Plastic material with excellent heat-conducting property and preparation method thereof

Abstract

The invention relates to a plastic material with excellent heat-conducting property and a preparation method thereof, and belongs to the field of material manufacturing. The invention relates to a plastic material with excellent heat-conducting property. The plastic material comprises matrix resin, heat-conducting filler, a surface modifier and a dispersing agent, the weight part of the matrix resin is 100 parts; the weight part of the heat-conducting filler is 10-50; the weight part of the surface modifier is 0.5-5; the weight part of the dispersing agent is 0.1 to 2. By carefully selecting the adaptive matrix resin, the heat-conducting filler and the surface modifier and optimizing the ratio of all the components, the heat conductivity coefficient is greatly improved while good mechanical properties of the material are maintained.

Description

Technical Field

[0001] The present invention relates to the field of material manufacturing, and particularly to a plastic material with excellent thermal conductivity and a preparation method thereof. Background Art

[0002] Traditional plastic materials generally have poor thermal conductivity, which greatly limits their applications in fields with high requirements for thermal conductivity, such as heat sinks, electronic packaging, LED lighting, etc. To improve the thermal conductivity of plastics, a common method is to add thermal conductive fillers, such as metal powders, ceramic particles, carbon materials, etc. However, adding a large amount of such fillers will cause problems such as deterioration of the mechanical properties of the material and a significant increase in cost. Summary of the Invention

[0003] Based on this, it is necessary to provide a plastic material with excellent thermal conductivity and a preparation method thereof to address the problem of poor thermal conductivity of plastic materials.

[0004] A plastic material with excellent thermal conductivity, the plastic material with excellent thermal conductivity includes a matrix resin, a thermal conductive filler, a surface modifier, and a dispersant; The weight portion of the matrix resin is 100 parts; The weight portion of the thermal conductive filler is 10 - 50 parts; The weight portion of the surface modifier is 0.5 - 5 parts; The weight portion of the dispersant is 0.1 - 2 parts.

[0005] The above discloses a plastic material with excellent thermal conductivity. In fields such as heat sinks, electronic packaging, and LED lighting, where high requirements are placed on the thermal conductivity of materials, the application of traditional plastics is severely limited due to their poor thermal conductivity. Although adding thermal conductive fillers can improve the thermal conductivity of plastics, adding a large amount will lead to a decrease in the mechanical properties of the material and an increase in cost. However, this plastic material with excellent thermal conductivity effectively overcomes these problems. By carefully selecting suitable matrix resins, thermal conductive fillers, and surface modifiers, and optimizing the ratio of each component, while maintaining good mechanical properties, the material achieves a significant increase in the thermal conductivity coefficient. Compared with traditional solutions for improving thermal conductivity, there is no need to add a large amount of fillers, which not only avoids the problem of deterioration of mechanical properties caused by excessive fillers but also reduces the cost of the material. Based on the above advantages, this plastic material can be widely used in fields such as heat sinks, electronic packaging, and LED lighting. When applied to heat sinks, it can efficiently conduct heat and improve the heat dissipation efficiency; for electronic packaging, it can ensure the stable operation of electronic products; in the field of LED lighting, it can timely dissipate the heat generated by LED chips and extend the service life of lamps. Generally speaking, this material provides a better choice for the development of related industries. By setting the weight portion of the matrix resin to 100 parts, a standardized measurement benchmark is established for the material formula. With this as a reference, the addition amounts of thermal conductive fillers, surface modifiers, and dispersants can be accurately regulated to achieve a scientific combination of the proportions of each component. When based on 100 parts of the matrix resin and an appropriate amount of thermal conductive fillers is adapted, it not only ensures that the material has good thermal conductivity but also does not damage the mechanical properties due to excessive fillers. In actual production, based on 100 parts of the matrix resin, it helps to accurately control the quality of the material, ensure the stability and consistency of each batch of products, reduce the production cost caused by formulation errors, and enable the product to exhibit better performance in fields such as heat sinks and electronic packaging. By setting the weight portion of the thermal conductive filler to 10 - 50 parts (such as 10 parts, 20 parts, 30 parts, 40 parts, or 50 parts), when the content is within this range, supported by the matrix resin, the thermal conductive filler can effectively form a heat conduction path, significantly improving the thermal conductivity coefficient of the material and meeting the application requirements in high heat dissipation demand scenarios such as heat sinks and electronic packaging. At the same time, since it is not added in excess, it will not cause serious damage to the mechanical properties of the material, ensuring the structural strength and toughness of the material in actual use. Moreover, the range of 10 - 50 parts has a certain flexibility, and R & D personnel can accurately adjust the dosage according to the different emphases on thermal conductivity and cost in specific application scenarios, thereby achieving the optimal balance between material performance and cost and providing an adapted solution for diverse industrial applications. By setting the weight portion of the surface modifier to 0.5 - 5 parts (such as 0.5 parts, 0.8 parts, 2 parts, or 5 parts), this dosage of the surface modifier can form a stable coating layer on the surface of the thermal conductive filler, reducing the agglomeration phenomenon between the fillers and enabling the thermal conductive fillers to be evenly dispersed in the matrix resin. The improvement in the dispersibility of the fillers optimizes the heat conduction path and enhances the thermal conductivity of the material.An appropriate amount of surface modifier improves the interfacial compatibility between the thermal conductive filler and the matrix resin, enabling them to combine tightly, significantly enhancing the mechanical properties of the material, and reducing the risk of performance deterioration caused by the addition of thermal conductive filler. R & D personnel can also flexibly adjust the dosage within the range of 0.5 - 5 parts according to different application scenarios to achieve the best balance between material performance and cost, meeting the diverse industrial production requirements. By setting the weight part of the dispersant to 0.1 - 2 parts (such as 0.1 part, 0.5 part, 1 part or 2 parts), this dosage of dispersant can adsorb on the surface of the thermal conductive filler, and further inhibit the agglomeration of the thermal conductive filler through electrostatic repulsion and steric hindrance effects. Acting synergistically with the surface modifier, it greatly improves the dispersion uniformity of the thermal conductive filler in the matrix resin, thereby constructing a more efficient heat conduction network and significantly enhancing the thermal conductivity of the material. Moreover, the dispersant can help the matrix resin and the thermal conductive filler achieve better combination, improve the overall stability of the material, and improve its processing performance. For example, during injection molding, it ensures uniform flow of the material, reduces product defects, and guarantees product quality.

