Surface-mounted semiconductor surface overflowing glue grinding device

Abstract

A device for grinding and removing excessive glue on the surface of a surface-mounted semiconductor belongs to the technical field of semiconductors and comprises a T-shaped horizontal frame which is provided with a feeding area, a grinding and removing area and a discharging area; the outer wall of the rotating cylinder is connected with a pair of symmetrically arranged sucking and releasing mechanisms and a pair of symmetrically arranged material pressing mechanisms, and the sucking and releasing mechanisms and the material pressing mechanisms are arranged along the circumference at an interval of 90 degrees; the grinding surface of the grinding plate faces upwards, and the grinding plate swings in the horizontal direction and is arranged in the grinding area; the feeding area is used for preparing a semiconductor array frame to be processed; the sucking and releasing mechanism is used for rotating along with the rotating cylinder and transferring the semiconductor array frame from the feeding area to the grinding plate and from the grinding plate to the discharging area; the material pressing mechanism is used for pressing the semiconductor array frame which is supported on the grinding plate when the material pressing mechanism rotates to the grinding area along with the rotating cylinder; the grinding plate is used for grinding the back face of the semiconductor array frame in the pressed state so as to remove excessive glue. According to the device, automatic excessive glue polishing and removing treatment is achieved, and the batch treatment efficiency is greatly improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, relates to integrated circuit packaging, and specifically to a device for removing glue overflow from the surface of a patch semiconductor. Background Art

[0002] In the semiconductor packaging and testing industry, there is a type of chip semiconductor product whose base island / heat sink is exposed to the outside after packaging. Its function is to dissipate heat when the product generates heat during operation. The surface where the heat sink is located is used to be soldered to the circuit board. The smoother the fit between the heat sink and the circuit board surface, the better the heat dissipation effect.

[0003] After packaging, the plastic injection of this type of product may spread to part of the heat sink surface, which is called overflow. Figure 1 and Figure 2 Schematic diagrams of the back structure of a patch semiconductor in an ideal state without glue overflow and with glue overflow are shown respectively, wherein the back of the patch semiconductor 9 has a heat sink 91; and Figure 1 Compared with the situation shown in Figure 2 It can be seen that the plastic package 92 on the side of the heat sink 91 has overflowed toward the heat sink 91. If this overflow is not handled, the product will not fit the circuit board evenly when used for terminal assembly, which will lead to poor heat dissipation and cause terminal abnormality.

[0004] The conventional method of removing excess glue is to use alkaline solution to boil and loosen the slight excess glue layer, and use high-pressure water to wash away the excess glue during the tinning process of the surface copper of the product. This method uses corrosive solution, which may enter the interior of the product and cause damage. In addition, the purchase cost of the solution is high, the time for removing the excess glue is long, and the solution boiling time is long. If 10 magazines / frames are processed each time, it will take up to 2 to 3 hours. Summary of the invention

[0005] In order to solve the deficiencies of the above-mentioned related prior art, the present application provides a device for grinding away excess glue on the surface of a patch semiconductor, which realizes automated grinding and removal of excess glue and greatly improves batch processing efficiency.

[0006] In order to achieve the above object, the present invention adopts the following technologies: A device for removing excess glue from the surface of a patch semiconductor, comprising: A T-shaped horizontal frame, wherein the first end is a loading area, the second end opposite to the first end is a grinding area, and the third end is a unloading area; A rotating cylinder is rotatably passed through the middle of the horizontal frame, and its outer wall is connected with a pair of symmetrically arranged suction and release mechanisms and a pair of symmetrically arranged material pressing mechanisms, and the suction and release mechanisms and the material pressing mechanisms are arranged at an interval of 90 degrees along the circumference; The grinding mechanism disposed in the grinding area has a grinding plate with an upward-facing grinding surface and is swingably arranged in the horizontal direction. Among them, the loading area is used to prepare the semiconductor array frame to be processed. During application, multiple stacks of semiconductor array frames are prepared in a rectangular array in the loading area, with the front side facing up and the back side facing down. The heat sinks of the patch semiconductors on the semiconductor array frame are exposed on the back side. The pick-and-place mechanism is used to rotate with the rotating cylinder and transfer the semiconductor array frame from the loading area to the grinding plate and from the grinding plate to the unloading area. The pressing mechanism is used to press the semiconductor array frame that has been received on the grinding plate when it rotates with the rotating cylinder to the grinding area. The grinding plate is used to grind the back side of the semiconductor array frame in a pressed state to remove the overflow glue.

[0007] Furthermore, a pair of dust suction mechanisms symmetrically arranged along the circumference are also connected to the outer wall of the rotating cylinder. The dust suction mechanisms are located at the interval between the pick-and-place mechanism and the pressing mechanism. The dust suction mechanisms are used to rotate with the rotating cylinder and reach the grinding area prior to the pick-and-place mechanism to suck dust from the grinding surface of the grinding plate.

[0008] Furthermore, a fixed column passes through the middle of the horizontal frame, and three cross frames are installed thereon, respectively located above the loading area, the grinding area, and the unloading area. Lower top cylinders are vertically arranged on the cross frames. The lower top cylinders in the loading area and the unloading area are used to cooperate with the pick-and-place mechanism to complete the sucking / releasing action of the semiconductor array frame. The lower top cylinder in the grinding area is used to cooperate with the pick-and-place mechanism to complete the releasing and sucking actions of the semiconductor array frame, and cooperate with the pressing mechanism to complete the pressing action of the semiconductor array frame.

