A fixing structure for the lower die carrier of an injection mold

Abstract

The present invention discloses a fixing structure for the lower die carrier of an injection mold, which includes a body mechanism and a heat-conducting buffer mechanism. The body mechanism includes a base, a lower die carrier, and an upper die carrier. An installation groove is formed in the base, and the lower die carrier is installed in the installation groove. The heat-conducting buffer mechanism includes a gradient bionic support structure and a buffer assembly. By setting the gradient bionic support structure, the support plate of the traditional integral casting structure is composed of a composite structure of a heat-conducting plate, a heat-absorbing plate, a heat-dissipating plate, and a buffer plate, effectively avoiding the problem of frequent fatigue cracks caused by stress concentration. At the same time, through the heat transfer methods of heat conduction, heat absorption, and heat dissipation, the heat dissipation performance of the injection mold is effectively improved, thereby improving the injection efficiency. Moreover, the gradient bionic support structure can not only support the mold but also absorb energy, realizing the buffering of the high-frequency vibration of the injection mold, thus improving the buffering effect of the fixing mechanism on the injection mold.

Description

Technical Field

[0001] The present invention belongs to the technical field of injection molds, and particularly relates to a fixing structure for the lower die carrier of an injection mold. Background Art

[0002] An injection mold is a tool for producing plastic products and also a tool for imparting a complete structure and precise dimensions to plastic products. Injection molding is a processing method used in mass production of some complex-shaped parts. The plastic melted by heating is injected into the mold cavity under high pressure by an injection molding machine, and after cooling and solidification, a formed product is obtained. When an injection mold is used, it is supported by a lower die carrier fixing mechanism to ensure the accurate positioning and stable installation of the mold, withstand various forces during the injection process, maintain production stability, facilitate the installation and maintenance of the mold, and manage the influence brought by factors such as thermal expansion.

[0003] The existing injection molds have poor heat dissipation. Traditional heat dissipation uses water spraying or natural heat dissipation, and its heat dissipation performance is poor, resulting in difficult demolding of workpieces or deformation of workpieces, and low work efficiency. At the same time, when the lower die carrier fixing mechanism supports the injection mold, it needs to withstand high-frequency vibration. The existing mold fixing mechanism has a general buffering effect on the injection mold, affecting the quality of injection products. And the support plate of the lower die carrier fixing mechanism adopts an integral casting structure, and fatigue cracks frequently occur in the stress concentration area.

[0004] The information disclosed in this background art section is only intended to enhance the overall understanding of the present invention and should not be regarded as an admission or any form of suggestion that this information constitutes prior art already known to those of ordinary skill in the art. Summary of the Invention

[0005] The purpose of the present invention is to provide a fixing structure for the lower die carrier of an injection mold, which can solve the problem of low processing efficiency of workpieces caused by poor heat dissipation of traditional heat dissipation molds. At the same time, it is also used to solve the problem that the general buffering performance of the lower die carrier fixing mechanism affects the quality of injection products, and to solve the problem that the integral casting structure of the support plate results in frequent fatigue cracks in the stress concentration area.

[0006] In order to achieve the above purpose, the technical solution provided by a specific embodiment of the present invention is as follows:

[0007] A fixing structure for the lower die carrier of an injection mold, comprising:

[0008] A body mechanism, including a base, a lower die carrier, and an upper die carrier. An installation groove is formed in the base, and the lower die carrier is installed in the installation groove so that the lower die carrier can be installed in the base through the installation groove, and the injection mold can be supported by the base. A plurality of positioning guide columns are installed between the lower die carrier and the upper die carrier. After the lower die carrier and the upper die carrier are closed by the guidance of the positioning guide columns, injection molding is performed on the product.

