Smoke temperature protection device and system

Abstract

The invention discloses a smoke temperature protection device and system, and relates to the technical field of semiconductors. The device comprises a controller, and the controller is electrically connected with a temperature sensor, a smoke sensor, an alarm and an emergency stop device. The temperature sensor is configured to collect a temperature value of the semiconductor device and transmit the temperature value to the controller; the smoke sensor is configured to collect a smoke value of the semiconductor device and transmit the smoke value to the controller; the controller is configured to detect whether the received smoke value is within a preset numerical range or not, and execute a target operation according to the temperature value when it is detected that the smoke value is within the preset numerical range; the target operation under the condition that the temperature value is abnormal is that a first control signal is transmitted to an alarm to enable the alarm to give an alarm, and / or a second control signal is transmitted to an emergency stop device to enable the emergency stop device to power off the semiconductor equipment. According to the embodiment of the invention, smoke temperature protection of the semiconductor equipment can be effectively realized.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, and particularly relates to a smoke temperature protection device and system. Background Art

[0002] At present, with the development of semiconductor technology, the overall trend of yield detection equipment is towards complexity, intelligence, and automation. Since the construction cost of semiconductor factories is extremely high, and there are many high-power and high-load equipment operating simultaneously in the factory, once a dangerous accident such as a fire occurs, it will cause huge losses. Therefore, the requirements for fire monitoring of semiconductor equipment are extremely strict. In the prior art, smoke alarms are usually used to achieve fire monitoring and prevention of semiconductor equipment. However, this solution often has many defects such as untimely alarm and insufficient safety prevention.

[0003] Based on this, there is still an urgent need in the industry for a new type of fire protection solution for semiconductor equipment to more effectively achieve the purpose of safely protecting semiconductor equipment. Summary of the Invention

[0004] An embodiment of this application provides a smoke temperature protection device and system, which can more effectively achieve the safety protection of semiconductor equipment.

[0005] On the one hand of the embodiment of this application, an embodiment of this application provides a smoke temperature protection device. The smoke temperature protection device includes a controller, and the controller is electrically connected to a temperature sensor, a smoke sensor, an alarm, and an emergency stop device respectively; the temperature sensor is configured to collect the temperature value of the semiconductor equipment and transmit the temperature value to the controller;

[0006] The smoke sensor is configured to collect the smoke value of the semiconductor equipment and transmit the smoke value to the controller;

[0007] The controller is configured to: detect whether the received smoke value is within a preset numerical range, and in the case where the detected smoke value is within the preset numerical range, perform a target operation according to the temperature value;

[0008] Wherein, in the case of abnormal temperature value, the target operation is: transmitting a first control signal to the alarm to make the alarm give an alarm, and / or, transmitting a second control signal to the emergency stop device to make the emergency stop device cut off the power supply of the semiconductor equipment.

[0009] On the one hand of the embodiment of this application, an embodiment of this application provides a smoke temperature protection system. The smoke temperature protection system includes: an alarm, a temperature sensor, a smoke sensor, an emergency stop device, and the smoke temperature protection device according to any one of the foregoing embodiments.

[0010] In one aspect of the embodiments of the present application, the embodiments of the present application provide a method for protecting against smoke and temperature, which includes:

[0011] Obtain the temperature value and smoke value of the semiconductor device;

[0012] Detect whether the received smoke value is within a preset numerical range;

[0013] In the case where it is detected that the smoke value is within the preset numerical range, perform a target operation according to the temperature value; wherein, in the case where the temperature value is abnormal, the target operation is: transmit a first control signal to the alarm to cause the alarm to give an alarm, and / or transmit a second control signal to the emergency stop device to cause the emergency stop device to cut off the power supply of the semiconductor device.

[0014] In one aspect of the embodiments of the present application, the embodiments of the present application provide a smoke and temperature protection device, which includes:

[0015] A processor and a memory storing computer program instructions;

[0016] When the processor executes the computer program instructions, the smoke and temperature protection method provided in any one of the above embodiments of the present application is implemented.

[0017] In one aspect of the embodiments of the present application, the embodiments of the present application provide a computer storage medium, on which computer program instructions are stored, and when the computer program instructions are executed by a processor, the smoke and temperature protection method provided in any one of the above embodiments of the present application is implemented.

[0018] In one aspect of the embodiments of the present application, the embodiments of the present application provide a computer program product, and when the instructions in the computer program product are executed by a processor of an electronic device, the electronic device is caused to execute the smoke and temperature protection method provided in any one of the above embodiments of the present application.

[0019] A smoke and temperature protection device and system provided by the embodiments of the present application, the smoke and temperature protection device includes a controller, the controller is electrically connected to a temperature sensor, a smoke sensor, an alarm and an emergency stop device respectively, and the controller is configured to detect whether the received smoke value is within a preset numerical range, and in the case where it is detected that the smoke value is within the preset numerical range, perform a target operation according to the temperature value; wherein, in the case where the temperature value is abnormal, the target operation is: transmit a first control signal to the alarm to cause the alarm to give an alarm, and / or transmit a second control signal to the emergency stop device to cause the emergency stop device to cut off the power supply of the semiconductor device.

[0020] A smoke temperature protection device and system according to an embodiment of the present application. Considering that the physical characteristics of the temperature sensor and the smoke sensor are different, the smoke sensor is more sensitive and responds more quickly than the temperature sensor, and is more likely to have false operations caused by volatile gases, etc. Therefore, by simultaneously detecting the smoke and temperature of the semiconductor device, when the detected smoke value is within the preset numerical range, the current situation is reliably judged according to the temperature value, so as to perform accurate logical judgment and corresponding processing, thereby fully avoiding false operations caused by the physical characteristics of the smoke sensor in some scenarios, and realizing accurate alarm and safety protection for on-site fires.

[0021] Moreover, the controller is connected to the alarm and the emergency stop device. When an accident such as a fire occurs, this controller can quickly alarm and even implement power-off protection for the device by transmitting control signals in abnormal situations. Therefore, the smoke temperature alarm device can quickly and effectively reduce the risk of fire and prevent the fire from spreading further. In addition, since the embodiment of the present application specifically uses a temperature sensor and a smoke sensor to collect the temperature value and the smoke value, and such sensors as the temperature sensor and the smoke sensor are usually small in size and can be flexibly set at different positions of the semiconductor electric cabinet, it is convenient to detect key modules at different positions in the electric cabinet.

[0022] Overall, a smoke temperature protection device and system according to an embodiment of the present application can effectively realize the monitoring function of the temperature environment and the smoke environment of the operating state of the semiconductor device, and can take means such as intelligent alarm and automatic power-off protection in abnormal situations, so as to realize early fault prediction, thereby effectively avoiding semiconductor device failures and reducing the risks of personal injury and economic losses. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0024] Figure 1 is a schematic structural diagram of a smoke alarm provided by an embodiment of the present application;

[0025] Figure 2 is a schematic structural diagram of a smoke temperature protection device provided by an embodiment of the present application;

[0026] Figure 3 is a schematic structural diagram of a smoke temperature protection device provided by another embodiment of the present application;

[0027] Figure 4It is a schematic structural diagram of a smoke temperature protection device provided by another embodiment of the present application;

[0028] Figure 5 It is a schematic structural diagram of a smoke temperature protection system provided by an embodiment of the present application;

[0029] Figure 6 It is a schematic structural diagram of a smoke temperature protection system provided by another embodiment of the present application;

[0030] Figure 7 It is a schematic flowchart of a smoke temperature protection method provided by an embodiment of the present application;

[0031] Figure 8 It is a schematic scenario flowchart of a smoke temperature protection method provided by an embodiment of the present application;

[0032] Figure 9 It is a schematic structural diagram of a smoke temperature protection device provided by an embodiment of the present application. Detailed implementation manners

[0033] The features and exemplary embodiments of various aspects of the present application will be described in detail below. To make the objectives, technical solutions and advantages of the present application more clear and understandable, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only intended to provide a better understanding of the present application by showing examples of the present application.

