Die bonding device

Abstract

The invention discloses a die bonding device, which comprises a base station, two slide rail devices are oppositely arranged on the base station along a second direction, a movable cross beam is slidably arranged between the two slide rail devices, the movable cross beam is arranged in a first direction of the base station, and the movable cross beam is provided with a chip mounting head assembly used for chip mounting; the feeding module is arranged on the base table and located in the first direction; the welding table module is arranged at the downstream position of the feeding module, is positioned below the chip mounting head assembly, and is used for processing materials; the discharging module is arranged at the downstream position of the welding table module, and the discharging module is used for receiving materials from the welding table module; wherein the base station is further fixedly provided with an outer cover wrapping the welding station module, atmosphere gas can be introduced into the outer cover, and the outer cover is provided with a patch hole and covers a material to be processed to form a closed processing space. The nitrogen environment is not mixed with the air environment, high nitrogen density can be well achieved, and the nitrogen consumption is relatively less.

Description

Technical Field

[0001] The present invention belongs to the technical field of die bonding and chip mounting equipment, and particularly relates to a die bonding device. Background Art

[0002] The die bonding device is also known as a chip mounter. In the field of silicon carbide (SiC) chip mounting, generally, nano silver is used as the connection layer between the chip and the substrate. When mounting the SiC chip, the soldering station and the chip mounting head are generally heated to help achieve pre-sintering. However, nano silver itself is relatively easy to oxidize, and it is even easier to oxidize after heating. Once oxidized, it will affect the quality of chip mounting, and further affect the subsequent processes, resulting in the generation of defective products.

[0003] For the currently newer copper sintering process in the industry, due to the more easily oxidized property of copper, the impact will be greater.

[0004] The existing anti-oxidation design for wire-connected (used as an automated production line) silicon carbide usually directly passes nitrogen gas in the chip mounting area, and then exports the nitrogen gas through a diversion pipeline until the entire chip mounting area is covered. In this way, the nitrogen gas environment is mixed with the air environment, so it is not possible to achieve a very high nitrogen gas density well. And in the case of a relatively large chip mounting range, the nitrogen gas consumption in this way will be very large. Summary of the Invention

[0005] In view of the above problems existing in the prior art, the present invention provides a die bonding device. Two slide rail devices are oppositely arranged on the base along the second direction. A moving cross beam is slidably installed between the two slide rail devices. The moving cross beam is arranged in the first direction of the base. The soldering station module can be filled with an anti-oxidation gas. The outer cover is fixedly installed on the base through bolts around it. The outer cover covers the other parts of the soldering station module except, and forms a relatively enclosed processing space in cooperation with the base. The present invention fixes an outer cover covering the soldering station module outside the base, and fills the outer cover with an anti-oxidation gas. In this way, the nitrogen gas environment is not mixed with the air environment, and a very high nitrogen gas density can be well achieved.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions: A die bonding device, comprising: A base, on which two slide rail devices are oppositely arranged along the second direction. A moving cross beam is slidably installed between the two slide rail devices. The moving cross beam is arranged in the first direction of the base. The moving cross beam is installed with a chip mounting head assembly for chip mounting; A feeding module, which is arranged on the base and is located in the first direction; A soldering station module arranged at the downstream position of the feeding module. The soldering station module is located below the chip mounting head assembly and is used for processing materials; and An unloading module disposed at a downstream position of the soldering station module, the unloading module being configured to receive materials from the soldering station module; Wherein, an outer cover covering the soldering station module is further fixed to the base, the outer cover can be introduced with atmosphere gas, the outer cover is provided with a chip placement hole and the outer cover covers the material to be processed to form a closed processing space.

[0007] Further, the soldering station module further includes a soldering station assembly, a first-direction driving assembly and a second-direction driving assembly disposed in the outer cover; Wherein, the second-direction driving assembly is fixedly installed on the base, the first-direction driving assembly is in transmission cooperation with the second-direction driving assembly, the second-direction driving assembly is configured to drive the first-direction driving assembly to move along the second direction, the first-direction driving assembly is in transmission connection with the soldering station assembly, and the first-direction driving assembly is configured to drive the soldering station assembly to move in the first direction.

[0008] Further, the soldering station assembly includes an enclosing shell, a soldering station plate, a soldering station base, a soldering station sealing assembly and a lifting track assembly. A soldering station vertical plate is fixed to the upper part of the soldering station base, the soldering station vertical plate is fixed to the lower part of the soldering station plate and is distributed around the soldering station plate, and the enclosing shell is disposed outside the soldering station vertical plate and is fixedly connected to the soldering station base; There are two soldering station sealing assemblies which are respectively installed on the soldering station base. The soldering station sealing assemblies are disposed on both sides of the soldering station vertical plate and are located in the second direction of the base. The lifting track assembly is installed on the soldering station base, the lifting track assembly is configured to transport the materials, and the lifting track assembly is disposed in the first direction of the base.

[0009] Further, the soldering station sealing assembly includes a sealing cylinder and a sealing plate disposed in the third direction of the base. The sealing cylinder is fixed to one side of the soldering station base, the output end of the sealing cylinder is connected with the sealing plate, and the length of the sealing plate matches the length of the groove formed in the enclosing shell, so that a sealing structure can be formed in cooperation with the enclosing shell and the outer cover after the sealing plate is lifted.

