Computer network equipment with good heat dissipation effect

Abstract

The invention relates to the technical field of computer equipment, and discloses computer network equipment with a good heat dissipation effect, the computer network equipment comprises a case, the left side of the case is provided with a case door, the case door is fixedly connected with a handle, the inside of the case is provided with a mainboard, and the right side of the case is connected with a ventilation pipe. A sealing mechanism is arranged in the ventilation pipe; the sealing mechanism comprises a transverse shaft, a spiral groove, a threaded sleeve, a spherical top block and a sealing cover; the ventilation pipe is sealed and covered through the sealing cover, moisture outside the machine box is prevented from entering the machine box, the sealing cover is controlled to be opened and closed through the electric telescopic rod, the movable block, the connecting rod, the first triangular top block, the second triangular top block, the first sliding groove, the first sliding block, the transverse shaft and the spherical top block, and therefore in the rainy season, the ventilation pipe is sealed and covered through the spiral groove. The case is sealed through the sealing cover, so that external moisture can be effectively prevented from entering the case, metal parts on the mainboard are prevented from being corroded, and the service life of hardware is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of computer devices, and particularly to a computer network device with good heat dissipation effect. Background Art

[0002] An electronic computer inference node is a computing unit used to execute AI model inference tasks, and is usually used in deep learning and machine learning applications. The inference node is a key component of an AI system, responsible for applying the trained model to actual data for tasks such as prediction, classification, and detection. A large amount of heat is generated when the electronic computer inference node executes AI model inference tasks. Therefore, an efficient heat dissipation system is crucial for maintaining the performance and stability of the inference node.

[0003] According to a computer network device with good heat dissipation effect disclosed in a Chinese patent with the publication number "CN218037915U", aiming at the problems that the heat dissipation method and heat dissipation range in the existing computer network devices are relatively single, resulting in affecting the use of computer devices, the following solution is proposed. It includes a box body, a computer main body, an air-cooling component and a water-cooling component. The computer main body is placed on the bottom inner wall of the box body. The air-cooling component includes a first motor and a fan blade. The water-cooling component includes a condensation pipe and a refrigerator. The first motor is rotatably installed on the top inner wall of the box body, and the fan blade is fixedly installed on the output shaft of the first motor.

[0004] When the above patent is in use, heat exchange and cooling are carried out between the space inside the computer chassis and the outside through a heat dissipation net. However, in the rainy season, there will be a large amount of moisture in the air, which will enter the computer chassis through the heat dissipation net, resulting in a short circuit of the computer motherboard. Therefore, a computer network device with good heat dissipation effect is proposed to solve the above problems. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a computer network device with good heat dissipation effect aiming at the deficiencies in the above-mentioned prior art.

[0006] To solve the above technical problems, the technical solution adopted by the present invention is: A computer network device with good heat dissipation effect, including a chassis. A box door is arranged on the left side of the chassis, and a handle is fixedly connected to the box door. A main board is installed inside the chassis. A partition is arranged inside the chassis. The area between the right inner wall of the chassis and the partition forms a main board heat dissipation area. A ventilation pipe is connected to the right side of the chassis, and a sealing mechanism is arranged inside the ventilation pipe;

[0007] The sealing mechanism includes a cross shaft, a spiral groove, a threaded sleeve, a spherical top block, and a sealing cover;

[0008] The spiral groove is opened on the horizontal axis, the threaded sleeve is fixedly connected to the inside of the ventilation pipe through a fixing rod, the horizontal axis passes through the threaded sleeve through the spiral groove thread, the spherical top block is fixedly connected to the right end of the horizontal axis, the upper left corner of the sealing cover is hinged to the upper right corner of the ventilation pipe, and a seal is arranged between the two, the right end of the ventilation pipe is sealed by the sealing cover, and when the inside of the chassis needs to be ventilated, the sealing cover is pushed to the right by the spherical top block.

[0009] A brush plate is fixedly connected to the horizontal axis via a vertical rod, and bristles are fixedly connected to the brush plate. The top ends of the bristles are in contact with the inner wall of the ventilation pipe, and the dust and impurities adhering to the inner wall of the ventilation pipe are scraped off by the movement of the bristles. An annular comb plate is fixedly connected to the right side of the inner wall of the ventilation pipe, and a plurality of comb teeth are fixedly connected to the inner wall of the annular comb plate, and are arranged in a circular array. The comb teeth are in contact with the bristles, and the dust and impurities mixed in the bristles are scraped off by setting the comb teeth.

