Electric card spraying heat exchange assembly and heat exchange system

By using nozzle devices and heat exchange working fluid in electric card refrigeration devices, the problem of poor separation of heat and cooling capacity of electric card refrigeration devices is solved, and more efficient heat and cooling capacity exchange and utilization are achieved.

CN120062865APending Publication Date: 2025-05-30QINGDAO HAIER SMART TECH R & D CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202311542544.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-11-17
Publication Date
2025-05-30

AI Technical Summary

Technical Problem

The existing electric card refrigeration devices have poor separation effect on heat and cooling, resulting in a reduced utilization effect on heat and cooling.

Method used

The nozzle device is used to spray the heat exchange working fluid onto the surface of the electric card refrigeration device. Through the design of the spray chamber and the storage chamber, the heat and cooling capacity exchange between the heat exchange working fluid and the electric card refrigeration device is realized, and the separation and utilization effect of heat and cooling capacity is improved.

Benefits of technology

The heat and cooling capacity exchange effect between the heat exchange working fluid and the electric card refrigeration device is improved, and the utilization effect of the heat and cooling capacity generated by the electric card refrigeration device is enhanced.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120062865A_ABST
    Figure CN120062865A_ABST
Patent Text Reader

Abstract

The invention relates to the technical field of heat exchange, and discloses an electrocaloric spraying heat exchange assembly which comprises a nozzle device, the nozzle device comprises a shell, the shell is provided with a heat exchange working medium inlet and a heat exchange working medium spraying opening, and a distribution cavity close to the heat exchange working medium inlet and a spraying cavity which is close to the heat exchange working medium spraying opening and communicates with the distribution cavity are defined by the shell; the shell is internally provided with a spraying cavity and an electrocaloric refrigeration device which alternately generates heat and cold energy, the shell is further internally provided with a containing cavity communicated with the spraying cavity, and at least part of the electrocaloric refrigeration device is arranged in the containing cavity so that the heat exchange working medium sprayed out of the spraying cavity can exchange with the heat or cold energy generated by the electrocaloric refrigeration device. According to the electrocaloric spraying heat exchange assembly, the heat exchange effect on the electrocaloric refrigeration device is improved. The invention further discloses a heat exchange system.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application relates to the field of heat exchange technology, for example, to an electrocaloric spray heat exchange component and a heat exchange system. Background Art

[0002] Compression refrigeration products use fluorine-containing refrigerants, which will produce the greenhouse effect during production and use and have the risk of leakage and environmental pollution. With the development of modern society, the huge demand for refrigeration has exacerbated the global energy crisis. Therefore, there is an urgent need for a new refrigeration technology to replace the existing refrigeration technology.

[0003] When an electric field is applied to or removed from an electrocaloric material, the electrocaloric material will exhibit endothermic or exothermic phenomena, that is, the electrocaloric effect. Electrocaloric refrigeration devices are a new refrigeration technology based on the electrocaloric effect of electrocaloric materials, which do not need to use the compressors and refrigerants required by common refrigeration technologies, delaying the generation of the greenhouse effect and avoiding the environmental pollution problems caused by refrigerant leakage.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related technologies:

[0005] Currently, for the existing structures of electrocaloric refrigeration devices, the heat and cold of the electrocaloric refrigeration devices need to be separated in order to utilize the heat and cold. However, the separation effect of the heat and cold of the existing electrocaloric refrigeration devices is poor, thus reducing the utilization effect of the heat and cold of the electrocaloric refrigeration devices.

[0006] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of this application, and thus may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention

[0007] To have a basic understanding of some aspects of the disclosed embodiments, a simple summary is given below. This summary is not a general review, nor is it intended to identify key / important constituent elements or delineate the protection scope of these embodiments, but rather serves as a preface to the subsequent detailed description.

[0008] The embodiments of the present disclosure provide an electrocaloric spray component and a heat exchange system, which use the method of spraying a heat exchange working medium to separate the heat and cold in an electrocaloric refrigeration device, improving the separation effect of the heat and cold generated by the electrocaloric refrigeration device, and further improving the utilization effect of the heat and cold generated by the electrocaloric refrigeration device.

[0009] In some embodiments, the electrocaloric spray heat exchange assembly includes: a nozzle device, including a housing, the housing is provided with an inlet for a heat exchange working fluid and a spray port for the heat exchange working fluid, and the housing encloses a distribution cavity near the inlet for the heat exchange working fluid and a spray cavity near the spray port for the heat exchange working fluid and communicating with the distribution cavity; and, an electrocaloric refrigeration device, which alternately generates heat and cold. Wherein, an accommodation cavity communicating with the spray cavity is further provided in the housing, and at least a part of the electrocaloric refrigeration device is arranged in the accommodation cavity, so that the heat exchange working fluid sprayed from the spray cavity exchanges heat or cold with the heat or cold generated by the electrocaloric refrigeration device.

[0010] In some embodiments, the heat exchange system includes the electrocaloric spray heat exchange assembly as described above.

[0011] The electrocaloric spray heat exchange assembly and the heat exchange system provided by the embodiments of the present disclosure can achieve the following technical effects:

[0012] The electrocaloric spray heat exchange assembly provided by the embodiments of the present disclosure uses a nozzle device to spray a heat exchange working fluid onto the surface of the electrocaloric refrigeration device, so that the heat exchange working fluid exchanges heat and cold with the heat and cold generated by the electrocaloric refrigeration device, and takes away the heat and cold generated by the electrocaloric refrigeration device. In this way, the heat exchange effect between the heat exchange working fluid and the heat and cold of the electrocaloric refrigeration device is improved, and further the utilization effect of the heat and cold generated by the electrocaloric refrigeration device is improved.

[0013] The above general description and the following description are only exemplary and explanatory, and are not used to limit the present application. Description of the Drawings

[0014] One or more embodiments are exemplarily illustrated by corresponding drawings. These exemplary illustrations and the drawings do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation, and among them:

[0015] Figure 1 is a schematic structural diagram of an electrocaloric spray heat exchange assembly provided by an embodiment of the present disclosure;

[0016] Figure 2 is a schematic structural diagram of another electrocaloric spray heat exchange assembly provided by an embodiment of the present disclosure;

[0017] Figure 3 is a schematic structural diagram of another electrocaloric spray heat exchange assembly provided by an embodiment of the present disclosure;

[0018] Figure 4 is a schematic structural diagram of another electrocaloric spray heat exchange assembly provided by an embodiment of the present disclosure;

[0019] Figure 5 is a schematic structural diagram of another electrocaloric spray heat exchange assembly provided by an embodiment of the present disclosure;

[0020] Figure 6 It is a schematic structural diagram of another electrocaloric spray heat exchange component provided by an embodiment of the present disclosure;

[0021] Figure 7 It is a schematic structural diagram of another electrocaloric spray heat exchange component provided by an embodiment of the present disclosure;

[0022] Figure 8 It is a schematic diagram of a heat exchange system provided by an embodiment of the present disclosure;

[0023] Figure 9 It is a schematic diagram of another heat exchange system provided by an embodiment of the present disclosure;

[0024] Figure 10 It is a schematic structural diagram of a piezoelectric functional film layer in an electrocaloric element provided by an embodiment of the present disclosure;

[0025] Figure 11 It is a schematic structural diagram of an electrocaloric element provided by an embodiment of the present disclosure;

[0026] Figure 12 It is a flowchart of a preparation method of an electrocaloric element provided by an embodiment of the present disclosure;

[0027] Figure 13 It is a schematic structural diagram of an electrocaloric refrigeration chip provided by an embodiment of the present disclosure;

[0028] Figure 14 It is a schematic diagram of an electrocaloric element in an electrocaloric refrigeration chip being attached to a heat receiving end;

[0029] Figure 15 It is a schematic diagram of an electrocaloric element in an electrocaloric refrigeration chip being attached to a cold receiving end.