[0010] Further, the lifting track assembly includes a track plate, a lifting vertical plate, a lifting track cylinder and a jacking spring. The track plate is distributed in the first direction of the base and is located on one side of the soldering station plate. Two mutually parallel lifting track sliders are slidably connected to one side of the track plate, and the lifting track sliders are slidably connected with the lifting track slide rails fixed on the lifting vertical plate. The lifting vertical plate is fixedly disposed on the soldering station base; Wherein, a jacking spring is installed below the middle opening of the lifting vertical plate. Under the action of the jacking spring, the track plate has a tendency to move away from the soldering table base. The lifting track cylinder is fixed above the middle opening of the lifting vertical plate, and the output end of the lifting track cylinder abuts against the track plate, so that the track plate can move closer to the soldering table base after the lifting track cylinder works.

[0011] Further, the first-direction driving assembly includes a soldering table linear module slider and a soldering table linear module installed in the first direction. The soldering table linear module slider is fixedly connected to the upper part of the soldering table linear module, and the soldering table linear module is in transmission connection with the soldering table base. The second-direction driving assembly includes a soldering table driving base, a soldering table driving motor, and a soldering table ball screw arranged in the second direction of the base. The soldering table driving motor is in transmission connection with the soldering table ball screw, and the end of the soldering table ball screw is connected to the soldering table linear module slider.

[0012] Further, the feeding module includes a feeding conveyor belt assembly and a feeding pushing assembly installed on the base. The feeding pushing assembly includes a pushing cylinder, a feeding dial plate, and a pressing component. The pushing cylinder is arranged along the material moving direction, the pushing cylinder is fixed on the feeding pushing plate, the feeding pushing plate is fixedly arranged on the feeding conveyor belt assembly, the output end of the pushing cylinder is rotatably installed with the feeding dial plate, and the feeding dial plate can move along the first direction of the base under the drive of the pushing cylinder. The pressing component is fixed in the middle of the feeding pushing plate, so that when the feeding dial plate moves to the pressing component, the feeding dial plate can abut against the pressing component and rotate by a certain angle.

[0013] Further, the pressing component includes a pressing seat and a dial rod fixed on the pressing seat. The pressing seat is fixed in the middle of the feeding pushing plate, the pressing seat extends away from the feeding pushing plate to form an installation structure, the dial rod is fixed at the installation structure, and the dial rod is horizontally arranged and extends above the pushing cylinder.

[0014] Further, the discharging module includes a discharging conveyor belt assembly and a discharging pushing assembly installed on the base. The discharging pushing assembly includes a discharging motor, a discharging synchronous belt, a discharging synchronous assembly, and a discharging fixing plate. Among them, the discharging fixed plate is fixedly installed on the discharging conveyor belt assembly, the discharging motor is installed at one end of the discharging fixed plate, the discharging synchronous belt is arranged along the material moving direction, the discharging synchronous belt is transmission connected with the discharging motor, the discharging synchronous belt is fixed on the upper part of the discharging synchronous belt, and the discharging synchronous assembly is also slidingly connected with the discharging slide rail on the discharging fixed plate, the discharging synchronous assembly is fixed with a discharging paddle plate, the discharging paddle plate is used to push out the processed material, and the discharging synchronous assembly can move along the first direction of the base under the drive of the discharging motor.

[0015] Furthermore, the discharging synchronization component includes a discharging synchronization seat, a slide cylinder and a discharging overload detection component fixedly connected to the discharging synchronization belt; Among them, the slide cylinder is fixed on the discharge synchronization seat, the slide output seat is fixed on the output end of the slide cylinder, the discharge overload detection component is fixed on the slide output seat, the discharge overload detection component is fixedly installed on the discharge dial plate, and the slide cylinder is used to drive the discharge overload detection component to move in the third direction.

[0016] Compared with the prior art, the beneficial effects of this solution are: 1. The present invention provides a crystal bonding device, wherein two slide rail devices are arranged on the base in a second direction relative to each other, a movable crossbeam is slidably installed between the two slide rail devices, and the movable crossbeam is arranged on the first direction of the base. The present invention designs a feeding and pushing assembly with a high degree of automation, and the substrate enters the feeding conveyor belt assembly from the left side of the crystal bonding device. When the substrate is transmitted through the feeding plate of the feeding and pushing module by the feeding conveyor belt assembly, the feeding and pushing assembly of the pushing module can completely push the substrate into the soldering station module; 2. The soldering station module of the present invention is located below the patch head assembly. The soldering station module is installed on the base and is used to process materials. The soldering station module can be fed with anti-oxidation gas (nitrogen). The outer cover is fixed on the base by bolts around the periphery. The outer cover is arranged outside the other parts of the soldering station module and cooperates with the base to form a relatively closed processing space. Compared with the existing inline silicon carbide anti-oxidation design that directly passes nitrogen in the patch area, the present invention introduces anti-oxidation gas (nitrogen). The nitrogen environment is not mixed with the air environment, and a very high nitrogen density can be achieved. In the case of a relatively large patch range, the amount of nitrogen used is relatively less.

