Coupling transformer, mutual inductance adjusting method of coupling transformer and electronic equipment
By setting traces on the same substrate of the coupled transformer, the mutual inductance between the coils is cancelled, and the problem of weakening signal strength and signal-to-noise ratio reduction caused by mutual inductance interference in traditional transformers is solved, thereby achieving more efficient signal transmission.
Patent Information
- Application Number
- CN202510311273.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-17
- Publication Date
- 2025-05-27
AI Technical Summary
Traditional on-chip isolation transformers have a decrease in signal-to-noise ratio due to the increase in the thickness of the isolation layer, weakening the signal strength, and the mutual inductance interference between the coils of different channels is large, affecting signal transmission.
By setting traces on the same substrate of the coupled transformer, the mutual inductance between the coils is cancelled and the impact of mutual inductance on the transformer is reduced. The specific methods include obtaining the mutual inductance amount in real time, fitting the dynamic curve between the coil surrounding area of the trace and the mutual inductance amount, and adjusting the trace to match the position of the target connection point.
It significantly reduces the impact of mutual inductance between coils on the transformer, reduces interference in signal transmission, and improves signal strength and signal-to-noise ratio.
Smart Images

Figure CN120048631A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of transformer regulation, and in particular to a coupled transformer, a mutual inductance regulation method for the coupled transformer, and an electronic device. Background Art
[0002] Currently, related technologies propose that an on-chip integrated transformer can be used to replace a traditional optocoupler to transmit isolated signals. This solution has advantages such as a high communication data rate, no optical attenuation, and a short transmission delay. However, for a traditional on-chip isolation transformer, a relatively thick isolation layer is fabricated on the chip surface to achieve coil isolation, and its isolation ability is weak. When two adjacent transformer coils are used for signal transmission, interference will be generated between the coils of different channels due to mutual inductance. If the isolation ability of the transformer is increased by increasing the distance between the coils, the signal strength between the signals will be weakened. Summary of the Invention
[0003] In view of this, an object of the present invention is to provide a coupled transformer, a mutual inductance regulation method for the coupled transformer, and an electronic device, which can significantly reduce the influence of mutual inductance between coils on the transformer.
[0004] In a first aspect, an embodiment of the present invention provides a coupled transformer. The coupled transformer includes a first substrate and a second substrate that are isolated from each other. At the first substrate, there are provided: a first-channel transmitting coil and a second-channel receiving coil. At the second substrate, there are provided: a first-channel receiving coil and a second-channel transmitting coil. Among them, the first-channel transmitting coil is communicatively connected to the first-channel receiving coil to form a first signal transmission channel of the coupled transformer; the second-channel transmitting coil is communicatively connected to the second-channel receiving coil to form a second signal transmission channel of the coupled transformer.
[0005] In an embodiment, between the first-channel transmitting coil and the second-channel receiving coil, there is included: a first trace. Between the first-channel receiving coil and the second-channel transmitting coil, there is included: a second trace. Among them, the first trace is used to cancel the mutual inductance between the first-channel transmitting coil and the second-channel receiving coil; the second trace is used to cancel the mutual inductance between the first-channel receiving coil and the second-channel transmitting coil.
[0006] In an embodiment, the geometric center of the first-channel transmitting coil is a first center, the geometric center of the second-channel transmitting coil is a second center, the geometric center of the first-channel receiving coil is a third center, and the geometric center of the second-channel receiving coil is a fourth center.
[0007] In one embodiment, the first-channel transmitting coil includes: a first end and a second end, and the second-channel transmitting coil includes: a third end and a fourth end; wherein, the first-channel transmitting coil starts from the first end and rotates counterclockwise relative to the first center to reach the second end; the second-channel transmitting coil starts from the third end and rotates counterclockwise relative to the second center to reach the fourth end.
[0008] In one embodiment, the first trace includes: a first connecting line and a second connecting line, and the second trace includes: a third connecting line and a fourth connecting line; wherein, the first end of the first-channel transmitting coil is connected to the first connection point through the first connecting line; the second end of the first-channel transmitting coil is connected to the second connection point through the second connecting line; the third end of the second-channel transmitting coil is connected to the third connection point through the third connecting line; the fourth end of the second-channel transmitting coil is connected to the fourth connection point through the fourth connecting line.