[0034] It should be noted that in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, elements defined by the statement "comprising..." do not exclude the presence of additional identical elements in the process, method, article or device including the said elements.

[0035] It should be noted that in the embodiments of the present application, some existing solutions in the industry such as certain software, components, models, etc. may be mentioned. They should be regarded as exemplary, and their purpose is only to illustrate the feasibility in the implementation of the technical solutions of the present application, but it does not mean that the applicant has already or necessarily used this solution.

[0036] As described in the background art section, in the prior art, smoke alarms are often used for fire prevention. Figure 1 is a schematic structural diagram of a smoke alarm provided by an embodiment of the present application. As Figure 1 shown, the smoke alarm realizes fire prevention by monitoring the concentration of smoke. An ionization type smoke sensor is adopted inside. There is a radioactive substance in the sensor of the ionization alarm that can generate current. When the smoke particles in the smoke enter the sensor, they will disrupt the current, resulting in the alarm sounding. However, the above technical solutions often have many defects such as untimely alarm and low safety prevention intensity.

[0037] Specifically, (1) A large amount of smoke needs to be generated within the range that the existing smoke alarms can monitor before they can trigger an alarm. Therefore, such smoke alarms are usually only applicable to situations where there is a large amount of smoke during a fire. If a large amount of smoke is generated by semiconductor equipment, the semiconductor equipment may already have caught fire. Therefore, there is a risk of untimely alarm when using existing smoke alarms for fire prevention.

[0038] (2) The existing smoke alarms in the prior art are prone to false alarms when there is no fire. During the cleaning process of semiconductor equipment in a semiconductor factory, some volatile cleaning liquids (such as isopropyl alcohol, alcohol) are used. Such highly volatile liquids also generate smoke when evaporating, and at this time, the smoke alarms are prone to false alarms.

[0039] (3) The existing smoke alarms in the prior art cannot be connected to the machine tool, and lack effective safety protection means except for alarm. The currently used smoke alarms do not have output signal lines or other interfaces that can be connected in series to the main semiconductor equipment. The current smoke alarms cannot transmit information to the semiconductor equipment, and the equipment cannot cut off the power supply in a timely manner. Therefore, such solutions cannot effectively reduce the danger of fire when a fire occurs, and thus cannot effectively prevent the fire from spreading further.

[0040] (4) The existing smoke alarms in the prior art are more suitable for household, shopping mall and other scenarios, and are not applicable to industrial equipment. The existing smoke alarms are relatively large in size, and the space in the semiconductor electric cabinet is narrow, which is not convenient for installation in the electric cabinet of semiconductor equipment, and it is not convenient to monitor the key modules at different positions in the electric cabinet.

[0041] In view of the above, in order to solve the problems of the prior art, the embodiments of the present application provide a smoke temperature protection device and system to ensure the relevant monitoring of the safe operation of in-service equipment, and take corresponding measures to protect the equipment and the staff, so as to facilitate the full elimination of potential faults and avoid personal injuries and economic losses. It should be noted that the embodiments provided in the present application are not used to limit the scope of the disclosure of the present application.

[0042] First, the smoke temperature protection device 100 provided by the embodiments of the present application will be introduced below. Figure 2 The structural schematic diagram of the smoke temperature protection device 100 provided by an embodiment of the present application is shown. Figure 2 The shown smoke temperature protection device 100 includes a controller 10. The controller 10 is electrically connected to a temperature sensor, a smoke sensor, an alarm, and an emergency stop device respectively.

[0043] The above temperature sensor is configured to collect the temperature value of the semiconductor device and transmit the temperature value to the controller 10. The smoke sensor is configured to collect the smoke value of the semiconductor device and transmit the smoke value to the controller 10.

[0044] The controller 10 is configured to: detect whether the received smoke value is within a preset numerical range, and in the case where it is detected that the smoke value is within the preset numerical range, perform a target operation according to the temperature value.

[0045] Among them, in the case where the temperature value is abnormal, the target operation is: transmitting a first control signal to the alarm to cause the alarm to give an alarm, and / or transmitting a second control signal to the emergency stop device to cause the emergency stop device to cut off the power supply of the semiconductor device.

[0046] In this embodiment, the above smoke sensor and temperature sensor can be respectively arranged at different positions of the semiconductor device, and the semiconductor device is, for example, an electrical cabinet of a semiconductor yield detection device. One or more smoke sensors and temperature sensors can be arranged on the same semiconductor device to ensure multi-directional monitoring of the semiconductor device. The above smoke sensor and temperature sensor are respectively electrically connected to the controller 10 and feedback the corresponding smoke value and temperature value to the controller 10.

[0047] Among them, the smoke value feedback by the smoke sensor and the temperature value feedback by the temperature sensor can be analog signals or digital signals, which can be specifically determined according to the sensor selection. The time and frequency of the smoke sensor feedbacking the smoke value can be different from the time and frequency of the temperature sensor feedbacking the temperature value.

[0048] The alarm device may be a device with a warning function such as a buzzer or an alarm light. The alarm device may be added to the semiconductor device, or may be installed at other locations that are convenient for operators to view. The alarm device is electrically connected to the controller 10, and performs an alarm action in response to the first control signal of the controller 10, which can effectively prevent accidents and reduce losses.

[0049] The above-mentioned emergency stop device (EMO, Emergency Off) is a safety device used to quickly cut off the power supply of the device or stop its operation in an emergency. The emergency stop device is electrically connected to the controller 10, and cuts off the power supply of the semiconductor device by responding to the second control signal of the controller 10, thereby effectively reducing the risk of accidents.

[0050] The controller 10 is used to detect whether the received smoke value is within a preset value range, and when it is detected that the smoke value is within the preset value range, perform a target operation according to the temperature value.

[0051] Wherein, when the temperature value is abnormal, the target operation is: transmitting a first control signal to the alarm so that the alarm sounds an alarm, and / or transmitting a second control signal to the emergency stop device so that the emergency stop device cuts off power to the semiconductor device.

[0052] The above-mentioned preset numerical range can be, for example, the numerical range of the smoke value in a slightly abnormal state, which is likely to be caused by volatile gases and has nothing to do with the fire on site. Therefore, by setting the preset numerical range, when the smoke value is within the preset numerical range, the temperature value is obtained for logical judgment, and then the corresponding target operation is performed according to different temperature values.

[0053] For example, in the case of abnormal temperature values, if the temperature value is slightly abnormal, the controller 10 sends a first control signal to the alarm so that the alarm can sound an alarm in time. If the temperature value is seriously abnormal, the controller 10 transmits a second control signal to the emergency stop device so that the emergency stop device cuts off the power of the semiconductor device. Slight abnormalities and serious abnormalities can correspond to different temperature value ranges. In the case of normal temperature values, it is considered that the current smoke value may be abnormal due to volatile gases, and the normal operation of the semiconductor device can continue to be maintained.

