High-toughness high-temperature-resistant masking tape and preparation method thereof

Abstract

The invention relates to a high-toughness high-temperature-resistant masking tape and a preparation method thereof. Styrene-butadiene latex and neoprene latex are adopted to soak the masking paper and then are dried, and the two kinds of latex are matched to improve the mechanical property. Polyamide polyamine epichlorohydrin resin (PAE) is introduced to enhance wet strength and water resistance, melamine formaldehyde resin (MF) improves high temperature resistance and is flame-retardant, polyimide (PI) or polyether-ether-ketone (PEEK) further enhances extreme high temperature resistance, and at the same time, electrical insulation and chemical corrosion resistance are improved. And the nano reinforced material obviously improves the strength and toughness and prolongs the service life. And the crosslinking accelerator accelerates the crosslinking reaction and improves the heat resistance and chemical stability. According to the preparation method, segmented curing, low-temperature pre-curing, medium-temperature curing and high-temperature final curing are adopted to ensure that the components are completely cured, a stable cross-linked network structure is formed, the high-temperature resistance and stability are improved, internal stress and defects are reduced, the quality of the adhesive tape is improved, and the service life of the adhesive tape is prolonged. The adhesive tape has the advantages of excellent high temperature resistance, high toughness and wide applicability.

Description

Technical Field

[0001] The present invention belongs to the technical field of tapes, and particularly relates to a high-toughness and high-temperature-resistant masking tape and a preparation method thereof. Background Art

[0002] As an indispensable fixing and shielding tool in daily life and work, tapes are subdivided into various types such as high-temperature tapes, double-sided tapes, insulating tapes, special tapes, masking pressure-sensitive tapes, and die-cut tapes according to their functional characteristics, and are widely used in different fields and scenarios. Masking tapes, refined from their core materials - masking paper and pressure-sensitive adhesives, are finally made into a roll shape by uniformly coating a pressure-sensitive adhesive on the surface of the masking paper and applying an anti-sticking treatment on the other side, and are widely used in many industries such as decoration, painting masking, baking paint protection, and semiconductor component fixing.

[0003] During the production process, the base paper of masking paper is often impregnated with pure acrylate resin or styrene-acrylate resin. However, this process makes the masking tape brittle and easy to break at low temperatures, which brings inconvenience to construction operations. At the same time, most of its adhesive components are acrylate-based pressure-sensitive adhesives, and this choice limits the performance of masking tapes in high-temperature environments and is difficult to meet the requirements of high-temperature application scenarios such as high-temperature baking paint.

[0004] Especially in the field of electronic products, with the miniaturization of product volume and the improvement of integration, a large amount of heat will be generated during the operation of the circuit board, resulting in a significant increase in internal temperature. If the tape used lacks good high-temperature resistance, the masking tape is prone to problems such as degumming and cracking under high-temperature action, which will damage the circuit board. Therefore, developing a masking tape with excellent high-temperature resistance has become a key problem to be solved urgently.

[0005] The above information disclosed in the above background art part is only used to strengthen the understanding of the background art of the technology described in this article. Therefore, the background art may contain certain information that is not known prior art to those skilled in the art. Summary of the Invention

[0006] In order to solve the defects existing in the above-mentioned prior art, the present invention proposes a high-toughness and high-temperature-resistant masking tape and a preparation method thereof.

[0007] The technical solution adopted by the present invention is as follows:

[0008] A high-toughness and high-temperature-resistant masking paper tape, comprising a release layer, a base paper layer, a primer layer, and an adhesive layer arranged in sequence. The base paper layer is impregnated with an impregnating material required for rubber and plastics with good toughness. The impregnating material includes: 20-40% styrene-butadiene latex, 5-20% chloroprene latex, 1-5% polyamide polyamine epichlorohydrin resin, 1-3% melamine formaldehyde resin, 5-20% polyimide or polyether ether ketone, 0.5-1% nano-enhancing material, 0.05-0.2% crosslinking promoter, and deionized water.

[0009] Further, the release layer selects a light-release organic fluorine-based release agent.

[0010] Further, the primer layer uses a modified organic primer with good sealing effect; nano-fillers or inorganic fibers are added to the primer layer.

[0011] Further, the adhesive uses an epoxy-modified silicone pressure-sensitive adhesive, and the dosage of epoxy resin is 1-5%; an appropriate amount of toughening agent is added to the adhesive.

[0012] Further, the solid content of the styrene-butadiene latex is 48-50%, and it is diluted in a ratio of styrene-butadiene latex: deionized water = 1:2, and the dosage after dilution is 20-40%;

[0013] The solid content of the chloroprene latex is 48-50%, and it is diluted in a ratio of chloroprene latex: deionized water = 1:2, and the dosage after dilution is 5-20%;

[0014] The dosage of the melamine formaldehyde resin is 1-3% of the paper weight;

[0015] The polyamide polyamine epichlorohydrin resin is 1-5% of the paper weight;

[0016] The nano-enhancing material is 0.5-1% of the paper weight;

[0017] The dosage of the crosslinking promoter is 0.05-0.2% of the volume of the entire impregnating solution.