[0030] Reference numerals:

[0031] 1: First electrode layer; 11: Electrocaloric refrigeration electrode region; 12: Piezoelectric drive electrode region; 13: Electrode gap;

[0032] 2: Second electrode layer;

[0033] 3: Third electrode layer;

[0034] 4: Piezoelectric functional film layer; 41: Piezoelectric displacement unit; 42: Piezoelectric refrigeration unit; 431: First through - division gap; 432: First through - piezoelectric displacement unit; 433: Second through - division gap;

[0035] 5: Substrate layer;

[0036] 100: Electrocaloric element;

[0037] 201: First clamping skeleton; 202: Second clamping skeleton; 203: First bending gap; 204: Second bending gap; 205: Support skeleton;

[0038] 300: Heat receiving end;

[0039] 400: Cold quantity receiving end;

[0040] 500: Heat source tank; 501: Inlet tank; 502: Outlet tank; 503: Heat source tank inlet pipeline; 5031: First pump body; 5032: First inlet end; 5033: Second inlet end; 504: Heat source tank outlet pipeline; 5041: First check valve; 5042: First outlet end; 5043: Second outlet end;

[0041] 510: Nozzle device; 511: Housing; 512: Heat exchange working medium inlet; 513: First spray member; 514: Second spray member; 515: Guide vane; 516: Accommodation top plate; 5111: Distribution cavity; 5112: First spray cavity; 5113: Second spray cavity; 5114: Accommodation cavity;

[0042] 520: Electrocaloric refrigeration device; 521: Spray front end; 522: Spray end;

[0043] 600: Hot end heat exchanger; 610: First working medium inlet pipeline; 611: First valve body; 620: First working medium outlet pipeline; 621: Second check valve;

[0044] 700: Cold end heat exchanger; 710: Second working medium inlet pipeline; 711: Second valve body; 720: Second working medium outlet pipeline; 721: Third check valve. Detailed implementation manners

[0045] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for reference and illustration purposes only and are not intended to limit the embodiments of the present disclosure. In the following technical description, for the sake of explanation, numerous details are provided to give a thorough understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be shown in a simplified manner.

[0046] The terms "first", "second", etc. in the description and claims of the embodiments of the present disclosure and the above accompanying drawings are used to distinguish similar objects and do not necessarily need to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so as to describe the embodiments of the present disclosure here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion.

[0047] In the embodiments of the present disclosure, the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", "middle", "outer", "front", "rear", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the embodiments of the present disclosure and their embodiments, and are not used to limit that the indicated device, element or component must have a specific orientation, or be constructed and operated in a specific orientation. Moreover, in addition to being able to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0048] In addition, the terms "arrange", "connect", and "fix" should be understood in a broad sense. For example, "connect" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there is internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0049] Unless otherwise specified, the term "plurality" means two or more.

[0050] The term "and / or" is a description of the associated relationship of an object, indicating that there can be three relationships. For example, A and / or B means: A or B, or, A and B these three relationships.

[0051] It should be noted that, without conflict, the embodiments in the embodiments of the present disclosure and the features in the embodiments can be combined with each other.

[0052] The embodiments of the present disclosure provide an electrocaloric spray heat exchange assembly. As Figures 1 to 7 shown.

[0053] The electrocaloric spray heat exchange assembly provided by the embodiments of the present disclosure includes a nozzle device 510 and an electrocaloric refrigeration device 520. The nozzle device 510 includes a housing 511. The housing 511 is provided with a heat exchange working medium inlet 512 and a heat exchange working medium spray port, and the housing 511 encloses a distribution cavity 5111 near the heat exchange working medium inlet 512 and a spray cavity near the heat exchange working medium spray port and communicating with the distribution cavity 5111. The electrocaloric refrigeration device 520 alternately generates heat and cold. Wherein, a receiving cavity 5114 communicating with the spray cavity is further arranged in the housing 511, and at least part of the electrocaloric refrigeration device 520 is arranged in the receiving cavity 5114, so that the heat exchange working medium sprayed from the spray cavity exchanges heat with the heat or cold generated by the electrocaloric refrigeration device 520.

[0054] An embodiment of the present disclosure provides an electrocaloric spray heat exchange component, which includes an electrocaloric refrigeration device 520 and a nozzle device 510 that sprays a heat exchange working medium onto the surface of the electrocaloric refrigeration device 520 to exchange heat with the electrocaloric refrigeration device 520. A distribution cavity 5111, a spray cavity, and a receiving cavity 5114 that are sequentially communicated are arranged in a housing 511 of the nozzle device 510. After the heat exchange working medium enters from a heat exchange working medium inlet 512, it sequentially flows through the distribution cavity 5111, the spray cavity, and the receiving cavity 5114, and exchanges heat with at least part of the electrocaloric refrigeration device 520 arranged in the receiving cavity 5114, taking away the heat and cold generated by the electrocaloric refrigeration device 520.

[0055] The electrocaloric effect is a thermal effect of an iron material under an electric field, where heat is released when an electric field is applied and heat is absorbed when the electric field is removed. The electrocaloric refrigeration device 520 is a refrigeration device based on the electrocaloric effect. When the electrocaloric refrigeration device 520 releases heat, the heat exchange working medium is sprayed onto the surface of the electrocaloric refrigeration device 520, and the heat of the electrocaloric refrigeration device 520 is taken away through the evaporation and heat absorption of the heat exchange working medium; similarly, when the electrocaloric refrigeration device 520 absorbs heat, that is, generates cold, the heat exchange working medium is sprayed onto the surface of the electrocaloric refrigeration device 520, and the cold of the electrocaloric refrigeration device 520 is taken away through the condensation of the heat exchange working medium.

[0056] In the electrocaloric spray heat exchange component provided by the embodiment of the present disclosure, the heat exchange working medium spray port of the nozzle device 510 sprays the heat exchange working medium onto the surface of the electrocaloric refrigeration device 520 in a spraying manner, and the heat exchange working medium can quickly take away the heat or cold generated by the electrocaloric refrigeration device 520 in a short time; moreover, the heat exchange working medium is evenly distributed on the surface of the electrocaloric refrigeration device 520, avoiding the hot spot problem generated by the electrocaloric refrigeration device 520; at the same time, after the heat exchange working medium is sprayed onto the surface of the electrocaloric refrigeration device 520, it can quickly absorb or release heat to quickly take away the heat or cold on the surface of the electrocaloric refrigeration device 520, thereby quickly adjusting the temperature of the electrocaloric refrigeration device 520 and preventing the electrocaloric refrigeration device 520 from overheating or overcooling, and improving the service life of the electrocaloric refrigeration device 520. It can be seen that the electrocaloric spray heat exchange component provided by the embodiment of the present disclosure can enable the heat exchange working medium to effectively, quickly, and fully exchange heat or cold with the electrocaloric refrigeration device 520, which is beneficial to the subsequent utilization of the exchanged heat or cold.

[0057] In the embodiment of the present disclosure, at least part of the structure of the electrocaloric refrigeration device 520 is arranged in the receiving cavity 5114 of the nozzle device 510, so that the heat exchange working medium ejected from the heat exchange working medium spray port can directly spray the surface of the electrocaloric refrigeration device 520, improving the heat or cold exchange effect between the heat exchange working medium and the electrocaloric refrigeration device 520, and further improving the utilization effect of the subsequent heat or cold.

[0058] Optionally, the surface of the electrocaloric refrigeration device 520 is coated with a hydrophilic coating, which improves the heat exchange effect between the heat exchange working fluid and the electrocaloric refrigeration device 520.

[0059] In some alternative embodiments, the spray chamber includes a first spray chamber 5112 and a second spray chamber 5113. Among them, the accommodation chamber 5114 is arranged between the first spray chamber 5112 and the second spray chamber 5113.

[0060] The nozzle device 510 includes a first spray chamber 5112 and a second spray chamber 5113. Both the first spray chamber 5112 and the second spray chamber 5113 are communicated with the distribution chamber 5111. A part of the heat exchange working fluid in the distribution chamber 5111 enters the first spray chamber 5112, and the other part enters the second spray chamber 5113. And, the accommodation chamber 5114 is arranged between the first spray chamber 5112 and the second spray chamber 5113. That is, the part of the electrocaloric refrigeration device 520 arranged in the accommodation chamber 5114 is also arranged between the first spray chamber 5112 and the second spray chamber 5113. In this way, the heat exchange working fluid sprayed out from the first spray chamber 5112 can be sprayed onto one surface of the electrocaloric refrigeration device 520, and the heat exchange working fluid sprayed out from the second spray chamber 5113 can be sprayed onto the other surface of the electrocaloric refrigeration device 520. It can be seen that the electrocaloric spray heat exchange assembly provided by the embodiments of the present disclosure can spray both surfaces of the electrocaloric refrigeration device 520 at the same time, improving the uniformity of the distribution of the heat exchange working fluid on the surface of the electrocaloric refrigeration device 520.

[0061] Optionally, the second spray chamber 5113 is arranged on the periphery of the first spray chamber 5112.

