Supporting module, display assembly and electronic equipment

Abstract

The invention provides a supporting module, a display assembly and electronic equipment. The supporting module comprises a supporting plate, a first bonding layer, a base material layer and a second bonding layer, the supporting plate is provided with a bendable hollow area and flat areas connected with the two opposite sides of the hollow area respectively. The first bonding layer and the supporting plate are stacked, and the orthographic projection of the first bonding layer on the supporting plate at least covers the flat area; the base material layer is located on the side, away from the supporting plate, of the first bonding layer, and the orthographic projection of the base material layer on the supporting plate covers the hollowed-out area and covers partial areas, located on the two opposite sides of the hollowed-out area, of the flat area. The second bonding layer is arranged on the side, away from the supporting plate, of the base material layer, and the orthographic projection of the second bonding layer on the supporting plate is located within the coverage range of the orthographic projection of the base material layer on the supporting plate. Through the arrangement, the weight and the thickness of the supporting module can be reduced by utilizing the local design of the base material layer and the second bonding layer, so that the light and thin design of the display assembly is facilitated.

Description

Technical Field

[0001] The present application relates to the technical field of electronic devices, and specifically to a supporting module, a display component and an electronic device. Background Art

[0002] With the continuous development of electronic devices, more and more people are beginning to use electronic devices for socializing, entertainment or work, and people's requirements for electronic devices are getting higher and higher. Taking mobile phones as an example, some manufacturers have launched folding mobile phones equipped with flexible screens. By utilizing the bendability of the flexible screen to realize the opening and closing of the folding mobile phone, the folding mobile phone can have a larger display area after unfolding to meet the user's usage needs. At present, in order to ensure the flatness of the flexible screen after unfolding, most flexible screens are generally provided with a support module for supporting the flexible panel, so as to support the flexible panel with the support module. However, the overall thickness and weight of the existing support module are relatively large, which is not conducive to the lightweight design of the flexible screen. Summary of the invention

[0003] On the one hand, the present application provides a support module, which includes: a support plate, a first adhesive layer, a substrate layer and a second adhesive layer; the support plate has a bendable hollow area, and flat areas respectively connected to the opposite sides of the hollow area; the first adhesive layer and the support plate are stacked, and the orthographic projection of the first adhesive layer on the support plate at least covers the flat area; the substrate layer is located on the side of the first adhesive layer away from the support plate, and the orthographic projection of the substrate layer on the support plate covers the hollow area, and covers partial areas of the flat area located on opposite sides of the hollow area; the second adhesive layer is arranged on the side of the substrate layer away from the support plate, and the orthographic projection of the second adhesive layer on the support plate is within the coverage range of the orthographic projection of the substrate layer on the support plate.

[0004] On the one hand, the present application also provides a display component, which includes: a display module and the above-mentioned support module; the display module is arranged on the side of the second adhesive layer away from the substrate layer, and is respectively adhered to the first adhesive layer and the second adhesive layer, and the display module is configured to be able to be bent along the hollow area.

[0005] On the other hand, the present application further provides an electronic device, which includes: a shell assembly and the above-mentioned display assembly; wherein the display assembly is arranged on the shell assembly and is jointly surrounded by the shell assembly to form a receiving space.

[0006] The support module provided by this application is configured such that the orthographic projection of the base material layer on the support plate covers the hollow area and part of the flat area of the support plate. This enables the base material layer not only to block the hollow area of the support plate but also to be fixed by bonding to the flat area of the support plate through the first adhesive layer. Meanwhile, by providing a second adhesive layer on the side of the base material layer facing away from the hollow area, and ensuring that the orthographic projection of the second adhesive layer on the support plate is also within the coverage of the orthographic projection of the base material layer on the support plate, the orthographic projections of the stacked base material layer and the second adhesive layer on the support plate can cover only the hollow area and part of the flat area of the support plate. Compared with the solution where the base material layer and the second adhesive layer completely cover the hollow area and the flat area, the volume of the base material layer and the second adhesive layer can be reduced, thereby reducing the weight of the support module. Additionally, since the volume of the base material layer is reduced, its structural strength will also weaken, and the rebound force generated when the base material layer bends along with the hollow area of the support plate will also decrease. The reduction in the rebound force can lower the adhesive strength required for the second adhesive layer to bond the base material layer and the external structure, allowing the thickness of the second adhesive layer to be thinned. Through the above arrangements, the thickness and weight of the support module can be reduced, and when the support module is used to support the display module of the display component, it is beneficial for the thin and light design of the display component. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] To more clearly illustrate the technical solutions in the embodiments of this application, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of this application, and those of ordinary skill in the art can also obtain other drawings based on these drawings without creative efforts.

