Power module, communication equipment, motor driver, power assembly and vehicle

Abstract

The embodiment of the invention provides a power module, communication equipment, a motor driver, a power assembly and a vehicle, the reliability of power module connection is effectively improved, the processing difficulty of the power module can be effectively reduced, and the reduction of the heat-conducting property of the power module is avoided. The power module comprises an electronic device and a bottom plate, a first surface of the bottom plate and a second surface of the electronic device are opposite in position along a direction perpendicular to the surface of the bottom plate, the power module further comprises a connecting module, and the connecting module is connected between the first surface and the second surface. The power module also includes a reinforcement module covering the first surface, an outer sidewall of the connection module, and the electronics, the outer sidewall of the connection module extending between the first surface and the second surface. The thermal expansion coefficient of the reinforcing module is matched with the thermal expansion coefficient of the connecting module. The reinforcing module effectively improves the reliability of connection between the electronic device and the bottom plate.

Description

Technical Field

[0001] This application relates to the fields of automobiles and communication technologies, etc., and particularly relates to a power module, a communication device, a motor driver, a powertrain, and a vehicle. Background Art

[0002] The power module includes a base plate and electronic devices connected to the base plate. With the rapid development of power modules such as base station radio frequency power amplifier modules, hybrid vehicle insulated-gate bipolar transistor (IGBT) modules, high-performance light-emitting diodes (LEDs), and wide-bandgap semiconductors, the power consumption of the power module is increasing, resulting in a continuous increase in the operating junction temperature of the electronic devices, seriously affecting the performance and service life of the power module.

[0003] Moreover, to improve the reliability of the power module, it is necessary to suppress the mismatch of the coefficient of thermal expansion (CTE) between the base plate and the electronic devices. For this purpose, the CTE of the base plate can be reduced. For example, a base plate with a composite structure such as ceramics, copper / molybdenum copper / copper laminate (Cu / MoCu / Cu laminate), or direct bond copper (DBC) can be used. This base plate has a low CTE. Although it will suppress the CTE mismatch between the base plate and the electronic devices, it will reduce the thermal conductivity and cannot dissipate the heat generated by the electronic devices in a timely manner. Summary of the Invention

[0004] Embodiments of this application provide a power module, a communication device, a motor driver, a powertrain, and a vehicle, which can effectively improve the reliability of the power module connection, and can effectively reduce the processing difficulty of the power module and avoid the decline of the thermal conductivity of the power module.

[0005] In a first aspect, embodiments of this application provide a power module, including electronic devices and a base plate. The first surface of the base plate and the second surface of the electronic devices are opposite in the direction perpendicular to the surface of the base plate. The power module further includes a connection module connected between the first surface and the second surface. The power module further includes a reinforcement module covering the first surface, the outer sidewall of the connection module, and the electronic devices. The outer sidewall of the connection module extends between the first surface and the second surface, and the thermal expansion coefficient of the reinforcement module matches the thermal expansion coefficient of the connection module.

[0006] There is a situation of mismatch in the coefficient of thermal expansion between the electronic device and the base plate. The mismatch in the coefficient of thermal expansion will generate stress between the electronic device and the base plate, and this stress will reduce the reliability of the connection between the electronic device and the base plate. As shown in this aspect, when the reinforcement module covers the first surface, the outer sidewall of the connection module, and the electronic device, adhesive fixation will be formed between the reinforcement module and the first surface, between the reinforcement module and the outer sidewall of the connection module, and between the reinforcement module and the electronic device. This reinforcement module can effectively overcome the stress between the electronic device and the base plate, and the reinforcement module can ensure the reliable connection between the electronic device and the base plate through the connection module. Moreover, when the coefficient of thermal expansion of the reinforcement module matches the coefficient of thermal expansion of the connection module, then, when the ambient temperature where the power module is located changes, the deformation degree of the reinforcement module matches the deformation degree of the connection module, improving the reliability of the connection between the electronic device and the base plate.

[0007] In the packaging of the power module, the connection module between the electronic device and the base plate is the main path for heat transfer of the electronic device. Then, the connection module is the main factor affecting the reliability and heat dissipation of the power module. Due to the role of the reinforcement module, the connection module is reliably connected between the electronic device and the base plate, without the need to reduce the coefficient of thermal expansion of the base plate, reducing the processing difficulty of the base plate. The base plate does not need to use a material with a low thermal conductivity, thus avoiding the decline in the thermal conductivity of the power module. Due to the role of the reinforcement module, the base plate can use a material with a high thermal conductivity, improving the heat dissipation efficiency of the power module.

[0008] Based on the first aspect, in an optional implementation manner, the absolute value of the difference between the coefficient of thermal expansion of the reinforcement module and the coefficient of thermal expansion of the connection module is less than or equal to a preset value.

[0009] Adopting this implementation manner, when the absolute value of the difference between the coefficient of thermal expansion of the reinforcement module and the coefficient of thermal expansion of the connection module is less than or equal to the preset value, it indicates that the coefficient of thermal expansion of the reinforcement module is equal to or approximately equal to the coefficient of thermal expansion of the connection module. Then, when the ambient temperature where the power module is located changes, the deformation degree of the reinforcement module is the same as or close to the deformation degree of the connection module. Then, the deformation of the reinforcement module will not cause misalignment of the connection positions between the connection module and the electronic device, and between the connection module and the base plate, improving the reliability of the connection between the electronic device and the base plate.

[0010] Based on the first aspect, in an optional implementation manner, the Young's modulus of the reinforcement module is less than the Young's modulus of the electronic device.

[0011] With this implementation method, when the Young's modulus of the reinforcement module is less than that of the electronic device and the ambient temperature where the power module is located changes, stress is generated between the electronic device and the base plate. The stress release ability of the reinforcement module is stronger than that of the electronic device, enabling the reinforcement module to effectively release this stress and improving the reliability of the connection between the electronic device and the base plate.

[0012] Based on the first aspect, in an optional implementation method, the Young's modulus of the reinforcement module is less than that of the connection module.

[0013] With this implementation method, when the Young's modulus of the reinforcement module is less than that of the connection module and the ambient temperature where the power module is located changes, stress is generated between the electronic device and the base plate. The stress release ability of the reinforcement module is stronger than that of the connection module, enabling the reinforcement module to effectively release this stress and improving the reliability of the connection between the electronic device and the base plate.

[0014] Based on the first aspect, in an optional implementation method, the connection module is made of a sintered material, and the sintered material is a metal particle material at the nanoscale.

[0015] With this implementation method, the sintered material has the advantages of low sintering temperature, high melting point, and high thermal conductivity. Therefore, the connection module sintered from the sintered material effectively improves the heat dissipation performance of the power module, and can also increase the operating ambient temperature and service life of the power module, thereby improving the power density of the power module.

[0016] Based on the first aspect, in an optional implementation method, the orthographic projection of the connection module is within the coverage range of the orthographic projection of the electronic device. The second surface includes a first region and a second region. The first region is connected to the connection module, and the reinforcement module also covers the second region.

[0017] With this implementation method, a fairly strong bonding and fixation is formed between the reinforcement module and the second region, improving the reliability of the connection between the electronic device and the base plate.

[0018] Based on the first aspect, in an optional implementation method, the electronic device further includes a third surface connected to the second surface, and the reinforcement module also covers the third surface.

[0019] With this implementation method, a fairly strong bonding and fixation is formed between the reinforcement module and the third surface, improving the reliability of the connection between the electronic device and the base plate.

[0020] Based on the first aspect, in an optional implementation, the electronic device further includes a top surface connected to the third surface. Along a direction perpendicular to the second surface, the top surface is located opposite to the second surface, and the reinforcement module also covers the top surface.

[0021] With this implementation, the reinforcement module can also cover the top surface of the electronic device, so that the reinforcement module can cover the entire outer peripheral surface of the electronic device, and the reinforcement module can effectively ensure the reliability of the connection between the electronic device and the bottom plate.