[0017] 3. The discharging module of the crystal bonding device of the present invention is arranged at the downstream position of the soldering station module, and is used to receive the materials from the soldering station module. After the soldering station module completes the process of processing the substrate, the discharging pushing component of the discharging module can hook the substrate out of the soldering station module, and then cooperate with the discharging conveyor belt component to finally push the substrate out. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of the crystal bonding device; Figure 2 It is another schematic structural diagram of the die bonding device; Figure 3 It is another schematic structural diagram of the die bonding device (after removing the outer cover); Figure 4 It is a schematic structural diagram of the soldering platform module; Figure 5 It is a schematic structural diagram of the soldering platform module from another angle; Figure 6 It is a schematic structural diagram of the soldering platform driving base; Figure 7 It is a schematic structural diagram of the installation of the soldering platform plate and the soldering platform seat; Figure 8 It is the front view of the installation of the soldering platform plate and the soldering platform seat; Figure 9 It is a schematic structural diagram of the feeding and pushing component; Figure 10 It is another schematic structural diagram of the feeding and pushing component; Figure 11 It is the top view of the feeding and pushing component; Figure 12 It is a schematic structural diagram of the discharging and pushing component; Figure 13 It is another schematic structural diagram of the discharging and pushing component; Figure 14 It is the front view of the discharging and pushing component; Figure 15 It is the top view of the discharging and pushing component.

[0019] The reference numerals are as follows in sequence: Base 1, slide rail device 11, chip placement table 12, moving crossbeam 13, chip mounter head assembly 14, feeding module 2, feeding conveyor belt assembly 21, feeding pusher assembly 22, feeding deflector 23, pressing base 24, lever 25, pusher cylinder 26, feeding pusher plate 27, deflector connecting plate 28, deflector spring 281, spring plate 282, soldering station module 3, enclosing shell 31, soldering station plate 32, soldering station vertical plate 321, soldering station base 33, soldering station sealing assembly 34, lifting track assembly 35, track plate 351, lifting vertical plate 352, lifting track cylinder 353, abutting block 354, sealing cylinder 36, sealing plate 37, soldering station linear module slider 38, soldering station linear module 381, soldering station drive base 39, soldering station drive motor 391, soldering station ball screw 392, discharging module 4, discharging conveyor belt assembly 41, discharging pusher assembly 42, discharging motor 43, discharging synchronous belt 44, discharging synchronous assembly 45, discharging synchronous seat 451, slide table cylinder 452, slide table output seat 453, pusher sensor 454, pulling detection base 455, pulling sensor 456, first slide table guide rail 457, discharging fixing plate 46, synchronous belt pulley 47, deflector mounting seat 48, discharging deflector 481, outer cover 5. Detailed implementation

[0020] The present invention will be further described in detail below with reference to the accompanying drawings.

[0021] A die bonding device, as Figures 1 - 3 shown, includes: Base 1, on which two slide rail devices 11 are oppositely arranged along the second direction, a moving crossbeam 13 is slidably installed between the two slide rail devices 11, the moving crossbeam 13 is arranged in the first direction of the base 1, and the moving crossbeam 13 is installed with a chip mounter head assembly 14 for chip mounter; Feeding module 2, which is arranged on the base 1 and located in the first direction; Soldering station module 3 arranged at the downstream position of the feeding module 2, the soldering station module 3 is located below the chip mounter head assembly 14, and the soldering station module 3 is used for processing materials; and Discharging module 4 arranged at the downstream position of the soldering station module 3, the discharging module 4 is used for receiving materials from the soldering station module 3; Wherein, the base 1 is further fixed with an outer cover 5 covering the soldering station module 3, the outer cover 5 can introduce atmosphere gas, the outer cover 5 is provided with a chip mounter hole and the outer cover 5 covers the material to be processed to form a closed processing space.

[0022] According to a specific embodiment provided by the present invention, in the present invention, the base 1 is horizontally arranged, the second direction is the Y-axis direction of the base 1, the first direction is the X-axis direction of the base 1, the height direction (third direction) of the base 1 is the Z-axis direction, and two slide rail devices 11 are arranged at the upper part of the base 1 near the two sides. Specifically, the slide rail device 11 can adopt the existing gantry axis structure, and the slide rail device 11 drives the moving beam 13 to move in the second direction. The moving beam 13 is equipped with a patch head assembly 14 for patch. The patch head assembly 14 adopts an existing structure, such as a patch head that can move in the height direction of the base 1.

[0023] One side of the base 1 is the feed side, and the other side is the discharge side. The feed side is installed with a feed module 2, which is used to transport materials to the soldering station module 3. The material transported by the feed module 2 is the substrate to be processed. A chip placement table 12 is also installed on the top of the base 1. The chip placement table 12 is used to place the chip to be used. When in use, it is taken by the patch head assembly 14 and moved to the top of the substrate to be processed of the soldering station module 3 for patching.

