reducing the heat loss with the refrigerant in the other condensing refrigerant flow channel and the refrigerant in one evaporating refrigerant flow channel.
[0007] In one implementation, the cross-sectional areas of the two evaporating refrigerant flow channels are respectively larger than the cross-sectional areas of the two condensing refrigerant flow channels.
[0008] Since most of the refrigerant flowing in the condensing refrigerant flow channel is liquid, and most of the refrigerant flowing in the evaporating refrigerant flow channel is gaseous, the flow resistance of the liquid refrigerant is smaller than that of the gaseous refrigerant. Therefore, compared with the cross-sectional area of the condensing refrigerant flow channel, the cross-sectional area of the evaporating refrigerant flow channel is set larger, thereby increasing the pressure drop of the refrigerant flowing in the evaporating refrigerant flow channel.
[0009] In one implementation, a cross-sectional area of one condensing refrigerant flow channel is greater than a cross-sectional area of another condensing refrigerant flow channel.
[0010] Since the liquid refrigerant flowing in the other condensing refrigerant flow channel is more than the liquid refrigerant flowing in the one condensing refrigerant flow channel, the flow resistance of the refrigerant flowing in the other condensing refrigerant flow channel is smaller than the flow resistance of the refrigerant flowing in the one condensing refrigerant flow channel. Therefore, the cross-sectional area of one condensing refrigerant flow channel is set larger relative to the cross-sectional area of the other condensing refrigerant flow channel, thereby increasing the pressure drop of the refrigerant flowing in the one condensing refrigerant flow channel.
[0011] In one implementation, the cross-sectional area of the other evaporative refrigerant flow channel is larger than that of the one evaporative refrigerant flow channel.
[0012] Since the liquid refrigerant flowing in the other evaporating refrigerant flow channel is less than the liquid refrigerant flowing in the one evaporating refrigerant flow channel, the flow resistance of the refrigerant flowing in the other evaporating refrigerant flow channel is greater than the flow resistance of the refrigerant flowing in the one evaporating refrigerant flow channel. Therefore, relative to the cross-sectional area of one evaporating refrigerant flow channel, the cross-sectional area of the other evaporating refrigerant flow channel is set larger, thereby increasing the pressure drop of the refrigerant flowing in the other evaporating refrigerant flow channel.
[0013] In one implementation, the arrangement direction of the two condensing refrigerant flow channels and the two evaporating refrigerant flow channels is the same as the arrangement direction of the multiple condensing plate heat exchangers and the multiple evaporating plate heat exchangers. The arrangement direction of the multiple condensing plate heat exchangers is the same as the extension direction of each condensing refrigerant flow channel. The arrangement direction of the multiple evaporating plate heat exchangers is the same as the extension direction of each evaporating refrigerant flow channel.
[0014] According to the deployment method of multiple condensing plate changes and multiple evaporating plate changes, the positions of two condensing refrigerant flow channels and two evaporating refrigerant flow channels are deployed, so that the deployment of the pipes connected to the two condensing refrigerant flow channels on the multiple condensing plate changes and the pipes connected to the two evaporating refrigerant flow channels on the multiple evaporating plate changes are relatively regular, which simplifies the assembly process between the multiple condensing plate changes and the two condensing refrigerant flow channels and the assembly process between the multiple evaporating plate changes and the two evaporating refrigerant flow channels.
[0015] In one implementation, a plurality of condensing plates are arranged at intervals along the second direction, a plurality of evaporating plates are arranged at intervals along the second direction, a plurality of condensing plates and a plurality of evaporating plates are arranged at intervals along the third direction, and the first direction, the second direction, and the third direction are perpendicular to each other. In this way, the assembly of the condensing plates and the evaporating plates is convenient.
[0016] In one implementation, the side of the refrigerant substrate facing the condensation plate includes two groups of condensation holes and two groups of evaporation holes, each group of condensation holes includes a plurality of condensation holes, and each group of evaporation holes includes a plurality of evaporation holes. Each condensation hole in one group of condensation holes is used to connect a condensation refrigerant flow channel with a condensation refrigerant inlet of a condensation plate, and each condensation hole in another group of condensation holes is used to connect another condensation refrigerant flow channel with a condensation refrigerant outlet of a condensation plate. Each evaporation hole in one group of evaporation holes is used to connect an evaporation refrigerant flow channel with an evaporation refrigerant inlet of an evaporation plate, and each evaporation hole in another group of evaporation holes is used to connect another evaporation refrigerant flow channel with an evaporation refrigerant outlet of an evaporation plate.
[0017] The angle between the connecting line of two adjacent condensation holes in the two groups of condensation holes and the second direction is α 1 , 0°≤α 1 ≤45°. In this way, it can be ensured that the flow path of the refrigerant in each of the two condensing refrigerant flow channels is the shortest and the flow resistance is low.
[0018] The angle between the line connecting two adjacent condensation holes in the two groups of evaporation holes and the second direction is α 2 , 0°≤α 2 ≤45°. In this way, it can be ensured that the flow path of the refrigerant in each of the two evaporative refrigerant flow channels is the shortest and the flow resistance is low.
[0019] In one implementation, the refrigerant substrate also includes a confluence channel, which is used to connect another condensing refrigerant channel with an evaporating refrigerant channel. The heat exchanger also includes at least one throttling element, each throttling element is distributed in the confluence channel, and each throttling element is used to control the flow rate flowing from the confluence channel into an evaporating refrigerant channel.
[0020] In one implementation, an evaporative refrigerant flow channel includes a plurality of branch flow channels, one end of each branch flow channel is used to connect to the converging flow channel, and the other end of each branch flow channel is used to connect to an evaporative refrigerant inlet of an evaporator plate exchanger.
[0021] By setting the flow diversion channel on the refrigerant base plate, the flow diversion problem of multiple evaporation plates can be solved, thereby reducing the occupied space of the heat exchanger and simplifying the assembly of the heat exchanger.
[0022] In addition, by setting the shunt flow channel on the refrigerant substrate, on the one hand, there is no need to consider the sealing problem between the shunt flow channel and the refrigerant substrate, which reduces the production cost of the heat exchanger. On the other hand, when the heat exchanger is in a vibrating environment, it will not affect the shunt flow channel, ensuring the heat exchange performance of the heat exchanger.
[0023] In one implementation, the refrigerant substrate further includes a diverter flow channel, which is used to connect the converging flow channel with a plurality of diverter flow channels, and the cross-sectional area of the diverter flow channel first decreases and then increases along the direction in which the diverter flow channel and each diverter flow channel are arranged.
[0024] After the refrigerant enters the flow channel of the diverter, it will first shrink slightly, the speed will increase and the pressure will decrease, and the speed will reach the maximum value when it reaches the narrowest part of the flow channel of the diverter. Then it will slow down and expand the pressure, and the refrigerant will be sprayed into each diverter flow channel like a nozzle. Because the pressure is relatively high, the refrigerant flow rate is relatively fast, so the refrigerant flowing into each diverter flow channel will be more uniform.
[0025] In one implementation, the refrigerant substrate further includes a flow guide baffle, which is used to be embedded in the converging flow channel, and a gap is provided at the connection between the flow guide baffle and each diverting flow channel. The flow guide baffle includes a flow guide flow channel, which is used to connect the converging flow channel with the gap.
[0026] After the refrigerant enters the diversion channel of the diversion baffle, it will first shrink slightly, and the speed will increase while the pressure will decrease. When it reaches the junction of the outlet of the diversion channel and the gap, the speed will reach the maximum value. Then the speed will slow down and expand. Like a nozzle, the refrigerant will be sprayed into each diversion channel. Because the pressure is relatively high, the refrigerant flow rate is relatively fast, so the refrigerant flowing into each diversion channel will be more uniform.
[0027] In one implementation, the cross-sectional area of each diverting channel is smaller than the cross-sectional area of the converging channel; the lengths of each diverting channel are equal, and the cross-sectional areas of each diverting channel are the same. Alternatively, the length of one diverting channel is smaller than the length of another diverting channel, and the cross-sectional area of one diverting channel is smaller than the cross-sectional area of another diverting channel. In this way, the pressure drop of each diverting channel can be ensured to be as equal as possible.
[0028] In one implementation, the refrigerant substrate further includes at least one cutout, and the cutout is distributed in at least one of the following: between two condensing refrigerant flow channels, between two evaporating refrigerant flow channels, between another condensing refrigerant flow channel and an evaporating refrigerant flow channel, and between the inlet and outlet of the throttling element.
[0029] In this way, the cutout forms air isolation, which can reduce the heat transfer of the refrigerant in each refrigerant flow channel through the refrigerant substrate, achieve low heat leakage of the heat exchanger, and ensure the high heat exchange performance of the heat exchanger. In addition, the cutout is only set between two condensing refrigerant flow channels and / or between two evaporating refrigerant flow channels, that is, the cutout is only set in the substrate area that contributes the most to the heat leakage, which not only simplifies the process steps, but also ensures the structural strength of the refrigerant substrate.
[0030] In one implementation, the length of the cutout is greater than or equal to the length of each refrigerant flow channel, and the length of the cutout is greater than the width of the throttling element, so that the heat insulation effect between the refrigerant flow channels can be increased.
