Module carrier of CT detector module, CT detector module and CT device
By designing the module carrier for the CT detector module, the hollow body and heat transfer section structures are used to solve the challenges of the CT detector module in thermal management and cooling, achieving more effective heat dissipation and temperature stability.
Patent Information
- Application Number
- CN202411722343.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-11-30
- Filing Date
- 2024-11-28
- Publication Date
- 2025-05-30
AI Technical Summary
Modern CT detector modules have challenges in efficient cooling and thermal management, especially because X-ray sensor elements are sensitive to temperature fluctuations, resulting in temperature gradients and heat source management difficulties.
A module carrier for a CT detector module is designed, using an integrated, tunnel-shaped hollow body, which receives the cooling element through its elongated cavity and multiple openings, and provides thermal contact through the heat transfer section to promote heat transfer.
The gap between the cooling element and the module carrier is effectively reduced, the heat dissipation performance of the X-ray converter element is improved, the temperature gradient is reduced, and the working temperature stability of the CT detector module is improved.
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Figure CN120052940A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a module carrier of a CT detector module, a CT detector module and a CT device. Background Art
[0002] Modern computed tomography equipment (CT equipment) has a gantry with a rotatable frame. In addition, an X-ray source and a detector module for detecting X-ray radiation are arranged at the gantry. This type of CT detector module usually includes an X-ray conversion element, which has an X-ray sensor layer and may have a layer with an A / D (analog-to-digital) converter arranged below it. Electronic integration has recently become an important trend for X-ray conversion elements. The aim is to shorten the analog path length between the analog X-ray sensor layer and the A / D converter, which is usually implemented as an application-specific integrated circuit (ASIC). In an integrated X-ray converter, the analog X-ray sensor layer is formed by combining a suitable sensor layer (such as a scintillator) with a photodiode, while a direct-conversion semiconductor sensor is used in a counting X-ray converter. Then, the A / D converter designed as an ASIC generates a digital output signal. In both cases, integrating the ASIC with the analog X-ray sensor layer into a compact structure (especially a stacked structure) brings significant heat sources closer to the X-ray sensor elements of the X-ray sensor layer itself.
[0003] Since X-ray sensor elements are very sensitive to temperature fluctuations, thermal management is a key task in the development of modern CT detector modules. The special challenge of thermal management is to keep the operating temperature of the CT detector module stable, avoid temperature gradients between adjacent X-ray converter elements, and reduce the temperature gradient within each X-ray converter element. These challenges are even more important for counting X-ray converters because direct-conversion semiconductor sensors are additional heat sources and their sensor performance is very sensitive to thermal changes.
[0004] Currently, thermal management is ensured by creating a thermal interface between the X-ray converter element and the metal frame of the CT detector module using a thermally conductive adhesive or thermally conductive paste. However, this does not transfer a defined amount of heat because the quality of the thermal interface depends on various factors that are difficult to influence, especially the gap thickness between the X-ray converter and the metal frame, and the precise distribution of the thermally conductive paste.
[0005] Due to the huge amount of data of modern CT (counting) detectors, the need for efficient cooling of the modules is increasing in order to keep the sensors made of semiconductor material within an ideal operating range in terms of their temperature due to the high power of the ASICs. In addition to the absolute temperature, the temperature distribution in the sensor area also plays a crucial role. Usually, the sensor elements near the cooling air inlet are at a lower temperature because most of the incoming cooling air remains there and flows positively over the cooling fins. As a result, additional air is displaced into the rear space of the detector, so that the sensors far from the inlet area receive less cooling air, which is also additionally heated by the remaining sensor plates. Summary of the Invention
[0006] Accordingly, it is an object of the present invention to provide more effective heat dissipation for a CT detector module.
[0007] According to the present invention, this object is achieved by the subject matter according to the present invention. Advantageous embodiments with suitable developments are as follows. Regardless of the grammatical gender of a particular term, individuals with male or female gender identities are included within that term.
[0008] The present invention in a first aspect relates to a module carrier for a CT detector module. Here, the module carrier has an integral and tunnel-shaped hollow body. The hollow body has an elongated cavity and at least two openings. Here, two of the at least two openings are arranged opposite each other along the longitudinal extension direction of the hollow body. The hollow body is designed to be arranged on the X-ray converter element on its outer side. In addition, the hollow body is designed to receive at least one cooling element in its cavity by inserting it through at least one of the at least two openings. In addition, the hollow body is designed to be flowed through by a fluid along its longitudinal direction. Here, the hollow body has a heat transfer section, which is designed to provide a thermally conductive contact between at least one cooling element and the X-ray converter element.
[0009] The integral, in particular single-piece production of the hollow body can advantageously reduce the structural work involved in producing the hollow body. For example, material and adhesives, as well as time-consuming processing steps, can be saved thereby. In addition, when designed as an integral body, the hollow body can advantageously be completely formed of, in particular, a metal material, in particular a base material. This enables the hollow body to exhibit a uniform thermal conductivity. For example, the hollow body can be made from an extruded profile with subsequent machining.
[0010] The hollow body can be tunnel-shaped, in particular tubular and / or hose-shaped and / or cylindrical and / or cuboid. In this case, the elongated cavity of the hollow body can be tubular and / or hose-shaped and / or cylindrical and / or cuboid. The cavity can be surrounded, in particular defined, by a material (in particular metal) along the outer peripheral surface in the direction of the longitudinal extension of the hollow body. In particular, the cavity can be surrounded by a material in a direction different from the direction of the longitudinal extension of the hollow body. Advantageously, the cavity can extend continuously from one side of the hollow body to the opposite side of the hollow body along the longitudinal extension direction, in particular in a straight line or a curve. In addition, the hollow body has openings at its two ends respectively along its longitudinal extension direction. These two openings can be designed to have the same or different geometric shapes, for example in terms of their area and / or contour.
