White light COB lamp panel structure and manufacturing method thereof

Abstract

The invention discloses a white light COB lamp panel structure and a manufacturing method thereof, the white light COB lamp panel structure comprises a circuit board, a plurality of blue light LED chips are arranged on the circuit board, a lampshade which is attached to the circuit board and covers the blue light LED chips is arranged on the circuit board, and a plurality of grooves which are the same in shape, correspond to the positions of the blue light LED chips and are used for filling fluorescent agents are formed in the face, opposite to the blue light LED chips, of the lampshade. The grooves with the same shape are formed in the lampshade and used for being filled with the fluorescent glue, so that the consistency of the appearance and the filling amount of the fluorescent glue covering each blue light LED chip is ensured. According to the assembling structure of the lamp panel, through the packaging structure of the blue light LED chip by the lampshade and the circuit board, the process complexity of backlight module assembling can be effectively reduced, the structural strength of the whole lamp panel is enhanced, physical collision possibly caused to the blue light LED chip in the production or transportation process can be resisted, and the service life of the whole lamp panel is prolonged. Therefore, the safety of production and transportation is ensured, and the cost is also reduced at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of COB lamp boards and backlight processes, and specifically to a white light COB lamp board structure and a manufacturing method thereof. Background Art

[0002] In ultra-thin liquid crystal screens, white backlight is usually achieved by using the COB (Chip on Board) process, that is, directly mounting LED chips on the lamp board. This design allows optical films to be placed on the COB lamp board to form a backlight module. Currently, there are mainly two methods for preparing the backlight module: The first is the high-density small-size method: By increasing the number of small-size blue LED lights, reducing the spacing between LEDs, and fixing them by coating transparent silicone, and then converting blue light into white light using a quantum dot film or a fluorescent film. To reduce costs and improve production efficiency, fluorescent glue can be used instead of transparent silicone, thus eliminating the need for a quantum dot film or a fluorescent film. The advantage of this method is that it can improve the uniformity of light and the accuracy of color, but due to the small size and large number of LED chips, they are easily damaged during the production process, with extremely high requirements for the production process, high costs, short lifespan, and lack of economy. The second is the large-size LED chip method: Fixing larger-size blue LED chips on the lamp board and dropping fluorescent glue on each LED chip to generate white light. To further improve the white light effect, transparent silicone can be used and paired with a quantum dot film or a fluorescent film. The advantage of this method is that the color and brightness of light can be controlled by adjusting the shape and dosage of the fluorescent glue, but it is difficult to precisely control the shape and dosage of the fluorescent glue, resulting in difficulty in ensuring the consistency of the emitted light color and brightness. In addition, the process of dropping glue one by one takes a long time and is difficult to meet the requirements of large-scale production. Summary of the Invention

[0003] The present invention provides a white light COB lamp board structure and a manufacturing method thereof with simple structure and manufacturing process, and consistent emission color and brightness.

[0004] The white light COB lamp board structure described in the present invention includes a circuit board, on which several blue light LED chips are arranged, and a lamp cover that fits with the circuit board to cover the blue light LED chips. On the side of the lamp cover opposite to the blue light LED chips, several grooves with the same shape and corresponding to the positions of the blue light LED chips for filling fluorescent agents are provided.

[0005] The manufacturing method of the white light COB lamp board includes the following steps: S1, arranging and fixing several blue light LED chips on the circuit board; S2, manufacturing grooves with the same shape at the positions corresponding to the blue light LED chips on the lamp cover through an injection molding process, and then filling the grooves with fluorescent glue using a coating process; S3. Assemble the circuit board in Step S1 onto the lamp shade in Step S2, and perform pre-curing and curing to form a lamp board.

