An antistatic integrated circuit chip packaging device

Abstract

The present invention discloses an antistatic integrated circuit chip packaging device, which relates to the technical field of integrated circuit chip processing. The present invention includes a workbench, an ion blower, and a plurality of chip bodies, and further includes: a chip placement part for placing the plurality of chip bodies. The chip placement part includes a carrier installed on the workbench, and a plurality of alignment grooves matching the corresponding chip bodies are formed on the carrier. An adsorption component matching the plurality of chip bodies is also installed on the carrier; a lithography part for performing a redistribution layer process on the plurality of chip bodies. The advantages are as follows: Through the downward movement process of the moving cover, the present invention can automatically and orderly complete the adsorption and fixation of the chip bodies, the stirring, spraying, and scraping of epoxy resin, ensuring the stability of the chip bodies during the packaging process and the uniformity of epoxy resin filling, effectively ensuring the overall packaging effect and improving the overall packaging efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit chip processing, and particularly relates to an antistatic integrated circuit chip packaging device. Background Art

[0002] An integrated circuit chip is an electronic device that integrates a large number of tiny electronic components, such as transistors, resistors, capacitors, etc., on a small semiconductor silicon wafer through semiconductor manufacturing technology. It can achieve the miniaturization and light weight of electronic circuits, greatly improve the performance and reliability of electronic devices, and reduce costs at the same time. During the production process of integrated circuit chips, packaging is an important link in the integrated circuit manufacturing process, which involves connecting the integrated circuit chip (bare chip) to external leads and protecting the chip from physical and chemical damage.

[0003] Currently, for small-sized chips, the fan-out packaging process is generally adopted. During operation, the wafer is first cut into multiple chips, and then the cut chips are arranged on the carrier in the shape of a wafer, and the gaps between the chips are filled with epoxy resin. After that, each chip is processed using the redistribution layer technology, and finally, the chip finished product with a protective shell can be obtained. However, when the current packaging device fills epoxy resin, it is difficult to keep the position of the chips on the carrier unchanged, and at the same time, the uniformity of the epoxy resin filling cannot be ensured, which affects the overall chip quality. Therefore, it is necessary to design an antistatic integrated circuit chip packaging device. Summary of the Invention

[0004] Aiming at the deficiencies of the prior art, the present invention provides an antistatic integrated circuit chip packaging device, which solves the problems raised in the above background art.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] An antistatic integrated circuit chip packaging device includes a workbench, an ion blower, and a plurality of chip bodies, and further includes:

[0007] A chip placement part for placing a plurality of chip bodies. The chip placement part includes a carrier installed on the workbench. The carrier is provided with a plurality of alignment grooves adapted to the corresponding chip bodies, and the carrier is further installed with an adsorption component adapted to the plurality of chip bodies;

[0008] A lithography part for performing redistribution layer processing on a plurality of chip bodies. The lithography part includes a mounting frame fixedly installed on the workbench, and a moving cover is installed on the mounting frame through a telescopic cylinder. The ion blower is fixedly installed on the moving cover, and a lithography component adapted to the plurality of chip bodies is installed on the moving cover;

[0009] Spraying section, the spraying section is used to spray epoxy resin on a plurality of chip bodies placed on a carrier. The spraying section includes two storage cylinders fixedly installed on the top of the moving cover, and output pipes are fixedly connected between the two storage cylinders and the inner wall of the moving cover. Output components are installed between the mounting frame and the two storage cylinders. A positioning component for driving the adsorption component is also installed on the moving cover;

[0010] Smoothing section, the smoothing section is used to smooth the sprayed epoxy resin. The smoothing section includes a rotating rod rotatably connected to the moving cover, and a foam squeegee is slidably installed at one end of the rotating rod located inside the moving cover. A driving component that cooperates with the rotating rod and the positioning component is installed on the moving cover.

[0011] Further, the adsorption component includes a positioning ring slidably installed on the workbench. A plurality of pistons are fixedly installed on the upper surface of the positioning ring. Adsorption holes that are hermetically slidably matched with the corresponding pistons are opened on the side walls of each positioning groove. Two second tension springs are installed between the positioning ring and the bottom of the carrier. A plurality of grooves are opened on the side wall of the carrier. A plurality of convex blocks that are slidably matched with the corresponding grooves are fixedly installed on the positioning ring.