[0018] Further, the nano-enhancing material adopts one or a combination of more of nano-aluminum oxide, nano-silicon carbide, and nano-silicon nitride.

[0019] Further, the crosslinking promoter adopts one or a combination of more of dimethylaniline and triethylamine;

[0020] It also includes: a multi-functional crosslinking agent, which adopts one or a combination of more of multi-functional epoxy resin, multi-functional polyurethane, and multi-functional acrylate.

[0021] A preparation method of a high-toughness and high-temperature-resistant masking paper tape includes the following steps:

[0022] Preparation of masking paper base paper: Immerse the masking paper with a basis weight of 100 g / m2 into the impregnating solution for 10 minutes. After impregnation, take out the masking paper and remove the excess impregnating solution. Place the masking paper in an oven for three-stage curing.

[0023] After curing is completed, dry it by ventilation drying at 80°C for 2 hours to form. After forming, the thickness of the base paper is 0.12 - 0.13 mm, the mass is 120 - 140 g / m2, the tensile strength is 3.81 N / mm, and the elongation at break is 13.6%.

[0024] S2 Release layer coating: Coat the organic fluorine-based release agent on one side of the masking paper through a gravure roll coater, with a coating thickness of 3 - 5 microns, a drying temperature of 150°C, and a passing time through the drying tunnel of 4 minutes. After completion, test the release force to be 3 - 10 gf / 25 mm.

[0025] S3 Primer coating: Coat the organic primer on the other side of the masking paper through a gravure roll coater, with a coating thickness of 3 - 5 microns, a drying temperature of 100°C, and a passing time through the drying tunnel of 2 minutes.

[0026] S4 Adhesive coating: Coat the modified organic silicone adhesive on the primer side of the masking paper through a knife coater, with a coating thickness of 28 - 32 microns, a drying temperature of 160°C, and a passing time through the drying tunnel of 4 minutes.

[0027] Furthermore, the three-stage curing process in step S1 specifically includes:

[0028] Low-temperature pre-curing stage: Perform pre-curing at 60 - 80°C for about 1 to 2 hours to initially cure the resin or adhesive in the impregnated material and form a preliminary cross-linked network.

[0029] Medium-temperature curing stage: Perform post-secondary curing at 80°C to 120°C for about 2 to 4 hours to further promote the cross-linking reaction and enhance the cross-linking density and heat resistance of the material.

[0030] High-temperature final curing stage: 120°C to 200°C, for about 1 to 3 hours, to ensure that the cross-linking reaction proceeds completely and achieve the best curing effect.

[0031] Furthermore, the preparation steps of the impregnating solution are as follows:

[0032] A. Accurately weigh each raw material according to the formula ratio to ensure that all raw materials are dry and pollution-free.

[0033] B. In a suitable container, first add deionized water, and then sequentially add the diluted styrene-butadiene latex and chloroprene latex. Use a high-speed shear mixer or an ultrasonic disperser to mix and disperse to ensure that the latex particles are evenly dispersed in water.

[0034] C. Add melamine formaldehyde resin and polyamide polyamine epichlorohydrin resin, and continue stirring until the resin is completely dissolved;

[0035] D. Finally, add nano-aluminum oxide and dimethylaniline, and continue stirring until all raw materials are evenly mixed.

[0036] In summary, due to the adoption of the above technical solutions, the beneficial effects of the present invention are as follows:

[0037] 1. Since the present invention impregnates the masking tape in the impregnating solution and then dries it, and since styrene-butadiene latex and chloroprene latex are contained in the impregnating solution, the viscous latex can adhere other raw materials to the masking tape. The two latexes cooperate with each other to improve various mechanical properties of the masking tape; the introduction of polyamide polyamine epichlorohydrin resin (PAE) significantly improves the wet strength and water resistance of the tape, enabling the tape to maintain a stable sticking effect even in a humid environment. By closely combining with fibers, the overall mechanical properties of the tape are enhanced, and the peel strength is improved. The introduction of melamine formaldehyde resin (MF) significantly enhances the high-temperature resistance of the tape, enabling it to maintain stable performance for a long time in a high-temperature environment. Provide flame retardant protection, reduce the fire risk, and improve the safety of the tape. The introduction of polyimide (PI) or polyether ether ketone (PEEK) further enhances the high-temperature resistance of the tape, especially the high melting points of PI and PEEK enable the tape to withstand extreme high temperatures. Improve the electrical insulation performance and chemical corrosion resistance, and broaden the application range of the tape. The strengthening effect of introducing nano-enhancing materials: significantly improve the strength and toughness of the tape, enabling it to withstand greater external forces and stresses. Improve the abrasion resistance and scratch resistance, and extend the service life of the tape. The optimization effect of introducing crosslinking accelerators: accelerate the crosslinking reaction and improve production efficiency. Increase the crosslinking degree, form a more compact and stable crosslinked network structure, and improve the heat resistance and chemical stability.

