Display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel and electronic equipment, and relates to the technical field of display. The isolation structure comprises the first isolation opening and the second isolation opening in the first display area, the sub-pixel device having a light blocking effect is only arranged in the second isolation opening, and compared with the second isolation opening, the first isolation opening has higher light transmittance, so that the light transmittance of the first display area can be improved. Besides, the transparent conductive layer is electrically connected with the isolation structure forming the first isolation opening, so that the transparent conductive layer has a stable potential signal, and a shielding layer located between the array substrate and the touch function layer can be formed at the first isolation opening; signal crosstalk between the driving wires in the array substrate and the touch wires in the touch function layer is shielded, it is ensured that the display panel has a good display function and a good touch function, and the user experience is improved.

Description

Technical Field

[0001] This application relates to the field of display technologies, and more particularly, to a display panel and an electronic device. Background Art

[0002] With the development of technologies, the industry often disposes some optical sensors (such as fingerprint recognition sensors, infrared ranging sensors, and ambient light sensing sensors, etc.) under a display panel to increase the functions of an electronic device and improve the attractiveness of the electronic device to users.

[0003] To ensure the normal operation of the optical sensors, a certain light transmittance is required for the display panel area corresponding to the optical sensors. Therefore, it is necessary to adjust the film layer structure of this display panel area. However, after the film layer adjustment, there are problems of poor display function and / or touch function of the display panel, reducing the user experience. Summary of the Invention

[0004] To overcome the technical problems mentioned in the above technical background, this application provides a display panel and an electronic device.

[0005] In a first aspect of this application, a display panel is provided. The display panel includes a first display area and at least a part of a second display area surrounding the first display area;

[0006] The display panel includes:

[0007] An array substrate;

[0008] An isolation structure, which is located on the array substrate and includes a first isolation opening and a second isolation opening. Among them, the first isolation opening is located in the first display area, and the second isolation opening is located in the first display area and the second display area;

[0009] Sub-pixel devices, which are located in the second isolation opening;

[0010] A touch function layer, which is located on a side of the sub-pixel devices away from the array substrate;

[0011] A transparent conductive layer, which is located between the array substrate and the touch function layer and in a region corresponding to the first isolation opening, and the transparent conductive layer is electrically connected to the isolation structure.

[0012] In a possible implementation manner of this application, in the first display area, the first isolation opening and the second isolation opening are evenly distributed;

[0013] Preferably, in the first display area, the ratio of the number of the first isolation openings to the number of the second isolation openings ranges from greater than or equal to 1:2 to less than or equal to 2:1;

[0014] Preferably, the array substrate includes driving traces, and the touch function layer includes touch traces. In the first display area, the orthographic projection of the driving traces and / or the touch traces on the array substrate does not overlap with the orthographic projection of the first isolation openings on the array substrate;

[0015] Preferably, the isolation structure includes a stacked isolation portion and a blocking portion, and the orthographic projection of the isolation portion on the array substrate is located within the orthographic projection of the blocking portion on the array substrate;

[0016] Preferably, the isolation structure further includes an isolation substrate, and the isolation substrate, the isolation portion, and the blocking portion are stacked in sequence. The orthographic projection of the isolation portion on the array substrate is located within the orthographic projection of the isolation substrate on the array substrate, and the orthographic projection of the isolation substrate on the array substrate is located within the orthographic projection of the blocking portion on the array substrate;

[0017] In the direction facing the first isolation openings or the second isolation openings, the isolation substrate and the blocking portion respectively protrude relative to the isolation portion;

[0018] Preferably, the isolation substrate is a conductive isolation substrate, the isolation portion is a conductive isolation portion, and the blocking portion is a conductive blocking portion;

[0019] Preferably, the cathode of the sub-pixel device is electrically connected to the isolation structure forming the second isolation openings.

