Light mixing RGB stacking structure and packaging method thereof

Abstract

The invention discloses a light mixing RGB stacking structure and a packaging method thereof, and the method comprises the following steps: pasting a chip on a substrate packaged with a metal block, packaging the chip, and grinding a packaging surface to expose the front surface of the chip; drilling a hole on the packaging surface exposing the front surface of the chip until the top surface of the metal block is exposed, extending electroplating metal in the hole and on the packaging surface, transferring the electrical property of part of the electrode on the front surface of the chip to the metal block from the electroplating metal, leading out to the bottom surface, and packaging the electroplating metal; drilling holes in the packaging surface until other electrodes on the front surface of the chip are exposed, electrically leading the other electrodes on the front surface of the chip to the top surface by the electroplating circuit, and packaging the circuit; etching a groove on the top surface of the encapsulation to expose the top surface of the circuit, and mounting the light-emitting unit group in the groove and connecting the light-emitting unit group with the circuit to realize electrical connection between the chip and the light-emitting unit group; the whole size is reduced, the inner wall of the groove formed by the encapsulation body has a reflecting and gathering effect on the three-primary-color lamp beads of the light-emitting unit group, and the light mixing effect is good.

Description

Technical Field

[0001] The present invention belongs to the technical field of RGB packaging, and particularly relates to a mixed-light RGB stacking structure and a packaging method thereof. Background Art

[0002] With the development of integrated circuits and devices towards miniaturization, semiconductor devices, as one of the core electronics of integrated circuits, also show the development requirements of high integration, miniaturization, high performance, and low cost. In this field, both RGB LEDs and white LEDs can achieve the effect of white light. The white LED directly presents white light monochromatically, while the RGB LED is formed by mixing red, green, and blue primary color lights. Therefore, the RGB lamp forms an image by the intersection of the three primary colors. This RGB lamp can adjust the intensity of these three colors respectively to achieve a mixed-light effect, thereby realizing a very rich lighting effect. RGB lamps are widely used in stage lighting, billboards, building facades, and other occasions.

[0003] When mixing the three primary color lights, the intensity of each color light is controlled and adjusted by an IC chip electrically connected to the RGB. The control chip is the core of the integrated circuit dedicated to controlling the RGB lamp. Currently, when the RGB three-primary-color lamps are electrically connected to the control chip respectively, after the RGB is packaged into a package body and electrically connected to the chip through a circuit layer, and then encapsulated into a whole by encapsulating materials, resulting in a relatively large overall packaging size, the RGB light is scattered, and the mixed-light effect is poor. Summary of the Invention

[0004] To solve the above problems in the prior art, the present invention provides a mixed-light RGB stacking structure and a packaging method thereof.

[0005] To achieve the above object, a mixed-light RGB stacking structure and a packaging method thereof proposed by the present invention include the following steps: Chip mounting: Mount the chip on a substrate encapsulated with a metal block, encapsulate the chip, and grind the encapsulation surface to expose the front of the chip; Bottom electrical lead-out: Drill holes in the encapsulation surface exposing the front of the chip until the top surface of the metal block is exposed, and electroplate metal in the holes and on the encapsulation surface. Part of the electrodes on the front of the chip transfer the electrical property to the metal block and then lead out to the bottom surface, and then encapsulate the electroplated metal; Top electrical lead-out: Drill holes in the encapsulation surface until the other electrodes on the front of the chip are exposed, and the electroplated circuit leads out the electrical property of the other electrodes on the front of the chip to the top surface and encapsulates the circuit; Light-emitting unit group mounting: Etch a groove on the encapsulation top surface to expose the top surface of the circuit, mount the light-emitting unit group into the groove and connect it to the circuit to realize the electrical connection between the chip and the light-emitting unit group, and peel off the substrate to form a package body.

[0006] Further, in the chip mounting step, a substrate is provided, on which metal blocks are electroplated. The metal blocks are arranged at the same height. The metal blocks are encapsulated on the substrate, and the top surface of the metal blocks is exposed by grinding the top surface of the encapsulation. The chip is mounted on the encapsulation surface with the back surface of the chip facing the substrate.

