A device for grinding and removing overflow glue on the surface of a patch semiconductor

Abstract

A patch semiconductor surface overflow glue grinding device belongs to the field of semiconductor technology and includes: a horizontal frame in a T shape, which has a feeding area, a grinding area, and a discharging area respectively; a rotating cylinder, on the outer wall of which a pair of symmetrically arranged suction and release mechanisms and a pair of symmetrically arranged pressing mechanisms are connected, and the suction and release mechanisms and the pressing mechanisms are arranged at an interval of 90° along the circumference; a grinding plate with the grinding surface facing upward and swinging in the horizontal direction in the grinding area; the feeding area is used for preparing the semiconductor array frame to be processed; the suction and release mechanism is used to rotate with the rotating cylinder to transfer the semiconductor array frame from the feeding area to the grinding plate and from the grinding plate to the discharging area; the pressing mechanism is used to press the semiconductor array frame already received on the grinding plate when rotating with the rotating cylinder to the grinding area; the grinding plate is used to grind the back of the semiconductor array frame in a pressed state to remove the overflow glue. This device realizes automatic overflow glue grinding and removal processing and greatly improves the batch processing efficiency.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, relates to integrated circuit packaging, and specifically relates to a device for grinding and removing overflow glue on the surface of a surface-mounted semiconductor. Background Art

[0002] In the semiconductor packaging and testing industry, there is a type of surface-mounted semiconductor product whose base island / heat sink is exposed externally after packaging. Its function is to dissipate heat when the product generates heat during operation. The surface where the heat sink is located is used for welding to the circuit board. The flatter it fits with the circuit board surface, the better the heat dissipation effect.

[0003] After the packaging of this type of product, the injection plastic may spread to a part of the surface of the heat sink, which is called overflow glue. As Figure 1 and Figure 2 respectively show schematic diagrams of the back structures of surface-mounted semiconductors in the ideal state without overflow glue and with overflow glue. Among them, the back of the surface-mounted semiconductor 9 has a heat sink 91; compared with the situation shown in Figure 1 it can be seen from Figure 2 that there is a situation where the plastic package 92 on the periphery of the heat sink 91 spreads to the heat sink 91 to form overflow glue. If this overflow glue state is not processed, when the product is used for terminal assembly, it will be unevenly attached to the circuit board, which will further lead to poor heat dissipation and cause abnormalities in the terminal.

[0004] The conventional method for removing overflow glue is to steam it with alkaline solution to loosen the slight overflow glue layer, and use high-pressure water to wash away the overflow glue during the process of tin plating the surface copper of the product. This method uses corrosive solution, which may enter the product and cause damage; and the cost of purchasing the solution is relatively high, the time for removing overflow glue is long, and the steaming time of the solution is long; if 10 magazines / frames of products are processed each time, it takes up to 2 to 3 hours. Summary of the Invention

[0005] To solve the deficiencies of the above-mentioned related prior arts, this application provides a device for grinding and removing overflow glue on the surface of a surface-mounted semiconductor, which realizes automatic grinding and removing treatment of overflow glue and greatly improves the batch processing efficiency.

[0006] To achieve the above purpose, the present invention adopts the following technologies:

[0007] A device for grinding and removing overflow glue on the surface of a surface-mounted semiconductor, comprising:

[0008] A horizontal frame in a T shape, whose first end is the loading area, the second end opposite to the first end is the grinding area, and the third end is the unloading area;

[0009] A rotating cylinder rotatably passing through the middle of the horizontal frame, and a pair of symmetrically arranged suction and release mechanisms and a pair of symmetrically arranged pressing mechanisms are connected to its outer wall. The suction and release mechanisms and the pressing mechanisms are arranged at intervals of 90° along the circumference;

[0010] An abrading mechanism disposed in the abrading area, which has an abrasive plate with an abrasive surface facing upward and swingably arranged in the horizontal direction;

[0011] Among them, the loading area is used to prepare the semiconductor array frame to be processed. During application, multiple stacks of semiconductor array frames are prepared in a rectangular array in the loading area, and they are in a posture with the front side facing upward and the back side facing downward. The heat sinks of the patch semiconductors on the semiconductor array frame are exposed on the back side;

[0012] The suction and placement mechanism is used to rotate with the rotating cylinder to transfer the semiconductor array frame from the loading area to the abrasive plate and from the abrasive plate to the unloading area;

[0013] The pressing mechanism is used to press the semiconductor array frame that has been received on the abrasive plate when it rotates with the rotating cylinder to the abrading area;

[0014] The abrasive plate is used to grind the back side of the semiconductor array frame in a pressed state to remove the overflow glue.

[0015] Furthermore, a pair of dust suction mechanisms symmetrically arranged along the circumference are also connected to the outer wall of the rotating cylinder. The dust suction mechanisms are located at the interval between the suction and placement mechanism and the pressing mechanism. The dust suction mechanisms are used to rotate with the rotating cylinder and reach the abrading area prior to the suction and placement mechanism to suck dust from the abrasive surface of the abrasive plate.

[0016] Furthermore, a fixed column passes through the middle of the horizontal frame, and three cross frames are installed thereon, which are respectively located above the loading area, the abrading area, and the unloading area. Lower top cylinders are vertically arranged on the cross frames;

[0017] The lower top cylinders in the loading area and the unloading area are used to cooperate with the suction and placement mechanism to complete the sucking / releasing action of the semiconductor array frame;

[0018] The lower top cylinder in the abrading area is used to cooperate with the suction and placement mechanism to complete the releasing and sucking actions of the semiconductor array frame, and cooperate with the pressing mechanism to complete the pressing action of the semiconductor array frame.