[0062] In the embodiments of the present disclosure, the first spray chamber 5112 is circular, the shape of the second spray chamber 5113 is the same as that of the first spray chamber 5112, and the second spray chamber 5113 is arranged on the periphery of the first spray chamber 5112. For example, the first spray chamber 5112 and the second spray chamber 5113 are concentric circles, and the diameter of the second spray chamber 5113 is greater than that of the first spray chamber 5112. That is, the first spray chamber 5112 forms an inner circle, and the second spray chamber 5113 forms an outer circle, forming a structural form in which the second spray chamber 5113 is arranged on the periphery of the first spray chamber 5112. The accommodation chamber 5114 is arranged between the first spray chamber 5112 and the second spray chamber 5113, improving the spray effect of the heat exchange working fluid sprayed out from the first spray chamber 5112 and the second spray chamber 5113 onto the surface of the electrocaloric refrigeration device 520 at the same time. That is, the heat exchange effect of the heat exchange working fluid on the electrocaloric refrigeration device 520 is improved.

[0063] Optionally, the housing 511 includes a first spray housing enclosing a first spray chamber 5112 and a second spray housing enclosing a second spray chamber 5113. Among them, the first spray housing is provided with one or more first spray members 513 facing the accommodation chamber 5114, and the first spray member 513 is provided with a plurality of first spray openings. The second spray housing is provided with one or more second spray members 514 facing the accommodation chamber 5114, and the second spray member 514 is provided with a plurality of second spray openings.

[0064] The first spray housing is provided with a plurality of first spray members 513 facing the accommodation chamber 5114, and the first spray member 513 is provided with a plurality of first spray openings. The heat exchange working medium sprayed by the first spray member 513 can be sprayed onto one surface of the electrocaloric refrigeration device 520. The second spray housing is provided with a plurality of second spray members 514 facing the accommodation chamber 5114, and the second spray member 514 is provided with a plurality of second spray openings. The heat exchange working medium sprayed by the second spray member 514 can be sprayed onto the other surface of the electrocaloric refrigeration device 520. It can be seen that the first spray member 513 and the second spray member 514 can simultaneously perform spray heat exchange on two surfaces of the electrocaloric refrigeration device 520, improving the heat exchange effect on the electrocaloric refrigeration device 520.

[0065] Optionally, the first spray member 513 and the second spray member 514 are oppositely arranged. The length of the first spray member 513 is the same as the length of the second spray member 514, and the width of the electrocaloric refrigeration device 520 is the same as the length of the first spray member 513. In this way, the heat exchange working medium sprayed by the first spray member 513 and the second spray member 514 can effectively perform heat exchange on the entire surface of the electrocaloric refrigeration device 520, improving the heat exchange effect.

[0066] Optionally, the first spray member 513 and the second spray member 514 form a set of spray assemblies arranged oppositely, and each spray assembly is provided with an electrocaloric refrigeration device 520. When the electrocaloric spray heat exchange assembly is provided with multiple sets of spray assemblies, correspondingly, the number of electrocaloric refrigeration devices 520 can also be multiple. The electrocaloric spray heat exchange assembly provided by the embodiments of the present disclosure can simultaneously perform spray heat exchange on multiple electrocaloric refrigeration devices 520 through multiple sets of spray assemblies, thereby increasing the total heat exchange amount of the entire electrocaloric spray heat exchange assembly.

[0067] Optionally, the interior of the housing 511 further includes a top accommodation plate 516 provided at the top of the accommodation chamber 5114, and the top accommodation plate 516 is provided between the first spray chamber 5112 and the second spray chamber 5113.

[0068] Inside the housing 511 of the nozzle device 510 of the electrocaloric spray heat exchange component, a receiving top plate 516 is further provided. The receiving top plate 516 is arranged at the upper part of the receiving cavity 5114 and between the first spray cavity 5112 and the second spray cavity 5113. The receiving top plate 516 can play a role in liquid separation, splitting the heat exchange working medium in the distribution cavity 5111 into the first spray cavity 5112 and the second spray cavity 5113.

[0069] Optionally, the aforementioned electrocaloric spray heat exchange component further includes a guide vane 515. The guide vane 515 is arranged in the distribution cavity 5111 and is used to guide the heat exchange working medium entering from the heat exchange working medium inlet 512 to the spray cavity. Optionally, the electrocaloric spray heat exchange component further includes a driving device for driving the guide vane 515 to rotate.

[0070] The heat exchange working medium enters the distribution cavity 5111 through the heat exchange working medium inlet 512. The guide vane 515 rotates in the distribution cavity 5111. Under the centrifugal action of the guide vane 515, the heat exchange working medium is evenly and rapidly thrown out radially outward along the guide vane 515, so that the heat exchange working medium can enter the first spray cavity 5112 and the second spray cavity 5113, rather than causing the heat exchange working medium to accumulate at the heat exchange working medium inlet 512. In this way, the distribution uniformity of the heat exchange working medium in the two spray cavities is improved.

[0071] Optionally, the electrocaloric refrigeration device 520 includes a spray front end 521 arranged in the receiving cavity 5114 and a spray end 522 corresponding to the spray front end 521. Among them, the electrocaloric spray heat exchange component includes a plurality of obliquely arranged electrocaloric refrigeration devices 520, and the spray ends 522 of the plurality of electrocaloric refrigeration devices 520 are in a converging shape, as Figure 7 shown.

[0072] The electrocaloric spray heat exchange component includes a plurality of obliquely arranged electrocaloric refrigeration devices 520. The spray front ends 521 of the plurality of electrocaloric refrigeration devices 520 are all arranged in the receiving cavity 5114, and the spray ends 522 of the plurality of electrocaloric refrigeration devices 520 are in a converging shape, which is beneficial for the heat exchange working medium to flow along the surface of the electrocaloric refrigeration device 520 for sufficient heat exchange, and is also beneficial for collecting and processing the heat exchange working medium after heat exchange at the spray end 522.

[0073] The present disclosure embodiment also provides a heat exchange system including the aforementioned electrocaloric spray heat exchange component. As Figure 8 and Figure 9 shown.

[0074] The heat exchange system provided by the embodiments of the present disclosure includes a heat source assembly, a hot-end heat exchanger 600, and a cold-end heat exchanger 700. The heat source assembly includes a heat source tank 500 and an electrocaloric spray heat exchange assembly disposed in the heat source tank 500. The hot-end heat exchanger 600 is connected to the heat source assembly through a first working fluid circulation pipeline, and the cold-end heat exchanger 700 is connected to the heat source assembly through a second working fluid circulation pipeline. Among them, the electrocaloric spray heat exchange assembly includes a nozzle device 510 and an electrocaloric refrigeration device 520. The nozzle device 510 includes a housing 511. The housing 511 is provided with a heat exchange working fluid inlet 512 and a heat exchange working fluid spray port, and the housing 511 encloses a distribution cavity 5111 near the heat exchange working fluid inlet 512 and a spray cavity near the heat exchange working fluid spray port and communicating with the distribution cavity 5111. The electrocaloric refrigeration device 520 alternately generates heat and cold. Among them, a receiving cavity 5114 communicating with the spray cavity is further provided in the housing 511, and at least a part of the electrocaloric refrigeration device 520 is disposed in the receiving cavity 5114 so that the heat exchange working fluid sprayed from the spray cavity exchanges heat or cold with the heat or cold generated by the electrocaloric refrigeration device 520.

[0075] The embodiments of the present disclosure provide a heat exchange system including the aforementioned electrocaloric spray heat exchange assembly. The heat exchange system includes a heat source assembly, and the heat source assembly includes a heat source tank 500, and an electrocaloric spray heat exchange assembly is disposed in the heat source tank 500. The electrocaloric refrigeration device 520 in the electrocaloric spray heat exchange assembly can alternately generate heat and cold. When the electrocaloric refrigeration device 520 generates heat, the heat exchange working fluid in the heat source tank 500 exchanges heat with the electrocaloric refrigeration device 520. After the exchange, the heat exchange working fluid carrying heat flows out of the heat source tank 500 and enters the hot-end heat exchanger 600 through the first working fluid circulation pipeline, so that the heat can be utilized or dissipated in the hot-end heat exchanger 600; similarly, when the electrocaloric refrigeration device 520 generates cold, the heat exchange working fluid in the heat source tank 500 exchanges cold with the electrocaloric refrigeration device 520. After the exchange, the heat exchange working fluid carrying cold flows out of the heat source tank 500 and enters the cold-end heat exchanger 700 through the second working fluid circulation pipeline, so that the cold can be utilized or dissipated in the cold-end heat exchanger 700.

