IC chip burning detection device and detection method

Abstract

The invention discloses an IC chip burning detection device and method, and relates to the field of chip burning detection device.The detection device comprises a feeding mechanism and a transmission case, a feeding mechanism is erected on the top of the feeding mechanism, the feeding mechanism comprises a feeding roller B and a feeding roller A connected with an output shaft at the bottom of the transmission case, and the feeding roller B is connected with the transmission case. The feeding mechanism comprises a feeding roller B and a feeding roller A connected with an output shaft at the top of the transmission box, and the feeding roller A and the feeding roller B are sleeved with feeding belts in a transmission mode. The defects in the prior art are overcome, efficient and accurate detection and classification of the IC chips are achieved through innovative mechanical structure design and automatic control, the problems that a traditional device is low in efficiency, poor in precision, large in manual intervention and the like can be effectively solved, and high social use value and application prospects are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip programming and detection equipment, and particularly relates to an IC chip programming and detection device and a detection method. Background Art

[0002] An IC chip is a microelectronic circuit that integrates a large number of microelectronic components on a semiconductor wafer. Before using the IC chip, information such as a programmed program, data, or firmware needs to be written into the storage unit or logic unit inside the integrated circuit chip through specific equipment and software, which is called programming. After programming, the chip needs to be subjected to appearance inspection, function inspection, and data verification.

[0003] In the existing programming and detection, the appearance of the chip is detected by 3D detection. However, when detecting the chip during the placement process, only the front of the chip can be simply detected, but the back of the chip cannot be detected. Therefore, it is impossible to determine whether the chip is due to incomplete programming or there are quality problems with the chip itself, and manual verification is required later, which is time-consuming and laborious.

[0004] Moreover, when detecting the programming situation of the chip through a specific detection seat, the chip is grabbed and placed by a manipulator. Only one chip can be clamped at a time, and the transfer of the chip also needs to be conveyed by the manipulator, resulting in a relatively slow actual detection efficiency of the chip and unable to perform batch transfer. Summary of the Invention

[0005] In order to achieve a pipeline operation mode for the appearance visual inspection and programming detection of the chip, for the purpose of improving the programming detection efficiency of the chip, the present invention adopts the following technical solutions: An IC chip programming and detection device includes a feeding mechanism and a transmission box. A feeding conveyor is erected on the top of the feeding mechanism. The feeding mechanism includes a feeding roller B and a feeding roller A connected to the output shaft at the bottom of the transmission box. A feeding belt is sleeved on the feeding roller A and the feeding roller B in a driving manner. The feeding conveyor includes a feeding roller B and a feeding roller A connected to the output shaft at the top of the transmission box. A feeding belt is sleeved on the feeding roller A and the feeding roller B in a driving manner. Feeding rollers C are provided on the outer sides of both ends of the feeding roller A and the feeding roller B, and a synchronous belt is sleeved on the feeding rollers C in a driving manner. Inside the feeding belt, a vision detector, a detection platform, a take-up belt A, and a take-up belt B are sequentially arranged. A clamping mechanism is provided on the feeding conveyor.

[0006] Preferably, a driving motor is provided at the bottom outside of the transmission case. IC chips are placed at equal intervals on the feeding belt. The feeding belt is provided with limiting strips for stably placing the IC chips. Detection probes A and B are respectively provided on the top bottom surface and the bottom bottom surface of the vision detector. A burning and detection seat is provided on the top of the detection platform.

[0007] Preferably, a mounting seat is provided on the synchronous belt, and an electric push rod for driving the reset mechanism to move is provided inside the mounting seat.

[0008] Preferably, the clamping mechanism includes a clamping frame. Hanging frames connected to the synchronous belt are provided on both sides of the clamping frame. A sealing plate is provided on the top of the clamping frame.

[0009] Preferably, side through holes A are respectively opened on the left and right sides of the bottom surface of the clamping frame, and a middle through hole A is opened in the middle of the bottom surface of the clamping frame. Side through holes B corresponding to the positions of the side through holes A are respectively opened on the left and right sides of the top surface of the sealing plate, and a middle through hole B corresponding to the position of the middle through hole A is opened in the middle of the top surface of the sealing plate.