[0012] Further, the lithography component includes a lithography machine. A servo motor is fixedly installed on the moving cover, and the output end of the servo motor is fixedly connected to an electric telescopic rod. The output end of the electric telescopic rod is fixedly installed with a cross beam, and a chute is opened on the cross beam. A slider fixedly connected to the lithography machine is slidably installed in the chute. A moving motor is fixedly installed on the side wall of the cross beam, and the output end of the moving motor is fixedly connected to a lead screw that is threadedly connected to the slider.

[0013] Further, a rotating motor is fixedly installed at the bottom of the workbench, and the output end of the rotating motor passes through the workbench and the positioning ring and is fixedly connected to the bottom of the carrier. Two guide sleeves are fixedly installed on the side wall of the moving cover. Two guide columns that are slidably matched with the corresponding guide sleeves are fixedly installed on the workbench.

[0014] Further, the output component includes a pull rod fixedly installed on the mounting frame, and a connecting rod is slidably installed at the bottom of the pull rod. A fixed column is hermetically slidably installed on the storage cylinder, and a sealing plate that is hermetically slidably matched with the inside of the storage cylinder is fixedly installed at the bottom of the fixed column. A plurality of stirring blades are also fixedly installed on the side wall of the end of the fixed column located inside the storage cylinder. A convex rod is fixedly installed on the side wall of the connecting rod. A second spiral groove that cooperates with the convex rod is opened on the inner wall of the fixed column.

[0015] Further, the alignment component includes a lifting ring slidably installed inside the moving cover, and the lifting ring corresponds to the alignment ring in position. A plurality of lifting blocks are fixedly installed on the side wall of the lifting ring. A plurality of lifting grooves slidably matched with the corresponding lifting blocks are formed on the inner wall of the moving cover, and a compression spring is installed between each lifting groove and the corresponding lifting block.

[0016] Further, the driving component includes a rotating sleeve and a connecting shaft rotatably installed on the moving cover. A fixed gear ring is fixedly installed on the rotating sleeve. A connecting gear ring meshing with the fixed gear ring is rotatably installed on the connecting shaft through a one-way bearing, and a belt transmission structure is installed between the connecting shaft and the rotating rod. A guide rod is fixedly installed on the top of one of the lifting blocks through a plug rod. A first spiral groove matched with the guide rod is formed on the inner wall of the rotating sleeve.

[0017] Further, a T-shaped groove is formed at the bottom of the rotating rod. A T-shaped rod slidably matched with the T-shaped groove is fixedly installed on the top of the foam squeegee. A round rod is fixedly installed at the bottom of the pull rod. A telescopic groove matched with the round rod is formed on the connecting rod, and a first tension spring is installed between the telescopic groove and the round rod.

[0018] Further, the depth of the T-shaped groove is less than the telescopic length of the electric telescopic rod, the depth of the telescopic groove is greater than the maximum distance between the stirring blade and the upper surface of the storage cylinder, the height of the second spiral groove is greater than or equal to the maximum distance between the alignment ring and the lifting ring, and the maximum distance between the guide rod and the bottom of the rotating sleeve is less than the depth of the lifting groove.

[0019] Compared with the existing technology, the advantages of the present invention are as follows:

[0020] 1: Through the cooperation of the adsorption component and a plurality of alignment grooves, a plurality of chip bodies can be effectively positioned and fixed on the carrier, ensuring their stability during the encapsulation process, and avoiding the position deviation of the chip bodies caused by contact during the encapsulation process, which affects the overall encapsulation effect;

[0021] 2: Through the cooperation of the spraying part and the scraping part, epoxy resin can be evenly filled on the carrier during the encapsulation process, so that it is evenly filled between a plurality of chip bodies, ensuring that the area of the formed protective shell is consistent, thereby ensuring that the overall chip quality after encapsulation remains consistent;

[0022] 3: Through the cooperation of the alignment component and the driving component, as the moving cover continuously moves downward, the adsorption and fixation of the chip body, the spraying of epoxy resin, and the scraping treatment can be automatically and orderly completed without the need for separate control by the staff. The automation production effect is achieved by a simple structure, and the production cost can be reduced;

[0023] 4: Through the design of the output component, as the moving cover moves downward, the stirring, spraying, and stopping of spraying of epoxy resin can be automatically completed in coordination with the overall process, enabling the entire encapsulation process to be completed in an orderly manner, ensuring the overall encapsulation effect, and improving the overall encapsulation efficiency.