[0006] In one of the embodiments, the matrix resin is one or a combination of several of polyamide, polycarbonate, polyphenylene sulfide, polyether ether ketone, and liquid crystal polymer. Selecting one or several of polyamide, polycarbonate, polyphenylene sulfide, polyether ether ketone, and liquid crystal polymer as the matrix resin is of great significance for improving material performance and expanding application scenarios. Polyamide has excellent wear resistance, self-lubricity, and mechanical strength, and the materials made can operate stably under complex working conditions. Polycarbonate has excellent impact resistance and good dimensional stability, and is suitable for the field of electronic packaging with high precision requirements. Polyphenylene sulfide has outstanding chemical stability and high temperature resistance, which can improve the reliability of materials in harsh environments. Polyether ether ketone has extremely excellent high temperature stability and mechanical properties, and can meet the stringent requirements of high-end industries for materials. Liquid crystal polymer can significantly improve the fluidity of materials, optimize processing performance, and reduce the molding difficulty. Using a combination of the above one or several resins can not only integrate the advantages of each resin, but also precisely control the material properties by adjusting the ratio to meet the requirements of different application scenarios. In the field of radiators, a combination with high temperature resistance and good thermal conductivity can be selected; in the field of electronic packaging, a combination with impact resistance and dimensional stability can be emphasized to improve the adaptability of materials and broaden the application scope of materials.

[0007] In one embodiment, the thermal conductive filler is one or a combination of aluminum nitride, boron nitride, silicon carbide, aluminum oxide, zinc oxide, graphene, and carbon nanotubes. By selecting one or several of aluminum nitride, boron nitride, silicon carbide, aluminum oxide, zinc oxide, graphene, and carbon nanotubes as the thermal conductive filler, the thermal conductivity of the material can be significantly enhanced. Aluminum nitride has a high thermal conductivity and good electrical insulation properties, and is suitable for electronic devices with high requirements for heat dissipation and insulation. Boron nitride not only has excellent thermal conductivity but also has lubricity, which can reduce the friction coefficient of the material. Silicon carbide has high hardness and good thermal conductivity, and can enhance the wear resistance and thermal stability of the material. Aluminum oxide has a low cost and good chemical stability, and is an ideal choice to improve the cost performance of the material. Zinc oxide has antibacterial properties while providing a certain thermal conductivity. Graphene and carbon nanotubes have ultra-high thermal conductivity and good flexibility, and can effectively improve the thermal and mechanical properties of the material. Using one or more thermal conductive fillers in combination can integrate the advantages of each filler, and by adjusting the ratio, precise control of the thermal, mechanical and other properties of the material can be achieved. In the field of heat sinks, selecting high thermal conductivity fillers such as aluminum nitride and graphene can greatly improve the heat dissipation efficiency; in the field of electronic packaging, combining with aluminum oxide, boron nitride, etc. can not only ensure the thermal conductivity but also meet the requirements of insulation and stability.

[0008] In one embodiment, the surface modifier is one or a combination of silane coupling agents, titanate coupling agents, and aluminate coupling agents. By selecting one or several of silane coupling agents, titanate coupling agents, and aluminate coupling agents as the surface modifier, it is of great significance to optimize the material properties and reduce the production cost. Silane coupling agents can form chemical bonds between the thermal conductive filler and the matrix resin, improve the interfacial compatibility between the two, and significantly enhance the dispersion of the thermal conductive filler in the matrix resin. When combined with thermal conductive fillers such as aluminum nitride and silicon carbide, it can evenly disperse the fillers and build an efficient heat conduction network, enhancing the thermal conductivity of the material. Titanate coupling agents can not only promote the dispersion of fillers but also reduce the viscosity of the material system and improve the processing performance of the material. During the injection molding process, the material flows more smoothly and the molding defects are reduced. Aluminate coupling agents are relatively inexpensive, and while enhancing the interfacial bonding force, they effectively reduce the material cost, especially suitable for large-scale production scenarios sensitive to costs.

[0009] In one embodiment, the dispersant is one or a combination of polyethylene wax, polypropylene wax, stearic acid, calcium stearate, and zinc stearate. By selecting one or several of polyethylene wax, polypropylene wax, stearic acid, calcium stearate, and zinc stearate as the dispersant, an excellent dispersing effect can be exerted in the material system. Taking polyethylene wax and polypropylene wax as examples, they have good lubricity and low surface energy, can form a protective film on the surface of the thermal conductive filler, and effectively prevent filler agglomeration through steric hindrance effect, so that the thermal conductive filler is evenly dispersed in the matrix resin, constructing a more efficient heat conduction path and significantly improving the thermal conductivity of the material. Stearic acid, calcium stearate, and zinc stearate can improve the processability of the material while improving the dispersibility. During high-temperature processing, they reduce the viscosity of the material, make the material flow more smoothly, reduce molding defects, and improve product quality. Moreover, these dispersants are widely sourced and relatively low in cost, and can be flexibly combined according to different application scenarios and cost requirements, effectively controlling production costs on the premise of ensuring material performance.