[0010] Preferably, the top inner wall of the chassis is fixedly connected to an electric telescopic rod, the bottom end of the electric telescopic rod is fixedly connected to a movable block, the top of the movable block is fixedly connected to a connecting rod, the right end of the connecting rod is fixedly connected to a first triangular top block, and the left end of the horizontal axis is rotatably connected to a second triangular top block, the inclined surface of the first triangular top block is slidably connected to the inclined surface of the second triangular top block, and the second triangular top block is pushed to the right during the downward movement of the first triangular top block, and a first slide groove is provided on the inclined surfaces of the first triangular top block and the second triangular top block, and the first slide groove is slidably connected to a first slider inside the first slide groove, and the two first sliders are fixedly connected, and the second triangular top block is pulled to the left through the two first sliders and the first slide groove during the upward movement of the first triangular top block.

[0011] Preferably, an air-cooling heat dissipation mechanism is provided inside the chassis, and the air-cooling heat dissipation mechanism includes two sliding bars, the top of the sliding bar is fixedly connected to the top inner wall of the chassis, the outer wall of the sliding bar is provided with a second sliding groove, the second sliding groove includes a straight groove and an arc groove, and the two are connected, the arc groove is arranged above the straight groove, and the arc groove is arranged on the left side of the ventilation duct, the sliding bar is slidably connected with a sliding sleeve, the inner wall of the sliding sleeve is fixedly connected with a second slider, the second slider is slidably connected to the inside of the second sliding groove, the sliding sleeve can move up and down under the limiting action of the sliding bar, and at the same time, under the mutual cooperation of the second slider and the arc groove, the sliding sleeve will rotate when it moves upward to the left side of the ventilation duct.

[0012] Preferably, a connecting block is fixedly connected to one side opposite to the two sliding sleeves, a cooling fan is fixedly connected to the upper and lower sides of the connecting block, and the cooling fan is arranged on the left side of the mainboard, and the mainboard is cooled by arranging the cooling fan.

[0013] Preferably, a fixed pulley is fixedly connected to the inner wall of the top of the chassis. A cable is wound around the fixed pulley. One end of the cable is fixedly connected to the top end of the movable block, and the other end of the cable away from the movable block is fixedly connected to the top heat dissipation fan. A wind collecting hood is fixedly connected to the left end of the ventilation pipe. The cross-sectional area of the air flow is reduced through the wind collecting hood, and the wind speed flowing through the ventilation pipe is increased.

[0014] Preferably, a spray cooling mechanism is arranged inside the chassis. The spray cooling mechanism includes slopes. Two slopes are arranged on the outer wall of the top of the chassis. Two water tanks are fixedly connected to the inner wall of the top of the chassis. A filter screen is arranged on the top of the water tank. The filter screen is arranged below the slopes. A water tank is fixedly connected to the inner wall of the bottom of the chassis. The water tank is connected to the water tank through a water pipe. Rainwater is collected into the water tank by arranging the slopes, water tanks and water pipes. The impurities in the rainwater are filtered by arranging the filter screen.

[0015] Preferably, a heat-conducting copper plate is connected to the heat-generating end of the main board. The heat-conducting copper plate is sleeved on the outside of the main board. A sealed setting is provided among the heat-conducting copper plate, the main board and the inner wall of the chassis. The heat-conducting efficiency of the heat-conducting copper plate is higher, and the heat on the main board can be conducted out more quickly. And moisture is avoided from causing a short circuit of the main board through sealing.

[0016] Preferably, an electric nozzle is fixedly connected to the right side of the movable block. A water pump is installed on the top of the water tank. The bottom water inlet end of the water pump penetrates into the inside of the water tank. The top water outlet end of the water pump is fixedly connected to a hose. The top end of the hose penetrates through the movable block and is connected to the electric nozzle. Rainwater stored in the water tank is pumped up by the water pump and supplied to the electric nozzle. A perforated plate is fixedly connected to the right end of the electric nozzle. The water sprayed by the electric nozzle is dispersed into a large number of small droplets through the multiple small holes arranged on the perforated plate, significantly increasing the number and surface area of the droplets. More droplets mean a larger contact area, thereby improving the cooling efficiency of water on the heat-conducting copper plate.

