Automatic positioning and grabbing device for chip processing and grabbing method of automatic positioning and grabbing device

Abstract

The invention provides an automatic positioning and grabbing device for chip machining and a grabbing method of the automatic positioning and grabbing device, and relates to the field of chip machining. The automatic positioning and grabbing device comprises a clamping and adjusting assembly, a positioning and moving assembly and a posture adjusting parallel mechanism, and a second swing arm of the positioning and moving assembly is rotationally connected with a moving platform of the clamping and adjusting assembly; the posture adjusting parallel mechanism is located below the clamping adjusting assembly, a vacuum suction cup and a visual camera are arranged on a moving platform of the clamping adjusting assembly, the visual camera recognizes the shape, size and position information of a chip, under the cooperation of the positioning moving assembly and the clamping adjusting assembly, the clamping jaw is controlled to rapidly move to a to-be-clamped area, and therefore the chip can be rapidly clamped. And in the clamping process, the angle of the movable platform is adjusted through the posture adjusting parallel mechanism, the clamping jaw can adjust the distance in a self-adaptive mode according to the shape of the chip while the vacuum suction cup adsorbs the center position of the chip, posture-variable clamping, taking and placing of the chip are achieved, and the robot has the advantages of being high in adaptability and stability.

Description

Technical Field

[0001] The invention relates to the field of chip processing, and in particular to an automatic positioning and grasping device for chip processing and a grasping method thereof. Background Art

[0002] As electronic devices become increasingly complex and chip production precision requirements continue to increase, the demand for efficient, intelligent, and precise chip automated handling equipment is also increasing, especially in the production of integrated circuits (ICs), where automated chip production and assembly are particularly important. Chip gripping robots play a key role in this process, and are mainly used to grab, carry, and place chips during chip production and testing.

[0003] Existing chip manipulators mainly use gear drive to realize opening and closing actions, and the rotation operation control is complicated. When the size of the opening and closing mechanical structure is determined, its opening degree and the size of the pick-and-place operation object are fixed accordingly. In addition, most manipulators use the method of imitating the clamping of human arms to clamp the chip, which easily causes the clamping contact position to be not in the center position, causing one end to be suspended and shake. Therefore, it is necessary to propose an automatic positioning and grasping device for chip processing and a grasping method thereof. Summary of the invention

[0004] In order to solve the deficiencies of the above-mentioned prior art, the purpose of the present invention is to provide an automatic positioning and grasping device for chip processing and a grasping method thereof. The shape, size, position and other information of the chip are identified by a visual camera. With the cooperation of the positioning moving component and the clamping adjustment component, the clamping claw is controlled to move quickly to the area to be clamped, and the angle of the moving platform is adjusted by the posture adjustment parallel mechanism during clamping. While the vacuum suction cup adsorbs the center position of the chip, the clamping claw can adaptively adjust the spacing according to the chip shape, thereby realizing variable posture clamping and placement of the chip, maintaining stability and high precision in complex environments, and adapting to the grasping needs of chips of different specifications and types.

[0005] Specifically, on the one hand, the present invention provides an automatic positioning and gripping device for chip processing, which includes a clamping and adjusting assembly, a positioning and moving assembly, and a posture adjusting parallel mechanism. The second swing arm of the positioning and moving assembly is rotatably connected to the moving platform of the clamping and adjusting assembly. The clamping and adjusting assembly includes a plurality of clamping mechanisms and a moving platform. Each clamping mechanism includes a jaw, a slide table, a ball screw, a clamping motor, and a support seat. The jaw is connected to the top of the slide table. The slide table is in screw transmission with the ball screw. The output shaft of the clamping motor is connected to the first end of the ball screw through a coupling. The second end of the ball screw is connected to the support seat. The positioning and moving assembly includes a plurality of moving mechanisms. Each moving mechanism includes a first swing arm, a second swing arm, and a first motor. The first end of the first swing arm is rotatably connected to the hinge seat on the side of the moving platform. The first end of the second swing arm is rotatably connected to the second end of the first swing arm. The output shaft of the first motor is connected to the second end of the second swing arm through a coupling. The posture adjusting parallel mechanism includes a moving platform, a fixed platform, and three motion chains connecting the moving platform and the fixed platform. Each motion chain includes a first connecting rod, a second connecting rod, a third connecting rod, a fourth connecting rod, and a third motor. The first end of the first connecting rod is rotatably connected to the bottom end of the moving platform. The first end of the second connecting rod is rotatably connected to the second end of the first connecting rod. The second end of the second connecting rod is rotatably connected to the top end of the fixed platform. The first end of the third connecting rod is rotatably connected to the middle of the second connecting rod. The first end of the fourth connecting rod is rotatably connected to the second end of the third connecting rod. The output shaft of the third motor is connected to the second end of the fourth connecting rod.