[0024] In summary, through the downward movement process of the moving cover, the present invention can automatically and orderly complete the adsorption and fixation of the chip body, the stirring, spraying, and leveling of epoxy resin, ensuring the stability of the chip body and the uniformity of epoxy resin filling during the encapsulation process, effectively ensuring the overall encapsulation effect, and improving the overall encapsulation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic structural diagram of an antistatic integrated circuit chip encapsulation device proposed by the present invention;

[0026] Figure 2 is Figure 1 a schematic structural diagram from another perspective;

[0027] Figure 3 is Figure 2 a top view of

[0028] Figure 4 is Figure 3 a schematic structural diagram of the A-A plane in

[0029] Figure 5 is Figure 4 a schematic enlarged structural diagram of the a part in

[0030] Figure 6 is Figure 2 a schematic structural diagram of the structure at the workbench in

[0031] Figure 7 is Figure 2 a schematic exploded structural diagram of the structure at the carrier in

[0032] Figure 8 is Figure 2 a schematic structural diagram of the structure at the moving cover in

[0033] Figure 9 is Figure 8 an exploded structural diagram of

[0034] Figure 10 is Figure 9 a top view of the structure at the fixing column in

[0035] Figure 11 is Figure 10 a schematic structural diagram of the B-B plane in

[0036] Figure 12 is Figure 4Schematic enlarged view of the structure of part b in the middle.

[0037] In the figure: 1, workbench; 2, chip body; 3, carrier; 4, alignment groove; 5, guide post; 6, mounting bracket; 7, telescopic cylinder; 8, moving cover; 9, servo motor; 10, electric telescopic rod; 11, cross beam; 12, sliding groove; 13, slider; 14, lithography machine; 15, moving motor; 16, lead screw; 17, rotating motor; 18, storage cylinder; 19, output pipe; 20, pull rod; 21, fixed column; 22, sealing plate; 23, stirring blade; 24, convex rod; 25, connecting rod; 26, first tension spring; 27, rotating rod; 28, foam squeegee; 29, T-shaped rod; 30, T-shaped groove; 31, lifting groove; 32, lifting block; 33, lifting ring; 34, compression spring; 35, insertion rod; 36, rotating sleeve; 37, fixed gear ring; 38, connecting shaft; 39, one-way bearing; 40, connecting gear ring; 41, first spiral groove; 42, guide rod; 43, belt drive structure; 44, adsorption hole; 45, piston; 46, alignment ring; 47, convex block; 48, groove; 49, second tension spring; 50, guide sleeve. Detailed implementation manners

[0038] Referring to Figures 1 - 12 , an antistatic integrated circuit chip packaging device, including a workbench 1, an ion blower, and a plurality of chip bodies 2. The ion blower is fixedly installed on the moving cover 8. The ion blower is an existing product, and when it works, it can blow out a charged air flow to help eliminate the static electricity on the surface of the carrier 3, the moving cover 8, and the workbench 1 during the packaging process. At the same time, all tools, equipment, and workstations in the device that come into contact with the chip body 2 must be grounded to ensure that the static electricity can be effectively conducted away. And the operator needs to wear an antistatic bracelet and ensure good contact between the bracelet and the body. The bracelet is connected to the ground through a grounding wire to eliminate the static electricity on the human body. The entire packaging process should comply with the antistatic measure standards. The chip body 2 is a chip cut from a wafer, and further includes:

[0039] A chip placement part for placing a plurality of chip bodies 2. The chip placement part includes a carrier 3 installed on the workbench 1. A plurality of alignment grooves 4 matching the corresponding chip bodies 2 are formed on the carrier 3. Through the design of the alignment grooves 4, the placement position of the chip body 2 on the carrier 3 can be limited.

