Semiconductor product production equipment

Abstract

The invention discloses semiconductor product production equipment, and relates to the technical field of semiconductor detection, the semiconductor product production equipment comprises a control cabinet, the upper end face of the control cabinet is provided with a middle box, the left side and the right side of the middle box are respectively provided with a vacuum pressurization tank and a detection tank, and the openings in the two sides of the middle box are communicated with the openings in the vacuum pressurization tank and the detection tank; the feeding mechanism is mounted in the middle box and is used for feeding the semiconductor products into the vacuum pressurizing tank or the detection tank; a supporting plate is mounted in the middle of the interior of the middle box; through cooperative arrangement of the feeding mechanism, the guide mechanism and the pressing mechanism, full-process operation such as automatic feeding and fluorine oil immersion of the semiconductor device, sealing of the vacuum pressurization tank and transferring of the vacuum pressurization tank and the detection tank can be achieved, tedious manual operation steps are omitted, manual operation before high-temperature fluorine oil is avoided, the production efficiency is improved, and the production cost is reduced. And the detection efficiency and the safety of the semiconductor device are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor detection, and particularly to a production device for semiconductor products. Background Art

[0002] The hermetic packaging of semiconductor devices plays a crucial protective role. The hermetic packaging can not only prevent external substances such as water, dust, and oxides from entering the interior of the semiconductor device to protect its normal operation, but also improve the service life and stability of the components. Therefore, after the production of semiconductor devices, leak detection tests need to be carried out to ensure the production quality of semiconductor devices.

[0003] The carbon fluorocarbon bubble method is a commonly used method for detecting the hermeticity of semiconductor devices. Its detection principle is to first immerse the semiconductor device in a low-boiling-point fluorinated oil and apply pressure. Since the molecules of the low-boiling-point fluorinated oil are small, even tiny leak holes can be penetrated by it. If there are leak holes in the electronic device, when pressure is applied, the low-boiling-point fluorinated oil will enter the device interior. Then, the pressurized semiconductor device is transferred to a fluorinated oil with a high boiling point of about 125°C. The low-boiling-point fluorinated oil will quickly vaporize, causing the pressure inside the device cavity to rise sharply. The gas emerging through the leak holes will form bubbles in the high-boiling-point fluorinated oil, thereby judging the hermeticity of the semiconductor device.

[0004] Currently, for the testing equipment using the carbon fluorocarbon bubble method, its vacuum pressure tank and detection tank are both independently set. When soaking and pressurizing the semiconductor device, it is necessary to manually open the cover of the vacuum pressure tank, close and lock the cover after placing the semiconductor device, and repeat the operation to take it out after the pressurization is completed. The fluorinated oil adhering to the wire basket needs to be drained for at least two minutes or more before it can be placed in the high-boiling-point fluorinated oil for detection. Moreover, there is also a situation of fluorinated oil dripping during the process of transferring the semiconductor device, resulting in low detection efficiency and easy contamination of the detection platform. In addition, there is a certain safety risk when manually holding the wire basket to operate at the detection tank containing the 125°C high-boiling-point fluorinated oil. Therefore, a production device for semiconductor products is needed to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a production device for semiconductor products to solve the problems existing in the prior art as mentioned in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solutions:

[0007] A production device for semiconductor products, comprising:

[0008] A control cabinet, on the upper end surface of which an intermediate box is installed. A vacuum pressure tank and a detection tank are respectively installed on the left and right sides of the intermediate box. The openings on both sides of the intermediate box are communicated with the openings on the vacuum pressure tank and the detection tank;

[0009] A feeding mechanism, which is installed in the intermediate box and is used to send semiconductor products into the vacuum pressurization tank or the detection tank;

[0010] A guiding mechanism, a support plate is installed at the middle position inside the intermediate box, and a guiding mechanism is installed on the support plate. The guiding mechanism is used to enable the feeding mechanism to smoothly enter the vacuum pressurization tank or the detection tank;

[0011] A pressing mechanism, which is installed in the vacuum pressurization tank and the detection tank and is used to drive the feeding mechanism to immerse the semiconductor product into the detection liquid;

[0012] A rotary driving mechanism, which is installed on the support plate and is used to drive the feeding mechanism to drive the semiconductor product to perform centrifugal removal of the surface detection liquid;

[0013] A shielding mechanism, which is installed on the feeding mechanism. The shielding mechanism is used to shield the detection liquid during the centrifugal removal process and is used to prevent the semiconductor product from detaching from the feeding mechanism under the action of centrifugal force.