[0009] Furthermore, the grinding mechanism includes a cross frame installed on the horizontal frame, at least one first horizontal guide rail provided on the cross frame, a grinding motor vertically installed on the horizontal frame with its output shaft passing through the cross frame upward, a turntable coaxially connected to the output shaft of the grinding motor and located above the cross frame, a rotating column eccentrically provided on the turntable, and a mounting block rotatably provided on the rotating column. A second horizontal guide rail perpendicular to its guiding direction is slidably provided on the first horizontal guide rail. A fixed seat is installed on the mounting block, and the fixed seat is slidably fitted to the second horizontal guide rail. The fixed seat is hollow inside and is connected to a vacuum pump installed in the grinding area or the cross frame through a hose. Vacuum suction holes communicating with its inside are arrayed on the top of the fixed seat, and the grinding plate is disposed on the top of the fixed seat.

[0010] Furthermore, a loading assembly is provided in the loading area, and a unloading assembly is provided in the unloading area; the loading assembly and the unloading assembly adopt the same structure, the loading assembly / unloading assembly comprises a pair of slide rails arranged on a horizontal frame along the length direction of the loading area / unloading area where the loading assembly / unloading assembly is located, a slider is slidably provided on the slide rail, a magazine seat is mounted on the slider, a plurality of limiting columns are provided on the magazine seat, and a plurality of limiting columns form a plurality of limiting areas in a rectangular array, the limiting areas are used to place magazines, a lifting hole penetrating the magazine seat is provided at the limiting areas, a limiting platform is provided at the bottom of the inner wall of the magazine, a receiving plate is provided on the limiting platform, and the receiving plate is used to receive the semiconductor array frame stacked on the magazine; The loading assembly / unloading assembly also includes a lifting mechanism arranged in the respective loading area / unloading area array and installed on the horizontal frame. The horizontal frame array is provided with a through hole corresponding to the lifting mechanism. The lifting mechanism is used to lift and lower the magazine seat when it moves along the slide rail to a predetermined position. The predetermined position refers to when the through holes are respectively opposite to the lifting holes, and the through holes and the lifting holes act on the receiving plate to perform lifting and lowering.

[0011] The beneficial effects of the present invention are: 1. It realizes continuous and efficient batch loading, adsorption transfer, polishing and de-glueing, adsorption transfer, and unloading of semiconductor frame arrays stacked in multiple clips. Through physical erasing, the effect of removing excess glue is more direct, and it only takes a few seconds each time to achieve the effect; and the grinding surface is set by diamond abrasive material to further ensure the grinding effect in a short time; the time spent on semi-finished product grinding is only 1 / 8 of the time spent on removing excess glue with liquid; and before each loading to the grinding area, there will be a dust suction mechanism that rotates with the same rotating drum to vacuum the top surface of the grinding plate, so as to provide a clean grinding environment for the next semiconductor frame array to be polished, ensuring the grinding effect; 2. Integrate batch loading, batch transfer, batch grinding, and batch unloading into one device, making the process more compact, saving transfer time between processes and additional tooling processes. When the last processed material is adsorbed and transferred to the unloaded material, the next one to be processed has also been adsorbed and transferred to the processing area, making the stepping rhythm more efficient. 3. The adsorption mechanism and the pressing mechanism are arranged at intervals. On the one hand, they correspond to different functions respectively, so as to facilitate the reliability of absorption and transfer, and the stability of adsorption, pressing and grinding. On the other hand, they can cooperate with the rotation to perform a tandem follow-up operation to improve the process flow efficiency; 4. During grinding, the grinding plate is constrained by the first horizontal guide rail and the second horizontal guide rail while swinging through the eccentric shaft, which can ensure that the grinding plate maintains its original posture and stability during the swing, ensuring that the grinding is completed effectively and efficiently; 5. In both the suction mechanism and the pressing mechanism, the reset after the lower jacking cylinder is released is completed by springs, enabling the lower jacking cylinder to be fixedly arranged without rotating with the rotating cylinder. This reduces the difficulty of implementing the device and does not affect the reset stroke after descending. If the lower jacking cylinder rotates with the rotating cylinder, the influence of rotation on the pipeline of the lower jacking cylinder needs to be considered, and a lower jacking cylinder needs to be added to each cross plate, which will increase the number of lower jacking cylinders and is not conducive to cost control. Among them, the pressing mechanism also provides pressing and buffering through the setting of the third spring. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a schematic diagram of the back structure of a patch semiconductor without glue overflow in an embodiment of the present application.

[0013] Figure 2 is a schematic diagram of the back structure of a patch semiconductor with glue overflow in an embodiment of the present application.

[0014] Figure 3 is a schematic diagram of a partial front structure of a semiconductor array frame in an embodiment of the present application.

[0015] Figure 4 is a schematic diagram of a partial back structure of a semiconductor array frame in an embodiment of the present application.

[0016] Figure 5 is a schematic diagram of the overall structure of a glue overflow grinding device in an embodiment of the present application.

[0017] Figure 6 is a schematic diagram of the structure of a horizontal frame, a feeding assembly, and a discharging assembly in an embodiment of the present application.

[0018] Figure 7 is a schematic diagram of the disassembled structure of a grinding mechanism in an embodiment of the present application.

[0019] Figure 8 is a schematic diagram of the combined structure of a grinding mechanism adsorbing a semiconductor array frame in an embodiment of the present application.

[0020] Figure 9 is a schematic diagram of the disassembled structure of a magazine and a jacking mechanism in an embodiment of the present application.

[0021] Figure 10 is a schematic diagram of the sectional structure of a fixed column and a rotating cylinder in an embodiment of the present application.

[0022] Figure 11 is a schematic diagram of the structure of a rotating cylinder, a suction and release mechanism, and a pressing mechanism in an embodiment of the present application.

[0023] Figure 12 is a schematic diagram of the structure of a rotating cylinder and a dust suction mechanism in an embodiment of the present application.

[0024] Figure 13 It is a schematic side view structure of the dust suction mechanism according to an embodiment of the present application.

[0025] Figure 14 It is a schematic side view structure of the suction and release mechanism according to an embodiment of the present application when it is located above the magazine.