[0022] Based on the first aspect, in an optional implementation, the reinforcement module covers another surface of the bottom plate. The bottom plate includes multiple surfaces, and the first surface and the another surface are different from each other among the multiple surfaces.

[0023] With this implementation, the reinforcement module can also cover another surface of the bottom plate. This another surface may be located opposite to the first surface, and / or the another surface is connected to the first surface. The reinforcement module effectively ensures the reliability of the connection between the electronic device and the bottom plate.

[0024] Based on the first aspect, in an optional implementation, the orthographic projection of the electronic device is within the coverage range of the orthographic projection of the connection module. The electronic device further includes a third surface connected to the second surface, and the connection module is also connected to the third surface.

[0025] With this implementation, the connection module can extend to the third surface of the electronic device. Since the connection module is connected to both the third surface and the second surface at the same time, the reliability of the connection between the electronic device and the bottom plate is achieved through the connection module.

[0026] Based on the first aspect, in an optional implementation, the third surface includes a third region and a fourth region. The distance between the third region and the bottom plate is less than the distance between the fourth region and the bottom plate. The connection module is connected to the third region, and the reinforcement module also covers the fourth region.

[0027] With this implementation, a fairly strong bonding and fixing is formed between the reinforcement module and the fourth region, improving the reliability of the connection between the electronic device and the bottom plate.

[0028] Based on the first aspect, in an optional implementation, the fixing module extends to the first pore and / or the second pore of the connection module. Among them, the first pore is located on the outer sidewall of the connection module, the second pore is located on the inner sidewall of the connection module, and the inner sidewall of the connection module contacts the electronic device.

[0029] With this implementation method, since the reinforcement module can extend into at least one of the first pore or the second pore of the connection module, the reliability of the connection between the reinforcement module and the connection module is improved, and further the reliability of the connection between the electronic device and the base plate is improved.

[0030] Based on the first aspect, in an optional implementation method, the base plate includes a fourth surface. Along the direction perpendicular to the surface of the base plate, the first surface and the fourth surface are located on opposite sides. The power module further includes a radiator. The fourth surface is connected to an intermediate layer, and the intermediate layer is used to connect the fourth surface and the fifth surface of the radiator; the power module further includes a heat dissipation reinforcement module, and the heat dissipation reinforcement module covers the fifth surface, the outer side wall of the intermediate layer, and the sixth surface of the base plate. Wherein, the sixth surface of the base plate is connected between the first surface and the fourth surface, the outer side wall of the intermediate layer extends between the fifth surface and the fourth surface, and the coefficient of thermal expansion of the heat dissipation reinforcement module matches the coefficient of thermal expansion of the intermediate layer.

[0031] With this implementation method, there is a situation of mismatch in the coefficient of thermal expansion between the radiator and the base plate. The mismatch in the coefficient of thermal expansion will generate stress between the radiator and the base plate, and this stress will reduce the reliability of the connection between the radiator and the base plate. As shown in this aspect, the heat dissipation reinforcement module will improve the adhesion between the radiator and the base plate, improve the reliability of the connection between the radiator and the base plate, and further improve the heat dissipation efficiency of the power module. Moreover, when the coefficient of thermal expansion of the heat dissipation reinforcement module matches the coefficient of thermal expansion of the intermediate layer, then when the ambient temperature where the power module is located changes, the deformation degree of the heat dissipation reinforcement module matches the deformation degree of the intermediate layer, improving the reliability of the connection between the radiator and the base plate.

[0032] Based on the first aspect, in an optional implementation method, the absolute value of the difference between the coefficient of thermal expansion of the heat dissipation reinforcement module and the coefficient of thermal expansion of the intermediate layer is less than or equal to a preset value.

[0033] With this implementation method, when the absolute value of the difference between the coefficient of thermal expansion of the heat dissipation reinforcement module and the coefficient of thermal expansion of the intermediate layer is less than or equal to a preset value, it indicates that the coefficient of thermal expansion of the heat dissipation reinforcement module is equal to or approximately equal to the coefficient of thermal expansion of the intermediate layer. Then, when the ambient temperature where the power module is located changes, the deformation degree of the heat dissipation reinforcement module is the same as or close to the deformation degree of the intermediate layer. Then, the deformation of the heat dissipation reinforcement module will not cause misalignment of the connection positions between the intermediate layer and the radiator and between the intermediate layer and the base plate, improving the reliability of the connection between the radiator and the base plate.

[0034] Second aspect, an embodiment of the present application provides a power module, including electronic devices, a bottom plate, and a radiator. A first surface of the bottom plate and a second surface of the electronic devices are opposite in position along a direction perpendicular to the surface of the bottom plate. The power module further includes a connection module, which is connected between the first surface and the second surface. The bottom plate includes a fourth surface. Along a direction perpendicular to the surface of the bottom plate, the first surface and the fourth surface are opposite in position. The power module further includes a radiator. The fourth surface is connected to an intermediate layer, and the intermediate layer is used to connect the fourth surface and a fifth surface of the radiator. The power module further includes a heat dissipation reinforcement module, which covers the fifth surface, an outer sidewall of the intermediate layer, and a sixth surface of the bottom plate. Among them, the sixth surface of the bottom plate is connected between the first surface and the fourth surface, the outer sidewall of the intermediate layer extends between the fifth surface and the fourth surface, and the coefficient of thermal expansion of the heat dissipation reinforcement module matches the coefficient of thermal expansion of the intermediate layer.

[0035] Based on the second aspect, in an optional implementation, the absolute value of the difference between the coefficient of thermal expansion of the heat dissipation reinforcement module and the coefficient of thermal expansion of the intermediate layer is less than or equal to a preset value.

[0036] Third aspect, an embodiment of the present application provides a communication device, including a housing, a processor, and the power module according to any one of the first aspects described above. The processor and the power module are located inside the housing, and the processor is electrically connected to the electronic devices. For the description of the beneficial effects, please refer to those shown in the first aspect, and no specific details will be elaborated here.

[0037] Fourth aspect, an embodiment of the present application provides a motor driver. The motor driver includes a capacitor and at least one power module according to any one of the first aspects described above. The power module is electrically connected to the capacitor. The capacitor is used to provide voltage for the power module, and the power module is used to convert direct current into alternating current, and the alternating current is used to drive a motor.

[0038] Fifth aspect, an embodiment of the present application provides a powertrain, including a motor and a motor driver according to any one of the first aspects described above, which is connected to the motor. The motor driver is used to provide alternating current for the motor, and the motor is used to convert the alternating current from the motor driver into kinetic energy.

[0039] Sixth aspect, an embodiment of the present application provides a vehicle, including wheels and a powertrain according to the fourth aspect described above, which is connected to the wheels. The powertrain is used to provide power for the wheels and drive the wheels to move. Description of the Drawings

[0040] Figure 1 Structural schematic diagram of the first embodiment of the power module provided by this application;

[0041] Figure 2 Structural schematic diagram of the second embodiment of the power module provided by this application;

[0042] Figure 3 Structural schematic diagram of the third embodiment of the power module provided by this application;

[0043] Figure 4 Structural schematic diagram of the fourth embodiment of the power module provided by this application;

[0044] Figure 5 Structural schematic diagram of the fifth embodiment of the power module provided by this application;

[0045] Figure 6 Flow chart of the steps of the first embodiment of the preparation method provided by this application;

[0046] Figure 7 Structural schematic diagram of an embodiment of the motor driver provided by this application;

[0047] Figure 8 Structural schematic diagram of an embodiment of the powertrain provided by this application;

[0048] Figure 9 Structural schematic diagram of an embodiment of the vehicle provided by this application;

[0049] Figure 10 Structural schematic diagram of the communication device provided by this application. Detailed implementation manners

[0050] The present application provides a power module, which includes a bottom plate and electronic devices connected to the surface of the bottom plate. The power module provided by the embodiments of the present application can improve the reliability of the connection between the bottom plate and the electronic devices. Among them, the power module can be various devices with high heat dissipation requirements, and this power module can be used to manufacture high-heat flux density devices such as high-frequency devices, power devices, optical communication modules, and transceiver components for high-frequency communication. The power module shown in this embodiment can also be called a power electronic device, that is, a power-type semiconductor device with the ability to handle high voltage and high current. For example, the power module can be a radio frequency (RF) power amplifier, a digital signal amplifier, an analog signal amplifier, an IGBT module, a metal-oxide-semiconductor field-effect transistor (MOSFET), a high-performance light-emitting LED or a power unit chip, a power supply, a servo driver, a frequency converter, a motor protector, etc. The power module is widely used in power supply circuits. Among them, the power module is a semiconductor device that converts the voltage, current, frequency, etc. of the power supply, and is the core device for power conversion in the power supply circuit. For example, the power module can be used as the core device for converting direct current to alternating current in the motor control part of an electric vehicle. Another example is that the power module outputs direct current from the battery of an electric vehicle or converts direct current into alternating current required for the operation of the vehicle. Another example is that the power module is applied to any module in a communication device, as long as the power module has high heat dissipation requirements during signal processing, voltage conversion, or current conversion.