[0076] For the heat exchange system provided by the embodiments of the present disclosure, the heat source assembly and the hot-end heat exchanger 600 form a closed heat internal circulation system through the first working fluid circulation pipeline, and the heat source assembly and the cold-end heat exchanger 700 form a closed cold internal circulation system through the second working fluid circulation pipeline. It can be seen that the heat exchange system provided by the embodiments of the present disclosure includes both a heat internal circulation system and a cold internal circulation system, and can recycle the heat and cold alternately generated by the electrocaloric refrigeration device 520.

[0077] Optionally, the hot-end heat exchanger 600 or the cold-end heat exchanger 700 may be a tube-fin heat exchanger, a microchannel heat exchanger, or other heat exchangers commonly used in air conditioners or other household appliances. The embodiments of the present disclosure do not impose excessive limitations on the specific structural forms of the hot-end heat exchanger 600 or the cold-end heat exchanger 700.

[0078] Optionally, the heat source tank 500 includes an inlet tank 501 and an outlet tank 502. The inlet tank 501 is used for the heat transfer working medium to flow in, and the inlet tank 501 is communicated with the heat transfer working medium inlet 512 of the electrocaloric spraying heat exchange assembly. The outlet tank 502 is used for the heat transfer working medium that has exchanged heat with the electrocaloric refrigeration device 520 to flow out.

[0079] Optionally, the outlet tank 502 of the heat source tank 500 is funnel-shaped, which is beneficial to collecting the heat transfer working medium after heat exchange and flowing it out from the outlet tank 502.

[0080] Optionally, the heat exchange system further includes a heat source tank inlet pipeline 503 and a heat source tank outlet pipeline 504. The heat source tank inlet pipeline 503 includes a first inlet end 5032 and a second inlet end 5033. Among them, the first inlet end 5032 is communicated with the inlet tank 501 of the heat source tank 500. The heat source tank outlet pipeline 504 includes a first outlet end 5042 and a second outlet end 5043. Among them, the first outlet end 5042 is communicated with the outlet tank 502 of the heat source tank 500.

[0081] When the electrocaloric refrigeration device 520 generates heat, the heat transfer working medium after heat exchange carries heat, enters the first working medium circulation pipeline through the heat source tank outlet pipeline 504, and enters the hot-end heat exchanger 600. After releasing heat in the hot-end heat exchanger 600, it flows back to the heat source tank 500 through the heat source tank inlet pipeline 503, that is, a heat cycle is completed; when the electrocaloric refrigeration device 520 generates cold, the heat transfer working medium after heat exchange carries cold, enters the second working medium circulation pipeline through the heat source tank outlet pipeline 504, and enters the cold-end heat exchanger 700. After releasing cold in the cold-end heat exchanger 700, it flows back to the heat source tank 500 through the heat source tank inlet pipeline 503, that is, a cold cycle is completed.

[0082] Optionally, a first pump body 5031 is provided on the heat source tank inlet pipeline 503; and a first one-way valve 5041 is provided on the heat source tank outlet pipeline 504. The first pump body 5031 can be used to pressurize and pump the heat transfer working medium in the heat source tank inlet pipeline 503 into the heat source tank 500. In this way, the flow rate of the heat transfer working medium flowing into the heat source tank 500 is increased, and the heat exchange effect between the heat transfer working medium and the electrocaloric refrigeration device 520 is improved.

[0083] Optionally, a first check valve 5041 is provided in the outlet pipeline 504 of the heat source tank. The conduction direction of the first check valve 5041 is from the first outlet end 5042 to the second outlet end 5043 of the outlet pipeline 504 of the heat source tank, preventing the heat transfer working medium flowing out of the outlet tank 502 of the heat source tank 500 from flowing back into the heat source tank 500. Optionally, the first check valve 5041 is a Tesla valve.

[0084] Optionally, the first working medium circulation pipeline includes a first working medium inlet pipeline 610 communicating with the inlet of the hot end heat exchanger 600 and a first working medium outlet pipeline 620 communicating with the outlet of the hot end heat exchanger 600. Among them, the first working medium inlet pipeline 610 communicates with the second outlet end 5043 of the outlet pipeline 504 of the heat source tank, and the first working medium outlet pipeline 620 communicates with the second inlet end 5033 of the inlet pipeline 503 of the heat source tank; the second working medium circulation pipeline includes a second working medium inlet pipeline 710 communicating with the inlet of the cold end heat exchanger 700 and a second working medium outlet pipeline 720 communicating with the outlet of the cold end heat exchanger 700. Among them, the second working medium inlet pipeline 710 communicates with the second outlet end 5043 of the outlet pipeline 504 of the heat source tank, and the second working medium outlet pipeline 720 communicates with the second inlet end 5033 of the inlet pipeline 503 of the heat source tank.

[0085] Optionally, with the hot end heat exchanger 600 as the division, the first working medium circulation pipeline includes a first working medium inlet pipeline 610 and a first working medium outlet pipeline 620. The heat transfer working medium carrying heat flowing out of the heat source tank 500 enters the hot end heat exchanger 600 through the first working medium inlet pipeline 610. After the heat transfer working medium completes heat dissipation in the hot end heat exchanger 600, it flows back into the heat source tank 500 through the first working medium outlet pipeline 620 and the inlet pipeline 503 of the heat source tank in sequence; similarly, with the cold end heat exchanger 700 as the division, the second working medium circulation pipeline includes a second working medium inlet pipeline 710 and a second working medium outlet pipeline 720. The heat transfer working medium carrying cold flowing out of the heat source tank 500 enters the cold end heat exchanger 700 through the second working medium outlet pipeline 720. After the heat transfer working medium completes cold dissipation in the cold end heat exchanger 700, it flows back into the heat source tank 500 through the second working medium outlet pipeline 720 and the inlet pipeline 503 of the heat source tank in sequence.

[0086] Optionally, a first valve body 611 is provided in the first working medium inlet pipeline 610, and a second valve body 711 is provided in the second working medium inlet pipeline 710; and, a second check valve 621 is provided in the first working medium outlet pipeline 620, and a third check valve 720 is provided in the second working medium outlet pipeline 720.

[0087] A shunt element is provided at the second outlet end 5043 of the heat source tank outlet pipeline 504, which is respectively communicated with the first working medium inlet pipeline 610 and the second working medium inlet pipeline 710. The first working medium inlet pipeline 610 is provided with a first valve body 611, and the second working medium inlet pipeline 710 is provided with a second valve body 711. By opening or closing the first valve body 611 and the second valve body 711, it is possible to precisely control whether the heat exchange working medium after heat exchange enters the first working medium inlet pipeline 610 or the second working medium inlet pipeline 710. Optionally, the first valve body 611 and / or the second valve body 711 is an electromagnetic valve, or the first valve body 611 and / or the second valve body 711 is a flow pump.

[0088] The first working medium outlet pipeline 620 is provided with a second check valve 621, and the conduction direction of the second check valve 621 is defined as from the outlet of the hot end heat exchanger 600 to the heat source tank 500, so that the heat exchange working medium after heat exchange by the hot end heat exchanger 600 flows back into the heat source tank 500; similarly, the second working medium outlet pipeline 720 is provided with a third check valve 720, and the conduction direction of the third check valve 720 is defined as from the outlet of the cold end heat exchanger 700 to the heat source tank 500, so that the heat exchange working medium after heat exchange by the cold end heat exchanger 700 flows back into the heat source tank 500.

[0089] Optionally, the heat exchange system provided by the embodiment of the present disclosure further includes a control unit, which is configured to control the heat exchange working medium flowing out after heat exchange with the electrocaloric refrigeration device 520 in the heat source tank 500 to enter the hot end heat exchanger 600 through the first working medium circulation pipeline when the electrocaloric refrigeration device 520 generates heat, and control the heat exchange working medium flowing out after heat exchange with the electrocaloric refrigeration device 520 in the heat source tank 500 to enter the cold end heat exchanger 700 through the second working medium circulation pipeline when the electrocaloric refrigeration device 520 generates cold.

[0090] When an electric field is applied, the electrocaloric refrigeration device 520 releases heat, and when the electric field is removed, the electrocaloric refrigeration device 520 absorbs heat. The control unit can control the flow direction of the heat exchange working medium after heat exchange by controlling the opening or closing state of the first valve body 611 and the second valve body 711.