[0026] Figure 15 It is a schematic partial state diagram when the suction nozzle of the suction plate according to an embodiment of the present application acts on the frame section of the semiconductor array frame.

[0027] Figure 16 It is a schematic side view structure of the material pressing mechanism and the grinding mechanism according to an embodiment of the present application.

[0028] Figure 17 It is Figure 16 an enlarged view of part A in

[0029] Reference numerals: 1 - horizontal frame, 10 - semiconductor array frame, 11 - loading area, 12 - unloading area, 13 - grinding area, 14 - slide rail, 15 - slider, 16 - magazine seat, 17 - jacking hole, 18 - limit post, 19 - through hole; 2 - magazine, 21 - limit table, 22 - receiving plate; 3 - jacking mechanism, 31 - horizontal top plate, 32 - guide rod, 33 - vertical guide sleeve, 34 - lifting motor, 35 - rack; 4 - grinding mechanism, 40 - cross frame, 41 - first horizontal guide rail, 42 - second horizontal guide rail, 43 - grinding motor, 44 - turntable, 45 - rotating column, 46 - mounting block, 47 - fixed seat, 48 - vacuum pump, 49 - grinding plate; 5 - fixed column, 50 - base, 51 - cross frame, 52 - lower jacking cylinder, 53 - rotating cylinder, 54 - gear ring, 55 - driving gear, 56 - driving motor, 57 - cross plate, 58 - cross bar; 6 - suction and release mechanism, 60 - first vacuum machine, 61 - first fixing plate, 62 - first movable plate, 63 - first stress block, 64 - suction plate, 65 - first guide post, 66 - first spring, 67 - suction nozzle; 7 - material pressing mechanism, 70 - second vacuum machine, 71 - second fixing plate, 72 - second movable plate, 73 - second stress block, 74 - material pressing plate, 75 - second guide post, 76 - second spring, 77 - limit head, 78 - limit cavity, 79 - third spring, 710 - limit groove, 711 - suction hole; 8 - dust suction mechanism, 81 - suction cup, 82 - downward extending cylinder, 83 - vacuum cleaner, 84 - vertical column, 85 - limit ring, 86 - fourth spring; 9 - chip semiconductor, 91 - heat sink, 92 - plastic package. Detailed implementation manners

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will describe the implementation manners of the present invention in detail with reference to the accompanying drawings. However, the embodiments described herein are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0031] As Figure 3 and Figure 4 respectively show partial front and back structure views of a semiconductor array frame 10. As Figure 1 and Figure 2 show a schematic back structure view of a single patch semiconductor 9 in the array on the semiconductor array frame 10. The heat sink 91 of the single patch semiconductor 9 is encapsulated on its back / back side.

[0032] An embodiment of the present application provides a device for removing overflow glue on the surface of a patch semiconductor, which is used to act on a plurality of stacks of semiconductor array frames 10 placed in an array in batches, and remove the patch semiconductors 9 on the semiconductor array frame 10 with overflow glue covering their heat sinks 91 as shown in Figure 2 to the situation without overflow glue as shown in Figure 1 .

[0033] Specifically, as Figures 5 - 8 , Figure 11 show, the overflow glue removal device of this example includes a horizontal frame 1, a grinding mechanism 4, a fixed column 5, a rotating cylinder 53, a suction and release mechanism 6, a pressing mechanism 7, etc.

[0034] The horizontal frame 1 is in a T shape. Its first end is the loading area 11, which is the starting end; the second end opposite to the first end is the grinding area 13, which is the intermediate processing end; the third end is the unloading area 12, which is the end. Among them, the first end and the second end are both located on the first straight segment of the T shape, and the third end is located on the second straight segment perpendicular to the first straight segment.

[0035] Among them, the loading area 11 is used to prepare the semiconductor array frame 10 to be processed. During application, multiple stacks of semiconductor array frames 10 are prepared in a rectangular array in the loading area 11, and are in a posture with the front facing up and the back facing down, presenting the states as shown in Figure 2 and Figure 4 . The heat sinks 91 of the patch semiconductors 9 on the semiconductor array frame 10 are exposed on the back. The grinding area 13 is used for grinding treatment, and the unloading area 12 is used to receive the semiconductor array frame 10 that has been processed and transferred from the grinding area 13.

[0036] The rotating cylinder 53 is rotatably penetrated through the middle of the horizontal frame 1. As the rotating cylinder 53 rotates in Figure 5When rotating clockwise from the shown perspective, there is an order of starting end → intermediate processing end → tail end. A pair of symmetrically arranged suction and release mechanisms 6 and a pair of symmetrically arranged material pressing mechanisms 7 are connected to the outer wall of the rotating cylinder 53. The suction and release mechanisms 6 and the material pressing mechanisms 7 are arranged at intervals of 90° along the circumference. A grinding mechanism 4 is provided in the grinding area 13. The grinding mechanism 4 has a grinding plate 49 with an upward-facing grinding surface and is arranged to swing in the horizontal direction.

[0037] After the semiconductor array frame 10 to be processed is prepared in the loading area 11, the suction and release mechanism 6 rotates with the rotating cylinder 53 to the loading area 11, sucks the semiconductor array frame 10 from the loading area 11 for transfer to the grinding plate 49. When the suction and release mechanism 6 rotates with the rotating cylinder 53 to the grinding area 13, it releases the semiconductor array frame 10 to the grinding area 13 and is received by the grinding plate 49. Then, the current suction and release mechanism 6 rotates to the unloading area 12 while remaining empty. At the same time, the next adjacent material pressing mechanism 7 rotates to the grinding area 13. The material pressing mechanism 7 adsorbs and presses the semiconductor array frame 10 already received on the grinding plate 49, and cooperates with the grinding plate 49 to grind the back surface of the semiconductor array frame 10 in the pressed state to remove the overflow glue. Specifically, the semiconductor array frame 10 is adsorbed and pressed by the material pressing mechanism 7 on the top surface of the grinding plate 49, and the grinding plate 49 continuously grinds the back surface of the chip-mounted semiconductor 9 during horizontal swinging to achieve glue removal. After the removal is completed, the material pressing mechanism 7 releases the pressing and continues to rotate to the unloading area 12. The next suction and release mechanism 6 following it rotates to the grinding area 13 to suck the processed semiconductor array frame 10, while the previous suction and release mechanism 6 rotates to the loading area 11 to suck the next batch of semiconductor array frames 10 to be processed. Continuing to rotate, the suction and release mechanism 6 sucking the processed semiconductor array frame 10 releases and unloads it when it rotates to the unloading area 12. In this way, by continuously cycling the operation, not only can the efficiency of batch processing be improved, but also there will be no waste of the stepping rhythm caused by excessive empty rotation.