[0020] In a possible implementation manner of the present application, the display panel further includes a pixel defining layer, the pixel defining layer is located on one side of the array substrate, and the isolation structure is located on the side of the pixel defining layer away from the array substrate;

[0021] The pixel defining layer includes pixel openings, wherein the pixel openings communicate with the second isolation openings, and the sub-pixel devices are disposed in the pixel openings;

[0022] The sub-pixel devices include an anode, a light-emitting material layer, and a cathode stacked in sequence;

[0023] Preferably, the light-emitting material layer extends from the pixel openings to the side of the pixel defining layer away from the array substrate, and the cathode extends from the pixel openings to the side of the pixel defining layer away from the array substrate and is connected to the isolation structure forming the second isolation openings.

[0024] In a possible implementation manner of the present application, the transparent conductive layer is located on the side of the pixel defining layer close to the array substrate, or the transparent conductive layer is located within the array substrate;

[0025] Preferably, the transparent conductive layer is connected to the isolation structure forming the first isolation opening through a via hole in the pixel defining layer.

[0026] In a possible implementation manner of the present application, the transparent conductive layer is located on the side of the pixel defining layer away from the array substrate;

[0027] The transparent conductive layer is connected to the isolation structure forming the first isolation opening;

[0028] Preferably, the transparent conductive layer is fabricated on the same layer as the cathode of the sub-pixel device.

[0029] In a possible implementation manner of the present application, the transparent conductive layer includes one of an indium tin oxide conductive layer, a zinc oxide aluminum conductive layer, and an indium tin zinc oxide conductive layer.

[0030] In a possible implementation manner of the present application, the touch function layer includes a touch pattern formed by the touch traces;

[0031] In the first display area, the touch function layer further includes a shielding layer, and the shielding layer is located on the side of the touch pattern facing the array substrate;

[0032] In the first display area, the orthographic projection of the touch pattern on the array substrate is located within the orthographic projection of the shielding layer on the array substrate;

[0033] Preferably, the distance range between the contour edge of the orthographic projection of the shielding layer on the array substrate and the contour edge of the orthographic projection of the touch pattern on the array substrate is greater than or equal to 0.5um and less than or equal to 1um.

[0034] In a possible implementation manner of the present application, the shielding layer includes a metal layer and an insulating layer, the insulating layer is located on the side of the touch pattern facing the array substrate, and the metal layer is located on the side of the insulating layer facing the array substrate;

[0035] The orthographic projection of the insulating layer on the array substrate coincides with the orthographic projection of the metal layer on the array substrate.

[0036] In a possible implementation manner of the present application, the display panel further includes a packaging layer, and the packaging layer includes a first inorganic packaging layer, an organic packaging layer, and a second inorganic packaging layer;

[0037] The first inorganic encapsulation layer is located on a side of the sub-pixel device facing away from the array substrate, and extends to a side of the isolation structure forming the second isolation opening and facing away from the array substrate;

[0038] The organic encapsulation layer covers the first inorganic encapsulation layer and an area outside the first inorganic encapsulation layer;

[0039] The second inorganic encapsulation layer is located on a side of the organic encapsulation layer facing away from the array substrate.

[0040] In a second aspect of the present application, there is provided an electronic device, which includes an optical sensor and a display panel in any one of the possible implementation manners of the first aspect;

[0041] The optical sensor is located on a backlight side of the display panel and at a position corresponding to the first display area.

[0042] The embodiments of the present application provide a display panel and an electronic device. In the display panel, the isolation structure includes a first isolation opening and a second isolation opening in the first display area. The sub-pixel device that blocks light is only disposed in the second isolation opening. Relative to the second isolation opening, the first isolation opening has a stronger light transmittance, so that the light transmittance of the first display area can be improved. In addition, the transparent conductive layer is electrically connected to the isolation structure, so that the transparent conductive layer has a stable potential signal, and a shielding layer can be formed at the position of the first isolation opening between the array substrate and the touch function layer to shield signal crosstalk between the driving trace in the array substrate and the touch trace in the touch function layer, ensuring that the display panel has good display and touch functions and improving the user experience. Description of the Drawings

[0043] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0044] Figure 1 Schematically shows a regional distribution diagram of the display panel provided in this embodiment;

[0045] Figure 2 Schematically shows one of the partial film layer structures of the display panel provided in this embodiment;