[0017] The present invention adopts the above technical solutions and can bring the following beneficial effects:

[0018] 1. The invention seals the ventilation pipe by setting a sealing mechanism with a sealing cover to prevent moisture outside the chassis from entering the chassis interior. The opening and closing of the sealing cover are controlled by an electric telescopic rod, a movable block, a connecting rod, a first triangular top block, a second triangular top block, a first chute, a first slider, a horizontal shaft, and a spherical top block. Therefore, during the rainy season, the chassis can be effectively sealed by the sealing cover to prevent external moisture from entering the chassis interior, avoid corrosion of metal components on the motherboard, and extend the lifespan of the hardware. By setting a brush plate and bristles, the dust and impurities adhering to the inner wall of the ventilation pipe are brushed off, thereby improving the smoothness of the ventilation pipe and further enhancing its heat dissipation effect. By setting a threaded sleeve and a spiral groove, the brush plate and bristles rotate while moving, enabling the brush plate to scrape the dust on the inner wall of the ventilation pipe more cleanly. By setting an annular comb plate and comb teeth, the dust and impurities trapped in the bristles are scraped off, thus maintaining the cleanliness of the bristles and improving the cleaning effect of the bristles on the dust on the inner wall of the ventilation pipe.

[0019] 2. The invention sets up an air-cooling heat dissipation mechanism. Four heat dissipation fans are used to dissipate heat from the heat-conducting copper plate and the motherboard simultaneously. By setting a pull rope and a fixed pulley, the heat dissipation fans can move while blowing air for heat dissipation, improving the heat dissipation uniformity of the heat-conducting copper plate and the motherboard. By setting a second slider and an arc-shaped groove, when the sealing cover is opened, the four heat dissipation fans can all face the ventilation pipe. The air flow cross-sectional area is reduced by a wind-gathering cover, increasing the wind speed of the air blown by the four heat dissipation fans in the ventilation pipe, further improving the heat dissipation efficiency of the heat inside the chassis, and blowing out the dust scraped off by the bristles in the ventilation pipe with the high wind speed.

[0020] 3. The invention sets up a spray cooling mechanism. Rainwater is collected and utilized through a slope, a water tank, a water pipe, and a filter screen, saving water resources. The electric nozzle is driven up and down by a movable block, and the rainwater stored in the water tank is sprayed onto the heat-conducting copper plate by the electric nozzle to cool the heat-generating end of the motherboard through the principle of heat conduction. The heat-conducting copper plate has a higher heat conduction efficiency and can more quickly conduct the heat on the motherboard. Sealing is used to prevent short circuits of the motherboard caused by water vapor. By setting multiple small holes on the porous plate, the water sprayed by the electric nozzle is dispersed into a large number of fine water droplets, significantly increasing the number and surface area of the water droplets. More water droplets mean a larger contact area, thereby improving the cooling efficiency of the water on the heat-conducting copper plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 is a schematic diagram of the side structure of the present invention;

[0023] Figure 3 is a schematic diagram of the internal structure of the box area in the present invention;

[0024] Figure 4 is a side cross-sectional view of the side structure schematic diagram in the present invention;

[0025] Figure 5 is an exploded view of the internal structure of the box body area in the present invention;

[0026] Figure 6 is a front cross-sectional view of the movable block area in the present invention;

[0027] Figure 7 In the present invention Figure 6 is an enlarged view of part A;

[0028] Figure 8 is an exploded view of the internal structure of the ventilation pipe area in the present invention;

[0029] Figure 9 is an exploded view of the sliding rod area in the present invention;

[0030] Figure 10 In the present invention Figure 9 is an enlarged view of part B.