[0051] Figure 1 It is a structural schematic diagram of the first embodiment of the power module provided by the present application. The power module includes a bottom plate 101, electronic devices 102, a connection module 103, and a reinforcement module 104.

[0052] Specifically, the bottom plate 101 can be a printed circuit board (PCB), a substrate, or a base, etc. The bottom plate 101 shown in this embodiment has a first surface 111 and a fourth surface 112 that are opposite in position along the direction Z. Among them, the direction Z is perpendicular to the first surface 111 of the bottom plate 101, and the first surface is parallel to the plane XY. In this embodiment, the direction Z is perpendicular to the first surface 111 as an example. In other examples, the direction Z can also form a certain angle with the first surface 111, and no specific limitation is made. When the bottom plate 101 is a PCB, the bottom plate 101 includes one or more layers of plates, and conductive traces are arranged on one or both sides of each plate. The type of the plate is not limited in this embodiment. For example, the plate can be paper-based, glass fiber cloth-based, composite-based, ceramic-based, metal core-based, etc. When the bottom plate 101 is a substrate, the bottom plate 101 can be made of a material with high thermal conductivity. If the substrate is a heat sink, then the metal used to make the substrate can be a high thermal conductivity metal such as copper (Cu), aluminum (Al), silver (Ag), aluminum alloy, copper alloy, or tungsten copper alloy.

[0053] The electronic device 102 is connected to the first surface 111. The electronic device 102 can be a power chip 102. The power chip 102 can be silicon (Si), germanium (Ge), gallium arsenide (GaAs), indium phosphide (InP), and wide bandgap semiconductors, etc. Among them, the wide bandgap semiconductor can be silicon carbide (SiC) or gallium nitride (GaN), etc. Taking the electronic device 102 as a wide bandgap semiconductor as an example, when the electronic device 102 is a wide bandgap semiconductor, it can enable the power module to develop in the direction of high power, high density, and high integration. It should be clear that the type of the electronic device 102 is not limited in this embodiment. For example, the electronic device 102 can be any type of electronic component, such as a resistor, a capacitor, or an inductor, etc.

[0054] The electronic device 102 has a second surface 113. Along the direction Z, the first surface 111 and the second surface 113 face each other and are relatively positioned. The connection module 103 is located between the first surface 111 and the second surface 113. The connection module 103 is connected between the first surface 111 and the second surface 113 through a die bond. The connection module 103 is used to realize the connection between the electronic device 102 and the base plate 101. The connection module 103 shown in this embodiment has two functions. Function 1, the connection module 103 is used to mechanically fix the electronic device 102 and the base plate 101. Function 2, the connection module 103 is used to conduct heat for the heat generated by the electronic device 102, so as to realize the heat dissipation of the electronic device 102 to match the electronic device with an increasing power consumption. To achieve the above two functions, in this embodiment, taking the die bond as sintering as an example, then, the connection module 103 is formed by sintering a sintering material. The stress of the sintering material is low. By sintering to connect the electronic device 102 and the base plate 101, the reliability of the connection between the electronic device 102 and the base plate 101 can be improved. The sintering material has the advantages of low sintering temperature, high melting point and high thermal conductivity. Therefore, it can improve the heat dissipation performance of the power module, and can also increase the operating environment temperature and service life of the power module, thereby improving the power density of the power module. In specific implementation, the sintering material shown in this embodiment is a metal particle material at the nanoscale. Using the sintering principle, a reliable connection between the electronic device 102 and the base plate 101 can be realized, thereby improving the yield of the power module. The metal particle material can be silver, copper or a silver-copper mixed material. For example, the sintering material shown in this embodiment can be a nanometer silver particle paste. Among them, the nanometer silver particle paste is a silver paste made of nanometer silver particles and an organic solvent. It should be clear that in this embodiment, taking the die bond as sintering as an example is not limited. For example, the die bond can be low-temperature eutectic soldering, high-temperature eutectic soldering or diffusion bonding, and among them, the diffusion bonding can be transient liquid phase welding. If the electrical connection of the electronic device 102 is to be realized, the connection module 103 can have electrical conductivity. The electronic device 102 can be flip-chip soldered to the surface of the connection module 103 facing away from the base plate 101. If the base plate 101 is a PCB, then, the electronic device 102 is electrically connected to the base plate 101 via the electrical connection module 103. Another example is that the electrical connection module 103 may not have electrical conductivity, and the electronic device 102 can be electrically connected to the base plate 101 through a bonding wire. Another example is that the power module may include terminals. The electronic device 102 is electrically connected to the terminals through bonding wires. The terminals are used as the electrical connection interface of the power module to realize electrical connection with devices outside the power module (such as a controller, etc.).

[0055] There is a CTE mismatch between the electronic device 102 and the base plate 101. Herein, the CTE mismatch means that there is a large gap between the CTE of the electronic device 102 and the CTE of the base plate 101. When there is a CTE mismatch between the electronic device 102 and the base plate 101, during the heating and cooling process, the deformations of the electronic device 102 and the base plate 101 are inconsistent, and thus when returning to room temperature, there is stress between the electronic device 102 and the base plate 101. The greater the gap between the CTE of the electronic device 102 and the CTE of the base plate 101, the greater the stress. When the stress exceeds the connection force of the connection module 103, problems such as cracking of the connection module 103 will occur, resulting in the problem of connection failure between the electronic device 102 and the base plate 101. In this embodiment, to suppress the CTE mismatch between the electronic device 102 and the base plate 101, the CTE of the connection module 103 can be reduced. For this purpose, filler particles can be added to the sintering material. Specifically, the sintering material includes a sintering material main body and filler particles. The sintering material main body can be nano silver paste. The material of the filler particles in this embodiment is not limited. The CTE of the filler particles is less than the CTE of the nano silver paste, so that the sintering material added with filler particles and sintered into the connection module 103 can effectively reduce the CTE. For example, the filler particles with low CTE can include at least one of nickel (Ni), Ni alloy, Cu, nickel-plated copper, titanium (Ti), Ti alloy, iron (Fe), Fe alloy, and SiC powder, etc., without limitation.

[0056] It can be understood that due to the CTE mismatch between the electronic device 102 and the base plate 101, there will be stress between the electronic device 102 and the base plate 101. To improve the reliability of the power module, it is necessary to improve the reliability of the connection between the electronic device 102 and the base plate 101. For this purpose, the reinforcement module 104 shown in this embodiment can effectively improve the reliability of the connection between the electronic device 102 and the base plate 101. The optional structure of the reinforcement module 104 shown in this embodiment is as follows:

[0057] Optional structure 1

[0058] The connection module 103 shown in this example has a first orthographic projection on the XY plane, and the electronic device 102 has a second orthographic projection on the XY plane. Specifically, multiple projection rays irradiate the electronic device 102 to form a first orthographic projection on the XY plane, and each projection ray is parallel to the Z direction. Similarly, multiple projection rays irradiate the connection module 103 to form a second orthographic projection on the XY plane, and each projection ray is parallel to the Z direction. The first orthographic projection shown in this example is within the coverage range of the second orthographic projection. When the first orthographic projection is within the coverage range of the second orthographic projection, it indicates that the connection module 103 connects to a partial area of the second surface 113 of the electronic device 102. Specifically, the second surface 113 of the electronic device 102 includes a first area and a second area. Among them, the first area is the area connected to the connection module 103. The second area of the second surface 113 is the area not connected to the connection module 103.