[0007] Further, in the bottom surface electrical lead-out step, metal columns are electroplated in the holes, and a metal wiring layer is electroplated on the encapsulation surface. The wiring layer connects the columns and part of the electrodes on the front surface of the chip. The electrical connection of part of the electrodes on the front surface of the chip is transferred to the metal blocks through the wiring layer and the columns and then led out to the bottom surface.

[0008] Furthermore, in the top surface electrical lead-out step, the circuit includes the metal electroplated in the drilled holes and the metal extending on the encapsulation surface, and the two parts of the metal are electroplated and connected as a whole.

[0009] Furthermore, in the light-emitting unit group mounting step, the groove is formed by laser etching, and the groove is located above the chip.

[0010] Further, in the light-emitting unit group mounting step, the light-emitting unit group includes light-emitting diodes of the three primary colors of red, green, and blue. The light-emitting diodes of the light-emitting unit group are respectively mounted on the bottom of the groove and are electrically connected to the circuit.

[0011] Further, in the light-emitting unit group mounting step, the groove is filled with a transparent encapsulation glue layer to make the top surface of the encapsulation body flat.

[0012] A mixed-light RGB stacking structure includes an encapsulation body, and encapsulated in the encapsulation body are: A chip, part of the electrodes on the front surface of the chip are transferred to the bottom surface of the encapsulation body through the electroplated wiring layer, columns, and metal blocks. The bottom surface of the metal block is flush with the bottom surface of the encapsulation body and is exposed; A circuit, other electrodes on the front surface of the chip are led out to the top surface of the encapsulation body through the electroplated circuit; A groove, a groove is etched at a corresponding position on the top surface of the encapsulation body, and the top surface of the circuit is exposed in the groove; A light-emitting unit group, the light-emitting unit group is mounted in the groove and is respectively electrically connected to the top surface of the circuit to realize the electrical connection between the chip and the light-emitting unit group.

[0013] Further, after electroplating and encapsulating the metal block, its top surface is exposed by grinding. The chip is mounted on the encapsulation surface and the front surface of the chip is exposed by encapsulating and grinding.

[0014] Further, drill holes on the encapsulation surface to expose the top surface of the metal block, electroplate metal columns in the holes, and electroplate a wiring layer on the encapsulation surface. The wiring layer connects the columns and part of the electrodes on the front surface of the chip.

[0015] Further, the circuit includes the metal electroplated in the drill hole and the metal extending on the encapsulation surface, and the two parts of the metal are electroplated and connected as a whole.

[0016] Further, the groove is formed by laser etching, and the groove is located above the chip.

[0017] Further, the light-emitting unit group includes light-emitting beads of the three primary colors of red, green, and blue. The light-emitting beads of the light-emitting unit group are respectively mounted on the bottom of the groove and are electrically connected to the circuit.

[0018] Further, the groove is filled with a transparent encapsulation glue layer to make the top surface of the encapsulation body flat.

[0019] After the chip is mounted upright in the present invention, a groove is opened on the top surface of the encapsulation above the chip and the light-emitting unit group is mounted, realizing the electrical control of the chip over the light-emitting unit group. The whole process flow is simple, the size is reduced, and the cost is lowered. The inner wall of the groove formed by the encapsulation body has a reflection and gathering effect on the light of the three primary color light-emitting beads of the light-emitting unit group, and the light mixing effect is good. Description of the Drawings

[0020] Figures 1 - 5 It is a cross-sectional view of the chip mounting step of a light mixing RGB stacked structure encapsulation method of the present invention; Figures 6 - 8 It is a cross-sectional view of the bottom electrical lead-out step of a light mixing RGB stacked structure encapsulation method of the present invention; Figures 9 - 11 It is a cross-sectional view of the top electrical lead-out step of a light mixing RGB stacked structure encapsulation method of the present invention; Figures 12 - 15 It is a cross-sectional view of the light-emitting unit group mounting step of a light mixing RGB stacked structure encapsulation method of the present invention; Figure 16 It is one of the product cross-sectional views of a light mixing RGB stacked structure of the present invention;

[0021] Figure 17 It is the second of the product cross-sectional views of a light mixing RGB stacked structure of the present invention.