[0031] In a second aspect, a thermal management system is provided, which includes a compressor and a heat exchanger as described in any one of the first aspect and the possible implementation methods of the first aspect, the compressor is arranged on the side of the refrigerant substrate away from the condensation plate, the refrigerant substrate includes two side surfaces arranged opposite to each other along a second direction, one of the two side surfaces includes a gas inlet and a gas outlet, the gas inlet is used to connect a condensing refrigerant flow channel with the exhaust port of the compressor, and the gas outlet is used to connect another evaporating refrigerant flow channel with the intake port of the compressor.
[0032] The compressor compresses the low-temperature and low-pressure gaseous refrigerant into a high-temperature and high-pressure gaseous refrigerant, and discharges the high-temperature and high-pressure gaseous refrigerant into a condensing refrigerant flow channel through the gas inlet of the refrigerant base plate. The high-temperature and high-pressure gaseous refrigerant entering a condensing refrigerant flow channel enters each condensing plate exchanger through the condensing refrigerant inlet of each condensing plate exchanger respectively. After flowing into each condensing plate exchanger, the high-temperature and high-pressure gaseous refrigerant releases part of the heat and is converted into a supercooled liquid refrigerant. At the same time, the supercooled liquid flowing out of the condensing refrigerant outlet of each condensing plate exchanger flows into another condensing refrigerant flow channel. Furthermore, the supercooled liquid refrigerant in another condensing refrigerant flow channel flows into an evaporating refrigerant flow channel along the confluence channel, and the supercooled liquid refrigerant entering an evaporating refrigerant flow channel enters each evaporating plate exchanger through the evaporating refrigerant inlet of each evaporating plate exchanger. After flowing into each evaporator plate, the supercooled liquid absorbs part of the heat and is converted into a low-temperature and low-pressure gas-liquid mixed refrigerant. At the same time, the low-temperature and low-pressure gas-liquid mixed refrigerant flowing out of the evaporative refrigerant outlet of each evaporator plate flows into another evaporative refrigerant flow channel. The gas-liquid mixed refrigerant flowing into another evaporative refrigerant flow channel flows into the compressor again through the gas outlet of the refrigerant base plate, thus completing the heat exchange cycle.
[0033] Since the thermal management system includes the heat exchanger described in the first aspect, the cooling capacity of the thermal management system can be improved. In addition, the thermal management system has a simple layout and a compact structure, which simplifies the assembly process of the thermal management system.
[0034] In one implementation, the thermal management system also includes a gas-liquid separator, which is arranged on the side of the refrigerant substrate away from the condensing plate. The refrigerant substrate includes a gas inlet and a gas outlet. The gas inlet is used to connect another evaporating refrigerant flow channel with the liquid separator, and the gas outlet is used to connect the suction port of the compressor with the liquid separator.
[0035] The gas-liquid mixed refrigerant flowing into another evaporating refrigerant flow channel flows into the gas-liquid separator through the gas separation inlet of the refrigerant substrate. The gas-liquid separator separates the gaseous refrigerant and flows into the compressor again through the gas separation outlet of the refrigerant substrate, thereby completing the heat exchange cycle.
[0036] In a third aspect, an energy storage device is provided, the energy storage device comprising at least one battery cell and a thermal management system as described in any one of the second aspect and possible implementations of the second aspect, the thermal management system being configured to perform heat exchange with each of the battery cells.
[0037] Since the energy storage device includes the heat exchanger described in the first aspect, the space occupied by the energy storage device can be reduced and the assembly process of the energy storage device can be simplified.
[0038] In a fourth aspect, a photovoltaic power generation system is provided, comprising: a photovoltaic panel, a photovoltaic inverter, and an energy storage device as described in the third aspect, wherein the photovoltaic panel is used to convert solar energy into electrical energy, each battery cell is used to store electrical energy from the photovoltaic panel, the photovoltaic inverter is used to convert direct current from the photovoltaic panel into alternating current, and the heat exchanger is also used to perform heat exchange with the photovoltaic inverter.
[0039] Since the photovoltaic power generation system includes the heat exchanger described in the first aspect, the occupied space of the photovoltaic power generation system can be reduced and the assembly process of the photovoltaic power generation system can be simplified.
[0040] In a fifth aspect, an electric vehicle is provided, comprising a powertrain and an energy storage device as described in the third aspect, wherein the energy storage device is used to supply power to the powertrain.
[0041] Since the electric vehicle includes the heat exchanger described in the first aspect, the occupied space of the electric vehicle can be reduced and the assembly process of the electric vehicle can be simplified. BRIEF DESCRIPTION OF THE DRAWINGS
[0042] Figure 1 A schematic diagram of a photovoltaic power generation system provided in an embodiment of the present application.
[0043] Figure 2 A schematic diagram of an electric vehicle provided in an embodiment of the present application.
[0044] Figure 3 A schematic diagram of the three-dimensional structure of a heat exchanger provided in an embodiment of the present application.
[0045] Figure 4 A schematic diagram of the three-dimensional structure of another heat exchanger provided in an embodiment of the present application.
[0046] Figure 5 A schematic diagram of the three-dimensional structure of a condensation plate exchanger provided in an embodiment of the present application.
[0047] Figure 6 This is a schematic diagram of the three-dimensional structure of an evaporation plate exchanger provided in an embodiment of the present application.
[0048] Figure 7 This is a schematic diagram of the two-dimensional structure of a substrate in an example of a refrigerant substrate provided in an embodiment of the present application.
[0049] Figure 8 This is a schematic diagram of the two-dimensional structure of another substrate in an example of a refrigerant substrate provided in an embodiment of the present application.
[0050] Fig. 9 A schematic diagram of the two-dimensional structure of a substrate in another example of a refrigerant substrate provided in an embodiment of the present application.
[0051] Fig.10 This is a schematic diagram of the two-dimensional structure of another substrate in another example of a refrigerant substrate provided in an embodiment of the present application.
[0052] Fig.11 This is a schematic diagram of the two-dimensional structure of a substrate in another example of a refrigerant substrate provided in an embodiment of the present application.
[0053] Fig.12 This is a schematic diagram of the two-dimensional structure of a substrate in another example of a refrigerant substrate provided in an embodiment of the present application.
[0054] Fig.13 This is a schematic diagram of the two-dimensional structure of a substrate in another example of a refrigerant substrate provided in an embodiment of the present application.
[0055] Fig.14 This is a schematic diagram of the two-dimensional structure of another substrate in another example of a refrigerant substrate provided in an embodiment of the present application.
[0056] Fig.15 This is a schematic diagram of the three-dimensional structure of a substrate in another example of a refrigerant substrate provided in an embodiment of the present application.
[0057] Fig.16 for Fig.15 An enlarged schematic diagram of portion A of another substrate is shown.
[0058] Fig.17 This is a schematic diagram of the three-dimensional structure of a substrate in another example of a refrigerant substrate provided in an embodiment of the present application.
[0059] Fig.18 for Fig.17 An enlarged schematic diagram of portion B of another substrate is shown.
[0060] Fig.19 This is a schematic diagram of the two-dimensional structure of a substrate in another example of a refrigerant substrate provided in an embodiment of the present application.
[0061] Fig. 20 A schematic diagram of the two-dimensional structure of a refrigerant substrate provided in an embodiment of the present application. DETAILED DESCRIPTION
[0062] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings.
[0063] In the description of the embodiments of the present application, unless otherwise specified, “ / ” means or. For example, A / B can mean A or B. The “and / or” in this article is merely a way to describe the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.
[0064] In the embodiments of the present application, prefixes such as "first", "second", and "third" are used only to distinguish different description objects, and have no limiting effect on the position, order, priority, quantity or content of the described objects. The use of prefixes such as ordinal numbers to distinguish description objects in the embodiments of the present application does not constitute a limitation on the described objects. For the statement of the described objects, please refer to the description in the context of the claims or embodiments, and no unnecessary limitation should be constituted due to the use of such prefixes. In addition, in the description of this embodiment, unless otherwise specified, "multiple" means two or more.
[0065] The directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside" and "outside" in the embodiments of the present application are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on the present application.
[0066] References to "some embodiments" and the like described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in some embodiments" and the like appearing in different places in this specification do not necessarily all refer to the same embodiment, but rather mean "one or more but not all embodiments", unless otherwise specifically emphasized. The terms "include", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.
[0067] The "perpendicular" mentioned in this application is not perpendicular in the strict sense, but within the allowable error range. The "parallel" is not parallel in the strict sense, but within the allowable error range.
[0068] In the embodiments of the present application, the same reference numerals represent the same component or the same part. In the embodiments of the present application, for multiple identical parts, only one of the parts may be marked with a reference numeral in the drawings as an example. For other identical parts or components, the reference numerals are also applicable. In addition, the sizes and dimensions of the parts shown in the drawings are only exemplary.
[0069] An embodiment of the present application provides a heat exchanger, which includes a refrigerant substrate, a plurality of condensing plates and a plurality of evaporating plates, wherein each condensing plate and each evaporating plate are arranged on the same side of the refrigerant substrate along a first direction. The side of each condensing plate facing the refrigerant substrate includes a condensing refrigerant inlet and a condensing refrigerant outlet, and the side of each evaporating plate facing the refrigerant substrate includes an evaporating refrigerant inlet and an evaporating refrigerant outlet, and the refrigerant substrate includes two condensing refrigerant flow channels and two evaporating refrigerant flow channels. Among them, one of the two condensing refrigerant flow channels is used to connect the condensing refrigerant inlet of each condensing plate, and the other condensing refrigerant flow channel is used to connect the condensing refrigerant outlet of each condensing plate, and one of the two evaporating refrigerant flow channels is used to connect the other condensing refrigerant flow channel and the evaporating refrigerant inlet of each evaporating plate, and the other evaporating refrigerant flow channel is used to connect the evaporating refrigerant outlet of each evaporating plate.
