Semiconductor process equipment and control method thereof

Abstract

The invention provides semiconductor process equipment and a control method thereof. Wherein in the process that the semiconductor process equipment executes each process step of the process formula, if an alarm is generated in the current process step, the alarm type is determined; wherein a plurality of alarm types and fault-tolerant control operations corresponding to the alarm types are configured in the process formula, and the fault-tolerant control operations are used for representing remedial measures for ensuring that the semiconductor process equipment is in a safe state when an alarm occurs; and determining the corresponding target fault-tolerant control operation according to the alarm type, and controlling the semiconductor process equipment to operate according to the target fault-tolerant control operation so as to remedy the product when the alarm occurs, thereby flexibly performing fault-tolerant control through the alarm type, and ensuring the product quality and productivity of the semiconductor process equipment.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to semiconductor process equipment and a control method thereof. Background Art

[0002] In the semiconductor industry, semiconductor process equipment such as heat treatment equipment is a batch processing equipment for products. In practical applications, with the increase in the number of products processed in a single batch and the increase in the cost price of advanced process integrated circuits, the requirements for the stability and reliability of heat treatment equipment are getting higher and higher. Among them, during the operation of heat treatment equipment, in addition to ensuring the personal safety of operators and equipment safety, fault-tolerant control can protect product quality to the greatest extent, reduce the probability of product scrapping due to equipment reasons, and reduce economic losses.

[0003] Among them, fault-tolerant control refers to taking appropriate emergency measures for abnormal equipment conditions (such as alarms). Since the heat treatment process involves the use of hazardous chemicals in a high-temperature, low-pressure process chamber, and any deviation in key process parameters (such as temperature, pressure, flow, etc.) during the process may affect the process results, cause harmful accidents or lead to product scrapping, it is of great significance to configure fault-tolerant control for heat treatment equipment and respond accordingly when an alarm occurs during the operation of the equipment. However, the existing fault-tolerant control is relatively simple. When an alarm occurs, it only gives an alarm prompt and stops the operation of the current process. There are safety hazards, which not only affect the process results, but also reduce product quality and the production capacity of semiconductor process equipment. Summary of the invention

[0004] In view of this, an object of the present invention is to provide semiconductor process equipment and a control method thereof, so as to alleviate the problem that the existing fault-tolerant control is relatively simple, thereby reducing the product quality and production capacity of the semiconductor process equipment.

[0005] In the first aspect, an embodiment of the present invention provides a semiconductor process equipment control method, the method comprising: during the process of the semiconductor process equipment executing each process step of the process recipe, if the current process step generates an alarm, determining the alarm type; wherein the process recipe is configured with multiple alarm types and fault-tolerant control operations corresponding to each alarm type, the fault-tolerant control operation is used to characterize the remedial measures to ensure that the semiconductor process equipment is in a safe state when an alarm occurs; determining the corresponding target fault-tolerant control operation according to the alarm type, and controlling the semiconductor process equipment to operate according to the target fault-tolerant control operation.

[0006] Preferably, the alarm types include level one alarm, level two alarm and level three alarm; the fault-tolerant control operations include: process stop control operation, process alarm control operation and alarm prompt control operation; the step of determining the corresponding target fault-tolerant control operation according to the alarm type includes: if the alarm type is level one alarm, determining the target fault-tolerant control operation as the process stop control operation; or, if the alarm type is level two alarm, determining the target fault-tolerant control operation as the process alarm control operation; or, if the alarm type is level three alarm, determining the target fault-tolerant control operation as the alarm prompt control operation.

[0007] Preferably, the process alarm control operation is implemented through the corresponding process alarm recipe. If the target fault-tolerant control operation is the process alarm control operation, the step of controlling the semiconductor process equipment to run according to the target fault-tolerant control operation includes: controlling the semiconductor process equipment to switch from the current process step to executing the process alarm recipe, and when executing to the end step of the process alarm recipe, determining the target mode of the end step; wherein the target mode includes a first mode and a second mode, the first mode is used to characterize a mode of automatically returning to the process recipe after the process alarm recipe is executed, and the second mode is used to characterize a mode of staying at the end step after the process alarm recipe is executed; controlling the semiconductor process equipment to run according to the target mode to complete the process alarm recipe.

[0008] Preferably, the step of controlling the semiconductor process equipment to operate according to the target mode includes: if the target mode is the first mode, controlling the semiconductor process equipment to automatically return to the process recipe after the process alarm recipe is executed, and operate according to the next process step of the current process step.

[0009] Preferably, the step of controlling the semiconductor process equipment to operate according to the target mode includes: if the target mode is the second mode, controlling the semiconductor process equipment to stay at the end step; and obtaining user operations and controlling the operation of the semiconductor process equipment according to the user operations; wherein the user operations include jump operations and continue operations.

[0010] Preferably, the step of controlling the operation of the semiconductor process equipment according to the user operation includes: if the user operation is to continue the operation, controlling the semiconductor process equipment to return to the process recipe and operate according to the next process step of the current process step.

[0011] Preferably, the step of controlling the operation of semiconductor process equipment according to user operation includes: if the user operation is a jump operation, controlling the semiconductor process equipment to jump to any process step of the process recipe; or controlling the semiconductor process equipment to jump to any process step of the process alarm recipe.

[0012] Preferably, the process recipe includes a main process recipe and a sub-process recipe, and the method further includes: when the sub-process recipe is called in the target process step of the main process recipe, and the current process step that generates an alarm is the end step of the sub-process recipe, the number of times the sub-process recipe is run is obtained after the process alarm recipe is executed; if the number of runs reaches a preset number, the semiconductor process equipment is controlled to return to the next process step of the target process step to run.

[0013] Preferably, the method further comprises: if the number of operations does not reach a preset number, controlling the semiconductor process equipment to re-execute the sub-process recipe until the number of operations reaches a preset number.