[0046] Figure 3 Schematically shows a distribution diagram of the isolation structure around the first display area provided in this embodiment;

[0047] Figure 4Schematic diagram II of partial film layer structure of the display panel provided in this embodiment;

[0048] Figure 5 Schematic diagram III of partial film layer structure of the display panel provided in this embodiment;

[0049] Figure 6 Schematic diagram IV of partial film layer structure of the display panel provided in this embodiment;

[0050] Figure 7 Schematic diagram V of partial film layer structure of the display panel provided in this embodiment;

[0051] Figure 8 Schematic diagram VI of partial film layer structure of the display panel provided in this embodiment;

[0052] Figure 9 Top view schematic diagram of the touch pattern and the shielding layer provided in this embodiment;

[0053] Figure 10 is Figure 9 Partial enlarged schematic diagram of the dashed area in;

[0054] Figure 11 Schematic diagram VII of partial film layer structure of the display panel provided in this embodiment;

[0055] Figure 12 Schematic diagram of partial structure of the electronic device provided in this embodiment.

[0056] Icons: 1 - Electronic device; 10 - Display panel; 10A - Second display area; 10B - First display area; 110 - Array substrate; 1101 - Driving trace; 120 - Isolation structure; 12011 - First isolation opening; 12012 - Second isolation opening; 1202 - Isolation substrate; 1203 - Isolation part; 1204 - Blocking part; 130 - Sub-pixel device; 1301 - Anode; 1302 - Light-emitting material layer; 1303 - Cathode; 140 - Touch function layer; 141 - Touch pattern; 1401 - Touch trace; 1402 - Shielding layer; 14021 - Metal layer; 14022 - Insulating layer; 150 - Transparent conductive layer; 160 - Pixel defining layer; 1601 - Pixel opening; 170 - Encapsulation layer; 1701 - First inorganic encapsulation layer; 1702 - Organic encapsulation layer; 1703 - Second inorganic encapsulation layer. Detailed implementation manners

[0057] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are some, but not all, of the embodiments of this application. Components of the embodiments of this application usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0058] In the description of this application, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this application is usually placed when in use. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to this application.

[0059] Through long-term research, the inventors found that in some display panels, in order to reduce the difficulty of the evaporation process of the light-emitting material, an isolation structure is provided on the pixel definition layer between pixel apertures. When the light-emitting material layer and the cathode layer are evaporated in one layer, the light-emitting material layer and the cathode layer between adjacent pixel apertures can be disconnected at the position of the isolation structure. Through multiple evaporation and multiple etching processes, corresponding sub-pixel device film layers can be formed in the pixel apertures corresponding to different color sub-pixel devices.

[0060] When an optical sensor is provided below such a display panel, in order to ensure that a certain light transmittance is achieved in the target display panel area corresponding to the optical sensor, it is necessary to cancel the film layer with poor light transmittance in the target display panel area. In the related art, the sub-pixel device film layer with poor light transmittance in the target display panel area is cancelled.

[0061] However, after the sub-pixel device film layer in the target display panel area corresponding to the optical sensor is cancelled, it is found that the display function and / or touch function of the display panel will be affected to a certain extent. For example, the touch accuracy of the target panel area decreases, and the display uniformity of the display panel is affected, etc.

[0062] To solve the above problems, the inventors have innovatively designed the following technical solutions. The following will describe the specific implementation solutions of this application in detail with reference to the accompanying drawings. It should be noted that the defects existing in the above solutions in the prior art are all the results obtained by the inventors through practice and careful research. Therefore, the discovery process of the above technical problems and the solutions proposed by the embodiments below for the above problems should be the contributions made by the inventors to this application during the invention creation process, and should not be construed as well-known technical content in the art.

[0063] Please refer to Figure 1 and Figure 2 ,Figure 1 Schematic diagram of the distribution of each region of the display panel provided in this embodiment Figure 2 Schematic diagram of a partial film layer structure of the display panel provided in this embodiment. In this embodiment, the display panel 10 includes a first display area 10B and a second display area 10A. The second display area 10A at least partially surrounds the first display area 10B. The light transmittance of the first display area 10B is greater than that of the second display area 10A. The shape of the first display area 10B may include a circle, a rectangle, a water droplet shape, etc. In this embodiment, no specific limitation is made on the shape of the first display area 10B.