[0009] The heat-conducting buffer mechanism includes a gradient bionic support structure and a buffer component. The gradient bionic support structure changes the overall casting structure of the support plate used in the traditional lower die carrier fixing mechanism. By changing the force on the support plate through the gradient structure, it can solve the stress concentration problem while improving the energy absorption and release ability of the support plate for the impact force of the buffer die. The gradient bionic support structure is installed at the bottom of the lower die carrier for supporting the injection mold. The buffer component is installed between the gradient bionic support structure and the bottom groove wall of the installation groove, and the buffer component buffers the impact force received by the gradient bionic support structure. The gradient bionic support structure includes a heat-conducting plate, a heat-absorbing plate, a heat-dissipating plate, and a buffer plate. The heat-conducting plate, the heat-absorbing plate, the heat-dissipating plate, and the buffer plate are arranged in sequence from top to bottom, and a composite support plate of the gradient bionic support structure is formed by the heat-conducting plate, the heat-absorbing plate, the heat-dissipating plate, and the buffer plate. The heat-conducting plate is used to transfer the heat in the injection mold. The heat-absorbing plate is provided with a heat-absorbing component, the heat-dissipating plate is provided with a heat-dissipating component, and the buffer plate is used to absorb and buffer the impact force during injection molding. The heat in the injection mold is transferred through the heat-conducting plate, the heat-absorbing component in the heat-absorbing plate absorbs the heat transferred by the heat-conducting plate, and the heat-dissipating component in the heat-dissipating plate processes the heat absorbed by the heat-absorbing plate, changing the single heat-dissipating method of the traditional injection mold, improving the heat-dissipating performance, making it convenient for the workpiece to be demolded and preventing deformation, and improving the working efficiency.

[0010] In one or more embodiments of the present invention, a lower die core is installed in the lower die carrier, and an upper die core corresponding to the lower die core is installed at the bottom of the upper die carrier. The injection molding of the product can be carried out by the clamping of the lower die core and the upper die core. An injection molding pipe is installed at the top of the upper die carrier. A plurality of heat-dissipating holes are opened on the left and right side groove walls of the installation groove in a way that penetrates outward. The fluidity of the air in the installation groove is improved through the plurality of heat-dissipating holes to improve the heat dissipation of the mold during injection molding. A plurality of positioning screws are fixedly connected to the bottom groove wall of the installation groove. The upper ends of the plurality of positioning screws all penetrate through the lower die carrier and are located above the lower die carrier. The upper ends of the positioning screws are threadedly connected with fixing nuts. Through the fastening of the fixing nuts, the lower die carrier can be stably installed in the installation groove. At the same time, the plurality of positioning screws are used for positioning the lower die carrier during installation, making the installation of the lower die carrier convenient.

[0011] In one or more embodiments of the present invention, a plurality of assembly grooves are formed at the bottom of the lower mold base. A plurality of heat conduction protrusions matching the plurality of assembly grooves are integrally formed on the heat conduction plate. The plurality of heat conduction protrusions are sleeved on the inner walls of the corresponding plurality of assembly grooves. Through the contact between the heat conduction protrusions and the assembly grooves, the contact area between the lower mold base and the heat conduction plate is effectively increased, thereby improving the heat transfer effect of the temperature during injection molding in the lower mold core. At the same time, the cooperation between the heat conduction protrusions and the assembly grooves makes the structure stable when the lower mold base is installed on the heat conduction plate. The heat conduction plate is made of silicon nitride ceramic material, so that the heat conduction plate has excellent heat resistance and heat conduction performance. Therefore, when injecting in the lower mold core, the temperature can be quickly transferred from the lower mold base to the heat conduction plate, and the heat is transferred downward through the heat conduction plate.

[0012] In one or more embodiments of the present invention, a transition layer is provided between the heat conduction plate and the heat absorption plate. The transition layer is a TiSi2 composite transition layer. The transition layer is provided on the heat absorption plate by laser cladding, and the heat conduction plate is provided on the transition layer by laser cladding. The transition layer reduces the interfacial thermal stress between the heat conduction plate and the heat absorption plate, and at the same time improves the bonding strength between the heat conduction plate and the heat absorption plate through the transition layer.