[0009] In one embodiment, the first connection point and the second connection point are connected to the first transceiver chip, and the third connection point and the fourth connection point are connected to the second transceiver chip; wherein, the first transceiver chip is further connected to the first-channel transmitting coil and the second-channel receiving coil; the second transceiver chip is further connected to the first-channel receiving coil and the second-channel transmitting coil.
[0010] In one embodiment, the coil enclosing angles of the first trace when generating mutual inductance include a first included angle and a second included angle, and the coil enclosing angles of the second trace when generating mutual inductance include a third included angle and a fourth included angle; wherein, the first included angle is the included angle between the line connecting the first end of the first-channel transmitting coil and the third center and the line connecting the first connection point and the third center; the second included angle is the included angle between the line connecting the second end of the first-channel transmitting coil and the third center and the line connecting the second connection point and the third center; the third included angle is the included angle between the line connecting the third end of the second-channel transmitting coil and the fourth center and the line connecting the third connection point and the fourth center; the fourth included angle is the included angle between the line connecting the fourth end of the second-channel transmitting coil and the fourth center and the line connecting the fourth connection point and the fourth center.
[0011] In one embodiment, the sum of the first included angle and the second included angle is positively correlated with the mutual inductance amount for canceling the mutual inductance between the first-channel transmitting coil and the second-channel receiving coil; the sum of the third included angle and the fourth included angle is positively correlated with the mutual inductance amount for canceling the mutual inductance between the first-channel receiving coil and the second-channel transmitting coil.
[0012] Second aspect: Embodiments of the present invention further provide a method for adjusting the mutual inductance of a coupled transformer. The method is applied to the coupled transformer according to any one of the first aspect. The method includes: obtaining in real time the first mutual inductance and the second mutual inductance on the surface of the first substrate, and the third mutual inductance and the fourth mutual inductance on the surface of the second substrate, where the first mutual inductance is the mutual inductance between the first-channel transmitting coil and the second-channel receiving coil, the second mutual inductance is the sum of the mutual inductances between the second-channel receiving coil and the first connecting line and the second connecting line respectively, the third mutual inductance is the mutual inductance between the first-channel receiving coil and the second-channel transmitting coil, and the fourth mutual inductance is the sum of the mutual inductances between the first-channel receiving coil and the third connecting line and the fourth connecting line respectively; using the second mutual inductance and the fourth mutual inductance to respectively fit the first dynamic curve and the second dynamic curve between the coil surrounding area and the mutual inductance amount of the first trace and the second trace, and matching the first dynamic curve and the second dynamic curve with the first mutual inductance and the third mutual inductance respectively to determine the target connection point position of the coupled transformer.
[0013] Third aspect: Embodiments of the present invention further provide an electronic device, including a processor and a memory. The memory stores computer-executable instructions that can be executed by the processor, and the processor executes the computer-executable instructions to implement the method provided in the second aspect.
[0014] Embodiments of the present invention bring the following beneficial effects:
[0015] A coupled transformer, a method for adjusting the mutual inductance of a coupled transformer, and an electronic device provided by embodiments of the present invention. The coupled transformer includes a first substrate and a second substrate that are isolated from each other. At the first substrate, there are provided: a first-channel transmitting coil and a second-channel receiving coil. At the second substrate, there are provided: a first-channel receiving coil and a second-channel transmitting coil; where the first-channel transmitting coil is communicatively connected to the first-channel receiving coil to form a first signal transmission channel of the coupled transformer; the second-channel transmitting coil is communicatively connected to the second-channel receiving coil to form a second signal transmission channel of the coupled transformer. Embodiments of the present invention can use the traces between the coils on the same substrate to cancel the mutual inductance between the coils, thereby significantly reducing the influence of the mutual inductance between the coils on the transformer.
[0016] Other features and advantages of the present invention will be described in the following specification, and, in part, will be obvious from the specification, or will be understood by implementing the present invention. The objectives and other advantages of the present invention are achieved and obtained by the structures specifically pointed out in the specification, the claims, and the drawings.
[0017] To make the above objectives, features, and advantages of the present invention more obvious and understandable, the following specific preferred embodiments are given, and in conjunction with the accompanying drawings, the detailed description is as follows. Description of the Drawings
[0018] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the accompanying drawings required for the description of the specific embodiments or the prior art. Obviously, the accompanying drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other accompanying drawings can be obtained based on these drawings without creative efforts.