[0014] Preferably, the step of controlling the semiconductor process equipment to run according to the target fault-tolerant control operation includes: if the target fault-tolerant control operation is a process stop control operation, controlling the semiconductor process equipment to run according to the process stop recipe corresponding to the process stop control operation, and controlling the semiconductor process equipment to be in an idle state after the operation is completed; or, if the target fault-tolerant control operation is an alarm prompt control operation, controlling the semiconductor process equipment to give an alarm prompt and continue to run according to the process recipe.

[0015] In a second aspect, an embodiment of the present invention further provides a semiconductor process device, comprising a controller, characterized in that the controller comprises at least one processor and at least one memory, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the method of the first aspect is implemented.

[0016] In a third aspect, an embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the method of the first aspect is executed.

[0017] The embodiments of the present invention bring the following beneficial effects:

[0018] The embodiment of the present invention provides semiconductor process equipment and a control method thereof. During the process of each process step of the process recipe executed by the semiconductor process equipment, if the current process step generates an alarm, the alarm type is determined; wherein, the process recipe is configured with multiple alarm types and the fault-tolerant control operation corresponding to each alarm type, and the fault-tolerant control operation is used to characterize the remedial measures to ensure that the semiconductor process equipment is in a safe state when an alarm occurs; the corresponding target fault-tolerant control operation is determined according to the alarm type, and the semiconductor process equipment is controlled to operate according to the target fault-tolerant control operation. In the above control method, when an alarm occurs in the semiconductor process equipment during the execution of the process recipe, the corresponding target fault-tolerant control operation is determined according to the alarm type, and the semiconductor process equipment is controlled to operate according to the target fault-tolerant control operation to remedy the product when the alarm occurs, thereby flexibly performing fault-tolerant control through the alarm type, and ensuring the product quality and production capacity of the semiconductor process equipment.

[0019] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0020] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 Switching flow chart for existing equipment status;

[0023] Figure 2 A flowchart of a semiconductor process equipment control method provided by an embodiment of the present invention;

[0024] Figure 3 A schematic flow chart of switching between process recipes provided in an embodiment of the present invention;

[0025] Figure 4 A schematic diagram of an air intake and exhaust of a process chamber provided in an embodiment of the present invention;

[0026] Figure 5 A flowchart of another semiconductor process equipment control method provided by an embodiment of the present invention;

[0027] Figure 6 A flowchart of another semiconductor process equipment control method provided by an embodiment of the present invention;

[0028] Figure 7 A schematic diagram of the structure of a controller in a semiconductor process equipment provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] The control system of existing semiconductor process equipment adopts an automatic operation mode, and manages the process of semiconductor process equipment through equipment status scheduling. Among them, the equipment status mainly includes: unknown state (Unknown), formatting state (Initialize), idle state (Idle), standby state (Standby), ready state (Ready), running state (Run), hold state (Hold) and abort state (Abort); Figure 1 As shown in the figure, the switching process between various device states is as follows:

[0031] (1) When the semiconductor process equipment is in an unknown state, formatting the semiconductor process equipment; at this time, the semiconductor process equipment is in a formatted state;

[0032] (2) After the semiconductor process equipment is formatted, the switching of the equipment status is achieved by running different process recipes (Recipes); among which, the existing recipes mainly include: idle process recipe (Idle Recipe), main process recipe (Main Recipe), sub process recipe (Sub Recipe) and process abort recipe (Abort Recipe).

[0033] When the semiconductor process equipment runs the Idle Recipe, the equipment status is displayed as an idle state. At this time, the semiconductor process equipment automatically performs relevant temperature, pressure and other controls in the idle state, and after the control is completed, the equipment status is displayed as a standby state Standby to prepare for the next process flow. Among them, in Standby, the semiconductor process equipment can run the Main Recipe at any time. When the semiconductor process equipment runs the Main Recipe, the equipment status is displayed as a ready state Ready / Running state Run / End state End; among them, Ready belongs to the preparation stage to quickly control the various parameters of the semiconductor process equipment to the target state, and Run is the state in the entire process of formally running the Main Recipe. When the Main Recipe enters the last step (End Step), the equipment status is displayed as the End state. In addition, when the Main Recipe is executed, the equipment status switches to an idle state or a standby state so that the semiconductor process equipment can prepare for the next process flow.

[0034] In actual applications, Main Recipe is the standard process for semiconductor process equipment to process wafers. Sub Recipe can also be called during each process step of Main Recipe. In actual applications, Sub Recipe cannot be started directly in idle state and must be called by Main Recipe. In addition, the same process step (Step) in Main Recipe can call the same Sub Recipe multiple times, and different process steps can call different Sub Recipes; when semiconductor process equipment runs Sub Recipe, the equipment status is displayed as running status.

[0035] In addition, a Hold button is provided on the human-machine interaction interface of the semiconductor process equipment. When the equipment is in the Hold state, the operator can perform some emergency processing through manual control (Manual Control). Also, when the equipment is in the Running state, if an alarm occurs in the semiconductor process equipment, the semiconductor process equipment is controlled to execute the Abort Recipe, and the equipment state is switched to the Abort state. When the End Step of the Abort Recipe is executed, the control equipment state is displayed as the End state. Therefore, the Abort Recipe can be understood as a process that terminates the abnormal state and restores the equipment to a safe state.

[0036] However, the existing fault-tolerant control is relatively simple. When an alarm occurs, it only gives an alarm prompt and terminates the operation of the current process, which poses a safety hazard. It not only affects the process results, but also reduces product quality and the production capacity of semiconductor process equipment.

[0037] Based on this, an embodiment of the present invention provides semiconductor process equipment and a control method thereof. When an alarm occurs in the semiconductor process equipment during the execution of a process recipe, the corresponding target fault-tolerant control operation is determined according to the alarm type, and the semiconductor process equipment is controlled to operate according to the target fault-tolerant control operation to remedy the product when the alarm occurs, thereby flexibly performing fault-tolerant control according to the alarm type, thereby ensuring the product quality and production capacity of the semiconductor process equipment.

[0038] To facilitate understanding of this embodiment, the embodiment of the present invention is described in detail below.