[0013] In one or more embodiments of the present invention, the heat absorption member is a phase change material. The phase change material is a composite material of paraffin and expanded graphite. A containing chamber is formed in the heat absorption plate, and the phase change material is filled in the containing chamber, so that the heat conduction plate quickly transfers heat to the heat absorption plate, and then the heat can be absorbed by the phase change material. In order to improve the strength and heat conduction performance of the heat conduction plate, the heat conduction plate is made of a corrugated copper shell, which improves the compressive strength and allows phase change expansion at the same time. A plurality of heat conduction columns are arranged on the heat absorption plate in a matrix manner. The upper ends of the plurality of heat conduction columns are fixedly connected to the top inner wall of the containing chamber. The lower ends of the heat conduction columns penetrate through the bottom inner wall of the containing chamber and are located on the lower side of the heat absorption plate, so that the heat absorbed by the phase change material can be transferred downward through the plurality of heat conduction columns, so that the heat absorbed by the phase change material is released by downward transfer; at the same time, the plurality of heat conduction columns can support the structure of the heat absorption plate in the containing chamber to ensure the structural stability of the heat absorption plate when it is impacted.

[0014] In one or more embodiments of the present invention, the heat dissipation plate is manufactured by SLM 3D printing, which improves the preparation efficiency of the heat dissipation plate. At the same time, the heat dissipation plate is made of titanium alloy material. A plurality of first through holes are vertically formed on the heat dissipation plate in a matrix manner. The porosity of the heat dissipation plate is 15%. The plurality of first through holes correspond to the plurality of heat conduction columns. The heat conduction columns at the lower end of the heat absorption plate are sleeved in the corresponding first through holes. Through the cooperation between the heat conduction columns and the first through holes, when the heat absorbed by the phase change material is transferred downward through the heat conduction columns, the transferred heat can be quickly absorbed by the heat dissipation plate.

[0015] In one or more embodiments of the present invention, the heat dissipation member is a cooling groove, the cooling groove is formed in the heat dissipation plate, and the cooling groove is formed along the long side direction of the heat dissipation plate. The cooling groove is arranged in an annular structure, and the water inlet and outlet of the cooling groove are arranged on the side of the heat dissipation plate. A liquid inlet pipe is installed at the water inlet of the cooling groove, and a liquid outlet pipe is installed at the water outlet of the cooling groove. The ends of the liquid inlet pipe and the liquid outlet pipe away from the heat dissipation plate penetrate through the side wall of the base and are located outside the base. The coolant is transported into the cooling groove through the liquid inlet pipe. When the coolant flows in the cooling groove, the heat on the liquid inlet pipe can be absorbed. After the coolant absorbs the heat, the coolant is discharged through the liquid outlet pipe. Thus, through the flow of the coolant in the heat dissipation plate, the absorption of heat is realized. At the same time, the cooling groove is arranged in an annular structure, which improves the heat absorption effect when the cooling medium flows in the cooling groove. The heat dissipation of the injection mold is realized through the heat conduction of the heat conduction plate, the heat absorption of the heat absorption plate and the heat dissipation of the heat dissipation plate, changing the traditional single heat dissipation method and effectively improving the heat dissipation effect.

[0016] In one or more embodiments of the present invention, a plurality of second through holes are vertically formed in the buffer plate in a matrix manner. The plurality of second through holes are arranged in a conical structure with a small upper end and a large lower end. The diameter ratio of the upper port to the lower port of the second through hole is 1:4, and the porosity of the buffer plate is 40%. Through the arrangement of the plurality of second through holes, the buffer plate forms an energy-absorbing layer with a porous structure, thereby effectively improving the buffering when the injection mold is impacted.

[0017] In one or more embodiments of the present invention, the buffer assembly is a buffer layer, and the buffer layer is made of polyurethane material. By providing a buffer layer of polyurethane material at the bottom of the gradient bionic support structure, the buffering when the injection mold is impacted is further improved, ensuring that the quality of the product in the mold during injection will not be affected by the high-frequency vibration of the injection mold and improving the quality of the injection product.

[0018] In one or more embodiments of the present invention, a plurality of fixing holes are formed at the edge of the gradient bionic support structure. Connecting screws are threadedly connected in the plurality of fixing holes. The lower end of the connecting screw is threadedly connected to the bottom wall of the installation groove. Grooves are formed on the top of the heat conduction plate at the plurality of fixing holes, and the head of the connecting screw is embedded in the groove. The gradient bionic support structure can be fixed in the installation groove through the connecting screw, thereby ensuring the stability of the gradient bionic support structure after installation.

