Semiconductor adhesive tape and preparation method thereof

Abstract

Semiconductor adhesive tapes for cables, such as high voltage power cables, and methods of making such adhesive tapes are provided. The semiconductor tape includes a first layer comprising a fabric and a second layer in contact with the first layer. The second layer includes activated carbon or carbon black. The semiconductor tape has increased frictional force while still maintaining sufficient conductivity for use as a cladding for power cables, thereby improving the manufacturing process and reducing the overall production cost.

Description

[0001] Cross - reference to related applications

[0002] This application claims the benefit of U.S. Provisional Application Serial No. 63 / 417,772, filed Oct. 20, 2022, the entire disclosure of which is incorporated herein by reference for all purposes. Technical Field

[0003] This specification generally relates to semiconductor tapes, and more particularly to semiconductor tapes for cables such as overhead, underwater, or underground power cables. Background Art

[0004] High - voltage power cables are used to transmit medium - voltage or high - voltage electricity. The cable generally includes a conductor and a polymeric insulation system surrounding the conductor. A power cable that can be buried underground is called a land cable. A power cable that can be buried in the seabed and freely extend between two fixed points in seawater is called a submarine power cable, a seawater power cable, or an underwater power cable. Nowadays, due to the increasing demand for transmitting electricity from offshore energy sources (including offshore renewable energy facilities such as wind power facilities), the use of underwater power cables is increasing. In addition, due to the need to interconnect power transmission networks in different regions for global energy trade, the length of power transmission cables is also increasing. The energy - demand regions and energy - production regions may also be far apart, which further increases the demand for safe power transmission.

[0005] Semiconductor cable tapes can be used in many cushioning, bundling, insulating, connecting, and identification applications in heavy - duty power cables, multi - core cables, and communication cables. Semiconductor cable tapes have a variety of physical and electrical properties and are suitable for a variety of cable - manufacturing applications.

[0006] Semiconductor cable tapes are typically made of a nylon, polyester, or woven PET substrate coated on one or both sides with a cross - linked acrylic semiconductor compound. These tapes help balance the field current around the power conductor or core and ensure electrical contact with the grounding system. This reduces the electrical stress on the insulation material and improves performance. They can also be used to prevent electrolytic corrosion of the metal armor layer in high - voltage cables.

[0007] Although these semiconductor cable tapes have proven useful, they also have drawbacks. For example, the acrylic semiconductor compounds commonly used in these tapes typically have a relatively low coefficient of friction, which makes them slippery, especially during the process of manufacturing cables. This poses challenges to production and can increase the total cost of manufacturing cables.

[0008] Tapes with a relatively high coefficient of friction, such as cloth tapes or polyvinyl chloride (PVC) electrical tapes, have a higher coefficient of friction than standard semiconductor cable tapes. However, these types of tapes generally do not have sufficient electrical conductivity and thus cannot be used as the cladding for power cables.

[0009] Therefore, there is a need for semiconductor cable tapes that can both increase friction to improve the manufacturing process and maintain sufficient electrical conductivity for use in power cables. SUMMARY OF THE INVENTION

[0010] The following is a brief overview of the subject matter being claimed in order to provide a basic understanding of certain aspects of the subject matter being claimed. This overview is not an exhaustive review of the subject matter being claimed. Its purpose is neither to identify the key or critical elements of the subject matter being claimed nor to delineate the scope of the subject matter being claimed. Its purpose is only to present some concepts of the subject matter being claimed in a simplified form as a prelude to a more detailed description that follows.

[0011] The present invention provides semiconductor tapes and methods for preparing such tapes. The semiconductor tapes can also be used in applications such as cushioning, bundling, isolating, connecting, and / or identifying heavy power cables, multi-core cables, and communication cables. These semiconductor tapes have a stronger frictional force while still maintaining sufficient electrical conductivity. For example, they can be used as the cladding for power cables such as high-voltage or medium-voltage overhead, underwater, and / or underground power cables for transmitting medium-voltage or high-voltage electricity. This improves the cable manufacturing process and reduces the total production cost.

[0012] In one aspect, the semiconductor tape includes: a first layer containing a fabric and a second layer in contact with the first layer. The second layer includes activated carbon or carbon black. The applicant has found that activated carbon and / or carbon black can increase the static and dynamic coefficients of friction of the tape while maintaining sufficient electrical conductivity. For example, it can be used as the cladding for high-voltage power cables.