[0091] When an electric field is applied, the electrocaloric refrigeration device 520 releases heat. The heat transfer working fluid sprayed into the heat source tank 500 exchanges heat with the electrocaloric refrigeration device 520, rises in temperature, takes away the heat released by the electrocaloric refrigeration device 520, and flows out from the outlet tank 502 of the heat source tank 500. At this time, the controller controls the first valve body 611 to open, and at the same time controls the second valve body 711 to close, so that the heated heat transfer working fluid enters the hot end heat exchanger 600 through the first working fluid circulation pipeline. When the electric field is released, the electrocaloric refrigeration device 520 absorbs heat. The heat transfer working fluid sprayed into the heat source tank 500 exchanges heat with the electrocaloric refrigeration device 520, drops in temperature, takes away the cold released by the electrocaloric refrigeration device 520, and flows out from the outlet tank 502 of the heat source tank 500. At this time, the controller controls the first valve body 611 to close, and at the same time controls the second valve body 711 to open, so that the cooled heat transfer working fluid enters the cold end heat exchanger 700 through the second working fluid circulation pipeline.

[0092] Optionally, the heat transfer working fluid is an insulating heat-conducting liquid, including single-phase fluorinated liquid, phase-changeable fluorinated cooling liquid, or transformer insulating heat-conducting oil, etc.

[0093] The embodiment of the present disclosure also provides a household electrical appliance including the foregoing heat exchange system. The household electrical appliance may include an air conditioner to heat the room by using the heat dissipated by the hot end heat exchanger 600 of the heat exchange system, or to cool the room by using the cold dissipated by the cold end heat exchanger 700 of the heat exchange system. Optionally, the household electrical appliance may also include refrigeration equipment such as a refrigerator, a freezer, a display cabinet, etc., to cool the inside of the refrigeration equipment by using the cold dissipated by the cold end heat exchanger 700 of the heat exchange system.

[0094] The air conditioner provided by the embodiment of the present disclosure includes the foregoing heat exchange system.

[0095] The embodiment of the present disclosure also provides an electrocaloric refrigeration device applicable to any one of the foregoing electrocaloric spraying assemblies, heat exchange systems or household electrical appliances.

[0096] The electrocaloric refrigeration device includes an electrocaloric refrigeration chip, and the electrocaloric refrigeration chip includes an electrocaloric element, a heat receiving end and a cold receiving end. The electrocaloric element includes a first electrode layer, a second electrode layer, and a piezoelectric functional film layer. The piezoelectric functional film layer is disposed between the first electrode layer and the second electrode layer. The piezoelectric functional film layer includes a piezoelectric refrigeration region and a piezoelectric displacement region formed by partitioning the piezoelectric film layer. The piezoelectric displacement region is used to drive the piezoelectric refrigeration region to generate displacement; the heat receiving end is used to receive the heat of the electrocaloric element, and the cold receiving end is used to receive the cold of the electrocaloric element.

[0097] Currently, existing electrocaloric refrigeration systems need to design a movable heat transfer structure to move between the cold end and the hot end in cooperation with the application / release of the electric field, so as to achieve the separation of heat and cold. The heat transfer structure cannot be integrated with the electrocaloric refrigeration working fluid, has a large thermal resistance, and the heat exchange efficiency is low.

[0098] An embodiment of the present disclosure provides an electrocaloric element.

[0099] An embodiment of the present disclosure discloses an electrocaloric element 100. A piezoelectric displacement region is directly formed by partitioning the piezoelectric film layer in the electrocaloric element 100. The electrocaloric element 100 is driven to move through the piezoelectric displacement region for heat transfer. The electrocaloric element 100 integrates a thermal switch form, improving the heat exchange efficiency.

[0100] Combined Figure 10 With Figure 11 As shown, an embodiment of the present disclosure provides an electrocaloric element 100, including a first electrode layer 1, a second electrode layer 2, and a piezoelectric functional film layer 4. The piezoelectric functional film layer 4 is disposed between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric refrigeration region and a piezoelectric displacement region formed by partitioning the piezoelectric film layer. Among them, the piezoelectric displacement region is used to drive the piezoelectric refrigeration region to generate displacement.

[0101] The electrocaloric element 100 includes a first electrode layer 1, a second electrode layer 2, and a piezoelectric functional film layer 4 disposed between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric refrigeration region and a piezoelectric displacement region. By applying voltages to the first electrode layer 1 and the second electrode layer 2, an electric field is formed between the first electrode layer 1 and the second electrode layer 2, and different functional regions of the piezoelectric functional film layer 4 correspondingly achieve different functional effects. When a positive electric field is applied to both the piezoelectric refrigeration region and the piezoelectric displacement region simultaneously, the piezoelectric functional film layer 4 synchronously excites the piezoelectric effect and the electrocaloric effect, resulting in a positive displacement and heat release. When the electric field applied to the piezoelectric refrigeration region stops and a reverse electric field is applied to the piezoelectric displacement region, the piezoelectric refrigeration region absorbs heat due to the electrocaloric effect, and the piezoelectric displacement region undergoes a reverse displacement due to the piezoelectric effect, thereby driving the piezoelectric functional film layer 4 to reverse displacement. Through different functional partitions of the piezoelectric functional film layer 4, opposite displacements occur during heat release and heat absorption of the electrocaloric effect, effectively realizing heat separation and improving the heat exchange efficiency. The piezoelectric functional film layer 4 partition of the electrocaloric element 100 includes a piezoelectric displacement region, enabling the electrocaloric element 100 to integrate a thermal switch form, avoiding a large resistance caused by an externally provided movable heat transfer structure.

[0102] Optionally, a square-wave periodic electric field is applied to the piezoelectric displacement region.

[0103] Optionally, the first electrode layer 1 includes a platinum electrode, and / or the second electrode layer 2 includes a platinum electrode, and / or the third electrode layer 3 includes a platinum electrode.

[0104] Optionally, the piezoelectric refrigeration region includes one or more piezoelectric refrigeration units 42; the piezoelectric displacement region includes one or more piezoelectric displacement units 41.

[0105] When the piezoelectric refrigeration area includes a piezoelectric refrigeration unit 42 and the piezoelectric displacement area includes a piezoelectric displacement unit 41, the piezoelectric refrigeration unit 42 and the piezoelectric displacement unit 41 are arranged adjacent to each other. When the piezoelectric refrigeration area absorbs heat, the piezoelectric displacement area drives the piezoelectric refrigeration area to displace in the opposite direction. When the piezoelectric refrigeration area includes a plurality of piezoelectric refrigeration units 42 and the piezoelectric displacement area includes a plurality of piezoelectric displacement units 41, by setting the relative positions of the plurality of piezoelectric refrigeration units 42 and the piezoelectric displacement units 41, when the piezoelectric refrigeration area absorbs heat, the piezoelectric displacement area can better drive the piezoelectric functional film layer 4 to displace in the opposite direction, thereby realizing the separation of the heat release and heat absorption positions of the electrocaloric element 100.

[0106] Optionally, the piezoelectric refrigeration area includes a plurality of piezoelectric refrigeration units 42, and the plurality of piezoelectric refrigeration units 42 are arranged in an array. And / or, the piezoelectric displacement area includes a plurality of piezoelectric displacement units 41, and the plurality of piezoelectric displacement units 41 are arranged in an array.

[0107] The arrangement of the plurality of piezoelectric refrigeration units 42 in an array can make the heat release or heat absorption of each part of the electrocaloric element 100 balanced, facilitating the heat dissipation during heat release or the heat entry during heat absorption. The arrangement of the plurality of piezoelectric displacement units 41 in an array can make the force for the piezoelectric displacement area to drive the electrocaloric element 100 to displace in the opposite direction be evenly applied to the electrocaloric element 100 when the piezoelectric refrigeration area of the electrocaloric element 100 absorbs heat, so that each part of the electrocaloric element 100 displaces in the opposite direction synchronously, facilitating the electrocaloric element 100 to be attached to the heat transfer medium.

[0108] Optionally, the piezoelectric refrigeration area includes a plurality of piezoelectric refrigeration units 42, and two adjacent piezoelectric refrigeration units 42 are spaced apart. The piezoelectric displacement area includes a plurality of piezoelectric displacement units 41, and two adjacent piezoelectric displacement units 41 are spaced apart.