[0070] In the heat exchanger provided in the embodiment of the present application, multiple condensing plate exchangers and multiple evaporating plate exchangers are integrated on the refrigerant substrate, thereby increasing the cooling capacity of the heat exchanger. In addition, each condensing plate exchanger and each evaporating plate exchanger are arranged on the same side of the refrigerant substrate, making the heat exchanger layout simple and compact. Furthermore, the reuse of the heat exchanger can reduce the occupied space of the energy storage power station in the large cooling capacity scenario and simplify the assembly process of the energy storage power station.
[0071] The present application also provides a photovoltaic power generation system. Figure 1 The photovoltaic power generation system provided in the embodiment of the present application is described in detail.
[0072] Figure 1 Schematic diagram of a photovoltaic power generation system provided in an embodiment of the present application. Figure 1 As shown, the photovoltaic power generation system provided in the embodiment of the present application includes one or more photovoltaic components 1, a photovoltaic inverter 2, a box-type substation 3, a three-phase AC power grid 4, a first DC cable 5, a first AC cable 6, a second AC cable 7, an energy storage device 8 and a second DC cable 9. Among them, one or more photovoltaic components 1 are connected to the photovoltaic inverter 2 through the first DC cable 5, and the connection relationship between the photovoltaic component 1 and the photovoltaic inverter 2 can be a many-to-one connection. The energy storage device 8 is connected to the photovoltaic inverter 2 through the second DC cable 5. The photovoltaic inverter 2 converts the DC power output by the photovoltaic component 1 or the energy storage device 8 into AC power, and the AC side of the photovoltaic inverter 2 is connected to the box-type substation 3 through the first AC cable 6. The box-type substation 3 is connected to the three-phase AC power grid 4 through the second AC cable 7. In this way, the AC power output by the photovoltaic inverter 2 flows into the three-phase AC power grid 4 after passing through the box-type substation 3.
[0073] The photovoltaic power generation system is a power generation system that converts solar radiation energy into electrical energy by utilizing the photovoltaic effect of semiconductor materials. The photovoltaic power generation system provided in the embodiment of the present application can empower electric vehicles. The electric vehicles include pure electric vehicles, hybrid vehicles, extended-range electric vehicles, plug-in hybrid vehicles or new energy vehicles, etc. Among them, pure electric vehicles are also called pure electric vehicle / battery electric vehicle, or simply pure EV / battery EV. Hybrid vehicles are also called hybrid electric vehicles, or simply HEV. Extended-range electric vehicles are also called range extended electric vehicles, or REEV for short. Plug-in hybrid vehicles are also called plug-in hybrid electric vehicles, or PHEV for short. New energy vehicles are also called new energy vehicles, or NEV for short.
[0074] The photovoltaic module 1 may also be referred to as a photovoltaic array, and includes a plurality of photovoltaic strings. Photovoltaic is also referred to as photovoltaic, or PV for short. A string is also referred to as a string. Each photovoltaic string includes a plurality of photovoltaic panels connected in series. Photovoltaic panels are used to convert light energy into electrical energy. The electrical energy generated by photovoltaic panels is DC electricity. The voltage across the photovoltaic string is equal to the sum of the voltages generated by the plurality of photovoltaic panels. The output power of a photovoltaic module may represent the electrical energy output per unit time of the photovoltaic module.
[0075] In a photovoltaic power generation system, the area of each photovoltaic module 1 is generally fixed. When the light intensity remains unchanged, the larger the angle between the light irradiating the photovoltaic module 1 and the plane where the photovoltaic module 1 is located, that is, the smaller the incident angle of the light irradiating the photovoltaic module 1, the more electrical energy the photovoltaic module 1 outputs. When the light irradiates the photovoltaic module 1 vertically, that is, the angle between the light and the plane where the photovoltaic module 1 is located is 90°, reaching the maximum value, the power output by the photovoltaic module 1 reaches the maximum.
[0076] Each photovoltaic inverter 2 is used to convert input DC into AC, that is, to perform DC-AC conversion. The photovoltaic inverter 2 can also be called a DC-AC converter.
[0077] Box-type substation 3 is referred to as box-type substation 3. It is a compact distribution device that integrates high-voltage switchgear, distribution transformers and low-voltage distribution devices according to a certain wiring scheme. For example, box-type substation 3 integrates low-voltage cabinets, transformers, ring network cabinets, auxiliary power supplies and other equipment into a container, providing a highly integrated distribution solution for medium-voltage grid-connected scenarios of photovoltaic ground power stations.
[0078] The energy storage device 8 includes a thermal management system 80 and at least one battery cell 81 . The thermal management system 80 is used to perform heat exchange with each battery cell 81 .
[0079] When the photovoltaic power generation system includes a plurality of photovoltaic modules 1 , the photovoltaic power generation system further includes a combiner box, which is used to combine the direct current generated by the plurality of photovoltaic modules 1 and input the combined output into the photovoltaic inverter 2 .
[0080] The present application also provides an electric vehicle. Figure 2 The electric vehicle provided in the embodiment of the present application is described in detail.
[0081] Figure 2 Schematic diagram of an electric vehicle provided in an embodiment of the present application. Figure 2 As shown, the electric vehicle provided in the embodiment of the present application includes an energy storage device 10, wheels 20 and one or more powertrains 30. The powertrain 30 is used to receive power from the energy storage device 10 and drive the wheels 20, and the powertrain 30 is used to convert electrical energy into mechanical energy.
[0082] The energy storage device 10 includes a thermal management system 11 and at least one battery cell 12. The thermal management system 80 is used to perform heat exchange with each battery cell 12. The powertrain 30 includes a motor controller 31, a motor 32 and a reducer 33. The energy storage device 10 is connected to the motor controller 31 of the powertrain 30. The motor controller 31 receives the DC power transmitted by the battery cell 12 through the DC input interface. The motor controller 31 converts the DC power into AC power and transmits it to the terminal of the motor 32 winding through the AC output interface to control the start or stop, forward or reverse rotation, speed increase or decrease, increase or decrease of the driving torque, increase or decrease of the braking torque, etc. of the motor 32. The output end of the motor shaft transmits power to the wheels 20 of the electric vehicle through the reducer 33 to provide power for the wheels 20.
[0083] like Figure 1 The thermal management system 80 shown or Figure 2 The thermal management system 11 shown in the figure includes a heat exchanger. Figures 3 to 20 The specific structure of the heat exchanger provided in the embodiment of the present application is described in detail.
[0084] like Figure 3 and Figure 4 As shown, the heat exchanger 100 includes at least one condensing plate exchanger 110, at least one evaporating plate exchanger 120 and a refrigerant base plate 130. Each condensing plate exchanger 110 and each evaporating plate exchanger 120 are arranged on the same side of the refrigerant base plate along the first direction. In the embodiment where the heat exchanger 100 includes a plurality of condensing plates 110 and a plurality of evaporating plates 120, the high integration of the heat exchange plates (condensing plates 110 and evaporating plates 120) enables the heat exchanger 100 to achieve a high heat exchange capacity.
[0085] Each condensation plate 110 includes a plurality of condensation substrates, and the plurality of condensation substrates are spaced apart and distributed along the thickness direction of the condensation substrate. Figure 5 As shown, the side 111 of each condensation plate exchanger 110 includes a condensation refrigerant inlet A 11 and condensing refrigerant outlet A 12 , condensing refrigerant inlet A 11 and condensing refrigerant outlet A 12 In some embodiments, in order to facilitate the condensation refrigerant inlet A of each condensation plate 110, 11 , Condensation refrigerant outlet A 12 Connected to the condensing refrigerant flow channel on the refrigerant substrate 130, the condensing refrigerant inlet A 11 and condensing refrigerant outlet A 12 Aligned along the second direction, i.e., the condensing refrigerant inlet A 11 and condensing refrigerant outlet A 12In some embodiments, in order to prevent heat transfer between the refrigerant substrate 130 and each condensation plate 110, a gap is provided between the side 111 of each condensation plate 110 and the side of the refrigerant substrate 130 facing the condensation plate 110. For example, the gap may be 1 mm to 10 mm.
[0086] Each evaporation plate 120 includes a plurality of evaporation substrates, and the plurality of evaporation substrates are spaced apart and distributed along the thickness direction of the evaporation substrate. Figure 6 As shown, the side 121 of each evaporation plate exchanger 120 includes an evaporative refrigerant inlet A 21 and evaporative refrigerant outlet A 22 , evaporative refrigerant inlet A 21 and evaporative refrigerant outlet A 22 In some embodiments, in order to facilitate the evaporative refrigerant inlet A of each evaporation plate exchanger 120, 21 , Evaporative refrigerant outlet A 22 Connected to the evaporative refrigerant flow channel on the refrigerant substrate 130, the evaporative refrigerant inlet A 21 and evaporative refrigerant outlet A 22 Aligned along the second direction, i.e., the evaporative refrigerant inlet A 21 and evaporative refrigerant outlet A 22 In some embodiments, in order to prevent heat transfer between the refrigerant substrate 130 and each evaporation plate 120, a gap is provided between the side 111 of each condensation plate 110 and the side of the refrigerant substrate 130 facing the condensation plate 110. For example, the gap may be 1 mm to 10 mm.