[0019] Figure 1 It is a schematic structural diagram of a coupling transformer provided by an embodiment of the present invention;
[0020] Figure 2 It is a schematic structural diagram of a mutual inductance included angle of a wire routing provided by an embodiment of the present invention;
[0021] Figure 3 It is a schematic flowchart of a method for adjusting the mutual inductance of a coupling transformer provided by an embodiment of the present invention;
[0022] Figure 4 It is a schematic diagram of a dynamic curve between the coil enclosing area and the mutual inductance provided by an embodiment of the present invention;
[0023] Figure 5 It is a schematic structural diagram of an electronic device provided by an embodiment of the present invention. Specific Embodiments
[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.
[0025] At present, transmitting isolated signals through on-chip integrated transformers has advantages such as high communication data rate, no optical attenuation, and short transmission delay compared to traditional optocouplers. However, traditional on-chip isolation transformers use CMOS technology to fabricate a relatively thick isolation layer (~10 - 30um) on the chip surface to achieve coil isolation, while the epoxy-like dielectric layer filled between the light-emitting diode and the photosensitive triode of the optocoupler is up to hundreds of micrometers thick. Therefore, the distance through insulation (DTI) of the optocoupler is hundreds of times that of traditional magnetic isolators / capacitive isolators, with stronger isolation ability. If the isolation ability of the transformer is increased by increasing the distance between the coils, there are great technical difficulties for the design of multi-channel isolators: 1. If the distance between the transmitter and receiver coils of the transformer increases (e.g., hundreds of micrometers), the coupling between the coils will weaken (representing signal strength); 2. Having multiple isolation channels in a tiny package means that the coils of multiple channels are also close to each other. Since the area available for placing coils in a typical package is only in the range of thousands of micrometers, the coupling between coils of different channels cannot be ignored compared to the coupling between coils of the same channel (representing noise strength); 3. That is, as the thickness of the isolation layer increases, the coupling coefficient between coils of the same channel decreases and gets closer and closer to the coupling between coils of different channels, so the signal-to-noise ratio will decrease significantly, thus breaking the signal integrity of the system. Based on this, the coupling transformer, the mutual inductance adjustment method of the coupling transformer, and the electronic device provided by the embodiments of the present invention can significantly reduce the impact of the mutual inductance between coils on the transformer.
[0026] An embodiment of the present invention provides a schematic structural diagram of a coupling transformer, as Figure 1 shown. The coupling transformer includes a first substrate and a second substrate that are isolated from each other. At the first substrate, there are provided: a first-channel transmitting coil and a second-channel receiving coil. At the second substrate, there are provided: a first-channel receiving coil and a second-channel transmitting coil. Among them, the first-channel transmitting coil is communicatively connected to the first-channel receiving coil to form a first signal transmission channel of the coupling transformer; the second-channel transmitting coil is communicatively connected to the second-channel receiving coil to form a second signal transmission channel of the coupling transformer. Specifically, between the first-channel transmitting coil and the second-channel receiving coil, there is included: a first trace. Between the first-channel receiving coil and the second-channel transmitting coil, there is included: a second trace. Among them, the first trace is used to cancel the mutual inductance between the first-channel transmitting coil and the second-channel receiving coil; the second trace is used to cancel the mutual inductance between the first-channel receiving coil and the second-channel transmitting coil.
[0027] That is to say, the first-channel transmitting coil and the first-channel receiving coil are coils of the same channel, and the second-channel transmitting coil and the second-channel receiving coil are coils of the same channel. Two coils on the same substrate are adjacent coils of different channels, and there is mutual inductance between adjacent coils of different channels. This mutual inductance will affect the normal signal transmission between channels. Therefore, the mutual inductance of the same magnitude and opposite direction generated by the traces cancels out the mutual inductance between the coils. In addition, the design of the coils and traces on any substrate is the same.