[0040] An adsorption component matched with a plurality of chip bodies 2 is further installed on the carrier 3. The adsorption component includes an alignment ring 46 slidably installed on the workbench 1. A plurality of pistons 45 are fixedly installed on the upper surface of the alignment ring 46. An adsorption hole 44 in sealed sliding fit with the corresponding piston 45 is formed on the side wall of each alignment groove 4. Two second tension springs 49 are installed between the alignment ring 46 and the bottom of the carrier 3. A plurality of grooves 48 are formed on the side wall of the carrier 3. A plurality of bumps 47 slidably matched with the corresponding grooves 48 are fixedly installed on the alignment ring 46. After the plurality of chip bodies 2 are placed in alignment on the carrier 3, when the alignment ring 46 moves downward relative to the carrier 3, the plurality of pistons 45 can be driven to move downward simultaneously. At this time, due to the sealing of the chip body 2 in the alignment groove 4, a negative pressure is generated in the adsorption hole 44, and then the chip body 2 can be firmly adsorbed on the carrier 3 to ensure its stability during the packaging process. The cooperation between the bump 47 and the groove 48 is used to limit the moving direction of the alignment ring 46 relative to the carrier 3. The design of the second tension spring 49 is used to keep the plurality of adsorption holes 44 at the bottom of the corresponding alignment grooves 4 when the alignment ring 46 is not under pressure, so as to ensure that after the chip body 2 is placed, the plurality of adsorption holes 44 can successfully complete the adsorption and fixation of the plurality of chip bodies 2 by moving the alignment ring 46 downward.

[0041] A lithography unit, which is used for performing a redistribution layer process on a plurality of chip bodies 2. The redistribution layer technology is an existing technology, so its specific working principle will not be elaborated here. The lithography unit includes a mounting frame 6 fixedly installed on the workbench 1. A moving cover 8 is installed on the mounting frame 6 through a telescopic cylinder 7. A lithography component matched with a plurality of chip bodies 2 is installed on the moving cover 8. The lithography component includes a lithography machine 14. A servo motor 9 is fixedly installed on the moving cover 8. The output end of the servo motor 9 is fixedly connected to an electric telescopic rod 10. The output end of the electric telescopic rod 10 is fixedly installed with a cross beam 11. A chute 12 is formed on the cross beam 11. A slider 13 fixedly connected to the lithography machine 14 is slidably installed in the chute 12. A moving motor 15 is fixedly installed on the side wall of the cross beam 11. The output end of the moving motor 15 is fixedly connected to a lead screw 16 threadedly connected to the slider 13. When the servo motor 9 works, the lithography machine 14 can be moved along the cross beam 11 through the cooperation between the lead screw 16 and the slider 13.

[0042] The lithography machine 14 is an existing product. It is mainly used on this device to perform a re-wiring layer process on the chip body 2 after being filled with epoxy resin. Therefore, its specific structure and working principle will not be elaborated here. After the epoxy resin is filled, the crossbeam 11 can be lowered by starting the electric telescopic rod 10 to move the lithography machine 14 to a certain height from the chip body 2. Then, through the cooperation of the servo motor 9 and the moving motor 15, the lithography machine 14 can be moved relative to multiple chip bodies 2. A rotating motor 17 is fixedly installed at the bottom of the workbench 1, and the output end of the rotating motor 17 passes through the workbench 1 and the alignment ring 46 to be fixedly connected to the bottom of the carrier 3. With the operation of the rotating motor 17, the lithography machine 14 can process any position of multiple chip bodies 2, ensuring the smooth completion of the re-wiring layer. Specifically, the electric telescopic rod 10 can adopt an electric telescopic rod of model YMD-608, and the rotating motor 17, the servo motor 9, and the moving motor 15 can all adopt servo motors of model ACM6004M2H.

[0043] Two guide sleeves 50 are fixedly installed on the side wall of the moving cover 8, and two guide columns 5 that are slidably matched with the corresponding guide sleeves 50 are fixedly installed on the workbench 1. The cooperation between the guide column 5 and the guide sleeve 50 is used to limit the moving direction of the moving cover 8 relative to the workbench 1. When the telescopic cylinder 7 operates, the moving cover 8 can move relative to the workbench 1, so that before the re-wiring layer is performed, the lithography machine 14 is first lowered to a certain distance close to the chip body 2, and the moving cover 8 shields multiple chip bodies 2 on the carrier 3, which can prevent dust from entering the moving cover 8 and affecting the re-wiring layer.