[0087] like Figure 7 , Fig. 9 , Figures 11 to 13 As shown, the side of the refrigerant substrate 130 facing the condensation plate 110 includes two groups of condensation holes E 11 -E 12 and two sets of evaporation holes E 21 -E 22 The interior of the refrigerant substrate 130 includes two condensing refrigerant flow channels L1-L2, two evaporating refrigerant flow channels L3-L4 and a converging flow channel H. In the first direction, each condensing hole E in a group of condensing holes 11 Overlapping with the projection of a condensing refrigerant flow channel L1, each condensing hole E in another group of condensing holes 12 Overlapping with the projection of another condensing refrigerant flow channel L2, each evaporation hole E in a group of evaporation holes 21 Overlapping with the projection of an evaporative refrigerant flow channel L3, each evaporation hole E in another group of evaporation holes 22 Overlaps with the projection of another evaporative refrigerant flow channel L4.
[0088] Each group of condensation holes includes at least one condensation hole, and each condensation hole E in a group of condensation holes 11 For connecting a condensing refrigerant flow channel L1 with a condensing refrigerant inlet A of a condensing plate exchanger 110 11 , each condensation hole E in the other set of condensation holes 12 For connecting another condensing refrigerant flow channel L2 with a condensing refrigerant outlet A of a condensing plate exchanger 110 12 In this way, a plurality of condensation plates 110 are connected in parallel to each condensation refrigerant flow channel.
[0089] Each group of evaporation holes includes at least one evaporation hole. Each evaporation hole E in a group of evaporation holes 21 For connecting an evaporative refrigerant flow channel L3 with an evaporative refrigerant inlet A of an evaporation plate exchanger 120 21 , each evaporation hole E in another set of evaporation holes 22 For connecting another evaporative refrigerant flow channel L4 with an evaporative refrigerant outlet A of an evaporator plate exchanger 120 22 In this way, a plurality of evaporation plates 120 are connected in parallel to each evaporation refrigerant flow channel.
[0090] The confluence flow channel H is used to connect another condensing refrigerant flow channel L2 with an evaporating refrigerant flow channel L3. In this way, the refrigerant in a condensing refrigerant flow channel L1 can flow along the condensing refrigerant inlet A of each condensing plate exchanger 110. 11 Flows into each condensation plate exchange 110 and flows along the condensation refrigerant outlet A of each condensation plate exchange 110 12 The refrigerant flows into another condensing refrigerant flow channel L2. The refrigerant flows into an evaporating refrigerant flow channel L3 along the converging flow channel H connected to the other condensing refrigerant flow channel L2. The refrigerant in an evaporating refrigerant flow channel L3 can flow through the evaporating refrigerant inlet A of each evaporating plate exchanger 120. 21 Flows into each evaporation plate exchange 120 and flows along the evaporation refrigerant outlet A of each evaporation plate exchange 120 22 Flows into another evaporative refrigerant flow channel L4.
[0091] The number of each group of condensation holes is equal to the number of condensation plates 110 , and the number of each group of evaporation holes is equal to the number of evaporation plates 120 . Figures 3 to 18 In the figure, the heat exchanger 100 includes three condensing plates 110 and three evaporating plates 120 for example, which should not be construed as limiting the present application.
[0092] In some embodiments, such as Figure 3As shown, the plurality of condensation plates 110 and the plurality of evaporation plates 120 are arranged at intervals along the third direction. In other words, the plurality of condensation plates 110 are located on the left side, and the plurality of evaporation plates 120 are located on the right side. Further, the plurality of condensation plates 110 are arranged at intervals along the second direction, and the plurality of evaporation plates 120 are arranged at intervals along the second direction. In some other embodiments, Figure 4 As shown, a plurality of condensation plates 110 and a plurality of evaporation plates 120 are arranged at intervals along the second direction. In other words, a plurality of condensation plates 110 are located at the top and a plurality of evaporation plates 120 are located at the bottom, or a plurality of condensation plates 110 are located at the bottom and a plurality of evaporation plates 120 are located at the top. In this way, according to the deployment mode of the plurality of condensation plates 110 and the plurality of evaporation plates 120, the condensation refrigerant flow channel on the refrigerant substrate 130 connected with each condensation plate 110 is arranged on the same side, and the evaporation refrigerant flow channel on the refrigerant substrate 130 connected with each evaporation plate 120 is arranged on the other side, so that the assembly of the condensation plate 110 and the evaporation plate 120 and the design of the refrigerant flow channel are facilitated. In addition, in the embodiment where the plurality of condensation plates 110 are located at the top and the plurality of evaporation plates 120 are located at the bottom, it is beneficial to reduce the pressure drop of the gas-liquid two-phase refrigerant caused by gravity and improve the performance of the heat exchanger 100.
[0093] It should be noted that the first direction involved in the embodiment of the present application can be understood as: the front-to-back direction of the heat exchanger 100, the thickness direction of the condensation substrate, the thickness direction of the evaporation substrate, or the thickness direction of the refrigerant substrate 130. The second direction can be understood as the up-down direction of the heat exchanger 100 or the length direction of the refrigerant substrate 130. The third direction can be understood as the left-right direction of the heat exchanger 100 or the width direction of the refrigerant substrate 130.
[0094] In addition, the refrigerant in this application can also be called refrigerant, refrigerant or refrigerant, which is a medium substance used to complete energy conversion in various heat engines. These substances usually increase power through reversible phase change (such as gas-liquid phase change).
[0095] In the present application, the refrigerant is a working fluid used to transfer heat energy and produce a refrigeration effect. In other words, the refrigerant can transfer heat through evaporation and condensation. The refrigerant can be a substance that easily absorbs heat to become a gas, and easily releases heat to become a liquid. For example, the refrigerant is an intermediate substance in the refrigeration process. It first receives the coldness of the refrigerant and cools down, and then cools other cooled substances. As an example and not a limitation, in the present application, the refrigerant may include ammonia, air, water, salt water, chlorofluorocarbons (or chlorofluorocarbons), etc. In the present application, the gaseous refrigerant releases heat to become a liquid when under pressure, and absorbs heat when the high-pressure liquid is decompressed to become a gas.
[0096] The positional relationship between one condensing refrigerant flow channel L1, another condensing refrigerant flow channel L2, one evaporating refrigerant flow channel L3, and another evaporating refrigerant flow channel L4 is related to the positional relationship between the condensing plate exchanger 110 and the evaporating plate exchanger 120. In this way, the deployment of the pipelines connected to the two condensing refrigerant flow channels L1-L2 on the multiple condensing plate exchangers 110 and the pipelines connected to the two evaporating refrigerant flow channels L3-L4 on the multiple evaporating plate exchangers 120 are relatively regular, simplifying the assembly process between the multiple condensing plate exchangers 110 and the two condensing refrigerant flow channels L1-L2 and the assembly process between the multiple evaporating plate exchangers 110 and the two evaporating refrigerant flow channels L3-L4.
[0097] In an example, Figure 3 As shown, a plurality of condensation plates 110 and a plurality of evaporation plates 120 are arranged at intervals along the third direction. Figure 7 , Fig. 9 , Fig.11 , Fig.12 As shown, one condensing refrigerant flow channel L1, another condensing refrigerant flow channel L2, one evaporating refrigerant flow channel L3, and another evaporating refrigerant flow channel L4 are arranged along the third direction.
[0098] In another example, Figure 4 As shown, a plurality of condensation plates 110 and a plurality of evaporation plates 120 are arranged along the second direction. Fig.13 As shown, a condensing refrigerant flow channel L1, another condensing refrigerant flow channel L2, an evaporating refrigerant flow channel L3, and another evaporating refrigerant flow channel L4 are arranged along the second direction.
[0099] It should be noted that the arrangement of the plurality of condensing plates 110 and the plurality of evaporating plates 120 along the second direction can be understood as: all condensing plates 110 and all evaporating plates 120 of the heat exchanger 100 are arranged along the second direction. Figure 4 As shown, there may be a condensation plate 110 and an evaporation plate 120 arranged adjacent to each other along the third direction, but all condensation plates 110 and all evaporation plates 120 of the heat exchanger 100 are arranged along the second direction, that is, in this example, multiple condensation plates 110 and multiple evaporation plates 120 can also be understood as being arranged along the second direction.
[0100] The extension direction of a condensing refrigerant flow channel L1, the extension direction of another condensing refrigerant flow channel L2, and the plurality of condensing holes E of a group of condensing holes 11 The arrangement direction of the condensation holes E of another group of condensation holes 12 The arrangement directions are respectively related to the positional relationship of the plurality of condensation plates 110. For example, Figure 3 As shown, a plurality of condensation plates 110 are arranged along the second direction. Figure 7, Fig. 9 , Fig.11 , Fig.12 As shown, an extension direction of a condensing refrigerant flow channel L1, an extension direction of another condensing refrigerant flow channel L2, an arrangement direction of multiple condensing holes E11 of a group of condensing holes, and an arrangement direction of multiple condensing holes E12 of another group of condensing holes are respectively along the second direction.