[0028] In practical applications, the first substrate and the second substrate are stacked, and the receiving coil of the first channel overlaps with the transmitting coil of the first channel in the vertical direction, and the overlapping area is the first overlapping area. The receiving coil of the second channel overlaps with the transmitting coil of the second channel in the vertical direction, and the overlapping area is the second overlapping area. The ratio of the area of the receiving coil of the first channel to the area of the transmitting coil of the first channel is between 0.5 and 1.5; preferably, between 0.8 and 1.2. The ratio of the area of the receiving coil of the second channel to the area of the transmitting coil of the second channel is between 0.5 and 1.5; preferably, between 0.8 and 1.2. The ratio of the first overlapping area to the area of the receiving coil of the first channel is between 0.5 and 1.5; preferably, between 0.8 and 1.2. The ratio of the second overlapping area to the area of the receiving coil of the second channel is between 0.5 and 1.5; preferably, between 0.8 and 1.2. In addition, the first substrate and the second substrate are insulating substrates. The substrate located on the upper layer of the stack has a thickness of not less than 100 um, preferably not less than 300 um. The substrate located on the lower layer of the stack is fixedly connected to the package frame or the substrate.
[0029] In one embodiment, the thickness of the metal wire on the insulating substrate is between 0.5 um and 10 um, preferably between 0.6 um and 3 um. The line width of the metal wire is usually less than 150 um, preferably between 0.5 um and 20 um. The spacing between the coil metal wires is usually less than 150 um, preferably between 0.5 um and 20 um.
[0030] The geometric center of the first-channel transmitting coil is the first center, the geometric center of the second-channel transmitting coil is the second center, the geometric center of the first-channel receiving coil is the third center, and the geometric center of the second-channel receiving coil is the fourth center. The first-channel transmitting coil includes a first end and a second end, and the second-channel transmitting coil includes a third end and a fourth end. Among them, the first-channel transmitting coil starts from the first end and rotates counterclockwise relative to the first center to reach the second end; the second-channel transmitting coil starts from the third end and rotates counterclockwise relative to the second center to reach the fourth end. In addition, the first trace includes a first connecting line and a second connecting line, and the second trace includes a third connecting line and a fourth connecting line. Among them, the first end of the first-channel transmitting coil is connected to the first connection point through the first connecting line; the second end of the first-channel transmitting coil is connected to the second connection point through the second connecting line; the third end of the second-channel transmitting coil is connected to the third connection point through the third connecting line; the fourth end of the second-channel transmitting coil is connected to the fourth connection point through the fourth connecting line.
[0031] Further, the first connection point and the second connection point are connected to the first transceiver chip, and the third connection point and the fourth connection point are connected to the second transceiver chip. Among them, the first transceiver chip is also connected to the first-channel transmitting coil and the second-channel receiving coil; the second transceiver chip is also connected to the first-channel receiving coil and the second-channel transmitting coil.
[0032] Since the designs of the coils and traces on any substrate are the same, taking the first substrate as an example, refer to Figure 2 The structural schematic diagram of a mutual inductance angle between traces as shown, which includes the first coil (N) of the first channel and the second coil (M) of the second channel. The geometric center of the first coil of the first channel is the first center (NC), and the geometric center of the second coil of the second channel is the second center (MC). The first coil includes a first end (C-) and a second end (C+). The rotation direction from the first end (C-) of the first coil along the winding of the first coil to the second end (C+) of the first coil relative to the first center (NC) is the first direction (counterclockwise). Among them, the first end C- is connected to the first connection point A+ (in practice, A+ can be a pad) through the first connecting line P, and the second end C+ is connected to the second connection point A- (in practice, A- can be a pad) through the second connecting line Q. The first connection point and the second connection point are connected to the transceiver chip. The rotation direction from the first end of the first coil along the first connecting line to the first connection point relative to the second center is opposite to the first direction (that is, the direction from C- along P to A+ is clockwise relative to MC), and the rotation direction from the second end of the first coil along the second connecting line to the second connection point relative to the second center is the same as the first direction (that is, the direction from C+ along Q to A- is counterclockwise relative to MC).
[0033] That is to say, when the magnetic field increasing out of the paper vertically is at the center of coil M, the magnetic field increasing into the paper vertically is at the center of coil N. Accordingly, a positive voltage is induced at C+, and a negative voltage is induced at C-. On the other hand, a positive voltage is induced at A+, and a negative voltage is induced at A-. Therefore, from the perspective of the A+ / A+ pads, the electromotive forces induced by the trace P+Q and coil N are opposite.