[0038] 2. Adopt the method of segmented curing. In the low-temperature pre-curing stage: initially cure the resin and other components in the tape to form a certain crosslinked network structure, laying a foundation for subsequent curing. In the medium-temperature curing stage: further promote the crosslinking reaction to enhance the strength and toughness of the tape. In the high-temperature final curing stage: ensure that all components in the tape are completely cured to form a stable and dense crosslinked network structure, significantly improving the high-temperature resistance and stability of the tape. The three-stage curing process can also reduce the internal stress and defects during the curing process, and improve the quality and service life of the tape. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The present invention will be described by way of examples with reference to the accompanying drawings, where:

[0040] Figure 1 is a schematic structural diagram of the high-toughness and high-temperature resistant masking tape in the present invention;

[0041] Figure 2 This is a flow chart of the preparation method of the high-toughness and high-temperature-resistant masking tape in the present invention.

[0042] Reference numerals: release layer - 1, base paper layer - 2, primer layer - 3, and adhesive layer - 4. Detailed implementation manners

[0043] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part rather than all of the embodiments of the present application. Usually, the components of the embodiments of the present application described and illustrated herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application claimed, but merely represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of protection of the present application.

[0044] Embodiment

[0045] The sources and model selections of the components in Embodiments 1 - 3 are as follows:

[0046] Styrene-butadiene latex

[0047] Companies: Shell Chemical Co., Phillips Petroleum Co., etc.;

[0048] Models: Solprene X-30, Solprene X-40, Solprene-1204, etc. (specific models need to be selected according to the solid content and performance requirements).

[0049] Chloroprene latex

[0050] Companies: Changshou Chemical Plant (Changshou Brand), Qingdao Chemical Plant, etc.;

[0051] Models: LCR-401, LCR-TY-50, etc. (specific models need to be selected according to the solid content and performance requirements).

[0052] Polyamide polyamine epichlorohydrin resin

[0053] Companies: Produced by many chemical raw material manufacturers, and specific selections need to be made according to market demand and supplier situations;

[0054] Models: Vary depending on different manufacturers and need to be selected according to specific performance requirements.

[0055] Melamine formaldehyde resin

[0056] Company: Produced by multiple resin manufacturers such as Dow Chemical, BASF, etc.;

[0057] Model: Varies depending on different manufacturers and needs to be selected according to specific performance requirements.

[0058] Polyimide (PI) or polyetheretherketone (PEEK)

[0059] Company: Such as DuPont in the United States, Kaneka Chemical in Japan, BASF in Germany, etc.;

[0060] Model: Varies depending on different manufacturers and performance requirements, such as DuPont's Kapton series PI, Kaneka Chemical's PEEK series, etc.

[0061] Nano-enhanced materials

[0062] Company: Nano material manufacturers such as Nano New Materials (Suzhou) Co., Ltd., Shenzhen Nano Port Co., Ltd., etc.;

[0063] Model: Nano-aluminum oxide (Al 2 O 3 ), nano-silicon carbide (SiC), nano-silicon nitride (Si 3 N 4 ), etc. The specific model needs to be selected according to performance requirements.

[0064] Crosslinking accelerator

[0065] Company: Chemical reagent manufacturers such as Sinopharm Chemical Reagent Co., Ltd., Aladdin Reagent (Shanghai) Co., Ltd., etc.;

[0066] Model: Dimethylaniline, triethylamine, etc. The specific model needs to be selected according to performance requirements (usually these chemicals are sold in pure form or in solution form at a certain concentration).

[0067] Multi-functional crosslinking agent

[0068] Company: Manufacturers of epoxy resins, polyurethanes, acrylates, etc., such as BASF, Dow Chemical, Huntsman, etc.;

[0069] Model: Multi-functional epoxy resins (such as E-51, E-44, etc.), multi-functional polyurethanes (such as multi-functional polyurethane prepolymers made from basic raw materials such as MDI, TDI, etc.), multi-functional acrylates (such as resins or monomers containing multiple acrylate functional groups), etc. The specific model needs to be selected according to performance requirements.

[0070] Materials for release layer 1 and primer layer 3

[0071] Company: Manufacturers of release agents and primers such as 3M, Avery Dennison, Toyo Ink, etc.;

[0072] Model: Light release organic fluorine release agent, modified organic primer, etc. The specific model needs to be selected according to performance requirements and supplier situation.