[0024] The soldering station module 3 is installed on the base 1 and is used to process materials. The soldering station module 3 can be fed with atmospheric gas. The discharging module 4 is installed on the discharging side of the base 1. The discharging module 4 is used to receive the materials processed by the soldering station module 3. The soldering station module 3 includes an outer cover 5. The outer cover 5 is fixed on the base 1 by bolts. A patch hole is opened in the middle of the outer cover 5. The patch hole is used for the patch head assembly 14 to be inserted and patched with the substrate material. The outer cover 5 covers the other parts of the soldering station module 3 and cooperates with the base 1 to form a relatively closed processing space.

[0025] During processing, after the soldering station module 3 is heated and reaches the working temperature, the soldering station module 3 moves so that the position on the substrate where the patch is required is aligned with the patch hole in the middle of the outer cover 5, and then the patch head assembly 14 sucks the chip to the patch hole position for patch operation, and then the soldering station module 3 aligns the next patch station of the substrate with the patch hole, and the above process is repeated until the entire substrate is completed.

[0026] Furthermore, if Figures 4 - 8 As shown, the soldering station module 3 further includes a soldering station assembly, a first direction driving assembly and a second direction driving assembly arranged in the outer cover 5; Among them, the second direction driving component is fixedly installed on the base 1, the first direction driving component and the second direction driving component are transmission-coordinated, the second direction driving component is used to drive the first direction driving component to move along the second direction, the first direction driving component is transmission-connected to the welding platform component, and the first direction driving component is used to drive the welding platform component to move in the first direction.

[0027] According to a specific embodiment provided by the present invention, this embodiment provides a specific structure of a soldering station module 3. The second-direction driving component is fixedly installed on the base 1. The second-direction driving component is used to drive the first-direction driving component to move in the second direction. The first-direction driving component is equipped with a soldering component, and the first-direction driving component is used to drive the soldering station component to move in the first direction.

[0028] Further, the soldering station component includes an enclosing shell 31, a soldering station plate 32, a soldering station base 33, a soldering station sealing component 34, and a lifting track component 35. A soldering station vertical plate 321 is fixed to the upper part of the soldering station base 33. The soldering station vertical plate 321 is fixed to the lower part of the soldering station plate 32 and is distributed around the soldering station plate 32. The enclosing shell 31 is disposed outside the soldering station vertical plate 321 and is fixedly connected to the soldering station base 33; There are two soldering station sealing components 34, which are respectively installed on the soldering station base 33. The soldering station sealing components 34 are disposed on both sides of the soldering station vertical plate 321 and are located in the second direction of the base 1. The lifting track component 35 is installed on the soldering station base 33. The lifting track component 35 is used to transport the material. The lifting track component 35 is disposed in the first direction of the base 1.

[0029] According to a specific embodiment provided by the present invention, the atmosphere gas in this embodiment is nitrogen. The enclosing shell 31 is of a frame structure. A nitrogen access hole is opened outside the enclosing shell 31. The soldering station plate 32 is of a rectangular flat plate structure. The specific structure of the soldering station vertical plate 321 in this embodiment is not limited, as long as the soldering station plate 32 can be actually installed on the soldering station base 33.

[0030] The soldering station plate 32 is located in the middle of the enclosing shell 31, and the soldering station vertical plate 321 is fixed to the lower part around the soldering station plate 32. The soldering station base 33 is installed with the soldering station sealing component 34 on the side in the direction of material input and output. The soldering station sealing component 34 functions to isolate the soldering space from the external environment in the second direction of the soldering station plate 32. The lifting track component 35 is installed on the soldering station base 33. The lifting track component 35 is correspondingly arranged with the feeding module 2. The lifting track component 35 is used to dock the material from the feeding module 2 to form a limit. When the lifting track component 35 rises and the soldering station sealing component 34 descends, waiting for the material to enter the soldering station module 3. When the material enters the soldering station module 3, the lifting track component 35 descends, and the material (substrate) is placed on the soldering station plate 32. At this time, the soldering station sealing component 34 rises to cooperate with the outer cover 5 to isolate the soldering station from the external environment.

[0031] Further, the soldering station sealing assembly 34 includes a sealing cylinder 36 and a sealing plate 37 disposed in the third direction of the base 1. The sealing cylinder 36 is fixed to one side of the soldering station seat 33, and the output end of the sealing cylinder 36 is connected to the sealing plate 37. The length of the sealing plate 37 matches the length of the groove formed in the surrounding shell 31, so that a sealing structure can be formed in cooperation with the surrounding shell 31 and the outer cover 5 after the sealing plate 37 is lifted.

[0032] According to a specific embodiment provided by the present invention, the sealing cylinder 36 is vertically installed. The sealing cylinder 36 adopts a slide table cylinder 452. The surrounding shell 31 is provided with a groove to allow the material to pass through. The sealing plate 37 is a plate body structure with an "L" - shaped cross - section. One side is fixed to the output end of the sealing cylinder 36, and the other side is close to the soldering station and located at the groove formed in the surrounding shell 31.