[0044] A positioning component for driving the adsorption component is also installed on the moving cover 8. The positioning component includes a lifting ring 33 slidably installed inside the moving cover 8, and the lifting ring 33 corresponds to the alignment ring 46 in position. A plurality of lifting blocks 32 are fixedly installed on the side wall of the lifting ring 33, and a plurality of lifting grooves 31 that are slidably matched with the corresponding lifting blocks 32 are formed on the inner wall of the moving cover 8. A compression spring 34 is installed between each lifting groove 31 and the corresponding lifting block 32. When the moving cover 8 moves downward, the lifting ring 33 first contacts the alignment ring 46 and pushes the alignment ring 46 to move downward against the elastic force of the second tension spring 49, thereby automatically completing the adsorption and fixation of the chip body 2 on the carrier 3.

[0045] The spraying section is used to spray epoxy resin on multiple chip bodies 2 placed on the carrier 3. The spraying section includes two storage cylinders 18 fixedly installed on the top of the moving cover 8, and output pipes 19 are fixedly connected between the two storage cylinders 18 and the inner wall of the moving cover 8. Output components are installed between the mounting frame 6 and the two storage cylinders 18. The output component includes a pull rod 20 fixedly installed on the mounting frame 6, and a connecting rod 25 is slidably installed at the bottom of the pull rod 20. A fixed column 21 is slidably installed on the storage cylinder 18 in a sealed manner, and a sealing plate 22 that is slidably and sealingly fitted with the inside of the storage cylinder 18 is fixedly installed at the bottom of the fixed column 21. A plurality of stirring blades 23 are also fixedly installed on the side wall of the end of the fixed column 21 located inside the storage cylinder 18. A convex rod 24 is fixedly installed on the side wall of the connecting rod 25. A second spiral groove that matches the convex rod 24 is formed on the inner wall of the fixed column 21. During the operation of the telescopic cylinder 7 that causes the moving cover 8 to move relatively closer, due to the cooperation between the convex rod 24 and the second spiral groove, the fixed column 21 will initially rotate inside the storage cylinder 18. At this time, the epoxy resin and curing agent inside can be stirred through the plurality of stirring blades 23 to make them mix evenly. At the same time, stirring can also reduce the air bubbles existing in the epoxy resin to a certain extent;

[0046] A round rod is fixedly installed at the bottom of the pull rod 20. A telescopic groove that matches the round rod is formed on the connecting rod 25, and a first tension spring 26 is installed between the telescopic groove and the round rod. After the lifting ring 33 contacts the alignment ring 46 and pushes it downward so that the multiple chip bodies 2 are adsorbed and fixed on the carrier 3, the convex rod 24 also moves to the top of the second spiral groove. At this time, the continuous downward movement of the moving cover 8 causes the lifting block 32 to move upward in the lifting groove 31 against the elastic force of the compression spring 34. At the same time, the convex rod 24 pulls the fixed column 21 to drive the sealing plate 22 to move upward in the storage cylinder 18, and the stirred epoxy resin therein is sent out from the output pipe 19 and sprayed on the carrier 3. When the moving cover 8 continues to move downward and the lifting block 32 moves a certain distance in the lifting groove 31 but does not move to the maximum distance, the stirring blade 23 contacts the top of the storage cylinder 18. At this time, the continuous downward movement of the moving cover 8 causes the round rod to move upward relative to the connecting rod 25 against the elastic force of the first tension spring 26. At this time, the spraying action of the epoxy resin stops, and the spraying process is completed.

[0047] The leveling part is used for leveling the sprayed epoxy resin. The leveling part includes a rotating rod 27 rotatably connected to the moving cover 8. A foam squeegee 28 is slidably installed at one end of the rotating rod 27 inside the moving cover 8. A T-shaped groove 30 is formed at the bottom of the rotating rod 27. A T-shaped rod 29 that is slidably engaged with the T-shaped groove 30 is fixedly installed at the top of the foam squeegee 28. The cooperation between the T-shaped groove 30 and the T-shaped rod 29 can ensure the effective connection and transmission between the foam squeegee 28 and the rotating rod 27. At the same time, when the moving cover 8 moves downward and approaches the workbench 1, it enables the foam squeegee 28 to have a certain upward movement space after contacting the chip body 2, avoiding excessive pressure on the chip body 2 caused by it, which may damage the chip body 2 or result in poor leveling effect of the epoxy resin.