[0019] Compared with the prior art, by setting the gradient bionic support structure, the support plate of the traditional integral casting structure is composed of a composite structure of a heat conduction plate, a heat absorption plate, a heat dissipation plate and a buffer plate, effectively avoiding the problem of frequent fatigue cracks caused by stress concentration; at the same time, through the heat transfer methods of heat conduction, heat absorption and heat dissipation, the heat dissipation performance of the injection mold is effectively improved, thereby improving the injection efficiency; and the gradient bionic support structure can not only support the mold but also absorb energy, realizing the buffering of the high-frequency vibration of the injection mold, thus improving the buffering effect of the fixing mechanism on the injection mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0021] Figure 1 The front view of a fixing structure of the lower mold base of an injection mold in an embodiment of the present invention;

[0022] Figure 2 The perspective view of a fixing structure of the lower mold base of an injection mold in an embodiment of the present invention;

[0023] Figure 3 The cross-sectional view of a fixing structure of the lower mold base of an injection mold in an embodiment of the present invention;

[0024] Figure 4 The sectional view of a fixing structure of the lower mold base of an injection mold in an embodiment of the present invention;

[0025] Figure 5 The exploded view of the gradient bionic support structure in the present invention;

[0026] Figure 6 The installation schematic diagram of the lower mold base and the gradient bionic support structure in the present invention;

[0027] Figure 7 The sectional view of the heat dissipation plate in the present invention;

[0028] Figure 8 In the present invention Figure 4 The sectional view at position A;

[0029] Figure 9 In the present invention Figure 4 The sectional view at position B;

[0030] Figure 10 In the present invention Figure 5 The sectional view at position C.

[0031] Description of Main Reference Numerals:

[0032] 1 - Body mechanism, 11 - Base, 12 - Installation groove, 13 - Lower mold base, 14 - Lower mold core, 15 - Upper mold base, 16 - Upper mold core, 17 - Injection pipe, 18 - Positioning guide post, 19 - Heat dissipation hole, 110 - Assembly groove, 111 - Positioning screw, 112 - Fixed nut, 2 - Heat conduction and buffering mechanism, 21 - Heat conduction plate, 22 - Heat absorption plate, 23 - Heat dissipation plate, 24 - Buffer plate, 25 - Heat conduction protrusion, 26 - First through hole, 27 - Second through hole, 28 - Transition layer, 29 - Accommodation chamber, 210 - Phase change material, 211 - Heat conduction column, 212 - Cooling groove, 213 - Liquid inlet pipe, 214 - Liquid outlet pipe, 215 - Buffer layer, 216 - Fixed hole, 217 - Connecting screw, 218 - Groove body. Detailed Embodiment

[0033] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0034] As Figures 1 - 4 shown, a fixing structure for the lower mold base of an injection mold in an embodiment of the present invention includes a body mechanism 1 and a heat conduction and buffering mechanism 2.

[0035] As Figures 1 - 4 shown, the body mechanism 1 includes a base 11, a lower mold base 13, and an upper mold base 15. An installation groove 12 is formed in the base 11, and the lower mold base 13 is installed in the installation groove 12 so that the lower mold base 13 can be installed in the base 11 through the installation groove 12, and the injection mold can be supported by the base 11. A plurality of positioning guide posts 18 are installed between the lower mold base 13 and the upper mold base 15. Through the guiding of the positioning guide posts 18, the lower mold base 13 and the upper mold base 15 are used for injection molding of products after being closed.

[0036] As Figures 1 - 4As shown in the figure, a lower die carrier 13 is installed with a lower die core 14, and the bottom of an upper die carrier 15 is installed with an upper die core 16 corresponding to the lower die core 14. The injection molding of the product can be carried out through the die closing of the lower die core 14 and the upper die core 16. An injection molding pipe 17 is installed at the top of the upper die carrier 15. A plurality of heat dissipation holes 19 are opened on the left and right side walls of the installation groove 12 in a way that penetrates outward. The fluidity of the air in the installation groove 12 is improved through the plurality of heat dissipation holes 19, so as to improve the heat dissipation performance of the mold during injection molding. A plurality of positioning screw rods 111 are fixedly connected to the bottom wall of the installation groove 12. The upper ends of the plurality of positioning screw rods 111 all penetrate through the lower die carrier 13 and are located above the lower die carrier 13. The upper end of the positioning screw rod 111 is threadedly connected with a fixing nut 112. Through the fastening of the fixing nut 112, the lower die carrier 13 can be stably installed in the installation groove 12. At the same time, the plurality of positioning screw rods 111 are used for positioning the lower die carrier 13 during installation, making the installation of the lower die carrier 13 convenient.