[0064] The display panel 10 includes an array substrate 110, an isolation structure 120, sub-pixel devices 130, and a touch function layer 140. The isolation structure 120 is located on one side of the array substrate 110. The isolation structure 120 forms a first isolation opening 12011 and a second isolation opening 12012 on the array substrate 110. The first isolation opening 12011 is located in the first display area 10B, and the second isolation opening 12012 is located in the first display area 10B and the second display area 10A. That is, the first isolation opening 12011 and the second isolation opening 12012 are distributed in the first display area 10B, and the second isolation opening 12012 is distributed in the second display area 10A.

[0065] The sub-pixel devices 130 are located in the second isolation opening 12012, and no sub-pixel devices 130 are provided in the first isolation opening 12011. In this embodiment, at least one sub-pixel device 130 may be provided in the second isolation opening 12012. The pixel driving circuit in the array substrate 110 is connected to the sub-pixel devices 130 to drive the sub-pixel devices 130 to emit light. Preferably, one sub-pixel device 130 is provided in one second isolation opening 12012.

[0066] The touch function layer 140 is located on the side of the sub-pixel devices 130 away from the array substrate 110.

[0067] In this embodiment, the display panel 10 further includes a transparent conductive layer 150. The transparent conductive layer 150 is located in the region between the array substrate 110 and the touch function layer 140 and corresponding to the first isolation opening 12011. The transparent conductive layer 150 is electrically connected to the isolation structure 120 forming the first isolation opening 12011.

[0068] In the above structure, the isolation structure 120 includes a first isolation opening 12011 and a second isolation opening 12012 in the first display area 10B. The sub-pixel device 130 that blocks light is only disposed in the second isolation opening 12012. Relative to the second isolation opening 12012, the first isolation opening 12011 has a stronger light transmittance, so that the light transmittance of the first display area 10B can be improved. In addition, the transparent conductive layer 150 is electrically connected to the isolation structure 120 forming the first isolation opening 12011, so that the transparent conductive layer 150 has a stable potential signal, and a shielding layer can be formed between the array substrate 110 and the touch function layer 140 at the position of the first isolation opening 12011, which shields the signal crosstalk between the driving signal in the array substrate 110 and the touch signal in the touch function layer 140, thereby ensuring that the display panel 10 has good display and touch functions.

[0069] In order to make the light transmission of the first display area 10B uniform, please refer to Figure 3 , in the first display area 10B, the first isolation opening 12011 and the second isolation opening 12012 are evenly distributed. In this embodiment, in the first display area 10B, the ratio of the number of the first isolation openings 12011 to the number of the second isolation openings 12012 ranges from greater than or equal to 1:2 to less than or equal to 2:1. Exemplarily, the ratio of the number of the first isolation openings 12011 to the number of the second isolation openings 12012 includes 1:2, 3:5, 2:3, 1:1, 3:2, 5:3, and 2:1. In order to balance the light transmission and display function of the first display area 10B, preferably, the ratio of the number of the first isolation openings 12011 to the number of the second isolation openings 12012 is 1:1.

[0070] In this embodiment, the cathode of the sub-pixel device 130 is electrically connected to the isolation structure 120 forming the second isolation opening 12012. In the second display area 10A, the cathode of the sub-pixel device 130 is electrically connected to the isolation structure 120 to form a conductive layer covering the entire second display area 10A. In the first display area 10B, the cathode of the sub-pixel device 130, the isolation structure 120, and the transparent conductive layer 150 can be connected to form a conductive layer covering the entire first display area 10B. That is, through the above connection method, a conductive layer covering the display area of the entire display panel 10 can be formed. When an external voltage signal is applied to this conductive layer, the same cathode voltage signal can be ensured for the entire display panel, ensuring the uniformity of display.