[0019] Furthermore, the abrading mechanism includes a cross frame installed on the horizontal frame, at least one first horizontal guide rail disposed on the cross frame, a grinding motor vertically installed on the horizontal frame and with its output shaft passing upward through the cross frame, a turntable coaxially connected to the output shaft of the grinding motor and located above the cross frame, a rotating column eccentrically disposed on the turntable, and a mounting block rotatably disposed on the rotating column. A second horizontal guide rail perpendicular to its guiding direction is slidably provided on the first horizontal guide rail. A fixed seat is installed on the mounting block, and the fixed seat is slidably fitted to the second horizontal guide rail. The inside of the fixed seat is hollow and is connected to a vacuum pump installed in the abrading area or the cross frame through a hose. Vacuum suction holes communicating with its inside are arrayed on the top of the fixed seat, and the abrasive plate is disposed on the top of the fixed seat.

[0020] Furthermore, a loading assembly is provided in the loading area, and a unloading assembly is provided in the unloading area; the loading assembly and the unloading assembly adopt the same structure, the loading assembly / unloading assembly comprises a pair of slide rails arranged on a horizontal frame along the length direction of the loading area / unloading area where the loading assembly / unloading assembly is located, a slider is slidably provided on the slide rail, a magazine seat is mounted on the slider, a plurality of limiting columns are provided on the magazine seat, and a plurality of limiting columns form a plurality of limiting areas in a rectangular array, the limiting areas are used to place magazines, a lifting hole penetrating the magazine seat is provided at the limiting areas, a limiting platform is provided at the bottom of the inner wall of the magazine, a receiving plate is provided on the limiting platform, and the receiving plate is used to receive the semiconductor array frame stacked on the magazine;

[0021] The loading assembly / unloading assembly also includes a lifting mechanism arranged in the respective loading area / unloading area array and installed on the horizontal frame. The horizontal frame array is provided with a through hole corresponding to the lifting mechanism. The lifting mechanism is used to lift and lower the magazine seat when it moves along the slide rail to a predetermined position. The predetermined position refers to when the through holes are respectively opposite to the lifting holes, and the through holes and the lifting holes act on the receiving plate to perform lifting and lowering.

[0022] The beneficial effects of the present invention are:

[0023] 1. It realizes continuous and efficient batch loading, adsorption transfer, polishing and de-glueing, adsorption transfer, and unloading of semiconductor frame arrays stacked in multiple clips. Through physical erasing, the effect of removing excess glue is more direct, and it only takes a few seconds each time to achieve the effect; and the grinding surface is set by diamond abrasive material to further ensure the grinding effect in a short time; the time spent on semi-finished product grinding is only 1 / 8 of the time spent on removing excess glue with liquid; and before each loading to the grinding area, there will be a dust suction mechanism that rotates with the same rotating drum to vacuum the top surface of the grinding plate, so as to provide a clean grinding environment for the next semiconductor frame array to be polished, ensuring the grinding effect;

[0024] 2. Integrate batch loading, batch transfer, batch grinding, and batch unloading into one device, making the process more compact, saving transfer time between processes and additional tooling processes. When the last processed material is adsorbed and transferred to the unloaded material, the next one to be processed has also been adsorbed and transferred to the processing area, making the stepping rhythm more efficient.

[0025] 3. The adsorption mechanism and the pressing mechanism are arranged at intervals. On the one hand, they correspond to different functions respectively, so as to facilitate the reliability of absorption and transfer, and the stability of adsorption, pressing and grinding. On the other hand, they can cooperate with the rotation to perform a tandem follow-up operation to improve the process flow efficiency;

[0026] 4. During grinding, while the grinding plate swings through the eccentric rotating shaft, it is constrained by the first horizontal guide rail and the second horizontal guide rail, which can ensure that the grinding plate maintains its original posture and stability during swinging, and ensure that grinding is completed effectively and efficiently.

[0027] 5. In both the suction mechanism and the pressing mechanism, the reset after the lower jacking cylinder releases its function is completed through springs, so that the lower jacking cylinder can be fixedly arranged without rotating with the rotating cylinder, reducing the difficulty of device implementation and not affecting the reset stroke after descending; if the method of rotating with the rotating cylinder is adopted, the influence of rotation on the pipeline of the lower jacking cylinder needs to be considered, and the lower jacking cylinder needs to be added to each cross plate, which will instead increase the number of lower jacking cylinders set, and is not conducive to cost control; among them, the pressing mechanism also provides pressing and buffering through the setting of the third spring. Brief Description of the Drawings

[0028] Figure 1 It is a schematic diagram of the back structure of a patch semiconductor without glue overflow in an embodiment of the present application.

[0029] Figure 2 It is a schematic diagram of the back structure of a patch semiconductor with glue overflow in an embodiment of the present application.

[0030] Figure 3 It is a schematic diagram of a partial front structure of a semiconductor array frame in an embodiment of the present application.

[0031] Figure 4 It is a schematic diagram of a partial back structure of a semiconductor array frame in an embodiment of the present application.

[0032] Figure 5 It is a schematic diagram of the overall structure of a glue overflow grinding device in an embodiment of the present application.

[0033] Figure 6 It is a schematic diagram of the structure of a horizontal frame, a feeding component, and a discharging component in an embodiment of the present application.

[0034] Figure 7 It is a schematic diagram of the exploded structure of a grinding mechanism in an embodiment of the present application.

[0035] Figure 8 It is a schematic diagram of the combined structure of a grinding mechanism adsorbing a semiconductor array frame in an embodiment of the present application.

[0036] Figure 9 It is a schematic diagram of the exploded structure of a magazine and a lifting mechanism in an embodiment of the present application.

[0037] Figure 10 It is a schematic diagram of the sectional structure of a fixed column and a rotating cylinder in an embodiment of the present application.

[0038] Figure 11It is a schematic diagram of the structure of the rotating cylinder, the suction and release mechanism, and the material pressing mechanism of the embodiment of the present application.