[0109] The spacing between two adjacent piezoelectric refrigeration units 42 among the plurality of piezoelectric refrigeration units 42 can make the heat release or heat absorption of each part of the electrocaloric element 100 balanced, facilitating the heat dissipation during heat release or the heat entry during heat absorption. On this basis, other functional modules, such as piezoelectric displacement units 41, can be arranged between two adjacent piezoelectric refrigeration units 42. Similarly, the spacing between two adjacent piezoelectric displacement units 41 among the plurality of piezoelectric displacement units 41 can make the force for the piezoelectric displacement area to drive the electrocaloric element 100 to displace in the opposite direction be evenly applied to the electrocaloric element 100 when the piezoelectric refrigeration area of the electrocaloric element 100 absorbs heat. On this basis, other functional modules, such as piezoelectric refrigeration units 42, can be arranged between two adjacent piezoelectric displacement units 41.

[0110] Optionally, the piezoelectric refrigeration unit 42 and the piezoelectric displacement unit 41 are alternately spaced apart from each other.

[0111] A plurality of piezoelectric refrigeration units 42 and a plurality of piezoelectric displacement units 41 are alternately arranged at intervals from each other. When the piezoelectric refrigeration area absorbs heat due to the electrocaloric effect, the piezoelectric displacement unit 41 displaces in the reverse direction to drive the adjacent piezoelectric refrigeration unit 42 to displace in the reverse direction, thereby enabling the electrocaloric element 100 to displace in the reverse direction and having a high flatness after displacement, which is convenient for the electrocaloric element 100 to be attached to the heat transfer medium for heat transfer.

[0112] Optionally, the piezoelectric refrigeration area includes a first piezoelectric refrigeration unit 42, and the piezoelectric displacement area includes a first piezoelectric displacement unit 41 adjacent to the first piezoelectric refrigeration unit 42. Among them, the length of the first piezoelectric refrigeration unit 42 is greater than or equal to the length of the first piezoelectric displacement unit 41; or, the width of the first piezoelectric refrigeration unit 42 is greater than or equal to the width of the first piezoelectric displacement unit 41; or, the area of the first piezoelectric refrigeration unit 42 is greater than or equal to the area of the first piezoelectric displacement unit 41.

[0113] The piezoelectric functional film layer 4 is a thin film layer structure, and the length, width or area can be understood as dimensions. Therefore, it can be understood that the size of the adjacent first piezoelectric refrigeration unit 42 is larger than that of the first piezoelectric displacement unit 41, thereby increasing the heat release or absorption amount of the electrocaloric element 100.

[0114] Optionally, the piezoelectric functional film layer 4 includes a first piezoelectric functional surface and a second piezoelectric functional surface opposite to the first piezoelectric functional surface. Among them, the first piezoelectric functional surface includes a piezoelectric refrigeration area and a piezoelectric displacement area, and the second piezoelectric functional surface only includes a piezoelectric refrigeration area.

[0115] The piezoelectric functional film layer 4 is a thin film layer structure with a thickness. Taking the thin film layer including a first sub-film layer and a second sub-film layer that are attached to each other as an example. The first piezoelectric functional surface corresponds to the first sub-film layer and includes a piezoelectric refrigeration area and a piezoelectric displacement area; the second piezoelectric functional surface corresponds to the second sub-film layer and only includes a piezoelectric refrigeration area without a piezoelectric displacement area. Regarding the first sub-film layer and the second sub-film layer as a whole, that is, the piezoelectric functional film layer 4 forms a piezoelectric displacement area embedded structure. The piezoelectric displacement area embedded structure increases the size of the piezoelectric refrigeration area in the piezoelectric functional film layer 4, thereby increasing the heat release or absorption amount of the electrocaloric element 100.

[0116] Optionally, a distinguishing gap for distinguishing between these two functional unit areas is provided between adjacent piezoelectric refrigeration units 42 and piezoelectric displacement units 41. Setting the distinguishing gap can partition the functional unit areas to realize the electrocaloric effect excited by the piezoelectric refrigeration unit 42 and the piezoelectric effect excited by the piezoelectric displacement unit 41 without mutual influence.

[0117] Optionally, the distinguishing gap is in a strip shape, a grid shape or an irregular shape. It can be understood that the shape of the distinguishing gap is not specifically limited, and it can be realized to separate the two functional units on both sides of the distinguishing gap to achieve different functional unit partitions.

[0118] Optionally, the distinguishing gap is an air gap.

[0119] Optionally, the distinguishing gap includes a first distinguishing gap, a second distinguishing gap, and a third distinguishing gap arranged in sequence. A first piezoelectric refrigeration unit 42 is arranged between the first distinguishing gap and the second distinguishing gap, and a first piezoelectric displacement unit 41 is arranged between the second distinguishing gap and the third distinguishing gap.

[0120] It can be understood that they are arranged in sequence as the first distinguishing gap, the first piezoelectric refrigeration unit 42, the second distinguishing gap, the first piezoelectric displacement unit 41, and the third distinguishing gap, that is, a distinguishing gap is arranged between adjacent piezoelectric refrigeration units 42 and piezoelectric displacement units 41 to avoid mutual influence between different functional units.

[0121] Optionally, the distinguishing gap includes an etched distinguishing gap formed by etching. The distinguishing gap is formed by etching, with a simple process, and enables the electrocaloric element 100 to integrate different functional units of the electrocaloric effect and the piezoelectric effect at the same time.

[0122] Optionally, the piezoelectric displacement region includes a through-type piezoelectric displacement unit 41. The through-type piezoelectric displacement unit 41 includes a first through distinguishing gap 431 and a second through distinguishing gap 433, and both the first through distinguishing gap 431 and the second through distinguishing gap 433 penetrate the piezoelectric film layer; and a first through piezoelectric displacement unit 432 arranged between the first through distinguishing gap 431 and the second through distinguishing gap 433.

[0123] Figure 11 Shown is the electrocaloric element 100 including the through-type piezoelectric displacement unit 41. The through-type piezoelectric displacement unit 41 includes a first through distinguishing gap 431, a first through piezoelectric displacement unit 432, and a second through distinguishing gap 433 arranged in sequence, and Figure 11 As shown in the figure, the first through distinguishing gap 431 and the second through distinguishing gap 433 have the same height as the first through piezoelectric displacement unit 432, that is, both the first through distinguishing gap 431 and the second through distinguishing gap 433 penetrate the piezoelectric film layer. Such an arrangement can avoid the mutual influence between the first through piezoelectric displacement unit 432 and the adjacent piezoelectric refrigeration units 42 on both sides. Moreover, by setting the piezoelectric displacement region as the through-type piezoelectric displacement unit 41, the piezoelectric displacement region and the piezoelectric refrigeration region can share the second electrode layer 2, and in the preparation method, only the first electrode layer 1 needs to be etched for the preparation of the electrode layer, without secondary etching of the electrode layer.

[0124] Specifically, a positive voltage is applied to the first electrode layer 1 and the second electrode layer 2, and a positive electric field is formed between the first electrode layer 1 and the second electrode layer 2. At this time, the electrocaloric displacement region and the electrocaloric refrigeration region of the piezoelectric functional film layer 4 simultaneously excite the electrocaloric effect and the piezoelectric effect, and the electrocaloric element 100 displaces forward and releases heat. After that, the electrocaloric refrigeration electrode region 11 in the first electrode layer 1 is powered off, that is, the electric field corresponding to the electrocaloric refrigeration region is removed, and the electrocaloric refrigeration region excites the electrocaloric effect to absorb heat; a reverse voltage is applied to the piezoelectric drive electrode region 12 in the first electrode layer 1 and the second electrode layer 2, and a reverse electric field is formed between the first electrode layer 1 and the second electrode layer 2, and the piezoelectric displacement region excites the piezoelectric effect to displace reversely. The electrocaloric element 100 releases heat and displaces forward, absorbs heat and displaces reversely, realizing heat separation.

[0125] Optionally, the electrocaloric element 100 further includes a base layer 5. The base layer 5 is disposed below the second electrode layer 2.

[0126] The piezoelectric functional film layer 4, the first electrode layer 1 and the second electrode layer 2 are combined to form a thin film structure. A base layer 5 is disposed below the second electrode layer 2 of the electrocaloric element 100, which can support the thin film structure and provide an operation platform during preparation. The setting of the base layer 5 can also maintain the flatness of the electrocaloric element 100, so that the electrocaloric element 100 can be close to the heat transfer medium when transferring heat.