[0010] Preferably, side clamping plates A and B are respectively slidably sleeved on the left and right sides inside the side through hole A, and middle clamping plates are slidably sleeved on the left and right sides inside the middle through hole A.

[0011] Preferably, racks A are provided on the surfaces of the side clamping plates A and B, racks B are provided on the other side surface of the side clamping plate B and the outer side surface of the middle clamping plate, and a linkage gear meshing and matching with the rack B is provided inside the clamping frame.

[0012] Preferably, transverse movement holes for sliding the side clamping plates A, B and the middle clamping plates are opened on the sides of the side through hole A and the middle through hole A. A gear set meshing and matching with the rack A is rotatably provided inside the side through hole A; The gear set includes a driving gear meshing and matching with the rack A on the side surface of the side clamping plate A, and a driven gear meshing and matching with the rack A on the side surface of the side clamping plate B. Synchronous gears A and B for synchronizing the transmission between the driving gear and the driven gear are provided between the driving gear and the driven gear.

[0013] Preferably, mounting holes are opened on the feeding belt, and a reset mechanism slidably sleeved with the mounting holes is provided on the feeding belt; Guide holes are respectively opened on the left and right side surfaces of the clamping frame. The reset mechanism includes a reset frame slidably sleeved with the mounting holes. A baffle is provided in the middle of the reset frame. A reset spring is provided on the side surface of the baffle, and the other end of the reset spring is fixedly connected to the inner side surface of the mounting hole. A stabilizing frame slidably sleeved with the mounting hole is provided on the top surface of the baffle, and the end of the reset frame is fixedly connected to the end of the pushing frame.

[0014] A detection method for an IC chip burning and detection device includes the following steps: S1: The IC chip after the burning process is grasped and placed on the top surface of the feeding belt by a mechanical gripper provided externally, and the IC chip is placed with its front side facing down. Then, the internal gear transmission of the transmission box is controlled by a driving motor, and the feeding belt conveys the IC chip to directly below the side through-hole B and the middle through-hole B. At this time, the detection probe B performs surface damage detection on the back of the IC chip. S2: The output shafts of the electric push rods at corresponding positions are activated, enabling the side clamping plate A, the side clamping plate B, and the middle clamping plate to clamp the IC chip placed on the top surface of the feeding belt. Then, by the overall movement of the feeding mechanism, the clamping mechanism is driven to move clockwise until the clamping mechanism loaded with the IC chip moves directly below the detection probe A, allowing the detection probe A to perform surface damage detection on the front of the IC chip. S3: After both the back and front of the IC chip have passed the detection by the vision detector, driven by the feeding mechanism, the IC chip is conveyed directly above the burning detection seat. The burning detection seat will raise its height through the internal components of the detection platform, release the clamping of the IC chip by the clamping mechanism, and make the top surface of the burning detection seat in contact with the back of the IC chip. Then, it will lower its height, and the internal components of the burning detection seat will detect and process the burning condition of the IC chip. After the detection is completed, the unqualified IC chip will be lifted to the initial height by the burning detection seat, and the previous clamping mechanism will re-clamp the IC chip. After the clamping mechanism has clamped the IC chip, the burning detection seat will lower its height to ensure that the clamping mechanism can pass over its top surface with the IC chip. Then, the next empty clamping mechanism will move directly above the burning detection seat, and the burning detection seat will raise the height of the qualified IC chip to allow it to clamp the IC chip. S4: According to the detection results of the vision detector and the detection platform, the feeding mechanism drives the two clamping mechanisms respectively loaded with qualified chips and unqualified chips to move. The qualified IC chips are conveyed by the next empty clamping mechanism and placed in the top surface grooves of the winding belt A. The unqualified IC chips are conveyed by the previous clamping mechanism and placed in the top surface grooves of the winding belt B. Then, through the winding operations at the ends of the winding belt A and the winding belt B, during the winding process, film sealing treatment is performed on their top surfaces.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. Through the automated design of the feeding mechanism and the feeding mechanism, continuous conveyance and detection of IC chips are achieved, reducing manual intervention and significantly improving the detection efficiency. The dual detection mechanism of the vision detector and the detection platform can simultaneously complete surface damage detection and burning detection, avoiding multiple handling and repeated detection. The vision detector is equipped with detection probe A and detection probe B, which can perform high-precision vision detection on the front and back of the IC chip to ensure a comprehensive inspection of surface damage.