[0006] Preferably, the clamping and adjusting assembly is located above the posture adjusting parallel mechanism. The clamping and adjusting assembly includes a first clamping mechanism, a second clamping mechanism, a third clamping mechanism, and a fourth clamping mechanism. The clamping mechanisms are arranged perpendicular to each other around the moving platform. The first clamping mechanism and the second clamping mechanism are arranged parallel to each other on the first end face of the moving platform. The third clamping mechanism and the fourth clamping mechanism are arranged parallel to each other on the second end face of the moving platform.

[0007] Preferably, each moving mechanism further includes a fixed seat, a connecting plate, a slider, a slide rail, a synchronous belt, a driving pulley, a driven pulley, and a second motor. The first motor is arranged on the fixed seat. The fixed seat is connected to the fixed block and the slider on the synchronous belt through the connecting plate respectively. The slider is slidably connected to the slide rail. The driving belt is in transmission connection with the driven pulley through the synchronous belt. The output shaft of the second motor is connected to the driving pulley.

[0008] Preferably, it further includes a base arranged below the positioning and moving assembly. The moving mechanisms are arranged perpendicular to each other on the base. The positioning and moving assembly includes a first moving mechanism, a second moving mechanism, and a third moving mechanism. The first moving mechanism and the second moving mechanism are located on the same plane. The moving direction of the synchronous belt is the same as the arrangement direction of the slide rail. The central axes of the driving pulley and the driven pulley are both perpendicular to the arrangement direction of the slide rail.

[0009] Preferably, the three moving branch chains of the posture adjustment parallel mechanism are respectively arranged at the apex angles of the moving platform, and an adsorption port is arranged at the center position of the moving platform.

[0010] Preferably, torsion springs are provided at the joints of the second swing arm and the first swing arm, and the first link and the second link.

[0011] Preferably, a vacuum chuck and a vision camera are arranged on the moving platform of the clamping adjustment assembly.

[0012] Preferably, the clamping jaw is of an L-shaped structure, and an elastic member is provided at the second end of the clamping jaw.

[0013] Preferably, the positioning moving assembly drives the clamping adjustment assembly to move above the chip to be clamped, the posture adjustment parallel mechanism adjusts the posture of the moving platform, and the clamping adjustment assembly drives the clamping jaws to approach or move away from each other, so as to realize the variable-posture clamping and picking of the clamping adjustment assembly.

[0014] On the other hand, the present invention provides a grasping method for an automatic positioning and grasping device for chip processing, which includes the following steps:

[0015] S1. Clamping position adjustment, specifically including the following sub-steps:

[0016] S11. Identify the shape, size and position information of the chip through the vision camera, control each moving mechanism in the positioning moving assembly to make the clamping adjustment assembly move to a preset position, the second motor drives the driving pulley to rotate, and then drives the synchronous belt to move along the direction of the slide rail, so as to drive the first motor on the fixed seat to move along the slide rail;

[0017] S12. The first motor in each moving mechanism drives the second swing arm to move, and then drives the first swing arm to move, so as to realize the adjustment of the angle of the moving platform;

[0018] S2. Chip posture adjustment: The chip to be clamped is adsorbed on the moving platform through the adsorption port, the third motor drives the fourth link to move, and drives the link mechanism formed by the third link, the second link and the first link to move, so as to adjust the angle of the chip on the moving platform;

[0019] S3. Grasping operation, specifically including the following sub-steps:

[0020] S31. When the chip to be clamped moves below the moving platform, adsorb the center position of the chip to be clamped through the vacuum chuck;

[0021] S32. According to the external dimensions of the chip to be clamped, drive the ball screw by the clamping motor to drive the slide table to move along the ball screw, so as to adjust the distance between the clamping jaws, and realize the variable-posture clamping of the clamping jaws in the clamping adjustment assembly;