[0039] Embodiment 1

[0040] The embodiment of the present invention provides a semiconductor process equipment control method, such as Figure 2 As shown, the method comprises the following steps:

[0041] Step S202, during the process of semiconductor process equipment executing each process step of the process recipe, if the current process step generates an alarm, determine the alarm type.

[0042] Among them, the process recipe Recipe is configured with multiple alarm types and the fault-tolerant control operations corresponding to each alarm type. The fault-tolerant control operation is used to represent the remedial measures to ensure that the semiconductor process equipment is in a safe state when an alarm occurs. In actual applications, the process recipe includes multiple process steps. During the process of each process step of the process recipe executed by the semiconductor process equipment, it is monitored in real time whether an alarm (Alarm) is generated, and when an alarm is generated in the current process step, the alarm type is determined so as to determine the corresponding fault-tolerant control operation according to the alarm type, thereby realizing the flexible calling of the corresponding fault-tolerant control operation according to different alarm types, so as to remedy the product when the alarm occurs, and ensure the product quality of the semiconductor process equipment.

[0043] Step S204, determining a corresponding target fault-tolerant control operation according to the alarm type, and controlling the semiconductor process equipment to operate according to the target fault-tolerant control operation.

[0044] The above-mentioned semiconductor process equipment control method determines the corresponding target fault-tolerant control operation according to the alarm type when an alarm occurs in the semiconductor process equipment during the execution of the process recipe, and controls the semiconductor process equipment to operate according to the target fault-tolerant control operation to remedy the product when the alarm occurs, thereby flexibly performing fault-tolerant control according to the alarm type, thereby ensuring the product quality of the semiconductor process equipment.

[0045] In one embodiment, the alarm types include level one alarm, level two alarm and level three alarm; the fault-tolerant control operations include: process stop control operation, process alarm control operation and alarm prompt control operation; the step of determining the corresponding target fault-tolerant control operation according to the alarm type includes: if the alarm type is level one alarm, determining the target fault-tolerant control operation as the process stop control operation; or, if the alarm type is level two alarm, determining the target fault-tolerant control operation as the process alarm control operation; or, if the alarm type is level three alarm, determining the target fault-tolerant control operation as the alarm prompt control operation.

[0046] In practical applications, the alarms of semiconductor process equipment are mainly divided into equipment status abnormality alarms and process abnormality alarms. In each process step of the process recipe, multiple alarm types and corresponding fault-tolerant control operations (i.e., fault-tolerant control measures) can be set; among them, the alarm type and fault-tolerant control operation are realized by mounting the alarm description table (Alarm table). During the process of semiconductor process equipment executing each process step of the process recipe, the equipment operation status, the working status of each device, and the status of the process quantity are monitored in real time, and an alarm is generated when an abnormality occurs. The corresponding fault-tolerant control operation is determined in the Alarm table according to the alarm type of the alarm.

[0047] Specifically, according to the harmfulness of various alarms after they are generated, the alarm types are divided into level one alarm, level two alarm and level three alarm; among them, the harmfulness of level one alarm is higher, and the harmfulness of level three alarm is lower. Alarms with low or average harmfulness between level one alarm and level three alarm are collectively referred to as level two alarms.

[0048] Similarly, fault-tolerant control operations include: process abort control operation, process alarm control operation and alarm prompt control operation; among them, the process abort control operation is implemented by the corresponding process abort recipe Abort Recipe, the process alarm control operation is implemented by the corresponding process alarm recipe Alarm Recipe, and the alarm prompt control operation is implemented by the alarm prompt; the corresponding Alarm table is shown in Table 1 below:

[0049] Table 1

[0050] Alarm Type Fault-tolerant control operations Processing Actions 1 Level 1 alarm Jump to Abort Recipe Alarm prompt and execute Abort Recipe 2 Second level alarm Jump to Alarm Recipe Alarm prompt and execute Alarm Recipe 3 Three-level alarm Ignore Alarm prompt

[0051] According to the above Table 1, when the alarm type is a first-level alarm, the target fault-tolerant control operation is determined to be a process abort control operation, an alarm prompt is given, and the semiconductor process equipment is controlled to jump from the current process step to the process abort recipe Abort Recipe; when the alarm type is a second-level alarm, the target fault-tolerant control operation is determined to be a process alarm control operation, an alarm prompt is given, and the semiconductor process equipment is controlled to jump from the current process step to the process alarm recipe Alarm Recipe; when the alarm type is a third-level alarm, the target fault-tolerant control operation is determined to be an alarm prompt control operation, and the semiconductor process equipment only gives an alarm prompt. At this time, the process recipe continues to run unaffected, that is, it does not jump to other recipes and can be ignored (Ignore).

[0052] In addition, in order to avoid conflicts between fault-tolerant control operations, the response priorities of fault-tolerant control operations are divided based on the principle of better protecting personal safety, equipment safety, and product safety. Among them, the division is generally agreed upon with the user to ensure that customers can mount the alarm table in accordance with actual needs when using semiconductor process equipment. Since the first-level alarm, second-level alarm, and third-level alarm are arranged in order of priority, in the fault-tolerant control operation, the priority is process stop control operation > process alarm control operation > alarm prompt control operation.

[0053] Among them, for the process stop control operation with the highest priority, some first-level alarms that may cause equipment safety risks, such as fire alarms and smoke alarms, are usually mounted as process stop control operations; for the alarm prompts with the lowest priority, some first-level alarms such as abnormal intake pressure and device failure are usually mounted as alarm prompt control operations; and the remaining second-level alarms are mounted as process alarm control operations. In practical applications, if the priority levels are not divided, when the device failure alarm and the smoke alarm are generated at the same time, if only the alarm prompt is executed, it will cause equipment risks. Therefore, through the above-mentioned Alarm table, different alarm types are configured with corresponding fault-tolerant control operations. At the same time as the alarm prompt, the safety of semiconductor process equipment when an alarm occurs is guaranteed by corresponding remedial measures; and when multiple alarm types occur, fault-tolerant control is performed in order of priority, which further effectively ensures the safety of semiconductor process equipment, thereby ensuring the product quality and production capacity of semiconductor process equipment.