[0031] In the figure: 1, chassis; 101, box door; 102, handle; 103, partition; 2, main board; 3, ventilation pipe; 4, sealing mechanism; 401, horizontal axis; 402, spiral groove; 403, threaded sleeve; 404, spherical top block; 405, sealing cover; 406, brush plate; 407, annular comb plate; 408, electric telescopic rod; 409, movable block; 4010, connecting rod; 4011, first triangular top block; 4012, second triangular top block; 4013, first chute; 4014, first slider; 5, air-cooled heat dissipation mechanism; 501, sliding rod; 502, second chute; 503, sliding sleeve; 504, second slider; 505, connecting block; 506, heat dissipation fan; 507, cable; 508, fixed pulley; 509, wind gathering cover; 6, spray cooling mechanism; 601, slope; 602, water tank; 603, filter screen; 604, water tank; 605, water pipe; 606, water pump; 607, electric nozzle; 608, perforated plate; 609, hose; 6010, heat conducting copper plate. Detailed implementation manners

[0032] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] Please refer to Figures 1-10An embodiment of the present invention is: a computer network device with good heat dissipation effect, comprising a chassis 1, a chassis door 101 is arranged on the left side of the chassis 1, a handle 102 is fixedly connected to the chassis door 101, a motherboard 2 is installed inside the chassis 1, a partition 103 is arranged inside the chassis 1, the area between the right inner wall of the chassis (1) and the partition 103 forms a motherboard heat dissipation area, a ventilation pipe 3 is connected to the right side of the chassis 1, and a sealing mechanism 4 is arranged inside the ventilation pipe 3;

[0034] The sealing mechanism 4 includes a transverse shaft 401, a spiral groove 402, a threaded sleeve 403, a spherical top block 404, and a sealing cover 405;

[0035] The spiral groove 402 is opened on the horizontal axis 401, the threaded sleeve 403 is fixedly connected to the inside of the ventilation pipe 3 through a fixing rod, the horizontal axis 401 passes through the threaded sleeve 403 through the spiral groove 402, the spherical top block 404 is fixedly connected to the right end of the horizontal axis 401, the upper left corner of the sealing cover 405 is hinged to the upper right corner of the ventilation pipe 3, and a seal is arranged between the two, the right end of the ventilation pipe 3 is sealed by the sealing cover 405, and when it is necessary to ventilate the inside of the chassis 1, the sealing cover 405 is pushed to the right by the spherical top block 404.

[0036] A brush plate 406 is fixedly connected to the horizontal axis 401 through a vertical rod, and bristles are fixedly connected to the brush plate 406. The top ends of the bristles are in contact with the inner wall of the ventilation pipe 3, and the dust and impurities adhering to the inner wall of the ventilation pipe 3 are scraped off by the movement of the bristles. An annular comb plate 407 is fixedly connected to the right side of the inner wall of the ventilation pipe 3, and a plurality of comb teeth are fixedly connected to the inner wall of the annular comb plate 407, and are arranged in a circular array. The comb teeth are in contact with the bristles, and the dust and impurities mixed in the bristles are scraped off by setting the comb teeth.

[0037] An electric telescopic rod 408 is fixedly connected to the top inner wall of the chassis 1, and a movable block 409 is fixedly connected to the bottom end of the electric telescopic rod 408. A connecting rod 4010 is fixedly connected to the top of the movable block 409. The right end of the connecting rod 4010 is fixedly connected to a first triangular top block 4011, and the left end of the horizontal axis 401 is rotatably connected to a second triangular top block 4012. The inclined surface of the first triangular top block 4011 is slidably connected to the inclined surface of the second triangular top block 4012. During the downward movement of the first triangular top block 4011, the second triangular top block 4012 is pushed to the right. A first sliding groove 4013 is provided on the inclined surfaces of the first triangular top block 4011 and the second triangular top block 4012. A first sliding block 4014 is slidably connected inside the first sliding groove 4013. The two first sliding blocks 4014 are fixedly connected. During the upward movement of the first triangular top block 4011, the second triangular top block 4012 is pulled to the left by the two first sliding blocks 4014 and the first sliding groove 4013.