[0006] The white light COB lamp board structure and its manufacturing method ensure the consistency of the shape and filling amount of the fluorescent glue covering each blue LED chip by providing grooves with the same shape on the lamp shade. This is crucial for maintaining the optical brightness and color uniformity generated by each blue LED, as it avoids optical color differences caused by uneven thickness and shape of the fluorescent glue, thereby improving the light color quality of the backlight module. In the assembly structure of the lamp board, through the encapsulation structure of the lamp shade and the circuit board for the blue LED chips, not only can the process complexity of assembling the backlight module be effectively reduced, but also the structural strength of the entire lamp board is enhanced, enabling it to resist physical collisions that may occur to the blue LED chips during production or transportation, thus ensuring the safety of production and transportation while also reducing costs. The white light COB lamp board structure and its manufacturing method described in the present invention have a simple structure and manufacturing process. By precisely controlling the filling of the fluorescent glue, not only is the light uniformity and color accuracy improved, but also the physical strength and durability of the lamp board are enhanced through the encapsulation of the structure of the lamp shade and the circuit board, and the production cost is reduced.

[0007] As a preferred embodiment of the present invention, a pit is formed by inward concavity at the center of the top of the cross-section of the groove, and edges on both sides of the center of the top of the cross-section of the groove protrude to form a left shoulder and a right shoulder.

[0008] As a preferred embodiment of the present invention, the first included angle formed by both sides of the pit is 60 degrees - 120 degrees.

[0009] As a preferred embodiment of the present invention, the second included angle between the inner walls on both sides of the cross-section of the groove and the horizontal plane is 45 degrees - 90 degrees.

[0010] As a preferred embodiment of the present invention, the plane of the lamp shade is matte or glossy. Description of the Drawings

[0011] Figure 1 It is a schematic diagram of a white light COB lamp board structure.

[0012] Figure 2 It is a schematic diagram of the assembly of a white light COB lamp board structure.

[0013] Figure 3 It is a schematic diagram of the light pattern of a blue LED chip.

[0014] Figure 4 It is a schematic diagram of the light pattern of another blue LED chip.

[0015] Figure 5 It is a schematic diagram of the groove structure.

[0016] Figure 6 It is a schematic diagram of the second groove structure.

[0017] Figure 7 It is a schematic diagram of the third groove structure. Specific implementation manners

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0019] It should be noted that if there are directional indications (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial...) involved in the embodiments of the present invention, then the directional indications are only used to explain the relative positional relationship and movement conditions between components in a certain specific posture (as shown in the accompanying drawings). If this specific posture changes, then the directional indications will also change accordingly.

[0020] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "set", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0021] If there is a description involving "first" or "second" in the embodiments of the present invention, then the description of "first" or "second" is only for descriptive purposes and cannot be understood as indicating or implying its relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical features of each embodiment (including but not limited to structures, materials, or characteristics, etc.) can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0022] Such as Figure 1 and Figure 2As shown in the figure, a white light COB lamp board structure includes a circuit board 1, on which several blue light LED chips 2 are arranged, and a lamp cover 3 that is attached to the circuit board to cover the blue light LED chips. On the side of the lamp cover opposite to the blue light LED chips, several grooves 4 with the same shape and corresponding to the positions of the blue light LED chips for filling fluorescent agent are provided.

[0023] The manufacturing method of the white light COB lamp board described above includes the following steps: S1, Arrange and fix several blue light LED chips on the circuit board; S2, Use the injection molding process to make grooves with the same shape at the positions corresponding to the blue light LED chips on the lamp cover, and then use the coating process to fill the fluorescent glue into the grooves; S3, Assemble the circuit board in step S1 to the lamp cover in step S2, and perform pre-curing and curing to form the lamp board.