[0022] In the figure: 1. Encapsulation body; 2. Chip; 3. Circuit; 4. Groove; 5. Light-emitting unit group; 6. Metal block; 7. Column; 8. Wiring layer. Detailed Embodiments

[0023] The content of the present invention will be described below in conjunction with specific embodiments. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar components or components with the same or similar functions throughout.

[0024] The directional terms mentioned in the present invention, such as: up, down, left, right, front, back, inside, outside, front side, back side, side, etc., are only with reference to the directions in the attached drawings. The embodiments described below with reference to the attached drawings and the directional terms used are exemplary and are only used to explain the present invention, and should not be construed as a limitation to the present invention. In addition, for the various specific examples of processes and materials provided by the present invention, those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0025] To better understand the purpose, structure and function of the present invention, the following will further describe in detail a mixed - light RGB stacking structure and its encapsulation method proposed by the present invention with reference to the attached Figure 1 - attached Figure 15 drawings. The method includes the following steps: Chip 2 mounting: Mount chip 2 on a substrate encapsulated with a metal block 6, encapsulate chip 2, and grind the encapsulation surface to expose the front side of chip 2; Bottom - surface electrical lead - out: Drill holes in the encapsulation surface exposing the front side of chip 2 until the top surface of the metal block 6 is exposed, and electroplate metal in the holes and on the encapsulation surface. Part of the electrodes on the front side of chip 2 are electrically transferred to the metal block 6 and then led out to the bottom surface, and then the electroplated metal is encapsulated; Top - surface electrical lead - out: Drill holes in the encapsulation surface until other electrodes on the front side of chip 2 are exposed, and the electroplating circuit leads out the electricity of other electrodes on the front side of chip 2 to the top surface, and encapsulate the circuit; Light - emitting unit group 5 mounting: Etch a groove 4 on the encapsulated top surface to expose the top surface of the circuit 3, mount the light - emitting unit group 5 into the groove 4 and connect it to the circuit 3 to realize the electrical connection between chip 2 and the light - emitting unit group 5, and peel off the substrate to form the encapsulation body 1.

[0026] Among them, as Figures 1 - 5 shown, in the chip 2 mounting step, a substrate is provided. The substrate is made of materials commonly used in the art, which can be a resin board or other materials. According to the reasonable design of the spatial layout on the substrate surface, first electroplate a plurality of metal blocks 6 evenly at corresponding positions on the substrate (as Figure 1 shown). The electroplated metal blocks 6 have the same height. After electroplating, use encapsulating material to encapsulate the metal blocks 6 evenly on the substrate, and use mechanical grinding on the encapsulation top surface to horizontally grind to expose the top surfaces of all metal blocks 6 (as Figure 2 shown).

[0027] Then, chip 2 is mounted at the corresponding position on the polished encapsulation cover. The back surface (non-functional surface) of chip 2 faces the substrate and is mounted on the encapsulation cover, with the front surface (functional surface) of chip 2 facing upward. There is a Bump (conductive ball implanted) conductive electrode structure on the front surface of chip 2. The number of chips 2 placed can be set according to the surface area of the substrate. In this application, three chips 2 are taken as an example. The chips 2 are respectively mounted at the corresponding positions of metal block 6. The back surface of chip 2 is mounted on the encapsulation cover through the adhesive bonding glue (as Figure 3 shown), and then the encapsulation cover exposing the top surface of metal block 6 is polished and the chip 2 is completely encapsulated again using encapsulation material (as Figure 4 shown). Similarly, the top surface of the encapsulation is polished by mechanical grinding until all the front electrodes of chips 2 are exposed (as Figure 5 shown).