[0038] More specifically, a fixed column 5 passes through the middle of the horizontal frame 1, and three cross frames 51 are installed thereon, which are respectively located above the loading area 11, the grinding area 13, and the unloading area 12. Vertical lower pushing cylinders 52 are respectively provided on the cross frames 51. The lower pushing cylinders 52 in the loading area 11 and the unloading area 12 are used to cooperate with the suction and release mechanism 6 to complete the sucking / releasing action of the semiconductor array frame 10. The lower pushing cylinder 52 in the grinding area 13 is used to cooperate with the suction and release mechanism 6 to complete the releasing and sucking action of the semiconductor array frame 10, and cooperate with the material pressing mechanism 7 to complete the pressing action of the semiconductor array frame 10. That is, the lower pushing cylinder 52 is used to perform the lowering and raising actions after the suction and release mechanism 6 and the material pressing mechanism 7 rotate into position.

[0039] As an alternative implementation, in order to simplify the structure, such as Figure 10As shown in the figure, the fixed column 5 can be installed on the base 50. The rotating cylinder 53 is coaxially and rotatably sleeved on the outer periphery of the fixed column 5 and supported on the base 50. A gear ring 54 is provided on the outer periphery of the rotating cylinder 53. The gear ring 54 meshes with a driving gear 55. The driving gear 55 is connected to the output shaft of a driving motor 56 installed on the horizontal frame 1 or on the base 50. The rotating cylinder 53 is driven to rotate by the driving motor 56 in cooperation with the driving gear 55 and the gear ring 54. Considering the stability of the operation of the rotating cylinder 53, the driving motor 56 can be a servo motor, which has an encoder to provide real-time feedback of position information. When powered off, it can be assisted in locking by an external brake or a mechanical locking device, or other existing means in the art such as an electromagnetic / permanent magnet braking motor with power-off self-locking can be selected.

[0040] Specifically, as Figures 6 - 8 shown, the grinding mechanism 4 includes a cross frame 40 installed on the horizontal frame 1, at least one first horizontal guide rail 41 provided on the cross frame 40, a grinding motor 43 vertically installed on the horizontal frame 1 and whose output shaft passes upward through the cross frame 40, a turntable 44 coaxially connected to the output shaft of the grinding motor 43 and located above the cross frame 40, a rotating column 45 eccentrically provided on the turntable 44, and a mounting block 46 rotatably provided on the rotating column 45. A second horizontal guide rail 42 perpendicular to the guiding direction of the first horizontal guide rail 41 is slidably provided on the first horizontal guide rail 41. A fixed seat 47 is installed on the mounting block 46. The fixed seat 47 is slidably engaged with the second horizontal guide rail 42. The interior of the fixed seat 47 is hollow and is connected to a vacuum pump 48 installed in the grinding area 13 or on the cross frame 40 through a hose. Vacuum suction holes communicating with its interior are arranged in an array on the top of the fixed seat 47. The grinding plate 49 is arranged against the top of the fixed seat 47.

[0041] The grinding plate 49 is adsorbed and closely attached to the top of the fixed seat 47 by the vacuum pump 48, so that it swings synchronously with the fixed seat 47. The grinding motor 43 drives the turntable 44 to rotate. The eccentric rotating column 45 rotates accordingly. The fixed seat 47 connected to the mounting block 46 and sliding on the second horizontal guide rail 42 will swing in a manner of maintaining its original posture under the drive of the rotating column 45 and under the constraints of the second horizontal guide rail 42 and the first horizontal guide rail 41, realizing swinging in the horizontal direction, so as to realize that the grinding plate 49 continuously grinds and removes the colloid on the back of the semiconductor array frame 10 adsorbed and pressed by the pressing mechanism 7. Preferably, the grinding plate 49 is a grinding plate with a diamond abrasive material on its top surface, which can have a better grinding effect and improve the grinding speed.

[0042] Specifically, a loading component is provided in the loading area 11, and an unloading component is provided in the unloading area 12. The loading component and the unloading component have the same structure. Specifically, as Figure 5 、 Figure 6 、 Figure 9As shown in the figure, the loading component or the unloading component both include a pair of slide rails 14 arranged along the length direction of their respective areas on the horizontal frame 1 and a jacking mechanism 3 arranged in an array in their respective areas and mounted on the horizontal frame 1. Here, their respective areas refer to the loading area 11 where the loading component is located and the unloading area 12 where the unloading component is located. The whole jacking mechanism 3 is located below the horizontal frame 1. Specifically, a slider 15 is slidably arranged on the slide rail 14, a magazine seat 16 is mounted on the slider 15, a plurality of limiting columns 18 are arranged on the magazine seat 16, and a plurality of limiting areas in a rectangular array are formed by the plurality of limiting columns 18. The limiting areas are used for placing the magazines 2. A jacking hole 17 penetrating the magazine seat 16 is arranged at the limiting area. A limiting platform 21 is arranged at the bottom of the inner wall of the magazine 2, and a receiving plate 22 is arranged on the limiting platform 21. The receiving plate 22 is used for receiving the semiconductor array frames 10 stacked in the magazine 2. The horizontal frame 1 is provided with through holes 19 corresponding to the jacking mechanism 3 in an array. The jacking mechanism 3 is used for, when the magazine seat 16 moves along the slide rail 14 to a predetermined position (the predetermined position means that the through holes 19 are respectively directly opposite to the jacking holes 17), acting on the receiving plate 22 through the through holes 19 and the jacking holes 17 to perform lifting and lowering.