[0014] A linear driver, which is installed on the intermediate box and is used to drive the feeding mechanism to perform horizontal linear motion.

[0015] Preferably, the feeding mechanism includes a slide rail, a carriage and a connecting frame. The slide rail is installed at the upper side inside the intermediate box. The carriage is slidably connected to the slide rail. The connecting frame is installed on the carriage. A fixed shaft is connected to the lower end of the connecting frame, and a sealing plate is rotatably connected to the fixed shaft;

[0016] A connecting seat is installed on one side of the sealing plate. A lifting rod is vertically slidably connected to the connecting seat. A return spring for driving the lifting rod to slide upward is installed in the connecting seat. A wire basket for placing semiconductor products is installed at one end of the lifting rod.

[0017] Preferably, the guiding mechanism includes guiding strips and guiding blocks. The guiding strips are installed on both sides of the support plate and are arranged in pairs. One end of the guiding strip is provided with a guiding inclined surface. The guiding block is connected to the lower side of the sealing plate. The guiding block can slide between the guiding strips, and a guiding inclined surface is also provided on the guiding block.

[0018] Preferably, the pressing mechanism includes rollers and driving blocks. The rollers are installed at the upper front side of the lifting rod. The driving blocks are respectively installed on the inner top of the vacuum pressurization tank and the detection tank. The driving blocks are provided with inclined surfaces for guiding the lifting rod to move downward.

[0019] Preferably, the rotary drive mechanism includes a gear and a rack. The gear is fixedly installed on the lower side of the sealing plate, and a rack is installed in the middle of the support plate. The gear can mesh with the rack and drive the sealing plate to rotate.

[0020] Preferably, the shielding mechanism includes a connecting rod, side baffles and a cover plate. The connecting rod is installed on the sealing plate, the side baffles are connected to the connecting rod, and a cover plate is also installed on the side baffles. The cover plate is located directly above the wire basket.

[0021] Preferably, a sealing gasket is provided on one end face of the sealing plate.

[0022] Preferably, the linear actuator is a linear slide.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0024] 1. Through the coordinated setting of the feeding mechanism, guiding mechanism and pressing mechanism, the present invention can realize the full-process operations such as automatic feeding and immersion of semiconductor devices in fluorine oil, sealing of the vacuum pressure tank, and transfer between the vacuum pressure tank and the detection tank, eliminating the cumbersome manual operation steps, avoiding manual operation in front of high-temperature fluorine oil, and improving the detection efficiency and safety of semiconductor devices.

[0025] 2. Through the coordinated setting of the rotary drive mechanism, shielding mechanism and feeding mechanism, during the transfer of semiconductor devices from the vacuum pressure tank to the detection tank, most of the fluorine oil on the surface of the wire basket and semiconductor devices can be removed, shortening the draining time and avoiding dripping during the manual transfer process, thereby further improving the detection efficiency of semiconductor devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a front perspective structural schematic diagram of the present invention.

[0027] Figure 2 is a top perspective structural schematic diagram of the present invention.

[0028] Figure 3 is a sectional structural schematic diagram of the intermediate box, vacuum pressure tank and detection tank of the present invention.

[0029] Figure 4 For the present invention Figure 3 is a partial enlarged structural schematic diagram at A in

[0030] Figure 5 is a front perspective structural schematic diagram of the feeding mechanism of the present invention.

[0031] Figure 6 is a bottom perspective structural schematic diagram of the feeding mechanism of the present invention.

[0032] Figure 7 This is a schematic diagram of the feeding mechanism of the present invention in a vacuum pressure tank.