[0010] The second aspect of the present application discloses a preparation method of a plastic material with excellent thermal conductivity. The preparation method of the plastic material with excellent thermal conductivity includes the following steps: S1. Prepare a modified thermal conductive filler; S2. Mix the modified thermal conductive filler with a matrix resin to obtain a plastic material with excellent thermal conductivity; The specific steps of S1 are as follows: S11. Weigh the thermal conductive filler, surface modifier, and dispersant according to parts by weight; S12. Put the weighed thermal conductive filler, surface modifier, and dispersant into a high-speed mixer for mixing; S13. Dry the evenly mixed thermal conductive filler, surface modifier, and dispersant to remove moisture and obtain the modified thermal conductive filler.

[0011] The second aspect described above discloses a method for preparing a plastic material with excellent thermal conductivity. By modifying the thermal conductive filler, the compatibility between the filler and the matrix resin is greatly improved. This not only significantly enhances the dispersion uniformity of the thermal conductive filler in the matrix resin, but also helps to build an efficient heat conduction network, remarkably enhancing the thermal conductivity of the material. Directly mixing the modified thermal conductive filler with the matrix resin features a simple and efficient process, effectively shortening the preparation cycle, reducing the complexity of the production process, decreasing the energy consumption and costs caused by complex processes, and greatly improving the production efficiency. In addition, this method has good flexibility and controllability. By adjusting the modification method and the raw material ratio, it can meet the different performance requirements of materials in different application scenarios. Whether it is a radiator with extremely high heat dissipation requirements or the field of electronic packaging with strict requirements for performance stability, the plastic material produced by this preparation method can be perfectly adapted, providing strong support for the development of the industry. By accurately weighing the thermal conductive filler, the surface modifier, and the dispersant by weight parts, an accurate raw material ratio is provided for the subsequent steps, ensuring that each component plays its best role and avoiding fluctuations in material performance caused by material errors. Put the weighed raw materials into a high-speed mixer. High-speed mixing can quickly break the agglomeration between components with its powerful stirring force, achieving uniform dispersion. The surface modifier can thus fully act on the surface of the thermal conductive filler, reducing its surface energy and greatly improving the compatibility between the thermal conductive filler and the matrix resin. The dispersant further prevents the filler from agglomerating again through electrostatic repulsion and steric hindrance effects, creating conditions for building an efficient heat conduction network. Dry the mixed material to remove moisture. The presence of moisture will affect the heat conduction performance of the material and may also cause defects such as bubbles and cracks during the molding process. The drying treatment effectively solves these problems and improves the stability and reliability of the material.

[0012] In one of the embodiments, the temperature for mixing the thermal conductive filler, the surface modifier, and the dispersant in the high-speed mixer in S12 is 18 - 28°C, and the mixing time is 5 - 15 minutes. By mixing the thermal conductive filler, the surface modifier, and the dispersant at 18 - 28°C (such as 18°C, 20°C, 25°C, or 28°C) for 5 - 15 minutes (such as 5 minutes, 8 minutes, 10 minutes, or 15 minutes), significant advantages are demonstrated while ensuring the mixing effect. Mixing at 18 - 28°C avoids the investment in additional heating or cooling equipment, greatly reducing energy consumption, conforming to the current concept of green production and reducing production costs. The mixing duration of 5 - 15 minutes effectively avoids the negative effects caused by overmixing while ensuring sufficient mixing. During this time period, the powerful stirring force of the high-speed mixer enables the surface modifier to be fully adsorbed on the surface of the thermal conductive filler, significantly improving its compatibility with the matrix resin. The dispersant can also prevent the filler from agglomerating with the help of electrostatic repulsion and steric hindrance, facilitating the construction of an efficient heat conduction network.

[0013] In one embodiment, the drying temperature of the thermally conductive filler, the surface modifier, and the dispersant after being uniformly mixed in S13 is 80 - 120 °C, and the drying time is 2 - 4 hours. Drying at 80 - 120 °C for 2 - 4 hours has multiple significant advantages. In this temperature range, the moisture on the surface of the thermally conductive filler can be effectively removed. If moisture remains in the material, it will seriously affect the heat conduction efficiency and may also cause problems such as pores and cracks in the subsequent processing of the material. 80 - 120 °C (such as 80 °C, 90 °C, 100 °C, or 120 °C) is much lower than the decomposition temperature of the surface modifier, which not only avoids the decomposition and invalidation of the surface modifier during drying but also prevents the structure of the thermally conductive filler from being damaged. Once the drying temperature is too high, the surface modifier decomposes, and it cannot effectively modify the thermally conductive filler. At the same time, the thermally conductive filler may also oxidize or decompose, resulting in a significant decline in the material properties. While if the temperature is too low, the moisture on the surface of the thermally conductive filler cannot be fully removed, which will hinder the uniform mixing of the surface modifier and the thermally conductive filler and reduce the mixing effect. 2 - 4 hours (such as 2 hours, 3 hours, or 4 hours) ensures the full removal of moisture, laying a solid foundation for the subsequent preparation of plastic materials with high thermal conductivity, guaranteeing the stability and reliability of product quality, and facilitating the wide application of the materials in fields such as radiators and electronic packaging.

[0014] In one embodiment, the specific steps of S2 are as follows: S21. Weigh the matrix resin by weight parts; S22. Put the weighed matrix resin and the modified thermally conductive filler into a twin-screw extruder for mixing; S23. Put the uniformly mixed matrix resin and the modified thermally conductive filler into a twin-screw extruder for melt blending; S24. Extrude the melt-blended material from the twin-screw extruder, and pelletize it after water cooling or air cooling to obtain the plastic material with excellent thermal conductivity.