[0101] The extension direction of one evaporating refrigerant flow channel L3, the extension direction of another evaporating refrigerant flow channel L4, and the plurality of evaporating holes E of a group of evaporating holes 21 The arrangement direction of the evaporation holes E of another group of evaporation holes 22 The arrangement directions are respectively related to the positional relationship of the plurality of evaporation plates 120. For example, Figure 3 As shown, the plurality of evaporation plates 120 are arranged along the second direction. Figure 7 , Fig. 9 , Fig.11 , Fig.12 As shown, the extension direction of an evaporative refrigerant flow channel L3, the extension direction of another evaporative refrigerant flow channel L4, and the plurality of evaporation holes E of a group of evaporation holes 21 The arrangement direction of the evaporation holes E of another group of evaporation holes 22 The arrangement directions are respectively along the second direction.
[0102] If necessary, Figure 7 , Fig. 9 , Figures 11 to 13 As shown, a condensing refrigerant flow channel L1 is connected to a group of condensing holes E. 11 As an example, another condensing refrigerant flow channel L2 is connected to multiple condensing holes E of another group of condensing holes. 12 As an example, an evaporative refrigerant flow channel L3 is connected to a group of evaporation holes and multiple condensation holes E 21 As an example, another evaporative refrigerant flow channel L4 is connected to multiple evaporation holes E of another group of evaporation holes. 22 The shortest path is taken as an example, which should not limit the present application.
[0103] In some embodiments, the angle between the line connecting two adjacent condensation holes in the two groups of condensation holes and the second direction is α 1 , 0°≤α 1 ≤45°. In this way, it can be ensured that the flow path of the refrigerant in each of the two condensing refrigerant flow channels L1-L2 is the shortest and the flow resistance is low.
[0104] For example, Figures 7 to 12 As shown, all condensation holes E of the two groups of condensation holes 11 -E 12They are almost located on a straight line along the second direction, that is, the angle between the connecting line of two adjacent condensation holes in the two groups of condensation holes and the second direction is approximately 0°.
[0105] In some embodiments, the angle between the line connecting two adjacent condensation holes in the two groups of evaporation holes and the second direction is α 2 , 0°≤α 2 ≤45°. In this way, it can be ensured that the flow path of the refrigerant in each of the two evaporative refrigerant flow channels L3-L4 is the shortest and the flow resistance is low.
[0106] For example, Figures 7 to 12 As shown, all the evaporation holes E of the two groups of evaporation holes 21 -E 22 They are almost located on a straight line along the second direction, that is, the angle between the connecting line of two adjacent condensation holes in the two groups of evaporation holes and the second direction is approximately 0°.
[0107] It should be noted that the angle between the connecting line and the second direction involved in the embodiments of the present application can be understood as the angle between the connecting line and the second direction along the clockwise direction or the counterclockwise direction.
[0108] In some embodiments, another condensing refrigerant flow channel L2 and an evaporating refrigerant flow channel L3 are respectively distributed between one condensing refrigerant flow channel L1 and another evaporating refrigerant flow channel L4. In this way, one condensing refrigerant flow channel L1 and another evaporating refrigerant flow channel L4 for transmitting high-temperature and high-pressure refrigerant are arranged on one side of the edge of the condensing substrate 130, reducing the heat loss with the refrigerant in the other condensing refrigerant flow channel L2 and the refrigerant in one evaporating refrigerant flow channel L3.
[0109] In some embodiments, the cross-sectional areas of the two evaporating refrigerant flow channels are respectively larger than the cross-sectional areas of the two condensing refrigerant flow channels. Since the refrigerant flowing in the condensing refrigerant flow channel is mostly liquid, and the refrigerant flowing in the evaporating refrigerant flow channel is mostly gaseous, the flow resistance of the liquid refrigerant is smaller than that of the gaseous refrigerant. Therefore, compared with the cross-sectional area of the condensing refrigerant flow channel, the cross-sectional area of the evaporating refrigerant flow channel is set larger, thereby increasing the pressure drop of the refrigerant flowing in the evaporating refrigerant flow channel.
[0110] In some embodiments, the cross-sectional area of one condensing refrigerant flow channel L1 is greater than the cross-sectional area of another condensing refrigerant flow channel L2. Since the liquid refrigerant flowing in the other condensing refrigerant flow channel L2 is greater than the liquid refrigerant flowing in the one condensing refrigerant flow channel L1, the flow resistance of the refrigerant flowing in the other condensing refrigerant flow channel L2 is less than the flow resistance of the refrigerant flowing in the one condensing refrigerant flow channel L1. Therefore, relative to the cross-sectional area of the other condensing refrigerant flow channel L2, the cross-sectional area of the one condensing refrigerant flow channel L1 is set larger, thereby increasing the pressure drop of the refrigerant flowing in the one condensing refrigerant flow channel L1.
[0111] In some embodiments, the cross-sectional area of the other evaporative refrigerant flow channel L4 is larger than that of the one evaporative refrigerant flow channel L3. Since the liquid refrigerant flowing in the other evaporative refrigerant flow channel L4 is less than that flowing in the one evaporative refrigerant flow channel L3, the flow resistance of the refrigerant flowing in the other evaporative refrigerant flow channel L4 is greater than that of the refrigerant flowing in the one evaporative refrigerant flow channel L3. Therefore, relative to the cross-sectional area of the one evaporative refrigerant flow channel L3, the cross-sectional area of the other evaporative refrigerant flow channel L4 is set larger, thereby increasing the pressure drop of the refrigerant flowing in the other evaporative refrigerant flow channel L4.
[0112] It should be noted that the cross section of the flow channel involved in the present application can be understood as a cross section perpendicular to the extension direction of the flow channel.
[0113] In some embodiments, Figure 7 , Fig. 9 , Figures 11 to 13 As shown, the heat exchanger 100 further includes at least one throttling element, each of which is distributed in the converging flow channel H, and each throttling element is used to control the flow rate from the converging flow channel H into an evaporating refrigerant flow channel L3.
[0114] Exemplarily, the projection of the throttling element along the first direction is arranged between the total projection of the plurality of condensation panels 110 and the total projection of the plurality of evaporation substrates 120 .
[0115] In some embodiments, the throttling element realizes the throttling effect through a device. For example, the throttling element can be a device that can realize the throttling effect, such as an electronic expansion valve (EEV) or a thermal expansion valve. Figure 7 , Fig. 9 , Figures 11 to 13 As shown, the refrigerant substrate 130 further includes a throttling hole T, in which a throttling element is embedded.
[0116] In some embodiments, the throttling element realizes the throttling effect through structural design. The throttling element is a throttling channel, which is used to connect the converging channel H with an evaporating refrigerant channel L3, and the cross-sectional area of each throttling channel connected to the converging channel H is equal to the cross-sectional area of each throttling channel connected to an evaporating refrigerant channel L3.
[0117] In some embodiments, the cross-sectional area of the middle portion of each throttling channel is respectively smaller than the cross-sectional area of the connection between each throttling channel and the converging channel H, and the cross-sectional area of the connection between each throttling channel and an evaporative refrigerant channel L3.
[0118] In some embodiments, along the arrangement direction of the inlet and outlet of the throttling channel, the cross-sectional area of the throttling channel first decreases and then increases. The connection between the throttling channel and the converging channel can be called the inlet of the throttling channel, and the connection between the throttling channel and an evaporative refrigerant channel L3 can be called the outlet of the throttling channel.
[0119] In some embodiments, such as Figure 7 , Fig. 9 , Figures 11 to 13 As shown, a cutout G may also be provided in at least one of the following: between two condensing refrigerant flow channels, between two evaporating refrigerant flow channels, between another condensing refrigerant flow channel and an evaporating refrigerant flow channel, and between the inlet and outlet of the throttling element. In this way, the cutout G forms air isolation, which can reduce the heat transfer of the refrigerant in each refrigerant flow channel through the refrigerant substrate 130, thereby achieving low heat leakage of the heat exchanger 100 and ensuring the high heat exchange performance of the heat exchanger 100. In addition, the cutout G is provided only between two condensing refrigerant flow channels and / or between two evaporating refrigerant flow channels, that is, the cutout G is provided only in the substrate area that contributes the most to the heat leakage effect, which not only simplifies the process steps, but also ensures the structural strength of the refrigerant substrate 130.
[0120] Exemplarily, the cutout G may be formed by cutting the coolant substrate 130 , and may be a straight line or a curved line.
[0121] In some embodiments, the length of the cutout G is greater than or equal to the length of each refrigerant flow channel, and the length of the cutout G is greater than the width of the throttling element T. In this way, the heat insulation effect between the refrigerant flow channels can be increased.
[0122] Illustratively, the cutout G may be a groove, a gap, or a scratch.
[0123] In some embodiments, the refrigerant substrate 130 further includes a heat insulating material, which is distributed in at least one of the following: between two condensing refrigerant flow channels, between two evaporating refrigerant flow channels, between another condensing refrigerant flow channel and one evaporating refrigerant flow channel, and between the inlet and outlet of the throttling element. In this way, the heat insulating material can reduce the heat transfer of the refrigerant in each refrigerant flow channel through the refrigerant substrate 130, thereby achieving low heat leakage of the heat exchanger 100 and ensuring high heat exchange performance of the heat exchanger 100.