[0037] As Figures 1 - 6 shown, the heat-conducting buffer mechanism 2 includes a gradient bionic support structure and a buffer component. The gradient bionic support structure changes the traditional lower die carrier fixing mechanism that uses a support plate with an integral casting structure. By changing the force on the support plate through the gradient structure, the stress concentration problem can be solved while also improving the energy absorption and release ability of the support plate to buffer the impact force of the mold. The gradient bionic support structure is installed at the bottom of the lower die carrier 13 for supporting the injection mold. The buffer component is installed between the gradient bionic support structure and the bottom wall of the installation groove 12 to buffer the impact force received by the gradient bionic support structure. The gradient bionic support structure includes a heat-conducting plate 21, a heat-absorbing plate 22, a heat-dissipating plate 23, and a buffer plate 24. The heat-conducting plate 21, the heat-absorbing plate 22, the heat-dissipating plate 23, and the buffer plate 24 are arranged in sequence from top to bottom. The heat-conducting plate 21, the heat-absorbing plate 22, the heat-dissipating plate 23, and the buffer plate 24 form a composite support plate of the gradient bionic support structure. The heat-conducting plate 21 is used to transfer the heat in the injection mold. A heat-absorbing component is arranged in the heat-absorbing plate 22, and a heat-dissipating component is arranged in the heat-dissipating plate 23. The buffer plate 24 is used to absorb and buffer the impact force during injection molding. The heat in the injection mold is transferred through the heat-conducting plate 21, the heat-absorbing component in the heat-absorbing plate 22 absorbs the heat transferred by the heat-conducting plate 21, and the heat-dissipating component in the heat-dissipating plate 23 processes the heat absorbed by the heat-absorbing plate 22, changing the traditional single heat dissipation method of the injection mold, improving the heat dissipation performance, making the workpiece easy to demold and preventing deformation, thereby improving the work efficiency.

[0038] As Figure 6 and Figure 8As shown in the figure, a plurality of assembly grooves 110 are formed at the bottom of the lower mold base 13. A plurality of heat conducting protrusions 25 that are integrally formed with the plurality of assembly grooves 110 are provided on the heat conducting plate 21. The plurality of heat conducting protrusions 25 are sleeved on the walls of the corresponding plurality of assembly grooves 110. Through the contact between the heat conducting protrusions 25 and the assembly grooves 110, the contact area between the lower mold base 13 and the heat conducting plate 21 is effectively increased, thereby improving the heat transfer effect of the temperature during injection molding in the lower mold core 14. At the same time, the cooperation between the heat conducting protrusions 25 and the assembly grooves 110 makes the structure of the lower mold base 13 stable when it is installed on the heat conducting plate 21. The heat conducting plate 21 is made of silicon nitride ceramic material, so that the heat conducting plate 21 has excellent high temperature resistance and heat conduction performance. Therefore, when injection molding is carried out in the lower mold core 14, the temperature can be quickly transferred from the lower mold base 13 to the heat conducting plate 21, and the heat is transferred downward through the heat conducting plate 21.

[0039] As Figure 5 and Figure 8 shown in the figure, a transition layer 28 is provided between the heat conducting plate 21 and the heat absorbing plate 22. The transition layer 28 is a TiSi2 composite transition layer. The transition layer 28 is provided on the heat absorbing plate 22 by laser cladding, and the heat conducting plate 21 is provided on the transition layer 28 by laser cladding. The transition layer 28 reduces the interfacial thermal stress between the heat conducting plate 21 and the heat absorbing plate 22, and at the same time improves the bonding strength between the heat conducting plate 21 and the heat absorbing plate 22 through the transition layer 28.