[0008] Figure 1 is a schematic structural diagram of the electronic device 10 provided by the embodiment of this application;

[0009] Figure 2 is Figure 1 the exploded structural diagram of the electronic device 10 therein;

[0010] Figure 3 is Figure 2 the stacked structural diagram of the display component 200 therein;

[0011] Figure 4 is Figure 3 the stacked structural diagram of the support module 220 therein;

[0012] Figure 5 is Figure 4 the structural diagram of the support plate 221 therein;

[0013] Figure 6 is Figure 4 the top view of the support module 220 therein. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0014] As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, a device configured to receive / transmit communication signals via a wired connection (such as via a Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), digital cable, direct cable connection, and / or another data connection / network) and / or via a wireless interface (such as for a cellular network, Wireless Local Area Network (WLAN), digital television network such as a DVB-H network, satellite network, AM-FM broadcast transmitter, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; Personal Communication System (PCS) terminals that may combine cellular radiotelephone with data processing, facsimile, and data communication capabilities; PDAs that may include a radiotelephone, pager, Internet / intranet access, web browser, notepad, calendar, and / or Global Positioning System (GPS) receiver; and conventional laptop and / or palmtop receivers or other electronic devices including a radiotelephone transceiver. A mobile phone is an electronic device configured with a cellular communication module.

[0015] The present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be specifically noted that the following embodiments are only used to illustrate the present application, but do not limit the scope of the present application. Similarly, the following embodiments are only partial embodiments of the present application rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0016] Reference to "embodiments" in the present application means that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0017] Please refer to Figures 1 to 2 , Figure 1 which is a schematic structural diagram of an electronic device 10 provided by an embodiment of the present application, Figure 2 and Figure 1 is an exploded structural diagram of the electronic device 10 in

[0018] The electronic device 10 provided by the embodiment of the present application may be a foldable mobile phone, a foldable tablet computer, a foldable personal digital assistant, a foldable e-book reader, etc. Hereinafter, only the electronic device 10 being a foldable mobile phone will be used as an example for illustration. AsFigures 1 to 2 As shown in the figure, the electronic device 10 may include: a housing assembly 100 and a display assembly 200. Among them, the housing assembly 100 may be connected to the display assembly 200 and can jointly enclose a receiving space with the display assembly 200 to install various functional components required for the electronic device 10, such as a battery, a camera, a speaker, a microphone, and a fingerprint recognition module, etc. At the same time, the housing assembly 100 and the display assembly 200 can also be folded along the axis Y to achieve the folding function of the electronic device 10, and the axis Y may be the symmetric folding line of the housing assembly 100 and the display assembly 200. That is, both the housing assembly 100 and the display assembly 200 can be divided into two symmetrically divided area parts by the axis Y. In this embodiment, the display assembly 200 may have the advantages of being thin and light in weight, which is beneficial to realizing the overall thin and light design of the electronic device 10.

[0019] Optionally, the axis Y may also be an asymmetric folding line. That is, the two area parts of the housing assembly 100 and the display assembly 200 divided by the axis Y may be asymmetrically arranged. In addition, the axis Y can not only be placed longitudinally as shown in Figure 1 the figure, so that the electronic device 10 can be folded left and right based on the axis Y, but also can be placed horizontally, so that the electronic device 10 can be folded up and down based on the axis Y.