[0013] In various embodiments, the tape further includes a third layer that includes activated carbon or carbon black. The second layer and the third layer are preferably bonded to opposite surfaces of the first layer.

[0014] In various embodiments, the second layer and / or the third layer contains a fluid, such as water, and the solid content of the second layer is from about 30% to about 60%, preferably about 45%. The applicant has found that a solid content greater than about 60% results in an unstable mixture, while a solid content less than about 30% reduces the electrical conductivity of the layer such that the electrical conductivity of the entire tape is insufficient to be used as a cable cladding.

[0015] In various embodiments, the second layer and / or the third layer comprise carbon black. The carbon black can be substantially or completely in a solid state and can comprise a mixed pigment or substantially the same pigment. The carbon black can be hydrophobic. The hydrophobic carbon black can be transported separately, i.e., not mixed with an aqueous solution such as water. This increases the solids content of the final mixture used to produce the second layer and / or the third layer.

[0016] In various embodiments, the carbon black accounts for about 6 wt% to about 35 wt% of the second layer and / or the third layer, preferably about 24.5 wt% of the second layer. The applicant has found that a carbon black content in the mixture greater than about 35 wt% results in an unstable mixture, while a carbon black content in the mixture less than about 6 wt% reduces the conductivity of the layer such that the conductivity of the entire tape is insufficient to be used as a cable jacket.

[0017] The second layer and / or the third layer can also include an electrically insulating polymer, such as an acrylic copolymer dispersed in water. The acrylic copolymer can be self-crosslinking and can serve to bind the second layer and / or the third layer to the first layer.

[0018] Materials suitable for the fabric include, but are not limited to, nylon, polyester, synthetic fibers, natural fibers, and synthetic polymers. In certain embodiments, the fabric comprises nylon or polyester, or a combination thereof.

[0019] The second layer and / or the third layer also include water, which accounts for about 25 wt% to about 30 wt% of the second layer. The second layer and / or the third layer can include a dispersant such as sodium polyacrylate. The second layer and / or the third layer can also include a suspending agent such as polysaccharides. The second layer and / or the third layer can include an antifoaming agent such as mineral oil. The second layer and / or the third layer can include a thickening agent such as NaOH and other stabilizers.

[0020] The second layer and / or the third layer can also include a second polymer. The second polymer can be similar to or substantially different from the first polymer. Materials suitable for the second polymer include acrylate-styrene copolymers and the like.

[0021] In certain embodiments, the tape has a friction force that is substantially the same as or greater than that of a conventional non-conductive protective tape. In one such embodiment, the static coefficient of friction of the tape is at least about 1.00, preferably at least about 1.25, and more preferably about 1.4 to 2.0. The kinetic coefficient of friction of the tape can be at least about 0.7, preferably at least about 0.8.

[0022] In an embodiment, the tape has sufficient electrical conductivity to be used as a cladding for high-voltage cables or other cables. In one such embodiment, the tape is configured to be located on the core conductor of the cable. In another embodiment, the tape is configured to be located over the outer cladding of the cable. In other embodiments, the tape can be arranged to surround one of the other layers of the cable, such as the inner semiconductive layer, insulation layer, outer semiconductive layer, wire screen, bedding and binder layer or sheath or jacket of the cable.

[0023] Preferably, the volume resistivity of the tape is less than or equal to about 1 million (Ω / cm), more preferably less than or equal to about 100 (Ω / cm). Also preferably, the tape has a Through / Res of ≤500 (Ω) and a Surface / Res of ≤10,000 (Ω / sq).

[0024] In another aspect, the present invention provides a cable that includes a coated tape. The cable can include a high-voltage or medium-voltage cable. The cable can be configured to be used as an overhead, underwater and / or underground power cable. The coated tape includes a first layer of fabric and a second layer that includes activated carbon or carbon black.

[0025] In another aspect, a method of manufacturing a semiconductive tape includes providing a first layer of fabric and a second layer that includes activated carbon or carbon black. The second layer is bonded to the surface of the first layer to form a semiconductive tape that has increased friction and sufficient electrical conductivity to be used as a cable cladding for a cable.

[0026] In an embodiment, the second layer is formed from a mixture of activated carbon or carbon black and a polymer, and then the mixture is applied to the surface of the first layer. Preferably, the polymer includes a material that helps to bond the activated carbon or carbon black to the first layer.

[0027] Preferably, the second layer has a sufficient moisture content to apply the layer as a substantially fluid mixture to the first layer. The first layer can be stretched along a frame, winder, roller press or similar device to provide a substantially flat or planar surface for applying the second layer.