[0073] Adhesive

[0074] Company: Adhesive manufacturers, such as Henkel, Bostik, Dow Corning, etc.

[0075] Model: Epoxy modified silicone pressure sensitive adhesive, etc. The specific model needs to be selected according to performance requirements and supplier situation.

[0076] Example 1

[0077] A high toughness and high temperature resistant masking tape comprises a release layer 1, a base paper layer 2, a primer layer 3 and an adhesive layer 4 arranged in sequence. The base paper layer 2 is impregnated with an impregnating material required for rubber and plastic with good toughness; the impregnating material includes: 20% styrene butadiene latex, 5% chloroprene latex, 1% polyamide polyamine epichlorohydrin resin, 1% melamine formaldehyde resin, 5% polyimide (PI) or polyether ether ketone (PEEK), 0.5% nano-enhancing material, 0.05% crosslinking promoter and deionized water (the balance to 100%).

[0078] The release layer 1 selects a light release organic fluorine release agent with a release force of 1 - 30 gf / 25 mm

[0079] The primer layer 3 uses a modified organic primer with good sealing effect; nano fillers or inorganic fibers, such as nano silica or glass fiber, are added to the primer layer 3 to enhance the adhesion and mechanical strength of the primer layer 3

[0080] The adhesive uses an epoxy modified silicone pressure sensitive adhesive with an epoxy resin dosage of 1 - 5%; an appropriate amount of toughening agent, such as elastomer particles or thermoplastic elastomer, is added to the adhesive to improve the toughness and impact resistance of the adhesive layer 4

[0081] The nano-enhancing material adopts one or a combination of nano alumina (Al 2 O 3 ), nano silicon carbide (SiC) or nano silicon nitride (Si 3 N 4 )

[0082] The crosslinking promoter adopts one or a combination of dimethylaniline and triethylamine; it also includes: a multi-functional crosslinking agent, which adopts one or a combination of multi-functional epoxy resin, multi-functional polyurethane and multi-functional acrylate.

[0083] Example 2

[0084] A high-toughness and high-temperature-resistant masking tape comprises a release layer 1, a base paper layer 2, a primer layer 3, and an adhesive layer 4 arranged in sequence. The base paper layer 2 is impregnated with an impregnating material required for rubber and plastics with good toughness; the impregnating material includes: 30% styrene-butadiene latex, 15% chloroprene latex, 3% polyamide polyamine epichlorohydrin resin, 2% melamine formaldehyde resin, 15% polyimide (PI) or polyether ether ketone (PEEK), 0.8% nano-enhancing material, 0.15% crosslinking accelerator, and deionized water (the balance to 100%).

[0085] The release layer 1 selects a light-release organofluorine release agent, and the release force is 1-30 gf / 25 mm

[0086] The primer layer 3 uses a modified organic primer with good sealing effect; nano-fillers or inorganic fibers, such as nano-silica or glass fiber, are added to the primer layer 3 to enhance the adhesion and mechanical strength of the primer layer 3

[0087] The adhesive uses an epoxy-modified silicone pressure-sensitive adhesive, and the amount of epoxy resin is 1-5%; an appropriate amount of toughening agent, such as elastomer particles or thermoplastic elastomer, is added to the adhesive to improve the toughness and impact resistance of the adhesive layer 4

[0088] The nano-enhancing material uses one or a combination of nano-aluminum oxide (Al 2 O 3 ), nano-silicon carbide (SiC), or nano-silicon nitride (Si 3 N 4 )

[0089] The crosslinking accelerator uses one or a combination of dimethylaniline and triethylamine; it also includes: a multi-functional crosslinking agent, which uses one or a combination of multi-functional epoxy resin, multi-functional polyurethane, and multi-functional acrylate

[0090] Example 3

[0091] A high-toughness and high-temperature-resistant masking tape comprises a release layer 1, a base paper layer 2, a primer layer 3, and an adhesive layer 4 arranged in sequence. The base paper layer 2 is impregnated with an impregnating material required for rubber and plastics with good toughness; the impregnating material includes: 40% styrene-butadiene latex, 20% chloroprene latex, 5% polyamide polyamine epichlorohydrin resin, 3% melamine formaldehyde resin, 20% polyimide (PI) or polyether ether ketone (PEEK), 1% nano-enhancing material, 0.2% crosslinking accelerator, and deionized water (the balance to 100%).