[0033] In the figure: 1, control cabinet; 2, intermediate box; 3, vacuum pressure tank; 4, detection tank; 5, feeding mechanism; 51, slide rail; 52, carriage; 53, connecting frame; 54, sealing plate; 55, connecting seat; 56, lifting rod; 57, return spring; 58, wire basket; 59, sealing gasket; 6, guiding mechanism; 61, guiding strip; 62, guiding block; 7, pressing mechanism; 71, roller; 72, driving block; 8, rotary driving mechanism; 81, gear; 82, rack; 9, shielding mechanism; 91, connecting rod; 92, side baffle; 93, cover plate; 10, linear driver; 11, support plate. Specific embodiments

[0034] In order to make the technical means, creative features, achieved purposes and effects of the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0035] Please refer to Figure 1-7 , the present invention provides the following technical solutions:

[0036] A production device for semiconductor products, comprising: a control cabinet 1, an intermediate box 2 is installed on the upper end surface of the control cabinet 1, a vacuum pressure tank 3 and a detection tank 4 are respectively installed on the left and right sides of the intermediate box 2, and the openings on both sides of the intermediate box 2 are communicated with the openings on the vacuum pressure tank 3 and the detection tank 4; the vacuum pressure tank 3 is used for containing low-boiling fluorinated oil, the detection tank 4 is used for containing high-boiling fluorinated oil, the detection tank 4 is made of a transparent material for easy observation of the internal detection situation, and the intermediate box 2 can collect the fluorinated oil dropped by the removed semiconductor devices.

[0037] A feeding mechanism 5, the feeding mechanism 5 is installed in the intermediate box 2 and is used for sending semiconductor products into the vacuum pressure tank 3 or the detection tank 4; a linear driver 10, the linear driver 10 is installed on the intermediate box 2 and is used for driving the feeding mechanism 5 to move horizontally in a straight line, and the linear driver 10 is a linear slide, and the linear slide can provide a stable linear driving force. The feeding mechanism 5 includes a slide rail 51, a carriage 52 and a connecting frame 53, the slide rail 51 is installed at the upper side position inside the intermediate box 2, the carriage 52 is slidably connected to the slide rail 51, the connecting frame 53 is installed on the carriage 52, a fixed shaft is connected to the lower end of the connecting frame 53, and a sealing plate 54 is rotatably connected to the fixed shaft, and the sealing plate 54 can rotate relative to the connecting frame 53, providing a structural basis for the centrifugal oil removal and direction conversion of semiconductor devices.

[0038] One side of the sealing plate 54 is provided with a connecting seat 55. A lifting rod 56 is vertically slidably connected to the connecting seat 55. A return spring 57 for driving the lifting rod 56 to slide upward is installed in the connecting seat 55. One end of the lifting rod 56 is provided with a wire basket 58 for placing semiconductor products. A sealing gasket 59 is provided on one side end face of the sealing plate 54. The sealing gasket 59 can improve the sealing performance between the sealing plate 54 and the opening of the vacuum pressure tank 3. The wire basket 58 is used for placing semiconductor devices to be detected. The lifting and lowering movement of the lifting rod 56 can make the wire basket 58 immerse in the fluorinated oil.

[0039] A guiding mechanism 6. A support plate 11 is installed at the middle position inside the intermediate box 2. The guiding mechanism 6 is installed on the support plate 11. The guiding mechanism 6 is used to enable the feeding mechanism 5 to smoothly enter the vacuum pressure tank 3 or the detection tank 4. The guiding mechanism 6 includes guiding strips 61 and guiding blocks 62. The guiding strips 61 are installed at both sides of the support plate 11 and are arranged in pairs. One end of the guiding strip 61 is provided with a guiding inclined surface. The guiding block 62 is connected to the lower side of the sealing plate 54. The guiding block 62 can slide between the guiding strips 61, and the guiding block 62 is also provided with a guiding inclined surface. Through the cooperation of the guiding strips 61 and the guiding blocks 62, the wire basket 58 can smoothly enter the vacuum pressure tank 3 or the detection tank 4, and enable the pressing mechanism 7 to smoothly drive the lifting rod 56.

[0040] A pressing mechanism 7. The pressing mechanism 7 is installed in the vacuum pressure tank 3 and the detection tank 4 and is used to drive the feeding mechanism 5 to immerse the semiconductor products into the detection liquid. The pressing mechanism 7 includes rollers 71 and driving blocks 72. The rollers 71 are installed at the upper side of the front end of the lifting rod 56. The driving blocks 72 are respectively installed at the inner top of the vacuum pressure tank 3 and the detection tank 4. The driving blocks 72 are provided with inclined surfaces for guiding the lifting rod 56 to move downward. After the wire basket 58 enters the vacuum pressure tank 3 or the detection tank 4, the wire basket 58 can automatically descend to immerse the semiconductor devices into the fluorinated oil, and when the wire basket 58 disengages from the vacuum pressure tank 3 or the detection tank 4, the wire basket 58 can disengage from the fluorinated oil.