[0059] The reinforcement module 104 shown in this embodiment simultaneously covers the first surface 111 of the bottom plate 101, the second area of the second surface 113, the outer sidewall 114 of the connection module 103, and the electronic device 102. Among them, the outer sidewall 114 of the connection module 103 extends between the first surface 111 and the second surface 113. For example, the reinforcement module 104 shown in this embodiment is made of a structurally stable reinforcing material. When the reinforcement module 104 simultaneously covers the first surface 111 of the bottom plate 101, the second area of the second surface 113, the outer sidewall 114 of the connection module 103, and the electronic device 102, the reinforcement module 104 can effectively overcome the stress that appears between the electronic device 102 and the bottom plate 101. When the reinforcement module 104 overcomes the stress between the electronic device 102 and the bottom plate 101, the difference in deformation between the electronic device 102 and the bottom plate 101 will be inhibited, thereby improving the reliability of the connection between the electronic device 102 and the bottom plate 101 and enhancing the structural stability of the power module. This embodiment does not limit the specific material of the reinforcing material, as long as the reinforcement module 104 made of the reinforcing material can overcome the stress between the electronic device 102 and the bottom plate 101. For example, the reinforcing material can be epoxy resin.

[0060] The electronic device 102 further includes a third surface 115 connected to the second surface 113. For example, the second surface 113 is the bottom surface of the electronic device 102, and the third surface 115 is the side surface of the electronic device 102. The reinforcement module 104 also covers the third surface 115. It can be understood that the third surface 115 shown in this embodiment can extend along the direction Z, or there is a certain angle between the third surface 115 and the direction Z. Specifically, no limitation is made as long as the third surface 115 is connected to the second surface 113. Specifically, epoxy resin is coated on the first surface 111 of the bottom plate 101, the second area of the second surface 113, the outer sidewall 114 of the connection module 103, and the third surface 115 of the electronic device 102. After the epoxy resin is cured, the reinforcement module 104 that simultaneously covers the first surface 111 of the bottom plate 101, the second area of the second surface 113, the outer sidewall 114 of the connection module 103, and the third surface 115 of the electronic device 102 can be formed. In this example, the epoxy resin is in a liquid colloidal state or an incompletely cured film material before curing, and becomes a solid (i.e., the reinforcement module 104) after curing.

[0061] In this embodiment, when the reinforcement module 104 simultaneously covers the first surface 111 of the bottom plate 101, the second area of the second surface 113, the outer sidewall 114 of the connection module 103, and the third surface 115 of the electronic device 102, a bonding strength with considerable strength will be formed between the reinforcement module 104 and the first surface 111, between the reinforcement module 104 and the second area of the second surface 113, between the reinforcement module 104 and the outer sidewall 114 of the connection module 103, and between the reinforcement module 104 and the third surface 115 of the electronic device 102. As a result, a bonding force with a certain strength is formed between the reinforcement module 104 and the first surface 111 of the bottom plate 101, the second area of the second surface 113, the outer sidewall 114 of the connection module 103, and the third surface 115 of the electronic device 102 respectively. This bonding force can effectively overcome the stress between the electronic device 102 and the bottom plate 101. In this embodiment, no limitation is made on the size of the bonding fixation formed by the reinforcement module 104, as long as the bonding fixation formed by the reinforcement module 104 can overcome the stress between the electronic device 102 and the bottom plate 101.

[0062] As can be seen from the above examples, the reinforcement module 104 can be connected to multiple devices of the power module. For example, as shown in Structure 1, the reinforcement module 104 simultaneously covers the first surface 111 of the bottom plate 101, the second region of the second surface 113, the outer sidewall 114 of the connection module 103, and the electronic device 102. Another example is shown in Structure 2. The reinforcement module 104 simultaneously covers the first surface 111 of the bottom plate 101, the second region of the second surface 113, the outer sidewall 114 of the connection module 103, and the third surface 115 of the electronic device 102. Then, the reinforcement module 104 can effectively overcome the stress between the electronic device 102 and the bottom plate 101, so that even if the stress between the electronic device 102 and the bottom plate 101 is large, due to the action of the reinforcement module 104, the connection relationship between the electronic device 102, the bottom plate 101, and the connection module 103 can be fixed. For example, to achieve high-efficiency heat dissipation of the electronic device 102, the bottom plate 101 can adopt a metal substrate with a high thermal conductivity. However, the gap between the CTE of the metal substrate and the CTE of the electronic device 102 is large, which will increase the stress between the metal substrate and the electronic device 102. In this embodiment, the reinforcement module 104 covers the metal substrate, the electronic device 102, and the connection module 103 at the same time, thereby effectively overcoming the stress between the metal substrate and the electronic device 102 and ensuring the reliable connection between the metal substrate and the electronic device 102.

[0063] Optionally, the electronic device further includes a top surface connected to the third surface. Along a direction perpendicular to the second surface, the top surface and the second surface are located on opposite sides. The reinforcement module also covers the top surface. The reinforcement module shown in this example can also cover the top surface of the electronic device, so that the reinforcement module can cover the entire outer peripheral surface of the electronic device, and the reinforcement module can effectively ensure the reliability of the connection between the electronic device and the bottom plate. Additionally, optionally, the reinforcement module covers another surface of the bottom plate. The bottom plate includes multiple surfaces, and the first surface and the another surface are different from each other among the multiple surfaces. As shown in this example, the reinforcement module can also cover another surface of the bottom plate. This another surface can be located on the opposite side of the first surface, and / or the another surface is connected to the first surface. The reinforcement module effectively ensures the reliability of the connection between the electronic device and the bottom plate.

[0064] The reinforcement module 104 provided in this embodiment may further include filler particles. Specifically, the reinforcement module 104 includes a reinforcement module main body (formed by curing the epoxy resin shown above) and filler particles filled inside the reinforcement module main body. Combining Figure 1 and Figure 2 shown, where Figure 2FIG. 0 is a schematic structural diagram of the second embodiment of the power module provided by the present application. When the connection module 103 is made of sintered material, the connection module 103 is a porous structure, that is, the connection module 103 includes a plurality of pores.

[0065] For example, the connection module 103 includes a first pore 201, and the first pore 201 is located on the outer side wall 114 of the connection module 103. The size of the filler particles included in the reinforcement module 104 shown in this example is smaller than the size of the first pore 201 of the connection module 103. Then, the filler particles of the reinforcement module 104 can penetrate into the interface where the reinforcement module 104 is connected to the connection module 103 (i.e., the outer side wall 114), so that the first pore 201 of the connection module 103 can accommodate the filler particles of the reinforcement module 104. In this embodiment, neither the size nor the shape of the first pore 201 is limited, as long as the first pore 201 of the connection module 103 can accommodate the filler particles of the reinforcement module 104.

[0066] For another example, the connection module 103 includes a second pore 202, and the second pore 202 is located on the inner side wall of the connection module, where the inner side wall of the connection module contacts the electronic device 102. The size of the filler particles included in the reinforcement module 104 shown in this example is smaller than the size of the second pore 202 of the connection module 103. Then, the filler particles of the reinforcement module 104 can penetrate into the interface where the connection module 103 is connected to the electronic device 102 (i.e., the inner side wall), so that the second pore 202 of the connection module 103 can accommodate the filler particles of the reinforcement module 104. In this embodiment, neither the size nor the shape of the second pore 202 is limited, as long as the second pore 202 can accommodate the filler particles of the reinforcement module 104.