[0033] Further, the lifting track assembly 35 includes a track plate 351, a lifting vertical plate 352, a lifting track cylinder 353, and a jacking spring (not visible in the figure). The track plates 351 are distributed in the first direction of the base 1 and are located on one side of the soldering station plate 32. Two mutually parallel lifting track sliders are slidably connected to one side of the track plate 351. The lifting track sliders are slidably connected to the lifting track slide rails fixed on the lifting vertical plate 352. The lifting vertical plate 352 is fixedly arranged on the soldering station seat 33. Among them, the jacking spring is installed at the lower part of the opening in the middle of the lifting vertical plate 352. Under the action of the jacking spring, the track plate 351 has a tendency to move away from the soldering station seat 33. The lifting track cylinder 353 is fixed at the upper part of the opening in the middle of the lifting vertical plate 352. The output end of the lifting track cylinder 353 abuts against the track plate 351, so that the track plate 351 can move closer to the soldering station seat 33 after the lifting track cylinder 353 works.

[0034] According to a specific embodiment provided by the present invention, the track plate 351 is a long - strip plate body structure. The track plate 351 is provided with a groove - type structure for the substrate to enter. A chamfer structure is arranged at the feeding direction of the track plate 351 to facilitate the entry of the material, thereby playing a role in limiting.

[0035] The lifting track slider is slidably connected to the lifting track slide rail on the lifting vertical plate 352, enabling the track plate 351 to move linearly up and down. The lifting vertical plate 352 is vertically fixed on the soldering station base 33. On the side of the lifting vertical plate 352 facing the soldering station plate 32, the lifting track slide rail is fixed. There is an opening in the middle of the lifting vertical plate 352. A jacking spring (not visible in the figure) is installed at the lower part of the opening. The lifting track cylinder 353 is fixed in the middle of the opening. The track plate 351 is equipped with an abutting block 354. The abutting block 354 extends into the opening in the middle of the lifting vertical plate 352. The jacking spring is located below the abutting block 354. The jacking spring is a compression spring. Under the action of the jacking spring, the track plate 351 can be jacked up. The output end of the lifting track cylinder 353 abuts against one side of the abutting block 354. In this way, when the lifting track cylinder 353 works, it can push the abutting block 354 to move the track plate 351 downward, so that the material can be placed on the soldering station plate 32.

[0036] Further, the first-direction driving component includes a slider 38 of the soldering station linear module 381 and the soldering station linear module 381 installed in the first direction. The upper part of the slider 38 of the soldering station linear module 381 is fixedly connected to the soldering station linear module 381. The soldering station linear module 381 is in transmission connection with the soldering station base 33. The second-direction driving component includes a soldering station driving base 39, a soldering station driving motor 391, and a soldering station ball screw 392 arranged in the second direction of the base 1. The soldering station driving motor 391 is in transmission connection with the soldering station ball screw 392. The end of the soldering station ball screw 392 is connected to the slider 38 of the soldering station linear module 381.

[0037] According to a specific embodiment provided by the present invention, this embodiment provides a specific structure of the first-direction driving component and the second-direction driving component. The soldering station linear module 381 is used to drive the soldering station base 33 to move in the first direction. The soldering station linear module 381 adopts an existing linear module structure. The soldering station driving base 39 is fixed on the base 1. One end of the soldering station ball screw 392 is equipped with a soldering station driving motor 391. The soldering station driving motor 391 is fixed on the side of the soldering station driving base 39. Parallel slide rails are arranged on both sides of the soldering station ball screw 392. The slider 38 of the soldering station linear module 381 is slidably matched with the two slide rails. The soldering station linear module 381 is fixed on the upper part of the slider 38 of the soldering station linear module 381.

[0038] Further, as Figures 9 - 11As shown, the feeding module 2 includes a feeding conveyor belt assembly 21 and a feeding pusher assembly 22 mounted on the base table 1. The feeding pusher assembly 22 includes a pusher cylinder 26, a feeding deflector 23 and a pressing member. The pusher cylinder 26 is arranged along the material moving direction. The pusher cylinder 26 is fixed on the feeding pusher plate 27. The feeding pusher plate 27 is fixedly arranged on the feeding conveyor belt assembly 21. The output end of the pusher cylinder 26 is rotatably installed with the feeding deflector 23. Driven by the pusher cylinder 26, the feeding deflector 23 can move along the first direction of the base table 1. The pressing member is fixed in the middle of the feeding pusher plate 27, so that when the feeding deflector 23 moves to the position of the pressing member, the feeding deflector 23 can abut against the pressing member and rotate by a certain angle.

[0039] According to a specific embodiment provided by the present invention, the feeding conveyor belt assembly 21 is fixed on the base table 1. The feeding conveyor belt assembly 21 can adopt an existing conveyor belt structure and is set according to the width of the substrate. The feeding pusher assembly 22 is installed between the feeding conveyor belt assemblies 21 and is located below the passing material.

[0040] The feeding pusher plate 27 is of a long plate structure. The pusher cylinder 26 is installed on the feeding pusher plate 27. The pusher cylinder 26 adopts an existing rodless cylinder, and the rodless cylinder can adopt the CY3B rodless cylinder produced by SMC Corporation. The pusher cylinder 26 is fixedly installed on the feeding pusher plate 27 along the length direction of the feeding conveyor belt assembly 21. The feeding deflector 23 is rotatably installed at the output end of the upper part of the pusher cylinder 26 through a deflector connecting plate 28. The feeding deflector 23 is of an "N"-shaped hook structure. The feeding deflector 23 is rotatably installed on the deflector connecting plate 28. A deflector spring 281 is installed on the deflector connecting plate 28. One side of the feeding deflector 23 abuts against one end of the deflector spring 281, and the other end of the deflector spring 281 is fixedly installed with a spring plate 282. The deflector spring 281 is a compression spring. Under the action of the deflector spring 281, the end of the feeding deflector 23 can be set upward so that the upper end of the feeding deflector 23 can be caught in the edge of the lower part of the material (the edge of the material tray). Driven by the pusher cylinder 26, the feeding deflector 23 can move along the first direction of the base table 1, so as to move the material to the soldering table plate 32 of the soldering table module 3.