[0028] In an embodiment, the first layer and the second layer are dried to remove the moisture content and / or to promote the bonding of the second layer to the first layer. The second layer can also include a polymer, such as an acrylic copolymer dispersed in water. The method can also include crosslinking the acrylic copolymer to bond the second layer to the first layer.

[0029] In an embodiment, the method further includes forming a third layer that includes activated carbon or carbon black and bonding the third layer to the first layer. The second layer and the third layer can be bonded to opposite surfaces of the first layer.

[0030] The ideal goals achieved by the various embodiments of this specification listed herein are not intended to imply or indicate that, in the most general embodiment or any more specific embodiment of this specification, any one or all of these goals exist as necessary features, either individually or jointly. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a graph comparing the static friction coefficients of the tape described herein with those of prior art tapes; and

[0032] Figure 2 is a graph comparing the kinetic friction coefficients of the tape described herein with those of prior art tapes. DETAILED DESCRIPTION

[0033] This specification and the accompanying drawings illustrate exemplary embodiments and should not be considered restrictive. The scope of this specification is defined by the claims (including equivalents). Various mechanical, compositional, structural, and operational changes can be made without departing from the scope of this specification and the claims (including equivalents). In some cases, well-known structures and techniques are not shown or described in detail to avoid obscuring this specification. The same reference numerals in two or more figures represent the same or similar elements. Additionally, elements and their related aspects described in detail with reference to one embodiment can, where practical, also be included in other embodiments not specifically shown or described. For example, if an element is described in detail with reference to one embodiment but not with reference to a second embodiment, it can still be claimed that the element is included in the second embodiment. Moreover, the descriptions herein are for illustrative purposes only and do not necessarily reflect the actual shape, size, or dimensions of the system or the exemplary components.

[0034] It should be noted that, as used in this specification and the appended claims, the singular forms "a", "an", and "the", and any singular usage of any word, include plural referents unless explicitly and unambiguously limited to one referent. As used herein, the term "comprising" and its grammatical variants are intended to be non-restrictive, such that items listed in a list do not exclude other similar items that can be substituted or added to the listed items.

[0035] Unless otherwise specified, any quantity value is an approximation, whether or not the words "about" or "approximately" are noted. The materials, methods, and examples described herein are for illustrative purposes only and are not intended to be limiting.

[0036] This document provides a semiconductor tape and a method for preparing such a tape. Also provided is a semiconductor tape for use in cables such as aerial, underwater, or underground power cables. The semiconductor tape has increased friction while still maintaining sufficient conductivity to be used as a cladding for power cables, thereby improving the manufacturing process and reducing the total production cost.

[0037] In various embodiments, the semiconductor tape described herein includes a fabric and an activated carbon or carbon black material. The fabric can be mixed with the carbon material to form a single layer. Alternatively, the tape can be formed as multiple separate layers bonded together. In one embodiment, the tape includes a first fabric layer bonded to a second layer including activated carbon or carbon black.

[0038] The fabric can include any material suitable for use in a tape, such as a semiconductor tape. Suitable fabrics include, but are not limited to, nylon, polyester, synthetic fibers, natural fibers, and synthetic polymers. In certain embodiments, the fabric includes nylon or polyester, or a combination thereof.

[0039] In certain embodiments, the tape further includes a third layer including activated carbon or carbon black. The second and third layers are preferably bonded to opposite surfaces of the first layer.

[0040] The second layer and / or the third layer includes carbon black or activated carbon, for example, powdered activated carbon, granular activated carbon, spherical activated carbon, activated carbon cloth, woody activated carbon, etc. Suitable carbon blacks can include acetylene black, channel black, furnace black, lampblack, thermal black, or a combination thereof. The carbon black can contain mixed pigments or substantially the same pigment.

[0041] Activated carbon (or charcoal filter media) is typically made from raw organic materials with a relatively high carbon content. Heating under anaerobic conditions can be used to increase or activate the surface area of the carbon. Suitable activated carbon materials include bamboo, coconut shell, willow peat, wood, coconut coir, lignite, coal, petroleum, soybean hulls, nut shells, bagasse, and combinations thereof.

[0042] In certain embodiments, the carbon black is substantially hydrophobic, such that it can be transported alone, i.e., not mixed with an aqueous solution such as water. This increases the solids content of the final mixture used to produce the second layer.