[0022] S4. When transferring the chip to the designated position, the vacuum chuck releases the adsorption of the chip, and controls each jaw of the clamping and adjusting assembly to move away from each other until the chip is released, and the chip grasping and transferring is completed.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0024] The automatic positioning and grasping device for chip processing of the present invention identifies information such as the shape, size, and position of the chip through a vision camera. Under the cooperation of the positioning and moving assembly and the clamping and adjusting assembly, it controls the jaws to quickly move to the area to be clamped. During clamping, the angle of the moving platform is adjusted through the pose adjustment parallel mechanism. While the vacuum chuck adsorbs the center position of the chip, the jaws can adaptively adjust the spacing according to the shape of the chip, realizing variable-pose clamping and picking and placing of the chip, and being able to maintain stability and high precision in a complex environment and adapt to the grasping requirements of different specifications and types of chips. Description of the Drawings

[0025] Figure 1 is the overall structural schematic diagram of the automatic positioning and grasping device for chip processing of the present invention;

[0026] Figure 2 is the front view schematic diagram of the automatic positioning and grasping device for chip processing of the present invention;

[0027] Figure 3 is the structural schematic diagram of the clamping and adjusting assembly in the present invention;

[0028] Figure 4 is the front view schematic diagram of the clamping and adjusting assembly in the present invention;

[0029] Figure 5 is the top view schematic diagram of the clamping and adjusting assembly in the present invention;

[0030] Figure 6 is the structural schematic diagram of the cooperation between the clamping and adjusting assembly and the positioning and moving assembly in the present invention;

[0031] Figure 7 is the front view schematic diagram of the cooperation between the clamping and adjusting assembly and the positioning and moving assembly in the present invention;

[0032] Figure 8 is the structural schematic diagram of the pose adjustment parallel mechanism in the present invention;

[0033] Figure 9 is the front view schematic diagram of the pose adjustment parallel mechanism in the present invention.

[0034] Main reference numerals:

[0035] 1. Clamping and adjusting assembly; 11. First clamping mechanism; 111. Claw; 112. Slide table; 113. Ball screw; 114. Clamping motor; 115. Support base; 116. Elastic member; 12. Second clamping mechanism; 13. Third clamping mechanism; 14. Fourth clamping mechanism; 15. Moving platform; 2. Positioning and moving assembly; 21. First moving mechanism; 201. First swing arm; 202. Second swing arm; 203. First motor; 204. Fixed base; 205. Connecting plate; 206. Slide block; 207. Slide rail; 208. Synchronous belt; 209. Driving pulley; 210. Driven pulley; 211. Second motor; 22. Second moving mechanism; 23. Third moving mechanism; 3. Pose adjustment parallel mechanism; 31. Moving platform; 311. First connecting rod; 312. Second connecting rod; 313. Third connecting rod; 314. Fourth connecting rod; 315. Third motor; 32. Fixed platform; 33. Suction port; 4. Vacuum chuck; 5. Base. Detailed implementation manners

[0036] Hereinafter, the implementation manners of the present invention will be described with reference to the accompanying drawings.

[0037] The automatic positioning and gripping device for chip processing of the present invention, as Figure 1 and Figure 2 shown, includes a clamping and adjusting assembly 1, a positioning and moving assembly 2, a pose adjustment parallel mechanism 3 and a base 5. The second swing arm 202 of the positioning and moving assembly 2 is rotatably connected to the moving platform 15 of the clamping and adjusting assembly 1. The positioning and moving assembly 2 is arranged on the base 5. The pose adjustment parallel mechanism 3 is located below the clamping and adjusting assembly 1. A vacuum chuck 4 and a vision camera are arranged on the moving platform 15 of the clamping and adjusting assembly 1. The positioning and moving assembly 2 drives the clamping and adjusting assembly 1 to move above the chip to be clamped. The pose adjustment parallel mechanism 3 adjusts the pose of the moving platform 31, and the clamping and adjusting assembly 1 drives the claws 111 to approach or move away from each other, so as to realize the variable-pose clamping, picking and placing of the clamping and adjusting assembly 1.