[0041] Furthermore, the pressing component includes a pressing seat 24 and a lever 25 fixed on the pressing seat 24. The pressing seat 24 is fixed in the middle of the feed push plate 27. The pressing seat 24 extends away from the feed push plate 27 to form a mounting structure. The lever 25 is fixed at the mounting structure. The lever 25 is horizontally arranged and extends to the top of the push cylinder 26. In order to facilitate the feed paddle 23 to extend under the material, the pressing component is fixed in the middle of the feed push plate 27. When the push cylinder 26 drives the feed paddle 23 to move to the pressing component, the feed paddle 23 can be abutted against the pressing component and then rotated to a certain angle. Specifically, the pressing seat 24 is fixed in the middle of the feed push plate 27. The pressing seat 24 extends in the height direction to form a mounting structure. The lever 25 is horizontally arranged and extends to the top of the push cylinder 26 to correspond to the feed paddle 23.

[0042] Furthermore, if Figures 12 - 15 As shown, the discharging module 4 includes a discharging conveyor belt assembly 41 and a discharging pushing assembly 42 installed on the base 1, and the discharging pushing assembly 42 includes a discharging motor 43, a discharging synchronous belt 44, a discharging synchronous assembly 45 and a discharging fixing plate 46; Among them, the discharging fixed plate 46 is fixedly installed on the discharging conveyor belt assembly 41, and the discharging motor 43 is installed at one end of the discharging fixed plate 46. The discharging synchronous belt 44 is arranged along the material moving direction, and the discharging synchronous belt 44 is transmission-connected with the discharging motor 43. The discharging synchronous component 45 is fixed on the upper part of the discharging synchronous belt 44. The discharging synchronous component 45 is also slidingly connected with the discharging slide rail on the discharging fixed plate 46. The discharging synchronous component 45 is fixed with a discharging paddle 481, and the discharging paddle 481 is used to push out the processed material. Driven by the discharging motor 43, the discharging synchronous component 45 can move along the first direction of the base 1.

[0043] According to a specific embodiment provided by the present invention, the discharge conveyor belt assembly 41 is fixed on the base 1, and the discharge conveyor belt assembly 41 can adopt the existing conveyor belt structure, and the discharge conveyor belt assembly 41 is set according to the position on the base plate. In order to better remove the processed materials from the welding table plate 32, this embodiment provides a specific structure of the discharge pusher assembly 42, which is installed between the discharge conveyor belt assemblies 41 and is located below the passing materials.

[0044] The discharge fixed plate 46 is fixedly installed inside the discharge conveyor belt assembly 41. The discharge fixed plate 46 adopts a long plate seat structure to facilitate the installation of the discharge synchronous belt 44. An output motor 43 is installed at one end of the discharge fixed plate 46 where the material enters. The discharge synchronous belt 44 has a structure with limit teeth on one side. The discharge synchronous belt 44 is fixedly installed with the discharge synchronous component 45 through the limit teeth. A synchronous belt pulley 47 is installed at the other end of the discharge fixed plate 46. The discharge synchronous belt 44 is rotationally matched with the synchronous belt pulley 47. In this way, when the discharge motor 43 works, it drives the discharge synchronous component 45 to move through the discharge synchronous belt 44. An output dial 481 is installed on the upper part of the discharge synchronous component 45. The output dial 481 has a finger-shaped structure. One end of the output dial 481 extends upward. The output dial 481 can move the material out of the soldering table plate 32 and then continue to output and move forward through the discharge conveyor belt assembly 41.

[0045] Further, the discharge synchronous component 45 includes a discharge synchronous seat 451 fixedly connected to the discharge synchronous belt 44, a slide table cylinder 452, and a discharge overload detection component. Among them, the slide table cylinder 452 is fixed on the discharge synchronous seat 451. A slide table output seat 453 is fixed to the output end of the slide table cylinder 452. The discharge overload detection component is fixed to the slide table output seat 453. The discharge overload detection component is fixedly installed with the output dial 481. The slide table cylinder 452 is used to drive the discharge overload detection component to move in the third direction.

[0046] According to a specific embodiment provided by the present invention, the discharge synchronous belt 44 works under the drive of the discharge motor 43. At the same time, the discharge synchronous belt 44 drives the discharge synchronous seat 451 to move along the discharge slide rail. The slide table cylinder 452 is installed in the height direction. The slide table cylinder 452 can make the output dial 481 move in the height direction, so that the output dial 481 can be conveniently stuck at the corresponding position of the substrate material carrier to pull or push the substrate material carrier forward. The slide table output seat 453 is fixed with a discharge overload detection component. When the substrate material carrier is blocked and stuck during the movement process, after the discharge overload detection component detects this process, it transmits a signal to the electrical control system, and then the electrical control system sends a signal to stop the discharge motor 43 from working.