[0048] A driving component that cooperates with the rotating rod 27 and the alignment component is installed on the moving cover 8. The driving component includes a rotating sleeve 36 rotatably installed on the moving cover 8 and a connecting shaft 38. A fixed gear ring 37 is fixedly installed on the rotating sleeve 36. A connecting gear ring 40 that meshes with the fixed gear ring 37 is rotatably installed on the connecting shaft 38 through a one-way bearing 39. A belt drive structure 43 is installed between the connecting shaft 38 and the rotating rod 27. A guide rod 42 is fixedly installed at the top of one of the lifting blocks 32 through a plug rod 35. A first spiral groove 41 that cooperates with the guide rod 42 is formed on the inner wall of the rotating sleeve 36. After the spraying process is completed, at this time, the plug rod 35 enters the rotating sleeve 36, and the guide rod 42 is located in the first spiral groove 41. As the moving cover 8 continues to move downward, the cooperation between the guide rod 42 and the first spiral groove 41 causes the rotating sleeve 36 to rotate. At this time, the fixed gear ring 37 rotates to drive the connecting gear ring 40 to rotate. The one-way bearing 39 is in a locked rotation state, so the connecting shaft 38 rotates. Through the operation of the belt drive structure 43, the rotating rod 27 drives the foam squeegee 28 to rotate horizontally on the carrier 3, completing the leveling process of the sprayed epoxy resin and ensuring the uniformity of the epoxy resin filling. When the guide rod 42 moves downward in the rotating sleeve 36, the fixed gear ring 37 drives the connecting gear ring 40 to rotate in the reverse direction. At this time, the one-way bearing 39 is in a rotating state, and the connecting shaft 38 cannot drive the rotating rod 27 to rotate.

[0049] The belt drive structure 43 is a prior art, and its working principle and specific structure will not be elaborated here. The depth of the T-shaped groove 30 is less than the telescopic length of the electric telescopic rod 10. The depth of the telescopic groove is greater than the maximum distance between the stirring blade 23 and the upper surface of the storage cylinder 18. The height of the second spiral groove is greater than or equal to the maximum distance between the alignment ring 46 and the lifting ring 33. The maximum distance between the guide rod 42 and the bottom of the rotating sleeve 36 is less than the depth of the lifting groove 31. The advantage of such a dimension design is to ensure that the adsorption and fixation of the chip body 2, the stirring of the epoxy resin, the spraying of the epoxy resin, and the leveling of the epoxy resin can be smoothly and orderly completed during the entire encapsulation process, avoiding mutual conflicts. At the same time, it can also avoid the problem that the cross beam 11 contacts the carrier 3 during the leveling of the epoxy resin, resulting in damage to the lithography machine 14 by the epoxy resin.

[0050] In the present invention, the working principle of an antistatic integrated circuit chip packaging device is as follows:

[0051] Placement of the chip body 2: A plurality of chip bodies 2 cut from the wafer are respectively placed into a plurality of alignment grooves 4 on the carrier 3, and it is ensured that the placement is in place;

[0052] Adsorption and fixation of the chip body 2: After the placement is completed, the telescopic cylinder 7 is started to make the moving cover 8 approach the workbench 1. After the moving cover 8 moves down a certain distance, the lifting ring 33 contacts the alignment ring 46 and pushes it down, so that a plurality of suction holes 44 generate suction force to effectively adsorb and fix a plurality of chip bodies 2 on the carrier 3. When the alignment ring 46 moves down in place, the continued downward movement of the moving cover 8 causes the lifting block 32 to move upward in the lifting groove 31 against the elastic force of the compression spring 34;

[0053] Stirring of the epoxy resin: During the downward movement of the moving cover 8 until the lifting block 32 starts to move upward in the lifting groove 31, the downward movement of the moving cover 8 relative to the mounting frame 6 will cause the fixing column 21 to rotate in the storage cylinder 18 under the cooperation of the convex rod 24 and the second spiral groove. At this time, a plurality of stirring blades 23 stir the epoxy resin located in the storage cylinder 18;