[0054] In one embodiment, the process alarm control operation is implemented through the corresponding process alarm recipe. If the target fault-tolerant control operation is the process alarm control operation, the process of controlling the semiconductor process equipment to operate according to the target fault-tolerant control operation is as follows: controlling the semiconductor process equipment to switch from the current process step to executing the process alarm recipe, and when executing to the end step of the process alarm recipe, determining the target mode of the end step; wherein the target mode includes a first mode and a second mode, the first mode is used to characterize a mode of automatically returning to the process recipe after the process alarm recipe is executed, and the second mode is used to characterize a mode of staying at the end step after the process alarm recipe is executed; controlling the semiconductor process equipment to operate according to the target mode to complete the process alarm recipe.

[0055] Specifically, when the semiconductor process equipment is running according to the process recipe, if a secondary alarm is generated in the current process step, at this time, the currently running process recipe is immediately terminated, and the target fault-tolerant control operation is determined to be the process alarm control operation according to Table 1. Since the process alarm control operation is implemented through the corresponding process alarm recipe Alarm Recipe, the semiconductor process equipment jumps from the process recipe to the Alarm Recipe. Since the corresponding remedial measures are added to the Alarm Recipe, the Alarm Recipe is executed by the semiconductor process equipment, thereby ensuring the safety state of the semiconductor process equipment and improving the product quality of the semiconductor process equipment.

[0056] In addition, the Alarm Recipe is different from other recipes. The Alarm Recipe also has different modes in its end step (EndStep), so that after executing the Alarm Recipe, the semiconductor process equipment does not enter the Idle state to wait for the next process state like other recipes, but performs mode judgment, which not only ensures the safety of the semiconductor process equipment when it alarms, but also facilitates the guarantee of the output of mass production of semiconductor process equipment through different modes.

[0057] In actual applications, when the semiconductor process equipment executes to the end step (End Step) of the Alarm Recipe, the target mode of the end step is determined; wherein the target mode includes a first mode and a second mode; the first mode may also be referred to as the End mode, i.e., the mode in which the Alarm Recipe automatically returns to the process recipe after the execution is completed; the second mode may also be referred to as the End+Hold mode, i.e., the mode in which the Alarm Recipe stays at the end step after the execution is completed and enters the Hold state.

[0058] Specifically, the specific process of semiconductor process equipment operating in target mode is as follows:

[0059] (1) If the target mode is the first mode, the semiconductor process equipment is controlled to automatically return to the process recipe after the process alarm recipe is executed, and to run according to the next process step of the current process step.

[0060] Specifically, when the End Step of the Alarm Recipe is in the End mode, at this time, the semiconductor process equipment automatically returns to the process recipe after executing the Alarm Recipe, and runs according to the next process step of the current process step that calls the Alarm Recipe in the process recipe. For example, when the third process step Step3 in the process recipe executes the Alarm Recipe due to the generation of a secondary alarm, when the End Step of the Alarm Recipe is in the End mode, after the End Step is executed, the semiconductor process equipment automatically returns to the process recipe and continues to run according to the fourth process step Step4.

[0061] Therefore, when the End Step of the Alarm Recipe is in End mode, the Alarm Recipe is called when a secondary alarm occurs, and after the Alarm Recipe is executed, it automatically returns to the next process step in the process recipe that calls the Alarm Recipe to continue running until the process is completed. This not only ensures the safety of the semiconductor process equipment when an alarm occurs, but also returns to the process to continue processing after the equipment is safe, avoiding the quality reduction of the wafer due to process interruption, thereby improving the product quality and production capacity of semiconductor process equipment.

[0062] (2) If the target mode is the second mode, control the semiconductor process equipment to stay at the end step; and obtain user operations and control the operation of the semiconductor process equipment according to the user operations; wherein the user operations include jump operations and continue operations.

[0063] Specifically, when the End Step of the Alarm Recipe is the End+Hold mode, at this time, the semiconductor process equipment stays at the End Step after executing the Alarm Recipe and enters the Hold state. At the same time, the human-computer interaction interface of the semiconductor process equipment also provides operation buttons, where the operation buttons include a jump operation button Jump and a continue operation button Resume. The operator operates the corresponding operation button according to the state of the semiconductor process equipment and the current wafer processing state. After the semiconductor process equipment obtains the operator's user operation on the operation button, it operates according to the user operation.

[0064] In one operation mode, if the user operates to continue the operation, the semiconductor process equipment is controlled to return to the process recipe and operate according to the next process step of the current process step. Specifically, when the operator operates Resume, at this time, the semiconductor process equipment returns to the process recipe that calls the Alarm Recipe, and operates according to the next process step of the current process step that calls the Alarm Recipe, so as to continue processing the wafers in the semiconductor process equipment until the process recipe is executed, thereby avoiding the semiconductor process equipment from not completing the process, thereby ensuring product quality.

[0065] In another operation mode, if the user operation is a jump operation, the semiconductor process equipment is controlled to jump to any process step of the process recipe. Alternatively, if the user operation is a jump operation, the semiconductor process equipment is controlled to jump to any process step of the process alarm recipe. That is, when the operator operates Jump, at this time, the semiconductor process equipment jumps to any process step in the process recipe that calls the Alarm Recipe, or jumps to any process step of the currently running Alarm Recipe, so that the semiconductor process equipment is in a safe state.

[0066] Therefore, when a secondary alarm occurs, the Alarm Recipe is executed by the semiconductor process equipment to ensure the safety of the equipment; and by setting two modes in the End Step of the Alarm Recipe, the semiconductor process equipment can be controlled to execute the corresponding mode according to the user operation, enriching the application scenarios.

[0067] In one embodiment, the process recipe includes a main process recipe Main Recipe and a sub-process recipe SubRecipe, and the method further includes: when the sub-process recipe is called in the target process step of the main process recipe, and the current process step that generates an alarm is the end step of the sub-process recipe, obtaining the number of runs of the sub-process recipe after the process alarm recipe is executed; if the number of runs reaches a preset number, controlling the semiconductor process equipment to return to the next process step of the target process step; if the number of runs does not reach the preset number, controlling the semiconductor process equipment to re-execute the sub-process recipe until the number of runs reaches the preset number.