[0034] In one embodiment, when the first connection line P and the second connection line Q remain unchanged, if the first coil (N) of the first channel rotates clockwise relative to the first center (NC) when going from the first end (C-) of the first coil along the winding of the first coil to the second end (C+) of the first coil, the induced electromotive force of the first coil and the induced electromotive force of the second coil (M) are in a superposition state, which will cause interference amplification. Therefore, it is necessary to set the first direction to be counterclockwise.
[0035] See Figure 2 In the structural schematic diagram of the mutual inductance included angle of a trace shown, the coil surrounding angles of the first trace when generating mutual inductance include a first included angle and a second included angle, and the coil surrounding angles of the second trace when generating mutual inductance include a third included angle and a fourth included angle; wherein, the first included angle is the included angle between the connection line of the first end of the transmitting coil of the first channel and the third center and the connection line of the first connection point and the third center (i.e., Figure 2 S1 in Figure 2 ); the second included angle is the included angle between the connection line of the second end of the transmitting coil of the first channel and the third center and the connection line of the second connection point and the third center (i.e.,
[0036] S2 in
[0037] Based onFigure 1 The structural schematic diagram of the coupled transformer shown. In the embodiments of the present invention, the mutual inductance adjustment method of the coupled transformer will be introduced in detail. Refer to Figure 3 The flowchart of a mutual inductance adjustment method of a coupled transformer shown. This method mainly includes the following steps S302 to S304:
[0038] Step S302: Real-time obtain the first mutual inductance and the second mutual inductance on the surface of the first substrate, and the third mutual inductance and the fourth mutual inductance on the surface of the second substrate. Among them, the first mutual inductance is the mutual inductance between the first-channel transmitting coil and the second-channel receiving coil, the second mutual inductance is the sum of the mutual inductances between the second-channel receiving coil and the first connecting line and the second connecting line respectively, the third mutual inductance is the mutual inductance between the first-channel receiving coil and the second-channel transmitting coil, and the fourth mutual inductance is the sum of the mutual inductances between the first-channel receiving coil and the third connecting line and the fourth connecting line respectively.
[0039] Step S304: Use the second mutual inductance and the fourth mutual inductance to respectively fit the first dynamic curve and the second dynamic curve between the coil enclosing area and the mutual inductance amount of the first trace and the second trace, and match the first dynamic curve and the second dynamic curve with the first mutual inductance and the third mutual inductance respectively to determine the target connection point position of the coupled transformer. In one embodiment, refer to Figure 4 The schematic diagram of the dynamic curve between the coil enclosing area and the mutual inductance amount shown. That is to say, it is necessary to adjust the area of the second-channel receiving coil enclosed by the first trace, and adjust the line length and shape of the first trace through simulation, so as to adjust the mutual inductance. After the positions of the first-channel transmitting coil and the second-channel receiving coil are determined, the mutual inductance between the first-channel transmitting coil and the second-channel receiving coil is determined. When the area enclosed by the first trace is small, the second mutual inductance is small. When the area enclosed by the first trace is large, the second mutual inductance is large. Select the situation where the absolute values of the first mutual inductance and the second mutual inductance are closest, so as to achieve the effect of eliminating the total mutual inductance.
[0040] In summary, the present invention can utilize the mutual inductance formed by the traces between the two transformer coils and the pads to cancel out the original mutual inductance between the two coils. Therefore, the orientation and layout of the traces must meet certain requirements, neither under-compensating nor over-compensating, so as to form a state close to zero mutual inductance and eliminate mutual interference. For example, when coil M generates a magnetic field that increases out of the paper perpendicular to the plane of the paper, coil N will induce a magnetic field that increases into the paper perpendicular to the plane of the paper, thereby generating an induced electromotive force at both ends of coil N (this is the source of the interference of coil M on coil N, that is, induced electromotive force 1). On the other hand, both ends of coil N are connected to the other side of coil M through trace P and trace Q. Since coils P and Q also enclose coil M, an induced electromotive force will also be formed on coils P and Q (that is, induced electromotive force 2). If the winding method (clockwise / counterclockwise) of coil N is appropriate and the lengths of traces P and Q are appropriate, then for the whole of coil N + trace P + trace Q, induced electromotive force 1 and induced electromotive force 2 are equal (or close) in magnitude and opposite in direction, so the sum is close to 0, thereby achieving the purpose of eliminating the induced electromotive force and eliminating the interference. In addition, traces P and Q also have the effect of setting the pads of coil N and the pads of coil M on the same side, which is convenient for connection.