[0038] As Figures 3 to 5As shown in the figure, the clamping and adjusting assembly 1 includes a plurality of clamping mechanisms and a moving platform 15. The clamping and adjusting assembly 1 includes a first clamping mechanism 11, a second clamping mechanism 12, a third clamping mechanism 13 and a fourth clamping mechanism 14. Each clamping mechanism is perpendicularly arranged around the moving platform 15. The first clamping mechanism 11 and the second clamping mechanism 12 are arranged in parallel on the first end face of the moving platform 15, and the third clamping mechanism 13 and the fourth clamping mechanism 14 are arranged in parallel on the second end face of the moving platform 15. Each clamping mechanism has the same structure. Each clamping mechanism includes a clamping jaw 111, a sliding table 112, a ball screw 113, a clamping motor 114 and a support seat 115. The clamping jaw 111 is an L-shaped structure. The first end of the clamping jaw 111 is connected to the top end of the sliding table 112. The sliding table 112 is helically connected to the ball screw 113. The output shaft of the clamping motor 114 is connected to the first end of the ball screw 113 through a coupling. The second end of the ball screw 113 is connected to the support seat 115. An elastic member 116 is provided at the second end of the clamping jaw 111.

[0039] As Figure 6 and Figure 7 shown in the figure, the positioning and moving assembly 2 includes a plurality of moving mechanisms. The positioning and moving assembly 2 includes a first moving mechanism 21, a second moving mechanism 22 and a third moving mechanism 23. The first moving mechanism 21 and the second moving mechanism 22 are located on the same plane. Each moving mechanism is perpendicularly arranged on the base 5. Each moving mechanism has the same structure. Each moving mechanism includes a first swing arm 201, a second swing arm 202, a first motor 203, a fixed seat 204, a connecting plate 205, a slider 206, a slide rail 207, a synchronous belt 208, a driving pulley 209, a driven pulley 210 and a second motor 211. The first end of the first swing arm 201 is rotatably connected to the hinge seat on the side of the moving platform 15. The first end of the second swing arm 202 is rotatably connected to the second end of the first swing arm 201. A torsion spring is provided at the connection between the second swing arm 202 and the first swing arm 201. The output shaft of the first motor 203 is connected to the second end of the second swing arm 202 through a coupling. The first motor 203 is arranged on the fixed seat 204. The fixed seat 204 is respectively connected to the fixed block on the synchronous belt 208 and the slider 206 through the connecting plate 205. The slider 206 is slidably connected to the slide rail 207. The driving pulley 209 is drivingly connected to the driven pulley 210 through the synchronous belt 208. The output shaft of the second motor 211 is connected to the driving pulley 209. The moving direction of the synchronous belt 208 is the same as the arrangement direction of the slide rail 207. The central axes of the driving pulley 209 and the driven pulley 210 are both perpendicular to the arrangement direction of the slide rail 207.

[0040] As Figure 8 and Figure 9As shown in the figure, the posture adjustment parallel mechanism 3 includes a moving platform 31, a fixed platform 32, and three moving chains connecting the moving platform 31 and the fixed platform 32. The three moving chains of the posture adjustment parallel mechanism 3 are respectively arranged at the apex angles of the moving platform 31. The three moving chains have the same structure. Each moving chain includes a first connecting rod 311, a second connecting rod 312, a third connecting rod 313, a fourth connecting rod 314, and a third motor 315. The first end of the first connecting rod 311 is rotatably connected to the hinge seat at the bottom end of the moving platform 31. The first end of the second connecting rod 312 is rotatably connected to the second end of the first connecting rod 311. Torsion springs are provided at the connection between the first connecting rod 311 and the second connecting rod 312. The second end of the second connecting rod 312 is rotatably connected to the hinge seat at the top end of the fixed platform 32. The first end of the third connecting rod 313 is rotatably connected to the middle of the second connecting rod 312. The first end of the fourth connecting rod 314 is rotatably connected to the second end of the third connecting rod 313. The output shaft of the third motor 315 is connected to the second end of the fourth connecting rod 314. An adsorption port 33 is provided at the center position of the moving platform 31.

[0041] A grasping method for an automatic positioning and grasping device for chip processing, which includes the following steps:

[0042] S1. Adjust the clamping position, and the sub-steps include:

[0043] S11. Identify information such as the shape, size, and position of the chip through a vision camera, and control each moving mechanism in the positioning and moving assembly 2 to move the clamping and adjusting assembly 1 to a preset position. The second motor 211 drives the driving pulley 209 to rotate, and then drives the synchronous belt 208 to move along the direction of the slide rail 207, thereby driving the first motor 203 on the fixed seat 204 to move along the slide rail 207.