[0068] Specifically, since Sub Recipe can only be called and run through Main Recipe, let the process step in Main Recipe that calls and runs Sub Recipe be the target process step. When the process recipe when the secondary alarm occurs is Sub Recipe, and the current process step that calls Alarm Recipe in Sub Recipe is the End Step of Sub Recipe, at this time, the semiconductor process equipment executes Alarm Recipe, and obtains the number of Sub Recipe runs after the Alarm Recipe is executed. If the number of runs reaches the preset number, the semiconductor process equipment automatically returns to the next process step of the target process step that calls Sub Recipe in Main Recipe. Conversely, if the number of runs does not reach the preset number, the semiconductor process equipment automatically returns to execute Sub Recipe until the number of runs reaches the preset number.

[0069] In addition, in addition to determining whether the number of runs has reached the preset number, when the Sub Recipe is called in the target process step, the remaining total number of runs corresponding to the Sub Recipe (i.e., the preset number of times) can be directly obtained, and when the Sub Recipe is run once, the remaining total number of runs is reduced by 1. For example, the remaining total number of runs is set to 5 times. After the Sub Recipe is run once, the remaining total number of runs = the remaining total number of runs minus 1. At this time, the remaining total number of runs is 4. After each run of the Sub Recipe is completed, determine whether the remaining total number of runs is 0. If it is 0, it automatically returns to the next process step of the target process step that calls the Sub Recipe in the Main Recipe for execution. If it is not 0, continue to execute the Sub Recipe until the remaining total number of runs is 0.

[0070] Therefore, in the process of semiconductor process equipment, such as Figure 3As shown, the process of switching between recipes is as follows: (A1) first run the Idle Recipe to put the semiconductor process equipment in the Idle state to prepare for the process flow; then, determine whether to start the Main Recipe, if not, continue to be in the Idle state, if so, run the Main Recipe; (A2) during the running of each process step of the Main Recipe, determine whether to call the Sub Recipe, if not, continue to run the Main Recipe until it runs to its End Step; if so, run the Sub Recipe, and during the running process, when it runs to the End Step of the Sub Recipe, determine whether the remaining running total is 0, if not, re-run the Sub Recipe, such as returning to the first process step of the Sub Recipe to start running until it is 0; if the remaining running total is 0, return to the next process step in the Main Recipe that calls the Sub Recipe and continue to run until it reaches the End Step of the Main Recipe, and, when the Main Recipe runs to the End Step, return to the Idle Recipe to prepare for the next process flow.

[0071] It should be noted that when the End Step of Sub Recipe calls Alarm Recipe, after the Alarm Recipe is executed, it is determined whether the total number of remaining runs of Sub Recipe is 0. If it is 0, it automatically returns to the next process step of the target process step that called Sub Recipe in Main Recipe to run. If the total number of remaining runs is not 0, it automatically returns to execute Sub Recipe. At the same time, the total number of remaining runs of Sub Recipe is reduced by 1. When it runs to End Step again, if the alarm still exists, it continues to call Alarm Recipe, and after the Alarm Recipe is executed, it is re-determined whether the total number of remaining runs of Sub Recipe is 0, and the above process is repeated.

[0072] In addition, if the process steps other than End Step in Sub Recipe call Alarm Recipe, after the Alarm Recipe is executed, it jumps back to Sub Recipe and continues to run according to the next process step that calls Alarm Recipe in Sub Recipe; at the same time, the number of times Sub Recipe is run is determined until the number of times Sub Recipe is run reaches the preset number, or the total number of remaining runs is 0.

[0073] In one embodiment, if the target fault-tolerant control operation is a process suspension control operation, the process of controlling the semiconductor process equipment to operate according to the target fault-tolerant control operation is as follows: controlling the semiconductor process equipment to operate according to the process suspension recipe corresponding to the process suspension control operation, and controlling the semiconductor process equipment to be in an idle state after the operation is completed.

[0074] Specifically, Figure 3 As shown in the figure, when the semiconductor process equipment is running according to the process recipe, if the first-level alarm is triggered in the current process step, since the first-level alarm is highly harmful, at this time, the currently running process recipe is controlled to be terminated immediately, and the semiconductor process equipment is controlled to run according to the process abort recipe Abort Recipe corresponding to the process abort control operation, such as removing the product from the process chamber as soon as possible to reduce the degree of damage to the product and reduce the degree of damage to the semiconductor process equipment after a serious failure. And, when running to the End Step of Abort Recipe, return to Idle Recipe to prepare for the next process flow. Therefore, by calling Abort Recipe during the first-level alarm, the equipment safety is guaranteed.

[0075] In one embodiment, if the target fault-tolerant control operation is an alarm prompt control operation, the process of controlling the semiconductor process equipment to operate according to the target fault-tolerant control operation is as follows: the semiconductor process equipment is controlled to issue an alarm prompt and continue to operate according to the process recipe. Since the third-level alarm is less harmful, at this time, the semiconductor process equipment is controlled to only issue an alarm prompt and continue to operate according to the process recipe to ensure the production capacity of the semiconductor process equipment.

[0076] In summary, in the process of semiconductor process equipment, when an alarm occurs, the existing fault-tolerant control method is to terminate the operation of the current process. However, this method has different degrees of impact on the process results, and it is also impossible to achieve the purpose of both enabling the equipment to quickly enter a safe state when an alarm occurs and restoring the current process. Based on this, the semiconductor process equipment control method provided by the embodiment of the present invention increases the flexibility of fault-tolerant control operations without affecting the response of the equipment to the alarm, and provides an automatic recovery processing method or a processing method of continuing the process after waiting for the operator to restore the equipment state in a safe state, so that when an alarm occurs, the equipment can enter a safe state through reasonable compensatory measures, and restore the current process to proceed smoothly, thereby ensuring the smooth completion of the current process and achieving the purpose of protecting product quality and improving production capacity.