[0043] In one embodiment, the carbon black is 100% solid and preferably constitutes from about 6 wt% to about 35 wt% of the second layer, preferably about 24.5 wt% of the second layer.

[0044] The second layer and / or the third layer may also include polymers that facilitate binding to the first layer. Polymers suitable for the second layer include acrylic copolymers such as sodium polyacrylate, polyvinyl acetate, polyacrylamide, latex, and combinations thereof. The copolymer can be a stable emulsion or dispersion of polymer microparticles in an aqueous solution.

[0045] In certain embodiments, the polymer has self-crosslinking properties such that when dried and the aqueous solution (such as water) is substantially removed from the mixture, the polymer "cures". This curing helps the binding between the carbon black and the first layer. The polymer is about 40% to about 50% solids, preferably about 45%; and accounts for about 35% to about 50% by weight of the entire mixture, preferably about 40.9% by weight.

[0046] The second layer and / or the third layer may include a second polymer that also helps bind to the first layer. The second polymer can be a material similar to or substantially different from the first polymer. Second polymers suitable for the second layer include acrylic copolymers such as sodium polyacrylate, polyvinyl acetate, polyacrylamide, acrylate-styrene, latex, and combinations thereof. The copolymer can be a stable emulsion or dispersion of polymer microparticles in an aqueous solution. The second polymer is about 40% to about 60% solids, preferably about 50% solids, and accounts for about 2% to about 5% by weight of the entire mixture, preferably about 3.4% by weight.

[0047] The second layer and / or the third layer may also include a dispersant to facilitate the dissolution of surfactants and additives into the mixture. Suitable dispersants include polyvinylpyrrolidone (PVP), sodium hexametaphosphate (SHP), sodium salt of ethylenediaminetetraacetic acid (sodium EDTA), sodium dodecylsulfonate (SDS), sodium dodecylbenzenesulfonate (SDBS), sodium polyacrylate, etc. In one embodiment, the dispersant includes sodium polyacrylate sold under the trade name RHEOSOLVE and produced by Coatex. The dispersant is about 40% to about 60% solids, preferably about 45% solids, and accounts for about 0.1% to about 0.5% by weight of the entire mixture, preferably about 0.4% by weight.

[0048] The second layer and / or the third layer may also include a suspending agent to promote the suspension or dispersion of particles and reduce precipitation. Suitable suspending agents include aqueous biopolymers such as methylcellulose (MC), sodium carboxymethylcellulose (CMC), hydroxypropylmethylcellulose (HPMC), polysaccharides, etc. In one embodiment, the suspending agent includes a polysaccharide sold under the trade name xanthan gum and produced by TERChemicals. The suspending agent is preferably 100% solids and accounts for about 0.5% to about 2% by weight of the entire mixture, preferably about 1% by weight.

[0049] The second layer and / or the third layer may also include an antifoaming agent to reduce the surface tension of the mixture. Suitable antifoaming agents include certain aqueous alcohols (cetearyl alcohol), insoluble oils (castor oil), stearates, polydimethylsiloxanes and other silicone derivatives, ethers, diols, mineral oils, etc. In one embodiment, the antifoaming agent includes a mineral oil with the trade name DISPELAIR and produced by Blackburn Chemicals, LTD. The antifoaming agent is preferably about 1% to about 100% solids and accounts for about 0.05 wt% to about 0.22 wt% of the entire mixture, preferably about 0.1 wt%.

[0050] The second layer and / or the third layer may also include a thickening agent to increase the overall viscosity of the mixture. Suitable thickening agents include starch, gelatin, gum arabic, pectin, agar, NaOH, stabilizers, etc. The thickening agent is about 10% to about 20% solids, preferably about 17% solids, and accounts for about 0.5 wt% to about 1 wt% of the entire mixture, preferably about 0.8 wt%.

[0051] The second layer and / or the third layer may also include an aqueous solution (such as water) to reduce the total solids content of the second layer. In one embodiment, water accounts for about 20 wt% to about 40 wt% of the entire mixture, preferably about 25 wt% to 30 wt%, more preferably about 28.9 wt%.

[0052] The second layer and / or the third layer may include other materials such as antifoaming agents, bactericides, fungicides, chelating agents, etc.

[0053] The total solids content of the second layer and / or the third layer is preferably about 30% to about 60%, preferably about 45%. The applicant has found that a solids content greater than about 60% will cause the mixture to be unstable, while a solids content less than about 30% will reduce the conductivity of this layer, making the conductivity of the entire tape insufficient for use as a cable cladding.