[0028] Chip 2 can be an RGB control chip 2, which is the core of an integrated circuit specifically used to control RGB lights. It can adjust the brightness of each primary color channel through voltage or digital signals, thereby achieving precise control of RGB lights. Its working principle is to adjust the brightness of RGB lights by changing the duty cycle of the PWM signal (pulse width modulation). Because this kind of chip 2 usually contains multiple PWM (pulse width modulation) controllers, it can be used to control the brightness of the red, green, and blue channels respectively; in addition, it also includes a color correction circuit for correcting the color imbalance problem between RGB channels to ensure the accuracy of the output color, and usually has a wide input voltage range and high current output capacity, making it suitable for various different types of RGB light applications. At the same time, it also has multiple protection functions, such as over-temperature protection, over-current protection, and short-circuit protection, which can ensure the reliability and safety of LED lights. The chip 2 used in this application is a common type in the art.

[0029] Among them, as Figures 6 - 8 shown, in the bottom surface electrical lead-out step, during the chip 2 mounting step, holes are drilled at the positions of the corresponding metal blocks 6 on the horizontal encapsulation cover exposing the front surface of chip 2 through laser or other etching methods to remove the encapsulation material above the metal blocks 6, so that the top surface of the metal blocks 6 is exposed at the bottom of the holes (as Figure 6 shown). Through the electroplating process, electroplating continues. The electroplating solution first penetrates into the holes, fills the holes by electroplating to form metal columns 7, and then continues to electroplate along the encapsulation cover on the encapsulation cover to form a wiring layer 8 (as Figure 7As shown in the figure, the wiring layer 8 covers the top end of the column 7. The column 7 and the wiring layer 8 are electroplated and connected as a whole. The column 7 and the metal block 6 are electroplated and connected as a whole. One end of the wiring layer 8 extends flat along the encapsulation surface to cover part of the electrodes of the chip 2 and is electroplated and connected as a whole with the electrodes of the chip 2, realizing the electrical connection from part of the electrodes of the chip 2 to the metal block 6. The electrical property of the front part of the electrodes of the chip 2 is transferred by electroplated metal to the metal block 6 and then led out to the bottom surface of the encapsulant. Then, during the chip 2 mounting step, the encapsulant is used to continue encapsulate on the top surface of the formed encapsulation, completely encapsulating the electroplated metal wiring layer 8 and the column 7 (as Figure 8 shown). According to the height dimension design of the entire product, the optimal encapsulation thickness here is set. After encapsulation, the top surface of the encapsulation is horizontal and flat.

[0030] Among them, as Figures 9 - 11 shown, in the top surface electrical lead-out step, at the corresponding position on the top surface of the encapsulation formed in the bottom surface electrical lead-out step, drilling is carried out by laser or other etching methods. The corresponding position refers to the other electrodes on the chip 2 except for the part of the electrodes that are electrically connected to the metal block 6 in the bottom surface electrical lead-out step. In the attached figure, it is a cross-sectional view, only showing the electrodes of the chip 2 that are not blocked. The number of electrodes is set according to the electrical connection situation of the chip 2. Since the remaining other electrodes need to be electrically connected to the light-emitting unit group 5 to realize the electrical control of the chip 2 over the light-emitting unit group 5, and each group of the light-emitting unit group 5 has R, G, and B three-primary-color lamp beads, so three remaining other electrodes should be set. Remove the corresponding encapsulant on part of the electrodes of the chip 2, making the other electrodes of the chip 2 exposed at the bottom of the hole (as Figure 9 shown). Through the electroplating process, electroplating continues. The electroplating solution first penetrates into the hole, electroplating and filling the hole with metal, and then continues to electroplate metal flat along the encapsulation surface on the encapsulation surface. The two parts of the metal are electroplated and connected as a whole to form a circuit (as Figure 10 shown). The circuit 3 electrically leads out the other electrodes on the front of the chip 2 to the top surface of the encapsulant. The bottom surface refers to the lowest surface of the encapsulant formed by all encapsulations, that is, the side close to the substrate in the attached figure. The top surface refers to the topmost surface of the encapsulant formed by all encapsulations, that is, the opposite surface of the bottom surface of the encapsulant. Through the drilling, electroplating, and encapsulation processes, the electrodes of the chip are led out of the encapsulant in two opposite directions. On the top surface of the encapsulation formed in the bottom surface electrical lead-out step, the encapsulant is used to completely encapsulate the circuit 3 (as Figure 11 shown). According to the height dimension design of the entire product and the height dimension of the R, G, and B three-primary-color light-emitting unit group, the optimal encapsulation thickness here is set. After encapsulation, the top surface of the encapsulation is horizontal and flat.