[0043] When loading, first place the magazines 2 stacked with the semiconductor array frames 10 in the limiting areas of the magazine seat 16 respectively. In the magazine 2, the semiconductor array frames 10 are stacked on the receiving plate 22, and the receiving plate 22 is supported by the limiting platform 21 but can be jacked up. Then move the magazine seat 16 above the area where the through holes 19 are located and make each through hole 19 correspond to the jacking hole 17 respectively. The jacking mechanism 3 acts on the receiving plate 22 through the through holes 19 and the jacking holes 17 to jack up the semiconductor array frames 10 therein by a certain height for the picking and placing mechanism 6 to pick up and transfer. After each is picked up, it is jacked up by a certain height continuously. When unloading, the jacking mechanism 3 is used to first jack up the receiving plate 22 to the receiving height to receive the semiconductor array frames 10 picked up, transferred and released by the picking and placing mechanism 6. After each reception, it moves down by a certain height continuously.

[0044] By setting the movable magazine seat 16, it is convenient to move from the preparation position to the position to be picked up in the loading area 11. And by forming an array of limiting areas by the limiting columns 18, it is convenient to place the magazines 2 in batches, and they can be jacked up in batches subsequently and also picked up in batches, so batch loading can be realized. Similarly, for the unloading area 12, batch unloading can also be realized.

[0045] As an alternative implementation form of the jacking mechanism 3, such as Figure 6 and Figure 9As shown in the figure, the jacking mechanism 3 includes a pair of vertical guide sleeves 33 mounted on the horizontal frame 1, guide rods 32 inserted into each vertical guide sleeve 33, a rack 35 parallel to the guide rods 32, a horizontal top plate 31 connected to the tops of the guide rods 32 and the rack 35, and a lifting motor 34 mounted on the horizontal frame 1. The output shaft of the lifting motor 34 is connected with a driving gear meshing with the rack 35. Specifically, the vertical guide sleeves 33 and the lifting motor 34 can be connected to the horizontal frame 1 through brackets and are located below the horizontal frame 1. By the action of the lifting motor 34, the driving gear rotates to drive the rack 35 to jack up the horizontal top plate 31 or lower the horizontal top plate 31. The horizontal top plate 31 acts on the receiving plate 22, and the guide rods 32 and the vertical guide sleeves 33 can be used to limit the stability of the lifting during the lifting process. Similarly, considering the stability of the operation of the jacking mechanism 3, the lifting motor 34 can be a servo motor, or other existing means in the art such as an electromagnetic / permanent magnet braking motor with power-off self-locking can be selected.

[0046] Preferably, in order to remove the debris and dust generated on the top surface of the grinding plate 49 after each grinding and provide a clean grinding surface for the next grinding, a dust suction component can be configured for dust suction. Specifically, in the structural environment already set up in this application, how to effectively utilize the current structural components to build a dust suction structure and make it operate efficiently and effectively suck dust is another technical problem to be solved. As Figure 5 shown, a pair of dust suction mechanisms 8 are symmetrically arranged along the circumference on the outer wall of the rotating cylinder 53 of the present application. The dust suction mechanisms 8 are located at the interval between the suction and release mechanism 6 and the material pressing mechanism 7. Specifically, if the rotating cylinder 53 rotates clockwise as Figure 5 shown, the dust suction mechanisms 8 are located in front of the suction and release mechanism 6. Then, as the rotating cylinder 53 rotates, the dust suction mechanisms 8 can reach the grinding area 13 prior to the suction and release mechanism 6 to suck dust from the grinding surface of the grinding plate 49. With such a setting, the rotation of the rotating cylinder 53 is well utilized, and the dust suction mechanisms 8 can suck dust before the suction and release mechanism 6 reaches the grinding area 13 each time, so as to clean the grinding surface of the grinding plate 49 for the next grinding and cleaning work.

[0047] Specifically, as Figure 12 and Figure 13 shown, the dust suction mechanism 8 includes a cross bar 58 connected to the outer wall of the rotating cylinder 53, a vacuum cleaner 83 mounted on the cross bar 58, a suction cup 81 arranged parallel to and below the cross bar 58 and connected to the vacuum cleaner 83 through a hose, a downward extending cylinder 82 vertically mounted on the cross bar 58 and the output shaft of which passes through the cross bar 58 to connect the suction cup 81. A plurality of vertical columns 84 are connected to the top of the suction cup 81. The vertical columns 84 all pass through the cross bar 58 upward. A limit ring 85 is provided at the top of the vertical columns 84. The limit ring 85 is located above the cross bar 58. A fourth spring 86 is sleeved on the vertical columns 84. The fourth spring 86 is located between the suction cup 81 and the cross bar 58.

[0048] When the dust suction mechanism 8 is ready to perform dust suction, it is located above the grinding plate 49. At this time, the suction cup 81 is extended downward by a certain distance through the lower extension cylinder 82, so that there is only a small distance between the suction cup 81 and the grinding surface of the grinding plate 49. The vacuum cleaner 83 is turned on to suck the grinding surface of the grinding plate 49 through the suction cup 81. Considering the problem of the dust suction coverage area, when the suction cup 81 of the dust suction mechanism 8 just has an area covering the grinding plate 49, the suction cup 81 can be extended downward and the vacuum cleaner 83 can be turned on, so that during the rotation process, continuous dust suction can be carried out to cover the entire area of the grinding plate 49 and ensure the dust suction effect. The fourth spring 86 is used to provide buffering during the recovery stroke of the lower extension cylinder 82 to avoid hard contact between the suction cup 81 and the cross bar 58.