[0092] The release layer 1 selects a light-release organofluorine release agent, and the release force is 1-30 gf / 25 mm

[0093] The bottom coating 3 uses a modified organic primer with good sealing effect; nano fillers or inorganic fibers, such as nano silica or glass fiber, are added to the bottom coating 3 to enhance the adhesion and mechanical strength of the bottom coating 3

[0094] The adhesive uses an epoxy-modified silicone pressure-sensitive adhesive, and the dosage of epoxy resin is 1-5%; an appropriate amount of toughening agent, such as elastomer particles or thermoplastic elastomer, is added to the adhesive to improve the toughness and impact resistance of the adhesive layer 4

[0095] The nano-enhancing material uses one or a combination of nano alumina (Al 2 O 3 ), nano silicon carbide (SiC) or nano silicon nitride (Si 3 N 4 )

[0096] The crosslinking accelerator uses one or a combination of dimethylaniline and triethylamine; it also includes: a multi-functional crosslinking agent, which uses one or a combination of multi-functional epoxy resin, multi-functional polyurethane and multi-functional acrylate

[0097] Table 1 Raw material ratio of the impregnating solution in Examples 1-3

[0098]

[0099] The high-toughness and high-temperature masking tape in Examples 1-3 is prepared by the following method

[0100] S1 Masking paper base paper preparation: Immerse the masking paper with a basis weight of 100 g / m2 into the impregnating solution for 10 minutes. After impregnation, take out the masking paper and remove the excess impregnating solution; place the masking paper in an oven for three-stage curing; (Using the method of segmented curing, first perform low-temperature pre-curing to preliminarily shape the material, and then perform high-temperature post-curing to complete the crosslinking reaction. The curing temperature and time should be determined according to the types of crosslinking agent and accelerator and the thickness of the material. At the same time, ensure the air circulation in the oven during the curing process to avoid local overheating resulting in a decline in material performance)

[0101] After curing, dry it at 80°C with ventilation for 2 hours to form. After forming, the thickness of the base paper is 0.12-0.13 mm, the mass is 120-140 g / m2, the tensile strength is 3.81 N / mm, and the elongation at break is 13.6%;

[0102] S2 Release layer 1 coating: Coat the organic fluorine-based release agent on one side of the masking paper through a gravure roll coater, with a coating thickness of 3-5 microns, a drying temperature of 150°C, and a passing time through the drying oven of 4 minutes. After completion, test the release force to be 3-10 gf / 25 mm;

[0103] S3 Primer Coating: Apply an organic primer on the other side of the masking paper through a gravure roll coater. The coating thickness is 3 - 5 microns, the drying temperature is 100°C, and the passing time through the drying oven is 2 min;

[0104] S4 Adhesive Coating: Apply a modified silicone adhesive on the primer side of the masking paper through a knife coater. The coating thickness is 28 - 32 microns, the drying temperature is 160°C, and the passing time through the drying oven is 4 min.

[0105] The three - stage curing process in step S1 specifically includes:

[0106] Low - temperature pre - curing stage: Carry out pre - curing at 60 - 80°C for about 1 to 2 hours to preliminarily cure the resin or adhesive in the impregnated material and form a preliminary cross - linked network. The temperature in this stage is relatively low, which can avoid excessive stress inside the material and at the same time enable the material to gradually adapt to the curing process;

[0107] Medium - temperature curing stage: Carry out secondary post - curing at 80°C to 120°C for about 2 to 4 hours to further promote the cross - linking reaction, enhance the cross - linking density and heat resistance of the material. The temperature in this stage is moderate, which can accelerate the diffusion and reaction of the cross - linking agent and at the same time avoid performance degradation caused by overheating of the material;

[0108] High - temperature final - curing stage: 120°C to 200°C, for about 1 to 3 hours, to ensure that the cross - linking reaction proceeds completely and achieve the best curing effect. The temperature in this stage is relatively high, which can accelerate the reaction of the remaining unreacted cross - linking agent and accelerator and at the same time improve the high - temperature resistance and mechanical strength of the material;

[0109] Precautions:

[0110] Heating rate: During the heating process, the heating rate should be controlled to avoid excessive thermal stress inside the material.

[0111] Soaking time: After the end of each temperature stage, a stable temperature should be maintained for a period of time to ensure uniform temperature distribution inside the material and achieve the best curing effect.

[0112] Cooling process: After curing, the temperature should be slowly reduced to room temperature to avoid cracks or performance degradation of the material due to rapid cooling.

[0113] Process adjustment: Specific process parameters should be adjusted according to the type, thickness, required performance of the impregnated material and the conditions of the production equipment. In practical applications, it is recommended to conduct small - batch tests to verify the rationality of the process parameters and make adjustments according to the test results.

[0114] By adopting the above multi-stage curing process parameters, the curing effect of the impregnating material can be optimized, its high temperature resistance and toughness can be improved, and the requirements of a wider range of applications can be met.