[0031] Among them, as Figures 12 - 15 shown, in the light-emitting unit group 5 mounting step, at the corresponding position above the chip 2 on the top surface of the encapsulation formed in the top surface electrical lead-out step, a groove 4 is etched out. The groove 4 is formed by laser etching. The top surface of the circuit 3 is all exposed in the groove 4 (asFigure 12 As shown in the figure, the light-emitting unit group 5 is mounted in the groove 4, and a group of light-emitting unit groups 5 are mounted in the groove 4 (as Figure 13 shown). Each group of the light-emitting unit group 5 is composed of lamp beads of the three primary colors R, G, and B. The lamp beads of the three primary colors of the light-emitting unit group are electrically connected to the circuit respectively, so that the chip 2 can separately electrically control the lamp beads of the three primary colors in the light-emitting unit group 5. The chip 2 is the core of an integrated circuit dedicated to controlling RGB lamps and can adjust the brightness of each lamp bead of the three primary colors through voltage or digital signals, thereby achieving precise control of the RGB lamps.

[0032] Furthermore, the groove 4 is filled with a transparent encapsulation glue layer to make the top surface of the encapsulation body 1 flat (as Figure 14 shown). After the transparent encapsulation glue layer fills the groove 4, the light-emitting unit group 5 is encapsulated and protected, and has a longer service life.

[0033] Since multiple chips 2 are encapsulated simultaneously in this application, finally, a cutting process is required to cut the encapsulation material at the cutting lane position to separate it into product units (as Figure 15 shown). The encapsulation material of each product unit is the encapsulation body 1 as a whole, and then the substrate is removed by mechanical peeling or other means; after the chip 2 is mounted face up, a groove is opened on the top surface of the encapsulation above the chip 2 and the light-emitting unit group 5 is mounted to realize the electrical control of the light-emitting unit group 5 by the chip 2. The entire process flow is simple, the size is reduced, and the cost is lowered. The inner wall of the groove 4 formed by the encapsulation body has a reflective and converging effect on the light of the lamp beads of the three primary colors of the light-emitting unit group 5, and the encapsulation material is black, which helps with the light mixing effect.

[0034] By adjusting the intensities of these three colors of the three primary colors of the light-emitting unit group 5, more than 16 million different colors can be generated. When the three primary colors are mixed, it follows the principle of additive color mixing: when the spectral distribution or color coordinates of the RGB three-color light sources participating in the color mixing are determined, any color within the region can be mixed. The mixed color is determined by the relative proportion of the light fluxes of the RGB three primary colors, and the total brightness of the color mixing is equal to the sum of the light fluxes of the three primary colors, thereby achieving a very rich lighting effect.

[0035] Through the above color mixing RGB stacked structure encapsulation method, a color mixing RGB stacked structure can be obtained, as Figure 16 and Figure 17 shown. This structure includes an encapsulation body 1, and encapsulated in the encapsulation body 1 are: A chip 2, and part of the electrodes on the front surface of the chip 2 are transmitted to the bottom surface of the encapsulation body 1 through the electroplated wiring layer 8, the column 7, and the metal block 6. The bottom surface of the metal block 6 is flush with the bottom surface of the encapsulation body 1 and is exposed; A circuit 3, and other electrodes on the front surface of the chip 2 are led out to the top surface of the encapsulation body 1 through the electroplated circuit 3; The groove 4 is etched at the corresponding position on the top surface of the package body 1, and the top surface of the circuit 3 is exposed within the groove 4; The light-emitting unit group 5 is mounted within the groove 4 and is electrically connected to the top surface of the circuit 3 respectively, realizing the electrical connection between the chip 2 and the light-emitting unit group 5.