[0049] As an optional specific structure of the suction and release mechanism 6, as Figure 11 , Figure 14 , Figure 15 shown, the suction and release mechanism 6 includes a first fixed plate 61 connected to the outer wall of the rotating cylinder 53 through a cross plate 57, a first movable plate 62 parallel to and located above the first fixed plate 61, a plurality of suction plates 64 parallel to and located below the first fixed plate 61, and a first vacuum machine 60 mounted on the first fixed plate 61. The suction plates 64 are connected to the first movable plate 62 through a plurality of first guide posts 65 passing through the first fixed plate 61. Each suction plate 64 can correspondingly suck a semiconductor array frame 10. The first vacuum machine 60 can be mounted above the first movable plate 62 through a rod body passing through the first movable plate 62 and connecting to the first fixed plate 61. The bottom of the suction plate 64 is provided with a suction nozzle 67 array for adsorbing the frame section of the semiconductor array frame 10. The suction plate 64 is connected to the first vacuum machine 60 through a hose. A first spring 66 is sleeved on the first guide post 65, and the first spring 66 is located between the first fixed plate 61 and the first movable plate 62. The lower pushing cylinder 52 is used to act on the first movable plate 62. The top surface of the first movable plate 62 has a first force receiving block 63 for receiving the action of the lower pushing cylinder 52.

[0050] When it is necessary to suck the semiconductor array frame 10 stacked on the top layer and lifted by the horizontal top plate 31 from the magazine 2, through the action of the lower pushing cylinder 52, the first movable plate 62 is forced to descend, and the suction plates 64 also descend synchronously until the suction nozzle 67 contacts the frame section of the semiconductor array frame 10 to be sucked. The first vacuum machine 60 is turned on so that the suction nozzle 67 adsorbs the semiconductor array frame 10; the first spring 66 can provide a buffering effect during the downward stroke to avoid pressing down on the semiconductor array frame 10, and can also make the first movable plate 62 reset upward when the lower pushing cylinder 52 retracts its driving rod, so that the suction plates 64 will lift the semiconductor array frame 10 adsorbed through the suction nozzles 67.

[0051] When the suction and release mechanism 6 is positioned at the grinding area 13 or the blanking area 12 and is ready to release the sucked semiconductor array frame 10, under the action of the lower push cylinder 52, the first movable plate 62 is forced to descend, and the suction plate 64 also descends synchronously until the adsorbed semiconductor array frame 10 comes into contact, or there is only a small distance from the grinding surface of the grinding plate 49, or there is only a small distance from the receiving plate 22 in the magazine 2 of the blanking area 12 or the semiconductor array frame 10 stacked on the receiving plate 22. Then, control the first vacuum machine 60 to release the adsorption of the suction nozzle 67 on the semiconductor array frame 10, so that the semiconductor array frame 10 is received on the grinding plate 49, or the receiving plate 22 in the blanking area 12, or the semiconductor array frame 10 stacked on the receiving plate 22 in the blanking area 12, completing the discharging. Then, the lower push cylinder 52 retracts its driving rod, and the first movable plate 62 resets upward under the action of the first spring 66, retracting the suction plate 64.

[0052] In the above process, through the ingenious and reasonable structural design, a part of the structure rotates with the rotating cylinder 53 to cooperate with another part of the fixed structure in different areas for suction and release, achieving both the stepping operation mode of rotation without being affected and ensuring the downward force action required during suction / release.

[0053] As an optional specific structure of the pressing mechanism 7, such as Figure 11 , Figure 16 , Figure 17As shown in the figure, the blank holding mechanism 7 includes a second fixed plate 71 connected to the outer wall of the rotating cylinder 53 through a cross plate 57, a second movable plate 72 parallel to and above the second fixed plate 71, a plurality of blank holding plates 74 parallel to and below the second fixed plate 71, and a second vacuum machine 70 mounted on the second fixed plate 71. The blank holding plates 74 are connected to a plurality of second guide posts 75 that pass through the second fixed plate 71 and the second movable plate 72 at the same time. The second vacuum machine 70 can be mounted above the second movable plate 72 through a rod body that passes through the second movable plate 72 and connects to the second fixed plate 71. The blank holding plates 74 are connected to the second vacuum machine 70 through hoses. The number of blank holding plates 74 matches the number of magazines 2 on the magazine seat 16. Each blank holding plate 74 correspondingly acts on the semiconductor array frame 10 on the top surface of one magazine 2. A limiting groove 710 is formed by recessing the bottom surface of the blank holding plate 74 for limiting the semiconductor array frame 10. The inner bottom surface of the limiting groove 710 is provided with suction holes 711 for adsorbing the front surface of the patch semiconductor 9 of the semiconductor array frame 10. A plurality of limiting cavities 78 corresponding to the positions of the second guide posts 75 are provided on the second movable plate 72. The top ends of the second guide posts 75 are provided with limiting heads 77 located in the limiting cavities 78. A second spring 76 and a third spring 79 are sleeved on the second guide posts 75. The second spring 76 is located between the second fixed plate 71 and the second movable plate 72, and the third spring 79 is located between the limiting head 77 and the inner top wall of the limiting cavity 78. The lower push cylinder 52 is used to act on the second movable plate 72. The top surface of the second movable plate 72 has a second force receiving block 73 for receiving the action of the lower push cylinder 52.