[0067] In this embodiment, the Young's modulus of the reinforcement module 104 is smaller than the Young's modulus of the electronic device 102. Optionally, the Young's modulus of the reinforcement module 104 is smaller than the Young's modulus of the connection module 103. Then, when the Young's modulus of the reinforcement module 104 is smaller than the Young's modulus of the electronic device 102, and / or the Young's modulus of the reinforcement module 104 is smaller than the Young's modulus of the connection module 103, even if stress is generated between the electronic device 102 and the bottom plate 101, the reinforcement module 104 can effectively release the stress, improving the reliability of the connection between the electronic device 102 and the bottom plate 101. It should be clear that the reinforcement module 104 needs to satisfy the above relationship of Young's modulus on the premise of ensuring the bonding and fixing of the electronic device 102, the connection module 103, and the bottom plate 101. The reinforcement module 104 shown in this embodiment includes a reinforcement module main body and filler particles, and the filler particles are filled in the reinforcement module main body, and the Young's modulus of the reinforcement module 104 can be adjusted by the filler particles.

[0068] The connection module 103 shown in this embodiment may include at least one of the first pore 201 or the second pore 202. In this embodiment, taking the connection module including the first pore 201 and the second pore 202 as an example, the reinforcement module 104 may extend into the first pore 201 and the second pore 202 of the connection module 103, effectively improving the bonding force between the connection module 103 and the reinforcement module 104, so that the reinforcement module 104 effectively overcomes the stress between the electronic device 102 and the bottom plate 101, thereby suppressing the degree of deformation of the connection module 103. Then, the reinforcement module 104 effectively improves the reliability of the connection between the electronic device 102 and the bottom plate 101.

[0069] The filler particles included in the reinforcement module 104 shown in this embodiment are used to adjust the Young's modulus of the reinforcement module 104. In addition, the filler particles of the reinforcement module 104 are also used to adjust the CTE of the reinforcement module 104, so that the CTE of the reinforcement module 104 added with filler particles matches the CTE of the connection module 103. The matching of the CTE of the reinforcement module 104 and the CTE of the connection module 103 shown in this embodiment specifically means that the absolute value of the difference between the CTE of the reinforcement module 104 and the CTE of the connection module 103 is less than or equal to a preset value. The preset value shown in this embodiment is 0 or any positive number close to 0. The size of the preset value is not limited in this embodiment, as long as the CTE of the reinforcement module 104 is equal to or approximately equal to the CTE of the connection module 103. When the CTE of the reinforcement module 104 is equal to or approximately equal to the CTE of the connection module 103, when the ambient temperature changes, the degree of deformation of the reinforcement module 104 is the same as or close to the degree of deformation of the connection module 103. Then, the deformation of the reinforcement module 104 will not cause misalignment of the connection positions between the connection module 103 and the electronic device, and between the connection module 103 and the bottom plate, improving the reliability of the connection between the electronic device and the bottom plate. For example, the connection module 103 may include electrical connectors for realizing electrical connection between the electronic device and the bottom plate. When the degree of deformation of the reinforcement module 104 is the same as or close to the degree of deformation of the connection module 103, even if the ambient temperature of the power module changes, it can ensure that the electrical connectors in the connection module 103 always maintain electrical connection with the electronic device and the bottom plate respectively, avoiding the reinforcement module 104 squeezing the connection module 103, so that the electrical connection channels between the electrical connectors and the electronic device, and / or the electrical connection channels between the electrical connectors and the bottom plate are disconnected, ensuring the reliability of the electrical connection between the electronic device and the bottom plate.

[0070] The CTE of the filler particles of the reinforcement module 104 shown in this embodiment is less than the CTE of the reinforcement module body. When the CTE of the filler particles of the reinforcement module 104 is less than the CTE of the reinforcement module body, the CTE mismatch between the electronic device 102 and the base plate 101 can be effectively suppressed. For the description of the filler particles of the reinforcement module, please refer to the description of the filler particles of the connection module 103, and details will not be elaborated here.

[0071] Optional structure 2

[0072] For the structure of the power module shown in this example, please refer to Figure 3 as shown, where Figure 3 is the structural example diagram of the third embodiment of the power module provided by this application. The power module shown in this example includes a base plate 301, a connection module 303, and an electronic device 302. The connection module 303 is used to connect the electronic device 302 and the base plate 301. For the specific description of the base plate 301, the connection module 303, and the electronic device 302, please refer to Figure 1 the corresponding description, and details will not be elaborated here. The connection module 303 has a third orthographic projection on the plane XY, and the electronic device 102 has a fourth orthographic projection on the plane XY. For the description of the third orthographic projection and the fourth orthographic projection, please refer to Figure 1 the description of the corresponding first orthographic projection and second orthographic projection, and details will not be elaborated here. The fourth orthographic projection shown in this example is within the coverage of the third orthographic projection. When the fourth orthographic projection is within the coverage of the third orthographic projection, the outer sidewall of the connection module 303 extends to the side surface of the electronic device 302. Specifically, the electronic device 302 includes a third surface 312 connected to the second surface 311, and the third surface 312 is connected to the second surface 311. It can be understood that the second surface 311 is the bottom surface of the electronic device 302, and the third surface 312 is the side surface of the electronic device 302. The third surface 312 of the connection module 303 specifically includes a third region 313 and a fourth region 314. The distance between the third region 313 and the base plate 301 is less than the distance between the fourth region 314 and the base plate 301. It can be understood that with the base plate 301 as the reference, the fourth region 314 is above the third region 313. The connection module 303 extends to the third surface 312 of the electronic device 302 and connects the third region 313 of the third surface 312. The reinforcement module 304 covers the first surface of the base plate 301, the outer sidewall of the connection module 303, and the fourth region 314 of the electronic device 302. For the description of the material of the reinforcement module 304, please refer to Figure 1The corresponding description will not be elaborated here. Due to the CTE mismatch between the electronic device 302 and the base plate 301, there is stress between the electronic device 302 and the base plate 301. To improve the reliability of the power module, it is necessary to improve the reliability of the connection between the electronic device 302 and the base plate 301. For this purpose, the reinforcement module 304 shown in this embodiment can cover the first surface of the base plate 301, the outer sidewall of the connection module 303, and the fourth area 314 of the electronic device 302 at the same time, effectively improving the reliability of the connection between the electronic device 102 and the base plate 101. For the description of how the reinforcement module 104 improves the connection reliability between the electronic device and the base plate, please refer to the description of the above optional structure 1, which will not be elaborated here.

[0073] The power module shown in this embodiment may further include a package cover connected to the first surface of the base plate. An encapsulation space is formed between the package cover and the first surface of the base plate. The electronic device, the reinforcement module, and the connection module shown in the above embodiment are all located in this encapsulation space. The package cover is used to isolate moisture, oxygen, or any contaminants to prevent moisture, oxygen, or any contaminants from affecting the normal performance of the electronic device.

[0074] As can be seen from the above description of the power module, the power module has a high heat dissipation requirement. Figure 4 This is a structural example diagram of the fourth embodiment of the power module provided by this application. The power module shown in this embodiment includes a base plate 401, a connection module 403, an electronic device 403, and a reinforcement module 404. For specific descriptions, please refer to Figures 1 to 3 Any of the above, which will not be elaborated here. The base plate 401 shown in this embodiment includes a first surface 411 and a fourth surface 412 that are opposite to each other in the Z direction. The first surface 411 is used to connect the connection module 403 and the reinforcement module 404. For specific descriptions, please refer to Figures 1 to 3 The corresponding description will not be elaborated here. The power module shown in this embodiment further includes a heat sink 405. The fourth surface 412 of the base plate 401 is connected to an intermediate layer 413, and this intermediate layer 413 is used to connect the fourth surface 412 and the fifth surface 414 of the heat sink 405. Optionally, the intermediate layer 413 is made of solder, and welding between the heat sink 405 and the base plate 401 is achieved based on this intermediate layer 413. For another example, the intermediate layer 413 can be made of a sintered material. For the description of the sintered material, please refer to Figure 1 The corresponding description will not be elaborated here. Sintered connection between the heat sink 405 and the base plate 401 is achieved based on this intermediate layer 413. For another example, the intermediate layer 413 can be made of a sticky glue, and bonding between the heat sink 405 and the base plate 401 is achieved based on this intermediate layer 413.