[0071] Further, in order to increase the light transmittance of the first display area 10B, it is necessary to increase the light transmittance of the area where the first isolation opening 12011 is located. For this purpose, there should be no traces with poor light transmittance passing through the area where the first isolation opening 12011 is located. Specifically, in this embodiment, the array substrate 110 includes driving traces 1101 that provide display driving signals for pixel driving circuits. The driving traces 1101 can be formed by different metal layers in the array substrate 110. The touch function layer 140 includes touch traces 1401 for forming touch patterns 141. In the first display area 10B, the orthographic projection of the driving traces 1101 and / or the touch traces 1401 on the array substrate 110 does not overlap with the orthographic projection of the first isolation opening 12011 on the array substrate 110. With such a design, the light transmittance of the area where the first isolation opening 12011 is located can be improved, thereby increasing the light transmittance of the first display area 10B.

[0072] Please refer to Figure 4 , the isolation structure 120 includes an isolation part 1203 and a blocking part 1204 which are stacked. The orthographic projection of the isolation part 1203 on the array substrate 110 is located within the orthographic projection of the blocking part 1204 on the array substrate 110. Optionally, in this embodiment, the isolation structure 120 may further include an isolation substrate 1202. The isolation substrate 1202, the isolation part 1203, and the blocking part 1204 are stacked in sequence. The orthographic projection of the isolation part 1203 on the array substrate 110 is located within the orthographic projection of the isolation substrate 1202 on the array substrate 110, and the orthographic projection of the isolation substrate 1202 on the array substrate 110 is located within the orthographic projection of the blocking part 1204 on the array substrate 110.

[0073] In the direction towards the corresponding first isolation opening 12011 or the second isolation opening 12012, the isolation substrate 1202 and the blocking part 1204 protrude relative to the isolation part 1203 respectively. In this embodiment, the isolation substrate 1202 is a conductive isolation substrate, the isolation part 1203 is a conductive isolation part, and the blocking part 1204 is a conductive blocking part.

[0074] In one embodiment, the transparent conductive layer 150 can be electrically connected to the isolation structure 120 by connecting to the isolation substrate 1202.

[0075] Exemplarily, the isolation substrate 1202 can be made of metal molybdenum, the isolation part 1203 can be made of metal aluminum, and the blocking part 1204 can be made of metal titanium. By applying a voltage signal to the blocking part 1204, the same cathode voltage signal can be obtained in the plane of the display panel 10, thereby ensuring the display uniformity of the display panel.

[0076] Please refer to Figure 5, Further, the display panel 10 further includes a pixel definition layer 160. The pixel definition layer 160 is located on one side of the array substrate 110, and the isolation structure 120 is located on the side of the pixel definition layer 160 away from the array substrate 110. The pixel definition layer 160 includes pixel openings 1601, and the pixel openings 1601 communicate with the second isolation openings 12012. The sub-pixel devices 130 are disposed in the pixel openings 1601.

[0077] The sub-pixel devices 130 include an anode 1301, a light-emitting material layer 1302, and a cathode 1303 which are stacked. The anode 1301 is distributed at intervals on one side of the array substrate 110. Exemplarily, the anode 1301 is distributed at the position of the array substrate 110 corresponding to the isolation opening 1201, and the pixel opening 1601 exposes the anode 1301. The light-emitting material layer 1302 extends from the pixel opening 1601 to the side of the pixel definition layer 160 away from the array substrate 110. The cathode 1303 extends from within the pixel opening 1601 to the side of the pixel definition layer 160 away from the array substrate 110 and is connected to the isolation structure 120 forming the second isolation opening 12012. Exemplarily, the cathode 1303 extends from within the pixel opening 1601 to the side of the pixel definition layer 160 away from the array substrate 110 and is lapped with the isolation substrate 1202 around the second isolation opening 12012.

[0078] Please refer to Figure 5 , In a possible implementation manner of this embodiment, the transparent conductive layer 150 is located on the side of the pixel definition layer 160 close to the array substrate 110. The transparent conductive layer 150 is connected to the isolation structure 120 forming the first isolation opening 12011 through a via hole in the pixel definition layer 160. Exemplarily, the transparent conductive layer 150 is connected to the side of the isolation substrate 1202 facing the array substrate 110 around the first isolation opening 12011 through a via hole in the pixel definition layer 160. In this implementation manner, it is necessary to pre-fabricate the transparent conductive layer 150 on the surface or inside of the array substrate 110 so that the transparent conductive layer 150 can be electrically connected to the isolation substrate 1202 of the isolation structure 120 fabricated subsequently.