[0016] 2. Through the setting of the clamping mechanism, and by using the settings of the side through-hole A, the middle through-hole A, the side through-hole B, and the middle through-hole B, it is possible to accurately dock the IC chip with the programming and testing socket according to the placement position of the IC chip and the placement position of the programming and testing socket, without the need for an external manipulator to perform repeated picking and placing, thus improving the actual testing efficiency of the IC chip.

[0017] 3. Through the cooperation of the clamping mechanism, the winding belt A, and the winding belt B, it is possible to automatically store the qualified and unqualified IC chips separately and complete the film sealing process, reducing the errors and time costs of manual classification.

[0018] 4. Through the design of the reset mechanism and the electric push rod, the stability and reliability of the clamping mechanism are ensured, and the failure rate is reduced. At the same time, the device adopts a modular design, and the structures of each component are compact, which is convenient for installation, maintenance, and upgrading.

[0019] In summary, the present invention overcomes the deficiencies of the prior art. With innovative mechanical structure design and automated control, it realizes the efficient and accurate detection and classification of IC chips, can effectively solve problems such as low efficiency, poor accuracy, and excessive manual intervention of traditional devices, and has high social use value and application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0021] Figure 1 is a schematic diagram of the overall structure of the present invention; Figure 2 is a front view of the overall structure of the present invention; Figure 3 is a schematic diagram of the structural splicing of the synchronous belt and the clamping mechanism in the present invention; Figure 4 is the Figure 3 local enlarged view of part A therein; Figure 5 is an exploded view of the structure of the clamping mechanism in the present invention; Figure 6 is a schematic diagram of the structural position of the clamping mechanism and the testing platform in the present invention; Figure 7 is an exploded view of the structure of the reset mechanism in the present invention; Figure 8 is a schematic diagram of the structural position of the reset mechanism and the feeding belt in the present invention; Figure 9 This Figure 1 is the enlarged view of the local structure at position B in this Figure 10 This Figure 5 is the enlarged view of the local structure at position C in this

[0022] In the figure: 100, IC chip; 200, vision detector; 2001, detection probe A; 2002, detection probe B; 300, detection platform; 3001, programming detection seat; 1, feeding mechanism; 101, feeding roller A; 102, feeding roller B; 103, feeding belt; 1031, limiting strip; 2, feeding mechanism; 201, feeding belt; 2011, mounting hole; 202, feeding roller A; 203, feeding roller B; 204, feeding roller C; 205, synchronous belt; 2051, mounting seat; 2052, electric push rod; 3, transmission box; 31, driving motor; 4, take-up belt A; 5, take-up belt B; 6, clamping mechanism; 601, clamping frame; 6011, side through hole A; 6012, middle through hole A; 6013, hanging bracket; 6014, transverse movement hole; 602, sealing plate; 6021, side through hole B; 6022, middle through hole B; 603, linkage gear; 604, side clamping plate A; 6041, rack A; 605, side clamping plate B; 6051, rack B; 606, middle clamping plate; 607, gear set; 6071, driving gear; 6072, synchronous gear A; 6073, synchronous gear B; 6074, driven gear; 61, guiding hole; 8, reset mechanism; 801, reset frame; 802, baffle; 803, reset spring; 804, stabilizing frame; 805, pushing frame. Detailed implementation manners

[0023] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0024] Embodiment 1 Refer to Figures 1 - 10, an IC chip programming and detection device, comprising a feeding mechanism 1 and a transmission box 3. A feeding conveyor 2 is mounted on top of the feeding mechanism 1. The feeding mechanism 1 includes a feeding roller B102 and a feeding roller A101 connected to the bottom output shaft of the transmission box 3. A feeding belt 103 is sleeved on the feeding roller A101 and the feeding roller B102. The feeding conveyor 2 includes a feeding roller B203 and a feeding roller A202 connected to the top output shaft of the transmission box 3. A feeding belt 201 is sleeved on the feeding roller A202 and the feeding roller B203. Feeding rollers C204 are provided on the outer sides of both ends of the feeding roller A202 and the feeding roller B203. A timing belt 205 is sleeved on the feeding rollers C204; Inside the feeding belt 201, a vision detector 200, a detection platform 300, a take-up belt A4, and a take-up belt B5 are successively arranged. A clamping mechanism 6 is provided on the feeding conveyor 2. Mounting holes 2011 are formed in the feeding belt 201. A reset mechanism 8 slidably sleeved with the mounting holes 2011 is provided on the feeding belt 201. A lifting device is provided inside the detection platform 300.