[0011] Advantageously, the cavity can extend in a straight line along the longitudinal extension direction of the hollow body, in particular with substantially no curvature. In this case, the wall of the hollow body, for example the outer peripheral surface of the hollow body, can extend substantially parallel to the longitudinal extension direction of the hollow body. This can enable a plurality of CT detector elements, in particular module carriers, to form a grid-like arrangement adjacent to each other. In addition, it can enable a fluid to flow better through the hollow body.
[0012] The hollow body, in particular the elongated cavity, is designed to be flowed through by a fluid, such as a liquid, in particular water, and / or a gas, in particular air, along its longitudinal extension direction, in particular from one side of the hollow body to the opposite side of the hollow body along the longitudinal extension direction. In particular, the hollow body, in particular the cavity, can be designed to guide, in particular convey, a fluid along its longitudinal extension direction.
[0013] In addition, the hollow body can be designed to receive at least one cooling element, in particular a plurality of cooling elements, in its cavity by inserting through at least one of the at least two openings. In particular, the hollow body can be designed to receive at least one cooling element, in particular a plurality of cooling elements, in its cavity by inserting through at least one or the other of the two opposite openings. Advantageously, at least one cooling element can be introduced, in particular pushed, into the cavity of the hollow body through at least one opening. Here, the hollow body can be designed to receive, in particular hold, at least one cooling element in a target position. The target position can describe the spatial relative position and / or relative orientation and / or relative pose of at least one cooling element relative to the hollow body. In order to position at least one cooling element in its target position, the hollow body can have, for example, positioning elements on its inner side, in particular raised areas and / or grooves for guiding and / or positioning and / or fixing at least one cooling element.
[0014] At least one cooling element can have a heat contact surface. In addition, the cooling element can be designed to be flowed through by a fluid along the longitudinal extension direction of the hollow body in its target position.
[0015] The hollow body is designed to be arranged on the X-ray converter element on its outer side, in particular on the side facing away from the cavity, in particular at the surface. The X-ray converter element can have an X-ray detector layer on its upper side. In addition, the X-ray detector layer can be designed to detect X-ray radiation emitted by an X-ray source. The X-ray detector layer can include a direct conversion (semiconductor) X-ray sensor layer, for example including CdTe, CdZnTe, CdTeSe, CdZnTeSe, CdMnTe, GaAs, Si or Ge as the semiconductor material. The X-ray detector layer can also include an X-ray sensor layer and an optically coupled photodiode, in particular an array of one or more photodiodes, the X-ray sensor layer being designed to convert X-ray radiation into light. As the scintillator material, for example, GOS (Gd2O2S), CsJ, YGO or LuTAG is typically used. The X-ray detector layer can also include a layer with an analog-to-digital converter, on which the X-ray sensor layer is applied, wherein the A / D converter layer can be implemented in one or more ASICs. The X-ray detector layer can be applied to a substrate (also called a substrate), such as a printed circuit board or a ceramic or glass substrate, which then forms the bottom surface of the X-ray converter element. The bottom surface of the X-ray conversion element can have a thermal contact surface, in particular a metal thermal contact surface. The thermal contact surface can cover part or all of the bottom surface of the X-ray conversion element. The thermal contact surface can be connected to the thermal contact surfaces of the A / D converter layer and / or the X-ray sensor layer through metallized vias in the substrate and / or the A / D converter layer of the X-ray detector layer, so that heat can be conducted from there into the thermal contact surface. This is also called thermal via technology. The metallized vias can be, for example, contact holes in the substrate.
[0016] The hollow body has heat transfer sections, in particular a plurality of heat transfer sections, which are designed to provide a thermally conductive contact, in particular a thermal contact, between at least one cooling element, in particular the thermal contact surface of at least one cooling element, and the X-ray converter element, in particular the thermal contact surface of the X-ray converter element. Advantageously, the heat transfer sections can be arranged at the target location of at least one cooling element. The heat transfer sections can be designed to transfer heat between the X-ray converter element, in particular the thermal contact surface of the X-ray converter element, and at least one cooling element, in particular the thermal contact surface of at least one cooling element.
[0017] The heat transfer section can provide direct or indirect thermally conductive contact between the X-ray converter element and at least one cooling element. In the case of direct thermally conductive contact, the two thermally conductive surfaces of the X-ray converter element and the at least one cooling element can be in direct contact, in particular touch, through corresponding depressions, in particular openings, of the hollow body. In particular, the two thermally conductive surfaces of the X-ray converter element and the at least one cooling element can be pressed against each other or adhered to each other. In the case of indirect thermally conductive contact, heat transfer through the material of the hollow body can be facilitated at the heat transfer section between the thermally conductive surfaces of the X-ray converter element and the at least one cooling element, for example through corresponding thermally conductive surfaces on the outer and inner sides of the hollow body. In particular, the thermally conductive surface on the inner side of the hollow body and the thermally conductive surface of the at least one cooling element can be pressed against each other or adhered to each other. In addition, the thermally conductive surface on the outer side of the hollow body and the thermally conductive surface of the X-ray converter element can be pressed against each other or adhered to each other.
[0018] The thermally conductive contact can be further improved by, for example, thermal paste or thermal pads or adhesives or soldering materials. The thermally conductive surfaces can, for example, have a metal coating. The metal coating can be formed, for example, by coating a metal with good thermal conductivity (such as gold, silver or copper). The metal coating can be a so-called "metallized thermal pad", i.e., a metallized thermal pad.
[0019] The proposed embodiment can advantageously dissipate heat from the CT detector module more effectively.