[0039] Figure 12 It is a schematic diagram of the structure of the rotating drum and the dust collection mechanism of an embodiment of the present application.

[0040] Figure 13 It is a schematic diagram of the side view structure of the dust collection mechanism of an embodiment of the present application.

[0041] Figure 14 It is a side view structural schematic diagram of the suction and release mechanism of the embodiment of the present application when it is located above the magazine.

[0042] Figure 15 It is a schematic diagram of the local state when the suction nozzle of the suction plate of the embodiment of the present application acts on the frame section of the semiconductor array frame.

[0043] Figure 16 It is a schematic diagram of the side view structure of the pressing mechanism and the grinding mechanism of the embodiment of the present application.

[0044] Figure 17 yes Figure 16 Magnified view of section A in .

[0045] Reference numerals:

[0046] 1-horizontal frame, 10-semiconductor array frame, 11-loading area, 12-unloading area, 13-grinding area, 14-slide rail, 15-slider, 16-clip seat, 17-lifting hole, 18-limiting column, 19-through hole;

[0047] 2-magazine, 21-limiting platform, 22-receiving plate;

[0048] 3-lifting mechanism, 31-horizontal top plate, 32-guide rod, 33-vertical guide sleeve, 34-lifting motor, 35-rack;

[0049] 4-grinding mechanism, 40-cross frame, 41-first horizontal guide rail, 42-second horizontal guide rail, 43-grinding motor, 44-turntable, 45-rotating column, 46-mounting block, 47-fixed seat, 48-vacuum pump, 49-grinding plate;

[0050] 5-fixed column, 50-base, 51-cross frame, 52-lower cylinder, 53-rotating cylinder, 54-gear ring, 55-driving gear, 56-driving motor, 57-cross plate, 58-cross bar;

[0051] 6-suction and release mechanism, 60-first vacuum machine, 61-first fixed plate, 62-first movable plate, 63-first force block, 64-suction plate, 65-first guide column, 66-first spring, 67-suction nozzle;

[0052] 7 - Pressing mechanism, 70 - Second vacuum machine, 71 - Second fixed plate, 72 - Second movable plate, 73 - Second stress block, 74 - Pressing plate, 75 - Second guide post, 76 - Second spring, 77 - Limit head, 78 - Limit cavity, 79 - Third spring, 710 - Limit groove, 711 - Suction hole;

[0053] 8 - Dust collection mechanism, 81 - Suction cup, 82 - Downward extending cylinder, 83 - Vacuum cleaner, 84 - Vertical column, 85 - Limit ring, 86 - Fourth spring;

[0054] 9 - Surface - mounted semiconductor, 91 - Heat sink, 92 - Plastic package. Detailed implementation manners

[0055] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will describe the implementation manners of the present invention in detail with reference to the accompanying drawings. However, the embodiments described herein are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0056] As Figure 3 and Figure 4 respectively show partial front and back views of the structure of a semiconductor array frame 10, and as Figure 1 and Figure 2 show a schematic diagram of the back structure of a single surface - mounted semiconductor 9 arrayed on the semiconductor array frame 10, and the heat sink 91 of the single surface - mounted semiconductor 9 is encapsulated on its back / back side.

[0057] The embodiments of the present application provide a device for removing overflow glue on the surface of surface - mounted semiconductors, which is used to act on multiple stacks of array - placed semiconductor array frames 10 in batches, and process the surface - mounted semiconductors 9 on the semiconductor array frame 10 with overflow glue covering their heat sinks 91 as shown in Figure 2 into the situation without overflow glue as shown in Figure 1 .

[0058] Specifically, as Figures 5 - 8 , Figure 11 show, the overflow - glue removal device of this example includes a horizontal frame 1, a grinding mechanism 4, a fixed column 5, a rotating cylinder 53, a suction and placement mechanism 6, a pressing mechanism 7, etc.

[0059] The horizontal frame 1 is in a T - shape. Its first end is the loading area 11, which is the starting end; the second end opposite to the first end is the grinding area 13, which is the intermediate processing end; the third end is the unloading area 12, which is the end. Among them, the first end and the second end are both located on the first straight section of the T - shape, and the third end is located on the second straight section perpendicular to the first straight section.

[0060] Among them, the loading area 11 is used to prepare the semiconductor array frame 10 to be processed. During application, multiple stacks of semiconductor array frames 10 are prepared in a rectangular array in the loading area 11, and they are in a posture with the front facing up and the back facing down, presenting the states as shown in Figure 2 and Figure 4 . The heat sink 91 of the chip semiconductor 9 on the semiconductor array frame 10 is exposed on the back. The grinding area 13 is used for grinding treatment, and the unloading area 12 is used to receive the semiconductor array frame 10 that has been processed and transferred from the grinding area 13.

[0061] The rotating cylinder 53 rotates through the middle of the horizontal frame 1. As the rotating cylinder 53 rotates clockwise from the perspective as shown in Figure 5 , it follows the order of the starting end → the middle processing end → the tail end. A pair of symmetrically arranged suction and release mechanisms 6 and a pair of symmetrically arranged pressing mechanisms 7 are connected to the outer wall of the rotating cylinder 53. The suction and release mechanisms 6 and the pressing mechanisms 7 are arranged at intervals of 90° along the circumference. The grinding area 13 is provided with a grinding mechanism 4, and the grinding mechanism 4 has a grinding plate 49 with the grinding surface facing up and arranged to swing in the horizontal direction.