[0115] The steps for preparing the impregnating solution are as follows:

[0116] A. Weigh each raw material accurately according to the formula ratio to ensure that all raw materials are dry and pollution-free;

[0117] B. In a suitable container, first add deionized water, and then add the diluted styrene-butadiene latex and chloroprene latex in sequence. Use a high-speed shear mixer or an ultrasonic disperser for mixing and dispersion to ensure that the latex particles are evenly dispersed in water;

[0118] C. Add melamine formaldehyde resin and polyamide polyamine epichlorohydrin resin, and continue stirring until the resin is completely dissolved;

[0119] D. Finally, add nano-aluminum oxide and dimethylaniline, and continue stirring until all raw materials are evenly mixed.

[0120] Comparative Example 1: A method for preparing a high-toughness and high-temperature-resistant masking tape, which is different from Examples 1-3 in that it is prepared according to the traditional method, and the masking tape is not impregnated with the impregnating solution in the present invention and is not cured in a three-stage manner.

[0121] Comparative Example 2: A method for preparing a high-toughness and high-temperature-resistant masking tape, which is different from Examples 1-3 in that styrene-butadiene latex is not added to the components of the impregnating material.

[0122] Comparative Example 3: A method for preparing a high-toughness and high-temperature-resistant masking tape, which is different from Examples 1-3 in that chloroprene latex is not added to the components of the impregnating material.

[0123] Comparative Example 4: A method for preparing a high-toughness and high-temperature-resistant masking tape, which is different from Examples 1-3 in that polyamide polyamine epichlorohydrin resin is not added to the components of the impregnating material.

[0124] Comparative Example 5: A method for preparing a high-toughness and high-temperature-resistant masking tape, which is different from Examples 1-3 in that melamine formaldehyde resin is not added to the components of the impregnating material.

[0125] Comparative Example 6: A method for preparing a high-toughness and high-temperature-resistant masking tape, which is different from Examples 1-3 in that polyimide (PI) or polyether ether ketone (PEEK) is not added to the components of the impregnating material.

[0126] Comparative Example 7: A method for preparing a high-toughness and high-temperature-resistant masking tape, which is different from Examples 1-3 in that nano-enhancing materials are not added to the components of the impregnating material.

[0127] Comparative Example 8: A preparation method of a high-toughness and high-temperature-resistant masking tape, which is different from Examples 1-3 in that no crosslinking accelerator is added to the composition of the impregnating material.

[0128] Performance detection test: Prepare masking tapes according to the methods in Examples 1-3 and Comparative Examples 1-8, and detect the various performances of the masking tapes according to the following standards. The detection results are shown in Table 2:

[0129] High-temperature resistance: According to GB / T2792, prepare two groups of specimens for each example or comparative example. Place the two groups of specimens in a constant-temperature oven at 150°C and keep the temperature constant for 30 minutes. Perform thermal peeling on one group of specimens, and after taking out the other group of specimens, cool them for 2 hours at (23±2)°C and a relative humidity of 60-70%. Conduct a peeling test according to GB / T2792 to detect whether there is residual glue on the steel plate surface and whether the tape is broken.

[0130] Masking tape thickness: The test method is (GB / T 7125-2017);

[0131] Tensile strength (longitudinal): The test method is GB / T 30776-2014;

[0132] Elongation at break (longitudinal): The test method is GB / T 30776-2014;

[0133] Peeling strength: The test method is GB / T 2792-2014.

[0134] Performance test of masking tapes prepared in each example and each comparative example in Table 2

[0135]

[0136]

[0137] It can be seen from the data in Table 2 that the thickness of the masking tapes prepared according to the methods in Examples 1-3 meets the national standards. During the high-temperature resistance test, there is no residual glue, the tape is not broken, the high-temperature resistance performance is good, the tensile strength and elongation at break are large, the toughness is good, the 180° peeling strength is large, and the adhesiveness is good.

[0138] In Comparative Example 1, since the masking paper was not impregnated, it can be seen from the detection data that the 180° peeling force of the masking tape prepared in Comparative Example 1 is not much different from that in Examples 1-3. However, during the high-temperature resistance test, there is residual glue on the steel plate, the tape is broken, and both the tensile strength and elongation at break are poor, indicating that impregnating the masking paper with the impregnating solution can improve the high-temperature resistance performance and toughness of the masking tape.

[0139] In Comparative Example 2, since styrene-butadiene latex was not added to the impregnating solution for impregnating the masking paper, styrene-butadiene latex plays multiple roles in the high-toughness and high-temperature resistant masking paper tape, such as providing excellent toughness, enhancing high-temperature resistance performance, improving waterproof performance, improving adhesion and peel strength, and promoting environmental protection and sustainability. There was residual glue in the high-temperature resistance test of the masking tape prepared in Comparative Example 2, the tape broke, and the performance of the tape such as tensile strength, elongation at break, and 180° peel force was quite different from that of Examples 1-3, indicating that adding styrene-butadiene latex can increase the toughness and high-temperature resistance performance of the masking tape.