[0079] Please refer to Figure 6, in another possible implementation manner of this embodiment, the transparent conductive layer 150 is located inside the array substrate 110. The transparent conductive layer 150 is connected to the isolation structure 120 forming the first isolation opening 12011 through a via hole in the pixel defining layer 160. Exemplarily, the transparent conductive layer 150 is connected to the side of the isolation substrate 1202 facing the array substrate 110 around the first isolation opening 12011 through a via hole in the pixel defining layer 160. In this implementation manner, it is necessary to pre-fabricate the transparent conductive layer 150 on the surface or inside of the array substrate 110 so that the transparent conductive layer 150 can be electrically connected to the isolation substrate 1202 of the isolation structure 120 fabricated subsequently.

[0080] Please refer to Figure 7 , in yet another possible implementation manner of this embodiment, the transparent conductive layer 150 is located on the side of the pixel defining layer 160 away from the array substrate 110, and the transparent conductive layer 150 overlaps with the isolation substrate forming the first isolation opening 12011. Exemplarily, the transparent conductive layer 150 overlaps with the side of the isolation substrate 1202 forming the first isolation opening 12011 away from the array substrate 110. In this implementation manner, the transparent conductive layer 150 can be fabricated on the same layer as the cathode of a sub-pixel device of a certain color (such as red). Exemplarily, when depositing the light-emitting material layer of the sub-pixel device of this color, a mask plate can be used to block the first isolation opening 12011, and only expose the first isolation opening 12011 when fabricating the cathode of the sub-pixel device of this color, so as to fabricate the transparent conductive layer 150 on the same layer as the cathode of the sub-pixel device of this color. The transparent conductive layer 150 in this implementation manner does not require additional new process steps for fabrication, and the fabrication process is simple and the manufacturing cost is lower.

[0081] In this embodiment, the transparent conductive layer 150 may include one of an indium tin oxide (ITO) conductive layer, a zinc aluminum oxide (AZO) conductive layer, and an indium tin zinc oxide (ITZO) conductive layer. Using the above conductive layer as the transparent conductive layer 150 can not only ensure the light transmittance of the first display area 10B, but also has good electrical conductivity, ensuring that there is no signal crosstalk between the driving traces 1101 in the array substrate 110 and the touch traces 1401 in the touch function layer 140 in the first display area 10B.

[0082] Please refer to Figure 8 and Figure 9 , the touch function layer 140 includes a touch pattern 141 formed by touch traces 1401. In the first display area 10B, the touch function layer 140 further includes a shielding layer 1402. The shielding layer 1402 is located on the side of the touch pattern 141 facing the array substrate 110. In the first display area 10B, the orthographic projection of the touch pattern 141 on the array substrate 110 is located within the orthographic projection of the shielding layer 1402 on the array substrate 110. In this embodiment, please refer toFigure 10 , the distance d between the contour edge of the positive projection of the shielding layer 1402 on the array substrate 110 and the contour edge of the positive projection of the touch pattern 141 on the array substrate 110 ranges from greater than or equal to 0.5um to less than or equal to 1um. Exemplarily, the distance d includes 0.5um, 0.52um, 0.58um, 0.63um, 0.72um, 0.81um, 0.87um, 0.98um, 1um, etc. With such a design, signal interference between the driving trace 1101 and the touch trace 1401 can be further avoided, and the anti-interference ability of the driving trace 1101 and the touch trace 1401 can be improved.

[0083] Furthermore, the shielding layer 1402 includes a metal layer 14021 and an insulating layer 14022. The insulating layer 14022 is located on the side of the touch pattern 141 facing the array substrate 110, and the metal layer 14021 is located on the side of the insulating layer 14022 facing the array substrate 110. The positive projection of the insulating layer 14022 on the array substrate 110 coincides with the positive projection of the metal layer 14021 on the array substrate 110. With such a design, not only can the anti-interference ability of the traces in the first display area be enhanced, but the newly added metal layer 14021 and insulating layer 14022 can also disperse the folding stress generated during folding, improving the anti-folding performance of the display panel 10.