[0062] After the semiconductor array frame 10 to be processed is prepared in the loading area 11, the suction and release mechanism 6 rotates with the rotating cylinder 53 to the loading area 11, sucks the semiconductor array frame 10 from the loading area 11 for transfer to the grinding plate 49. When the suction and release mechanism 6 rotates with the rotating cylinder 53 to the grinding area 13, it releases the semiconductor array frame 10 to the grinding area 13 and is received by the grinding plate 49. Then, the current suction and release mechanism 6 rotates to the unloading area 12 while remaining empty, and at the same time, the next adjacent pressing mechanism 7 rotates to the grinding area 13. The pressing mechanism 7 adsorbs and presses the semiconductor array frame 10 that has been received on the grinding plate 49, and cooperates with the grinding plate 49 to grind the back of the semiconductor array frame 10 in the pressed state to remove the overflow glue. Specifically, the semiconductor array frame 10 is adsorbed and pressed by the pressing mechanism 7 on the top surface of the grinding plate 49, and the grinding plate 49 continuously grinds the back of the chip semiconductor 9 during horizontal swinging to achieve glue removal. After the removal is completed, the pressing mechanism 7 releases the pressing and continues to rotate to the unloading area 12. The next suction and release mechanism 6 following it rotates to the grinding area 13 to suck the processed semiconductor array frame 10, while the previous suction and release mechanism 6 rotates to the loading area 11 to suck the next batch of semiconductor array frames 10 to be processed. Continuing to rotate, the suction and release mechanism 6 that sucks the processed semiconductor array frame 10 releases and unloads when it rotates to the unloading area 12. In this way, by continuously cycling the operation, not only can the efficiency of batch processing be improved, but also there will be no waste of the stepping rhythm caused by excessive empty rotation.

[0063] More specifically, a fixed column 5 passes through the middle of the horizontal frame 1, and three cross frames 51 are installed thereon, which are respectively located above the loading area 11, the grinding area 13, and the unloading area 12. Vertical lower pushing cylinders 52 are respectively provided on the cross frames 51. The lower pushing cylinders 52 in the loading area 11 and the unloading area 12 are used to cooperate with the suction and release mechanism 6 to complete the sucking / releasing action of the semiconductor array frame 10; the lower pushing cylinder 52 in the grinding area 13 is used to cooperate with the suction and release mechanism 6 to complete the releasing and sucking actions of the semiconductor array frame 10, and cooperate with the pressing mechanism 7 to complete the pressing action of the semiconductor array frame 10. That is, the lower pushing cylinder 52 is used to perform the lowering and raising actions after the suction and release mechanism 6 and the pressing mechanism 7 are rotated into place.

[0064] As an alternative embodiment, in order to simplify the structure, as Figure 10 shown, the fixed column 5 can be installed on the base 50. The rotating cylinder 53 is coaxially rotatably sleeved on the outer periphery of the fixed column 5 and supported on the base 50. A toothed ring 54 is provided on the outer periphery of the rotating cylinder 53. The toothed ring 54 meshes with a driving gear 55. The driving gear 55 is connected to the output shaft of a driving motor 56 installed on the horizontal frame 1 or the base 50. The rotating cylinder 53 is driven to rotate by the driving motor 56 in cooperation with the driving gear 55 and the toothed ring 54. Considering the stability of the operation of the rotating cylinder 53, the driving motor 56 can be a servo motor, which has an encoder to provide real-time feedback of position information and can be assisted by an external brake or a mechanical locking device for locking when power is off, or other existing means in the art such as an electromagnetic / permanent magnet braking motor with power-off self-locking can be selected.

[0065] Specifically, as Figures 6 - 8 shown, the grinding mechanism 4 includes a cross frame 40 installed on the horizontal frame 1, at least one first horizontal guide rail 41 provided on the cross frame 40, a grinding motor 43 vertically installed on the horizontal frame 1 and the output shaft of which passes upward through the cross frame 40, a turntable 44 coaxially connected to the output shaft of the grinding motor 43 and located above the cross frame 40, a rotating column 45 eccentrically provided on the turntable 44, and a mounting block 46 rotatably provided on the rotating column 45. A second horizontal guide rail 42 perpendicular to the guiding direction thereof is slidably provided on the first horizontal guide rail 41. A fixed seat 47 is installed on the mounting block 46. The fixed seat 47 is slidably fitted to the second horizontal guide rail 42. The fixed seat 47 is hollow inside and is connected to a vacuum pump 48 installed in the grinding area 13 or the cross frame 40 through a hose. Vacuum suction holes communicating with its interior are arrayed on the top of the fixed seat 47. The grinding plate 49 is attached to the top of the fixed seat 47.

[0066] The grinding plate 49 is adsorbed and closely attached to the top of the fixed seat 47 by a vacuum pump 48, so that it swings synchronously with the fixed seat 47. The grinding motor 43 drives the turntable 44 to rotate. The eccentric rotating column 45 rotates along with it, is connected to the mounting block 46 and slides on the second horizontal guide rail 42. The fixed seat 47 will swing in a way that maintains its original posture under the drive of the rotating column 45 and under the constraints of the second horizontal guide rail 42 and the first horizontal guide rail 41, realizing swinging in the horizontal direction. The swinging is to realize that the grinding plate 49 continuously grinds and removes the colloid on the back of the semiconductor array frame 10 adsorbed and pressed by the material pressing mechanism 7. Preferably, the grinding plate 49 is a grinding plate with a corundum material on its top surface, which can have a better grinding effect and improve the grinding speed.