[0020] In another advantageous embodiment of the proposed module carrier, the hollow body can have another opening which is arranged away from its longitudinal extension direction. In this case, the hollow body can be designed to receive at least one cooling element in its cavity by inserting it through the another opening.
[0021] In particular, the hollow body can be designed to receive a plurality of cooling elements in its cavity by inserting them through the another opening. Advantageously, at least one cooling element can be introduced, in particular pushed, into the cavity of the hollow body through the another opening. The another opening can be arranged on the outer side, in particular the outer peripheral surface, of the hollow body away from its longitudinal extension direction. In particular, the another opening can be arranged on the outer side of the hollow body opposite to the X-ray converter element.
[0022] The proposed embodiment can enable the simple and precisely positioned introduction of at least one cooling element into the cavity of the hollow body. In addition, the proposed embodiment can advantageously enable the two opposite openings to be designed for the optimal flow of fluid. In particular, the two opposite openings do not necessarily have to be designed for introducing at least one cooling element into the cavity.
[0023] In another advantageous embodiment of the proposed module carrier, the module carrier can have a cover element. In the operating state of the module carrier, at least one cooling element can be arranged in the cavity, and the cover element can be fastened to the hollow body. Furthermore, the cover element can at least partially, in particular completely, seal another opening.
[0024] The cover element can be designed, for example, as a cover plate, in particular made of a metallic material. In particular, the cover plate can be formed from the same metallic material as the hollow body. In the operating state, the cover element can be fastened to the hollow body, in particular at another opening, by means of fastening means. The fastening means can include, for example, mechanical fastening means, in particular screws, pins, bolts, rivets and / or springs, and / or chemical fastening means, in particular adhesives. Advantageously, the fastening means can be designed to fasten the cover element to the hollow body, in particular to hold it in a position-fixed manner. The cover element can advantageously be designed to seal the other opening in a fluid-tight manner. Furthermore, the cover element can be designed to hold at least one cooling element in its target position in the cavity of the hollow body.
[0025] The proposed embodiment can enable an improved flow of fluid through the cavity. Furthermore, the cover element can improve the shielding against primary radiation to protect other electronic components arranged behind it. In addition, the cover element can advantageously contribute to further strengthening the hollow body.
[0026] In another advantageous embodiment of the proposed module carrier, the hollow body can be designed to receive a plurality of cooling elements in its cavity via at least one of at least two openings. Furthermore, the plurality of cooling elements can be arranged in rows in the cavity along the longitudinal extension direction of the hollow body.
[0027] In this case, one cooling element each can respectively adjoin at least one further cooling element along the longitudinal extension direction, in particular abut against at least one further cooling element or be arranged at a distance from at least one further cooling element. The plurality of cooling elements can each have at least one cavity which extends along the longitudinal extension direction of the hollow body when the cooling elements are arranged in rows in the cavity of the hollow body. The cavities of the cooling elements can each be designed to be tunnel-shaped, in particular tubular and / or hose-shaped and / or cylindrical and / or cuboid-shaped. In this case, the cavities can be surrounded by the material of the cooling elements (in particular metal), in particular delimited by a metallic material. Advantageously, the cavities of the cooling elements can each extend continuously from one side of the cooling element to the opposite side along the longitudinal extension direction, in particular in a straight line or in a curve. The cavities can each have an opening on both sides of the cooling element. Furthermore, the cooling elements can be arranged in rows in the cavity such that the openings of the cavities are at least partially overlapped, in particular completely overlapped, by adjacent cooling elements.
[0028] The proposed embodiments can achieve effective heat dissipation through a plurality of cooling elements along the longitudinal extension direction of the hollow body, and are particularly suitable for the waste heat of the X-ray converter element along the longitudinal extension direction.
[0029] In another advantageous embodiment of the proposed module carrier, the hollow body can respectively have a heat transfer section for each cooling element. In this case, the cooling elements arranged in rows can have different lengths along the longitudinal extension direction of the hollow body. In addition, the length of the heat transfer section along the longitudinal extension direction of the hollow body can be adapted to the length of the cooling element.
[0030] A plurality of heat transfer sections can be arranged on the common side of the hollow body, or at least partially arranged on different sides of the hollow body. In addition, the cooling elements arranged in rows can have different lengths, especially spatial extensions, along the longitudinal extension direction of the hollow body. For example, when the cooling elements are arranged in rows along the longitudinal extension direction of the hollow body, they can have a reduced length. In this case, the length of the heat transfer section along the longitudinal extension direction of the hollow body, especially the length of the opening or the heat contact surface of the hollow body, can be adapted to the length of the cooling element, especially the corresponding length of the heat contact surface of the cooling element.
[0031] The proposed embodiments can achieve uniform heat dissipation along the longitudinal extension direction of the hollow body through a plurality of cooling elements.
[0032] In another advantageous embodiment of the proposed module carrier, for each of the cooling elements to be received, the heat transfer section can respectively have an opening. In this case, when arranged in the cavity, in the operating state of the module carrier, at least one cooling element can be in direct thermal contact with the X-ray converter element.
[0033] For each of the cooling elements to be received, the heat transfer section can have an opening, especially a groove, on the hollow body, especially on the material of the hollow body. At least one opening can continuously extend from the inner side, especially the cavity, to the outer side of the hollow body. Advantageously, at least one opening can be arranged on the hollow body such that in the operating state of the module carrier, direct thermal contact is provided between the heat contact surface of the X-ray converter element and at least one cooling element through the opening. In particular, the heat transfer section can have a plurality of openings arranged on the hollow body such that in the operating state of the module carrier, direct thermal contact is provided between the heat contact surface of the X-ray converter element and a plurality of cooling elements through the corresponding openings.
[0034] The proposed embodiments can achieve particularly effective, especially direct, heat transfer between the X-ray detector element and at least one cooling element.