[0036] After electroplating and encapsulating the metal block 6, its top surface is polished to be exposed. The chip 2 is mounted on the encapsulating surface and then encapsulated and polished to expose the front surface of the chip 2. A hole is drilled on the encapsulating surface until the top surface of the metal block 6 is exposed. A metal column 7 is electroplated within the hole, and a wiring layer 8 is electroplated on the encapsulating surface. The wiring layer 8 connects the column 7 and some electrodes on the front surface of the chip 2. The circuit 3 includes the metal electroplated within the hole and the metal extending on the encapsulating surface, and the two parts of the metal are electroplated and connected as a whole. The groove 4 is formed by laser etching. The groove 4 is located above the chip 2. The light-emitting unit group 5 includes light-emitting beads of the three primary colors of red, green, and blue. The light-emitting beads of the light-emitting unit group 5 are respectively mounted on the bottom of the groove 4 and are electrically connected to the circuit 3 (as Figure 16 shown).

[0037] Furthermore, the groove 4 is filled with a transparent encapsulating glue layer to make the top surface of the package body 1 flat (as Figure 17 shown). After the transparent encapsulating glue layer fills the groove 4, the light-emitting unit group 5 is encapsulated and protected, and has a longer service life.

[0038] The encapsulating material adopted in the present invention can be epoxy resin, cyanate ester, polyimide, etc. It has low cost and good curing performance. The encapsulation process plays an important role in the semiconductor manufacturing field, mainly reflected in aspects such as protection, connection, support, reliability, and promotion of technological progress. The protection function means that the encapsulation of the chip 2 can protect the chip 2 from mechanical damage, moisture, dust, and other external environmental factors, ensuring the normal operation of the chip 2 in extreme environments; the connection function means that the encapsulation provides a way to connect the chip 2 with other electronic components, enabling the chip to be installed and used on a circuit board; the support function means that while supporting the chip 2, the encapsulation can fix the chip 2 to prevent its damage; the reliability means that the requirements for the reliability of the encapsulation material and process are getting higher and higher to ensure the normal operation of the chip 2 in various extreme environments.

[0039] For all the steps using the electroplating process in the present invention, first, electroplating protection is formed on the surface through photolithography techniques such as exposure and development, and then a metal seed layer is formed in the area to be electroplated through a suitable method such as sputtering or electroless copper plating. The metal seed layer is made of copper or other metal materials. The metal seed layer is to ensure the bonding force between the metal electroplated subsequently and the encapsulating material, and at the same time provide a surface for conductive ions to attach for electroplating to ensure the electroplating effect. The entire steps and materials used in the electroplating process are also common technical knowledge in this field.

[0040] After the chip 2 is mounted face up, a groove is formed on the top surface of the encapsulation above the chip 2 and the light-emitting unit group 5 is mounted, so as to realize the electrical control of the chip 2 over the light-emitting unit group 5. The whole technological process is simple, the size is reduced, and the cost is lowered. The inner wall of the groove 4 formed by the encapsulation has a reflection and convergence effect on the trichromatic lamp beads of the light-emitting unit group 5, and the light mixing effect is good.

[0041] It can be understood that the present invention is described by means of some embodiments. Those skilled in the art know that, without departing from the spirit and scope of the present invention, various changes or equivalent replacements can be made to these features and embodiments. In addition, under the teaching of the present invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present invention belong to the scope protected by the present invention.

Claims

1. A mixed light RGB stacking structure packaging method, characterized in that: The following steps are involved: Chip mounting: mounting the chip on a substrate encapsulated with a metal block, encapsulating the chip, and grinding the encapsulation surface to expose the front side of the chip; Bottom surface electrical lead-out: Drill holes on the package surface that exposes the front of the chip until the top surface of the metal block is exposed, and extend the electroplated metal in the hole and on the package surface. The electrical properties of some electrodes on the front of the chip are transferred from the electroplated metal to the metal block and then led to the bottom surface, and then the electroplated metal is encapsulated; Electrical lead-out from the top surface: Drill holes in the package surface until other electrodes on the front of the chip are exposed, and the electroplating circuits electrically lead other electrodes on the front of the chip to the top surface to encapsulate the circuits; Mounting of the light-emitting unit group: a groove is etched on the top surface of the package to expose the top surface of the circuit, the light-emitting unit group is mounted into the groove and connected to the circuit to achieve electrical connection between the chip and the light-emitting unit group, and the substrate is peeled off to form a package.