[0025] Specifically, referring to Figures 1 - 3 、 Figure 6 and Figure 9, a drive motor 31 is provided at the outer bottom of the transmission box 3. IC chips 100 are placed at equal intervals on the feeding belt 103. A limiting strip 1031 for stably placing the IC chips 100 is provided on the feeding belt 103. Detection probes A2001 and B2002 are respectively provided on the top bottom surface and the bottom bottom surface of the vision detector 200. A programming and detection seat 3001 is provided on the top of the detection platform 300. A lifting device provided inside the detection platform 300 is used to control the use height of the programming and detection seat 3001, so that the top surface of the programming and detection seat 3001 is in contact connection with the bottom surface of the IC chip 100. The setting of the transmission box 3 can synchronously control the feeding mechanism 1 and the feeding mechanism 2 to rotate intermittently for conveying the IC chips 100. The settings of the detection probes A2001 and B2002 can perform visual detection of surface damage on the front and back according to the position of the IC chip 100 to remove damaged IC chips 100. When detecting the programming situation of the IC chip 100, the clamping mechanism 6 drives the IC chip 100 to move directly above the programming and detection seat 3001, and then controls the programming and detection seat 3001 to rise in height through the lifting device inside the detection platform 300, so that the top surface of the programming and detection seat 3001 is in contact connection with the bottom surface of the IC chip 100. The programming and detection seat 3001 descends in height to allow the programming and detection seat 3001 to detect the programming situation of the IC chip 100. After the detection is completed, the programming and detection seat 3001 is lifted in height, the clamping mechanism 6 clamps the IC chip 100, and then controls the programming and detection seat 3001 to descend in height. The two clamping mechanisms 6 respectively drive the IC chip 100 to be conveyed to the top surfaces of the winding belt A4 and the winding belt B5 for the distribution placement of qualified and unqualified IC chips 100. The IC chips 100 after the programming operation will be grabbed by an external manipulator and placed on the top surface of the feeding belt 103, and then visually detected and programmed and detected by this device, improving the detection efficiency.

[0026] Specifically, referring to Figure 3 , Figure 4 , Figure 7 and Figure 8 , an installation seat 2051 is provided on the synchronous belt 205. An electric push rod 2052 for driving the reset mechanism 8 to move is provided inside the installation seat 2051. The number of electric push rods 2052 needs to be adapted to the number of the clamping mechanism 6 and the reset mechanism 8 to cooperate with the reset mechanism 8 to adjust the positions of the internal components of the clamping mechanism 6.

[0027] Embodiment 2 Referring to Figures 1 - 10, The difference between this embodiment and Embodiment 1 is that the clamping mechanism 6 includes a clamping frame 601. Suspension frames 6013 connected to the synchronous belt 205 are provided on both sides of the clamping frame 601. A sealing plate 602 is provided on the top of the clamping frame 601. The movement of the synchronous belt 205 drives the synchronous movement of the clamping mechanism 6.

[0028] Specifically, referring to Figures 3 - 6 , side through holes A6011 are formed on the left and right sides of the bottom surface of the clamping frame 601, and a middle through hole A6012 is formed in the middle of the bottom surface of the clamping frame 601. Side through holes B6021 corresponding to the positions of the side through holes A6011 are formed on the left and right sides of the top surface of the sealing plate 602, and a middle through hole B6022 corresponding to the position of the middle through hole A6012 is formed in the middle of the top surface of the sealing plate 602. The positions of the side through holes A6011 and the side through holes B6021 correspond, and the positions of the middle through hole A6012 and the middle through hole B6022 correspond, which facilitates the IC chip 100 to be located therein and facilitates the clamping mechanism 6 to complete the clamping operation on the IC chip 100.