[0035] In another advantageous embodiment of the proposed module carrier, for each of the cooling elements to be received, the heat transfer section can respectively have a thermal contact surface on the inner side of the hollow body and at least one additional thermal contact surface on the outer side. In this case, the heat transfer section can be designed to transfer heat between the thermal contact surfaces on the inner and outer sides of the hollow body. In the operating state of the module carrier, at least one cooling element can have direct thermal contact with the corresponding thermal contact surface at the inner side when arranged in the cavity. In addition, in the operating state, the X-ray converter element can have direct thermal contact with the thermal contact surface at the outer side when arranged on the outer side of the hollow body.
[0036] Advantageously, for each of the cooling elements to be received, the heat transfer section can respectively have thermal contact surfaces on the inner and outer sides of the hollow body. The thermal contact surfaces corresponding to each of the cooling elements to be received can be arranged offset or opposite to each other on the inner and outer sides of the hollow body. The corresponding thermal contact surfaces can be designed to be the same or different in terms of their material composition and / or geometric features, and the geometric features are, for example, spatial extent, especially surface, and / or profile and / or shape and / or pattern.
[0037] The heat transfer section can also be designed to transfer heat, especially conduct and / or transmit heat, between the corresponding thermal contact surfaces on the inner and outer sides of the hollow body. The heat transfer can be achieved by means of the material (especially metal) of the hollow body arranged between the corresponding thermal contact surfaces on the inner and outer sides.
[0038] Advantageously, in the operating state of the module carrier, at least one cooling element, especially a plurality of cooling elements, can have direct thermal contact with the corresponding thermal contact surface at the inner side of the hollow body when arranged in the cavity. Advantageously, the thermal contact surface can be arranged inside the hollow body such that in the operating state of the module carrier, direct thermal contact is provided between the thermal contact surface of at least one cooling element and the thermal contact surface of the heat transfer section located inside. In particular, the heat transfer section can have a plurality of thermal contact surfaces arranged on the inner side of the hollow body such that in the operating state of the module carrier, direct thermal contact is provided between the thermal contact surface of the cooling element and the thermal contact surface of the heat transfer section located inside.
[0039] Advantageously, in the operating state of the module carrier, the X-ray converter element can have direct thermal contact with the thermal contact surface on the outer side of the hollow body when arranged on the outer side of the hollow body. Advantageously, the thermal contact surface can be arranged on the outer side of the hollow body such that in the operating state of the module carrier, direct thermal contact is provided between the thermal contact surface of the X-ray converter element and the thermal contact surface of the heat transfer section located outside.
[0040] The proposed embodiments can achieve heat transfer by means of a hollow body, in particular the material of the hollow body. Thus, effective heat dissipation can be achieved.
[0041] In another advantageous embodiment of the proposed module carrier, the hollow body can have at least one first section and at least one further section along its longitudinal extension direction. In this case, at least one first section can be designed to receive at least one cooling element. In addition, at least one second section can have a flow-guiding internal structure.
[0042] Advantageously, the hollow body can have a plurality of sections, in particular spatial sections, in particular one or more first sections and one or more further sections along its longitudinal extension direction. At least one first section and at least one further section can be arranged directly adjacent to each other or spaced apart from each other. In addition, one further section or a plurality of further sections can be arranged before or after one or more first sections or between two first sections, and vice versa.
[0043] At least one first section can be designed to receive at least one cooling element. In particular, for each cooling element to be received, the hollow body can respectively have a first section. For example, at least one first section can be designed to hold at least one cooling element in a form-fitting manner, in particular in its target position. For example, at least one first section can have grooves and / or protrusions and / or structures on the inner side of the hollow body, which are adapted to the shape of the outer side of the at least one cooling element to be received, in particular grooves and / or protrusions and / or structures.
[0044] At least one further section can have a flow-guiding internal structure, such as depressions and / or protrusions. Advantageously, at least one further section can be designed to adjust the flow of the fluid flowing through the hollow body in an operating state in a defined manner, such as decelerating and / or accelerating and / or deflecting and / or mixing and / or swirling it.
[0045] In an advantageous embodiment, the hollow body can be designed to receive a plurality of cooling elements arranged in rows. In addition, the hollow body can respectively have a first section for receiving each cooling element. In this case, the hollow body can have two further sections, which are arranged before and after the row-like arrangement of the plurality of first sections.
[0046] In another advantageous embodiment of the proposed module carrier, the hollow body can have a closed profile transverse to its longitudinal direction.
[0047] Advantageously, the cavity of the hollow body can be completely surrounded by the hollow body material remote from the longitudinal extension direction. Thus, the hollow body can have a completely closed profile in a cross-section perpendicular to its longitudinal extension direction, which surrounds the cavity. The profile can be, for example, polygonal or elliptical.
[0048] The proposed embodiments can advantageously reduce the flow losses into the rear space when the fluid flows through the cavity, because the inflowing fluid (e.g., cooling air) can be almost completely supplied to at least one cooling element and used to cool the X-ray converter element. The closed and more robust shape of the hollow body allows the required wall thickness to be minimized advantageously. This can maximize the cross-sectional area of the hollow body available for fluid flow and the surface area of the cooling elements for convection. In addition, the hollow body with a closed profile can be better suited for mechanical post-processing, because less mechanical distortion and / or less mechanical deformation can occur due to rotational forces (especially torsion). Therefore, the blank hollow body can be processed module by module with higher precision to form the proposed hollow body and then the hollow body can be fixed in the detector module carrier. Advantageously, the hollow body can be made of an extruded profile and then machined. In terms of manufacturing costs, this manufacturing form is comparable to the manufacturing form of aluminum die-casting followed by machining, but it has the above advantages unlike the latter.