[0040] As Figure 4 combined Figure 8 shown in the figure, the heat absorbing member is a phase change material 210. The phase change material 210 is a composite material of paraffin and expanded graphite. A receiving chamber 29 is formed in the heat absorbing plate 22, and the phase change material 210 is filled in the receiving chamber 29, so that the heat conducting plate 21 quickly transfers heat to the heat absorbing plate 22, and then the heat can be absorbed by the phase change material 210. In order to improve the strength and heat conduction performance of the heat conducting plate 21, the heat conducting plate 21 is made of a corrugated copper shell, which improves the compressive strength while allowing phase change expansion. A plurality of heat conducting columns 211 are arranged on the heat absorbing plate 22 in a matrix manner. The upper ends of the plurality of heat conducting columns 211 are fixedly connected to the top wall of the receiving chamber 29. The lower ends of the heat conducting columns 211 penetrate through the bottom wall of the receiving chamber 29 and are located on the lower side of the heat absorbing plate 22, so that the heat absorbed by the phase change material 210 can be transferred downward through the plurality of heat conducting columns 211, so that the heat absorbed by the phase change material 210 is released by the downward transfer method; at the same time, the plurality of heat conducting columns 211 can support the structure of the heat absorbing plate 22 in the receiving chamber 29 to ensure the structural stability of the heat absorbing plate 22 when it is impacted.

[0041] As Figure 5 、 Figure 7 and Figure 8As shown, the heat dissipation plate 23 is made by SLM 3D printing, which improves the preparation efficiency of the heat dissipation plate 23. At the same time, the heat dissipation plate 23 is made of titanium alloy material. A plurality of first through holes 26 are vertically formed in the heat dissipation plate 23 in a matrix manner, and the porosity of the heat dissipation plate 23 is 15%. The plurality of first through holes 26 correspond to a plurality of heat conduction columns 211. One end of the heat conduction column 211 outside the heat absorption plate 22 is sleeved in the corresponding first through hole 26. Through the cooperation of the heat conduction column 211 and the first through hole 26, when the heat absorbed by the phase change material 210 is transferred downward through the heat conduction column 211, the transferred heat can be quickly absorbed by the heat dissipation plate 23.

[0042] As Figure 2 , Figure 5 and Figure 7 As shown, the heat dissipation member is a cooling groove 212. The cooling groove 212 is formed in the heat dissipation plate 23 and is arranged along the long side direction of the heat dissipation plate 23. The cooling groove 212 is arranged in an annular structure, and the water inlet and outlet of the cooling groove 212 are arranged on the side of the heat dissipation plate 23. A liquid inlet pipe 213 is installed at the water inlet of the cooling groove 212, and a liquid outlet pipe 214 is installed at the water outlet of the cooling groove 212. One ends of the liquid inlet pipe 213 and the liquid outlet pipe 214 away from the heat dissipation plate 23 penetrate through the side wall of the base 11 and are located outside the base 11. The coolant is conveyed into the cooling groove 212 through the liquid inlet pipe 213. When the coolant flows in the cooling groove 212, the heat on the liquid inlet pipe 213 can be absorbed. After the coolant absorbs the heat, the coolant is discharged through the liquid outlet pipe 214. Thus, through the flow of the coolant in the heat dissipation plate 23, the absorption of heat is realized. At the same time, the cooling groove 212 is arranged in an annular structure, which improves the heat absorption effect when the cooling medium flows in the cooling groove 212. The heat dissipation of the injection mold is realized through the heat conduction of the heat conduction plate 21, the heat absorption of the heat absorption plate 22 and the heat dissipation of the heat dissipation plate 23, changing the traditional single heat dissipation method and effectively improving the heat dissipation effect.

[0043] As Figure 5 and Figure 9 As shown, a plurality of second through holes 27 are vertically formed in the buffer plate 24 in a matrix manner. The plurality of second through holes 27 are arranged in a conical structure with a small upper end and a large lower end. The diameter ratio of the upper port to the lower port of the second through hole 27 is 1:4, and the porosity of the buffer plate 24 is 40%. Through the arrangement of the plurality of second through holes 27, the buffer plate 24 forms an energy absorption layer with a porous structure, thus effectively improving the buffering when the injection mold is impacted.