[0047] Specifically, the discharge overload detection component includes a material pushing detection structure and a material pulling detection structure. A first slide table guide rail 457 is installed on the slide table output seat 453. The first slide table guide rail 457 is slidably connected to the material pushing detection structure. The output dial 481 is fixed to the material pulling detection structure.

[0048] The pusher detection structure includes a pusher spring and a pusher sensor 454. The pulling detection structure is slidably connected to the first slide rail 457. The pusher sensor 454 is installed on the slide output seat 453. Under the action of the pusher spring, the pulling detection structure has a tendency to move away from the pusher sensor 454. The pusher spring is not visible in the figure.

[0049] The pulling detection structure includes a pulling detection base 455, a pulling spring, and a pulling sensor 456. The first slide rail 457 is slidably connected to the pulling detection base 455. A second slide rail is fixedly installed on the pulling detection base 455. A dial plate mounting seat 48 is slidably connected to the second slide rail. The pulling sensor 456 is installed on the pulling detection base 455. One end of the pulling spring abuts against the pulling detection base 455, and the other end abuts against the dial plate mounting seat 48. Under the action of the pulling spring, the dial plate mounting seat 48 has a tendency to move away from the pulling sensor 456. The pulling spring is not visible in the figure.

[0050] The pusher detection structure and the pulling detection structure can be respectively used to detect whether the substrate material stage is blocked and stuck during the movement in the pusher and pulling processes. The second slide rail and the first slide rail 457 adopt the structure of linear rails. The pusher spring and the pulling spring are both compression springs. The specific structures of the pulling detection base 455 and the dial plate mounting seat 48 are not limited here. The pusher sensor 454 and the pulling sensor 456 are both photoelectric sensors. A light blocking piece is installed on the pulling detection base 455 and the dial plate mounting seat 48. After the pulling detection base 455 and the dial plate mounting seat 48 move against the pusher spring or the pulling spring, the light blocking piece correspondingly inserts into the pusher sensor 454 and the pulling sensor 456 to generate a signal.

[0051] The specific working process is as follows: The chip substrate material enters the feeding conveyor belt assembly 21 from the left side of the die bonding device. At this time, the soldering table module 3 will move to the corresponding position to dock with the chip substrate, and the sealing plate 37 at the feeding position on the soldering table module 3 will be at a low position, and the track plate 351 will rise. When the chip substrate is transmitted through the feeding pusher 23 of the feeding conveyor belt assembly 21, the feeding pusher 23 will completely push the chip substrate into the soldering table module 3. Then the track plate 351 will descend, allowing the chip substrate to fall on the soldering table plate 32 and be fixed by vacuum suction. Then the sealing plate 37 at the feeding position of the soldering table plate 32 will rise. At this time, the soldering station part will form a relatively airtight cavity with the outer cover 5. Then, nitrogen is introduced into the entire outer cover 5, and the soldering station board 32 starts to heat up. When the working temperature is reached, the first-direction driving component and the second-direction driving component work, so that the position on the chip substrate where the material needs to be pasted is aligned with the chip placement hole in the middle of the outer cover 5. Then, the chip placement head sucks the chip from the chip placement table 12 to the material pasting station for the pasting operation. After that, the soldering station module 3 aligns the next station of the chip substrate with the opening, and cycles in sequence until the entire chip substrate is pasted. After the entire chip substrate is completed, the vacuum of the soldering station board 32 is disconnected. Then, the track board 351 will rise and the sealing plate 37 on the discharging side of the soldering station module 3 will lower its height. Then, the discharging module 4 will first hook out the chip substrate from the soldering station module 3, and finally cooperate with the discharging conveyor belt component 41 to push out the chip substrate.

[0052] Finally, it should be noted that in the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0053] In the description of the present invention, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A die bonding device, characterized in that: include: A base, wherein two slide rail devices are arranged on the base in a second direction relative to each other, a moving beam is slidably installed between the two slide rail devices, the moving beam is arranged in the first direction of the base, and a patch head assembly for patch is installed on the moving beam; A feeding module, which is disposed on the base and located in a first direction; A soldering station module disposed at a downstream position of the feeding module, the soldering station module is located below the patch head assembly, and the soldering station module is used for processing materials; and A discharging module disposed at a downstream position of the soldering station module, the discharging module is used to receive materials from the soldering station module; The base is also fixed with an outer cover covering the outside of the soldering station module, the outer cover can be passed with atmospheric gas, the outer cover is provided with patch holes and the outer cover is covered outside the material to be processed to form a closed processing space.

2. A die bonding device according to claim 1, characterized in that: The soldering station module also includes a soldering station assembly, a first direction driving assembly and a second direction driving assembly arranged in the outer cover; Among them, the second direction driving component is fixedly installed on the base, the first direction driving component is transmission-coordinated with the second direction driving component, the second direction driving component is used to drive the first direction driving component to move along the second direction, the first direction driving component is transmission-connected to the welding platform component, and the first direction driving component is used to drive the welding platform component to move in the first direction.