[0029] Specifically, referring to Figure 5 and Figure 6 , side clamping plates A604 and side clamping plates B605 are respectively and slidably sleeved on the left and right sides inside the side through hole A6011, and middle clamping plates 606 are slidably sleeved on the left and right sides inside the middle through hole A6012. The side clamping plates A604 and the side clamping plates B605 can move in opposite directions at the same speed inside the side through hole A6011 to complete the clamping operation on the IC chip 100, and the two middle clamping plates 606 can move relatively at the same speed inside the middle through hole A6012 to complete the clamping operation on the IC chip 100.

[0030] Specifically, referring to Figure 5 and Figure 6 , racks A6041 are provided on the surfaces of the side clamping plates A604 and the side clamping plates B605, racks B6051 are provided on the other side surface of the side clamping plates B605 and the outer side surfaces of the middle clamping plates 606, and a linkage gear 603 meshing with the rack B6051 is provided inside the clamping frame 601. The movement of the side clamping plate A604 can drive the movement of the side clamping plate B605 through the meshing of the gear and the rack, and the movement of the side clamping plate B605 can drive the movement of the middle clamping plate 606 through the meshing effect of the gear and the rack.

[0031] Specifically, referring to Figure 5 、 Figure 6 and Figure 10 , transverse movement holes 6014 for the side clamping plates A604, the side clamping plates B605 and the middle clamping plates 606 to slide are formed on the sides of the side through hole A6011 and the middle through hole A6012, and a gear set 607 meshing with the rack A6041 is rotatably provided inside the side through hole A6011; The gear set 607 includes a driving gear 6071 that meshes and matches with the rack A6041 on the side of the side clamping plate A604, and a driven gear 6074 that meshes and matches with the rack A6041 on the side of the side clamping plate B605. Between the driving gear 6071 and the driven gear 6074, there are a synchronizing gear A6072 and a synchronizing gear B6073 for synchronizing their transmissions. The setting of the gear set 607 ensures that the moving speeds of the side clamping plate A604 and the side clamping plate B605 are the same, and at the same time, their moving directions are opposite, enabling the side clamping plate A604 and the side clamping plate B605 to cooperate with each other to complete the clamping and placing operations on the IC chip 100.

[0032] Specifically, referring to Figure 1 and Figures 5 - 8 , guiding holes 61 are provided on both the left and right sides of the clamping frame 601. The reset mechanism 8 includes a reset frame 801 that is slidably sleeved in the mounting hole 2011. A baffle 802 is provided in the middle of the reset frame 801. A reset spring 803 is provided on the side of the baffle 802, and the other end of the reset spring 803 is fixedly connected to the inner side of the mounting hole 2011. A stabilizing frame 804 that is slidably sleeved in the mounting hole 2011 is provided on the top surface of the baffle 802. The end of the reset frame 801 is fixedly connected to the end of the pushing frame 805. The pushing frame 805 can be inserted into the inside of the guiding hole 61. The end of the pushing frame 805 is in direct contact with the side clamping plate A604 at both ends of the clamping mechanism 6. The reset mechanisms 8 at both the left and right ends of the clamping mechanism 6 can be synchronously regulated by the electric push rod 2052 to enable the clamping mechanism 6 to perform the clamping and placing operations on the IC chip 100.

[0033] For other structures not described, refer to Embodiment 1.