[0044] As Figure 5 and Figure 9As shown, the buffer component is the buffer layer 215. The buffer layer 215 is made of polyurethane material. By setting the buffer layer 215 of polyurethane material at the bottom of the gradient bionic support structure, the buffering during the impact of the injection mold is further improved, ensuring that the quality of the products in the mold during injection is not affected by the high-frequency vibration of the injection mold, and improving the quality of the injection products.

[0045] As Figure 5 and Figure 10 As shown, a plurality of fixing holes 216 are provided at the edge of the gradient bionic support structure. Connecting screws 217 are threadedly connected in the plurality of fixing holes 216. The lower end of the connecting screw 217 is threadedly connected to the bottom wall of the installation groove 12. Grooves 218 are provided on the top of the heat conducting plate 21 at the plurality of fixing holes 216. The head of the connecting screw 217 is embedded in the groove 218. The gradient bionic support structure can be fixed in the installation groove 12 through the connecting screw 217, thereby ensuring the stability of the gradient bionic support structure after installation.

[0046] During use, a buffer layer 215 is installed on the bottom groove wall of the installation groove 12, and a gradient bionic support structure formed by combining a heat conducting plate 21, a heat absorbing plate 22, a heat dissipating plate 23, and a buffer plate 24 is installed on the buffer layer 215. Connecting screws 217 are respectively threadedly connected in a plurality of fixing holes 216, and the lower ends of the connecting screws 217 are threadedly connected to the bottom groove wall of the installation groove 12, so as to fix the gradient bionic support structure in the installation groove 12. Then, the lower mold base 13 is sleeved on a plurality of positioning screws 111, such that the assembly groove 110 at the bottom of the lower mold base 13 is sleeved on the heat conducting protrusions 25 at the upper end of the heat conducting plate 21. Then, fixing nuts 112 are installed at the upper ends of the positioning screws 111 to fix the lower mold base 13 on the gradient bionic support structure. Materials are injected into the lower mold core 14 through an injection pipe 17. After the lower mold base 13 and the upper mold base 15 are closed, injection molding is performed through the cooperation of the lower mold core 14 and the upper mold core 16. During high-frequency vibration during injection molding, the lower mold base 13 will transmit the vibration force to the gradient bionic support structure and the buffer layer 215. The buffer plate 24 and the buffer layer 215 can effectively absorb and buffer the impact, so as to ensure that the products in the injection mold are not affected by vibration impact. At the same time, the heat in the injection mold will be transmitted from the lower mold core 14 to the lower mold base 13, and then from the lower mold base 13 to the heat conducting plate 21. The heat conducting plate 21 transmits the heat to the heat absorbing plate 22 through the transition layer 28, such that the heat is absorbed by the phase change material 210, thereby efficiently reducing the temperature in the injection mold and improving the heat dissipation performance of the temperature in the injection mold. The heat absorbed by the phase change material 210 will be transmitted to the heat dissipating plate 23 through the heat conducting columns 211, and then the cooling medium flowing in the cooling grooves 212 provided in the heat dissipating plate 23 can absorb and process the heat, so that the phase change material 210 can continuously absorb heat and ensure the heat dissipation performance of the injection mold. At the same time, the composite mechanism of the gradient bionic support structure avoids the problem of frequent fatigue cracks caused by stress concentration in the integral casting structure, and improves the service life of the fixing mechanism.