[0054] When it is necessary to adsorb and press the semiconductor array frame 10 located on the polishing surface of the polishing plate 49 for polishing and degumming, when the pressing mechanism 7 rotates with the rotating cylinder 53 to the grinding area 13, it acts downward through the lower top cylinder 52 at this position, causing the top surface of the second movable plate 72 to move downward under force, and the second spring 76 is compressed. The limiting cavity 78, the third spring 79, the second guide post 75, and the pressing plate 74 also descend as a whole. When the pressing plate 74 contacts the semiconductor array frame 10, the semiconductor array frame 10 gradually fits into the limiting groove 710, and the back surface of the single-chip semiconductor 9 fits to the orifice of the suction hole 711; then, the lower top cylinder 52 continues to act, causing the second movable plate 72 to continue to descend. At this time, the second guide post 75 and the pressing plate 74 are already supported by the polishing plate 49 and no longer descend. The distance between the limiting head 77 and the inner top wall of the limiting cavity 78 will decrease, and the third spring 79 will be compressed. After being compressed to a certain extent, the lower top cylinder 52 is paused. At this time, the semiconductor array frame 10 is adsorbed and pressed against the polishing surface of the polishing plate 49. Then, by starting the swinging motion of the polishing plate 49, the back surface of the single-chip semiconductor 9 is polished. The semiconductor array frame 10 is limited by the limiting groove 710, which also avoids displacement during polishing. It should be noted that at this time, the second spring 76 is still not compressed to the limit, and the third spring 79 is only compressed for a certain stroke. Therefore, the third spring 79 can provide pressing and buffering forces to facilitate polishing. Subsequently, after the action of the lower top cylinder 52 on the second movable plate 72 is released, the second spring 76 can reset the second movable plate 72 for the upward stroke. During the reset, the second movable plate 72 first rises, and at the same time, the third spring 79 will gradually return to the natural state and finally retract to the initial state.

[0055] The above are only the preferred embodiments of the present application and are not used to limit the present application. Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application.

Claims

1. A device for removing excess glue from the surface of a patch semiconductor, characterized in that: include: A T-shaped horizontal frame (1), wherein the first end is a loading area (11), the second end opposite to the first end is a grinding area (13), and the third end is a unloading area (12); A rotating cylinder (53) is rotatably passed through the middle of the horizontal frame (1), and its outer wall is connected to a pair of symmetrically arranged suction and release mechanisms (6) and a pair of symmetrically arranged material pressing mechanisms (7), wherein the suction and release mechanisms (6) and the material pressing mechanisms (7) are arranged at an interval of 90 degrees along the circumference; A grinding mechanism (4) disposed in the grinding area (13), comprising a grinding plate (49) with a grinding surface facing upward and swung in a horizontal direction; The loading area (11) is used to prepare semiconductor array frames (10) to be processed. When used, the semiconductor array frames (10) are stacked in a rectangular array in the loading area (11) with the front side facing upward and the back side facing downward. The heat sink (91) of the patch semiconductor (9) on the semiconductor array frame (10) is exposed on the back side. The suction and release mechanism (6) is used to rotate with the rotating cylinder (53) to transfer the semiconductor array frame (10) from the loading area (11) to the grinding plate (49) and from the grinding plate (49) to the lowering area (12); The material pressing mechanism (7) is used to press the semiconductor array frame (10) received on the grinding plate (49) when the rotating cylinder (53) rotates to the grinding area (13); The grinding plate (49) is used to grind the back side of the semiconductor array frame (10) in a pressed state to remove overflow glue.

2. The device for removing excess glue from the surface of a SMD semiconductor according to claim 1, characterized in that: The outer wall of the rotating cylinder (53) is also connected to a pair of dust suction mechanisms (8) arranged symmetrically along the circumference. The dust suction mechanisms (8) are located at the interval between the suction and release mechanisms (6) and the material pressing mechanism (7). The dust suction mechanisms (8) are used to rotate with the rotating cylinder (53) and reach the grinding area (13) before the suction and release mechanisms (6) to suck dust from the grinding surface of the grinding plate (49).

3. The device for removing excess glue from the surface of a SMD semiconductor according to claim 2, characterized in that: The dust collecting mechanism (8) comprises a cross bar (58) connected to the outer wall of the rotating cylinder (53), a dust collector (83) mounted on the cross bar (58), a suction cup (81) arranged parallel to the bottom of the cross bar (58) and connected to the dust collector (83) via a hose, and a downward extending cylinder (82) vertically mounted on the cross bar (58) and having an output shaft passing through the cross bar (58) and connected to the suction cup (81); a plurality of vertical columns (84) are connected to the top of the suction cup (81); the vertical columns (84) are all arranged to pass through the cross bar (58) upwards; a limiting ring (85) is provided at the top of the vertical column (84); a fourth spring (86) is sleeved on the vertical column (84); and the fourth spring (86) is located between the suction cup (81) and the cross bar (58).

4. The device for removing excess glue from the surface of a SMD semiconductor according to claim 1, characterized in that: A fixed column (5) is provided in the middle of the horizontal frame (1), and three horizontal frames (51) are installed on the horizontal frame, which are respectively located above the loading area (11), the grinding area (13), and the unloading area (12). Lower cylinders (52) are respectively vertically provided on the horizontal frames (51); The lower top cylinders (52) of the loading area (11) and the unloading area (12) are used to cooperate with the suction and release mechanism (6) to complete the suction / release action of the semiconductor array frame (10); The lower top cylinder (52) of the grinding area (13) is used to cooperate with the suction and release mechanism (6) to complete the release and suction action of the semiconductor array frame (10), and cooperate with the pressing mechanism (7) to complete the pressing action of the semiconductor array frame (10).

5. The device for removing excess glue from the surface of a SMD semiconductor according to claim 4, characterized in that: The fixed column (5) is mounted on the base (50), the rotating cylinder (53) is rotatably sleeved on the outer periphery of the fixed column (5) and supported on the base (50), the outer periphery of the rotating cylinder (53) is provided with a gear ring (54), the gear ring (54) is meshed with a driving gear (55), and the driving gear (55) is connected to the output shaft of a driving motor (56) mounted on the horizontal frame (1).