[0044] S12. The first motor 203 in each moving mechanism drives the second swing arm 203 to move, and then drives the first swing arm 201 to move, thereby realizing the adjustment of the angle of the moving platform 15.

[0045] S2. Adjust the posture of the chip: The chip to be clamped is adsorbed on the moving platform 31 through the adsorption port 33. The third motor 315 drives the fourth connecting rod 314 to move, driving the connecting rod mechanism formed by the third connecting rod 313, the second connecting rod 312, and the first connecting rod 311 to move, thereby adjusting the angle of the chip on the moving platform 31.

[0046] S3. Perform the clamping, picking, and placing operations, and the sub-steps include:

[0047] S31. When the chip to be clamped moves below the moving platform 15, adsorb the center position of the chip to be clamped through the vacuum chuck 4.

[0048] S32. According to the external dimensions of the chip to be picked up, drive the ball screw 113 to move through the clamping motor 114, and drive the slide table 112 to move along the ball screw 113, so as to adjust the distance between the clamping jaws 111, and realize the variable attitude picking of the clamping jaws 111 in the clamping adjustment assembly 1.

[0049] S4. When transferring the chip to the specified position, cancel the adsorption of the chip by the vacuum chuck 4, and control the clamping jaws 111 of the clamping adjustment assembly 1 to move away from each other until the chip is released, and the chip grasping and transferring is completed.

[0050] The automatic positioning and grasping device for chip processing of the present invention identifies information such as the shape, size, and position of the chip through a vision camera. Under the cooperation of the positioning and moving assembly 2 and the clamping adjustment assembly 1, it controls the clamping jaws 111 to quickly move to the area to be picked up, and adjusts the angle of the moving platform 31 through the pose adjustment parallel mechanism 3 during picking. While the vacuum chuck 4 adsorbs the center position of the chip, the clamping jaws 111 can adaptively adjust the distance according to the external shape of the chip, realizing variable attitude picking and picking and placing of the chip, and being able to maintain stability and high precision in a complex environment and adapt to the grasping requirements of different specifications and types of chips.

[0051] The above embodiments only describe the preferred embodiments of the present invention, and do not limit the scope of the present invention. Without departing from the design spirit of the present invention, various deformations and improvements made by those of ordinary skill in the art to the technical solutions of the present invention shall fall within the protection scope determined by the claims of the present invention.

Claims

1. An automatic positioning and grasping device for chip processing, characterized in that: It includes a clamping and adjusting component, a positioning and moving component and a posture adjustment parallel mechanism. The second swing arm of the positioning and moving component is rotatably connected to the moving platform of the clamping and adjusting component. The clamping adjustment assembly includes a plurality of clamping mechanisms and a mobile platform, each clamping mechanism includes a clamping claw, a slide, a ball screw, a clamping motor and a support seat, the clamping claw is connected to the top of the slide, the slide and the ball screw are spirally driven, the output shaft of the clamping motor is connected to the first end of the ball screw through a coupling, and the second end of the ball screw is connected to the support seat; The positioning moving assembly includes a plurality of moving mechanisms, each of which includes a first swing arm, a second swing arm and a first motor, the first end of the first swing arm is rotatably connected to the hinge seat at the side end of the moving platform, the first end of the second swing arm is rotatably connected to the second end of the first swing arm, and the output shaft of the first motor is connected to the second end of the second swing arm through a coupling; The posture adjustment parallel mechanism includes a moving platform, a fixed platform and three motion branches connected between the moving platform and the fixed platform, each motion branch includes a first connecting rod, a second connecting rod, a third connecting rod, a fourth connecting rod and a third motor, the first end of the first connecting rod is rotatably connected to the bottom end of the moving platform, the first end of the second connecting rod is rotatably connected to the second end of the first connecting rod, the second end of the second connecting rod is rotatably connected to the top end of the fixed platform, the first end of the third connecting rod is rotatably connected to the middle part of the second connecting rod, the first end of the fourth connecting rod is rotatably connected to the second end of the third connecting rod, and the output shaft of the third motor is connected to the second end of the fourth connecting rod.