[0041] A rotary driving mechanism 8. The rotary driving mechanism 8 is installed on the support plate 11 and is used to drive the feeding mechanism 5 to drive the semiconductor products to perform centrifugal removal of the surface detection liquid. The rotary driving mechanism 8 includes a gear 81 and a rack 82. The gear 81 is fixedly installed at the lower side of the sealing plate 54. The rack 82 is installed in the middle of the support plate 11. The gear 81 can engage with the rack 82 and drive the sealing plate 54 to rotate. When the feeding mechanism 5 passes through the middle position of the intermediate box 2, the rotary driving mechanism 8 can drive the sealing plate 54 to rotate to realize the removal of the fluorinated oil on the wire basket 58 and the semiconductor devices.

[0042] A shielding mechanism 9 is installed on the feeding mechanism 5. The shielding mechanism 9 is used to shield the detection liquid during the centrifugal removal process and to prevent the semiconductor product from detaching from the feeding mechanism 5 under the action of centrifugal force. The shielding mechanism 9 includes a connecting rod 91, side baffles 92 and a cover plate 93. The connecting rod 91 is installed on the sealing plate 54. The side baffles 92 are connected to the connecting rod 91. The cover plate 93 is also installed on the side baffles 92. The cover plate 93 is located directly above the wire basket 58. When the wire basket 58 is in the upper position, the shielding mechanism 9 can cover the upper opening of the wire basket 58 to prevent the semiconductor device from being thrown out during the rotation of the wire basket 58, and the side baffles 92 can prevent the fluorine oil from splashing into the vacuum pressure tank 3 or the detection tank 4 during the centrifugal removal process.

[0043] The working process of the present invention is as follows:

[0044] When a leak detection test needs to be performed on a semiconductor device, first press down the lifting rod 56 to separate the wire basket 58 from the shielding mechanism 9, and place the semiconductor device to be detected into the wire basket 58. Start the linear actuator 10 to drive the feeding mechanism 5 to move to the left, and the wire basket 58 enters the vacuum pressure tank 3. During this process, the roller 71 contacts and is pressed by the driving block 72 in the vacuum pressure tank 3, causing the lifting rod 56 to slide downward in the connecting seat 55. The lifting rod 56 drives the wire basket 58 to move downward, so that the semiconductor device in the wire basket 58 is immersed in the low-boiling-point fluorine oil contained in the vacuum pressure tank 3. At the same time, the sealing plate 54 is tightly pressed against the opening of the vacuum pressure tank 3 through the sealing gasket 59 to achieve sealing, and nitrogen is introduced into the vacuum pressure tank 3 for pressurization.

[0045] After the pressurization is completed, the vacuum pressure tank 3 is depressurized. The linear actuator 10 drives the feeding mechanism 5 to move to the right, so that the wire basket 58 gradually moves out of the vacuum pressure tank 3. During this process, the return spring 57 pushes the lifting rod 56 upward, so that the wire basket 58 is separated from the fluorine oil, and the cover plate 93 covers the upper opening of the wire basket 58, and the side baffle 92 is located on the left side of the wire basket 58.

[0046] When the feeding mechanism 5 moves to the middle position of the intermediate box 2 and the gear 81 meshes with the rack 82, the sealing plate 54 rotates to generate centrifugal force, removing the residual fluorine oil on the surface of the wire basket 58 and the semiconductor device. According to the number of rotation turns, the number of teeth of the rack 82 is set so that when the gear 81 disengages from the rack 82, the wire basket 58 faces the detection tank 4. Under the action of the guiding mechanism 6, the wire basket 58 enters the detection tank 4 in the positive direction, and the pressing mechanism 7 drives the wire basket 58 into the high-boiling-point fluorine oil, and judges whether the semiconductor device is qualified according to the generation of bubbles.