[0041] The device provided by the embodiment of the present invention has the same implementation principle and the same technical effects as those of the foregoing method embodiment. For a brief description, for the parts not mentioned in the device embodiment, reference may be made to the corresponding content in the foregoing method embodiment.
[0042] The embodiment of the present invention provides an electronic device. Specifically, the electronic device includes a processor and a storage device; a computer program is stored on the storage device, and when the computer program is run by the processor, it executes the method according to any one of the foregoing embodiments.
[0043] Figure 5 FIG. 10 is a schematic structural diagram of an electronic device provided by an embodiment of the present invention. The electronic device 100 includes: a processor 50, a memory 51, a bus 52, and a communication interface 53. The processor 50, the communication interface 53, and the memory 51 are connected through the bus 52; the processor 50 is used to execute an executable module stored in the memory 51, such as a computer program.
[0044] Among them, the memory 51 may include a high-speed random access memory (RAM, Random Access Memory), and may also include a non-volatile memory, such as at least one disk memory. Through at least one communication interface 53 (which can be wired or wireless), communication connection between the system network element and at least one other network element can be realized, and the Internet, wide area network, local area network, metropolitan area network, etc. can be used.
[0045] The bus 52 can be an ISA bus, a PCI bus, an EISA bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For the sake of convenience of representation, Figure 5 only a bidirectional arrow is used in the figure, but it does not mean that there is only one bus or one type of bus.
[0046] Among them, the memory 51 is used to store a program. After receiving an execution instruction, the processor 50 executes the program. The method executed by the device defined by the flow process disclosed in any one of the foregoing embodiments of the present invention can be applied to the processor 50 or implemented by the processor 50.
[0047] The processor 50 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by the integrated logic circuit in the hardware of the processor 50 or the instructions in the form of software. The above-mentioned processor 50 may be a general-purpose processor, including a central processing unit (CPU for short), a network processor (NP for short), etc.; it may also be a digital signal processor (DSP for short), an application specific integrated circuit (ASIC for short), a field-programmable gate array (FPGA for short), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. It can implement or execute the various methods, steps and logic block diagrams disclosed in the embodiments of the present invention. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc. The steps of the method disclosed in combination with the embodiments of the present invention can be directly embodied as being executed and completed by the hardware decoding processor, or executed and completed by the combination of the hardware and software modules in the decoding processor. The software module may be located in a mature storage medium in the art such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory, or an electrically erasable programmable memory, a register, etc. This storage medium is located in the memory 51, and the processor 50 reads the information in the memory 51 and combines its hardware to complete the steps of the above method.
[0048] The computer program product of the readable storage medium provided by the embodiments of the present invention includes a computer-readable storage medium storing program code. The instructions included in the program code can be used to execute the method described in the foregoing method embodiments. For the specific implementation, reference can be made to the foregoing method embodiments, and details are not described herein again.
[0049] If the above-described functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, an electronic device, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as USB flash drives, mobile hard disks, read-only memories (ROMs), random access memories (RAMs), magnetic disks, or optical discs.
[0050] Finally, it should be noted that the above-described embodiments are only specific implementation manners of the present invention, used to illustrate the technical solutions of the present invention, rather than limiting it. The protection scope of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: any person skilled in the technical field can still modify the technical solutions described in the foregoing embodiments, or can easily conceive of changes, or perform equivalent replacements on some of the technical features; and these modifications, changes, or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.
Claims
1. A coupling transformer, characterized in that: The coupling transformer comprises a first substrate and a second substrate isolated from each other, wherein the first substrate is provided with: a first channel transmitting coil and a second channel receiving coil, and the second substrate is provided with: a first channel receiving coil and a second channel transmitting coil; wherein, The first channel transmitting coil is communicatively connected with the first channel receiving coil to form a first signal transmission channel of the coupling transformer; The second channel transmitting coil is communicatively connected with the second channel receiving coil to form a second signal transmission channel of the coupling transformer.