[0127] Optionally, the first electrode layer 1 is provided with an electrode gap 13, and the electrode gap 13 divides the first electrode layer 1 into an electrocaloric refrigeration electrode region 11 and a piezoelectric drive electrode region 12. Among them, the electrocaloric refrigeration electrode region 11 corresponds to the electrocaloric refrigeration region, and the piezoelectric drive electrode region 12 corresponds to the piezoelectric displacement region. A positive electric field is applied to the electrocaloric refrigeration electrode region 11 and the piezoelectric drive electrode region 12 to cause the piezoelectric displacement region and the electrocaloric refrigeration region to displace in the first direction; or, the electric field of the electrocaloric refrigeration motor region is removed, the electrocaloric refrigeration region of the piezoelectric functional film layer 4 absorbs heat, and at the same time, a reverse electric field is applied to the piezoelectric drive electrode region 12 to cause the piezoelectric displacement region to drive the heat-absorbing electrocaloric refrigeration region to displace in the second direction.

[0128] Corresponding to the two different functional units of the electrocaloric refrigeration region and the piezoelectric displacement region, different electric fields need to be applied to the electrodes to excite different functional effects. Therefore, the first electrode layer 1 is provided with an electrode gap 13, so that the first electrode layer 1 is separated into an electrocaloric refrigeration electrode region 11 corresponding to the electrocaloric refrigeration region and a piezoelectric drive electrode region 12 corresponding to the piezoelectric displacement region, and different electric fields are applied to the electrocaloric refrigeration electrode region 11 and the second electrode layer 2 and the piezoelectric drive electrode region 12 and the second electrode layer 2 to realize the excitation of different functional effects.

[0129] Optionally, the electrode gap 13 is correspondingly arranged with the distinguishing gap.

[0130] Optionally, the electrode gap 13 communicates with the distinguishing gap to form a through-type gap. The electrode gap 13 corresponds to the distinguishing gap, so that when different electric fields are applied to different regions of the first electrode layer 1, different functional effects can be excited in the functional regions corresponding to the electrode regions. Further, the communication between the electrode gap 13 and the distinguishing gap enables adjacent different functional units to not affect each other.

[0131] The embodiments of the present disclosure provide a method for manufacturing an electrocaloric element.

[0132] In some embodiments, as shown in Figure 12 , the method for manufacturing the electrocaloric element 100 includes:

[0133] S301, depositing a second electrode layer 2 on the base layer 5;

[0134] S302, depositing a piezoelectric film layer on the second electrode layer 2;

[0135] S303, depositing a first electrode layer 1 on the piezoelectric film layer;

[0136] S304, etching the first electrode layer 1 and the piezoelectric film layer to obtain the electrocaloric element 100. Among them, the electrocaloric element 100 is the aforementioned electrocaloric element 100.

[0137] Optionally, the piezoelectric film layer includes a piezoelectric ceramic film layer.

[0138] The electrocaloric effect is a thermal effect of a ferroelectric material under an electric field, where heat is released when an electric field is applied and heat is absorbed when the electric field is removed. The ferroelectric thin film is excited by applying a high electric field through the electrodes on both sides to generate a periodic electrocaloric effect. The research on solid-state electrocaloric refrigeration materials can be divided into three categories: inorganic, organic, and inorganic-organic composite materials. Among them, inorganic materials mainly focus on the lead-containing reference system of lead zirconate titanate-based piezoelectric ceramics (PZT), and their geometric forms mainly include bulk ceramics, thin films, thick films, and multi-layer thick films. The piezoelectric film layer disclosed in the embodiments of the present disclosure includes a piezoelectric ceramic film layer, that is, an inorganic ferroelectric material.

[0139] On the one hand, compared with organic ferroelectric materials that require a high voltage (such as kilovolt-level voltage) to excite the electrocaloric effect, inorganic ferroelectric materials require a smaller voltage (such as hundred-volt-level voltage) to excite the electrocaloric effect. And a high voltage is likely to break down the thin film, resulting in a short service life of the electrocaloric element 100, while a low voltage extends the service life of the electrocaloric element 100.

[0140] On the other hand, inorganic thin-film ferroelectric materials have a large adiabatic temperature change and a wide ferroelectric phase transition temperature range, so refrigeration applications with a wide temperature range and a large temperature difference can be realized. At the same time, the synthesis process of low-temperature crystallized ferroelectric thin films can be compatible with semiconductor microelectromechanical (CMOS / MEMs) processes, enabling the integration of the piezoelectric functional film layer 4 in the electrocaloric element 100 on the base layer 5 (such as a silicon wafer), and the removal of the substrate can be achieved by means of lithography to achieve a larger self-temperature change.

[0141] Optionally, the piezoelectric ceramic film layer includes a lead zirconate titanate-based piezoelectric ceramic film layer.

[0142] Optionally, the piezoelectric ceramic film layer includes a lanthanum lead zirconate titanate ceramic film layer.

[0143] Ferroelectric dielectrics such as lead zirconate titanate-based piezoelectric ceramic film layers (PZT) or lanthanum lead zirconate titanate ceramic film layers (PLZT) have both piezoelectricity and electrocaloric effect at the same time. Therefore, the same material can be used in the piezoelectric displacement region and the piezoelectric refrigeration region and deposited on the same layer, and the functions can be distinguished only by controlling the different electric fields applied to the electrode layer.

[0144] Optionally, the thickness of the deposited piezoelectric film layer is greater than or equal to 8 μm and less than or equal to 20 μm.

[0145] Optionally, the etching of the first electrode layer 1 and the piezoelectric film layer includes: etching the first electrode layer to obtain an electrode gap 13; performing through-etching on the piezoelectric film layer to obtain a through-separation gap, as well as a piezoelectric refrigeration unit 42 and a through-type piezoelectric displacement unit 41 located between the through-separation gaps.

[0146] Optionally, the base layer 5 includes a silicon wafer.

[0147] Optionally, before depositing the second electrode layer 2 on the base layer 5, it further includes: oxidizing the surface of the silicon wafer to obtain a silicon-on-insulator substrate; performing hydrogen implantation on the silicon-on-insulator substrate to reduce the thickness of the silicon-on-insulator substrate; bonding the oxide layer of the silicon-on-insulator substrate to the substrate silicon. The substrate silicon has a large thickness and serves to provide mechanical support for the silicon-on-insulator substrate, facilitating subsequent operations on the base layer 5.

[0148] Optionally, after etching the first electrode layer 1 and the piezoelectric film layer, it further includes: removing the substrate silicon and the oxide layer to thin the silicon wafer. Among them, the mechanical thinning method is used to remove the substrate silicon and the oxide layer, and the thickness of the thinned silicon wafer is greater than or equal to 8 μm and less than or equal to 13 μm.

[0149] Optionally, the deposition of the piezoelectric film layer is achieved by the sol-gel method.

[0150] In the electrocaloric refrigeration chip disclosed in the embodiments of the present disclosure, the piezoelectric film layer of the electrocaloric element 100 is directly partitioned to form a piezoelectric displacement region, and the electrocaloric element 100 is driven to move through the piezoelectric displacement region. The clamping framework clamps the electrocaloric element 100 so that the electrocaloric element 100 releases heat and fits to the heat receiving end 300, and absorbs heat and fits to the cold quantity receiving end 400. The electrocaloric refrigeration chip has a self-integrated cold and heat separation structure, and the stability is enhanced.

[0151] Combined with Figures 13 to 15 As shown, the embodiments of the present disclosure provide an electrocaloric refrigeration chip, including an electrocaloric element 100, a clamping framework, a heat receiving end 300, and a cold quantity receiving end 400. The electrocaloric element 100 includes a first electrode layer 1, a second electrode layer 2, and a piezoelectric functional film layer 4. The piezoelectric functional film layer 4 is disposed between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric refrigeration region and a piezoelectric displacement region formed by partitioning the piezoelectric film layer. Among them, the piezoelectric displacement region is used to drive the piezoelectric refrigeration region to generate displacement. The clamping framework includes a first clamping framework 201 clamped to the first side of the first end of the electrocaloric element 100, and a second clamping framework 202 clamped to the second side of the first end of the electrocaloric element 100. The heat receiving end 300 is disposed on the side of the first clamping framework 201 and is used to receive the heat of the electrocaloric element 100. The cold quantity receiving end 400 is disposed on the side of the second clamping framework 202 and is used to receive the cold quantity of the electrocaloric element 100.