[0034] Embodiment 3 A detection method for an IC chip programming and detection device includes the following steps: S1: The programmed IC chip 100 is grabbed and placed on the top surface of the feeding tape 103 by a mechanical gripper provided externally, and the IC chip 100 is placed with its front side facing down. Then, the internal gears of the transmission box 3 are driven by the driving motor 31 to make the feeding tape 103 convey the IC chip 100 to directly below the side through hole B6021 and the middle through hole B6022. At this time, the detection probe B2002 performs a surface damage detection on the back of the IC chip 100. S2: The output shaft of the electric push rod 2052 at the corresponding position is opened to enable the side clamping plate A604, the side clamping plate B605, and the middle clamping plate 606 to perform a clamping operation on the IC chip 100 placed on the top surface of the feeding tape 103. Then, by the overall movement of the feeding mechanism 2, the clamping mechanism 6 is driven to rotate clockwise until the clamping mechanism 6 loaded with the IC chip 100 moves to directly below the detection probe A2001, allowing the detection probe A2001 to perform a surface damage detection operation on the front of the IC chip 100. S3: After both the back and front of the IC chip 100 have passed the detection of the vision detector 200, driven by the feeding mechanism 2, the IC chip 100 is conveyed above the programming and detection seat 3001. The programming and detection seat 3001 will lift its height through the internal components of the detection platform 300, release the clamping of the IC chip 100 by the clamping mechanism 6, make the top surface of the programming and detection seat 3001 in contact with the back of the IC chip 100, then lower the height with the IC chip 100, and then use the internal components of the programming and detection seat 3001 to detect and process the programming situation of the IC chip 100. After the detection is completed, the unqualified IC chip 100 is lifted to the initial height by the programming and detection seat 3001, and the previous set of clamping mechanism 6 re-clamps the IC chip 100. After the clamping mechanism 6 has clamped the IC chip 100, the programming and detection seat 3001 will lower its height to ensure that the clamping mechanism 6 can pass over it with the IC chip 100. Then the next set of vacant clamping mechanisms 6 will move above the programming and detection seat 3001, and the programming and detection seat 3001 will lift the height of the qualified IC chip 100 to allow it to clamp the IC chip 100; S4: According to the detection results of the vision detector 200 and the detection platform 300, the feeding mechanism 2 drives two sets of clamping mechanisms 6 respectively loaded with qualified chips and unqualified chips to move. The qualified IC chips 100 are conveyed by the next set of vacant clamping mechanisms 6 and placed in the top surface grooves of the winding belt A4. The unqualified IC chips 100 are conveyed by the previous set of clamping mechanisms 6 and placed in the top surface grooves of the winding belt B5. Then, through the winding operations at the ends of the winding belt A4 and the winding belt B5, during the winding process, film sealing treatment is performed on their top surfaces.

[0035] Working principle: In the present invention, the feeding mechanism 1 conveys the IC chip 100 from the feeding roller A101 and the feeding roller B102 to directly below the feeding mechanism 2 through the feeding belt 103. The limiting strip 1031 ensures the stable placement of the IC chip 100 on the feeding belt 103. The driving motor 31 controls the intermittent rotation of the feeding belt 103 through the transmission box 3 to ensure that the IC chips 100 enter the detection area one by one; When two adjacent sets of clamping mechanisms 6 move, the previous set of clamping mechanisms 6 will clamp the IC chip 100 on the feeding belt 103 through the cooperation of the electric push rod 2052 and the reset mechanism 8. The next set of clamping mechanisms 6 is in a vacant state. The feeding mechanism 2 conveys the clamped IC chip 100 below the vision detector 200. The detection probe B2002 performs visual detection on the back surface of the IC chip 100 for surface damage, and the detection probe A2001 performs visual detection on the front surface of the IC chip 100 for surface damage. If there is damage on the surface of the IC chip 100, the vision detector 200 will mark the chip as unqualified; The feeding mechanism 2 transports the IC chip 100 directly above the detection platform 300. The lifting device inside the detection platform 300 raises the programming and detection socket 3001 to make contact with the back of the IC chip 100. The previous set of clamping mechanisms 6 releases the clamping of the IC chip 100. Then, the programming and detection socket 3001 and the IC chip 100 together descend in height. Next, the programming and detection socket 3001 detects the programming situation of the IC chip 100, such as whether the program is correctly written and whether the electrical performance meets the standards, and synchronizes the detection results of the comprehensive vision detector 200. After the detection is completed, the programming and detection socket 3001 first raises the unqualified IC chip 100 to the initial height. The previous set of clamping mechanisms 6 re-clamps the unqualified IC chip 100. After the clamping is completed, the programming and detection socket 3001 descends in height alone, allowing the previous set of clamping mechanisms 6 loaded with the unqualified IC chip 100 to leave. Then, the next set of empty clamping mechanisms 6 rotates directly above the programming and detection socket 3001. At this time, the previous set of clamping mechanisms 6 loaded with the unqualified IC chip 100 has been removed. After the empty clamping mechanisms 6 are in place, the programming and detection socket 3001 raises the qualified IC chip 100 to the initial height and clamps it using the empty clamping mechanisms 6, enabling the next set of empty clamping mechanisms 6 to transport the qualified IC chip 100 to the winding belt A4, while the previous set of clamping mechanisms 6 transports the unqualified IC chip 100 to the winding belt B5. The winding belt A4 and the winding belt B5 store the chips in categories through winding operations and perform film sealing during the winding process; After three IC chips 100 of the same batch are detected, using the lifting control of the programming and detection socket 3001, the unqualified and qualified chips that appear are transported to the winding belt A4 and the winding belt B5 in batches using two adjacent sets of clamping mechanisms 6.