[0075] The power module further includes a heat dissipation and reinforcement module 406, and the heat dissipation and reinforcement module 406 covers the fifth surface 414, the outer sidewall of the intermediate layer 413, and the sixth surface 415 of the bottom plate 401. Among them, the sixth surface 415 of the bottom plate 401 extends between the first surface 411 and the fourth surface 412. For example, the sixth surface 415 shown in this embodiment is the side surface of the bottom plate, and the first surface 411 and the fourth surface 412 are the upper surface and the lower surface of the bottom plate, respectively. The outer sidewall of the intermediate layer 413 extends between the fifth surface 414 and the fourth surface 412. For the description of the material of the heat dissipation and reinforcement module 406, please refer to Figure 1 the description of the corresponding reinforcement module material, which will not be elaborated here. Since there is a CTE mismatch between the radiator 405 and the bottom plate 401, there will be stress between the radiator 405 and the bottom plate 401. To improve the reliability of the power module, it is necessary to improve the reliability of the connection between the radiator 405 and the bottom plate 401. For this reason, the heat dissipation and reinforcement module 406 that simultaneously covers the fifth surface 414, the outer sidewall of the intermediate layer 413, and the sixth surface 415 of the bottom plate 401 shown in this embodiment can effectively improve the reliability of the connection between the radiator 405 and the bottom plate 401. For the description of the structure of the heat dissipation and reinforcement module 405, please refer to the description of the reinforcement module structure shown in the above embodiment, which will not be elaborated here.

[0076] The connection module 403, the reinforcement module 404, and the bottom plate 401 shown in this embodiment can conduct the heat generated by the electronic device 402 to the radiator 405, and the radiator 405 then dissipates the heat. By dissipating heat through the radiator 405, the efficiency of dissipating heat from the electronic device 402 is effectively improved, and the reliability of the power module is improved. Since the radiator included in the power module can timely discharge the heat of the electronic device and improve the heat dissipation performance of the power module, then, when specifically applying the power module, the working temperature of the power module can be increased. When the power module can work normally at a higher working temperature, the number of electronic devices included in the power module can be increased to improve the power density of the power module and the integration degree of the power module. To achieve high-efficiency heat dissipation of the radiator 405, the radiator 405 is made of a material with high thermal conductivity. This embodiment does not limit the high-thermal-conductivity material, as long as the radiator made of this high-thermal-conductivity material can timely discharge the heat generated by the electronic device from the power module. For example, the radiator 405 can be made of metal. This embodiment does not limit the specific form of the radiator 405. For example Figure 4 as shown, the radiator 405 includes a substrate 421 and a plurality of heat dissipation fins 422 extending from the substrate 421 in a direction away from the bottom plate 401. This embodiment does not limit the heat dissipation method of the radiator 405. For example, the heat of the radiator 405 is discharged through a fan, a liquid cooling pipe for circulating liquid coolant, etc.

[0077] The CTE of the heat dissipation and reinforcement module 406 shown in this embodiment matches the CTE of the intermediate layer 413. Specifically, the absolute value of the difference between the CTE of the heat dissipation and reinforcement module 406 and the CTE of the intermediate layer 413 is less than or equal to a preset value. For specific descriptions, please refer to the description that the absolute value of the difference between the CTE of the reinforcement module and the CTE of the connection module shown in the above embodiment is less than or equal to the preset value, and details are not elaborated here. It can be understood that when the CTE of the heat dissipation and reinforcement module 406 is equal to or approximately equal to the CTE of the intermediate layer 413, the reliability of the connection between the base plate and the radiator is improved.

[0078] Figure 5 This is a structural example diagram of the fifth embodiment of the power module provided by this application. In Figure 4 In the corresponding embodiment, the power module includes a reinforcement module and a heat dissipation and reinforcement module as an example, while Figure 5 In the embodiment shown, the power module may only include a heat dissipation and reinforcement module. Specifically, the power module shown in this embodiment includes a base plate 501, a connection module 503, and electronic devices 503. For specific descriptions, please refer to Figure 1 the corresponding descriptions, and details are not elaborated here. The base plate 501 shown in this embodiment includes a first surface 511 and a fourth surface 512 that are opposite in the Z direction. The power module shown in this embodiment further includes a radiator 505. The fourth surface 512 of the base plate 501 is connected to an intermediate layer 513, and this intermediate layer 513 is used to connect the fourth surface 512 and the fifth surface 514 of the radiator 505. The power module further includes a heat dissipation and reinforcement module 506. For the description of the position of the heat dissipation and reinforcement module 506 and the description of the radiator 505, please refer to Figure 5 the corresponding descriptions, and details are not elaborated here.

[0079] The embodiment of this application also provides a preparation method for preparing a power module. Figure 6 This is a flowchart of the steps of the first embodiment of the preparation method provided by this application. Figure 6 The method shown is used to manufacture a power module as shown in Figures 1 to 3 any embodiment.

[0080] Step 601: Print or coat the sintering material on the first surface of the base plate.

[0081] For the description of the base plate, please refer to Figure 1The corresponding description will not be elaborated here. In specific implementation, the sintered material can be printed on the sintering area corresponding to the first surface of the base plate by using the stencil printing process or the screen printing process. Since the stencil printing process has lower cost and is simpler than the screen printing process. Therefore, in the embodiment of the present application, the stencil printing process is adopted to print the sintered material on the sintering area corresponding to the first surface of the base plate. For the description of the sintered material, please refer to Figure 1 The corresponding description will not be elaborated here. Taking the reinforcement module made of sintered material as an example in the preparation method shown in this embodiment, it is not limited. For example, if the reinforcement module is formed by a welding process, the solder can be set on the first surface of the base plate. Another example, if the reinforcement module is formed by an adhesion process, the glue can be coated on the first surface of the base plate. In the case of printing or coating the sintered material on the first surface of the base plate, the sintered material can also be pre-dried.

[0082] Step 602: Mount the electronic device on the sintered material.

[0083] For the description of the electronic device, please refer to Figure 1 The corresponding description will not be elaborated here. First, the electronic device can be lifted by vacuum adsorption, and then the electronic device is fixed on the dried sintered material.

[0084] Step 603: Sinter the electronic device mounted on the sintered material.

[0085] Through the sintering of the sintered material, the sintered material is solidified into a connection module 103 for connecting the electronic device 102 and the base plate 101. Sintering means that at high temperature, the atomic diffusion between the particles of the sintered material and at the interface between the sintered material and the joined body is promoted, enhancing the bonding strength and bonding reliability. For the description of the positional relationship among the electronic device 102, the connection module 103, and the base plate 101 prepared through steps 601 to 604, please refer to Figures 1 to 3 The corresponding description will not be elaborated here.

[0086] Step 604: Coat the reinforcing material on the target area and cure it.

[0087] For the description of the reinforcing material for structural stability, please refer to Figure 1 The corresponding description will not be elaborated here. For example, based on Figure 1 In the corresponding embodiment, the reinforcing material can be coated on the target area, and the target area includes the first surface of the base plate, the outer sidewall of the connection module, the third surface of the electronic device, and the second area of the second surface of the electronic device. For the specific description, please refer to Figure 1 The corresponding description will not be elaborated here. Another example, based on Figure 3For the corresponding embodiment, the reinforcing material can be coated on the target area, which includes the first surface of the bottom plate, the outer side wall of the connection module, and the fourth area on the third surface of the electronic device. For specific descriptions, please refer to Figure 3 the corresponding description, which will not be elaborated here. The reinforcing material coated on the target area forms a reinforcement module after curing.

[0088] For the description of the process of connecting the radiator to the bottom plate and forming the heat dissipation reinforcement module, please refer to the process of connecting the electronic device 401 to the bottom plate and forming the reinforcement module shown in this embodiment, which will not be elaborated here.