[0054] The tape preferably has conductive properties suitable for use as a cable cladding. The volume resistivity of the tape is preferably about 1 million (Ω / cm), more preferably less than or equal to about 100 (Ω / cm). Preferably, the tape has a penetration resistance of ≤500 (Ω) and a surface resistance of ≤10000 (Ω / sq).

[0055] The tape may be located above the cable conductor, and it may also be located on one of the other layers of the cable (e.g., the inner semiconductive layer, insulation layer, outer semiconductive layer, metal shielding layer, cushioning layer and binding layer or outer sheath of the cable). In one embodiment, the tape is located on the outer cladding of the cable and on the underside of the final plastic sheath component.

[0056] Examples

[0057] The applicant tested the frictional force of a tape ("high friction semiconductor tape or HFS tape") that adheres two layers of the above mixture to a fabric. These layers are bonded to opposite surfaces of the fabric. The applicant compared these test results with two conventional tapes: (1) a conventional protective tape with the trade name CT50 / 113 and sold by Scapa UK, Ltd.; and (2) a conventional semiconductor tape with the trade name SC36 / 65 and also sold by Scapa UK, Ltd. The applicant tested 11 different samples of the SC36 / 65 tape, 5 different samples of the CT50 / 113 protective tape, and 8 different samples of the tape described herein.

[0058] Each sample was prepared, cut to a suitable size, and placed on a test bench, ensuring that the sample was as flat as possible (i.e., clips or tape were placed on both sides of the sample). The frictional force of each sample was tested using a Testometric testing machine, a friction device (i.e., a slider, weights, and a cable), and a 2 kgf load cell. The slider was pulled along the test bench at a speed of approximately 100 mm / min, and the frictional force was recorded on the Testometric testing machine.

[0059] As Figure 1 shown, the HFS tape described herein has a higher coefficient of static friction than the two conventional tapes. The average coefficient of static friction of the HFS tape is 1.442, while the average coefficient of static friction of the conventional protective tape is only 1.087, and the average coefficient of static friction of the conventional semiconductor tape is 0.46. In addition, the electrical conductivity of the HFS tape is basically the same as that of the semiconductor tape.

[0060] As Figure 2 shown, the HFS tape described herein also has a higher coefficient of kinetic friction than the conventional tapes. The average coefficient of kinetic friction of the HFS tape is 0.8294, while the average coefficient of kinetic friction of the protective tape is 0.7844, and the average coefficient of kinetic friction of the semiconductor tape is only 0.3685.

[0061] Therefore, the HFS tape described herein has basically the same electrical conductivity as the conventional semiconductor tape, but has a higher frictional force than both the protective tape and the semiconductor tape.

[0062] The semiconductor tape described herein is manufactured by the following method: forming a first layer including a fabric and forming a second layer including activated carbon or carbon black. The second layer is bonded to the surface of the first layer to form a semiconductor tape.

[0063] The second layer is formed from a mixture of activated carbon or carbon black and at least one polymer, and then the mixture is applied to the surface of the first layer. The mixture preferably comprises the above components with a total solids content of from about 30% to about 60%, preferably about 45%. The second layer preferably has a sufficient moisture content so that it can be applied to the first layer as a substantially liquid layer. The first layer can be stretched along a frame, a winder, a calender or a similar device to provide a smooth or flat surface for applying the second layer.

[0064] The first and second layers are dried to remove the moisture content and / or to promote the bonding of the second layer to the first layer. The method may also include crosslinking the acrylic copolymer to bond the second layer to the first layer.

[0065] In an exemplary embodiment, a fabric layer is stretched over a frame such that its edges are secured. The frame may include a stenter or a similar device. A fluid carbon black mixture is applied to the fabric through a pipe, a tube, a nozzle or other conduit, and the positions of these pipes, tubes, nozzles or other conduits are arranged such that the fluid mixture is delivered directly onto the fabric on the stenter. The mixture is then levelled or flattened with a squeegee or other suitable levelling device until it is substantially flat (e.g., similar to screen printing). The thickness and weight of the mixture will depend on the specific application of the tape.

[0066] The fabric layer and the mixture are then passed through a series of drying devices (such as ovens) to remove substantially all of the moisture in the mixture and to cure the mixture. Preferably, the mixture is cured by crosslinking the polymer in the mixture at an elevated temperature, which causes the mixture to bond to the fabric layer. In certain embodiments, the mixture is cured at about 150 degrees Celsius, but the specific temperature will depend on the specific self-crosslinking polymer used in the mixture.