[0054] Spraying of the epoxy resin: When the lifting block 32 moves upward in the lifting groove 31, the convex rod 24 moves to the top of the second spiral groove. At this time, the continued downward movement of the moving cover 8 will drive the fixing column 21 to move upward in the storage cylinder 18 through the pull rod 20, and the stirred epoxy resin is sprayed onto the carrier 3 through the output pipe 19;

[0055] Leveling treatment of epoxy resin: After the spraying treatment is completed, at this time, the inserting rod 35 enters the rotating sleeve 36, and the guiding rod 42 is located in the first spiral groove 41. As the moving cover 8 continues to move downward, the cooperation between the guiding rod 42 and the first spiral groove 41 causes the rotating sleeve 36 to rotate. At this time, the fixed gear ring 37 rotates to drive the connecting gear ring 40 to rotate. The one-way bearing 39 is locked for rotation. Therefore, the connecting shaft 38 rotates, and through the operation of the belt transmission structure 43, the rotating rod 27 drives the foam squeegee 28 to rotate horizontally on the carrier 3, completing the leveling treatment of the epoxy resin at the spraying position;

[0056] Heavy wiring layer treatment: After the epoxy resin is leveled, the telescopic cylinder 7 is contracted to move the moving cover 8 upward and keep a certain distance between the foam squeegee 28 and the upper surface of the carrier 3 (the distance is greater than the thickness of the cross beam 11 and the lithography machine 14). Then, the electric telescopic rod 10 is started to move the cross beam 11 downward to the bottom of the foam squeegee 28. After that, the lithography machine 14 can be started, and through the cooperation of the servo motor 9, the moving motor 15, and the rotating motor 17, the heavy wiring layer treatment of all the chip bodies 2 is completed;

[0057] Demoulding treatment: After the heavy wiring layer treatment is completed, the telescopic cylinder 7 is contracted to move the moving cover 8 upward to reset. After the moving cover 8 moves upward a certain distance, the lifting ring 33 is completely separated from the alignment ring 46. During this process, the elastic force of the second tension spring 49 causes the alignment ring 46 to move upward to reset. Therefore, the multiple pistons 45 move upward to reset, releasing the suction force in the suction holes 44. At this time, the multiple chip bodies 2 filled with epoxy resin can be taken off the carrier 3 together and sent to the cutting process.

[0058] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.

Claims

1. An antistatic integrated circuit chip packaging device, comprising a workbench (1), an ion blower, and a plurality of chip bodies (2), characterized in that, Further comprising: A chip placement part for placing a plurality of chip bodies (2). The chip placement part includes a carrier (3) installed on a workbench (1). A plurality of alignment grooves (4) matching the corresponding chip bodies (2) are formed on the carrier (3). An adsorption component matching the plurality of chip bodies (2) is also installed on the carrier (3). A lithography part for performing a redistribution layer process on the plurality of chip bodies (2). The lithography part includes a mounting frame (6) fixedly installed on the workbench (1). A moving cover (8) is installed on the mounting frame (6) through a telescopic cylinder (7). The ion blower is fixedly installed on the moving cover (8). A lithography component matching the plurality of chip bodies (2) is installed on the moving cover (8). A spraying part for performing an epoxy resin spraying process on the plurality of chip bodies (2) placed on the carrier (3). The spraying part includes two storage cylinders (18) fixedly installed on the top of the moving cover (8). Output pipes (19) are fixedly connected between the two storage cylinders (18) and the inner wall of the moving cover (8). Output components are installed between the mounting frame (6) and the two storage cylinders (18). A positioning component for driving the adsorption component is also installed on the moving cover (8). A leveling part for leveling the sprayed epoxy resin. The leveling part includes a rotating rod (27) rotatably connected to the moving cover (8). A foam squeegee (28) is slidably installed at one end of the rotating rod (27) inside the moving cover (8). A driving component matching the rotating rod (27) and the positioning component is installed on the moving cover (8). The adsorption component includes an alignment ring (46) slidably installed on the workbench (1). A plurality of pistons (45) are fixedly installed on the upper surface of the alignment ring (46). Adsorption holes (44) in sealed sliding fit with the corresponding pistons (45) are formed on the side walls of each alignment groove (4). Two second tension springs (49) are installed between the alignment ring (46) and the bottom of the carrier (3). A plurality of grooves (48) are formed on the side wall of the carrier (3). A plurality of bumps (47) slidably matched with the corresponding grooves (48) are fixedly installed on the alignment ring (46). The positioning component includes a lifting ring (33) slidably installed inside the moving cover (8), and the lifting ring (33) corresponds to the alignment ring (46) in position. A plurality of lifting blocks (32) are fixedly installed on the side wall of the lifting ring (33). A plurality of lifting grooves (31) in sliding fit with the corresponding lifting blocks (32) are formed on the inner wall of the moving cover (8). A compression spring (34) is installed between each lifting groove (31) and the corresponding lifting block (32).