[0089] The embodiment of the present application also provides a motor driver, Figure 7 which is a structural example diagram of an embodiment of the motor driver provided by the present application. The motor driver 700 includes a capacitor 701 and at least one power module 702 as described in any of the above embodiments. The power module 702 is electrically connected to the capacitor 701. The capacitor 701 is used to provide voltage for the power module 702. The motor driver 700 is used to invert the direct current output by the power battery pack into alternating current, and the alternating current is used to drive the motor.

[0090] By using the motor driver shown in this embodiment, since the reinforcement module can improve the reliability of the connection between the electronic device and the bottom plate, the structure of the motor driver is made more stable, and the service life of the motor driver is extended.

[0091] The embodiment of the present application also provides a powertrain, Figure 8 which is a structural example diagram of an embodiment of the powertrain provided by the present application. The powertrain 800 includes a motor 801 and a motor driver 802 connected to the motor 801. The motor driver 802 is as Figure 7 shown in the corresponding embodiment, which will not be elaborated here. The motor driver 802 is used to provide alternating current for the motor 801, and the motor 801 is used to convert the alternating current from the motor driver 802 into kinetic energy.

[0092] The embodiment of the present application also provides a vehicle, Figure 9FIG. 0 is a schematic structural diagram of an embodiment of the vehicle provided by the present application. In an embodiment of the present application, the vehicle may be an electric vehicle (EV), a purely electric vehicle (PEV), or a battery electric vehicle (BEV), a hybrid vehicle (HEV), a range extend electric vehicle (REEV), a plug-in hybrid electric vehicle (PHEV), a new energy vehicle, etc.

[0093] In one embodiment, the vehicle 900 is configured to be in a fully or partially autonomous driving mode. For example, the vehicle 900 can control itself while in the autonomous driving mode, and can determine the current state of the vehicle and its surrounding environment through manual operation, determine the possible behavior of at least one other vehicle in the surrounding environment, and determine the confidence level corresponding to the possibility that the other vehicle performs the possible behavior, and control the vehicle 900 based on the determined information. When the vehicle 900 is in the autonomous driving mode, the vehicle 900 can be set to operate without interacting with people. The vehicle 900 may include various systems, and each system may include a plurality of components. In addition, each system and component of the vehicle 900 can be interconnected by wire or wirelessly.

[0094] The vehicle shown in this embodiment includes a sensing system 903, which may include several sensors for sensing information about the environment around the vehicle 900. For example, the sensing system 903 may include a positioning system (the positioning system may be a global positioning system (GPS) system, or it may be a Beidou system or other positioning systems), an inertial measurement unit (IMU), a radar, a lidar, and a camera. The sensing system 903 may also include sensors for monitoring the internal systems of the vehicle 900 (such as an in-vehicle air quality monitor, a fuel gauge, an engine oil temperature gauge, etc.). Sensor data from one or more of these sensors can be used to detect objects and their corresponding characteristics (position, shape, orientation, speed, etc.). Such detection and identification are key functions for the safe operation of the autonomous vehicle 900. The positioning system can be used to estimate the geographical location of the vehicle 900. The IMU is used to sense changes in the position and orientation of the vehicle 900 based on inertial acceleration. In one embodiment, the IMU can be a combination of an accelerometer and a gyroscope. The radar can use radio signals to sense objects within the surrounding environment of the vehicle 900. In some embodiments, in addition to sensing objects, the radar can also be used to sense the speed and / or forward direction of the objects. This embodiment does not limit the specific type of the radar. For example, the radar can be a millimeter-wave radar or a lidar, etc. The lidar can use laser to sense objects in the environment where the vehicle 900 is located. In some embodiments, the lidar may include one or more laser sources, a laser scanner, and one or more detectors, as well as other system components. The camera can be used to capture multiple images of the surrounding environment of the vehicle 900. The camera can be a static camera, a video camera, a mono / stereo camera, or an infrared imager.

[0095] The vehicle 900 also includes an advanced driving assistance system (ADAS) 901. The ADAS 901 senses the surrounding environment at any time during the vehicle's driving process, collects data, identifies, detects, and tracks static and dynamic objects, and combines navigation map data to perform system operations and analyses, so as to let the driver perceive possible dangers in advance and effectively improve the comfort and safety of vehicle driving. For example, the ADAS 901 can control the vehicle through the data obtained by the sensing system 903. Also, for example, the ADAS 901 can control the vehicle through in-vehicle data, where the in-vehicle data can be the main data on the vehicle dashboard (fuel consumption, engine speed, temperature, etc.), vehicle speed information, steering wheel angle information, or vehicle body attitude data, etc.

[0096] Vehicle 900 interacts with external sensors, other vehicles, other computer systems, or users through peripheral device 902. Peripheral device 902 may include a wireless communication system, an in-vehicle computer, a microphone, and / or a speaker, etc. In some embodiments, peripheral device 902 provides a means for the user of vehicle 900 to interact with the user interface. For example, the in-vehicle computer may provide information to the user of vehicle 900. The user interface may also operate the in-vehicle computer to receive user input. The in-vehicle computer can be operated through a touch screen. In other cases, peripheral device 902 may provide a means for vehicle 900 to communicate with other devices located inside the vehicle. For example, the microphone may receive audio from the user of vehicle 900 (e.g., voice commands or other audio inputs). Similarly, the speaker may output audio to the user of vehicle 900.

[0097] The wireless communication system can communicate wirelessly with one or more devices directly or via a communication network. For example, the wireless communication system may use 3rd-generation (3G) cellular communication technologies, such as Code Division Multiple Access (CDMA), Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS). The wireless communication system may use 4th-generation (4G) cellular communication technologies, such as Long Term Evolution (LTE). The wireless communication system may also use 5th-generation (5G) cellular communication technologies, 6th-generation (6G) mobile network standards. The wireless communication system may utilize Wireless Local Area Network (WLAN) communication. In some embodiments, the wireless communication system may utilize infrared links, Bluetooth, or ZigBee protocol to communicate directly with devices. The wireless communication system may also utilize various vehicle communication systems. For example, the wireless communication system may include one or more Dedicated Short Range Communications (DSRC) devices, which may include public and / or private data communications between vehicles and / or roadside stations.

[0098] Some or all functions of vehicle 900 are controlled by computer system 904. Computer system 904 can control the functions of vehicle 900 based on inputs received from various systems (e.g., sensing system 903, ADAS 901, peripheral devices 902) and from the user interface. Computer system 904 can include at least one processor that executes instructions stored in a non-transitory computer-readable medium such as a memory. Computer system 904 can also be multiple computing devices that control individual components or subsystems of vehicle 900 in a distributed manner.

[0099] In this embodiment, the type of the processor is not limited. For example, the processor can be one or more field-programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), system on chips (SoCs), central processing units (CPUs), network processors (NPs), digital signal processing circuits (DSPs), micro controller units (MCUs), programmable logic devices (PLDs), or other integrated chips, or any combination of the above chips or processors, etc. Among them, the processor can be located inside the vehicle, or the processor can be located away from the vehicle and communicate with the vehicle wirelessly.

[0100] In some embodiments, the memory can contain instructions (e.g., program logic) that can be executed by the processor to perform various functions of vehicle 900. In addition to the instructions, the memory can also store data, such as map data, route information, the position, direction, speed of the vehicle, and other vehicle data. The information stored in the memory can be used by vehicle 900 and computer system 904 during the operation of vehicle 900 in autonomous, semi-autonomous, and / or manual modes.

[0101] Vehicle 900 shown in this embodiment further includes a powertrain 905 connected to computer system 904 and wheels 906 connected to powertrain 905. For the description of the structure of powertrain 905, please refer to Figure 8 the corresponding embodiment, which will not be elaborated here specifically. Powertrain 905 is used to provide power for wheels 906 to drive wheels 906 to perform movements such as forward, backward, and turning.