[0084] Furthermore, please refer to Figure 11 , the display panel 10 further includes a packaging layer 170. The packaging layer 170 includes a first inorganic packaging layer 1701, an organic packaging layer 1702, and a second inorganic packaging layer 1703. The first inorganic packaging layer 1701 is located on the side of the sub-pixel device 130 facing away from the array substrate 110 and extends to the side of the isolation structure 130 forming the second isolation opening 12012 facing away from the array substrate 110. The first inorganic packaging layer 1701 includes a plurality of packaging units, and adjacent packaging units are disconnected on the side of the same isolation structure 120 facing away from the array substrate 110. Each packaging unit is used to package the sub-pixel device 130 in one isolation opening 1201, and the first inorganic packaging layer 1701 can be fabricated by chemical vapor deposition. The organic packaging layer 1702 covers the first inorganic packaging layer 1701 and the area outside the first inorganic packaging layer 1701. The organic packaging layer 1702 can be fabricated by inkjet printing. The organic packaging layer 1702 can fill the light-emitting surface of the entire display panel flat so as to fabricate subsequent film layers above it. The second inorganic packaging layer 1703 is located on the side of the organic packaging layer 1702 facing away from the array substrate 110, and the second inorganic packaging layer 1703 is fabricated by chemical vapor deposition. The touch function layer 140 is located on the side of the second inorganic packaging layer 1703 facing away from the array substrate 110.

[0085] Based on the same inventive concept, this embodiment further provides an electronic device. Please refer to Figure 12 , the electronic device 1 includes an optical sensor 20 and the display panel 10 described in the previous embodiment. The optical sensor 20 is located on the backlight side of the display panel 10 and at a position corresponding to the first display area 10B. Using the above display panel 10 can not only ensure the light transmittance of the first display area corresponding to the optical sensor 20, but also enable the display panel 10 to have good display and touch functions, ensuring a good user experience for the user.

[0086] The embodiment of the present application provides a display panel and an electronic device. In the display panel, the isolation structure forms a first isolation opening and a second isolation opening in the first display area. The sub-pixel devices that block light are only arranged in the second isolation opening. Compared with the second isolation opening, the first isolation opening has a stronger light transmittance, so that the light transmittance of the first display area can be improved. In addition, the transparent conductive layer is electrically connected to the isolation structure forming the first isolation opening, so that the transparent conductive layer has a stable potential signal, and a shielding layer can be formed between the array substrate and the touch function layer at the position of the first isolation opening to shield the signal crosstalk between the driving traces in the array substrate and the touch traces in the touch function layer, ensuring that the display panel has good display and touch functions.

[0087] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that, the display panel includes a first display area and a second display area at least partially surrounding the first display area; the display panel includes: an array substrate; an isolation structure, the isolation structure is located on the array substrate and includes a first isolation opening and a second isolation opening, wherein the first isolation opening is located in the first display area, and the second isolation opening is located in the first display area and the second display area; sub-pixel devices, the sub-pixel devices are located in the second isolation opening; a touch function layer, the touch function layer is located on a side of the sub-pixel devices away from the array substrate; a transparent conductive layer, the transparent conductive layer is located in a region corresponding to the first isolation opening between the array substrate and the touch function layer, and the transparent conductive layer is electrically connected to the isolation structure.