[0038] Working principle: When the inside of the chassis 1 needs to be cooled, the electric telescopic rod 408 is first turned on to drive the movable block 409 to move downward. The movable block 409 moves downward to drive the first triangular top block 4011 to move downward through the connecting rod 4010. The first triangular top block 4011 moves downward to push the second triangular top block 4012 to the right. The second triangular top block 4012 moves to the right to drive the horizontal axis 401 to move to the right. The horizontal axis 401 moves to the right to drive the spherical top block 404 to move to the right and push the sealing cover 405 open, so that the space inside the chassis 1 can exchange heat with the outdoors for cooling. The horizontal axis 401 moves to the right to drive the brush plate 406 and the bristles to move to the right through the vertical rod, and brushes off the dust and impurities adhering to the inner wall of the ventilation pipe 3, maintaining the patency of the ventilation pipe 3. The horizontal axis 401 rotates itself under the action of the spiral groove 402 and the threaded sleeve 403 during the movement to the right. The horizontal axis 401 rotates while moving to the right, driving the brush plate 406 to move to the right and rotate at the same time, so that the brush plate 406 can scrape the dust on the inner wall of the ventilation pipe 3 more cleanly. The dust and impurities mixed in the bristles are scraped off by providing an annular comb plate 407 and comb teeth, thereby maintaining the cleanliness of the bristles and improving the cleaning effect of the bristles on the dust on the inner wall of the ventilation pipe 3.

[0039] See also Figures 1-10 On the basis of the above embodiment, in another embodiment of the present invention, an air-cooling heat dissipation mechanism 5 is arranged inside the chassis 1, and the air-cooling heat dissipation mechanism 5 includes two sliding bars 501, and the top of the sliding bar 501 is fixedly connected to the top inner wall of the chassis 1, and the outer wall of the sliding bar 501 is provided with a second sliding groove 502, and the second sliding groove 502 includes a straight groove and an arc groove, and the two are connected, and the arc groove is arranged above the straight groove, and the arc groove is arranged on the left side of the ventilation pipe 3, and a sliding sleeve 503 is slidably connected to the sliding bar 501, and a second slider 504 is fixedly connected to the inner wall of the sliding sleeve 503, and the second slider 504 is slidably connected to the inside of the second sliding groove 502, and the sliding sleeve 503 can move up and down under the limiting action of the sliding bar 501, and under the mutual cooperation of the second slider 504 and the arc groove, the sliding sleeve 503 will rotate when it moves upward to the left side of the ventilation pipe 3.

[0040] A connecting block 505 is fixedly connected to one side opposite to the two sliding sleeves 503 , and a cooling fan 506 is fixedly connected to the upper and lower sides of the connecting block 505 . The cooling fan 506 is arranged on the left side of the mainboard 2 , and the mainboard 2 is cooled by the cooling fan 506 .

[0041] A fixed pulley 508 is fixedly connected to the top inner wall of the chassis 1, and a cable 507 is wound around the fixed pulley 508. One end of the cable 507 is fixedly connected to the top of the movable block 409, and the other end of the cable 507 away from the movable block 409 is fixedly connected to the top cooling fan 506. The left end of the ventilation duct 3 is fixedly connected to a wind collecting hood 509, which reduces the cross-sectional area of ​​the airflow and increases the wind speed flowing through the ventilation duct 3.

[0042] Working principle: While the movable block 409 moves downward, the four heat dissipation fans 506 are pulled upward to the horizontal height of the ventilation pipe 3 through two ropes 507, and rotate under the action of the second slider 504 and the arc-shaped groove, and face the ventilation pipe 3. The wind blown by the heat dissipation fans 506 discharges the heat in the chassis 1 to the outside through the ventilation pipe 3. The air flow cross-sectional area is reduced by the air gathering hood 509, so that the wind speed of the wind blown by the four heat dissipation fans 506 in the ventilation pipe 3 increases, and the dust scraped off by the bristles in the ventilation pipe 3 is blown out by the high wind speed.

[0043] Please refer to Figures 1-10 , on the basis of the above embodiments, in another embodiment of the present invention, a spray cooling mechanism 6 is provided inside the chassis 1. The spray cooling mechanism 6 includes slopes 601. Two slopes 601 are provided on the outer wall of the top of the chassis 1. Two water tanks 602 are fixedly connected to the inner wall of the top of the chassis 1. A filter screen 603 is provided on the top of the water tank 602. The filter screen 603 is arranged below the slopes 601. A water tank 604 is fixedly connected to the inner wall of the bottom of the chassis 1. The water tank 604 is connected to the water tank 602 through a water pipe 605. Rainwater is collected into the water tank 604 by arranging the slopes 601, the water tanks 602 and the water pipe 605, and impurities in the rainwater are filtered by arranging the filter screen 603.