[0077] For ease of understanding, an example is given here. For the ALD (Atomic layer deposition) process of semiconductor process equipment, if a vacuum pump alarm occurs during the deposition of the Main Recipe, the alarm type is a secondary alarm, and the corresponding fault-tolerant control operation is a process alarm control operation. At the same time, the End Step mode of the process alarm recipe Alarm Recipe is set to End+Hold mode. At this time, the currently running Main Recipe is terminated and the Alarm Recipe is run.

[0078] like Figure 4 As shown, during the operation of the Alarm Recipe, the corresponding valves for the air intake: Valve 1, Valve 2 and Valve 3 are all closed, and the exhaust valve is closed, so that the semiconductor process equipment enters a safe state and stays at the EndStep of the Alarm Recipe, waiting for the operator to inspect the vacuum pump. After the vacuum pump is restored, the operator can click Resume to continue the process according to the process situation. Compared with the direct termination method in the existing control scheme, the production capacity and product quality of the semiconductor process equipment are greatly improved.

[0079] In addition, if in the in-situ cleaning (Dry Clean) process of semiconductor process equipment, the heat release during the Dry Clean reaction will cause the exhaust pipe temperature to rise rapidly, and the temperature rise may cause damage to the pipe heating belt. In the Dry Clean process, the alarm for abnormal heating belt temperature can be defined as a secondary alarm, and the corresponding fault-tolerant control operation is the process alarm control operation. At the same time, the End Step mode of the Alarm Recipe is set to the End mode. At this time, terminate the currently running Main Recipe and run the Alarm Recipe. In the Alarm Recipe, first evacuate the Dry Clean gas in the process chamber and introduce nitrogen N 2 After a period of time, the pipeline temperature can return to normal. At this time, after the Alarm Recipe is completed, it automatically returns to the Dry Clean process to continue running, which not only ensures the device safety of the semiconductor process equipment, but also improves the operating efficiency of the semiconductor process equipment, thereby increasing the production capacity of the semiconductor process equipment.

[0080] Embodiment 2

[0081] Based on the above method embodiment, the embodiment of the present invention provides another semiconductor process equipment control method, which focuses on describing the process recipe is a Main Recipe that does not call a Sub Recipe, and calls an Alarm Recipe during execution. Figure 5As shown, the method comprises the following steps:

[0082] Step S502, running Idle Recipe; at this time, the semiconductor process equipment is in Idle state to prepare for the process flow;

[0083] Step S504, determine whether to start the Main Recipe; if not, continue to be in the Idle state, if so, execute step S506 to run the Main Recipe;

[0084] Step S506, running Main Recipe Step1; during the running of Main Recipe, the multiple process steps Step contained therein are executed in sequence, starting from the first process step Step1, and then executed in sequence according to the order of the process steps.

[0085] Step S508, running Main Recipe Stepn; wherein n represents any process step after the first process step Step1.

[0086] Step S510, whether an alarm is triggered; if not, execute step S524; if so, the currently running MainRecipe is terminated and execute step S512;

[0087] Step S512, the secondary alarm calls the Alarm Recipe; at this time, the semiconductor process equipment jumps from the Main Recipe to the process alarm control operation through the corresponding process alarm recipe Alarm Recipe, and runs according to the Alarm Recipe. The operator adds corresponding remedial measures in the Alarm Recipe. The remedial measures can be set according to different secondary alarms. The purpose is to ensure the safety status of the equipment and provide preparation conditions for the smooth recovery of the process.

[0088] Step S514, determine whether End Step is in End mode;

[0089] When the Alarm Recipe runs to its End Step, at this time, since the End Step is set with the End mode and the End+Hold mode, it is necessary to determine whether the End Step is the End mode. If so, execute step S516, if not, execute step S518.

[0090] Step S516, determine whether the End Step has been completed; if so, execute step S524, after the Alarm Recipe is completed, return to the next process step of the Alarm Recipe in the Main Recipe; if not, return to continue executing the End mode until the End Step is completed.

[0091] Step S518, stay at End Step, waiting for operation processing; when End Step is not in End mode, EndStep is in End+Hold mode. At this time, the semiconductor process equipment stays at End Step after executing Alarm Recipe and enters Hold state to wait for operation processing by the operator.

[0092] Step S520, determining whether Resume is clicked; that is, determining whether the operator clicks the Resume button on the human-computer interaction interface. If so, executing step S524, returning to the next process step of calling the Alarm Recipe in the Main Recipe; if not, executing step S522;

[0093] Step S522, select the target Step; when the operator does not click Resume but clicks Jump, the target Step corresponding to Jump is selected to make the semiconductor process equipment jump from the End Step of the Alarm Recipe to the target Step. The target Step can be any Step in the Main Recipe that calls the Alarm Recipe, or any Step in the Alarm Recipe, which is the End Step in the Main Recipe.

[0094] Step S524, run Main Recipe Step (n+1);

[0095] Step S526, running the Main Recipe End Step;

[0096] Step S528, determine whether End Step has been completed. If not, return to continue executing Main Recipe EndStep until End Step is completed. If so, return to step S502, that is, return to run Idle Recipe after Main Recipe is completed to prepare for the next process.

[0097] In addition, during the execution of the above Main Recipe, when a level 1 alarm occurs, such as Figure 5As shown, at this time, after step S510, the following steps are first executed: Step S530, the first-level alarm calls Abort Recipe, that is, calls the process abort recipe Abort Recipe corresponding to the process abort control operation, and returns to run IdleRecipe after the Abort Recipe is completed, so as to prepare for the next process.

[0098] Therefore, during the execution of the Main Recipe without calling the Sub Recipe, when the Abort Recipe is called, the Idle Recipe is directly returned after the Abort Recipe is executed. When the Alarm Recipe is called, the current Main Recipe will continue to run automatically. In addition, the current state of the semiconductor process equipment and the process conditions, combined with the operator's operation, will be used to perform relevant processing, so that the product after the alarm is triggered can be remedied through the compensatory measures in the Alarm Recipe, thereby ensuring the completeness of the process and the quality of the product.