[0140] In Comparative Example 3, since neoprene latex was not added to the impregnating solution for impregnating the masking paper, neoprene latex plays multiple roles in the high-toughness and high-temperature resistant masking paper tape, such as improving weather resistance, ozone resistance, abrasion resistance and impact resistance, improving adhesiveness and peel strength, providing oil and chemical resistance performance, and promoting high-temperature resistance performance. There was residual glue in the high-temperature resistance test of the masking tape prepared in Comparative Example 3, the tape broke, and the performance of the tape such as tensile strength, elongation at break, and 180° peel force was quite different from that of Examples 1-3, indicating that adding neoprene latex can increase the high-temperature resistance performance of the masking tape.

[0141] In Comparative Example 4, since polyamide polyamine epichlorohydrin resin was not added to the impregnating solution for impregnating the masking paper, polyamide polyamine epichlorohydrin resin plays multiple roles in the high-toughness and high-temperature resistant masking paper tape, such as enhancing wet strength performance, improving water resistance, increasing adhesion and peel strength, promoting high-temperature resistance performance, and enhancing chemical stability. Therefore, there was residual glue in the high-temperature resistance test of the masking tape prepared in Comparative Example 4, the tape broke, and the performance of the tape such as tensile strength, elongation at break, and 180° peel force was quite different from that of Examples 1-3, indicating that adding styrene-butadiene latex can increase the high-temperature resistance performance of the masking tape.

[0142] In Comparative Example 5, since melamine formaldehyde resin was not added to the impregnating solution for impregnating the masking paper, melamine formaldehyde resin plays multiple roles in the high-toughness and high-temperature resistant masking paper tape, such as enhancing heat resistance, aging resistance, strength and toughness, improving adhesion and peel strength, providing flame retardant performance, and maintaining chemical stability and water resistance. There was residual glue in the high-temperature resistance test of the masking tape prepared in Comparative Example 5, the tape broke, and the performance of the tape such as tensile strength, elongation at break, and 180° peel force was quite different from that of Examples 1-3, indicating that adding styrene-butadiene latex can increase the toughness performance of the masking tape.

[0143] In Comparative Example 6, polyimide (PI) or polyetheretherketone (PEEK) was not added to the impregnating solution for impregnating the masking paper. Polyimide (PI) and polyetheretherketone (PEEK) each have unique functions and effects in the high-toughness and high-temperature resistant masking paper tape. PI is famous for its high temperature resistance, electrical insulation, chemical solvent resistance, etc.; while PEEK is characterized by its excellent high temperature resistance, outstanding mechanical properties and chemical corrosion resistance. There was residual glue in the high temperature resistance test of the masking tape prepared in Comparative Example 6, the tape broke, and the properties such as the tensile strength, elongation at break, and 180° peel force of the tape were quite different from those in Examples 1-3, indicating that adding styrene-butadiene latex can increase the high temperature resistance of the masking tape.

[0144] In Comparative Example 7, nano-enhancing materials were not added to the impregnating solution for impregnating the masking paper. Nano-enhancing materials play multiple roles in the high-toughness and high-temperature resistant masking paper tape, such as significantly improving strength and toughness, enhancing high temperature resistance, improving wear resistance and scratch resistance, enhancing electrical insulation performance, improving chemical corrosion resistance, and promoting environmental protection and sustainability. There was residual glue in the high temperature resistance test of the masking tape prepared in Comparative Example 7, the tape broke, and the properties such as the tensile strength, elongation at break, and 180° peel force of the tape were quite different from those in Examples 1-3, indicating that adding styrene-butadiene latex can increase the toughness and high temperature resistance of the masking tape.

[0145] In Comparative Example 8, a crosslinking accelerator was not added to the impregnating solution for impregnating the masking paper. The crosslinking accelerator plays multiple roles in the high-toughness and high-temperature resistant masking paper tape, such as accelerating the crosslinking reaction, increasing the crosslinking degree, improving the heat resistance performance, optimizing the processing performance, and enhancing the chemical stability. There was residual glue in the high temperature resistance test of the masking tape prepared in Comparative Example 8, the tape broke, and the properties such as the tensile strength, elongation at break, and 180° peel force of the tape were quite different from those in Examples 1-3, indicating that adding styrene-butadiene latex can increase the toughness and high temperature resistance of the masking tape.