[0067] Specifically, a loading component is provided in the loading area 11, and an unloading component is provided in the unloading area 12. The loading component and the unloading component have the same structure. Specifically, as Figure 5 , Figure 6 , Figure 9 shown, both the loading component or the unloading component include a pair of slide rails 14 arranged along the length direction of their respective areas on the horizontal frame 1 and a jacking mechanism 3 arranged in an array in their respective areas and installed on the horizontal frame 1. Here, their respective areas refer to the loading area 11 where the loading component is located and the unloading area 12 where the unloading component is located. The whole jacking mechanism 3 is located below the horizontal frame 1. Specifically, a slider 15 is slidably provided on the slide rail 14, a magazine seat 16 is erected on the slider 15, and a plurality of limiting columns 18 are provided on the magazine seat 16. A plurality of limiting areas in a rectangular array are formed by the plurality of limiting columns 18. The limiting areas are used to place the magazine 2. A jacking hole 17 penetrating the magazine seat 16 is provided at the limiting area. A limiting platform 21 is provided at the bottom of the inner wall of the magazine 2, and a receiving plate 22 is arranged on the limiting platform 21. The receiving plate 22 is used to receive the semiconductor array frames 10 stacked in the magazine 2. The horizontal frame 1 is provided with through holes 19 corresponding to the jacking mechanism 3. The jacking mechanism 3 is used to act on the receiving plate 22 to lift and lower through the through holes 19 and the jacking holes 17 when the magazine seat 16 moves along the slide rail 14 to a predetermined position, and the predetermined position means that the through holes 19 and the jacking holes 17 are respectively aligned one by one.

[0068] When loading, first place the magazines 2 stacked with the semiconductor array frames 10 in the limiting areas of the magazine seat 16 respectively. In the magazine 2, the semiconductor array frames 10 are stacked on the receiving plate 22, and the receiving plate 22 is supported by the limiting platform 21 but can be lifted. Then, move the magazine seat 16 above the area where the through holes 19 are located, and make each through hole 19 correspond to the jacking holes 17 one by one. The jacking mechanism 3 acts on the receiving plate 22 through the through holes 19 and the jacking holes 17 to jack up the semiconductor array frame 10 therein by a certain height for the picking and placing mechanism 6 to pick up and transfer. After each picking, it is jacked up by a certain height again. When unloading, the jacking mechanism 3 is used to first jack up the receiving plate 22 to the receiving height to receive the semiconductor array frame 10 picked up, transferred and released by the picking and placing mechanism 6. After each receiving, it is moved down by a certain height again.

[0069] By setting the movable magazine seat 16, it is convenient to move from the preparation position to the position to be picked up in the loading area 11. And through the limiting columns 18 to form an array of limiting areas, it is convenient to place the magazines 2 in batches, and then they can be jacked up in batches and further picked up in batches, so as to realize batch loading. Similarly, for the unloading area 12, batch unloading can also be realized.

[0070] As an alternative implementation form of the jacking mechanism 3, as Figure 6 and Figure 9 shown, the jacking mechanism 3 includes a pair of vertical guide sleeves 33 installed on the horizontal frame 1, guide rods 32 inserted in each vertical guide sleeve 33, a rack 35 parallel to the guide rods 32, a horizontal top plate 31 connected to the tops of the guide rods 32 and the rack 35, and a lifting motor 34 installed on the horizontal frame 1. The output shaft of the lifting motor 34 is connected with a driving gear meshing with the rack 35. Specifically, the vertical guide sleeves 33 and the lifting motor 34 can be connected to the horizontal frame 1 through brackets and are located below the horizontal frame 1. By the action of the lifting motor 34, the driving gear rotates to drive the rack 35 to jack up the horizontal top plate 31 or lower the horizontal top plate 31. The horizontal top plate 31 acts on the receiving plate 22, and the guide rods 32 and the vertical guide sleeves 33 can be used to limit the stability of the lifting during the lifting process. Similarly, considering the stability of the operation of the jacking mechanism 3, the lifting motor 34 can be a servo motor, or other existing means in the art such as an electromagnetic / permanent magnet braking motor with power-off self-locking can be selected.

[0071] Preferably, in order to remove the debris and dust generated on the top surface of the grinding plate 49 after each grinding to provide a clean grinding surface for the next grinding, a dust suction component can be configured to perform dust suction. And specifically in the structural environment already set up in this application, how to effectively use the current structural components to build a dust suction structure and make it operate efficiently and effectively suck dust is another technical problem that needs to be solved. As Figure 5As shown, preferably, a pair of dust collection mechanisms 8 arranged symmetrically along the circumference are further connected to the outer wall of the rotating cylinder 53. The dust collection mechanisms 8 are located at the interval between the suction and release mechanism 6 and the pressing mechanism 7. Specifically, if the rotating cylinder 53 rotates clockwise as shown in Figure 5 , the dust collection mechanisms 8 are located in front of the suction and release mechanism 6. Further, as the rotating cylinder 53 rotates, the dust collection mechanisms 8 can reach the grinding area 13 prior to the suction and release mechanism 6 to suck dust from the grinding surface of the grinding plate 49. With such a setting, the rotation of the rotating cylinder 53 is well utilized, and each time before the suction and release mechanism 6 reaches the grinding area 13, the dust collection mechanisms 8 can suck dust first to clean the grinding surface of the grinding plate 49 for the next grinding and cleaning work.

[0072] Specifically, as shown in Figure 12 and Figure 13 , the dust collection mechanism 8 includes a cross bar 58 connected to the outer wall of the rotating cylinder 53, a vacuum cleaner 83 installed on the cross bar 58, a suction cup 81 arranged parallel to and below the cross bar 58 and connected to the vacuum cleaner 83 through a hose, and a downward extending cylinder 82 vertically installed on the cross bar 58 with an output shaft passing through the cross bar 58 to connect the suction cup 81. A plurality of vertical columns 84 are connected to the top of the suction cup 81. The vertical columns 84 all pass upward through the cross bar 58. A limit ring 85 is provided at the top of the vertical columns 84. The limit ring 85 is located above the cross bar 58. A fourth spring 86 is sleeved on the vertical columns 84. The fourth spring 86 is located between the suction cup 81 and the cross bar 58.