[0099] Embodiment 3

[0100] Based on the above method embodiment, the present invention provides another semiconductor process equipment control method, which focuses on describing the process recipe as a Main Recipe that calls a Sub Recipe and calls an Alarm Recipe during execution. Figure 6 As shown, the method comprises the following steps:

[0101] Step S602, running Idle Recipe; at this time, the semiconductor process equipment is in Idle state to prepare for the process flow;

[0102] Step S604, determine whether to start the Main Recipe; if not, continue to be in the Idle state, if so, execute step S606 to run the Main Recipe;

[0103] Step S606, running Main Recipe Step1; during the running of Main Recipe, the multiple process steps Step contained therein are executed in sequence, starting from the first process step Step1, and then executed in sequence according to the order of the process steps.

[0104] Step S608, running Main Recipe Stepn; wherein n represents any process step after the first process step Step1.

[0105] Step S610, determine whether to call Sub Recipe, if yes, execute step S612, if no, execute step S638;

[0106] Step S612, running Sub Recipe Step1; during the running of Sub Recipe, the multiple process steps Step contained therein are executed in sequence, starting from the first process step Step1, and then executed in sequence according to the order of the process steps.

[0107] Step S614, running Sub Recipe Stepm; wherein m represents any process step after the first process step Step1 in the Sub Recipe.

[0108] Step S616, whether an alarm is triggered; if not, execute step S634; if yes, the currently running Sub Recipe is terminated and execute step S618;

[0109] Step S618, the secondary alarm calls the Alarm Recipe; at this time, the semiconductor process equipment jumps from the Sub Recipe to the process alarm control operation through the corresponding process alarm recipe Alarm Recipe, and runs according to the Alarm Recipe. The operator adds corresponding remedial measures in the Alarm Recipe. The remedial measures can be set according to different secondary alarms. The purpose is to ensure the safety status of the equipment and provide preparation conditions for the smooth recovery of the process.

[0110] Step S620, determine whether End Step is in End mode;

[0111] When the Alarm Recipe runs to its End Step, at this time, since the End Step is set with the End mode and the End+Hold mode, it is necessary to determine whether the End Step is the End mode. If so, execute step S622, if not, execute step S624.

[0112] Step S622, determine whether the End Step has been completed; if so, execute step S632, after the Alarm Recipe is completed, return to the next process step of calling the Sub Recipe in the Main Recipe; if not, return to continue executing the End mode until the End Step is completed.

[0113] Step S624, stay at End Step, waiting for operation processing; when End Step is not End mode, EndStep is End+Hold mode. At this time, the semiconductor process equipment stays at End Step after executing Alarm Recipe and enters Hold state to wait for operation processing by the operator.

[0114] Step S626, determining whether Resume is clicked; that is, determining whether the operator clicks the Resume button on the human-computer interaction interface, if so, executing step S632; if not, executing step S628;

[0115] Step S628, select the target Step;

[0116] Step S630: Determine whether to jump to Sub Recipe; that is, determine whether the target Step is any step of Sub Recipe. If so, return to step S614; if not, execute step S640;

[0117] Step S632, determining whether Sub Recipe Step m is an End Step; that is, determining whether the step of calling Alarm Recipe in Sub Recipe is the last step, if so, executing step S636, if not, executing step S634;

[0118] Step S634, execute Sub Recipe End Step, and return to step S636 after the execution is completed;

[0119] Step S636, determining whether the remaining number of times of Sub Recipe is 0; that is, when the step of calling Alarm Recipe in Sub Recipe is End Step, at this time, Alarm Recipe is called, and after the Alarm Recipe is completed, determining whether the remaining number of times of Sub Recipe is 0, if so, executing step S638, if not, returning to step S612, re-executing Sub Recipe until the remaining number of times of Sub Recipe is 0.

[0120] Step S638, run Main Recipe Step (n+1);

[0121] Step S640, running the Main Recipe End Step;

[0122] Step S642, determine whether End Step has finished running. If not, return to continue executing Main Recipe EndStep until End Step finishes running. If so, return to step S602, that is, return to run Idle Recipe after Main Recipe is completed to prepare for the next process.

[0123] In addition, during the execution of the above Main Recipe, when a level 1 alarm occurs, such as Figure 6 As shown, at this time, after step S616, the following steps are first executed: Step S644, the first-level alarm calls Abort Recipe, that is, calls the process abort recipe Abort Recipe corresponding to the process abort control operation and returns to run IdleRecipe after Abort Recipe is completed, so as to prepare for the next process.

[0124] Therefore, during the execution of the Main Recipe that calls the Sub Recipe, when the Abort Recipe is called, the Idle Recipe is directly returned after the Abort Recipe is executed. When the Alarm Recipe is called, the current Main Recipe and the called Sub Recipe are automatically continued to run. According to the current state of the semiconductor process equipment and the process conditions, combined with the operator's operation, relevant processing is performed so that the product after the alarm is remedied through the compensatory measures in the Alarm Recipe, thereby ensuring the completeness of the process and the product quality.

[0125] Embodiment 4

[0126] An embodiment of the present invention further provides a semiconductor process equipment, including a controller, the controller including at least one processor and at least one memory, the memory storing a computer program, and the computer program implements the above-mentioned semiconductor process equipment control method when executed by the processor.

[0127] See also Figure 7 As shown, the controller includes a processor 100 and a memory 101 . The memory 101 stores machine executable instructions that can be executed by the processor 100 . The processor 100 executes the machine executable instructions to implement the above-mentioned semiconductor process equipment control method.

[0128] Further, Figure 7 The controller shown further includes a bus 102 and a communication interface 103 , and the processor 100 , the communication interface 103 and the memory 101 are connected via the bus 102 .