[0020] Exemplarily, the housing assembly 100 can be used to carry the display assembly 200 and install various functional components required for the electronic device 10. As Figure 2 shown in the figure, the housing assembly 100 may include: a middle frame 110 and a rear cover 120. Among them, the display assembly 200 covers one side of the middle frame 110, and the rear cover 120 covers the other side of the middle frame 110, and the three can jointly enclose the aforementioned receiving space to accommodate the functional components required for the aforementioned electronic device 10. At the same time, the materials of the middle frame 110 and the rear cover 120 can be glass, metal or hard plastic, etc., so that the middle frame 110 and the rear cover 120 have a certain structural strength and can support the functional components in the receiving space, and the middle frame 110 and the rear cover 120 can be made of the same material or different materials. In addition, considering that the middle frame 110 and the rear cover 120 are generally directly exposed to the external environment, a functional material for wear resistance, corrosion resistance and scratch resistance is also coated on the outer surfaces of the middle frame 110 and the rear cover 120 (that is, the outer surface of the electronic device 10).

[0021] Further, the middle frame 110 can also be divided along the axis Y into a first middle frame 111 and a second middle frame 112, and the first middle frame 111 and the second middle frame 112 can be rotatably connected (such as through a rotating shaft assembly 300), so that the first middle frame 111 and the second middle frame 112 can be folded along the axis Y. Similarly, the rear cover 120 can also be divided along the axis Y into a first rear cover 121 and a second rear cover 122, and the first rear cover 121 and the second rear cover 122 can be respectively covered on the first middle frame 111 and the second middle frame 112, and can be folded along the axis Y with the first middle frame 111 and the second middle frame 112. In addition, the first rear cover 121 and the second rear cover 122 can also be connected by a flexible material, such as leather, etc., and the flexible material can play a role in covering the gap between the first rear cover 121 and the second rear cover 122, and meet the folding requirements of the first rear cover 121 and the second rear cover 122, so as to improve the sealing performance of the electronic device 10. It can be understood that the foregoing housing assembly 100 is only an exemplary illustration, and the specific structure of the housing assembly 100 can also be adaptively adjusted according to design requirements, as long as the housing assembly 100 can be used to install the display assembly 200 and can be folded along the axis Y, and this embodiment does not make any limitations in this regard.

[0022] In all the directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application, they are only used to explain the relative position relationship and movement conditions between components in a certain specific posture (as shown in the drawings). If this specific posture changes, then the directional indications will also change accordingly. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally further include steps or units not listed, or may optionally further include other steps or units inherent to these processes, methods, products or devices.

[0023] Please refer to Figures 3 to 6 , Figure 3 is Figure 2 a schematic stacked structure diagram of the display assembly 200 in Figure 4 is Figure 3 a schematic stacked structure diagram of the support module 220 in Figure 5 is Figure 4 a schematic structure diagram of the support plate 211 in Figure 6 is Figure 4 a top view of the support module 220 in

[0024] The display assembly 200 is covered on the side of the middle frame 110 facing away from the rear cover 120, and can jointly enclose the aforementioned accommodation space with the middle frame 110 and the rear cover 120, and the display assembly 200 can also be folded along the axis Y with the housing assembly 100. Such asFigures 3 to 4 As shown, the display component 200 includes a display module 210 and a support module 220. Among them, the display module 210 and the support module 220 are stacked, and are located on the side of the support module 220 away from the back cover 120. Both the display module 210 and the support module 220 can be folded along the axis Y to realize the folding function of the display component 200. At the same time, the support module 220 can also be used to support the display module 210 to maintain the flatness of the display module 210 before and after folding. In this embodiment, the support module 220 can not only meet the support requirements of the display module 210, but also has the advantages of light weight and thin thickness, which is beneficial to the thin and light design of the display component 200.