[0044] A heat conducting copper plate 6010 is connected to the heat generating end of the main board 2. The heat conducting copper plate 6010 is sleeved outside the main board 2. A sealed setting is provided among the heat conducting copper plate 6010, the main board 2 and the inner wall of the chassis 1. The heat conducting efficiency of the heat conducting copper plate 6010 is higher, and the heat on the main board 2 can be conducted out more quickly, and short circuit of the main board 2 caused by water vapor is avoided through sealing.

[0045] An electric nozzle 607 is fixedly connected to the right side of the movable block 409. A water pump 606 is installed on the top of the water tank 604. The bottom water inlet end of the water pump 606 penetrates into the interior of the water tank 604. The top water outlet end of the water pump 606 is fixedly connected to a hose 609. The top end of the hose 609 penetrates through the movable block 409 and is connected to the electric nozzle 607. The rainwater stored in the water tank 604 is pumped up by the water pump 606 and supplied to the electric nozzle 607. A perforated plate 608 is fixedly connected to the right end of the electric nozzle 607. The water sprayed by the electric nozzle 607 is dispersed into a large number of fine water droplets through the multiple small holes on the perforated plate 608, significantly increasing the number and surface area of the water droplets. More water droplets mean a larger contact area, thereby improving the cooling efficiency of the water for the heat conducting copper plate 6010.

[0046] Working principle: Rainwater is collected into the water tank 604 by setting a ramp 601, a water tank 602, and a water pipe 605. The impurities in the rainwater are filtered by setting a filter screen 603. The movable block 409 moves up and down to drive the electric nozzle 607 to move up and down, and the rainwater stored in the water tank 604 is sprayed onto the heat-conducting copper plate 6010 through the electric nozzle 607. The heat-generating end of the main board 2 is cooled through the heat conduction principle. The heat-conducting copper plate 6010 has a higher heat conduction efficiency and can conduct the heat on the main board 2 more quickly. And it is sealed to prevent the main board 2 from being short-circuited due to water vapor. The water sprayed by the water-electric nozzle 607 is dispersed into a large number of small droplets through the multiple small holes on the perforated plate 608, significantly increasing the number and surface area of the droplets. More droplets mean a larger contact area, thereby improving the cooling efficiency of water for the heat-conducting copper plate 6010.

[0047] The present invention provides a computer network device with good heat dissipation effect. There are many methods and ways to specifically implement this technical solution. The above is only the preferred embodiment of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention. Each component not clearly defined in this embodiment can be implemented by using the prior art.

Claims

1. A computer network device with good heat dissipation effect, comprising a chassis (1), characterized in that: The left side of the chassis (1) is provided with a cabinet door (101), the cabinet door (101) is fixedly connected with a handle (102), a mainboard (2) is installed inside the chassis (1), a partition (103) is provided inside the chassis (1), the area between the right inner wall of the chassis (1) and the partition (103) forms a mainboard heat dissipation area, the right side of the chassis (1) is connected with a ventilation pipe (3), and a sealing mechanism (4) is provided inside the ventilation pipe (3); The sealing mechanism (4) comprises a transverse shaft (401), a spiral groove (402), a threaded sleeve (403), a spherical top block (404), and a sealing cover (405); The spiral groove (402) is formed on the transverse axis (401); the threaded sleeve (403) is fixedly connected to the inside of the ventilation pipe (3) via a fixing rod; the transverse axis (401) passes through the threaded sleeve (403) via the spiral groove (402); the spherical top block (404) is fixedly connected to the right end of the transverse axis (401); the upper left corner of the sealing cover (405) is hinged to the upper right corner of the ventilation pipe (3), and a sealing arrangement is provided between the two; A brush plate (406) is fixedly connected to the horizontal axis (401) via a vertical rod, bristles are fixedly connected to the brush plate (406), the top ends of the bristles are in contact with the inner wall of the ventilation pipe (3), an annular comb plate (407) is fixedly connected to the right side of the inner wall of the ventilation pipe (3), a plurality of comb teeth are fixedly connected to the inner wall of the annular comb plate (407), and the comb teeth are in contact with the bristles.