[0073] When the dust collection mechanism 8 is ready to suck dust, it is located above the grinding plate 49. At this time, the suction cup 81 is extended downward by a certain distance through the downward extending cylinder 82 so that there is only a small distance between the suction cup 81 and the grinding surface of the grinding plate 49. The vacuum cleaner 83 is turned on to suck dust from the grinding surface of the grinding plate 49 through the suction cup 81. Considering the problem of the dust collection coverage area, when a region of the suction cup 81 of the dust collection mechanism 8 just covers the grinding plate 49, the suction cup 81 can be extended downward and the vacuum cleaner 83 can be turned on, so that during the rotation process, continuous dust suction can be carried out to cover the entire area of the grinding plate 49 to ensure the dust collection effect. The fourth spring 86 is used to provide buffering during the retraction stroke of the downward extending cylinder 82 to avoid hard contact between the suction cup 81 and the cross bar 58.

[0074] As an optional specific structure of the suction and release mechanism 6, as shown in Figure 11 、 Figure 14 、 Figure 15As shown, the suction and release mechanism 6 includes a first fixed plate 61 connected to the outer wall of the rotating cylinder 53 through a cross plate 57, a first movable plate 62 parallel to and above the first fixed plate 61, a plurality of suction plates 64 parallel to and below the first fixed plate 61, and a first vacuum machine 60 mounted on the first fixed plate 61. The suction plates 64 are connected to the first movable plate 62 through a plurality of first guide posts 65 passing through the first fixed plate 61. Each suction plate 64 can correspondingly suck a semiconductor array frame 10. The first vacuum machine 60 can be mounted above the first movable plate 62 through a rod body passing through the first movable plate 62 and connecting to the first fixed plate 61. The bottom of the suction plate 64 is arrayed with suction nozzles 67 for adsorbing the frame section of the semiconductor array frame 10. The suction plate 64 is connected to the first vacuum machine 60 through a hose. A first spring 66 is sleeved on the first guide post 65, and the first spring 66 is located between the first fixed plate 61 and the first movable plate 62. The lower push cylinder 52 is used to act on the first movable plate 62. The top surface of the first movable plate 62 has a first force receiving block 63 for receiving the action of the lower push cylinder 52.

[0075] When it is necessary to suck the semiconductor array frame 10 stacked on the top layer and lifted by the horizontal top plate 31 from the magazine 2, through the action of the lower push cylinder 52, the first movable plate 62 is forced to descend, and the suction plates 64 also descend synchronously until the suction nozzles 67 contact the frame section of the semiconductor array frame 10 to be sucked. The first vacuum machine 60 is turned on to make the suction nozzles 67 adsorb the semiconductor array frame 10. The first spring 66 can provide a buffering effect during the downward stroke to avoid pressing down on the semiconductor array frame 10, and can also make the first movable plate 62 reset upward when the lower push cylinder 52 retracts its driving rod, so that the suction plates 64 will lift the semiconductor array frame 10 adsorbed by the suction nozzles 67.

[0076] When the suction and release mechanism 6 is positioned in the grinding area 13 or the blanking area 12 and is ready to release the sucked semiconductor array frame 10, through the action of the lower push cylinder 52, the first movable plate 62 is forced to descend, and the suction plates 64 also descend synchronously until the adsorbed semiconductor array frame 10 contacts, or there is only a small distance from the grinding surface of the grinding plate 49, or there is only a small distance from the receiving plate 22 in the magazine 2 in the blanking area 12 or the semiconductor array frame 10 stacked on the receiving plate 22 in the blanking area 12. Then, control the first vacuum machine 60 to release the adsorption of the suction nozzles 67 on the semiconductor array frame 10, so that the semiconductor array frame 10 is received on the grinding plate 49, or the receiving plate 22 in the blanking area 12, or the semiconductor array frame 10 stacked on the receiving plate 22 in the blanking area 12, completing the discharging. Then the lower push cylinder 52 retracts its driving rod, and the first movable plate 62 resets upward under the action of the first spring 66, retracting the suction plates 64.

[0077] In the above process, through a clever and reasonable structural design, a part of the structure rotates with the rotating cylinder 53 to cooperate with another part of the fixed structure for suction and release in different areas, achieving both a stepping operation mode of rotation without interference and ensuring the downward force action required during suction / release.

[0078] As an optional specific structure of the blanking mechanism 7, as Figure 11 , Figure 16 , Figure 17 shown, the blanking mechanism 7 includes a second fixed plate 71 connected to the outer wall of the rotating cylinder 53 through a cross plate 57, a second movable plate 72 parallel to and above the second fixed plate 71, a plurality of blanking plates 74 parallel to and below the second fixed plate 71, and a second vacuum machine 70 mounted on the second fixed plate 71. The blanking plates 74 are connected to a plurality of second guide posts 75 that pass through the second fixed plate 71 and the second movable plate 72 at the same time. The second vacuum machine 70 can be mounted above the second movable plate 72 through a rod body that passes through the second movable plate 72 and connects to the second fixed plate 71. The blanking plates 74 are connected to the second vacuum machine 70 through hoses. The number of blanking plates 74 matches the number of magazines 2 on the magazine seat 16. Each blanking plate 74 correspondingly acts on the semiconductor array frame 10 on the top surface of a magazine 2. The bottom surface of the blanking plate 74 is recessed to form a limiting groove 710 for limiting the semiconductor array frame 10. The inner bottom surface of the limiting groove 710 is arrayed with suction holes 711 for adsorbing the front surface of the chip semiconductor 9 of the semiconductor array frame 10. A plurality of limiting cavities 78 corresponding to the positions of the second guide posts 75 are provided on the second movable plate 72. The top ends of the second guide posts 75 are provided with limiting heads 77 located in the limiting cavities 78. A second spring 76 and a third spring 79 are sleeved on the second guide posts 75. The second spring 76 is located between the second fixed plate 71 and the second movable plate 72. The third spring 79 is located between the limiting head 77 and the inner top wall of the limiting cavity 78. The lower top cylinder 52 is used to act on the second movable plate 72. The top surface of the second movable plate 72 has a second force receiving block 73 for receiving the action of the lower top cylinder 52.