[0129] Among them, the memory 101 may include a high-speed random access memory (RAM), and may also include a non-volatile memory (non-volatile memory), such as at least one disk storage. The communication connection between the system network element and at least one other network element is realized through at least one communication interface 103 (which can be wired or wireless), and the Internet, wide area network, local area network, metropolitan area network, etc. can be used. The bus 102 can be an ISA (Industrial Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus or an EISA (Enhanced Industry Standard Architecture) bus, etc. The above-mentioned bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 7 Only one bidirectional arrow is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0130] The processor 100 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by the hardware integrated logic circuit or software instructions in the processor 100. The above processor 100 can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The methods, steps and logic block diagrams disclosed in the embodiments of the present invention can be implemented or executed. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc. The steps of the method disclosed in conjunction with the embodiments of the present invention can be directly embodied as a hardware decoding processor for execution, or a combination of hardware and software modules in the decoding processor for execution. The software module may be located in a storage medium mature in the art, such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory, or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory 101, and the processor 100 reads the information in the memory 101 and completes the steps of the method of the above embodiment in combination with its hardware.

[0131] The semiconductor process equipment provided in the embodiment of the present invention has the same technical features as the semiconductor process equipment control method provided in the above embodiment, and can therefore solve the same technical problems and achieve the same technical effects.

[0132] This embodiment also provides a machine-readable storage medium, which stores machine-executable instructions. When the machine-executable instructions are called and executed by a processor, the machine-executable instructions prompt the processor to implement the above-mentioned semiconductor process equipment control method.

[0133] The semiconductor process equipment control method and the computer program product of the semiconductor process equipment provided in the embodiments of the present invention include a computer-readable storage medium storing program code. The instructions included in the program code can be used to execute the methods described in the previous method embodiments. The specific implementation can be found in the method embodiments and will not be repeated here.

[0134] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system and device described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0135] In addition, in the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0136] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0137] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0138] Finally, it should be noted that the above-described embodiments are only specific implementations of the present invention, which are used to illustrate the technical solutions of the present invention, rather than to limit them. The protection scope of the present invention is not limited thereto. Although the present invention is described in detail with reference to the above-described embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-described embodiments within the technical scope disclosed by the present invention, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A semiconductor process equipment control method, characterized in that: The method comprises: During the process of executing each process step of the process recipe by the semiconductor process equipment, if the current process step generates an alarm, determine the alarm type; wherein the process recipe is configured with multiple alarm types and a fault-tolerant control operation corresponding to each of the alarm types, and the fault-tolerant control operation is used to represent the remedial measures to ensure that the semiconductor process equipment is in a safe state when an alarm occurs; The corresponding target fault-tolerant control operation is determined according to the alarm type, and the semiconductor process equipment is controlled to operate according to the target fault-tolerant control operation.

2. The method according to claim 1, characterized in that The alarm types include level 1 alarm, level 2 alarm and level 3 alarm; the fault-tolerant control operations include process stop control operation, process alarm control operation and alarm prompt control operation; The step of determining the corresponding target fault-tolerant control operation according to the alarm type comprises: If the alarm type is the first level alarm, determining the target fault-tolerant control operation to be the process stop control operation; or, If the alarm type is the secondary alarm, determining the target fault-tolerant control operation to be the process alarm control operation; or, If the alarm type is the third-level alarm, the target fault-tolerant control operation is determined to be the alarm prompt control operation.

3. The method according to claim 2, characterized in that The process alarm control operation is implemented by a corresponding process alarm recipe. If the target fault-tolerant control operation is the process alarm control operation, the step of controlling the semiconductor process equipment to operate according to the target fault-tolerant control operation includes: Controlling the semiconductor process equipment to switch from the current process step to executing the process alarm recipe, and when executing to the end step of the process alarm recipe, determining the target mode of the end step; wherein the target mode includes a first mode and a second mode, the first mode is used to represent a mode of automatically returning to the process recipe after the process alarm recipe is executed, and the second mode is used to represent a mode of staying at the end step after the process alarm recipe is executed; The semiconductor process equipment is controlled to operate according to the target mode to complete the process alarm recipe.

4. The method according to claim 3, characterized in that The step of controlling the semiconductor process equipment to operate according to the target mode includes: If the target mode is the first mode, the semiconductor process equipment is controlled to automatically return to the process recipe after the process alarm recipe is executed, and run according to the next process step of the current process step.

5. The method according to claim 3, characterized in that: The step of controlling the semiconductor process equipment to operate according to the target mode includes: If the target mode is the second mode, the semiconductor process equipment is controlled to stay at the end step; and the user operation is obtained, and the semiconductor process equipment is controlled to run according to the user operation; wherein the user operation includes a jump operation and a continue operation.

6. The method according to claim 5, characterized in that The step of controlling the operation of the semiconductor process equipment according to the user operation comprises: If the user operation is the continue operation, the semiconductor process equipment is controlled to return to the process recipe and run according to the next process step of the current process step.

7. The method according to claim 5, characterized in that The step of controlling the operation of the semiconductor process equipment according to the user operation comprises: If the user operation is the jump operation, the semiconductor process equipment is controlled to jump to any process step of the process recipe; or, the semiconductor process equipment is controlled to jump to any process step of the process alarm recipe.

8. The method according to claim 3, characterized in that The process formula includes a main process formula and a sub-process formula, and the method further includes: When the sub-process recipe is called in the target process step of the main process recipe, and the current process step generating an alarm is the end step of the sub-process recipe, the number of times the sub-process recipe is run is obtained after the process alarm recipe is executed; If the operation times reaches a preset time, the semiconductor process equipment is controlled to return to the next process step of the target process step for operation.

9. The method according to claim 8, characterized in that The method further comprises: If the number of operations does not reach the preset number, the semiconductor process equipment is controlled to continue executing the sub-process recipe until the number of operations reaches the preset number.

10. The method according to claim 2, characterized in that The step of controlling the semiconductor process equipment to operate according to the target fault-tolerant control operation includes: If the target fault-tolerant control operation is the process stop control operation, controlling the semiconductor process equipment to run according to the process stop recipe corresponding to the process stop control operation, and controlling the semiconductor process equipment to be in an idle state after the operation is completed; or If the target fault-tolerant control operation is the alarm prompt control operation, the semiconductor process equipment is controlled to give an alarm prompt and continue to operate according to the process recipe.

11. A semiconductor process equipment, comprising a controller, characterized in that: The controller includes at least one processor and at least one memory, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the method according to any one of claims 1 to 10 is implemented.

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