[0025] Exemplarily, the display module 210 can be used to implement the image display function of the electronic device 10. The display module 210 can include a cover plate 211, an adhesive layer 212, a display panel 213, and a back film 214 that are stacked in sequence. The support module 220 is located on the side of the back film 214 away from the display panel 213 and is attached to the back film 214. Among them, the cover plate 211 can be used to protect the display panel 213, and the material of the cover plate 211 can be UTG (Ultra-Thin Glass) or CPI (Colorless polyimide) to provide the flexibility required for folding the display module 210. The adhesive layer 212 can be used to bond the cover plate 211 and the display panel 213, and the material of the adhesive layer 212 can be optical glue. The display panel 213 can be a flexible OLED panel, and the display panel 213 can be used to implement the image display function and can indicate the user to interact with the electronic device 10. The back film 214 can be used to etch the circuit of the display panel 213 and to protect the display panel 213, and the material of the back film 214 can be PET (polyethylene glycol terephthalate) or PI (Polyimide).

[0026] It can be understood that the stacked structure of the display module 210 is not limited to this, and the display module 210 can also include, for example, a touch panel and a fingerprint recognition sensor. That is, the stacked structure of the display module 210 can be adaptively adjusted according to design requirements, as long as the display module 210 can be folded along the axis Y. This embodiment does not make any limitations in this regard.

[0027] The support module 220 is disposed on the side of the back film 214 away from the display panel 213 and is used to support the display panel 213 to ensure the flatness of the display panel 213 before and after folding. As Figure 4As shown, the support module 220 may include a support plate 221, a first adhesive layer 222, a base material layer 223, and a second adhesive layer 224 that are sequentially stacked. The support plate 221 is disposed away from the back film 214, and the second adhesive layer 224 is disposed close to the back film 214. Among them, the support plate 221 is used to provide a supporting force for the display panel 213 to maintain the flatness of the display panel 213, and the support plate 221 can also be folded along the axis Y. The first adhesive layer 222 is used to bond the base material layer 223 and the support plate 221, and the first adhesive layer 222 is also used to bond the support plate 221 and the back film 214. The base material layer 223 can be used to block the hollow on the support plate 221 and can be folded along the axis Y with the support plate 221. The second adhesive layer 224 can be used to bond the base material layer 223 and the back film 214 and can cooperate with the first adhesive layer 222 to realize the bonding and fixing of the support module 220 and the back film 214.

[0028] Specifically, the material of the support plate 221 can be stainless steel, titanium alloy or carbon fiber composite material to provide sufficient support for the display panel 213. As Figure 4 shown, the support plate 221 has a bendable hollow area 2211 and flat areas 2212 respectively connected to opposite sides of the hollow area 2211. Among them, the rigidity of the hollow area 2211 is weaker than that of the flat area 2212, so that the hollow area 2211 can not only provide a certain degree of support for the display panel 213, but also have a certain degree of softness to be bent along the axis Y to realize the folding of the support plate 221 along the axis Y. At the same time, flat areas 2212 are connected to opposite sides of the hollow area 2211 parallel to the axis Y, and when the hollow area 2211 is folded along the axis Y, the flat areas 2212 located on opposite sides of the hollow area 2211 can also be folded along the axis Y. In addition, the flat area 2212 can be used to support the display panel 213 to maintain the flatness of the display panel 213 before and after folding.

[0029] Optionally, the hollow area 2211 has a through hole 2201 opened along the axis Y and a plurality of blind holes 2202 distributed on opposite sides of the through hole 2201 parallel to the axis Y and opened in a direction parallel to the axis Y. As Figure 5As shown, the through hole 2201 can communicate with the edge position of the hollowed-out area 2211 in the direction parallel to the axis Y, and the width of the through hole 2201 in the direction perpendicular to the axis Y can be greater than the width of the blind hole 2202 in the direction perpendicular to the axis Y, and it can be symmetrically arranged about the axis Y to minimize the rigidity of the area where the hollowed-out area 2211 is bent along the axis Y. A plurality of blind holes 2202 can be distributed on the opposite sides of the through hole 2201 parallel to the axis Y and symmetrically arranged about the axis Y, and the rigidity of the area of the hollowed-out area 2211 where the blind hole 2202 is provided can be stronger than the area of the hollowed-out area 2211 where the through hole 2201 is provided, so that the rigidity of the hollowed-out area 2211 in the direction towards the flat area 2212 can be gradually increased to avoid the problem of sudden change in rigidity strength caused by the opening of the through hole 2201 in the hollowed-out area 2211. In this embodiment, the blind hole 2202 is provided on the side of the hollowed-out area 2211 facing the substrate layer 223.