[0079] When it is necessary to adsorb and press the semiconductor array frame 10 located on the grinding surface of the grinding plate 49 for grinding and debonding, the pressing mechanism 7 removes the grinding area 13 as the rotating cylinder 53 rotates, and the lower top cylinder 52 at this position acts downward, so that the top surface of the second movable plate 72 is forced to move downward, the second spring 76 is compressed, and the limit cavity 78, the third spring 79, the second guide column 75, and the pressing plate 74 also descend as a whole. When the pressing plate 74 contacts the semiconductor array frame 10, the semiconductor array frame 10 gradually Matched into the limit groove 710, and the back of a single SMD semiconductor 9 matches the orifice of the suction hole 711; then, the lower top cylinder 52 continues to work, causing the second movable plate 72 to continue to descend. At this time, the second guide column 75 and the pressure plate 74 have been supported by the grinding plate 49 and no longer descend. The distance between the limit head 77 and the top wall of the limit cavity 78 will decrease, and the third spring 79 will be compressed. After being compressed to a certain extent, the lower top cylinder 52 is suspended. At this time, the semiconductor array frame 10 is adsorbed and pressed against the polishing surface of the grinding plate 49. Then, the swinging motion is started by the grinding plate 49 to achieve polishing of the back of the SMD semiconductor 9. The semiconductor array frame 10 is limited by the limit groove 710, and displacement during re-polishing is also avoided. It should be noted that at this time, the second spring 76 has not been compressed to the limit, and the third spring 79 has only been compressed for a certain stroke, so that the third spring 79 can provide compression and buffering force to facilitate grinding. Subsequently, after the action of the lower cylinder 52 on the second movable plate 72 is released, the second spring 76 can realize the resetting effect of the second movable plate 72 for the upward stroke. During the resetting, the second movable plate 72 rises first, and at the same time, the third spring 79 will gradually recover to its natural state and finally retract to its initial state.

[0080] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application.

Claims

1. A patch semiconductor surface overflow glue grinding device, characterized in that, Comprising: A horizontal frame (1) in a T shape, with its first end being the loading area (11), the second end opposite to the first end being the grinding area (13), and the third end being the unloading area (12); A rotating cylinder (53) rotatably passing through the middle of the horizontal frame (1), with a pair of symmetrically arranged suction and release mechanisms (6) and a pair of symmetrically arranged pressure mechanisms (7) connected to its outer wall. The suction and release mechanisms (6) and the pressure mechanisms (7) are arranged at intervals of 90° along the circumference; A grinding mechanism (4) provided in the grinding area (13), which has a grinding plate (49) with an upward-facing grinding surface and is swingably arranged in the horizontal direction; Among them, the loading area (11) is used to prepare the semiconductor array frame (10) to be processed. During application, multiple stacks of semiconductor array frames (10) are prepared in a rectangular array in the loading area (11), and are in a posture with the front side facing up and the back side facing down. The heat sinks (91) of the patch semiconductors (9) on the semiconductor array frame (10) are exposed on the back; The suction and release mechanism (6) is used to rotate with the rotating cylinder (53) to transfer the semiconductor array frame (10) from the loading area (11) to the grinding plate (49) and from the grinding plate (49) to the unloading area (12); The pressure mechanism (7) is used to press the semiconductor array frame (10) already received on the grinding plate (49) when rotating with the rotating cylinder (53) to the grinding area (13); The grinding plate (49) is used to grind the back of the semiconductor array frame (10) in a pressed state to remove the overflow glue; A pair of circumferentially symmetrically arranged dust suction mechanisms (8) are also connected to the outer wall of the rotating cylinder (53). The dust suction mechanisms (8) are located at the interval between the suction and release mechanisms (6) and the pressure mechanisms (7). The dust suction mechanisms (8) are used to rotate with the rotating cylinder (53) and reach the grinding area (13) prior to the suction and release mechanisms (6) to suck dust from the grinding surface of the grinding plate (49); A fixed column (5) passes through the middle of the horizontal frame (1), and three cross frames (51) are installed thereon, respectively located above the loading area (11), the grinding area (13), and the unloading area (12). Lower push cylinders (52) are vertically provided on the cross frames (51); The lower push cylinders (52) in the loading area (11) and the unloading area (12) are used to cooperate with the suction and release mechanism (6) to complete the suction / release action of the semiconductor array frame (10); The lower push cylinder (52) in the grinding area (13) is used to cooperate with the suction and release mechanism (6) to complete the release and suction actions of the semiconductor array frame (10), and cooperate with the pressure mechanism (7) to complete the pressing action of the semiconductor array frame (10); The blanking mechanism (7) includes a second fixed plate (71) connected to the outer wall of the rotating cylinder (53) through a cross plate (57), a second movable plate (72) parallelly located above the second fixed plate (71), a plurality of blanking plates (74) parallelly located below the second fixed plate (71), and a second vacuum machine (70) installed on the second fixed plate (71). The blanking plates (74) are connected to a plurality of second guide posts (75) that simultaneously pass through the second fixed plate (71) and the second movable plate (72). The blanking plates (74) are connected to the second vacuum machine (70) through hoses. The bottom surface of the blanking plate (74) is recessed to form a limiting groove (710) for limiting the semiconductor array frame (10). The inner bottom surface of the limiting groove (710) is provided with a suction hole array (711) for adsorbing the front surface of the patch semiconductor (9) of the semiconductor array frame (10). A plurality of limiting cavities (78) corresponding to the positions of the second guide posts (75) are provided on the second movable plate (72). The top of the second guide post (75) is provided with a limiting head (77) located in the limiting cavity (78). A second spring (76) and a third spring (79) are sleeved on the second guide post (75). The second spring (76) is located between the second fixed plate (71) and the second movable plate (72), and the third spring (79) is located between the limiting head (77) and the inner top wall of the limiting cavity (78). The lower top cylinder (52) is used to act on the second movable plate (72).