[0036] The control method of the present invention is automatically controlled by a controller. The control circuit of the controller can be realized by simple programming by those skilled in the art. The power supply is also common knowledge in the art. And the present invention mainly aims to protect mechanical devices, so the control method and circuit connection of the present invention will not be explained in detail.

[0037] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. An IC chip burning detection device, comprising a feeding mechanism (1) and a transmission box (3), characterized in that: A feeding mechanism (2) is mounted on the top of the feeding mechanism (1), the feeding mechanism (1) comprising a feeding roller B (102) and a feeding roller A (101) connected to the bottom output shaft of the transmission box (3), the feeding roller A (101) and the feeding roller B (102) having a feeding belt (103) on the transmission sleeve, the feeding mechanism (2) comprising a feeding roller B (203) and a feeding roller A (202) connected to the top output shaft of the transmission box (3), the feeding roller A (202) and the feeding roller B (203) having a feeding belt (201) on the transmission sleeve, the feeding rollers C (204) are provided on the outer sides of both ends of the feeding roller A (202) and the feeding roller B (203), and the feeding roller C (204) has a synchronous belt (205) on the transmission sleeve; The inner side of the feeding belt (201) is provided with a visual detector (200), a detection platform (300), a winding belt A (4) and a winding belt B (5) in sequence, and the feeding mechanism (2) is provided with a clamping mechanism (6).

2. An IC chip burning detection device according to claim 1, characterized in that: A driving motor (31) is provided at the bottom of the outer side of the transmission box (3); IC chips (100) are placed at equal intervals on the feed belt (103); a limit strip (1031) is provided on the feed belt (103) to provide a stable placement for the IC chips (100); a detection probe A (2001) and a detection probe B (2002) are provided on the top and bottom surfaces of the visual detector (200), respectively; and a burning detection seat (3001) is provided on the top of the detection platform (300).

3. An IC chip burning detection device according to claim 1, characterized in that: A mounting seat (2051) is provided on the synchronous belt (205), and an electric push rod (2052) is provided in the mounting seat (2051) for driving the reset mechanism (8) to move.

4. An IC chip burning detection device according to claim 1, characterized in that: The clamping mechanism (6) comprises a clamping frame (601), both sides of the clamping frame (601) are provided with hangers (6013) connected to the synchronous belt (205), and the top of the clamping frame (601) is provided with a sealing plate (602).

5. An IC chip burning detection device according to claim 4, characterized in that: The bottom surface of the clamping frame (601) is provided with side through holes A (6011) on both sides, and the bottom surface of the clamping frame (601) is provided with a central through hole A (6012) in the middle. The top surface of the sealing plate (602) is provided with side through holes B (6021) corresponding to the positions of the side through holes A (6011) on both sides, and the top surface of the sealing plate (602) is provided with a central through hole B (6022) corresponding to the position of the central through hole A (6012) in the middle.

6. An IC chip burning detection device according to claim 5, characterized in that: A side clamping plate A (604) and a side clamping plate B (605) are slidably mounted on the left and right sides of the side through hole A (6011), and a middle clamping plate (606) is slidably mounted on the left and right sides of the middle through hole A (6012).

7. An IC chip burning detection device according to claim 6, characterized in that: The surfaces of the side clamping plate A (604) and the side clamping plate B (605) are both provided with a rack A (6041), the other side surface of the side clamping plate B (605) and the outer side surface of the middle clamping plate (606) are both provided with a rack B (6051), and the clamping frame (601) is provided with a linkage gear (603) meshing with the rack B (6051).