[0049] In a second aspect, the invention relates to a CT detector module comprising at least one X-ray converter element, a module carrier according to the invention, and at least one cooling element. The X-ray converter element has an upper side and a lower side. In addition, the X-ray converter element has an X-ray detector layer at its upper side and a thermal contact surface at its lower side. In the operating state of the CT detector module, at least one cooling element is arranged in the cavity of the hollow body. In addition, in the operating state, the X-ray converter element is arranged on the outer side of the hollow body. In addition, in the operating state, at least one cooling element is in thermally conductive contact with the thermal contact surface of the X-ray converter element via a heat transfer section.
[0050] The advantages of the proposed CT detector module basically correspond to the advantages of the proposed cooling device. The features, advantages or alternative embodiments mentioned herein can also be applied to other claimed subject matters and vice versa.
[0051] The X-ray converter element has an X-ray detector layer at its upper side. In the operating state of the CT detector module, the detector module can face the X-ray source. In addition, the X-ray detector layer can be designed to detect the X-ray radiation emitted by the X-ray source. The X-ray detector layer can include a direct conversion (semiconductor) X-ray sensor layer, for example including CdTe, CdZnTe, CdTeSe, CdZnTeSe, CdMnTe, GaAs, Si or Ge as the semiconductor material. The X-ray detector layer can also include an X-ray sensor layer designed to convert X-ray radiation into light and a light-coupled photodiode, in particular one or more photodiode arrays. As the material, a scintillator material is usually used, such as GOS (Gd2O2S), CsJ, YGO or LuTAG. The X-ray detector layer can also include a layer with an analog-to-digital converter, on which the X-ray sensor layer is applied, wherein the A / D converter layer can be implemented in one or more ASICs. The X-ray detector layer can be applied to a substrate (also called a substrate), such as a printed circuit board or a ceramic or glass substrate, and then form the bottom surface of the X-ray conversion element.
[0052] The X-ray conversion element has a thermal contact surface at its lower side, in particular a metal thermal contact surface, which is in thermally conductive contact, in particular thermal contact, with the cooling device in the operating state of the CT detector module. The thermally conductive contact can be further improved by, for example, a thermal paste or a thermal pad or an adhesive or a welding material. In the operating state, a plurality of cooling elements of the cooling device can be arranged in rows at the lower side of the X-ray conversion element, such that the respective grooves and / or protrusions of the cooling elements are in thermally conductive contact with the respective corresponding thermal contact surfaces of the X-ray conversion element. For this purpose, the cooling elements can be arranged, for example, in a common module carrier, which enables the cooling elements to be arranged in rows and have grooves on at least one thermal contact surface. At least one thermal contact surface can, for example, have a metal coating. The metal coating can, for example, be formed by a metal coating with good thermal conductivity, such as gold, silver or copper. The metal coating can be a so-called "metalized thermal pad", that is, a metalized thermal pad. At least one thermal contact surface can cover part or the entire lower side of the X-ray converter element. The thermal contact surface can be connected to the thermal contact surfaces of the A / D converter layer and / or the X-ray sensor layer through metallized vias in the substrate and / or the A / D converter layer of the X-ray detector layer, so that heat can be conducted from there into the thermal contact surface. This is also called thermal via technology. The metallized vias can be, for example, contact holes in the substrate.
[0053] The proposed embodiments can achieve improved heat dissipation from the X-ray detector element to at least one cooling element. In particular, by arranging at least one cooling element in the hollow body, the gap between the cooling element and the hollow body or between the cooling element and the X-ray converter element, in particular the gap between the cooling element and the underside of the X-ray converter element, can be significantly reduced because no tolerance compensation is required. This can further improve the heat dissipation of the X-ray converter element.
[0054] In another advantageous embodiment of the proposed CT detector module, at least one cooling element arranged in the cavity of the hollow body can be designed to be flowed through by a fluid along the longitudinal extension direction of the hollow body. Furthermore, in the operating state of the CT detector module, the fluid can flow through the hollow body and at least one cooling element arranged therein along the longitudinal extension direction of the hollow body.
[0055] The proposed embodiments can achieve improved heat dissipation from the X-ray detector element to the fluid by means of at least one cooling element.
[0056] In another advantageous embodiment of the proposed CT detector module, the CT detector module can include a plurality of cooling elements which are arranged in rows in the cavity along the longitudinal extension direction of the hollow body in the operating state of the CT detector module.
[0057] In another advantageous embodiment of the proposed CT detector module, the heat transfer section can each have an opening for receiving each cooling element. Furthermore, in the operating state, at least one cooling element can be in direct thermally conductive contact with the heat contact surface of the X-ray converter element and can be fastened to the X-ray converter element by fastening means.
[0058] The fastening means can include, for example, mechanical fastening means, in particular screws, pins, bolts, rivets and / or springs, and / or chemical fastening means, in particular adhesives. Advantageously, the fastening means can be designed to fasten at least one cooling element (in particular a plurality of cooling elements) to the X-ray converter element, in particular to hold it in a position-fixed manner. In particular, the fastening means can be designed to fasten at least one cooling element to the X-ray converter element through at least one opening of the hollow body.
[0059] The proposed embodiments can achieve the precise arrangement of at least one cooling element relative to the X-ray converter element to be cooled.
[0060] In another advantageous embodiment of the proposed CT detector module, at least one cooling element can be fastened to the hollow body by means of another fastening means in the operating state.
[0061] Another fastening device may be the same as or different from the fastening device for fastening the cooling element to the X-ray converter element. The other fastening device may include, for example, a mechanical fastening device (in particular screws, pins, bolts, rivets and / or springs) and / or a chemical fastening device (in particular adhesives). Advantageously, the additional fastening device may be designed to fasten at least one cooling element (in particular a plurality of cooling elements) to the hollow body (in particular to the inner side of the hollow body), in particular to hold it in a position-fixed manner.