3. A die bonding device according to claim 2, characterized in that: The welding platform assembly includes a surrounding shell, a welding platform plate, a welding platform seat, a welding platform sealing assembly and a lifting track assembly. A welding platform vertical plate is fixed on the upper part of the welding platform seat. The welding platform vertical plate is fixed to the lower part of the welding platform plate and distributed around the welding platform plate. The surrounding shell is arranged outside the welding platform vertical plate and is fixedly connected to the welding platform seat. There are two welding platform sealing assemblies, which are respectively installed on the welding platform seat. The welding platform sealing assemblies are arranged on both sides of the welding platform vertical plate and are located in the second direction of the base. The lifting rail assembly is installed on the welding platform seat. The lifting rail assembly is used to transport the material, and the lifting rail assembly is arranged in the first direction of the base.

4. A die bonding device according to claim 3, characterized in that: The welding platform sealing assembly includes a sealing cylinder and a sealing plate arranged in the third direction of the base, the sealing cylinder is fixed to one side of the welding platform seat, the sealing plate is connected to the output end of the sealing cylinder, the length of the sealing plate matches the length of the groove opened in the surrounding shell, so that the sealing plate can cooperate with the surrounding shell and the outer cover to form a sealing structure after being raised.

5. The die bonding device according to claim 4, characterized in that: The lifting track assembly includes a track plate, a lifting vertical plate, a lifting track cylinder and a lifting spring. The track plate is distributed in the first direction of the base and is located on one side of the welding table plate. One side of the track plate is slidably connected to two lifting track slides arranged parallel to each other. The lifting track slide is slidably connected to the lifting track slide rail fixed on the lifting vertical plate. The lifting vertical plate is fixed on the welding table seat. Among them, the lifting spring is installed at the lower part of the middle opening of the lifting vertical plate, and under the action of the lifting spring, the track plate can have a tendency to move away from the welding base. The lifting track cylinder is fixed at the upper part of the middle opening of the lifting vertical plate, and the output end of the lifting track cylinder is in contact with the track plate, so that the track plate can be moved closer to the welding base after the lifting track cylinder works.

6. A die bonding device according to any one of claims 2 to 5, characterized in that: The first direction driving assembly comprises a welding station linear module slide and a welding station linear module installed in the first direction, the upper part of the welding station linear module slide is fixedly connected to the welding station linear module, and the welding station linear module is transmission-connected to the welding station seat; The second direction driving component includes a welding platform driving base, a welding platform driving motor and a welding platform ball screw arranged in the second direction of the base. The welding platform driving motor is transmission-connected to the welding platform ball screw, and the end of the welding platform ball screw is connected to the welding platform linear module slide.

7. A die bonding device according to claim 1 or 6, characterized in that: The feeding module comprises a feeding conveyor belt assembly and a feeding pushing assembly mounted on a base, the feeding pushing assembly comprises a pushing cylinder, a feeding paddle and a pressing component, the pushing cylinder is arranged along the material moving direction, the pushing cylinder is fixed on the feeding pushing plate, the feeding pushing plate is fixedly arranged on the feeding conveyor belt assembly, the feeding paddle is rotatably mounted on the output end of the pushing cylinder, and the feeding paddle can move along the first direction of the base under the driving of the pushing cylinder; The pressing component is fixed at the middle part of the feed push plate, so that when the feed paddle moves to the pressing component, the feed paddle can abut against the pressing component and then rotate at a certain angle.

8. The die bonding device according to claim 7, characterized in that: The pressing component includes a pressing seat and a lever fixed on the pressing seat. The pressing seat is fixed in the middle of the feed pushing plate. The pressing seat extends away from the feed pushing plate to form a mounting structure. The lever is fixed at the mounting structure. The lever is horizontally arranged and extends above the pushing cylinder.

9. A die bonding device according to claim 1 or 8, characterized in that: The discharging module comprises a discharging conveyor belt assembly and a discharging pushing assembly mounted on a base, wherein the discharging pushing assembly comprises a discharging motor, a discharging synchronous belt, a discharging synchronous assembly and a discharging fixing plate; Among them, the discharging fixed plate is fixedly installed on the discharging conveyor belt assembly, the discharging motor is installed at one end of the discharging fixed plate, the discharging synchronous belt is arranged along the material moving direction, the discharging synchronous belt is transmission connected with the discharging motor, the discharging synchronous belt is fixed on the upper part of the discharging synchronous belt, and the discharging synchronous assembly is also slidingly connected with the discharging slide rail on the discharging fixed plate, the discharging synchronous assembly is fixed with a discharging paddle plate, the discharging paddle plate is used to push out the processed material, and the discharging synchronous assembly can move along the first direction of the base under the drive of the discharging motor.

10. The die bonding device according to claim 9, characterized in that: The discharging synchronization component includes a discharging synchronization seat, a slide cylinder and a discharging overload detection component which are fixedly connected to the discharging synchronization belt; wherein, the slide cylinder is fixed on the discharging synchronization seat, a slide output seat is fixed on the output end of the slide cylinder, the discharging overload detection component is fixed on the slide output seat, the discharging overload detection component is fixedly installed with the discharging dial plate, and the slide cylinder is used to drive the discharging overload detection component to move in a third direction.

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