2. The coupling transformer according to claim 1, characterized in that: The first channel transmitting coil and the second channel receiving coil include: a first wiring, and the first channel receiving coil and the second channel transmitting coil include: a second wiring; wherein, The first wiring is used to offset the mutual inductance between the first channel transmitting coil and the second channel receiving coil; The second wiring is used to offset the mutual inductance between the first channel receiving coil and the second channel transmitting coil.
3. The coupling transformer according to claim 1, characterized in that: The geometric center of the first channel transmitting coil is the first center, the geometric center of the second channel transmitting coil is the second center, the geometric center of the first channel receiving coil is the third center, and the geometric center of the second channel receiving coil is the fourth center.
4. The coupling transformer according to claim 3, characterized in that: The first channel transmitting coil includes: a first end and a second end, and the second channel transmitting coil includes: a third end and a fourth end; wherein, The first channel transmitting coil starts from the first end and rotates counterclockwise relative to the first center to reach the second end; The second channel transmitting coil starts from the third end and rotates counterclockwise relative to the second center to reach the fourth end.
5. The coupling transformer according to claim 1, characterized in that: The first routing line includes: a first connecting line and a second connecting line, and the second routing line includes: a third connecting line and a fourth connecting line; wherein, The first end of the first channel transmitting coil is connected to the first connection point through the first connection line; the second end of the first channel transmitting coil is connected to the second connection point through the second connection line; The third end of the second channel transmitting coil is connected to the third connection point through the third connection line; the fourth end of the second channel transmitting coil is connected to the fourth connection point through the fourth connection line.
6. The coupling transformer according to claim 5, characterized in that: The first connection point and the second connection point are connected to the first transceiver chip, and the third connection point and the fourth connection point are connected to the second transceiver chip; wherein, The first transceiver chip is also connected to the first channel transmitting coil and the second channel receiving coil; The second transceiver chip is also connected to the first channel receiving coil and the second channel transmitting coil.
7. The coupling transformer according to claim 5, characterized in that: The coil enclosing angle of the first routing line when generating mutual inductance includes a first angle and a second angle, and the coil enclosing angle of the second routing line when generating mutual inductance includes a third angle and a fourth angle; wherein, The first angle is the angle between a line connecting the first end of the first channel transmitting coil and the third center and a line connecting the first connection point and the third center; The second angle is the angle between a line connecting the second end of the transmitting coil of the first channel and the third center and a line connecting the second connection point and the third center; The third angle is the angle between a line connecting the third end of the second channel transmitting coil and the fourth center and a line connecting the third connection point and the fourth center; The fourth angle is the angle between a line connecting the fourth end and the fourth center of the second channel transmitting coil and a line connecting the fourth connection point and the fourth center.
8. The coupling transformer according to claim 7, characterized in that: The sum of the first angle and the second angle is positively correlated with the mutual inductance used to offset the mutual inductance between the first channel transmitting coil and the second channel receiving coil; the sum of the third angle and the fourth angle is positively correlated with the mutual inductance used to offset the mutual inductance between the first channel receiving coil and the second channel transmitting coil.
9. A method for adjusting mutual inductance of a coupling transformer, characterized in that: The method is applied to the coupling transformer according to any one of claims 1 to 8, and the method comprises: Acquire in real time a first mutual inductance and a second mutual inductance of the surface of the first substrate, and a third mutual inductance and a fourth mutual inductance of the surface of the second substrate, wherein the first mutual inductance is the mutual inductance between the first channel transmitting coil and the second channel receiving coil, the second mutual inductance is the sum of the mutual inductances between the second channel receiving coil and the first connecting wire and the second connecting wire respectively, the third mutual inductance is the mutual inductance between the first channel receiving coil and the second channel transmitting coil, and the fourth mutual inductance is the sum of the mutual inductances between the first channel receiving coil and the third connecting wire and the fourth connecting wire respectively; The first dynamic curve and the second dynamic curve between the coil enclosing area and the mutual inductance of the first routing and the second routing are fitted respectively by using the second mutual inductance and the fourth mutual inductance, and the first dynamic curve and the second dynamic curve are matched with the first mutual inductance and the third mutual inductance respectively to determine the target connection point position of the coupling transformer.
10. An electronic device, characterized in that: The method comprises a processor and a memory, wherein the memory stores computer executable instructions that can be executed by the processor, and the processor executes the computer executable instructions to implement the method of claim 9.