[0062] In a third aspect, the invention relates to a CT device comprising a CT detector module according to the invention.
[0063] The advantages of the proposed CT device essentially correspond to the advantages of the proposed CT detector module. The features, advantages or alternative embodiments mentioned herein can also be applied to other claimed subject matters and vice versa.
[0064] The CT device may be an X-ray source, the proposed CT detector module and a supply unit. The X-ray source and the CT detector module may be arranged opposite to each other. The X-ray source may be designed to expose the CT detector module to X-ray radiation along the X-ray incident direction. The CT device may further include a gantry with a rotor. The X-ray source and the CT detector module may be arranged on the rotor in a predefined arrangement, in particular integrated in the rotor or fixed to the rotor. The rotor may be mounted to be rotatable about a rotation axis. The examination object to be imaged (e.g., a human and / or animal patient and / or a test phantom) may be placed on a patient examination table and moved through the gantry along the rotation axis. BRIEF DESCRIPTION OF THE DRAWINGS
[0065] Exemplary embodiments of the invention are shown in the drawings and further described below. In the different figures, the same reference signs are used for the same features. In the drawings:
[0066] Figure 1 and 2 schematic views showing different advantageous embodiments of the module carrier,
[0067] Figures 3 to 5 schematic views showing various advantageous embodiments of the proposed CT detector module,
[0068] Figure 6 schematic views showing advantageous embodiments of the proposed CT device. DETAILED DESCRIPTION
[0069] Figure 1A schematic illustration shows a preferred embodiment of the proposed module carrier. The module carrier may have an integral and tunnel-shaped hollow body HK. Additionally, the hollow body HK may have an elongated cavity HR and at least two openings O1 and O2. Two of the at least two openings O1 and O2 may be arranged opposite each other along the longitudinal extension direction LR of the hollow body HK. The hollow body HK may be designed to be arranged on an X-ray converter element (not shown here) on its outer side. Additionally, the hollow body HK may be designed to receive at least one cooling element KE in its cavity HR by inserting it through at least one of the at least two openings O1, O2. Additionally, the hollow body HK may be designed to be flowed through by a fluid along its longitudinal extension direction LR. Additionally, the hollow body HK may have a heat transfer section which is designed to provide a thermally conductive contact between at least one cooling element KE and the X-ray converter element.
[0070] Advantageously, the hollow space HR may extend linearly along the longitudinal extension direction LR of the hollow body HK. Additionally, for each of the cooling elements KE to be received, the heat transfer section may respectively have an opening HK.O. In this operating state of the module carrier, at least one cooling element KE may have a direct thermally conductive contact with the X-ray converter element when arranged in the hollow space HR.
[0071] The hollow body HK may have at least one first section and at least one further section along its longitudinal extension direction LR. In this case, at least one first section may be designed to receive at least one cooling element KE. Additionally, at least one second section may have a flow-guiding internal structure.
[0072] Advantageously, the hollow body HK may have a closed polygonal profile transverse to its longitudinal extension direction LR.
[0073] Figure 2 A schematic illustration shows another preferred embodiment of the proposed module carrier. In this case, for each of the cooling elements KE to be received, the heat transfer section may respectively have a thermal contact surface HK.WKFI on the inner side of the hollow body HK and at least one further thermal contact surface HK.WKFA on the outer side. The heat transfer section may be designed to transfer heat between the thermal contact surface HK.WKFI on the inner side of the hollow body HK and the thermal contact surface HK.WKFA on the outer side. Additionally, in the operating state of the module carrier, the thermal contact surface of at least one cooling element KE, in particular at least one cooling element KE.WKF, may have a direct thermally conductive contact with the corresponding thermal contact surface HK.WKFI on the inner side when arranged in the cavity HR, and the X-ray converter element (not shown here) may have a direct thermally conductive contact with the thermal contact surface HK.WKFA on the outer side when arranged on the outer side of the hollow body.
[0074] Furthermore, the hollow body HK can have another opening O3 arranged away from its longitudinal extension direction LR. The hollow body HK can be designed to receive at least one cooling element KE in its cavity HR by inserting through the other opening O3.
[0075] Furthermore, the module carrier can have a cover element AE. In this case, in the operating state of the module carrier, at least one cooling element KE can be arranged in the cavity HR, and the cover element AE is fastened to the hollow body HK. Furthermore, the cover element AE can at least partially seal the other opening O3.
[0076] Figure 3 An advantageous embodiment of the proposed CT detector module is shown. The CT detector module can include at least one X-ray converter element RKE, the proposed module carrier, and at least one cooling element KE. The X-ray converter element RKE can have an upper side and a lower side. The X-ray converter element RKE can have an X-ray detector layer RDS at its upper side and a thermal contact surface RKE.WKF at its lower side. In the operating state of the CT detector module, at least one cooling element KE can be arranged in the cavity HR of the hollow body HK. Furthermore, in the operating state, the X-ray converter element RKE can be arranged on the outer side of the hollow body. Furthermore, in the operating state, at least one cooling element KE can be in thermally conductive contact with the thermal contact surface RKE.WKF of the X-ray converter element via a heat transfer section. Furthermore, for each of the cooling elements KE to be received, the heat transfer section can respectively have an opening HK.O. In the operating state of the module carrier, when at least one cooling element KE is arranged in the cavity HR, it can have direct thermally conductive contact with the X-ray converter element RKE. In particular, at least one cooling element can have a thermal contact surface KE.WKF, which is in direct thermal contact with the thermal contact surface RKE.WKF of the X-ray converter element in the operating state.