[0030] Optionally, in addition to the above embodiments, the hollowed-out area 2211 can also be provided with only a plurality of blind holes 2202 to reduce its own rigidity strength, and the design of the through hole 2201 can be omitted. The arrangement of the plurality of blind holes 2202 on the hollowed-out area 2211 can also be adaptively adjusted according to design requirements, as long as the rigidity of the hollowed-out area 2211 can be weaker than the rigidity of the flat area 2212. This embodiment does not limit this.

[0031] Optionally, since the through hole 2201 is provided on the hollowed-out area 2211, in order to prevent foreign objects (such as dust) from entering the area where the display panel 213 is located from the through hole 2201, the support module 220 can further include: a dust-proof film 225. As Figure 4 shown, the dust-proof film 225 is stacked with the support plate 221 and is located on the side of the support plate 221 away from the substrate layer 223, and the orthographic projection of the dust-proof film 225 on the support plate 221 can also cover the hollowed-out area 2211, so that the dust-proof film 225 can block the through hole 2201 on the hollowed-out area 2211, thereby preventing foreign objects from entering the area where the display panel 213 is located from the through hole 2201 to improve the reliability of the display component 200. In this embodiment, the dust-proof film 225 can completely cover the hollowed-out area 2211, and the dust-proof film 225 can also be attached to a part of the flat area 2212 to improve the bonding stability between the dust-proof film 225 and the support plate 221.

[0032] The first adhesive layer 222 is located between the support plate 221 and the substrate layer 223, and is used to adhesively fix the substrate layer 223 on the support plate 221. Among them, the orthographic projection of the first adhesive layer 222 on the support plate 221 can at least cover the flat area 2212, so that the substrate layer 223 can be adhesively fixed to the flat area 2212 of the support plate 221 through the first adhesive layer 222 at least. For example, the first adhesive layer 222 can only cover the flat area 2212 of the support plate 221, and can form an avoidance space 2221 in the area between the hollow area 2211 and the substrate layer 223 to avoid the hollow area 2211, so as to prevent the problem of the first adhesive layer 222 sagging at the through holes 2201 and blind holes 2202. In this embodiment, the first adhesive layer 222 can be any one of silicone, acrylic adhesive, epoxy resin adhesive, and polyurethane adhesive, and the thickness of the first adhesive layer 222 can be 10-20 μm, specifically 10 μm, 16 μm, or 20 μm.

[0033] Optionally, in order to improve the adhesive strength between the substrate layer 223 and the support plate 221, the first adhesive layer 222 can also be provided to cover the hollow area 2211, so that the substrate layer 223 can be adhesively bonded to both the hollow area 2211 and the flat area 2212 through the first adhesive layer 222. Among them, the through holes 2201 and blind holes 2202 in the hollow area 2211 can be filled with a flexible material to support the first adhesive layer 222 covering the hollow area 2211 while weakening the rigidity of the hollow area 2211, so as to reduce the probability of the first adhesive layer 222 sagging at the through holes 2201 and blind holes 2202.

[0034] As Figure 4 and Figure 6 As shown, the substrate layer 223 is provided on the side of the first adhesive layer 222 facing away from the support plate 221, and the orthographic projection of the substrate layer 223 on the support plate 221 can not only cover the hollow area 2211, but also cover a partial area of the flat areas 2212 on the opposite sides of the hollow area 2211. That is, the orthographic projection of the substrate layer 223 can completely cover the hollow area 2211 and the flat area 2212 in the direction parallel to the axis Y, and can completely cover the hollow area 2211 and only cover a partial flat area 2212 in the direction perpendicular to the axis Y, so that the substrate layer 223 can cover a partial area of the support plate 221 without covering the entire surface of the support plate 221. Among them, the substrate layer 223 can be used to block foreign objects entering from the hollow area 2211, and can reinforce the hollow area 2211 of the support plate 221 without affecting the bending of the hollow area 2211, so as to improve the impact resistance of the support plate 221 at the hollow area 2211.