8. An IC chip burning detection device according to claim 7, characterized in that: The side surfaces of the side through hole A (6011) and the middle through hole A (6012) are provided with transverse holes (6014) for sliding of the side clamping plate A (604), the side clamping plate B (605) and the middle clamping plate (606); a gear set (607) meshing and matching with the rack A (6041) is rotatably provided inside the side through hole A (6011); The gear set (607) comprises a driving gear (6071) meshingly matched with the side rack A (6041) of the side clamp plate A (604), and a driven gear (6074) meshingly matched with the side rack A (6041) of the side clamp plate B (605), and a synchronous gear A (6072) and a synchronous gear B (6073) are arranged between the driving gear (6071) and the driven gear (6074) for synchronizing the transmission of the two.

9. An IC chip burning detection device according to claim 4, characterized in that: The feeding belt (201) is provided with a mounting hole (211), and the feeding belt (201) is provided with a reset mechanism (8) that is slidably mounted on the mounting hole (211); The left and right sides of the clamping frame (601) are provided with guide holes (61); the reset mechanism (8) comprises a reset frame (801) slidably mounted on the mounting hole (2011); a baffle (802) is provided in the middle of the reset frame (801); a reset spring (803) is provided on the side of the baffle (802); the other end of the reset spring (803) is fixedly connected to the inner side of the mounting hole (2011); a stabilizing frame (804) slidably mounted on the mounting hole (2011) is provided on the top surface of the baffle (802); and the end of the reset frame (801) is fixedly connected to the end of the push frame (805).

10. A detection method for an IC chip burning detection device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1: The IC chip (100) after the programming process is grasped by an external mechanical gripper and placed on the top surface of the feeding belt (103), and the IC chip (100) is placed with the front side facing downward, and then the internal gear transmission of the transmission box (3) is controlled by the driving motor (31), so that the feeding belt (103) conveys the IC chip (100) to the bottom of the side through hole B (6021) and the middle through hole B (6022). At this time, the detection probe B (2002) performs surface damage detection on the back side of the IC chip (100); S2: The output shaft of the electric push rod (2052) at the corresponding position is opened, so that the side clamping plate A (604), the side clamping plate B (605) and the middle clamping plate (606) can clamp the IC chip (100) placed on the top surface of the feeding belt (103), and then the overall movement of the feeding mechanism (2) is used to drive the clamping mechanism (6) to move clockwise until the clamping mechanism (6) loaded with the IC chip (100) moves to the bottom of the detection probe A (2001), so that the detection probe A (2001) can perform a surface damage detection operation on the front surface of the IC chip (100); S3: After both the back and front sides of the IC chip (100) have passed the inspection of the visual detector (200), the IC chip (100) is conveyed to the top of the burning inspection seat (3001) by the feeding mechanism (2). The burning inspection seat (3001) is raised by the internal components of the inspection platform (300). The clamping mechanism (6) for the IC chip (100) is released to allow the top surface of the burning inspection seat (3001) to be in contact with the back side of the IC chip (100). The IC chip (100) is then lowered and the internal components of the burning inspection seat (3001) are used to inspect the burning status of the IC chip (100). After the test is completed, the unqualified IC chip (100) is lifted to the initial height by the burning test seat (3001), and the first group of clamping mechanisms (6) re-clamps the IC chip (100). After the clamping mechanism (6) completes the clamping of the IC chip (100), the burning test seat (3001) will be lowered to ensure that the clamping mechanism (6) can carry the IC chip (100) through its top surface, and then the second group of empty clamping mechanisms (6) will move to the top of the burning test seat (3001), and the height of the qualified IC chip (100) is lifted by the burning test seat (3001), so that it can clamp the IC chip (100); S4: According to the detection results of the visual detector (200) and the detection platform (300), the two groups of clamping mechanisms (6) loaded with qualified chips and unqualified chips are driven to move through the feeding mechanism (2), and the qualified IC chip (100) is transported through the latter group of empty clamping mechanisms (6) and placed in the top surface groove of the winding belt A (4). The unqualified IC chip (100) is transported through the former group of clamping mechanisms (6) and placed in the top surface groove of the winding belt B (5). Then, through the winding operation of the ends of the winding belts A (4) and B (5), the top surfaces of both are sealed during the winding process.

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