[0015] By accurately weighing the matrix resin by weight parts, the formula ratio is ensured to be accurate, providing a stable foundation for the subsequent process and reducing the product quality fluctuations caused by material usage deviations. Put the matrix resin and the modified thermally conductive filler into a twin-screw extruder for mixing and melt blending. The powerful shearing and kneading effects of the twin-screw extruder enable the modified thermally conductive filler to be uniformly dispersed at the microscopic level in the matrix resin, fully exerting the thermal conductivity advantage of the filler and greatly enhancing the thermal conductivity of the material. At the same time, the tight combination also effectively improves the mechanical properties of the material. Extrude the melt-blended material and pelletize it after water cooling or air cooling. This process is not only efficient and fast but also flexible in the cooling method, which can be selected according to the actual production needs, effectively improving the production efficiency. The obtained plastic material has stable quality and uniform particles, is suitable for various molding processes such as injection molding and compression molding, and is widely used in fields such as radiators and electronic packaging, facilitating the high-quality development of related industries.

[0016] In one embodiment, the temperature for mixing the matrix resin and the modified thermal conductive filler in the high-speed mixer in S22 is 18 - 28°C, and the mixing time is 5 - 15 minutes. By mixing the matrix resin and the modified thermal conductive filler in the high-speed mixer at 18 - 28°C (such as 18°C, 20°C, 25°C or 28°C) for 5 - 15 minutes (such as 5 minutes, 8 minutes, 10 minutes or 15 minutes), it has obvious advantages in the material preparation process. Mixing at room temperature of 18 - 28°C avoids additional heating or cooling operations, significantly reduces energy consumption, conforms to the concept of green production and cost reduction and efficiency improvement, and effectively controls production costs. The mixing duration of 5 - 15 minutes allows the matrix resin and the modified thermal conductive filler to come into full contact under high-speed stirring. On the one hand, the modified thermal conductive filler can be preliminarily and evenly distributed in the matrix resin, laying a good foundation for the subsequent melt blending in the twin-screw extruder, making the filler more evenly dispersed at the microscopic level, and greatly improving the thermal conductivity of the material. On the other hand, the two materials are preliminarily combined during the mixing process, enhancing the interfacial interaction force and further improving the mechanical properties of the material.

[0017] In one embodiment, the melt blending temperature of S23 and the extrusion temperature of S24 are 200 - 350°C. By setting the melt blending temperature and the extrusion temperature in the range of 200 - 350°C (such as 200°C, 250°C, 300°C or 350°C), it plays an irreplaceable and crucial role in the material preparation process. Due to the differences in the melting points of various matrix resins, for example, the melting point of polyamide 6 is about 220°C, and the melting point of polycarbonate is about 260°C, this temperature range ensures that the matrix resin can be fully melted. Only when the matrix resin is completely melted can it be uniformly mixed with the thermal conductive filler at the molecular level, and then an efficient heat conduction network can be established, significantly improving the thermal conductivity of the material. At the same time, 200 - 350°C effectively avoids the risk of thermal degradation of most commonly used engineering plastics at high temperatures. If the temperature is too high, the molecular chains of the matrix resin will break, not only changing the molecular structure, causing the material to turn yellow, but also seriously deteriorating the material properties. Some thermal conductive fillers, such as aluminum nitride and boron nitride, are prone to oxidation or decomposition in a high-temperature environment, while this temperature range can prevent their structures from being damaged, ensuring the stability of the material. From a production perspective, this temperature range can keep the material in good fluidity, prevent the matrix resin from being insufficiently melted due to too low temperature, resulting in uneven mixing with the thermal conductive filler, reducing the risk of material blockage in the extruder during the extrusion process, and improving production efficiency. In addition, this temperature range reduces the possibility of harmful gas generation due to the decomposition of the matrix resin and additives, meeting the environmental protection requirements. Description of the Drawings

[0018] Figure 1 It is a schematic flow chart of a preparation method for a plastic material with excellent thermal conductivity; Figure 2 Schematic flow chart for preparing modified thermal conductive filler Figure 3 Schematic flow chart for preparing plastic material with excellent thermal conductivity Specific embodiments

[0019] In order to more clearly understand the above objects, features and advantages of the present invention, the present invention will be further described in detail below with reference to the drawings and specific embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments may be combined with each other

[0020] Many specific details are set forth in the following description in order to fully understand the present invention. However, the present invention may be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited by the specific embodiments disclosed below

[0021] The following describes some embodiments of the present invention with reference to the drawings, a plastic material with excellent thermal conductivity and a method for preparing the same Embodiment

[0022] As Figures 1 to 3 shown, this embodiment discloses a plastic material with excellent thermal conductivity, including matrix resin, thermal conductive filler, surface modifier and dispersant The weight part of the matrix resin is 100 parts The weight part of the thermal conductive filler is 10 - 50 parts The weight part of the surface modifier is 0.5 - 5 parts The weight part of the dispersant is 0.1 - 2 parts