[0124] The embodiment of the present application also provides a shunt structure, which is arranged on the refrigerant substrate 130, and is used to shunt the refrigerant in all condensing plates 110 into each evaporating plate 120. In this way, since the shunt structure is directly arranged on the refrigerant substrate 130, it not only reduces the occupied space of the heat exchanger 100 and simplifies the assembly of the heat exchanger 100, but also does not need to consider the sealing problem between the shunt structure and the refrigerant substrate. In addition, when the heat exchanger 100 is in a vibrating environment, it will not affect the shunt structure.
[0125] It should be noted that in the embodiment in which a diversion structure is provided on the refrigerant substrate 130, the one condensing refrigerant flow channel L1, another condensing refrigerant flow channel L2, one evaporating refrigerant flow channel L3, and another evaporating refrigerant flow channel L4 described above may also be provided on the refrigerant substrate 130, and the one condensing refrigerant flow channel L1, another condensing refrigerant flow channel L2, one evaporating refrigerant flow channel L3, and another evaporating refrigerant flow channel L4 described above may also be implemented using external pipelines, which is not limited to this in the embodiment of the present application.
[0126] The refrigerant substrate 130 includes at least one group of flow distribution structures, each group of flow distribution structures includes a plurality of flow distribution channels, and one end of the converging flow channel H is used to connect the condensing refrigerant outlet A of each condensing plate exchanger 110. 12 The other end of the converging flow channel H is used to connect to one end of each branch flow channel of each group of diversion structures, and the other end of each branch flow channel is used to connect to the evaporative refrigerant inlet A of an evaporating plate exchanger 120. 21 , that is, the number of the branch flow channels is equal to the number of the evaporation plates 120 .
[0127] In one example, the cross-section of the flow channel is a polygon such as a square. In another example, the cross-section of the flow channel is a circle, an arc, or an ellipse. In this way, the resistance of the refrigerant in the flow channel is smaller, and the pressure drop is also smaller.
[0128] In some embodiments, the flow diversion structure further includes a flow diversion head structure, which can make the refrigerant in each flow diversion channel more uniform.
[0129] like Fig.15 , Fig.16 and Fig.19 As shown, each group of diversion structures also includes a diverter flow channel D1, which is used to connect the converging flow channel H with multiple diverter flow channels M. The cross-sectional area of the diverter flow channel D1 first decreases and then increases along the direction in which the diverter flow channel D1 and each diverter flow channel M are arranged. In this way, after the refrigerant enters the diverter flow channel D1, it will first shrink slightly, increase in speed and decrease in pressure, and reach the maximum speed when it reaches the narrowest part of the diverter flow channel D1, and then decelerate and expand the pressure. Like a nozzle, the refrigerant is sprayed into each diverter flow channel D1. Because the pressure is relatively large and the refrigerant flow rate is relatively fast, the refrigerant flowing into each diverter flow channel will be relatively uniform.
[0130] In some embodiments, the cross-sectional area of each flow dividing channel M is smaller than the cross-sectional area of the flow dividing head channel D1.
[0131] In some embodiments, the angle between the axial direction of the flow channel D1 of the splitter and the second direction is θ 1 , 0°≤θ 1≤30°. In this way, when the heat exchanger 100 is placed along the second direction, uneven flow distribution caused by gravity can be avoided.
[0132] It should be understood that the axial direction of the splitter flow channel D1 can be understood as the extension direction of the splitter flow channel.
[0133] It should be noted that the angle between the axial direction and the second direction involved in the embodiments of the present application can be understood as the angle between the axial direction and the second direction along the clockwise direction or the counterclockwise direction.
[0134] like Fig.17 and Fig.18 As shown, each group of diversion structures also includes a guide baffle D2, which is used to embed into the converging flow channel H, and a gap B is provided at the connection between the guide baffle D2 and each diversion flow channel. Among them, the guide baffle D2 includes a guide flow channel d, which is used to connect the converging flow channel H with the gap B. In this way, after the refrigerant enters the guide flow channel d of the guide baffle D2, it will first shrink slightly, the speed will increase, and the pressure will decrease. When it reaches the junction of the outlet of the guide flow channel d and the gap B, it will reach the maximum speed, and then slow down and expand the pressure. Like a nozzle, the refrigerant is sprayed into each diversion flow channel. Because the pressure is relatively large and the refrigerant flow rate is relatively fast, the refrigerant flowing into each diversion flow channel is relatively uniform.
[0135] Exemplarily, the guide channel d may be a through hole penetrating the guide baffle D2 along the extension direction of the converging channel H. Exemplarily, the cross-sectional area of the through hole may be in any shape such as a circle, an ellipse, or a square.
[0136] In some embodiments, the distance between the guide baffle D2 and the end of the converging flow channel H away from the guide baffle D2 is greater than the gap. That is, the guide baffle D2 is disposed close to each diverting flow channel M.
[0137] In some embodiments, the angle between the axial direction of the flow guide channel d and the second direction is θ 2 , 0°≤θ 2 ≤30°. In this way, when the heat exchanger 100 is placed along the second direction, uneven flow distribution caused by gravity can be avoided.
[0138] In some embodiments, the cross-sectional area of each branch flow channel is smaller than the cross-sectional area of the converging flow channel and the cross-sectional area of each refrigerant flow channel.
[0139] In one example, the length of each branch flow channel is approximately equal, and the cross-sectional area of each branch flow channel is approximately the same. In another example, the length of each branch flow channel and the cross-sectional area of each branch flow channel are approximately positively correlated. For example, the length of one branch flow channel is smaller than the length of another branch flow channel, and the cross-sectional area of one branch flow channel is smaller than the cross-sectional area of another branch flow channel. In this way, the pressure drop of each branch flow channel can be ensured to be as equal as possible.
[0140] In some embodiments, the angle between the axial direction of the flow diversion channel and the second direction is θ 3 , 0°≤θ 3 ≤30°. In this way, when the heat exchanger 100 is placed along the second direction, uneven flow distribution caused by gravity can be avoided.
[0141] In some embodiments, the refrigerant substrate 130 includes two side surfaces arranged opposite to each other along the second direction, and the connection between each branch flow channel and the converging flow channel is equidistant from one of the two side surfaces. That is, the connection between each branch flow channel M and the converging flow channel H is aligned along the third direction, so that the refrigerant of the converging flow channel H can reach each branch flow channel almost at the same time, so that the distribution of the refrigerant in each branch flow channel is relatively uniform.
[0142] In some embodiments, the number of condensing plates 110 included in the heat exchanger 100 is equal to the number of evaporating plates 120 .
[0143] The thermal management system further includes a compressor, which is used to provide heat exchange power for the heat exchanger 100. The compressor is arranged on the side of the refrigerant substrate 130 away from the condensing plate 110. Figure 7 , Fig. 9 , Figures 11 to 13 , Fig.15 , Fig.17 As shown, the refrigerant substrate 130 includes two side surfaces arranged opposite to each other along the second direction, one of the two side surfaces includes a gas inlet C1 and a gas outlet C2, the gas inlet C1 is used to connect a condensing refrigerant flow channel L1 to the exhaust port of the compressor, and the gas outlet C2 is used to connect another evaporating refrigerant flow channel L4 to the intake port of the compressor.
[0144] like Figure 7 , Fig. 9 , Figures 11 to 13 As shown, the refrigerant substrate 130 also includes a first gas flow channel L5 and a second gas flow channel L6. The first gas flow channel L5 is used to communicate with the gas outlet C2, and the second gas channel L6 is used to communicate with the gas inlet C1 of the compressor 140 and the first refrigerant flow channel L1 respectively. In this way, the compressor can inhale the low-temperature and low-pressure gaseous refrigerant in each evaporator 120 from the first gas flow channel L5 through the gas outlet C2 of the refrigerant substrate 130, compress the low-temperature and low-pressure gaseous refrigerant into a high-temperature and high-pressure gaseous refrigerant, and discharge the high-temperature and high-pressure gaseous refrigerant into the second gas flow channel L6 through the gas inlet C1 of the refrigerant substrate 130, and then flow into the first refrigerant flow channel L1.
[0145] In some embodiments, such as Figure 6As shown, a pressure-temperature sensor S is also provided on one side of the gas inlet C1 of the first gas flow channel L5 close to the refrigerant substrate 130. The pressure-temperature sensor S is used to monitor the pressure and temperature of the high-temperature and high-pressure gaseous refrigerant discharged from the compressor in real time.
[0146] In some embodiments, Figure 6 As shown, a high-pressure switch K is also provided in the first gas flow channel L5. The high-pressure switch K is used to block the high-temperature and high-pressure gas in the first gas flow channel L5 from flowing into a condensing refrigerant flow channel L1 when the pressure of the high-temperature and high-pressure gaseous refrigerant in the first gas flow channel L5 is greater than a threshold value.