[0077] Advantageously, at least one cooling element KE arranged in the cavity HR of the hollow body HK can be designed to be flowed through by a fluid along the longitudinal extension direction LR of the hollow body HK. In the operating state of the CT detector module, the fluid flows through the hollow body HK and at least one cooling element KE arranged therein along the longitudinal extension direction LR of the hollow body HK.
[0078] Figure 4Another advantageous embodiment of the proposed CT detector module is shown. In this case, for each of the cooling elements KE to be received, the heat transfer section can have a thermal contact surface HK.WKFI on the inner side of the hollow body HK and at least one additional thermal contact surface HK.WKFA on the outer side. The heat transfer section can be designed to transfer heat between the thermal contact surface HK.WKFI on the inner side of the hollow body HK and the thermal contact surface HK.WKFA on the outer side. In addition, in the operating state of the module carrier, at least one cooling element KE, when arranged in the cavity HR, can have direct thermal contact with the corresponding thermal contact surface HK.WKFI on the inner side, and the X-ray converter element RKE, when arranged on the outer side of the hollow body, can have direct thermal contact with the thermal contact surface HK.WKFA on the outer side. In particular, in the operating state, the thermal contact surface RKE.WKF of the X-ray converter element can be in thermal contact with the thermal contact surface HK.WKFA of the hollow body on the outer side. In addition, in the operating state, the thermal contact surface KE.WKF of at least one cooling element can be in thermal contact with the thermal contact surface HK.WKFI of the hollow body on the inner side.
[0079] Figure 5 Another advantageous embodiment of the proposed CT detector module is shown. In this case, the hollow body HK can be designed to receive a plurality of cooling elements KE1, KE2, and KE3 in its cavity HR via at least one of at least two openings O1, O2. In addition, the plurality of cooling elements KE1, KE2, and KE3 can be arranged in rows in the cavity HR along the longitudinal extension direction LR of the hollow body HK. In particular, the hollow body HK can have a heat transfer section for each of the cooling elements KE1, KE2, KE3. The cooling elements KE1, KE2, and KE3 arranged in rows can have different lengths along the longitudinal extension direction LR of the hollow body HK. In addition, the length of the heat transfer section along the longitudinal extension direction LR of the hollow body HK can be adapted to the lengths of the cooling elements KE1, KE2, and KE3. Advantageously, for each of the cooling elements KE1, KE2, and KE3 to be received, the heat transfer section can have openings HK.O1, HK.O2, and HK.O3, respectively. In this case, in the operating state, one of the cooling elements KE1, KE2, and KE3 can have direct thermal contact with the thermal contact surface RKE.WKF of the X-ray converter element by means of the respective thermal contact surfaces KE1.WKF, KE2.WKF, and KE3.WKF and can be fastened to the X-ray converter element RKE by means of fastening means. Alternatively or additionally, in the operating state, the cooling elements KE1, KE2, and KE3 can be fastened to the hollow body HK by means of another fastening means.
[0080] Figure 6A schematic diagram showing an advantageous embodiment of the proposed CT device 33, which includes an X-ray source 37, a CT detector module DM, and a supply unit PRVS. The X-ray source 37 and the CT detector module DM can be arranged opposite to each other. The X-ray source 37 can be designed to expose the CT detector module to X-ray radiation along the X-ray incident direction. The CT device 33 can include a gantry 33 with a rotor 35. The X-ray source 37 and the CT detector module DM can be arranged at the rotor 35 in a specified arrangement, in particular integrated in the rotor 35 or fixed to the rotor 35. The rotor 35 can be mounted to be rotatable about a rotation axis 43. The examination object 39 to be imaged can be placed on a patient table 41 and moved through the gantry 33 along the rotation axis 43. The supply unit PRVS can be used to control the CT device 32 and calculate sectional images or volume images of the examination object 39. An input device 47 (such as a keyboard) and an output device 49 (such as a screen and / or a display) can be connected to the supply unit PRVS, in particular coupled in terms of signal technology. The input device 47 can advantageously be integrated into the output device 49, for example in the case of a resistive and / or capacitive input display.
[0081] The schematic diagram shown in the figure does not depict any scale or dimension relationships.
[0082] Finally, it is again pointed out that the methods and the devices shown above, which are described in detail, are merely exemplary embodiments, and those skilled in the art can modify them in various ways without departing from the scope of the present invention. In addition, the use of the indefinite article "a" or "an" does not exclude the possibility that the features discussed may occur more than once. Similarly, the terms "unit" and "element" do not exclude the relevant components from being composed of multiple interacting partial components, which can also be spatially distributed in an appropriate case.
[0083] In the context of the present application, the expression "based on" can be specifically understood as the expression "using". Specifically, a formula for generating (or: determining, defining, etc.) a first feature based on a second feature does not exclude generating (or: determining, defining, etc.) the first feature based on a third feature.
Claims
1. A module carrier for a CT detector module (DM), The module carrier has an integral tunnel-shaped hollow body (HK), The hollow body (HK) has an elongated cavity (HR) and at least two openings (O1, O2), wherein two openings (O1, O2) of the at least two openings (O1, O2) are arranged opposite to each other along a longitudinal extension direction (LR) of the hollow body (HK), The hollow body (HK) is designed as follows: - is arranged on the outer side of the hollow body on an X-ray converter element (RKE), - receiving at least one cooling element (KE, KE1, KE2, KE3) in the cavity (HR) of the hollow body by insertion through at least one of the at least two openings (O1, O2), - a fluid flows through the hollow body in the longitudinal extension direction (LR), The hollow body (HK) has a heat transfer section which is designed to provide a heat-conducting contact between at least one of the cooling elements (KE, KE1, KE2, KE3) and the X-ray converter element (RKE).