2. An antistatic integrated circuit chip packaging device according to claim 1, characterized in that, The lithography component includes a lithography machine (14). A servo motor (9) is fixedly installed on the movable cover (8), and the output end of the servo motor (9) is fixedly connected to an electric telescopic rod (10). The output end of the electric telescopic rod (10) is fixedly installed with a cross beam (11), and a chute (12) is opened on the cross beam (11). A slider (13) fixedly connected to the lithography machine (14) is slidably installed in the chute (12). A moving motor (15) is fixedly installed on the side wall of the cross beam (11), and the output end of the moving motor (15) is fixedly connected to a lead screw (16) threadedly connected to the slider (13).

3. An antistatic integrated circuit chip packaging device according to claim 1, characterized in that, A rotating motor (17) is fixedly installed at the bottom of the workbench (1), and the output end of the rotating motor (17) passes through the workbench (1) and the alignment ring (46) and is fixedly connected to the bottom of the carrier (3). Two guide sleeves (50) are fixedly installed on the side wall of the movable cover (8), and two guide posts (5) slidably matched with the corresponding guide sleeves (50) are fixedly installed on the workbench (1).

4. An antistatic integrated circuit chip packaging device according to claim 2, characterized in that, The output component includes a pull rod (20) fixedly installed on the mounting frame (6), and a connecting rod (25) is slidably installed at the bottom of the pull rod (20). A fixed column (21) is hermetically slidably installed on the storage cylinder (18), and a sealing plate (22) hermetically slidably matched with the inside of the storage cylinder (18) is fixedly installed at the bottom of the fixed column (21). A plurality of stirring blades (23) are also fixedly installed on the side wall of one end of the fixed column (21) located inside the storage cylinder (18). A convex rod (24) is fixedly installed on the side wall of the connecting rod (25), and a second spiral groove matched with the convex rod (24) is opened on the inner wall of the fixed column (21).

5. An antistatic integrated circuit chip packaging device according to claim 4, characterized in that, The driving component includes a rotating sleeve (36) and a connecting shaft (38) rotatably installed on the movable cover (8). A fixed gear ring (37) is fixedly installed on the rotating sleeve (36). A connecting gear ring (40) meshed with the fixed gear ring (37) is rotatably installed on the connecting shaft (38) through a one-way bearing (39), and a belt drive structure (43) is installed between the connecting shaft (38) and the rotating rod (27). A guide rod (42) is fixedly installed at the top of one of the lifting blocks (32) through a plug rod (35), and a first spiral groove (41) matched with the guide rod (42) is opened on the inner wall of the rotating sleeve (36).

6. An antistatic integrated circuit chip packaging device according to claim 5, characterized in that, A T-shaped groove (30) is opened at the bottom of the rotating rod (27). A T-shaped rod (29) slidably matched with the T-shaped groove (30) is fixedly installed at the top of the foam scraper (28). A round rod is fixedly installed at the bottom of the pull rod (20). A telescopic groove matched with the round rod is opened on the connecting rod (25), and a first tension spring (26) is installed between the telescopic groove and the round rod.

7. An antistatic integrated circuit chip packaging device according to claim 6, characterized in that, The depth of the T-shaped groove (30) is less than the telescopic length of the electric telescopic rod (10), the depth of the telescopic groove is greater than the maximum distance between the stirring blade (23) and the upper surface of the storage cylinder (18), the height of the second spiral groove is greater than or equal to the maximum distance between the alignment ring (46) and the lifting ring (33), and the maximum distance between the guide rod (42) and the bottom of the rotating sleeve (36) is less than the depth of the lifting groove (31).

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