[0023] The present application discloses a plastic material with excellent thermal conductivity. In fields such as heat sinks, electronic packaging, and LED lighting, where high requirements are placed on the thermal conductivity of materials, the application of traditional plastics is severely limited due to their poor thermal conductivity. Although adding thermal conductive fillers can improve the thermal conductivity of plastics, adding a large amount will lead to a decrease in the mechanical properties of the materials and an increase in costs. However, this plastic material with excellent thermal conductivity effectively overcomes these problems. By carefully selecting suitable matrix resins, thermal conductive fillers, and surface modifiers, and optimizing the ratios of the components, while maintaining good mechanical properties, the material achieves a significant increase in the thermal conductivity coefficient. Compared with traditional solutions for improving thermal conductivity, there is no need to add a large amount of fillers, which not only avoids the problem of deterioration of mechanical properties caused by excessive fillers but also reduces the cost of the materials. Based on the above advantages, this plastic material can be widely applied in fields such as heat sinks, electronic packaging, and LED lighting. When applied to heat sinks, it can efficiently conduct heat and improve the heat dissipation efficiency; for electronic packaging, it can ensure the stable operation of electronic products; in the field of LED lighting, it can promptly dissipate the heat generated by LED chips and extend the service life of the lamps. Generally speaking, this material provides a better-performing choice for the development of related industries. By setting the weight portion of the matrix resin to 100 parts, a standardized measurement benchmark is established for the material formula. With this as a reference, the addition amounts of the thermal conductive fillers, surface modifiers, and dispersants can be accurately controlled, achieving a scientific combination of the components in terms of proportion. When an appropriate amount of thermal conductive fillers is matched based on 100 parts of the matrix resin, it not only ensures that the material has good thermal conductivity but also does not damage the mechanical properties due to excessive fillers. In actual production, based on 100 parts of the matrix resin, it helps to accurately control the material quality, ensure the stability and consistency of each batch of products, reduce the production costs caused by formulation errors, and enable the products to exhibit better performance in fields such as heat sinks and electronic packaging. By setting the weight portion of the thermal conductive fillers to 10 - 50 parts (such as 10 parts, 20 parts, 30 parts, 40 parts, or 50 parts), when the content is within this range, supported by the matrix resin, the thermal conductive fillers can effectively form a heat conduction path, significantly increasing the thermal conductivity coefficient of the material and meeting the application requirements in high-heat dissipation demand scenarios such as heat sinks and electronic packaging. At the same time, since no excessive addition is made, it will not cause serious damage to the mechanical properties of the materials, ensuring the structural strength and toughness of the materials in actual use. Moreover, the range of 10 - 50 parts has a certain degree of flexibility, and researchers can accurately adjust the dosage according to the different emphases on thermal conductivity and cost in specific application scenarios, thereby achieving the optimal balance between material performance and cost and providing adapted solutions for diverse industrial applications. By setting the weight portion of the surface modifier to 0.5 - 5 parts (such as 0.5 parts, 0.8 parts, 2 parts, or 5 parts), this dosage of the surface modifier can form a stable coating layer on the surface of the thermal conductive fillers, reducing the agglomeration phenomenon between the fillers and enabling the thermal conductive fillers to be evenly dispersed in the matrix resin. The improvement in the dispersibility of the fillers optimizes the heat conduction path and enhances the thermal conductivity of the material.An appropriate amount of surface modifier improves the interfacial compatibility between the thermal conductive filler and the matrix resin, enabling them to combine tightly, significantly enhancing the mechanical properties of the material, and reducing the risk of performance deterioration caused by the addition of thermal conductive filler. R & D personnel can also flexibly adjust the dosage within the range of 0.5 - 5 parts according to different application scenarios to achieve the best balance between material performance and cost, meeting the diverse industrial production requirements. By setting the weight parts of the dispersant to 0.1 - 2 parts (such as 0.1 part, 0.5 part, 1 part or 2 parts), this dosage of dispersant can adsorb on the surface of the thermal conductive filler, and further inhibit the agglomeration of the thermal conductive filler through electrostatic repulsion and steric hindrance effects. Acting synergistically with the surface modifier, it greatly improves the dispersion uniformity of the thermal conductive filler in the matrix resin, thereby constructing a more efficient heat conduction network and significantly enhancing the thermal conductivity of the material. Moreover, the dispersant can help the matrix resin and the thermal conductive filler achieve better combination, improve the overall stability of the material, and improve its processing performance. For example, during injection molding, it ensures uniform flow of the material, reduces product defects, and guarantees product quality.

[0024] As Figures 1 to 3 shown, in addition to the features of the above embodiments, this embodiment further defines that: the matrix resin is one or a combination of several of polyamide, polycarbonate, polyphenylene sulfide, polyether ether ketone, and liquid crystal polymer. By selecting one or several of polyamide, polycarbonate, polyphenylene sulfide, polyether ether ketone, and liquid crystal polymer as the matrix resin, it is of great significance for improving material performance and expanding application scenarios. Polyamide has excellent wear resistance, self-lubricity, and mechanical strength, and the materials made can operate stably under complex working conditions. Polycarbonate has excellent impact resistance and good dimensional stability, and is suitable for the field of electronic packaging with high precision requirements. Polyphenylene sulfide has outstanding chemical stability and high temperature resistance, which can improve the reliability of materials in harsh environments. Polyether ether ketone has extremely excellent high temperature stability and mechanical properties, which can meet the stringent requirements of high-end industries for materials. Liquid crystal polymer can significantly improve the fluidity of materials, optimize processing performance, and reduce the molding difficulty. Using a combination of the above one or several resins can not only integrate the advantages of each resin, but also precisely control the properties of the material by adjusting the ratio to meet the requirements of different application scenarios. In the field of radiators, a combination with high temperature resistance and good thermal conductivity can be selected; in the field of electronic packaging, a combination with impact resistance and dimensional stability can be emphasized to improve the adaptability of the material and broaden the application range of the material.