2. The module carrier according to claim 1, wherein the hollow body (HK) has a further opening (O3) which is arranged remote from the longitudinal extension direction (LR) of the hollow body, The hollow body (HK) is designed to receive at least one cooling element (KE, KE1, KE2, KE3) in the cavity (HR) of the hollow body by insertion through the further opening (O3).
3. The module carrier according to claim 2, wherein the module carrier has a cover element (AE), wherein in an operating state of the module carrier at least one of the cooling elements (KE, KE1, KE2, KE3) is arranged in the cavity (HR) and the cover element (AE) is fastened to the hollow body (HK), The cover element (AE) at least partially seals the further opening (O3).
4. A module carrier according to any one of the preceding claims, wherein the hollow body (HK) is designed to receive a plurality of cooling elements (KE, KE1, KE2, KE3) in a cavity (HR) of the hollow body via at least one of the at least two openings (O1, O2, O3), in, A plurality of cooling elements (KE, KE1, KE2, KE3) can be arranged in a row in the cavity (HR) along a longitudinal extension direction (LR) of the hollow body (HK).
5. The module carrier according to claim 4, wherein the hollow body (HK) has a heat transfer section for each of the cooling elements (KE, KE1, KE2, KE3), wherein the cooling elements (KE, KE1, KE2, KE3) arranged in a row have different lengths along the longitudinal extension direction (LR) of the hollow body (HK), The length of the heat transfer section along the longitudinal extension direction (LR) of the hollow body (HK) is adapted to the length of the cooling element (KE, KE1, KE2, KE3).
6. A module carrier according to any one of the preceding claims, wherein the heat transfer section has an opening (HK.O1, HK.O2, HK.O3) for each of the cooling elements (KE, KE1, KE2, KE3) to be received, Therein, in an operating state of the module carrier, at least one of the cooling elements (KE, KE1, KE2, KE3) is in direct thermally conductive contact with the X-ray converter element (RKE) when arranged in the cavity (HR).
7. The module carrier according to any one of claims 1 to 5, wherein for each of the cooling elements (KE, KE1, KE2, KE3) to be accommodated, the heat transfer section has a respective thermal contact surface (HK.WKFI) on the inner side of the hollow body (HK) and the heat transfer section has at least one further thermal contact surface (HK.WKFA) on the outer side, wherein the heat transfer section is designed to transfer heat between the inner heat contact surface (HK.WKFI) and the outer heat contact surface (HK.WKFA) of the hollow body, Wherein in the operating state of the module carrier: at least one of the cooling elements (KE, KE1, KE2, KE3) has direct heat-conducting contact with a corresponding thermal contact surface (HK.WKFI) at the inner side when arranged in the cavity, and When arranged on the outer side of the hollow body (HK), the x-ray converter element (RKE) is in direct heat-conducting contact with a thermal contact surface (HK.WKFA) on the outer side.
8. A module carrier according to any one of the preceding claims, wherein the hollow body (HK) has at least one first section and at least one further section along the longitudinal extension direction (LR) of the hollow body, wherein the at least one first section is designed to receive at least one cooling element (KE, KE1, KE2, KE3), The at least one second section has a flow-guiding inner structure.
9. A module carrier according to any one of the preceding claims, The hollow body (HK) has a polygonal or elliptical contour transversely to the longitudinal extension direction (LR) of the hollow body.
10. A CT detector module (DM), comprising at least one X-ray conversion element (RK), a module carrier according to any of the preceding claims, and at least one cooling element (KE, KE1, KE2, KE3), wherein the X-ray conversion element (RKE) has an upper side and an underside, wherein the X-ray conversion element (RKE) has an X-ray detector layer (RDS) on the upper side of the X-ray conversion element and a thermal contact surface (RKE.WKF) on the underside of the X-ray conversion element, Wherein, in the operating state of the CT detector module (DM): at least one of the cooling elements (KE, KE1, KE2, KE3) is arranged in the cavity (HR) of the hollow body (HK), the X-ray conversion element (RKE) is arranged on the outside of the hollow body (HK), and At least one of the cooling elements (KE, KE1, KE2, KE3) is in thermal contact with a thermal contact surface (RKE.WKF) of the x-ray conversion element via the heat transfer section.
11. The CT detector module (DM) according to claim 10, wherein in the arrangement in the cavity (HR) of the hollow body (HK), at least one of the cooling elements (KE, KE1, KE2, KE3) is designed to allow a fluid to flow through along the longitudinal extension direction (LR) of the hollow body (HK), In the operating state of the CT detector module (DM), the fluid flows through the hollow body (HK) and at least one cooling element (KE, KE1, KE2, KE3) arranged in the hollow body along the longitudinal extension direction (LR) of the hollow body (HK).
12. A CT detector module (DM) according to claim 10 or 11, It comprises a plurality of cooling elements (KE, KE1, KE2, KE3), which are arranged in a row in the cavity (HR) along the longitudinal extension direction (LR) of the hollow body (HK) in the operating state of the CT detector module (DM).
13. A CT detector module (DM) according to any one of claims 10 to 12, wherein the heat transfer section has an opening (HK.O1, HK.O2, HK.O3) for each of the cooling elements (KE, KE1, KE2, KE3) to be received, In the operating state: at least one of the cooling elements (KE, KE1, KE2, KE3) is in direct thermal contact with the thermal contact surface (RKE.WKF) of the X-ray converter element, and is fastened to the X-ray converter element (RKE) by means of fastening means.
14. A CT detector module (DM) according to any one of claims 10 to 13, In the operating state, at least one of the cooling elements (KE, KE1, KE2, KE3) is fastened to the hollow body (HK) by means of a further fastening means.
15. A CT device comprising at least one CT detector module (DM) according to any one of claims 10 to 14.