[0054] The above-mentioned temperature value is abnormal, for example: the temperature value exceeds a preset temperature alarm threshold; the above-mentioned temperature value is normal, for example: the temperature value does not exceed the temperature alarm threshold.

[0055] Understandably, the controller 10 can be specifically implemented by a microcontroller unit (MCU), a digital signal processor (DSP), a single-chip microcomputer, or a field-programmable gate array (FPGA). Exemplarily, the functions of the above-mentioned controller 10 are implemented by using a single-chip microcomputer of the STM32 series. More specifically, the model of the controller 10 is selected as STM32F103RCT. This single-chip microcomputer has perfect data conversion functions and rich peripherals, which is conducive to fully realizing the functions of the controller 10.

[0056] Compared with the prior art, for a smoke and temperature protection device 100 according to an embodiment of the present application, considering that the physical characteristics of the temperature sensor and the smoke sensor are different, the smoke sensor is more sensitive and responds more quickly than the temperature sensor, and is more likely to have false actions caused by volatile gases, etc. Therefore, by simultaneously detecting the smoke and temperature of the semiconductor device, when the controller 10 detects that the smoke value is within a preset numerical range, it then makes a reliable judgment on the current situation according to the temperature value, so as to perform accurate logical judgment and corresponding processing, thereby being able to fully avoid false actions caused by the physical characteristics of the smoke sensor in some scenarios, and realizing accurate alarm and safety protection for on-site fires.

[0057] Moreover, by connecting the controller 10 to the alarm and the emergency stop device, when an accident such as a fire occurs, the controller 10 can quickly give an alarm and even implement power-off protection for the device by transmitting a control signal in an abnormal situation. Therefore, the smoke and temperature protection device 100 can effectively reduce the risk of fire and also prevent the fire from spreading further.

[0058] In addition, since the temperature sensor and the smoke sensor are specifically used in the embodiment of the present application to collect the temperature value and the smoke value, and such sensors as the temperature sensor and the smoke sensor are usually small in size and can be flexibly arranged at different positions of the semiconductor electric cabinet, it is convenient to detect key modules at different positions in the electric cabinet.

[0059] Generally speaking, a smoke and temperature protection device 100 according to an embodiment of the present application can effectively realize the monitoring function of the temperature environment and the smoke environment of the operating state of the semiconductor device, and can take measures such as intelligent alarm and automatic power-off protection in case of an abnormality, so as to realize early fault prediction, thereby effectively avoiding semiconductor device failures and reducing the risks of personal injury and economic losses.

[0060] As an alternative embodiment, when it is detected that the smoke value is within a preset numerical range, performing a target operation according to the temperature value includes:

[0061] When it is detected that the smoke value exceeds the smoke alarm threshold and does not exceed the smoke power-off threshold, perform a target operation according to the temperature value;

[0062] Wherein, the smoke alarm threshold is lower than the smoke power-off threshold.

[0063] In this embodiment, the preset numerical range of the above-mentioned smoke value is set as: the numerical range that exceeds the smoke alarm threshold and does not exceed the smoke power-off threshold. In this way, when the controller 10 detects that the smoke value exceeds the smoke alarm threshold and does not exceed the smoke power-off threshold, considering the different physical characteristics of the temperature sensor and the smoke sensor, the smoke sensor is more sensitive and responds more quickly than the temperature sensor, and false actions are likely to occur due to volatile gases, etc.

[0064] Therefore, the controller 10 will not directly perform a smoke alarm, but will wait for the temperature value subsequently feedback by the slower-responsive temperature sensor, and then perform relevant actions according to the temperature value feedback by the temperature sensor. Since the temperature value collected by the temperature sensor is more referenceable, it can ensure that the controller 10 can perform timely and reliable actions according to the temperature value feedback by the temperature sensor.

[0065] In this embodiment, when the controller 10 detects that the smoke value exceeds the smoke alarm threshold and does not exceed the smoke power-off threshold, by combining the temperature value feedback by the temperature sensor, dual detection is performed from both the smoke and temperature aspects, which can avoid false operations caused by the presence of volatile gases, etc., and is beneficial to maintaining the normal operation of the semiconductor device.

[0066] It can be understood that the above-mentioned smoke power-off threshold is higher than the smoke alarm threshold, and the smoke value under the normal operation of the semiconductor device is less than the smoke alarm threshold.

[0067] As an alternative embodiment, the controller is further configured to:

[0068] When it is detected that the smoke value exceeds the smoke power-off threshold, transmit a first control signal to the alarm and transmit a second control signal to the emergency stop device.

[0069] Specifically, after the controller 10 receives the smoke value, if the controller 10 detects that the smoke value exceeds the smoke power-off threshold, it transmits a second control signal to the emergency stop device, so that the emergency stop device operates to cut off the power supply of the semiconductor device, thereby enabling timely fault removal and effectively reducing the risk of damage to the semiconductor device. At the same time, the controller 10 also transmits a first control signal to the alarm, so that the alarm gives an alarm prompt sound or picture, etc., to remind relevant personnel to quickly check and solve the fire hazard. In this way, the protection safety is effectively improved.

[0070] It should be added that in some other embodiments, when the smoke value exceeds the smoke power-off threshold, the controller 10 may also transmit only the second control signal to the emergency stop device to ensure the timely cut-off of the device power supply, and there is no strict limit here. Also, when the controller 10 detects that the current smoke value does not exceed the smoke alarm threshold, the device can continue to operate normally.

[0071] In addition, in some embodiments, since the smoke sensor has its corresponding maximum feedback value that can be displayed, in order to ensure that the alarm thresholds are within the normal measurement range of the sensor, to avoid setting the threshold too high and unable to trigger the alarm, and to avoid setting the threshold too low and often generating false alarms, the above-mentioned smoke power-off threshold and smoke alarm threshold shall not exceed the maximum feedback value of the smoke sensor when set.

[0072] In one example, the smoke alarm threshold is set to be lower than 30% of the maximum feedback value of the smoke sensor, and the smoke power-off threshold is set to be lower than 10% of the maximum feedback value of the smoke sensor.

[0073] As an alternative embodiment, in the case of abnormal temperature value, perform a target operation according to the temperature value, including:

[0074] When it is detected that the temperature value exceeds the temperature alarm threshold and does not exceed the temperature power-off threshold, transmit the first control signal to the alarm;

[0075] When it is detected that the temperature value exceeds the temperature power-off threshold, transmit the first control signal to the alarm and transmit the second control signal to the emergency stop device;

[0076] Among them, the temperature power-off threshold is higher than the temperature alarm threshold.

[0077] Specifically, after receiving the temperature value, the controller 10 detects the temperature value. If it is detected that the temperature value reaches the temperature power-off threshold, the controller 10 transmits the second control signal to the emergency stop device and transmits the first control signal to the alarm, so that the emergency stop device can timely cut off the power supply of the semiconductor device and give an alarm prompt to relevant personnel through the alarm.

[0078] If it is detected that the temperature value reaches the temperature alarm threshold but does not reach the temperature power-off threshold, the controller 10 transmits the first control signal to the alarm to prompt relevant personnel to check the abnormal temperature through the alarm. If the controller 10 detects that the smoke value does not exceed the smoke alarm threshold, the device can continue to operate normally. If the temperature value does not exceed the temperature alarm threshold, the normal operation of the semiconductor device can continue to be maintained.