[0025] As Figures 1 to 3As shown, in addition to the features of the above embodiments, this embodiment further defines that the thermal conductive filler is one or a combination of several of aluminum nitride, boron nitride, silicon carbide, aluminum oxide, zinc oxide, graphene, and carbon nanotubes. By selecting one or several of aluminum nitride, boron nitride, silicon carbide, aluminum oxide, zinc oxide, graphene, and carbon nanotubes as the thermal conductive filler, the thermal conductivity of the material can be significantly enhanced. Aluminum nitride has high thermal conductivity and good electrical insulation, and is suitable for electronic devices with high requirements for heat dissipation and insulation. Boron nitride not only has excellent thermal conductivity but also has lubricity, which can reduce the friction coefficient of the material. Silicon carbide has high hardness and good thermal conductivity, and can enhance the wear resistance and thermal stability of the material. Aluminum oxide has a relatively low cost and good chemical stability, and is an ideal choice to improve the cost performance of the material. Zinc oxide has antibacterial properties while providing a certain thermal conductivity. Graphene and carbon nanotubes have ultra-high thermal conductivity and good flexibility, and can effectively improve the thermal and mechanical properties of the material. Using one or more thermal conductive fillers in combination can integrate the advantages of each filler, and by adjusting the ratio, precise control of the thermal, mechanical and other properties of the material can be achieved. In the field of heat sinks, selecting high-thermal-conductivity fillers such as aluminum nitride and graphene can greatly improve the heat dissipation efficiency; in the field of electronic packaging, combining with aluminum oxide, boron nitride, etc. can not only ensure the thermal conductivity but also meet the requirements of insulation and stability.

[0026] As Figures 1 to 3 shown, in addition to the features of the above embodiments, this embodiment further defines that the surface modifier is one or a combination of several of silane coupling agents, titanate coupling agents, and aluminate coupling agents. By selecting one or several of silane coupling agents, titanate coupling agents, and aluminate coupling agents as the surface modifier, it is of great significance to optimize the material properties and reduce the production cost. Silane coupling agents can form chemical bonds between the thermal conductive filler and the matrix resin, improve the interfacial compatibility between the two, and significantly enhance the dispersion of the thermal conductive filler in the matrix resin. When combined with thermal conductive fillers such as aluminum nitride and silicon carbide, it can evenly disperse the fillers and build an efficient heat conduction network, enhancing the thermal conductivity of the material. Titanate coupling agents can not only promote the dispersion of fillers but also reduce the viscosity of the material system and improve the processing performance of the material. During the injection molding process, the material can flow more smoothly, reducing molding defects. Aluminate coupling agents are relatively inexpensive, and while enhancing the interfacial bonding force, they effectively reduce the material cost, especially suitable for large-scale production scenarios sensitive to costs.

[0027] As Figures 1 to 3As shown, in addition to the features of the above embodiments, this embodiment further defines that the dispersant is one or a combination of polyethylene wax, polypropylene wax, stearic acid, calcium stearate, and zinc stearate. By selecting one or several of polyethylene wax, polypropylene wax, stearic acid, calcium stearate, and zinc stearate as the dispersant, an excellent dispersing effect can be exerted in the material system. Taking polyethylene wax and polypropylene wax as examples, they have good lubricity and low surface energy, can form a protective film on the surface of the thermal conductive filler, and effectively prevent filler agglomeration through steric hindrance effect, so that the thermal conductive filler is evenly dispersed in the matrix resin, constructing a more efficient heat conduction path and significantly improving the thermal conductivity of the material. Stearic acid, calcium stearate, and zinc stearate can improve the processing performance of the material while improving the dispersibility. During high-temperature processing, they reduce the viscosity of the material, make the material flow more smoothly, reduce molding defects, and improve product quality. Moreover, these dispersants are widely sourced and relatively low in cost, and can be flexibly combined according to different application scenarios and cost requirements, effectively controlling production costs on the premise of ensuring material performance. Example

[0028] As Figures 1 to 3 shown, this embodiment discloses a preparation method of a plastic material with excellent thermal conductivity, and the method includes the following steps: S1. Prepare modified thermal conductive filler; S2. Mix the modified thermal conductive filler with the matrix resin to obtain a plastic material with excellent thermal conductivity; The specific steps of S1 are as follows: S11. Weigh the thermal conductive filler, surface modifier, and dispersant according to parts by weight; S12. Put the weighed thermal conductive filler, surface modifier, and dispersant into a high-speed mixer for mixing; S13. Dry the evenly mixed thermal conductive filler, surface modifier, and dispersant to remove moisture and obtain the modified thermal conductive filler.

[0029] The second aspect of this application discloses a preparation method of a plastic material with excellent thermal conductivity. By modifying the thermal conductive filler, the compatibility between the filler and the matrix resin is greatly improved. This not only significantly enhances the dispersion uniformity of the thermal conductive filler in the matrix resin, but also helps to build an efficient heat conduction network, remarkably enhancing the thermal conductivity of the material. Directly mixing the modified thermal conductive filler with the matrix resin has a simple and efficient process, effectively shortening the preparation cycle, reducing the complexity of the production process, decreasing the energy consumption and cost caused by the complex process, and greatly improving the production efficiency. In addition, this method has good flexibility and controllability. By adjusting the modification method and the raw material ratio, it can meet the different performance requirements of different application scenarios. Whether it is a radiator with extremely high heat dissipation requirements or the electronic packaging field with strict requirements for performance stability, the plastic material produced by this preparation method can be perfectly adapted, providing strong support for the industrial development. By accurately weighing the thermal conductive filler, surface modifier and dispersant by weight parts, it provides an accurate raw material ratio for the subsequent steps, ensuring that each component plays the best role and avoiding fluctuations in material performance caused by material errors. Put the weighed raw materials into a high-speed mixer. High-speed mixing can quickly break the agglomeration between each component with its strong stirring force, achieving uniform dispersion. The surface modifier can fully act on the surface of the thermal conductive filler, reducing its surface energy and greatly improving the compatibility between the thermal conductive filler and the matrix resin. The dispersant further prevents the filler from agglomerating again through electrostatic repulsion and steric hindrance effects, creating conditions for building an efficient heat conduction network. Dry the mixed material to remove moisture. The presence of moisture will affect the heat conduction performance of the material and may also cause defects such as bubbles and cracks during the molding process. The drying treatment effectively solves these problems, improving the stability and reliability of the material.