[0035] Optionally, the width W1 of the substrate layer 223 in the direction perpendicular to the axis Y may be greater than or equal to 2 times the width W2 of the hollowed-out area 2211 in the direction perpendicular to the axis Y, and the width W1 of the base layer 223 in the direction perpendicular to the axis Y may also be less than or equal to 0.9 times the width W3 of the support plate 221 in the direction perpendicular to the axis Y. With such a setting, it can be ensured that the substrate layer 223 can completely cover the hollowed-out area 2211 and has sufficient area to bond with the first adhesive layer 222, so as to be adhesively fixed on the flat area 2212 through the first adhesive layer 222.

[0036] Furthermore, the material of the substrate layer 223 can be any one of polyimide, polyethylene terephthalate, and polyurethane, so that the substrate layer 223 can also have a certain flexibility to facilitate the folding of the substrate layer 223 along the axis Y with the hollowed-out area 2211. In addition, the thickness of the substrate layer 223 can be 5 - 20 μm, specifically 5 μm, 10 μm, 15 μm, or 20 μm. Through the above settings, the substrate layer 223 can reinforce and block the hollowed-out area 2211 of the support plate 221 while reducing the space (reducing the volume) occupied by itself on the support plate 221. Moreover, compared with the scheme where the substrate layer 223 covers the support plate 221 entirely, the design of the substrate layer 223 covering only part of it can not only reduce the weight of the support module 220 but also reduce the rebound force generated when the substrate layer 223 folds along the axis Y with the hollowed-out area 2211.

[0037] The second adhesive layer 224 is provided on the side of the substrate layer 223 facing away from the support plate 221, and the second adhesive layer 224 is used to bond the substrate layer 223 and the back film 214. As Figure 4 shown, the orthographic projection of the second adhesive layer 224 on the support plate 221 is within the coverage of the orthographic projection of the substrate layer 223 on the support plate 221. That is, the second adhesive layer 224 only covers the side of the substrate layer 223 facing away from the support plate 221, and does not cover the area where the first adhesive layer 222 is not covered by the substrate layer 223, so that both the first adhesive layer 222 and the second adhesive layer 224 can be bonded to the back film 214, thereby adhesively fixing the flat area 2212 and the substrate layer 223 on the back film 214 respectively. Through the above settings, since the substrate layer 223 only covers part of the support plate 221 and has a small volume and weak structural strength, the rebound force generated when the substrate layer 223 bends with the hollowed-out area 2211 is also small, so that the adhesive strength required for the second adhesive layer 224 to bond the substrate layer 223 and the back film 214 will also be reduced, which is conducive to thinning the second adhesive layer 224. In this embodiment, the second adhesive layer 224 can be any one of silicone, acrylic adhesive, epoxy resin adhesive, and polyurethane adhesive, and the thickness of the second adhesive layer 224 can be 10 - 15 μm, specifically 10 μm, 13 μm, or 15 μm.