[0147] In some embodiments, the thermal management system further includes a gas-liquid separator, and the compressor is arranged on the side of the refrigerant substrate 130 away from the condensation plate 110. Figure 7 , Fig. 9 , Figures 11 to 13 , Fig.15 , Fig.17 As shown, the refrigerant base plate 130 includes a gas separation inlet E s1 Gas outlet E s2 , gas inlet E s1 Used to connect another evaporative refrigerant flow channel L4 with the liquid separator, gas outlet E s2 The gas-liquid separator is used to connect the air inlet of the compressor. In this way, the gas-liquid separator can separate the refrigerant in the gas and liquid states flowing out of the evaporation plate 120, and send the gaseous refrigerant into the compressor.
[0148] like Figure 6 As shown, the third refrigerant flow channel L3 includes a confluence hole H and at least one group of flow distribution structures, and one end of the confluence hole H is used to connect the condensing refrigerant outlet A of each condensing plate exchanger 110. 12 Each group of flow distribution structures includes a guide hole D and a plurality of flow diversion holes M. Each group of flow distribution structures includes a guide hole D and a plurality of flow diversion holes M. In each group of flow distribution structures:
[0149] One end of the guide hole D is used to connect to the other end of the confluence hole H, and the other end of the guide hole D is used to connect to one end of each diversion hole M, and the other end of each diversion hole M is used to connect to the evaporation refrigerant inlet A of an evaporation plate exchanger 120. 21 .
[0150] In some embodiments, the refrigerant substrate 130 includes two substrates, one substrate 131 is arranged on a side of the other substrate 132 away from the evaporation plate 110. For example, the refrigerant substrate 130 includes Figure 7 A substrate 131 and Figure 8 Another substrate 132 is shown. For another example, the refrigerant substrate 130 includes Fig. 9 A substrate 131 and Fig.10Another substrate 132 is shown. For another example, the refrigerant substrate 130 includes Fig.13 A substrate 131 and Figure 4 Another substrate 132 is shown.
[0151] Next, the two groups of condensation holes E on the refrigerant substrate 130 are 11 -E 12 , two sets of evaporation holes E 21 -E 22 , the formation method of two condensing refrigerant flow channels L1-L2, two evaporating refrigerant flow channels L3-L4 and the converging flow channel H is explained.
[0152] ① The refrigerant flow channel is distributed on one of the two substrates 131. Thus, the refrigerant flow channel only needs to be processed on one substrate 131, and the two substrates are welded and assembled into a refrigerant substrate, thereby simplifying the processing technology of the refrigerant substrate.
[0153] For example, a groove corresponding to the condensing refrigerant flow channel L1, a groove corresponding to another condensing refrigerant flow channel L2, a groove corresponding to another evaporating refrigerant flow channel L4, a groove corresponding to the first gas flow channel L5, a groove corresponding to the second gas flow channel L6, and a groove corresponding to the converging flow channel H are respectively processed on the side surface of one substrate 131 facing the other substrate 132. In this way, after the two substrates are welded and assembled into a refrigerant substrate, a groove corresponding to a condensing refrigerant flow channel L1 on one substrate 131 and the side of the other substrate 132 facing one substrate 131 form a condensing refrigerant flow channel L1, a groove corresponding to another condensing refrigerant flow channel L2 and the side of the other substrate 132 facing one substrate 131 form another condensing refrigerant flow channel L2, a groove corresponding to another evaporative refrigerant flow channel L4 and the side of the other substrate 132 facing one substrate 131 form another evaporative refrigerant flow channel L4, a groove corresponding to the first gas flow channel L5 and the side of the other substrate 132 facing one substrate 131 form a first gas flow channel L5, a groove corresponding to the second gas flow channel L6 and the side of the other substrate 132 facing one substrate 131 form a second gas flow channel L6, and a groove corresponding to the confluence flow channel H and the side of the other substrate 132 facing one substrate 131 form a confluence flow channel H.
[0154] In addition, each condensation hole penetrating along the thickness direction of the other substrate 132 is processed on the other substrate 132, and each condensation hole corresponding to each condensation hole on the other substrate 132 is processed on the one substrate 131.
[0155] In the embodiment where the refrigerant substrate includes at least one set of flow distribution structures, a plurality of flow distribution holes are processed on the groove wall of the converging groove to serve as flow distribution channels.
[0156] ② The refrigerant flow channels are distributed on two base plates. Thus, a portion of the refrigerant flow channels is processed on the two base plates at the same time, and the two base plates are welded and assembled into a refrigerant base plate, thereby shortening the processing time of the refrigerant base plate.
[0157] For example, a groove corresponding to a portion of a condensing refrigerant flow channel L1, a groove corresponding to a portion of another condensing refrigerant flow channel L2, a groove corresponding to a portion of another evaporating refrigerant flow channel L4, a groove corresponding to a portion of the first gas flow channel L5, a groove corresponding to a portion of the second gas flow channel L6, and a groove corresponding to a portion of the converging flow channel H are respectively processed on the side of one substrate 131 facing the other substrate 132, and a groove corresponding to the remaining portion of a condensing refrigerant flow channel L1, a groove corresponding to the remaining portion of another condensing refrigerant flow channel L2, a groove corresponding to the remaining portion of another evaporating refrigerant flow channel L4, a groove corresponding to the remaining portion of the first gas flow channel L5, a groove corresponding to the remaining portion of the second gas flow channel L6, and a groove corresponding to the remaining portion of the converging flow channel H are respectively processed on the side of another substrate 132 facing the one substrate 131. In addition, along the arrangement direction of the two substrates, the projection of a groove corresponding to a portion of a condensing refrigerant flow channel L1 on one substrate 131 overlaps with the projection of a groove corresponding to the remaining portion of a condensing refrigerant flow channel L1 on the other substrate 132, the projection of a groove corresponding to a portion of another condensing refrigerant flow channel L2 on one substrate 131 overlaps with the projection of a groove corresponding to the remaining portion of another condensing refrigerant flow channel L2 on the other substrate 132, and the projection of a groove corresponding to a portion of another evaporative refrigerant flow channel L4 on one substrate 131 overlaps with the projection of a groove corresponding to another evaporative refrigerant flow channel L5 on the other substrate 132. 4, the projection of the groove corresponding to a part of the first gas flow channel L5 on one substrate 131 overlaps with the projection of the groove corresponding to the remaining part of the first gas flow channel L5 on the other substrate 132, the projection of the groove corresponding to a part of the second gas flow channel L6 on one substrate 131 overlaps with the projection of the groove corresponding to the remaining part of the second gas flow channel L6 on the other substrate 132, and the projection of the groove corresponding to a part of the confluence channel H on one substrate 131 overlaps with the projection of the groove corresponding to the remaining part of the confluence channel H on the other substrate 132.
[0158] In this way, after the two substrates are welded and assembled into a refrigerant substrate, a groove corresponding to a portion of a condensing refrigerant flow channel L1 on one substrate 131 is buckled with a groove corresponding to the remaining portion of a condensing refrigerant flow channel L1 on the other substrate 132 to form a condensing refrigerant flow channel L1, and a groove corresponding to a portion of another condensing refrigerant flow channel L2 on one substrate 131 is buckled with a groove corresponding to the remaining portion of another condensing refrigerant flow channel L2 on the other substrate 132 to form another condensing refrigerant flow channel L2. A groove corresponding to a portion of another evaporative refrigerant flow channel L4 on one substrate 131 is buckled with a groove corresponding to the remaining portion of another evaporative refrigerant flow channel L4 on the other substrate 132 to form another evaporative refrigerant flow channel L4. A groove corresponding to a portion of the first gas flow channel L5 on one substrate 131 is buckled with a groove corresponding to the remaining portion of the first gas flow channel L5 on the other substrate 132 to form the first gas flow channel L5. The second gas flow channel L6 is formed by fitting a groove corresponding to a portion of the second gas flow channel L6 on one substrate 131 and a groove corresponding to the remaining portion of the second gas flow channel L6 on another substrate 132. The confluence flow channel H is formed by fitting a groove corresponding to a portion of the confluence flow channel H on one substrate 131 and a groove corresponding to the remaining portion of the confluence flow channel H on another substrate 132.
[0159] In addition, each condensation hole penetrating along the thickness direction of the other substrate 132 is processed on the other substrate 132, and each condensation hole corresponding to each condensation hole on the other substrate 132 is processed on the one substrate 131.
[0160] In the embodiment where the refrigerant substrate includes at least one set of flow distribution structures, a plurality of flow distribution holes are processed on the groove wall of the converging groove to serve as flow distribution channels.
[0161] In some embodiments, the cross-section of each flow channel is circular, arc-shaped or elliptical, and each flow channel is distributed in the form of grooves in an embodiment of a substrate 131, such as Fig. 20 As shown, the dimension Δh of each flow channel along the first direction is less than or equal to the maximum dimension H of each refrigerant flow channel. In this way, it is ensured that each flow branching flow channel formed after the two substrates are covered is closed.