[0024] The white light COB lamp board structure and its manufacturing method described above ensure the consistency of the shape and filling amount of the fluorescent glue covering each blue light LED chip by providing grooves with the same shape on the lamp cover for filling the fluorescent glue. It is crucial for maintaining the optical brightness and color uniformity generated by each blue light LED because it avoids optical color differences caused by uneven thickness and shape of the fluorescent glue, thereby improving the light color quality of the backlight module. In the assembly structure of the lamp board, through the encapsulation structure of the lamp cover and the circuit board for the blue light LED chips, not only can the process complexity of assembling the backlight module be effectively reduced, but also the structural strength of the entire lamp board is enhanced, and it can resist physical collisions that may occur to the blue light LED chips during production or transportation, thus ensuring the safety of production and transportation and reducing costs at the same time. The white light COB lamp board structure and its manufacturing method described in the present invention have simple structures and manufacturing processes. By precisely controlling the filling of the fluorescent glue, not only the light uniformity and color accuracy are improved, but also the physical strength and durability of the lamp board are enhanced through the encapsulation of the structure of the lamp cover and the circuit board, and the production cost is reduced.

[0025] Because the light source of the blue light LED chip is darker in the middle and brighter at the left and right shoulders, as Figure 3 and Figure 4 shown. In order to improve the light pattern distribution of the blue light LED chip with a darker middle and brighter sides, as Figures 5-7As shown, a pit 401 is formed by the center of the top of the cross-section of the groove 4 being recessed downward, and left and right shoulders 402 and 403 are formed by the edges on both sides of the center of the top of the cross-section of the groove protruding, so that the light emitted by the light source of the blue LED chip can pass through the groove more evenly, thereby effectively improving the light emission uniformity. Further, the first included angle α formed by the two side edges of the pit is 60 degrees to 120 degrees, and the second included angle β between the inner walls of the two sides of the cross-section of the groove and the horizontal plane is 45 degrees to 90 degrees, so as to adapt to the light sources of a variety of different blue LED chips, such as Figures 5-7 shown.

[0026] The plane of the lampshade is matte or smooth. Due to its non-smooth surface, the matte lampshade can produce diffuse reflection, making the light distribution more uniform and soft, effectively reducing glare and improving lighting comfort. Relatively speaking, the smooth surface of the smooth lampshade is convenient for cleaning and maintenance, and it is not easy to accumulate dust. Therefore, according to specific lighting requirements and environmental conditions, a matte or smooth lampshade can be selected to achieve the best lighting effect.

[0027] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural transformation made by using the content of the specification and drawings of the present invention under the inventive concept of the present invention, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present invention. The mention of "embodiment" in this article means that the specific features, structures or characteristics described in connection with the embodiment may be included in at least one embodiment of the present application. The appearance of this phrase in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that, without conflict, the embodiments described herein can be combined with other embodiments, and the embodiments of the present invention and the features in the embodiments can be combined with each other.

Claims

1. A white light COB lamp panel structure, characterized in that: The invention comprises a circuit board (1) on which a plurality of blue light LED chips (2) are arranged, and a lampshade (3) which fits the circuit board and covers the blue light LED chips, wherein a plurality of grooves (4) having the same shape and corresponding to the positions of the blue light LED chips and used for filling fluorescent agent are arranged on a side of the lampshade opposite to the blue light LED chips.

2. The white light COB lamp panel structure according to claim 1, characterized in that: The top center of the cross section of the groove (4) is concave downward to form a pit (401), and the edges on both sides of the top center of the cross section of the groove are raised to form a left shoulder (402) and a right shoulder (403).

3. The white light COB lamp panel structure according to claim 2, characterized in that: The first angle (α) formed by the two side edges of the pit is 60 degrees to 120 degrees.

4. The white light COB lamp panel structure according to claim 2, characterized in that: The second angle (β) between the inner walls on both sides of the cross section of the groove and the horizontal plane is 45 degrees to 90 degrees.

5. The white light COB lamp panel structure according to claim 1, characterized in that: The plane of the lampshade is a matte surface or a glossy surface.

6. A method for manufacturing a white light COB lamp panel, characterized in that: The following steps are involved: S1, arranging and fixing a plurality of blue LED chips on a circuit board; S2, making a groove of the same shape on the lampshade corresponding to the position of the blue light LED chip through an injection molding process, and then filling the groove with fluorescent glue through a coating process; S3, assembling the circuit board of step S1 onto the lampshade of step S2, and performing pre-curing and curing to form a lamp board.

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