[0047] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, it is intended to include all changes falling within the meaning and scope of the equivalent elements of the claims in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0048] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An injection mold lower die holder fixing structure, characterized in that, Including: A body mechanism, including a base, a lower mold base, and an upper mold base. An installation groove is formed in the base, the lower mold base is installed in the installation groove, and a plurality of positioning guide posts are installed between the lower mold base and the upper mold base; A heat conduction and buffering mechanism, including a gradient bionic support structure and a buffering component. The gradient bionic support structure is installed at the bottom of the lower mold base, and the buffering component is installed between the gradient bionic support structure and the bottom wall of the installation groove. The gradient bionic support structure includes a heat conduction plate, a heat absorption plate, a heat dissipation plate, and a buffer plate, which are arranged in sequence from top to bottom. The heat conduction plate is used to transfer the heat in the injection mold. A heat absorption component is arranged in the heat absorption plate, and a heat dissipation component is arranged in the heat dissipation plate. The buffer plate is used to absorb and buffer the impact force during injection molding; A plurality of assembly grooves are formed at the bottom of the lower mold base. A plurality of heat conduction protrusions matching the plurality of assembly grooves are integrally formed on the heat conduction plate, and the plurality of heat conduction protrusions are sleeved on the walls of the corresponding plurality of assembly grooves. The heat conduction plate is made of silicon nitride ceramic material; The heat absorption component is a phase change material, which is a composite material of paraffin and expanded graphite. A containing chamber is formed in the heat absorption plate, and the phase change material is filled in the containing chamber. A plurality of heat conduction columns are arranged on the heat absorption plate in a matrix manner. The upper ends of the plurality of heat conduction columns are fixedly connected to the top wall of the containing chamber, and the lower ends of the heat conduction columns penetrate through the bottom wall of the containing chamber and are located on the lower side of the heat absorption plate; A plurality of second through holes are vertically formed in the buffer plate in a matrix manner. The plurality of second through holes are arranged in a conical structure with a small upper opening and a large lower opening. The diameter ratio of the upper port to the lower port of the second through hole is 1:4, and the porosity of the buffer plate is 40%; 2. The fixed structure of the lower die carrier of an injection mold according to claim 1, wherein, A lower mold core is installed in the lower mold base, an upper mold core corresponding to the lower mold core is installed at the bottom of the upper mold base, an injection pipe is installed at the top of the upper mold base, a plurality of heat dissipation holes are formed in the left and right side walls of the installation groove in a way that penetrates outward, a plurality of positioning screws are fixedly connected to the bottom wall of the installation groove, the upper ends of the plurality of positioning screws all penetrate through the lower mold base and are located above the lower mold base, and the upper ends of the positioning screws are threadedly connected with fixing nuts; 3. The fixed structure of the lower die carrier of an injection mold according to claim 1, wherein, A transition layer is arranged between the heat conduction plate and the heat absorption plate. The transition layer is a TiSi2 composite transition layer, and the transition layer is arranged on the heat absorption plate by laser cladding. The heat conduction plate is arranged on the transition layer by laser cladding; 4. The fixed structure of the lower die carrier of an injection mold according to claim 1, characterized in that, The heat dissipation plate is made by SLM 3D printing. A plurality of first through holes are vertically formed in the heat dissipation plate in a matrix manner. The porosity of the heat dissipation plate is 15%. The plurality of first through holes correspond to the plurality of heat conduction columns, and the lower ends of the heat conduction columns are sleeved in the corresponding first through holes; 5. The fixed structure of the lower die carrier of an injection mold according to claim 4, characterized in that, The heat dissipation member is a cooling groove, the cooling groove is formed in the heat dissipation plate, and the cooling groove is formed along the long side direction of the heat dissipation plate. The cooling groove is arranged in an annular structure, the water inlet and outlet of the cooling groove are arranged on the side edge of the heat dissipation plate, a liquid inlet pipe is installed at the water inlet of the cooling groove, a liquid outlet pipe is installed at the water outlet of the cooling groove, and the ends of the liquid inlet pipe and the liquid outlet pipe away from the heat dissipation plate penetrate through the side wall of the base and are located outside the base.

6. The fixed structure of the lower die carrier of an injection mold according to claim 1, wherein, The buffer assembly is a buffer layer, and the buffer layer is made of polyurethane material.

7. The fixed structure of the lower die carrier of an injection mold according to claim 1, characterized in that, A plurality of fixing holes are formed in the edge of the gradient bionic support structure, connection screws are threadedly connected in the plurality of fixing holes, the lower end of the connection screw is threadedly connected to the bottom wall of the installation groove, and groove bodies are formed in the top of the heat conduction plate at the plurality of fixing holes, and the head of the connection screw is embedded in the groove body.

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