[0067] In an embodiment, the tape is then rewound and fed back to the stenter with its opposite face facing the pipe or conduit. Then, similar to the above method, a carbon black-based mixture is applied to the opposite face. The second layer mixture is then dried in an oven and bonded to the fabric layer, thereby forming a tape with the first and second layer mixtures on opposite faces of the fabric.

[0068] Alternatively, the fabric can be dipped into a trough of the mixture so that both sides of the fabric are coated with the mixture simultaneously. In such an embodiment, the fabric coated with the mixture is then passed through two rollers or a similar device for squeezing so as to level or flatten the mixture before drying and curing.

[0069] Although the devices, systems, and methods of the present invention have been described in detail herein in accordance with certain preferred embodiments, many modifications and variations may still be made thereto by those skilled in the art. Accordingly, the foregoing description should not be construed as limiting, but should be construed to include the above-described apparent variations and be limited only by the gist and scope of the appended claims.

[0070] For example, in a first aspect, a first embodiment is a semiconductor tape that includes a first layer containing a fabric and a second layer in contact with the first layer. The second layer includes a polymer and activated carbon or carbon black.

[0071] A second embodiment is the first embodiment, wherein the second layer includes carbon black.

[0072] A third embodiment is any combination of the previous two embodiments, wherein the polymer includes an electrically insulating material.

[0073] A fourth embodiment is any combination of the previous three embodiments, wherein the polymer includes an acrylic copolymer dispersed in water.

[0074] A fifth embodiment is any combination of the previous four embodiments, wherein the carbon black is hydrophobic.

[0075] A sixth embodiment is any combination of the previous five embodiments, further including a third layer that includes a polymer and activated carbon or carbon black, wherein the first layer is located between the second layer and the third layer.

[0076] A seventh embodiment is any combination of the previous six embodiments, wherein the fabric includes a material selected from the group consisting of nylon, polyester, synthetic fibers, natural fibers, and synthetic polymers.

[0077] An eighth embodiment is any combination of the previous seven embodiments, wherein the solids content of the second layer is from about 30% to about 60%.

[0078] A ninth embodiment is any combination of the previous eight embodiments, wherein the solids content is about 45%.

[0079] A tenth embodiment is any combination of the previous nine embodiments, wherein the carbon black accounts for about 6% to about 35% by weight of the second layer.

[0080] An eleventh embodiment is any combination of the previous ten embodiments, wherein the carbon black accounts for about 24.5% by weight of the second layer.

[0081] A twelfth embodiment is any combination of the previous eleven embodiments, wherein the carbon black is 100% solid.

[0082] The thirteenth embodiment is any combination of the first twelve embodiments, wherein the second layer further contains water, and the water accounts for about 25% to about 30% by weight of the second layer.

[0083] The fourteenth embodiment is any combination of the first thirteen embodiments, wherein the second layer further includes a dispersant.

[0084] The fifteenth embodiment is any combination of the first fourteen embodiments, wherein the second layer further includes a suspending agent.

[0085] The sixteenth embodiment is any combination of the first fifteen embodiments, wherein the second layer further includes an aqueous dispersion of an acrylate-styrene copolymer.

[0086] The seventeenth embodiment is any combination of the first sixteen embodiments, wherein the second layer further includes an antifoaming agent.

[0087] The eighteenth embodiment is any combination of the first seventeen embodiments, wherein the second layer further includes a thickening agent.

[0088] On the other hand, there is provided a cable including a tape which is any combination of the first eighteen embodiments.

[0089] On the other hand, the first embodiment is a semiconductor tape for a cable. The tape includes a fabric and activated carbon or carbon black. The tape has a resistance of less than or equal to about 1 million (Ω / cm), and a coefficient of static friction of at least about 1.00.

[0090] The second embodiment is the first embodiment, wherein the resistance is less than or equal to about 100 (Ω / cm).

[0091] The third embodiment is any combination of the first two embodiments, wherein the coefficient of static friction is at least about 1.25.

[0092] The fourth embodiment is any combination of the first three embodiments, wherein the coefficient of static friction is about 1.4 to about 1.5.

[0093] The fifth embodiment is any combination of the first four embodiments, wherein the coefficient of kinetic friction of the tape is at least about 0.7.

[0094] The sixth embodiment is any combination of the first five embodiments, wherein the coefficient of kinetic friction is at least about 0.8.