6. The device for removing excess glue from the surface of a SMD semiconductor according to claim 1, characterized in that: The grinding mechanism (4) comprises a cross frame (40) mounted on the horizontal frame (1), at least one first horizontal guide rail (41) provided on the cross frame (40), a grinding motor (43) vertically mounted on the horizontal frame (1) and having an output shaft passing through the cross frame (40) in an upward direction, a rotating disk (44) coaxially connected to the output shaft of the grinding motor (43) and located above the cross frame (40), a rotating column (45) eccentrically provided on the rotating column (44), and a mounting block (46) rotatably provided on the rotating column (45), wherein the first horizontal guide rail (41) is provided on the cross frame (40) and the grinding motor (43) is vertically mounted on the horizontal frame (1) and the output shaft passes through the cross frame (40) in an upward direction, A second horizontal guide rail (42) perpendicular to the guide direction is slidably provided on the guide rail (41), a fixing seat (47) is installed on the mounting block (46), the fixing seat (47) is slidably matched with the second horizontal guide rail (42), the fixing seat (47) is hollow inside and is connected to a vacuum pump (48) installed in the grinding area (13) or the cross frame (40) through a hose, the top of the fixing seat (47) is provided with an array of vacuum suction holes connected to the inside, and a grinding plate (49) is arranged on the top of the fixing seat (47).

7. The device for removing excess glue from the surface of a SMD semiconductor according to claim 1, characterized in that: The loading area (11) is provided with a loading assembly, and the unloading area (12) is provided with a unloading assembly; The loading assembly and the unloading assembly both comprise a pair of slide rails (14) arranged on a horizontal frame (1) along the length direction of the respective regions, a slider (15) being slidably arranged on the slide rails (14), a magazine seat (16) being arranged on the slider (15), a plurality of limiting columns (18) being arranged on the magazine seat (16), the plurality of limiting columns (18) forming a plurality of limiting areas in a rectangular array, the limiting areas being used to place the magazine (2), a lifting hole (17) penetrating the magazine seat (16) being arranged at the limiting areas, a limiting platform (21) being arranged at the bottom of the inner wall of the magazine (2), a receiving plate (22) being arranged on the limiting platform (21), the receiving plate (22) being used to receive the semiconductor array frame (10) stacked on the magazine (2); Both the loading assembly and the unloading assembly further include lifting mechanisms (3) arranged in an array in their respective areas and mounted on the horizontal frame (1); the horizontal frame (1) array is provided with through holes (19) corresponding to the lifting mechanisms (3); the lifting mechanisms (3) are used to lift and lower the magazine seat (16) by acting on the receiving plate (22) through the through holes (19) and the lifting holes (17) when the magazine seat (16) moves to a predetermined position along the slide rail (14).

8. The device for removing excess glue from the surface of a SMD semiconductor according to claim 7, characterized in that: The lifting mechanism (3) comprises at least one vertical guide sleeve (33) mounted on the horizontal frame (1), a guide rod (32) inserted in the vertical guide sleeve (33), a rack (35) parallel to the guide rod (32), a horizontal top plate (31) connected to the top of the guide rod (32) and the rack (35), and a lifting motor (34) mounted on the horizontal frame (1), wherein the output shaft of the lifting motor (34) is connected to a driving gear meshed with the rack (35), and the horizontal top plate (31) is used to act on the receiving plate (22).

9. The device for removing excess glue from the surface of a SMD semiconductor according to claim 4, characterized in that: The suction and release mechanism (6) comprises a first fixed plate (61) connected to the outer wall of the rotating cylinder (53) through a transverse plate (57), a first movable plate (62) located parallel to and above the first fixed plate (61), a plurality of suction plates (64) located parallel to and below the first fixed plate (61), and a first vacuum machine (60) mounted on the first fixed plate (61); the suction plate (64) is connected to the first movable plate (62) through a plurality of first guide pillars (65) passing through the first fixed plate (61); a suction nozzle (67) is arrayed at the bottom of the suction plate (64) for adsorbing a frame section of the semiconductor array frame (10); the suction plate (64) is connected to the first vacuum machine (60) through a hose; a first spring (66) is sleeved on the first guide pillar (65); the first spring (66) is located between the first fixed plate (61) and the first movable plate (62); and a lower top cylinder (52) is used to act on the first movable plate (62).

10. The device for removing excess glue from the surface of a SMD semiconductor according to claim 4, characterized in that: The material pressing mechanism (7) comprises a second fixed plate (71) connected to the outer wall of the rotating cylinder (53) through a transverse plate (57), a second movable plate (72) located parallel to and above the second fixed plate (71), a plurality of material pressing plates (74) located parallel to and below the second fixed plate (71), and a second vacuum machine (70) mounted on the second fixed plate (71), the material pressing plate (74) being connected to a plurality of second guide pillars (75) simultaneously passing through the second fixed plate (71) and the second movable plate (72), the material pressing plate (74) being connected to the second vacuum machine (70) through a hose, the bottom surface of the material pressing plate (74) being recessed to form a limiting groove (710) for limiting the semiconductor array frame (10), the limiting groove ( The inner bottom surface array of the semiconductor array frame (710) has suction holes (711) for adsorbing the front surface of the patch semiconductor (9) of the semiconductor array frame (10); the second movable plate (72) is provided with a plurality of limiting cavities (78) corresponding to the position of the second guide pillar (75); the top of the second guide pillar (75) is provided with a limiting head (77) located in the limiting cavity (78); the second guide pillar (75) is sleeved with a second spring (76) and a third spring (79); the second spring (76) is located between the second fixed plate (71) and the second movable plate (72); the third spring (79) is located between the limiting head (77) and the inner top wall of the limiting cavity (78); and the lower top cylinder (52) is used to act on the second movable plate (72).

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