2. A computer network device with good heat dissipation effect according to claim 1, characterized in that: The top inner wall of the chassis (1) is fixedly connected with an electric telescopic rod (408), the bottom end of the electric telescopic rod (408) is fixedly connected with a movable block (409), the top of the movable block (409) is fixedly connected with a connecting rod (4010), the right end of the connecting rod (4010) is fixedly connected with a first triangular top block (4011), the left end of the horizontal axis (401) is rotatably connected with a second triangular top block (4012), the inclined surface of the first triangular top block (4011) is slidably connected with the inclined surface of the second triangular top block (4012), a first sliding groove (4013) is provided on the inclined surfaces of the first triangular top block (4011) and the second triangular top block (4012), the interior of the first sliding groove (4013) is slidably connected with a first sliding block (4014), and the two first sliding blocks (4014) are fixedly connected.

3. A computer network device with good heat dissipation effect according to claim 2, characterized in that: The chassis (1) is provided with an air-cooling heat dissipation mechanism (5), which comprises two sliding bars (501), the top of the sliding bar (501) is fixedly connected to the top inner wall of the chassis (1), the outer wall of the sliding bar (501) is provided with a second sliding groove (502), the second sliding groove (502) comprises a straight groove and an arc groove, and the two are connected, the arc groove is arranged above the straight groove, and the arc groove is arranged on the left side of the ventilation pipe (3), the sliding bar (501) is slidably connected with a sliding sleeve (503), the inner wall of the sliding sleeve (503) is fixedly connected with a second sliding block (504), and the second sliding block (504) is slidably connected to the inside of the second sliding groove (502).

4. The computer network device with good heat dissipation effect according to claim 3, characterized in that: A connecting block (505) is fixedly connected to one side opposite to the two sliding sleeves (503), and a heat dissipation fan (506) is fixedly connected to the upper and lower sides of the connecting block (505), and the heat dissipation fan (506) is arranged on the left side of the mainboard (2).

5. The computer network device with good heat dissipation effect according to claim 4, characterized in that: A fixed pulley (508) is fixedly connected to the inner wall of the top of the chassis (1), a rope (507) is wound around the fixed pulley (508), one end of the rope (507) is fixedly connected to the top of the movable block (409), and the other end of the rope (507) away from the movable block (409) is fixedly connected to the cooling fan (506) at the top, and a wind collecting cover (509) is fixedly connected to the left end of the ventilation pipe (3), and the wind collecting cover 509 reduces the cross-sectional area of ​​the airflow, thereby increasing the wind speed flowing through the ventilation pipe 3.

6. The computer network device with good heat dissipation effect according to claim 5, characterized in that: A spray cooling mechanism (6) is arranged inside the chassis (1), and the spray cooling mechanism (6) comprises a slope (601). The top outer wall of the chassis (1) is provided with two slopes (601). The top inner wall of the chassis (1) is fixedly connected with two water troughs (602). A filter screen (603) is arranged on the top of the water trough (602), and the filter screen (603) is arranged below the slope (601). The bottom inner wall of the chassis (1) is fixedly connected with a water tank (604), and the water tank (604) is connected to the water trough (602) via a water pipe (605).

7. The computer network device with good heat dissipation effect according to claim 6, characterized in that: A heat-conducting copper plate (6010) is connected to the heating end of the mainboard (2); the heat-conducting copper plate (6010) is sleeved on the outside of the mainboard (2); and the heat-conducting copper plate (6010), the mainboard (2), and the inner wall of the chassis (1) are sealed.

8. The computer network device with good heat dissipation effect according to claim 7, characterized in that: The right side of the movable block (409) is fixedly connected to an electric nozzle (607), the top of the water tank (604) is equipped with a water pump (606), the bottom water inlet of the water pump (606) penetrates into the interior of the water tank (604), the top water outlet of the water pump (606) is fixedly connected to a hose (609), the top end of the hose (609) penetrates the movable block (409) and is connected to the electric nozzle (607), and the right end of the electric nozzle (607) is fixedly connected to a porous plate (608).

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