[0095] The seventh embodiment is any combination of the first six embodiments, wherein the tape includes carbon black.

[0096] The eighth embodiment is any combination of the first seven embodiments, wherein the carbon black is substantially solid.

[0097] The ninth embodiment is any combination of the first eight embodiments, and further includes an acrylic copolymer dispersed in water.

[0098] The tenth embodiment is any combination of the first nine embodiments, wherein the carbon black is hydrophobic.

[0099] The eleventh embodiment is any combination of the first ten embodiments, wherein the acrylic copolymer and the carbon black are mixed together to form a mixture.

[0100] The twelfth embodiment is any combination of the first eleven embodiments, wherein the solid content of the mixture is about 30% to about 60%.

[0101] The thirteenth embodiment is any combination of the first twelve embodiments, wherein the solid content is about 45%.

[0102] The fourteenth embodiment is any combination of the first thirteen embodiments, wherein the carbon black accounts for about 6% to about 35% by weight of the mixture.

[0103] The fifteenth embodiment is any combination of the first fourteen embodiments, wherein the carbon black accounts for about 24.5% by weight of the mixture.

[0104] On the other hand, there is provided a power cable including a tape which is any combination of the first fourteen embodiments.

[0105] On the other hand, the first embodiment is a method for preparing a semiconductor tape. The method includes: forming a first layer including a fabric, forming a second layer including activated carbon or carbon black, and bonding the first layer to the second layer.

[0106] The second embodiment is the first embodiment, further including forming a mixture of activated carbon or carbon black and a polymer, and applying the mixture to the surface of the first layer.

[0107] The third embodiment is any combination of the first two embodiments, further including forming a third layer including activated carbon or carbon black, and bonding the third layer to the first layer.

[0108] The fourth embodiment is any combination of the first three embodiments, wherein the first layer includes a first surface and a second surface opposite to the first surface, wherein the second layer is bonded to the first surface, and the third layer is bonded to the second surface.

[0109] The fifth embodiment is any combination of the first four embodiments, wherein the polymer includes an acrylic copolymer dispersed in water.

[0110] The sixth embodiment is any combination of the first five embodiments, further including crosslinking the acrylic copolymer to bond the second layer to the first layer.

[0111] The seventh embodiment is any combination of the first six embodiments, wherein the second layer includes carbon black.

[0112] The eighth embodiment is any combination of the first seven embodiments, wherein the carbon black is hydrophobic.

[0113] The ninth embodiment is any combination of the first eight embodiments, wherein the solids content of the second layer is from about 30% to about 60%.

[0114] The tenth embodiment is any combination of the first nine embodiments, wherein the solids content is about 45%.

[0115] The eleventh embodiment is any combination of the first ten embodiments, wherein the carbon black accounts for about 6% to about 35% by weight of the second layer.

[0116] The twelfth embodiment is any combination of the first eleven embodiments, wherein the carbon black accounts for about 24.5% by weight of the second layer.

[0117] The thirteenth embodiment is any combination of the first twelve embodiments, wherein the carbon black is 100% solid.

[0118] The fourteenth embodiment is any combination of the first thirteen embodiments, wherein the second layer further contains water, and the water accounts for about 25% to about 30% by weight of the second layer.

[0119] The fifteenth embodiment is any combination of the first fourteen embodiments, wherein the second layer further includes an aqueous dispersion of an acrylate-styrene copolymer.

[0120] The sixteenth embodiment is any combination of the first fifteen embodiments, wherein the fabric includes a material selected from the group consisting of nylon, polyester, synthetic fiber, natural fiber, and synthetic polymer.

Claims

1. A semiconductor tape, comprising: a first layer including a fabric; and a second layer in contact with the first layer, the second layer including a polymer, and activated carbon or carbon black.

2. The tape according to claim 1, wherein, the second layer includes carbon black.

3. The tape according to claim 1, wherein, the polymer includes an electrical insulating material.

4. The tape according to claim 1, wherein, the polymer includes an acrylic copolymer dispersed in water.

5. The tape according to claim 2, wherein, the carbon black is hydrophobic.

6. The tape according to claim 1, further comprising a third layer, the third layer including a polymer, and activated carbon or carbon black, wherein, the first layer is located between the second layer and the third layer.

7. The tape according to claim 1, wherein, the fabric includes a material selected from the group consisting of nylon, polyester, synthetic fiber, natural fiber, and synthetic polymer.