[0030] Such as Figure 1 And Figure 2As shown, in addition to the features of the above embodiments, this embodiment further defines that: the temperature of mixing the thermal conductive filler, the surface modifier, and the dispersant in the S12 in a high-speed mixer is 18 - 28°C, and the mixing time is 5 - 15 minutes. By mixing the thermal conductive filler, the surface modifier, and the dispersant at 18 - 28°C (such as 18°C, 20°C, 25°C, or 28°C) for 5 - 15 minutes (such as 5 minutes, 8 minutes, 10 minutes, or 15 minutes), while ensuring the mixing effect, significant advantages are demonstrated. Mixing at 18 - 28°C avoids the investment in additional heating or cooling equipment, greatly reduces energy consumption, conforms to the current concept of green production, and reduces production costs. The mixing duration of 5 - 15 minutes, while ensuring sufficient mixing, effectively avoids the negative effects brought by overmixing. During this time period, the powerful stirring force of the high-speed mixer enables the surface modifier to be fully adsorbed on the surface of the thermal conductive filler, significantly improving its compatibility with the matrix resin. The dispersant can also prevent the aggregation of the filler by means of electrostatic repulsion and steric hindrance, helping to build an efficient heat conduction network.

[0031] As Figure 1 and Figure 2 As shown, in addition to the features of the above embodiments, this embodiment further defines that: the drying temperature of the thermal conductive filler, the surface modifier, and the dispersant after being uniformly mixed in the S13 is 80 - 120°C, and the drying time is 2 - 4 hours. By drying at 80 - 120°C for 2 - 4 hours, there are multiple significant advantages. In this temperature range, the moisture on the surface of the thermal conductive filler can be effectively removed. If moisture remains in the material, it will seriously affect the heat conduction efficiency and may also cause problems such as pores and cracks in the subsequent processing of the material. 80 - 120°C (such as 80°C, 90°C, 100°C, or 120°C) is much lower than the decomposition temperature of the surface modifier, which not only avoids the decomposition and failure of the surface modifier during drying but also prevents the structure of the thermal conductive filler from being damaged. Once the drying temperature is too high, the surface modifier decomposes, and it cannot effectively modify the thermal conductive filler. At the same time, the thermal conductive filler may be oxidized or decomposed, resulting in a significant decline in the material properties. While if the temperature is too low, the moisture on the surface of the thermal conductive filler cannot be fully removed, which will hinder the uniform mixing of the surface modifier and the thermal conductive filler and reduce the mixing effect. 2 - 4 hours (such as 2 hours, 3 hours, or 4 hours) ensures the full removal of moisture, laying a solid foundation for the subsequent preparation of plastic materials with high thermal conductivity, ensuring the stability and reliability of product quality, and helping the materials to be widely used in fields such as radiators and electronic packaging.

[0032] As Figure 1 and Figure 3 As shown, in addition to the features of the above embodiments, this embodiment further defines that the specific steps of the S2 are as follows: S21. Weigh the matrix resin by weight parts; S22. Put the weighed matrix resin and the modified thermal conductive filler into a twin-screw extruder for mixing; S23. Put the uniformly mixed matrix resin and the modified thermal conductive filler into a twin-screw extruder for melt blending; S24. Extrude the melt-blended material from the twin-screw extruder, cool it by water cooling or air cooling and then pelletize it to obtain the plastic material with excellent thermal conductivity.

[0033] By accurately weighing the matrix resin by weight parts, the formula ratio is ensured to be accurate, providing a stable basis for subsequent processes and reducing product quality fluctuations caused by material deviation. Put the matrix resin and the modified thermal conductive filler into a twin-screw extruder for mixing and melt blending. The powerful shearing and mixing effects of the twin-screw extruder enable the modified thermal conductive filler to be uniformly dispersed at the microscopic level in the matrix resin, giving full play to the thermal conductivity advantage of the filler and greatly improving the thermal conductivity of the material. At the same time, the tight combination also effectively improves the mechanical properties of the material. Extrude the melt-blended material, cool it by water cooling or air cooling and then pelletize it. This process is not only efficient and fast, but also the cooling method is flexible and can be selected according to actual production needs, effectively improving production efficiency. The obtained plastic material has stable quality and uniform particles, is suitable for various molding processes such as injection molding and compression molding, and is widely used in fields such as radiators and electronic packaging, contributing to the high-quality development of related industries.

[0034] Such as Figure 1 and Figure 3 As shown, in addition to the features of the above embodiments, this embodiment further defines that: the temperature for mixing the matrix resin and the modified thermal conductive filler in S22 in a high-speed mixer is 18 - 28 °C, and the mixing time is 5 - 15 minutes. By mixing the matrix resin and the modified thermal conductive filler in a high-speed mixer at 18 - 28 °C (such as 18 °C, 20 °C, 25 °C or 28 °C) for 5 - 15 minutes (for example, 5 minutes, 8 minutes, 10 minutes or 15 minutes), there are obvious advantages in the material preparation process. Mixing at room temperature of 18 - 28 °C avoids additional heating or cooling operations, significantly reduces energy consumption, conforms to the concept of green production and cost reduction and efficiency improvement, and effectively controls production costs. The mixing duration of 5 - 15 minutes allows the matrix resin and the modified thermal conductive filler to be in full contact under high-speed stirring. On the one hand, the modified thermal conductive filler can be initially uniformly distributed in the matrix resin, laying a good foundation for the subsequent melt blending in the twin-screw extruder, making the filler more uniformly dispersed at the microscopic level and greatly improving the thermal conductivity of the material. On the other hand, the two materials are initially combined during the mixing process, enhancing the interfacial force and further improving the mechanical properties of the material.