[0079] In this embodiment, for different abnormal degrees of the temperature value of the semiconductor device, by differentially setting the controller 10 to transmit different control signals, differential monitoring processing is performed on the semiconductor device in different temperature environments, which can reasonably ensure the stable operation of the semiconductor device and fire prevention.

[0080] It is understandable that the above temperature power-off threshold is higher than the temperature alarm threshold, and the temperature value under normal operation of the semiconductor device is less than the temperature alarm threshold.

[0081] In addition, in some embodiments, since the temperature sensor has its corresponding maximum feedback value that can be displayed, therefore, in order to ensure that the alarm thresholds are within the normal measurement range of the sensor, and to avoid the threshold being set too high to trigger an alarm, and to avoid the threshold being set too low to often generate false alarms, the above temperature power-off threshold and temperature alarm threshold shall not exceed the maximum feedback value of the temperature sensor when set.

[0082] In one example, the temperature alarm threshold is set to be lower than 30% of the maximum feedback value of the temperature sensor, and the temperature power-off threshold is set to be lower than 10% of the maximum feedback value of the temperature sensor.

[0083] It should be added that in some other embodiments, when the temperature value exceeds the temperature power-off threshold, the controller 10 can also only transmit the second control signal to the emergency stop device to ensure the timely cut-off of the device power supply, and there is no strict limitation here.

[0084] It should be noted that the above judgment logic of the temperature value also applies to the situation where the controller 10 normally receives the temperature value feedback from the temperature sensor. After the controller 10 receives the temperature value, the logical judgment and corresponding processing can be performed according to the above embodiment.

[0085] As an alternative embodiment, the controller 10 is configured to:

[0086] When it is detected that the smoke value exceeds the smoke power-off threshold, time the first duration for which the smoke value exceeds the smoke power-off threshold, and when the first duration reaches the preset delay time, transmit the second control signal to the emergency stop device;

[0087] and / or,

[0088] When it is detected that the temperature value exceeds the temperature power-off threshold, time the second duration for which the temperature value exceeds the temperature power-off threshold, and when the second duration reaches the preset delay time, transmit the second control signal to the emergency stop device;

[0089] Wherein, the preset delay time does not exceed the specified delay time upper limit value.

[0090] Specifically, when the controller 10 detects that the smoke value exceeds the smoke power-off threshold, and / or when the controller 10 detects that the temperature value exceeds the temperature power-off threshold, a second control signal needs to be transmitted to the emergency stop device, causing the emergency stop device to operate and cut off the power supply of the equipment.

[0091] In this embodiment, considering the situation where someone makes the current ambient temperature higher than the temperature power-off threshold for a short time, or makes the current ambient temperature higher than the temperature power-off threshold for a short time artificially. Therefore, in order to avoid the mis-triggering of the power-off operation, the above-mentioned first duration and second duration are further set to send delay signals, which is equivalent to being able to perform a delay waiting before executing the cut-off operation.

[0092] In this way, by setting the above delay, a certain operation and environment recovery time can be reserved for relevant personnel, avoiding direct execution of the power-off operation from interfering with on-site tests and other situations. At the same time, it is also beneficial to avoid mis-triggering and improve the reliability of power-off.

[0093] Among them, the above-mentioned first duration and second duration can be flexibly set to meet the different requirements of different environments for the timeliness of power-off. The first duration and the second duration can be the same or different.

[0094] In order to avoid the power-off being untimely due to the above-mentioned delay time being too long, a delay time upper limit value can be specified in advance, such as 10S. The first duration and the second duration shall not be set to exceed 10S.

[0095] In an example, both the above-mentioned first duration and second duration are set to 8S. If the temperature value exceeds the temperature power-off threshold, a delay of 8S will occur, and the second control signal of the controller 10 will be triggered, causing the emergency stop device to trigger and cut off the power supply of the semiconductor equipment. In this way, a delay of 8S before determining to cut off the power supply can effectively avoid mis-triggering caused by artificially making the current ambient temperature higher than the temperature threshold.

[0096] As an alternative embodiment, as Figure 3 shown, the smoke and temperature protection device 100 further includes a communication module 20, and the communication module 20 is electrically connected to the controller 10 and the touch screen respectively;

[0097] The communication module 20 is configured to receive the smoke value and temperature value sent by the controller 10, convert the smoke value and temperature value into corresponding first Ethernet physical signals, and transmit the first Ethernet physical signals to the touch screen;

[0098] The touch screen is configured to receive the first Ethernet physical signal and display the smoke value and temperature value based on the first Ethernet physical signal.

[0099] Specifically, the communication module 20 can serve as a communication bridge between the controller 10 and other devices, and is used to implement data format conversion between both ends of the bridge. For example, both the smoke value and the temperature value output by the controller 10 are digital signals, and the signal format supported by the touch screen is an Ethernet physical signal. The communication module 20 can convert the digital signal into an Ethernet physical signal, and vice versa, convert the Ethernet physical signal into a digital signal.

[0100] As an example, the communication module 20 can be implemented by using a W5500 chip in terms of hardware. The communication module 20 can be integrated with the aforementioned controller 10 on the same printed circuit board (PCB), and this PCB can be understood as the smoke and temperature protection device 100 in this application. The W5500 chip has developed the function of Ethernet communication. The W5500 chip can implement the TCP / IP protocol (Transmission Control Protocol / Internet Protocol).

[0101] The communication module 20 is used to support data communication between the controller 10 and the touch screen. After receiving the smoke value and the temperature value, the controller 10 transmits the values to the touch screen through the communication module 20. The touch screen can be specifically arranged on a semiconductor device. The touch screen is pre-configured with a UI interface (User Interface), and subsequently visualizes and intuitively displays the smoke value and the temperature value according to the data transmitted by the communication module 20. For example, a pop-up reminder is given for the smoke value and the temperature value.

[0102] In this embodiment, the data communication between the controller 10 and the touch screen is realized through the communication module 20. The controller 10 can timely transmit the received sensor data to the touch screen, and the touch screen can visually display the current smoke and temperature values collected by the controller 10, which helps the operator to timely check the current environmental monitoring situation.

[0103] As an alternative embodiment, the touch screen is further configured to:

[0104] Respond to a parameter configuration modification instruction input by the user's touch, generate a second Ethernet physical signal corresponding to the parameter configuration modification instruction, and transmit the second Ethernet physical signal to the communication module 20;

[0105] The communication module 20 is further configured to convert the second Ethernet physical signal into a corresponding digital signal, and transmit the digital signal to the controller 10;

[0106] The controller 10 is configured to respond to the digital signal and modify the parameters indicated by the parameter configuration modification instruction.

[0107] In this embodiment, the communication module 20 is used to implement data communication between the controller 10 and the touch screen. An operator can input the above parameter configuration modification instruction by performing a touch operation on the touch screen, etc., and generate a corresponding second Ethernet physical signal. The above parameter configuration modification instruction can be used to indicate a configuration change for at least one of the temperature power-off threshold, temperature alarm threshold, smoke power-off threshold, smoke alarm threshold, first duration, and second duration set in the controller 10.

[0108] After receiving the second Ethernet physical signal provided by the touch screen, the communication module 20 performs data conversion on the second Ethernet physical signal and then transmits it to the controller 10. The controller 10 adjusts the configuration of the corresponding parameters according to the received digital signal, so as to realize the flexible configuration modification of the parameters by the operator.