2. The surface overflow glue grinding device for patch semiconductors according to claim 1, wherein The dust suction mechanism (8) includes a cross bar (58) connected to the outer wall of the rotating cylinder (53), a vacuum cleaner (83) installed on the cross bar (58), a suction cup (81) parallelly arranged below the cross bar (58) and connected to the vacuum cleaner (83) through a hose, and a downward extending cylinder (82) vertically installed on the cross bar (58) and the output shaft of which passes through the cross bar (58) to connect the suction cup (81). A plurality of vertical columns (84) are connected to the top of the suction cup (81). The vertical columns (84) all extend upward through the cross bar (58). The top of the vertical column (84) is provided with a limiting ring (85). A fourth spring (86) is sleeved on the vertical column (84). The fourth spring (86) is located between the suction cup (81) and the cross bar (58).

3. The overflow glue grinding device for the surface of the patch semiconductor according to claim 1, wherein The fixed column (5) is installed on the base (50). The rotating cylinder (53) is rotatably sleeved on the outer periphery of the fixed column (5) and supported on the base (50). A toothed ring (54) is provided on the outer periphery of the rotating cylinder (53). The toothed ring (54) meshes with a driving gear (55). The driving gear (55) is connected to the output shaft of a driving motor (56) installed on the horizontal frame (1).

4. The surface overflow glue grinding device for patch semiconductors according to claim 1, characterized in that, The grinding mechanism (4) comprises a cross frame (40) mounted on the horizontal frame (1), at least one first horizontal guide rail (41) provided on the cross frame (40), a grinding motor (43) vertically mounted on the horizontal frame (1) and having an output shaft passing through the cross frame (40) in an upward direction, a rotating disk (44) coaxially connected to the output shaft of the grinding motor (43) and located above the cross frame (40), a rotating column (45) eccentrically provided on the rotating column (44), and a mounting block (46) rotatably provided on the rotating column (45), wherein the first horizontal guide rail (41) is provided on the cross frame (40) and the grinding motor (43) is vertically mounted on the horizontal frame (1) and the output shaft passes through the cross frame (40) in an upward direction, A second horizontal guide rail (42) perpendicular to the guide direction is slidably provided on the guide rail (41), a fixing seat (47) is installed on the mounting block (46), the fixing seat (47) is slidably matched with the second horizontal guide rail (42), the fixing seat (47) is hollow inside and is connected to a vacuum pump (48) installed in the grinding area (13) or the cross frame (40) through a hose, the top of the fixing seat (47) is provided with an array of vacuum suction holes connected to the inside, and a grinding plate (49) is arranged on the top of the fixing seat (47).

5. The glue overflow grinding device for the surface of the patch semiconductor according to claim 1, characterized in that, The loading area (11) is provided with a loading assembly, and the unloading area (12) is provided with a unloading assembly; The loading assembly and the unloading assembly both comprise a pair of slide rails (14) arranged on a horizontal frame (1) along the length direction of the respective regions, a slider (15) being slidably arranged on the slide rails (14), a magazine seat (16) being arranged on the slider (15), a plurality of limiting columns (18) being arranged on the magazine seat (16), the plurality of limiting columns (18) forming a plurality of limiting areas in a rectangular array, the limiting areas being used to place the magazine (2), a lifting hole (17) penetrating the magazine seat (16) being arranged at the limiting areas, a limiting platform (21) being arranged at the bottom of the inner wall of the magazine (2), a receiving plate (22) being arranged on the limiting platform (21), the receiving plate (22) being used to receive the semiconductor array frame (10) stacked on the magazine (2); Both the loading assembly and the unloading assembly further include lifting mechanisms (3) arranged in an array in their respective areas and mounted on the horizontal frame (1); the horizontal frame (1) array is provided with through holes (19) corresponding to the lifting mechanisms (3); the lifting mechanisms (3) are used to lift and lower the magazine seat (16) by acting on the receiving plate (22) through the through holes (19) and the lifting holes (17) when the magazine seat (16) moves to a predetermined position along the slide rail (14).

6. The surface overflow glue grinding device for patch semiconductors according to claim 5, characterized in that, The lifting mechanism (3) comprises at least one vertical guide sleeve (33) mounted on the horizontal frame (1), a guide rod (32) inserted in the vertical guide sleeve (33), a rack (35) parallel to the guide rod (32), a horizontal top plate (31) connected to the top of the guide rod (32) and the rack (35), and a lifting motor (34) mounted on the horizontal frame (1), wherein the output shaft of the lifting motor (34) is connected to a driving gear meshed with the rack (35), and the horizontal top plate (31) is used to act on the receiving plate (22).

7. The surface overflow glue grinding device for patch semiconductors according to claim 1, wherein The sucking and releasing mechanism (6) includes a first fixed plate (61) connected to the outer wall of the rotating cylinder (53) through a horizontal plate (57), a first movable plate (62) parallelly located above the first fixed plate (61), a plurality of material sucking plates (64) parallelly located below the first fixed plate (61), and a first vacuum machine (60) mounted on the first fixed plate (61). The material sucking plates (64) are connected to the first movable plate (62) through a plurality of first guide columns (65) passing through the first fixed plate (61). The bottom of the material sucking plates (64) is provided with suction nozzles (67) arrayed for adsorbing the frame sections of the semiconductor array frame (10). The material sucking plates (64) are connected to the first vacuum machine (60) through hoses. A first spring (66) is sleeved on the first guide columns (65), and the first spring (66) is located between the first fixed plate (61) and the first movable plate (62). The lower jacking cylinder (52) is used to act on the first movable plate (62).

Images