2. The packaging method of the mixed light RGB stacking structure according to claim 1, characterized in that: In the chip mounting step, a substrate is provided, on which metal blocks are electroplated, the metal blocks are arranged at the same height, the metal blocks are encapsulated on the substrate, and the top surface of the encapsulation is polished to expose the top surface of the metal blocks, and the chip is mounted on the encapsulation surface with the back of the chip facing the substrate.

3. The packaging method of the mixed light RGB stacking structure according to claim 1, characterized in that: In the bottom surface electrical lead-out step, a metal column is electroplated in the hole, and a metal wiring layer is electroplated on the package surface. The wiring layer connects the column and the electrode on the front side of the chip. The electrical properties of the electrode on the front side of the chip are transferred from the wiring layer and the column to the metal block and then led to the bottom surface.

4. The packaging method of the mixed light RGB stacking structure according to claim 3, characterized in that: In the top surface electrical lead-out step, the circuit includes metal plated in the drilled hole and metal extending on the package surface, and the two parts of metal are connected as a whole by electroplating.

5. The packaging method of the mixed light RGB stacking structure according to claim 1, characterized in that: In the light emitting unit assembly mounting step, the groove is formed by laser etching, and the groove is positioned above the chip.

6. The packaging method of the mixed light RGB stacking structure according to claim 1, characterized in that: In the light-emitting unit group mounting step, the light-emitting unit group includes red, green and blue primary color lamp beads, and the lamp beads of the light-emitting unit group are respectively mounted on the bottom of the groove and electrically connected to the circuit.

7. The packaging method of the mixed light RGB stacking structure according to claim 6, characterized in that: In the step of mounting the light emitting unit group, a transparent packaging glue layer is filled in the groove to make the top surface of the packaging body flat.

8. A mixed light RGB stacking structure, comprising a package, characterized in that: The package contains: Chip, wherein the electrodes on the front side of the chip are transferred to the bottom side of the package through the electroplated wiring layer, pillars and metal blocks, and the bottom side of the metal block is flush with the bottom side of the package and exposed; Circuit, other electrodes on the front side of the chip are led out to the top surface of the package through electroplated circuits; A groove is etched at a corresponding position on the top surface of the package body, and the top surface of the circuit is exposed in the groove; The light-emitting unit group is mounted in the groove and electrically connected to the top surface of the circuit respectively, so as to realize the electrical connection between the chip and the light-emitting unit group.

9. The light-mixing RGB stacking structure according to claim 8, characterized in that: The metal block is electroplated and encapsulated, then ground to expose its top surface, and a chip is mounted on the encapsulation surface and encapsulated and ground to expose the chip front surface.

10. The light-mixing RGB stacking structure according to claim 9, characterized in that: Holes are drilled on the package surface to expose the top surface of the metal block, metal pillars are electroplated in the holes, and a wiring layer is electroplated on the package surface. The wiring layer connects the pillars to the electrodes on the front side of the chip.

11. The light-mixing RGB stacking structure according to claim 10, characterized in that: The circuit includes metal plated in the drilled hole and metal extending on the package surface, and the two parts of metal are connected into a whole by electroplating.

12. The light-mixing RGB stacking structure according to claim 8, characterized in that: The groove is formed by laser etching, and the groove is positioned above the chip.

13. The light-mixing RGB stacking structure according to claim 8, characterized in that: The light-emitting unit group includes red, green and blue primary color lamp beads. The lamp beads of the light-emitting unit group are respectively mounted on the bottom of the groove and are electrically connected to the circuit.

14. The light-mixing RGB stacking structure according to claim 13, characterized in that: The groove is filled with a transparent packaging glue layer to make the top surface of the packaging body flat.

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