[0109] As an alternative embodiment, as Figure 4 shown, the communication module 20 is further configured to be electrically connected to the host computer;

[0110] The controller 10 is further configured to generate an alarm message when transmitting the first control signal to the alarm, and transmit the alarm message to the communication module 20;

[0111] The communication module 20 is further configured to perform data conversion on the alarm message and then transmit it to the host computer, so that the host computer records a log based on the alarm message.

[0112] Specifically, the communication module 20 can also be electrically connected to the host computer, which is used to realize data communication between the host computer and the controller 10. The host computer is, for example, a personal computer (PC), an embedded system, or a server, etc.

[0113] In order to meet the needs of relevant personnel for later query and problem analysis, etc., when the controller 10 transmits the first control signal to the alarm, it will generate a corresponding alarm message and transmit it to the host computer through the communication module 20. The host computer records a log according to the alarm message after data conversion by the communication module 20. Among them, the alarm message may include the smoke value and temperature value collected by the controller 10.

[0114] In this embodiment, the controller 10 realizes real-time monitoring of the environmental temperature and smoke of the semiconductor device. When the smoke or temperature in the environment meets the alarm condition, the controller 10 generates a corresponding alarm message according to the smoke value and temperature value, and the host computer generates a log. The operator can trace and view the operation status of the device by downloading the log on the host computer.

[0115] It should be added that after the controller 10 transmits the alarm information to the host computer through the communication module 20, the host computer can also throw an exception alarm message. Also, since power-off may occur when the smoke value or temperature value exceeds the power-off threshold, which may affect the normal communication with the host computer, the above-mentioned controller 10 can also throw the alarm information to the host computer only when the temperature value exceeds the temperature alarm threshold and does not exceed the temperature power-off threshold.

[0116] As an optional embodiment, the foregoing first control signal includes a first type of control sub-signal or a second type of control sub-signal, and the alarm includes an alarm light;

[0117] The controller is configured to:

[0118] When the temperature value exceeds the temperature alarm threshold, transmit a first type of control sub-signal to the alarm light so that the alarm light displays a light of a first color;

[0119] When the smoke value exceeds the smoke power-off threshold, transmit a second type of control sub-signal to the alarm light so that the alarm light displays a light of a second color.

[0120] In this embodiment, when the alarm includes an alarm light, when alarming for temperature abnormality and smoke abnormality, the alarm lights corresponding to different colors can also be set to light and flash respectively, so that relevant personnel can more intuitively understand the abnormal situation at the equipment site and facilitate positioning the source of the abnormality.

[0121] Exemplarily, when the temperature value exceeds the temperature alarm threshold, that is, when temperature abnormality requires an alarm, by transmitting a first type of control sub-signal to the alarm light, the alarm light flashes a yellow light. When the smoke value exceeds the smoke power-off threshold, that is, when smoke abnormality requires an alarm, by transmitting a second type of control sub-signal to the alarm light, the alarm light flashes a red light.

[0122] It should be added that when both the temperature value and the smoke value are abnormally alarmed, the controller 10 can also alternately send a first type of control sub-signal and a second type of control sub-signal to the alarm light so that the alarm light alternately flashes red and yellow lights, which is not strictly limited here.

[0123] Based on the smoke temperature protection device provided in the above embodiment, due to the same inventive concept, the present application also provides a smoke temperature protection system corresponding to the above smoke temperature protection device. The following is through Figure 5 A detailed introduction to the smoke temperature protection system.

[0124] Figure 5 Fig. shows a schematic structural diagram of a smoke temperature protection system provided by an embodiment of the present application. Figure 5The smoke temperature protection system 1000 shown includes: a smoke sensor 30, a temperature sensor 40, an alarm 50, an emergency stop device 60, and the smoke temperature protection device 100 as described in any of the above embodiments.

[0125] In a smoke temperature protection system 1000 of an embodiment of the present application, considering the different physical properties of the smoke sensor 30 and the temperature sensor 40, the smoke sensor 30 is more sensitive and reacts more quickly than the temperature sensor 40, and is more prone to malfunctions caused by volatile gases, etc. Therefore, by performing dual detection of the smoke and temperature of the semiconductor device at the same time, the controller 10, when detecting that the smoke value is within the preset value range, turns to the temperature value to make a reliable judgment on the current situation, so as to make accurate logical judgments and corresponding processing, thereby fully avoiding malfunctions caused by the physical properties of the smoke sensor 30 in some scenarios, and achieving accurate alarm and safety protection of on-site fires.

[0126] In addition, the controller 10 in the smoke temperature protection device 100 is connected to the alarm 50 and the emergency stop device 60. When an unexpected situation such as a fire occurs, the controller 10 can quickly alarm or even achieve power-off protection of the equipment by transmitting a control signal under abnormal circumstances. Therefore, the smoke temperature alarm device can quickly and effectively reduce the risk of fire and prevent the fire from further expanding.

[0127] In addition, since the embodiment of the present application specifically uses a temperature sensor 40 and a smoke sensor 30 to realize the collection of temperature values ​​and smoke values, and sensors such as the temperature sensor 40 and the smoke sensor 30 are usually small in size and can be flexibly set at different positions of the semiconductor electrical cabinet, it is convenient to detect key modules at different positions in the electrical cabinet.

[0128] In general, a smoke temperature protection system 1000 according to an embodiment of the present application can effectively monitor the temperature environment and smoke environment of the operating status of semiconductor equipment, and can take measures such as intelligent alarm and automatic power-off protection under abnormal circumstances, thereby achieving early fault prediction, thereby effectively avoiding semiconductor equipment failures and reducing the risk of personal injury and economic losses.

[0129] As an optional embodiment, Figure 6 As shown, the smoke temperature protection system 1000 further includes a touch screen 70; the smoke temperature protection device 100 further includes a communication module 20, and the communication module 20 is electrically connected to the controller 10 and the touch screen 70 respectively;

[0130] The communication module 20 is configured to receive the smoke value and the temperature value sent by the controller 10, convert the smoke value and the temperature value into corresponding first Ethernet physical signals, and transmit the first Ethernet physical signals to the touch screen 70;

[0131] The touch screen 70 is configured to receive the first Ethernet physical signal and display the smoke value and the temperature value based on the first Ethernet physical signal.

[0132] The communication module 20 can be integrated with the aforementioned controller 10 on the same PCB circuit board, and the PCB circuit board can be understood as the smoke and temperature protection device 100 in this application. The communication module 20 is used to support data communication between the controller 10 and the touch screen 70. After receiving the smoke value and the temperature value, the controller 10 transmits the values to the touch screen 70 through the communication module 20, and the touch screen 70 can be specifically arranged on the semiconductor device.

[0133] The aforementioned touch screen 70 is pre-configured with a UI interface, and subsequently, the visualization and intuitive display of the smoke value and the temperature value can be performed according to the data transmitted by the communication module 20. In this way, it helps the operator to view the current environmental monitoring situation in a timely manner.

[0134] As an optional embodiment, the touch screen 70 is further configured to:

[0135] In response to a parameter configuration modification instruction input by a user's touch operation, generate a second Ethernet physical signal corresponding to the parameter configuration modification instruction, and transmit the second Ethernet physical signal to the communication module 20;

[0136] The communication module 20 is further configured to convert the second Ethernet physical signal into a corresponding digital signal and transmit the digital signal to the controller 10;

[0137] The controller 10 is configured to, in response to the digital signal, perform configuration modification on the parameters indicated by the parameter configuration modification instruction.