[0102] This application embodiment also provides a communication device. Figure 10This is a structural example diagram of the communication device provided by this application. For the description of the device type of the communication device 1000 shown in this embodiment, please refer to the above embodiments and will not be elaborated here. In this embodiment, taking the communication device 1000 as a base station as an example, the communication device 1000 includes a baseband processor 1001, a radio frequency transceiver 1002, a power module 1003, and an antenna 1004 connected in sequence. The communication device 1000 further includes a processor 1005 connected to the baseband processor 1001, the radio frequency transceiver 1002, and the power module 1003 respectively. For the description of the structure of the power module 1003 shown in this embodiment, please refer to any of the above embodiments and will not be elaborated here.

[0103] The communication device 1000 includes P transmission channels and J reception channels, where P is any integer greater than or equal to 1, and J is any integer greater than or equal to 1. Among the J reception channels, each reception channel includes a receiver in the radio frequency transceiver 1002, a reception module in the power module 1003, and a reception antenna in the antenna 1004. Among the P transmission channels, each transmission channel includes a transmitter in the power module 1003, a transmission module in the power module 1003, and a transmission antenna in the antenna 1004. The transmission channel includes at least one switch module. In the transmission channel, the switch module can be connected between the transmitter and the transmission module, and / or between the transmission module and the transmission antenna. The switch module is used to conduct or cut off the transmission channel. The reception channel includes at least one switch module. In the reception channel, the switch module can be connected between the receiver and the reception module, and / or between the reception module and the reception antenna. The switch module is used to conduct or cut off the reception channel. The processor 1005 included in the communication device 1000 shown in this example is used to conduct at least one of the P transmission channels, and the processor 1005 is further used to conduct at least one of the J reception channels.

[0104] When the processor 1005 turns on the transmission channel, the baseband processor 1001 sends a first digital signal to the transmission channel. The transmitter in the radio frequency transceiver 1002 is used to convert the first digital signal into a first radio frequency signal and send the first radio frequency signal to the transmission module in the power module 1003. The transmission module processes the first radio frequency signal to obtain a processed first radio frequency signal. Among them, the transmission module may include devices such as a switch, a filter, a power amplifier (PA), a low noise amplifier (LNA), an antenna tuner, or a phase shifter. For example, when the transmission module includes a filter, the processing of the first radio frequency signal by the filter refers to filtering the first radio frequency signal. Another example is that when the transmission module includes a PA, the processing of the first radio frequency signal by the PA refers to amplifying the power of the first radio frequency signal, etc. The transmission module sends the processed first radio frequency signal to the transmitting antenna, and the transmitting antenna is used to emit the processed first radio frequency signal.

[0105] When the processor 1005 turns on the receiving channel, the receiving antenna receives a second radio frequency signal. The receiving module in the power module 1003 processes the second radio frequency signal to obtain a processed second radio frequency signal and sends the processed second radio frequency signal to the receiver in the radio frequency transceiver 1002. For the description of the devices included in the receiver and the processing of the second radio frequency signal, please refer to the description of the devices included in the transmitter and the processing of the first radio frequency signal, and no specific details will be elaborated here. The receiver in the radio frequency transceiver 1002 is used to convert the processed second radio frequency signal into a second digital signal and send the second digital signal to the baseband processor 1001, and the baseband processor 1001 performs digital processing on the second digital signal.

[0106] In this embodiment, the type of the processor 1005 is not limited. For example, the processor 1005 may be one or more field-programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), system on chips (SoCs), central processor units (CPUs), network processors (NPs), digital signal processing circuits (DSPs), micro controller units (MCUs), programmable logic devices (PLDs), or other integrated chips, or any combination of the above chips or processors, etc.

[0107] The above are only the specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered by the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A power module, It is characterized in that The power module comprises an electronic device and a base plate, wherein a first surface of the base plate and a second surface of the electronic device are opposite to each other in a direction perpendicular to the base plate surface, and the power module further comprises a connection module, wherein the connection module is connected between the first surface and the second surface; The power module also includes a reinforcement module, which covers the first surface, the outer side wall of the connection module and the electronic device. The outer side wall of the connection module extends between the first surface and the second surface. The thermal expansion coefficient of the reinforcement module matches the thermal expansion coefficient of the connection module.

2. The power module according to claim 1, It is characterized in that An absolute value of a difference between a thermal expansion coefficient of the reinforcement module and a thermal expansion coefficient of the connection module is less than or equal to a preset value.

3. The power module according to claim 1 or 2, It is characterized in that The Young's modulus of the reinforcement module is smaller than the Young's modulus of the electronic device.

4. The power module according to any one of claims 1 to 3, It is characterized in that The Young's modulus of the reinforcement module is smaller than the Young's modulus of the connection module.

5. The power module according to any one of claims 1 to 4, It is characterized in that The connection module is made of a sintered material, which is a nano-scale metal particle material.

6. The power module according to any one of claims 1 to 5, It is characterized in that The orthographic projection of the connection module is located within the coverage range of the orthographic projection of the electronic device. The second surface includes a first area and a second area. The first area is connected to the connection module, and the reinforcement module also covers the second area.

7. The power module according to claim 6, It is characterized in that The electronic device further includes a third surface connected to the second surface, and the reinforcement module further covers the third surface.

8. The power module according to claim 7, It is characterized in that The electronic device further comprises a top surface connected to the third surface, and along a direction perpendicular to the second surface, the top surface is located opposite to the second surface, and the reinforcement module also covers the top surface.

9. The power module according to any one of claims 1 to 8, It is characterized in that The reinforcement module covers another surface of the base plate. The base plate includes a plurality of surfaces. The first surface and the other surface are different from each other among the plurality of surfaces.

10. The power module according to any one of claims 1 to 5, It is characterized in that The orthographic projection of the electronic device is located within the coverage range of the orthographic projection of the connection module. The electronic device also includes a third surface connected to the second surface, and the connection module is also connected to the third surface.

11. The power module according to claim 10, It is characterized in that The third surface includes a third area and a fourth area. The distance between the third area and the base plate is smaller than the distance between the fourth area and the base plate. The connection module connects the third area, and the reinforcement module also covers the fourth area.

12. The power module according to any one of claims 1 to 11, It is characterized in that The fixing module extends to a first hole and / or a second hole of the connecting module, wherein the first hole is located at an outer side wall of the connecting module, the second hole is located at an inner side wall of the connecting module, and the inner side wall of the connecting module contacts the electronic device.

13. The power module according to any one of claims 1 to 12, It is characterized in that The base plate includes a fourth surface, and along a direction perpendicular to the base plate surface, the first surface and the fourth surface are located opposite to each other. The power module also includes a heat sink, and the fourth surface is connected to an intermediate layer, and the intermediate layer is used to connect the fourth surface and a fifth surface of the heat sink; The power module also includes a heat dissipation reinforcement module, which covers the fifth surface, the outer wall of the middle layer and the sixth surface of the base plate, wherein the sixth surface of the base plate is connected between the first surface and the fourth surface, the outer wall of the middle layer extends between the fifth surface and the fourth surface, and the thermal expansion coefficient of the heat dissipation reinforcement module matches the thermal expansion coefficient of the middle layer.

14. The power module according to claim 13, It is characterized in that An absolute value of a difference between a thermal expansion coefficient of the heat dissipation reinforcement module and a thermal expansion coefficient of the intermediate layer is less than or equal to a preset value.

15. A communication device, It is characterized in that The invention comprises a processor and the power module according to any one of claims 1 to 14, wherein the processor is electrically connected to the electronic device.

16. A motor driver, It is characterized in that It comprises a capacitor and at least one power module as described in any one of claims 1 to 14, wherein the power module is electrically connected to the capacitor, the capacitor is used to provide voltage to the power module, the power module is used to convert direct current into alternating current, and the alternating current is used to drive a motor.

17. A powertrain, Features: The invention comprises a motor and a motor driver as claimed in claim 16 connected to the motor, wherein the motor driver is used to provide alternating current to the motor, and the motor is used to convert the alternating current from the motor driver into kinetic energy.

18. A vehicle, Features: It comprises a wheel and a power assembly as claimed in claim 17 connected to the wheel, wherein the power assembly is used to provide power to the wheel to drive the wheel to move.

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