2. The automatic positioning and grasping device for chip processing according to claim 1, characterized in that: The clamping adjustment component is located above the posture adjustment parallel mechanism. The clamping adjustment component includes a first clamping mechanism, a second clamping mechanism, a third clamping mechanism and a fourth clamping mechanism. The clamping mechanisms are arranged vertically around the mobile platform. The first clamping mechanism and the second clamping mechanism are arranged parallel to each other on the first end surface of the mobile platform. The third clamping mechanism and the fourth clamping mechanism are arranged parallel to each other on the second end surface of the mobile platform.

3. The automatic positioning and grasping device for chip processing according to claim 1, characterized in that: Each moving mechanism also includes a fixed seat, a connecting plate, a slider, a slide rail, a synchronous belt, a driving pulley, a driven pulley and a second motor. The first motor is arranged on the fixed seat, and the fixed seat is connected to the fixed block and the slider on the synchronous belt through the connecting plate. The slider is slidably connected to the slide rail, the driving belt is transmission-connected to the driven pulley through the synchronous belt, and the output shaft of the second motor is connected to the driving pulley.

4. The automatic positioning and grasping device for chip processing according to claim 1, characterized in that: It also includes a base arranged below the positioning and moving assembly, and each moving mechanism is arranged perpendicularly on the base. The positioning and moving assembly includes a first moving mechanism, a second moving mechanism and a third moving mechanism. The first moving mechanism and the second moving mechanism are located on the same plane. The movement direction of the synchronous belt is the same as the arrangement direction of the slide rail. The center axis of the driving pulley and the center axis of the driven pulley are both perpendicular to the arrangement direction of the slide rail.

5. The automatic positioning and grasping device for chip processing according to claim 1, characterized in that: The three motion branches of the posture adjustment parallel mechanism are respectively arranged at the top corners of the moving platform, and a suction port is arranged at the center of the moving platform.

6. The automatic positioning and grasping device for chip processing according to claim 1, characterized in that: Torsion springs are provided at the connections between the second swing arm and the first swing arm, and between the first connecting rod and the second connecting rod.

7. The automatic positioning and grasping device for chip processing according to claim 1, characterized in that: A vacuum suction cup and a visual camera are arranged on the mobile platform of the clamping and adjusting component.

8. The automatic positioning and grasping device for chip processing according to claim 1, characterized in that: The clamping jaw is an L-shaped structure, and an elastic member is disposed at the second end of the clamping jaw.

9. The automatic positioning and grasping device for chip processing according to claim 1, characterized in that: The positioning moving component drives the clamping and adjusting component to move above the chip to be clamped, the posture adjustment parallel mechanism adjusts the posture of the moving platform, and the clamping and adjusting component drives the clamping claws to move closer or farther away from each other, thereby realizing the variable posture clamping and placement of the clamping and adjusting component.

10. A grasping method for the automatic positioning grasping device for chip processing according to any one of claims 1 to 9, characterized in that: It includes the following steps: S1, clamping position adjustment, specifically including the following sub-steps: S11, using a visual camera to identify the shape, size and position information of the chip, controlling each moving mechanism in the positioning moving assembly to move the clamping adjustment assembly to a preset position, and the second motor drives the active pulley to rotate, thereby driving the synchronous belt to move along the direction of the slide rail, thereby driving the first motor on the fixed seat to move along the slide rail; S12, the first motor in each moving mechanism drives the second swing arm to move, thereby driving the first swing arm to move, so as to adjust the angle of the moving platform; S2, chip posture adjustment: the chip to be clamped is adsorbed on the moving platform through the adsorption port, and the third motor drives the fourth connecting rod to move, driving the connecting rod mechanism formed by the third connecting rod, the second connecting rod and the first connecting rod to move, thereby adjusting the angle of the chip on the moving platform; S3, crawling operation, specifically includes the following sub-steps: S31, when the chip to be clamped moves to the bottom of the mobile platform, the center position of the chip to be clamped is adsorbed by the vacuum suction cup; S32, according to the external dimensions of the chip to be clamped, the ball screw is driven to move by the clamping motor, and the slide table is driven to move along the ball screw, so as to adjust the distance between the clamping jaws, and realize the variable posture clamping of the clamping jaws in the clamping adjustment assembly; S4. When the chip is transferred to the designated position, the vacuum suction cup releases the adsorption of the chip, controls the clamping jaws of the clamping and adjusting assembly to move away from each other until the chip is released, and the chip grabbing and transfer is completed.

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