[0138] In this embodiment, the operator inputs the above parameter configuration modification instruction by performing a touch operation on the touch screen 70 and generates a corresponding second Ethernet physical signal. After receiving the second Ethernet physical signal provided by the touch screen, the communication module 20 performs data conversion and then transmits it to the controller 10. In this way, the controller 10 adjusts the corresponding parameters according to the received digital signal, so as to realize the flexible configuration modification of the parameters by the operator.

[0139] As an optional embodiment, the smoke and temperature protection system 1000 further includes a host computer 80, and the host computer 80 is electrically connected to the communication module 20;

[0140] The controller 10 is further configured to generate an alarm message when transmitting the first control signal to the alarm 50, and transmit the alarm message to the communication module 20;

[0141] The communication module 20 is further configured to perform data conversion on the alarm message and then transmit it to the host computer 80;

[0142] The host computer 80 is configured to record logs based on the alarm information.

[0143] In order to meet the needs of relevant personnel for later query and problem analysis, etc., when the controller 10 transmits the first control signal to the alarm, it will generate corresponding alarm information and transmit it to the host computer through the communication module 20. The host computer records logs according to the alarm information after data conversion by the communication module 20. Among them, the alarm information may include the smoke value and temperature value collected by the controller 10.

[0144] In this embodiment, the controller 10 is used to realize the real-time monitoring of the environmental temperature and smoke of the semiconductor device. When the smoke or temperature in the environment where the semiconductor device is located meets the alarm conditions, the controller 10 generates corresponding alarm information according to the smoke value and temperature value, and transmits the alarm information to the host computer 80 through the communication module 20.

[0145] The host computer 80 records logs for the alarm information. The operator can later trace and view the operation status of the device by downloading the logs on the host computer 80, thus fully meeting the needs of relevant personnel for later query and problem analysis, etc.

[0146] For the same inventive concept, the embodiment of the present application also provides a smoke and temperature protection method corresponding to the smoke and temperature protection device described in the foregoing embodiment. For details, please refer to Figure 7 , Figure 7 shows a schematic flowchart of the smoke and temperature protection method provided by an embodiment of the present application. As Figure 7 shown, the smoke and temperature protection method includes the following steps:

[0147] S701, obtain the temperature value and smoke value of the semiconductor device;

[0148] S702, detect whether the received smoke value is within a preset numerical range;

[0149] S703, when it is detected that the smoke value is within the preset numerical range, perform a target operation according to the temperature value; wherein, when the temperature value is abnormal, the target operation is: transmit a first control signal to the alarm to make the alarm give an alarm, and / or transmit a second control signal to the emergency stop device to make the emergency stop device cut off the power supply of the semiconductor device.

[0150] A smoke temperature protection method provided by an embodiment of the present application performs dual detection on the smoke and temperature of a semiconductor device simultaneously. When the detected smoke value is within a preset numerical range, it then makes a reliable judgment on the current situation based on the temperature value, so as to perform accurate logical judgment and corresponding processing, thereby being able to fully avoid misoperations caused by the physical characteristics of the smoke sensor in some scenarios, and realizing accurate alarm and safety protection for on-site fires. Moreover, this smoke temperature protection method controls the alarm and the emergency stop device. When an accident such as a fire occurs, it can quickly give an alarm and even implement power-off protection for the device by transmitting control signals in abnormal situations. Therefore, it can quickly and effectively reduce the danger of fire and also prevent the fire from spreading further.

[0151] Overall, a smoke temperature protection method of an embodiment of the present application can effectively realize the monitoring function of the temperature environment and the smoke environment of the operating state of a semiconductor device, and can take means such as intelligent alarm and automatic power-off protection in abnormal situations. In this way, early fault prediction can be realized, thereby effectively avoiding semiconductor device failures and reducing the risks of personal injury and economic losses.

[0152] It should be noted that considering that the specific implementation processes of S701 - S703 have been described in detail above, for the sake of brevity, the present application will not repeat them here. Specifically, reference can be made to the specific descriptions of the smoke temperature protection device or the smoke temperature protection system in the above embodiments.

[0153] As an optional embodiment, when the detected smoke value is within a preset numerical range, performing a target operation according to the temperature value includes:

[0154] When the detected smoke value exceeds the smoke alarm threshold and does not exceed the smoke power-off threshold, performing a target operation according to the temperature value;

[0155] Among them, the smoke alarm threshold is lower than the smoke power-off threshold.

[0156] When the detected smoke value exceeds the smoke alarm threshold and does not exceed the smoke power-off threshold, waiting to obtain the temperature value of the semiconductor device, and then performing relevant actions according to the obtained temperature value.

[0157] In this embodiment, when the detected smoke value exceeds the smoke alarm threshold and does not exceed the smoke power-off threshold, by obtaining the temperature value to perform dual detection from both aspects of smoke and temperature, it can avoid misoperations caused by the occurrence of volatile gases, etc., which is beneficial to maintaining the normal operation of the semiconductor device.

[0158] As an optional embodiment, the method further includes:

[0159] When the detected smoke value exceeds the smoke power-off threshold, a first control signal is transmitted to the alarm, and a second control signal is transmitted to the emergency stop device.

[0160] Specifically, after receiving the smoke value, if it is detected that the smoke value exceeds the smoke power-off threshold, a second control signal is transmitted to the emergency stop device, causing the emergency stop device to operate to cut off the power supply of the semiconductor device, so that the fault can be removed in time and the risk of damage to the semiconductor device can be effectively reduced. At the same time, a first control signal is transmitted to the alarm, causing the alarm to give an alarm prompt sound or picture, etc., to remind relevant personnel to quickly check and solve the fire hazard, further improving the protection safety. If it is detected that the smoke value does not exceed the smoke alarm threshold, the device can continue to operate normally.

[0161] As an optional embodiment, in the case of abnormal temperature value, perform target operations according to the temperature value, including:

[0162] When it is detected that the temperature value exceeds the temperature alarm threshold and does not exceed the temperature power-off threshold, a first control signal is transmitted to the alarm;

[0163] When it is detected that the temperature value exceeds the temperature power-off threshold, a first control signal is transmitted to the alarm, and a second control signal is transmitted to the emergency stop device;

[0164] Wherein, the temperature power-off threshold is higher than the temperature alarm threshold.

[0165] Specifically, after receiving the temperature value, the temperature value is detected. If it is detected that the temperature value reaches the temperature power-off threshold, a second control signal is transmitted to the emergency stop device, and a first control signal is transmitted to the alarm, so that the emergency stop device can cut off the power supply of the semiconductor device in time, and the relevant personnel can be given an alarm prompt through the alarm.

[0166] If it is detected that the temperature value reaches the temperature alarm threshold but does not reach the temperature power-off threshold, a first control signal is transmitted to the alarm to prompt relevant personnel to check the temperature abnormality through the alarm. If it is detected that the smoke value does not exceed the smoke alarm threshold, the device can continue to operate normally.

[0167] In this embodiment, for different abnormal degrees of the temperature value of the semiconductor device, by differentiating and setting different control signals to be transmitted, the semiconductor device in different temperature environments is monitored and processed differently, which can reasonably ensure the stable operation of the semiconductor device and fire prevention.