[0047] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art will appreciate that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor product production equipment, characterized in that: include: A control cabinet (1), wherein an intermediate box (2) is installed on the upper end surface of the control cabinet (1), and a vacuum pressure tank (3) and a detection tank (4) are installed on the left and right sides of the intermediate box (2), respectively, and the openings on both sides of the intermediate box (2) are connected to the openings on the vacuum pressure tank (3) and the detection tank (4); A feeding mechanism (5), the feeding mechanism (5) is installed in the intermediate box (2) and is used to feed the semiconductor product into the vacuum pressure tank (3) or the detection tank (4); A guide mechanism (6), wherein a support plate (11) is installed at a middle position inside the intermediate box (2), and a guide mechanism (6) is installed on the support plate (11), and the guide mechanism (6) is used to allow the feeding mechanism (5) to smoothly enter the vacuum pressure tank (3) or the detection tank (4); A pressing mechanism (7), the pressing mechanism (7) being installed in the vacuum pressure tank (3) and the detection tank (4), and being used to drive the feeding mechanism (5) to immerse the semiconductor product into the detection liquid; A rotary drive mechanism (8), the rotary drive mechanism (8) being mounted on the support plate (11) and used to drive the feeding mechanism (5) to drive the semiconductor product to undergo centrifugal removal of surface detection liquid; A shielding mechanism (9), the shielding mechanism (9) being mounted on the feeding mechanism (5), the shielding mechanism (9) being used to shield the detection liquid during the centrifugal removal process and to prevent the semiconductor product from being separated from the feeding mechanism (5) under the action of centrifugal force; A linear drive (10), wherein the linear drive (10) is mounted on the middle box (2) and is used to drive the feeding mechanism (5) to move horizontally and linearly.

2. The semiconductor product production equipment according to claim 1, characterized in that: The feeding mechanism (5) comprises a slide rail (51), a slide frame (52) and a connecting frame (53); the slide rail (51) is installed at an upper position inside the intermediate box (2); the slide frame (52) is slidably connected to the slide rail (51); the connecting frame (53) is installed on the slide frame (52); a fixed shaft is connected to the lower end of the connecting frame (53); a sealing plate (54) is rotatably connected to the fixed shaft; A connecting seat (55) is installed on one side of the sealing plate (54), and a lifting rod (56) is vertically slidably connected to the connecting seat (55). A return spring (57) for driving the lifting rod (56) to slide upward is installed in the connecting seat (55), and a net basket (58) for placing semiconductor products is installed at one end of the lifting rod (56).

3. The semiconductor product production equipment according to claim 2, characterized in that: The guide mechanism (6) comprises a guide bar (61) and a guide block (62). The guide bars (61) are installed at two sides of the support plate (11) and are arranged in pairs. One end of the guide bar (61) is provided with a guide slope. The guide block (62) is connected to the lower side of the sealing plate (54). The guide block (62) can slide between the guide bars (61), and the guide block (62) is also provided with a guide slope.

4. The semiconductor product production equipment according to claim 2, characterized in that: The pressing mechanism (7) comprises a roller (71) and a driving block (72); the roller (71) is mounted on the upper front end of the lifting rod (56); the driving block (72) is mounted on the inner tops of the vacuum pressure tank (3) and the detection tank (4), respectively; and the driving block (72) is provided with an inclined surface for guiding the lifting rod (56) to move downward.

5. The semiconductor product production equipment according to claim 2, characterized in that: The rotary drive mechanism (8) comprises a gear (81) and a rack (82); the gear (81) is fixedly mounted at the lower side of the sealing plate (54); the rack (82) is mounted at the middle of the support plate (11); the gear (81) can mesh with the rack (82) and drive the sealing plate (54) to rotate.

6. The semiconductor product production equipment according to claim 2, characterized in that: The shielding mechanism (9) comprises a connecting rod (91), a side baffle plate (92) and a cover plate (93); the connecting rod (91) is mounted on a sealing plate (54); the side baffle plate (92) is connected to the connecting rod (91); a cover plate (93) is also mounted on the side baffle plate (92); and the cover plate (93) is located directly above the net basket (58).

7. The semiconductor product production equipment according to claim 3, characterized in that: A sealing gasket (59) is provided on one end surface of the sealing plate (54).

8. The semiconductor product production equipment according to claim 1, characterized in that: The linear drive (10) is a linear slide.

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