[0035] Such as Figure 1 and Figure 3As shown, in addition to the features of the above embodiments, this embodiment further defines that the melt blending temperature of S23 and the extrusion temperature of S24 are 200 - 350 °C. By setting the melt blending temperature and the extrusion temperature in the range of 200 - 350 °C (such as 200 °C, 250 °C, 300 °C or 350 °C), it plays an irreplaceable and crucial role in the material preparation process. Due to the differences in the melting points of various matrix resins, for example, the melting point of polyamide 6 is about 220 °C and the melting point of polycarbonate is about 260 °C, this temperature range ensures that the matrix resin can be fully melted. Only when the matrix resin is completely melted can it be uniformly mixed with the thermal conductive filler at the molecular level, thereby establishing an efficient heat conduction network and significantly improving the thermal conductivity of the material. At the same time, 200 - 350 °C effectively avoids the risk of thermal degradation of most commonly used engineering plastics at high temperatures. If the temperature is too high, the molecular chains of the matrix resin will break, not only changing the molecular structure, causing the material to turn yellow in color, but also seriously deteriorating the material properties. Some thermal conductive fillers, such as aluminum nitride and boron nitride, are prone to oxidation or decomposition in a high-temperature environment, while this temperature range can prevent their structures from being damaged and ensure the stability of the material. From a production perspective, this temperature range can keep the material in good fluidity, prevent the incomplete melting of the matrix resin due to too low temperature, resulting in uneven mixing with the thermal conductive filler, reduce the risk of material blockage in the extruder during the extrusion process, and improve production efficiency. In addition, this temperature range reduces the possibility of harmful gas generation due to the decomposition of the matrix resin and additives, meeting the environmental protection requirements.

[0036] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as falling within the scope described in this specification.

[0037] The above-described embodiments merely represent several implementation manners of the present invention. Their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A plastic material with excellent thermal conductivity, characterized in that: The plastic material with excellent thermal conductivity comprises a base resin, a thermal conductive filler, a surface modifier and a dispersant; The weight portion of the base resin is 100 parts; The weight portion of the thermally conductive filler is 10-50 parts; The weight portion of the surface modifier is 0.5-5 parts; The weight portion of the dispersant is 0.1-2 parts.

2. The plastic material with excellent thermal conductivity according to claim 1, characterized in that: The matrix resin is one or a combination of polyamide, polycarbonate, polyphenylene sulfide, polyetheretherketone and liquid crystal polymer.

3. The plastic material with excellent thermal conductivity according to claim 1, characterized in that: The thermal conductive filler is one or a combination of aluminum nitride, boron nitride, silicon carbide, aluminum oxide, zinc oxide, graphene and carbon nanotubes.

4. The plastic material with excellent thermal conductivity according to claim 1, characterized in that: The surface modifier is one or a combination of silane coupling agent, titanate coupling agent, and aluminate coupling agent; And / or the dispersant is one or a combination of polyethylene wax, polypropylene wax, stearic acid, calcium stearate, and zinc stearate.

5. A method for preparing a plastic material with excellent thermal conductivity, characterized in that: The method for preparing the plastic material with excellent thermal conductivity comprises the following steps: S1. preparing a modified thermally conductive filler; S2, mixing the modified thermally conductive filler with a matrix resin to obtain a plastic material with excellent thermal conductivity; The specific steps of S1 are as follows: S11, weighing a thermal conductive filler, a surface modifier and a dispersant according to parts by weight; S12, putting the weighed thermal conductive filler, the surface modifier and the dispersant into a high-speed mixer for mixing; S13, drying the uniformly mixed thermally conductive filler, the surface modifier and the dispersant to remove moisture and obtain the modified thermally conductive filler.

6. The plastic material with excellent thermal conductivity according to claim 5, characterized in that: The thermal conductive filler, the surface modifier and the dispersant in S12 are mixed in a high-speed mixer at a temperature of 18-28° C. and a mixing time of 5-15 minutes.

7. The plastic material with excellent thermal conductivity according to claim 5, characterized in that: The drying temperature of the uniformly mixed thermal conductive filler, the surface modifier and the dispersant in S13 is 80-120° C., and the drying time is 2-4 hours.

8. The plastic material with excellent thermal conductivity according to claim 5, characterized in that: The specific steps of S2 are as follows: S21, weighing the base resin in parts by weight; S22, putting the weighed base resin and the modified thermal conductive filler into a twin-screw extruder for mixing; S23, putting the uniformly mixed base resin and the modified thermally conductive filler into a twin-screw extruder for melt blending; S24, extruding the melt-blended material from a twin-screw extruder, and pelletizing it after water cooling or air cooling to obtain the plastic material with excellent thermal conductivity.

9. The plastic material with excellent thermal conductivity according to claim 8, characterized in that: The base resin and the modified thermally conductive filler in the S22 are mixed in a high-speed mixer at a temperature of 18-28° C. and a mixing time of 5-15 minutes.

10. The plastic material with excellent thermal conductivity according to claim 8, characterized in that: The melt blending temperature of S23 and the extrusion temperature of S24 are 200-350°C.

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