[0168] As an optional embodiment, it includes:

[0169] When it is detected that the smoke value exceeds the smoke power-off threshold, the first continuous duration during which the smoke value exceeds the smoke power-off threshold is timed, and when the first continuous duration reaches the preset delay time, a second control signal is transmitted to the emergency stop device;

[0170] and / or,

[0171] When it is detected that the temperature value exceeds the temperature power-off threshold, the second continuous duration during which the temperature value exceeds the temperature power-off threshold is timed, and when the second continuous duration reaches the preset delay time, a second control signal is transmitted to the emergency stop device;

[0172] Wherein, the preset delay time does not exceed the specified upper limit of the delay time.

[0173] Specifically, when it is detected that the smoke value exceeds the smoke power-off threshold, and / or when it is detected that the temperature value exceeds the temperature power-off threshold, a second control signal needs to be transmitted to the emergency stop device so that the emergency stop device operates to cut off the power supply of the equipment.

[0174] In this embodiment, considering the situation where someone makes the current ambient temperature higher than the temperature power-off threshold for a short time, or someone makes the current ambient temperature higher than the temperature power-off threshold for a short time, therefore, in order to avoid mis-triggering of the power-off operation, the above-mentioned first continuous duration and second continuous duration are further set to send delay signals, which is equivalent to being able to perform a delay wait before executing the cut-off operation.

[0175] In this way, by setting the above delay, a certain operation and environment recovery time can be reserved for relevant personnel, avoiding interference to on-site testing and other situations caused by directly executing the power-off operation, and at the same time, it is also beneficial to avoid mis-triggering and improve the reliability of power-off.

[0176] To facilitate understanding of the smoke temperature protection method provided in the above embodiment, the above method will be described below with a specific scenario embodiment. Figure 8 It is a schematic flowchart of a scenario embodiment of the smoke temperature protection method provided in an embodiment of the present application.

[0177] The application scenario of this scenario embodiment can be: a smoke sensor and a temperature sensor are set on a semiconductor device to timely monitor the temperature and smoke in the environment where the semiconductor device is located.

[0178] In this scenario embodiment, a smoke power-off threshold, a smoke alarm threshold, a temperature power-off threshold, and a temperature alarm threshold are preset. Among them, the smoke power-off threshold is higher than the smoke alarm threshold, and the temperature power-off threshold is higher than the temperature alarm threshold.

[0179] As Figure 8 shown, this scenario embodiment may specifically include the following steps:

[0180] S801, obtain the smoke value of the semiconductor device. In this embodiment, a smoke sensor can be pre-set on the semiconductor device to collect the smoke concentration information in the environment where the device is located.

[0181] S802, detect whether the smoke value exceeds the smoke power-off threshold. If so, execute S803.

[0182] S803, transmit a first control signal to the alarm and a second control signal to the emergency stop device to give an alarm and cut off the power of the device. When the smoke value exceeds the smoke power-off threshold, a second control signal is transmitted to the emergency stop device to make the emergency stop device work to cut off the power supply of the semiconductor device, so that the fault can be removed in time and the risk of damage to the semiconductor device can be effectively reduced.

[0183] At the same time, a first control signal is transmitted to the alarm to make the alarm give an alarm prompt sound or picture, etc., to remind relevant personnel to quickly check and solve the fire hazard, further improving the protection safety.

[0184] It should be added that in order to avoid the mis-triggering of the power-off operation, a signal transmission delay is set before transmitting the second control signal to the emergency stop device, which is equivalent to being able to perform a delay waiting before executing the power-off operation, thus helping to improve the reliability of the power-off operation.

[0185] S804, detect whether the smoke value exceeds the smoke alarm threshold and does not exceed the smoke power-off threshold, which is equivalent to detecting whether the smoke value is within the preset numerical range. If so, jump to S805.

[0186] It should be added that if the smoke value neither exceeds the above-mentioned smoke power-off threshold nor exceeds the above-mentioned smoke alarm threshold, the normal operation of the semiconductor device is continued.

[0187] S805, obtain the temperature value of the semiconductor device. In this embodiment, a temperature sensor can be pre-set on the semiconductor device to collect the temperature concentration information in the environment where the device is located.

[0188] In this step, considering that the physical characteristics of the temperature sensor and the smoke sensor are different, the smoke sensor is more sensitive and responds more quickly than the temperature sensor, and is prone to misoperation caused by volatile gases, etc. Therefore, wait for the temperature value feedback by the slower-responsive temperature sensor, and then perform relevant actions according to the temperature value feedback by the temperature sensor.

[0189] S806, detect whether the temperature value exceeds the temperature power-off threshold. If so, jump to execute S803. In this way, by transmitting the second control signal to the emergency stop device and transmitting the first control signal to the alarm, the emergency stop device can cut off the power supply of the semiconductor device in time, and the relevant personnel can be alarmed through the alarm.

[0190] S807, detect whether the temperature value exceeds the temperature alarm threshold and does not exceed the temperature power-off threshold. If so, proceed to execute S808 below.

[0191] S808, transmit the first control signal to the alarm to make the alarm sound. In this step, if it is detected that the temperature value reaches the temperature alarm threshold but does not reach the temperature power-off threshold, the first control signal is transmitted to the alarm to prompt the relevant personnel to check for temperature anomalies through the alarm.

[0192] It should be added that if the temperature value neither exceeds the above temperature power-off threshold nor exceeds the above temperature alarm threshold, the normal operation of the semiconductor device is continued.

[0193] Based on the smoke temperature protection method provided in the above embodiments, for the same inventive concept, the present application also provides a smoke temperature protection device corresponding to the above smoke temperature protection method. Next, through Figure 9 a detailed introduction to the smoke temperature protection device will be given.

[0194] Next, please refer to Figure 9 , Figure 9 which is a schematic structural diagram of a smoke temperature protection device provided in an embodiment of the present application.

[0195] The smoke temperature protection device may include a processor 901 and a memory 902 storing computer program instructions.

[0196] Specifically, the above processor 901 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application.

[0197] Memory 902 may include a mass memory for data or instructions. By way of example and not limitation, memory 902 may include a hard disk drive (HDD), a floppy disk drive, flash memory, an optical disc, a magneto-optical disc, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. In a suitable case, memory 902 may include removable or non-removable (or fixed) media. In a suitable case, memory 902 may be inside or outside the integrated gateway disaster recovery device. In a particular embodiment, memory 902 is non-volatile solid-state memory.

[0198] The memory may include a read-only memory (ROM), a random access memory (RAM), a magnetic disk storage media device, an optical storage media device, a flash memory device, an electrical, optical, or other physical / tangible memory storage device. Thus, generally, the memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described with reference to the method according to one aspect of the present disclosure.

[0199] The processor 901 reads and executes the computer program instructions stored in the memory 902 to implement any one of the smoke temperature protection methods in the above embodiments.

[0200] In one example, the data smoke temperature protection device may further include a communication interface 903 and a bus 910. Among them, as Figure 9 shown, the processor 901, the memory 902, and the communication interface 903 are connected through the bus 910 and complete communication with each other.

[0201] The communication interface 903 is mainly used to implement communication between the various modules, devices, units, and / or devices in the embodiments of the present application.

[0202] Bus 910 includes hardware, software, or both, and couples components of the smoke temperature protection device to each other. By way of example and not limitation, the bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), a HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an InfiniBand interconnect, a Low Pin Count (LPC) bus, a memory bus, a MicroChannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable bus or a combination of two or more of these. Where appropriate, bus 910 may include one or more buses. Although embodiments of the present application describe and illustrate specific buses, the present application contemplates any suitable bus or interconnect.