2. The display panel according to claim 1, characterized in that, in the first display area, the first isolation opening and the second isolation opening are evenly distributed; preferably, in the first display area, the ratio of the number of the first isolation openings to the number of the second isolation openings ranges from greater than or equal to 1:2 to less than or equal to 2:1; preferably, the array substrate includes driving traces, the touch function layer includes touch traces, and in the first display area, the orthographic projection of the driving traces and / or the touch traces on the array substrate does not overlap with the orthographic projection of the first isolation opening on the array substrate; preferably, the isolation structure includes a stacked isolation portion and a blocking portion, and the orthographic projection of the isolation portion on the array substrate is located within the orthographic projection of the blocking portion on the array substrate; preferably, the isolation structure further includes an isolation substrate, the isolation substrate, the isolation portion and the blocking portion are stacked in sequence, the orthographic projection of the isolation portion on the array substrate is located within the orthographic projection of the isolation substrate on the array substrate, and the orthographic projection of the isolation substrate on the array substrate is located within the orthographic projection of the blocking portion on the array substrate; in a direction facing the corresponding first isolation opening or the second isolation opening, the isolation substrate and the blocking portion respectively protrude relative to the isolation portion; preferably, the isolation substrate is a conductive isolation substrate, the isolation portion is a conductive isolation portion, and the blocking portion is a conductive blocking portion; preferably, the cathode of the sub-pixel device is electrically connected to the isolation structure forming the second isolation opening.

3. The display panel according to claim 1, characterized in that, the display panel further includes a pixel defining layer, the pixel defining layer is located on one side of the array substrate, and the isolation structure is located on a side of the pixel defining layer away from the array substrate; the pixel defining layer includes pixel openings, wherein the pixel openings communicate with the second isolation openings, and the sub-pixel devices are disposed in the pixel openings; the sub-pixel devices include an anode, a light-emitting material layer and a cathode stacked in sequence; Preferably, the light-emitting material layer extends from the pixel opening to the side of the pixel defining layer away from the array substrate, and the cathode extends from the pixel opening to the side of the pixel defining layer away from the array substrate and is connected to the isolation structure forming the second isolation opening.

4. The display panel according to claim 3, wherein, the transparent conductive layer is located on the side of the pixel defining layer close to the array substrate, or the transparent conductive layer is located within the array substrate; Preferably, the transparent conductive layer is connected to the isolation structure forming the first isolation opening through a via hole in the pixel defining layer.

5. The display panel according to claim 3, wherein, the transparent conductive layer is located on the side of the pixel defining layer away from the array substrate; the transparent conductive layer is connected to the isolation structure forming the first isolation opening; Preferably, the transparent conductive layer is fabricated on the same layer as the cathode of the sub-pixel device.

6. The display panel according to claim 1, wherein, the transparent conductive layer includes one of an indium tin oxide conductive layer, a zinc oxide aluminum conductive layer, and an indium tin zinc oxide conductive layer.

7. The display panel according to any one of claims 1-6, wherein, the touch function layer includes a touch pattern formed by touch traces; in the first display area, the touch function layer further includes a shielding layer, and the shielding layer is located on the side of the touch pattern facing the array substrate; in the first display area, the orthographic projection of the touch pattern on the array substrate is located within the orthographic projection of the shielding layer on the array substrate; Preferably, the distance range between the contour edge of the orthographic projection of the shielding layer on the array substrate and the contour edge of the orthographic projection of the touch pattern on the array substrate is greater than or equal to 0.5um and less than or equal to 1um.

8. The display panel according to claim 7, wherein, the shielding layer includes a metal layer and an insulating layer, the insulating layer is located on the side of the touch pattern facing the array substrate, and the metal layer is located on the side of the insulating layer facing the array substrate; the orthographic projection of the insulating layer on the array substrate coincides with the orthographic projection of the metal layer on the array substrate.

9. The display panel according to any one of claims 1-6, wherein, the display panel further includes a packaging layer, and the packaging layer includes a first inorganic packaging layer, an organic packaging layer, and a second inorganic packaging layer; the first inorganic packaging layer is located on the side of the sub-pixel device facing away from the array substrate and extends to the side of the isolation structure forming the second isolation opening away from the array substrate; the organic packaging layer covers the first inorganic packaging layer and the area outside the first inorganic packaging layer; the second inorganic packaging layer is located on the side of the organic packaging layer away from the array substrate.

10. An electronic device, wherein, the electronic device includes an optical sensor and the display panel according to any one of claims 1-9; the optical sensor is located on the backlight side of the display panel and at a position corresponding to the first display area.

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