[0146] As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-toughness, high-temperature-resistant masking tape, comprising a release layer (1), a base paper layer (2), a primer layer (3) and an adhesive layer (4) arranged in sequence, characterized in that: The base paper layer (2) is impregnated with an impregnation material having good toughness and meeting the requirements of rubber and plastic; the impregnation material comprises: 20-40% styrene-butadiene latex, 5-20% chloroprene latex, 1-5% polyamide-polyamine-epichlorohydrin resin, 1-3% melamine-formaldehyde resin, 5-20% polyimide or polyetheretherketone, 0.5-1% nano-reinforcement material, 0.05-0.2% cross-linking accelerator and deionized water.

2. The high-toughness, high-temperature-resistant masking tape according to claim 1, characterized in that: The release layer (1) is an organic fluorine release agent that allows for easy release.

3. The high-toughness, high-temperature-resistant masking tape according to claim 1, characterized in that: The primer layer (3) uses a modified organic primer with good sealing effect; nano fillers or inorganic fibers are added to the primer layer (3).

4. The high-toughness, high-temperature-resistant masking tape according to claim 1, characterized in that: The adhesive uses epoxy-modified organic silicon pressure-sensitive adhesive, and the amount of epoxy resin used is 1-5%. A toughening agent is added to the adhesive.

5. The high-toughness, high-temperature-resistant masking tape according to claim 1, characterized in that: The solid content of styrene butadiene latex is 48-50%, and it is diluted with styrene butadiene latex: deionized water = 1:2, and the amount after dilution is 20-40%; The solid content of chloroprene latex is 48-50%, and it is diluted with chloroprene latex: deionized water = 1:2, and the amount after dilution is 5-20%; The amount of melamine formaldehyde resin is 1-3% of the paper weight; The polyamide polyamine epichlorohydrin resin is 1-5% by weight of the paper; The nano-reinforcement material is 0.5-1% of the paper weight; The amount of cross-linking accelerator used is 0.05-0.2% of the volume of the entire impregnation solution.

6. The high-toughness, high-temperature-resistant masking tape according to claim 5, characterized in that: The nano-enhanced material is a combination of one or more of nano-aluminum oxide, nano-silicon carbide and nano-silicon nitride.

7. The high-toughness, high-temperature-resistant masking tape according to claim 1, characterized in that: The cross-linking accelerator is a combination of one or more of dimethylaniline and triethylamine; It also includes: a multifunctional cross-linking agent, which is a combination of one or more of a multifunctional epoxy resin, a multifunctional polyurethane and a multifunctional acrylate.

8. A method for preparing a high-toughness, high-temperature-resistant masking tape, characterized in that: The steps include: S1 Preparation of masking paper base paper: soak the masking paper with a basis weight of 100g / m2 into the impregnation liquid for 10 minutes. After the impregnation is completed, take out the masking paper and remove the excess impregnation liquid; place the masking paper in an oven for three-stage curing; after the curing is completed, dry it at 80℃ for 2 hours under ventilation to form it; S2 Release layer (1) coating: the organic fluorine release agent is coated on one side of the textured paper by a gravure roller coater, the coating thickness is 3-5 μm, the drying temperature is 150° C., and the time of passing through the drying tunnel is 4 min; S3 Primer coating: Apply the organic primer on the other side of the textured paper by a gravure roller coater, with a coating thickness of 3-5 microns, a drying temperature of 100°C, and a drying time of 2 minutes; S4 adhesive coating: The modified organic silicone adhesive is coated on the primer side of the masking paper by a scraper coater, the coating thickness is 28-32 microns, the drying temperature is 160°C, and the time through the drying tunnel is 4 minutes.

9. A method for preparing a high-toughness, high-temperature-resistant masking tape, characterized in that: The three-stage curing process specifically includes: Low-temperature pre-curing stage: pre-curing is carried out at 60-80°C for about 1 to 2 hours to initially cure the resin or adhesive in the impregnated material and form a preliminary cross-linking network; In the medium temperature curing stage, post-secondary curing is carried out at 80°C to 120°C for about 2 to 4 hours to further promote the cross-linking reaction and enhance the cross-linking density and heat resistance of the material; The high temperature final curing stage, 120℃ to 200℃, takes about 1 to 3 hours to allow the cross-linking reaction to complete.

10. A high-toughness, high-temperature-resistant masking tape and preparation method according to claim 8, characterized in that: The preparation steps of the impregnation solution are: A. Accurately weigh each raw material according to the formula ratio; B. In a suitable container, first add deionized water, then add the diluted styrene-butadiene latex and chloroprene latex in sequence, and use a high-speed shear mixer or an ultrasonic disperser to mix and disperse to ensure that the latex particles are evenly dispersed in the water; C. Add melamine formaldehyde resin and polyamide polyamine epichlorohydrin resin, and continue stirring until the resin is completely dissolved; D. Finally, add nano-alumina and dimethylaniline and continue stirring until all the raw materials are evenly mixed.

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