[0162] The compressor compresses the low-temperature and low-pressure gaseous refrigerant into a high-temperature and high-pressure gaseous refrigerant, and discharges the high-temperature and high-pressure gaseous refrigerant into the second gas flow channel L6 through the gas inlet C1 of the refrigerant substrate 130, and then flows into a condensing refrigerant flow channel L1. The high-temperature and high-pressure gaseous refrigerant entering a condensing refrigerant flow channel L1 passes through the condensing refrigerant inlet A of each condensing plate 110. 11After entering each condensation plate exchanger 110, the high-temperature and high-pressure gaseous refrigerant releases part of its heat and is converted into a supercooled liquid refrigerant. At the same time, the condensed refrigerant outlet A of each condensation plate exchanger 110 21 The outflowing supercooled liquid flows into another condensing refrigerant flow channel L2. Then, the supercooled liquid refrigerant in another condensing refrigerant flow channel L2 flows along the converging channel H into an evaporating refrigerant flow channel L3. The supercooled liquid refrigerant entering an evaporating refrigerant flow channel L3 passes through the evaporating refrigerant inlet A of each evaporating plate exchanger 120. 21 The supercooled liquid refrigerant enters each evaporation plate exchanger 120; or the supercooled liquid refrigerant in another condensation refrigerant flow channel L2 is divided into each branch flow channel through the branch structure in the converging channel H, and flows into each evaporation plate exchanger 120 through each branch flow channel. After flowing into each evaporation plate exchanger 120, the supercooled liquid absorbs part of the heat and is converted into a low-temperature and low-pressure gas-liquid mixed refrigerant. At the same time, the evaporation refrigerant outlet A of each evaporation plate exchanger 120 22 The low-temperature and low-pressure gas-liquid mixed refrigerant that flows out flows into another evaporative refrigerant flow channel L4. In an embodiment without a gas-liquid separator, the gas-liquid mixed refrigerant that flows into another evaporative refrigerant flow channel L4 flows into the compressor again through the gas outlet C2 of the refrigerant substrate 130, thereby completing the heat exchange cycle. In an embodiment with a gas-liquid separator, the gas-liquid mixed refrigerant that flows into another evaporative refrigerant flow channel L4 flows through the gas outlet E2 of the refrigerant substrate 130. s1 The gas-liquid separator separates the gaseous refrigerant and passes through the gas separation outlet E of the refrigerant substrate 130. s2 The gas flows into the first gas flow channel L5, and then flows into the compressor again through the gas inlet C1 connected to the first gas flow channel L5, thereby completing the heat exchange cycle.
[0163] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A heat exchanger, characterized in that, the heat exchanger includes a refrigerant substrate, a plurality of condensation plate exchangers and a plurality of evaporation plate exchangers. Each of the condensation plate exchangers and each of the evaporation plate exchangers are arranged on the same side of the refrigerant substrate along a first direction. The side of each condensation plate exchanger facing the refrigerant substrate includes a condensation refrigerant inlet and a condensation refrigerant outlet. The side of each evaporation plate exchanger facing the refrigerant substrate includes an evaporation refrigerant inlet and an evaporation refrigerant outlet. The refrigerant substrate includes two condensation refrigerant channels and two evaporation refrigerant channels, wherein: One of the two condensation refrigerant channels is used to connect the condensation refrigerant inlets of each of the condensation plate exchangers, and the other condensation refrigerant channel is used to connect the condensation refrigerant outlets of each of the condensation plate exchangers. One of the two evaporation refrigerant channels is used to connect the other condensation refrigerant channel and the evaporation refrigerant inlets of each of the evaporation plate exchangers, and the other evaporation refrigerant channel is used to connect the evaporation refrigerant outlets of each of the evaporation plate exchangers.
2. The heat exchanger according to claim 1, characterized in that, the other condensation refrigerant channel and the one evaporation refrigerant channel are respectively distributed between the one condensation refrigerant channel and the other evaporation refrigerant channel; the cross-sectional areas of the two evaporation refrigerant channels are respectively larger than the cross-sectional areas of the two condensation refrigerant channels; the cross-sectional area of the one condensation refrigerant channel is larger than the cross-sectional area of the other condensation refrigerant channel; the cross-sectional area of the other evaporation refrigerant channel is larger than the cross-sectional area of the one evaporation refrigerant channel.
3. The heat exchanger according to claim 1 or 2, characterized in that, the arrangement directions of the two condensation refrigerant channels and the two evaporation refrigerant channels are the same as the arrangement direction of the plurality of condensation plate exchangers and the plurality of evaporation plate exchangers; the arrangement direction of the plurality of condensation plate exchangers is the same as the extending direction of each condensation refrigerant channel; the arrangement direction of the plurality of evaporation plate exchangers is the same as the extending direction of each evaporation refrigerant channel.
4. The heat exchanger according to any one of claims 1 to 3, characterized in that, the plurality of condensation plate exchangers are arranged at intervals along a second direction, the plurality of evaporation plate exchangers are arranged at intervals along the second direction, the plurality of condensation plate exchangers and the plurality of evaporation plate exchangers are arranged at intervals along a third direction, and the first direction, the second direction, and the third direction are perpendicular to each other in pairs.
5. The heat exchanger according to any one of claims 1 to 4, characterized in that, The side of the refrigerant substrate facing the condenser plate changer includes two sets of condensation holes and two sets of evaporation holes. Each set of condensation holes includes a plurality of condensation holes, and each set of evaporation holes includes a plurality of evaporation holes. Each condensation hole in one set of the condensation holes is used to connect one condensation refrigerant flow channel with a condensation refrigerant inlet of one condenser plate changer, and each condensation hole in the other set of the condensation holes is used to connect the other condensation refrigerant flow channel with a condensation refrigerant outlet of one condenser plate changer. Each evaporation hole in one set of the evaporation holes is used to connect one evaporation refrigerant flow channel with an evaporation refrigerant inlet of one evaporator plate changer, and each evaporation hole in the other set of the evaporation holes is used to connect the other evaporation refrigerant flow channel with an evaporation refrigerant outlet of one evaporator plate changer, where: The included angle between the connection line of two adjacent condensation holes in the two sets of condensation holes and the second direction is α 1 , 0° ≤ α 1 ≤ 45°, and the included angle between the connection line of two adjacent condensation holes in the two sets of evaporation holes and the second direction is α 2 , 0° ≤ α 2 ≤ 45°.
6. The heat exchanger according to any one of claims 1 to 5, characterized in that, the refrigerant substrate further includes a converging flow channel, the converging flow channel is used to connect the other condensation refrigerant flow channel with the one evaporation refrigerant flow channel, the heat exchanger further includes at least one throttling element, each throttling element is distributed in the converging flow channel, and each throttling element is used to control the flow rate flowing into the one evaporation refrigerant flow channel from the converging flow channel.
7. The heat exchanger according to claim 6, characterized in that, the one evaporation refrigerant flow channel includes a plurality of diverging flow channels, one end of each diverging flow channel is used to connect the converging flow channel, and the other end of each diverging flow channel is used to connect an evaporation refrigerant inlet of one evaporator plate changer.
8. The heat exchanger according to claim 7, characterized in that, the refrigerant substrate further includes a diverging head flow channel, the diverging head flow channel is used to connect the converging flow channel with the plurality of diverging flow channels, and the cross-sectional area of the diverging head flow channel first decreases and then increases along the direction of arrangement of the diverging head flow channel and each diverging flow channel.
9. The heat exchanger according to claim 7, characterized in that, the refrigerant substrate further includes a guiding partition plate, the guiding partition plate is used to be embedded in the converging flow channel, and there is a gap at the connection between the guiding partition plate and each diverging flow channel, where: the guiding partition plate includes a guiding flow channel, and the guiding flow channel is used to connect the converging flow channel with the gap.
10. The heat exchanger according to any one of claims 7 to 9, characterized in that, the cross-sectional area of each diverging flow channel is respectively smaller than the cross-sectional area of the converging flow channel; the lengths of each diverging flow channel are equal, and the cross-sectional areas of each diverging flow channel are the same, or, the length of one diverging flow channel is smaller than the length of the other diverging flow channel, and the cross-sectional area of the one diverging flow channel is smaller than the cross-sectional area of the other diverging flow channel.
11. The heat exchanger according to any one of claims 1 to 10, characterized in that, the refrigerant substrate further includes at least one notch, and the notch is distributed in at least one of the following: between the two condensation refrigerant flow channels, between the two evaporation refrigerant flow channels, between the other condensation refrigerant flow channel and the one evaporation refrigerant flow channel, between the inlet and outlet of the throttling element.
12. The heat exchanger according to claim 11, It is characterized in that The length of the incision is greater than or equal to the length of each refrigerant flow channel.
13. A thermal management system, It is characterized in that The thermal management system includes a compressor and a heat exchanger as described in any one of claims 1 to 12, the compressor is arranged on the side of the refrigerant substrate away from the condensation plate, the refrigerant substrate includes two side surfaces arranged opposite to each other along a second direction, one of the two side surfaces includes a gas inlet and a gas outlet, the gas inlet is used to connect the one condensing refrigerant flow channel with the exhaust port of the compressor, and the gas outlet is used to connect the other evaporating refrigerant flow channel with the intake port of the compressor.
14. The thermal management system according to claim 13, It is characterized in that The thermal management system also includes a gas-liquid separator, which is arranged on the side of the refrigerant substrate away from the condensing plate. The refrigerant substrate includes a gas inlet and a gas outlet. The gas inlet is used to connect the other evaporative refrigerant flow channel with the liquid separator, and the gas outlet is used to connect the air intake of the compressor with the liquid separator.
15. An energy storage device, It is characterized in that The energy storage device comprises at least one battery cell and the thermal management system according to claim 13 or 14, wherein the thermal management system is configured to perform heat exchange with each of the battery cells.
Citation Information
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