[0038] For the support module 220 provided in this application, by setting the orthographic projection of the base material layer 223 on the support plate 221 to cover the hollow area 2211 and part of the flat area 2212 of the support plate 221, the base material layer 223 can not only block the hollow area 2211 of the support plate 221, but also be fixed by being bonded to the flat area 2212 of the support plate 221 through the first adhesive layer 222. At the same time, by setting the second adhesive layer 224 on the side of the base material layer 223 facing away from the hollow area 2211, and the orthographic projection of the second adhesive layer 224 on the support plate 221 is also within the coverage of the orthographic projection of the base material layer 223 on the support plate 221, the orthographic projections of the stacked base material layer 223 and the second adhesive layer 224 on the support plate 221 can only cover the hollow area 2211 and part of the flat area 2212 of the support plate 221. Compared with the solution where the base material layer 223 and the second adhesive layer 224 completely cover the hollow area 2211 and the flat area 2212, the volume of the base material layer 223 and the second adhesive layer 224 can be reduced to reduce the weight of the support module 220. In addition, since the volume of the base material layer 223 is reduced, the structural strength of the base material layer 223 will also be weakened, and the rebound force generated when the base material layer 223 is bent along with the hollow area 2211 of the support plate 221 will also be reduced. The reduction of the rebound force can reduce the bonding strength required for the second adhesive layer 224 to bond the base material layer 223 and the back film 214, so that the thickness of the second adhesive layer 224 can be thinned. Through the above settings, the thickness and weight of the support module 220 can be reduced, and when the support module 220 is used to support the display module 210 of the display assembly 200, it is beneficial to the thin and light design of the display assembly 200.

[0039] The above are only some embodiments of this application, and thus do not limit the protection scope of this application. Any equivalent device or equivalent process transformation made by using the content of the specification and drawings of this application, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of this application.

Claims

1. A support module, It is characterized in that The support module comprises: a support plate, a first adhesive layer, a substrate layer and a second adhesive layer; The support plate has a bendable hollow area and flat areas respectively connected to two opposite sides of the hollow area; the first adhesive layer is stacked with the support plate, and the orthographic projection of the first adhesive layer on the support plate at least covers the flat area; The substrate layer is located on a side of the first adhesive layer away from the support plate, and the orthographic projection of the substrate layer on the support plate covers the hollow area and covers a portion of the flat area located on two opposite sides of the hollow area; The second adhesive layer is disposed on a side of the substrate layer facing away from the support plate, and an orthographic projection of the second adhesive layer on the support plate is located within a coverage range of an orthographic projection of the substrate layer on the support plate.

2. The support module according to claim 1, It is characterized in that The orthographic projection of the first adhesive layer on the support plate covers the flat area, and the first adhesive layer forms an escape space between the hollow area and the substrate layer.

3. The support module according to claim 1, It is characterized in that The hollow area is configured to be bendable along an axis, and the flat area is connected to two opposite sides of the hollow area parallel to the axis.

4. The support module according to claim 3, It is characterized in that The width of the substrate layer in a direction perpendicular to the axis is greater than or equal to twice the width of the hollow area in a direction perpendicular to the axis, and the width of the substrate layer in a direction perpendicular to the axis is also less than or equal to 0.9 times the width of the support plate in a direction perpendicular to the axis.

5. The support module according to claim 3, It is characterized in that The hollow area has a through hole opened along the axis, and the hollow area also has a plurality of blind holes distributed on opposite sides of the through hole and opened in a direction parallel to the axis.

6. The support module according to claim 5, It is characterized in that The support module also includes: a dustproof film; The dustproof film is arranged on a side of the support plate away from the substrate layer, and the orthographic projection of the dustproof film on the support plate covers the hollow area to cover the through hole.

7. The support module according to any one of claims 1 to 6, It is characterized in that The material of the substrate layer is any one of polyimide, polyethylene terephthalate and polyurethane; The first adhesive layer is any one of silicone, acrylic glue, epoxy resin glue, and polyurethane glue; the second adhesive layer is also any one of silicone, acrylic glue, epoxy resin glue, and polyurethane glue.

8. The support module according to any one of claims 1 to 6, It is characterized in that The thickness of the substrate layer is 5-20 μm, the thickness of the first adhesive layer is 10-20 μm, and the thickness of the second adhesive layer is 10-15 μm.

9. A display component, It is characterized in that The display assembly comprises: a display module and a support module according to any one of claims 1 to 8; The display module is disposed on a side of the second adhesive layer away from the substrate layer, and is respectively attached to the first adhesive layer and the second adhesive layer, and the display module is configured to be bendable along with the hollowed-out area.

10. An electronic device, characterized in that, the electronic device includes: a housing assembly and the display assembly according to claim 9; wherein, the display assembly is disposed on the housing assembly, and together with the housing assembly, an accommodation space is formed.

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