8. The tape according to claim 1, wherein, the solid content of the second layer is about 30% to about 60%.

9. The tape according to claim 8, wherein, the solid content is about 45%.

10. The tape according to claim 2, wherein, the carbon black accounts for about 6% to about 35% by weight of the second layer.

11. The tape according to claim 2, wherein, the carbon black accounts for about 24.5% by weight of the second layer.

12. The tape according to claim 2, wherein, the carbon black is 100% solid.

13. The tape according to claim 1, wherein, the second layer further contains water, and the water accounts for about 25% to about 30% by weight of the second layer.

14. The tape according to claim 1, wherein, the second layer further includes a dispersant.

15. The tape according to claim 1, wherein, the second layer further includes a suspending agent.

16. The tape according to claim 1, wherein, the second layer further includes an aqueous dispersion of an acrylate-styrene copolymer.

17. The tape according to claim 1, wherein, the second layer further includes an antifoaming agent.

18. The tape according to claim 1, wherein, the second layer further includes a thickening agent.

19. A cable comprising the tape according to claim 1.

20. A semiconductor tape for a cable, the tape comprising: a fabric; and activated carbon or carbon black; and wherein, the tape has a resistance less than or equal to about 1 million (Ω / cm), and a coefficient of static friction of at least about 1.

00.

21. The tape according to claim 20, wherein, the resistance is less than or equal to about 100 (Ω / cm).

22. The tape according to claim 20, wherein, the coefficient of static friction is at least about 1.

25.

23. The tape according to claim 20, wherein, the coefficient of static friction is about 1.4 to about 1.

5.

24. The tape according to claim 20, wherein, the tape has a coefficient of kinetic friction of at least about 0.

7.

25. The tape according to claim 24, wherein, the coefficient of kinetic friction is at least about 0.

8.

26. The tape according to claim 20, wherein, The tape includes carbon black.

27. The tape according to claim 26, wherein, the carbon black is substantially in a solid state.

28. The tape according to claim 20, wherein, it further includes an acrylic copolymer dispersed in water.

29. The tape according to claim 26, wherein, the carbon black is hydrophobic.

30. The tape according to claim 28, wherein, the acrylic copolymer and the carbon black are mixed together to form a mixture.

31. The tape according to claim 30, wherein, the solid content of the mixture is about 30% to about 60%.

32. The tape according to claim 31, wherein, the solid content is about 45%.

33. The tape according to claim 30, wherein, the carbon black accounts for about 6% to about 35% by weight of the mixture.

34. The tape according to claim 33, wherein, the carbon black accounts for about 24.5% by weight of the mixture.

35. A cable, comprising the tape according to claim 20.

36. A method for preparing a semiconductor tape, the method comprises: forming a first layer including a fabric; forming a second layer including activated carbon or carbon black; and bonding the first layer to the second layer.

37. The method according to claim 36, further comprising forming a mixture of activated carbon or carbon black and a polymer, and applying the mixture to the surface of the first layer.

38. The method according to claim 36, further comprising forming a third layer including activated carbon or carbon black, and bonding the third layer to the first layer.

39. The method according to claim 38, wherein, the first layer includes a first surface and a second surface opposite to the first surface, wherein the second layer is bonded to the first surface, and the third layer is bonded to the second surface.

40. The method according to claim 37, wherein, the polymer includes an acrylic copolymer dispersed in water.

41. The method according to claim 39, further comprising crosslinking the acrylic copolymer to bond the second layer to the first layer.

42. The method according to claim 36, wherein, the second layer includes carbon black.

43. The method according to claim 42, wherein, the carbon black is hydrophobic.

44. The method according to claim 36, wherein, the solid content of the second layer is about 30% to about 60%.

45. The method according to claim 42, wherein, the solid content is about 45%.

46. The method according to claim 41, wherein, the carbon black accounts for about 6% to about 35% by weight of the second layer.

47. The method according to claim 41, wherein, the carbon black accounts for about 24.5% by weight of the second layer.

48. The method according to claim 42, wherein, the carbon black is 100% solid.

49. The method according to claim 36, wherein, the second layer further contains water, and the water accounts for about 25% to about 30% by weight of the second layer.

50. The method according to claim 36, wherein, the second layer further includes an aqueous dispersion of an acrylate-styrene copolymer.

51. The method according to claim 36, wherein, the fabric comprises a material selected from the group consisting of nylon, polyester, synthetic fiber, natural fiber, and synthetic polymer.

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