[0203] The smoke temperature protection device executes the smoke temperature protection method in the embodiments of the present application, thereby implementing the smoke temperature protection method described in the embodiments of the present application. Additionally, in combination with the smoke temperature protection method in the above embodiments, embodiments of the present application may provide a computer storage medium for implementation. Computer program instructions are stored on the computer storage medium; when the computer program instructions are executed by a processor, any one of the smoke temperature protection methods in the above embodiments is implemented.

[0204] Based on the smoke temperature protection method in the above embodiments, embodiments of the present application provide a computer program product. When the instructions in the computer program product are executed by a processor of an electronic device, the electronic device is caused to execute the smoke temperature protection method provided in any one of the above embodiments of the present application.

[0205] It should be clear that the present application is not limited to the specific configurations and processes described above and illustrated in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and illustrated as examples. However, the method process of the present application is not limited to the specific steps described and illustrated, and those skilled in the art can make various changes, modifications, and additions, or change the order between steps after understanding the spirit of the present application.

[0206] The functional blocks shown in the above-described structural block diagrams can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application-specific integrated circuit (ASIC), appropriate firmware, a plug-in, a functional card, and so on. When implemented in software, the elements of the present application are programs or code segments used to perform the required tasks. The program or code segment can be stored in a machine-readable medium or transmitted over a transmission medium or communication link via a data signal carried in a carrier wave. A "machine-readable medium" can include any medium that can store or transmit information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, fiber optic media, radio frequency (RF) links, and so on. The code segment can be downloaded via a computer network such as the Internet, an intranet, and so on.

[0207] It should also be noted that the exemplary embodiments mentioned in the present application describe some methods or systems based on a series of steps or devices. However, the present application is not limited to the order of the above steps, that is, the steps can be executed in the order mentioned in the embodiments, or different from the order in the embodiments, or several steps can be executed simultaneously.

[0208] Aspects of the present disclosure have been described above with reference to the flowcharts and / or block diagrams of methods, apparatuses (systems), and computer program products according to embodiments of the present disclosure. It should be understood that each block in the flowcharts and / or block diagrams, and the combinations of blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device to produce a machine such that the instructions executed by the processor of the computer or other programmable data processing device enable the implementation of the functions / actions specified in one or more blocks of the flowchart and / or block diagram. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field-programmable logic circuit. It should also be understood that each block in the block diagram and / or flowchart, and the combinations of blocks in the block diagram and / or flowchart, can also be implemented by dedicated hardware that performs the specified functions or actions, or by a combination of dedicated hardware and computer instructions.

[0209] The above are only specific embodiments of the present application. Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules, and units described above can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated herein. It should be understood that the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present application.

Claims

1. A smoke temperature protection device, characterized in that: The smoke temperature protection device comprises a controller, which is electrically connected to a temperature sensor, a smoke sensor, an alarm and an emergency stop device respectively; the temperature sensor is configured to collect a temperature value of a semiconductor device and transmit the temperature value to the controller; The smoke sensor is configured to collect a smoke value of the semiconductor device and transmit the smoke value to the controller; The controller is configured to: detect whether the received smoke value is within a preset value range, and if it is detected that the smoke value is within the preset value range, perform a target operation according to the temperature value; Wherein, when the temperature value is abnormal, the target operation is: transmitting a first control signal to the alarm so that the alarm sounds an alarm, and / or transmitting a second control signal to the emergency stop device so that the emergency stop device cuts off power to the semiconductor device.

2. The smoke temperature protection device according to claim 1, characterized in that: When the smoke value is detected to be within the preset value range, performing a target operation according to the temperature value includes: When it is detected that the smoke value exceeds the smoke alarm threshold and does not exceed the smoke power-off threshold, performing the target operation according to the temperature value; Wherein, the smoke alarm threshold is lower than the smoke power-off threshold.

3. The smoke temperature protection device according to claim 2, characterized in that: The controller is also configured to: When it is detected that the smoke value exceeds the smoke power-off threshold, the first control signal is transmitted to the alarm, and the second control signal is transmitted to the emergency stop device.

4. The smoke temperature protection device according to claim 3, characterized in that: In the case where the temperature value is abnormal, performing a target operation according to the temperature value includes: When it is detected that the temperature value exceeds the temperature alarm threshold and does not exceed the temperature power-off threshold, transmitting the first control signal to the alarm; When it is detected that the temperature value exceeds the temperature power-off threshold, a first control signal is transmitted to the alarm, and a second control signal is transmitted to the emergency stop device; Wherein, the temperature power-off threshold is higher than the temperature alarm threshold.

5. The smoke temperature protection device according to any one of claims 1 to 4, characterized in that: The controller is also configured to: When it is detected that the smoke value exceeds the smoke power-off threshold, timing a first duration that the smoke value exceeds the smoke power-off threshold, and transmitting the second control signal to the emergency stop device when the first duration reaches a preset delay time; and / or, When it is detected that the temperature value exceeds the temperature power-off threshold, timing the second duration of the temperature value exceeding the temperature power-off threshold, and transmitting the second control signal to the emergency stop device when the second duration reaches the preset delay time; Wherein, the preset delay time does not exceed a prescribed upper limit of the delay time.

6. The smoke temperature protection device according to claim 1, characterized in that: The smoke temperature protection device further comprises a communication module, wherein the communication module is electrically connected to the controller and the touch screen respectively; The communication module is configured to receive the smoke value and the temperature value sent by the controller, convert the smoke value and the temperature value into corresponding first Ethernet physical signals, and transmit the first Ethernet physical signal to the touch screen; The touch screen is configured to receive the first Ethernet physical signal and display the smoke value and the temperature value based on the first Ethernet physical signal.

7. The smoke temperature protection device according to claim 6, characterized in that: The touch screen is also configured as: In response to a parameter configuration modification instruction input by a user touch control, generating a second Ethernet physical signal corresponding to the parameter configuration modification instruction, and transmitting the second Ethernet physical signal to the communication module; The communication module is further configured to convert the second Ethernet physical signal into a corresponding digital signal and transmit the digital signal to the controller; The controller is configured to modify the configuration of the parameter indicated by the parameter configuration modification instruction in response to the digital signal.

8. The smoke temperature protection device according to claim 6, characterized in that: The communication module is also configured to be electrically connected to a host computer; The controller is further configured to generate alarm information when transmitting the first control signal to the alarm device, and transmit the alarm information to the communication module; The communication module is further configured to perform data conversion on the alarm information and transmit the converted information to the host computer, so that the host computer can perform log recording based on the alarm information.

9. The smoke temperature protection device according to claim 1, characterized in that: The first control signal includes a first-type control sub-signal or a second-type control sub-signal, and the alarm includes an alarm light; The controller is configured to: When the temperature value exceeds the temperature alarm threshold, transmitting the first type of control sub-signal to the alarm light so that the alarm light displays a light of a first color; When the smoke value exceeds the smoke power-off threshold, the second type of control sub-signal is transmitted to the warning light, so that the warning light displays a light of a second color.

10. A smoke temperature protection system, characterized in that: The smoke temperature protection system comprises: an alarm, a temperature sensor, a smoke sensor, an emergency stop device and the smoke temperature protection device according to any one of claims 1 to 9.

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