[0152] The electrocaloric refrigeration chip includes an electrocaloric element 100. The piezoelectric film layer of the electrocaloric element 100 is directly partitioned to form a piezoelectric displacement region, and the electrocaloric element 100 is driven to move through the piezoelectric displacement region. At the same time, a heat receiving end 300 and a cold quantity receiving end 400 are respectively disposed on both sides of the electrocaloric element 100, and the first end of the electrocaloric element 100 is clamped to the clamping framework. When a positive electric field is simultaneously applied to the piezoelectric refrigeration region and the piezoelectric displacement region, the piezoelectric functional film layer 4 synchronously excites the piezoelectric effect and the electrocaloric effect, undergoes a positive displacement and releases heat. The clamping framework clamps the electrocaloric element 100 so that the electrocaloric element 100 fits to the heat receiving end 300, as Figure 14 . When the application of the electric field to the piezoelectric refrigeration region stops and a reverse electric field is applied to the piezoelectric displacement region, the piezoelectric refrigeration region absorbs heat due to the electrocaloric effect, and the piezoelectric displacement region undergoes a reverse displacement due to the piezoelectric effect, thereby driving the piezoelectric functional film layer 4 to undergo a reverse displacement. The clamping framework clamps the electrocaloric element 100 so that the electrocaloric element 100 fits to the cold quantity receiving end 400, as Figure 15 . The electrocaloric refrigeration chip has a self-integrated cold and heat separation structure, and the stability is enhanced.

[0153] It can be understood that the electrocaloric element 100 in the electrocaloric refrigeration chip is the electrocaloric element 100 in the form of an internally integrated thermal switch as described above.

[0154] Optionally, the electrocaloric element 100 further includes a base layer 5 disposed below the second electrode layer 2. Among them, the first clamping frame 201 is disposed on the first electrode layer 1 of the electrocaloric element 100, and the second clamping frame 202 is disposed on the base layer 5 of the electrocaloric element 100.

[0155] The piezoelectric functional film layer 4, the first electrode layer 1, and the second electrode layer 2 are combined to form a thin film structure. A base layer 5 is disposed below the second electrode layer 2 of the electrocaloric element 100 to support the thin film structure. The setting of the base layer 5 can also maintain the flatness of the electrocaloric element 100, so that the electrocaloric element 100 can be close to the heat transfer medium when transferring heat. Correspondingly, the first clamping frame 201 is disposed above the first electrode layer 1 of the electrocaloric element 100, and the second clamping frame 202 is disposed below the base layer 5 of the electrocaloric element 100.

[0156] Optionally, a first bending gap 203 is provided between the first side of the electrocaloric element 100 and the heat receiving end 300. Among them, the first bending gap 203 is used for the first side of the electrocaloric element 100 to bend towards the heat receiving end 300 and fit with the heat receiving end 300. And / or, a second bending gap 204 is provided between the second side of the electrocaloric element 100 and the cold receiving end 400. Among them, the second bending gap 204 is used for the second side of the electrocaloric element 100 to bend towards the cold receiving end 400 and fit with the cold receiving end 400.

[0157] The settings of the first bending gap 203 and the second bending gap 204 increase the volume of the electrocaloric refrigeration chip. The thickness of the first bending gap 203, the thickness of the electrocaloric element 100 plus the thickness of the second bending gap 204 is the distance between the heat receiving end 300 and the cold receiving end 400, which increases the separation distance between the cold and heat of the electrocaloric element 100 and is convenient for the electrocaloric refrigeration chip to be actually applied to household electrical appliances.

[0158] Optionally, the first electrode layer 1 includes a first clamping portion disposed at the end and used for clamping with the first clamping frame 201, and a first fitting portion extending along the first clamping portion. Among them, the first bending gap 203 is disposed between the first fitting portion and the heat receiving end 300. And / or, the base layer 5 includes a second clamping portion disposed at the end and used for clamping with the second clamping frame 202, and a second fitting portion extending along the second clamping portion. Among them, the second bending gap 204 is disposed between the second fitting portion and the cold receiving end 400.

[0159] The first electrode layer 1 includes a first clamping portion and a first fitting portion extending along the first clamping portion. Among them, the first clamping portion is located at the end of the first electrode layer 1. The first clamping portion is used to fit with the first clamping skeleton 201. The position where the first clamping skeleton 201 is arranged is between the first clamping portion and the heat receiving end 300. The first clamping skeleton 201 not only plays a role in clamping the first side of the end of the electrocaloric element 100, but also plays a role in supporting the electrocaloric element 100 to construct the first bending gap 203. Similarly, the base layer 5 includes a second clamping portion and a second fitting portion extending along the second clamping portion. Among them, the second clamping portion is located at the end of the base layer 5. The second clamping portion is used to fit with the second clamping skeleton 202. The position where the second clamping skeleton 202 is arranged is between the second clamping portion and the cold receiving end 400. The second clamping skeleton 202 not only plays a role in clamping the second side of the end of the electrocaloric element 100, but also plays a role in supporting the electrocaloric element 100 to construct the second bending gap 204.

[0160] Optionally, the electrocaloric refrigeration chip further includes a support skeleton 205. The support skeleton 205 is supported between the heat receiving end 300 and the cold receiving end 400, and the support skeleton 205 is arranged at the second end of the electrocaloric element 100.

[0161] The first end of the electrocaloric element 100 is clamped by the first clamping skeleton 201 and the second clamping skeleton 202, and the first clamping skeleton 201 and the second clamping skeleton 202 simultaneously support the first end of the electrocaloric refrigeration chip. At the same time, a support skeleton for support is also required to be arranged at the second end of the electrocaloric refrigeration chip. One end of the support skeleton 205 abuts against the heat receiving end 300, and the other end abuts against the cold receiving end 400, thereby supporting the second end of the electrocaloric refrigeration chip.

[0162] Optionally, the second end of the electrocaloric element 100 abuts against the support skeleton 205; or, there is a gap between the second end of the electrocaloric element 100 and the support skeleton 205.

[0163] The second end of the electrocaloric element 100 can abut against the support skeleton 205 or there can be a gap. Figure 14 and Figure 15 As shown in the figure, the second end of the electrocaloric element 100 in the electrocaloric refrigeration chip is not fixedly arranged. When the electrocaloric element 100 releases heat, it displaces and fits with the heat receiving end 300. When the electrocaloric element 100 absorbs heat, it displaces and fits with the cold receiving end 400, forming a cantilever beam structure. Compared with the arrangement form of the electrocaloric element 100 where both ends are clamped, the contact area between the electrocaloric element 100 and the heat receiving end 300 or the cold receiving end 400 is larger, and the heat transfer efficiency is improved.

[0164] Optionally, the heat receiving end 300 includes an insulating and heat-conducting layer, and / or the cold receiving end 400 includes an insulating and heat-conducting layer. The heat receiving end 300 and / or the cold receiving end 400 are insulated, which can prevent the current leakage of the first electrode layer 1 or the second electrode layer 2 and cause losses. The heat receiving end 300 and / or the cold receiving end 400 are heat-conducting, which can conduct out the heat or cold of the electrocaloric element 100.

[0165] Optionally, the insulating and heat-conducting layer includes aluminum nitride / silicon carbide (AlN / SiC) composite ceramics.

[0166] Optionally, the first clamping skeleton 201, the second clamping skeleton 202, and / or the support skeleton 205 include insulating and heat-insulating skeletons. Each skeleton being heat-insulating can enable energy to be conducted out from the heat receiving end 300 or the cold receiving end 400, improving the heat and cold separation efficiency of the electrocaloric refrigeration chip.

[0167] Optionally, the insulating and heat-insulating skeleton includes an alumina skeleton.

[0168] In some embodiments, the electrocaloric refrigeration device 520 includes one or more of the foregoing electrocaloric refrigeration chips. Multiple electrocaloric refrigeration chips can increase the heat or cold of the electrocaloric refrigeration device 520, facilitating the application of the electrocaloric refrigeration device 520 in large equipment.

[0169] When the electrocaloric refrigeration device 520 includes multiple electrocaloric refrigeration chips, the multiple electrocaloric refrigeration chips can be arranged in an array. In this way, each part of the electrocaloric refrigeration device 520 can release or absorb heat evenly, and the electrocaloric refrigeration device 520 forms a square structure, facilitating the application of the electrocaloric refrigeration device 520 in large equipment.

[0170] Optionally, the first electrode layer 1 is provided with an electrode gap 13. The electrode gap 13 divides the first electrode layer 1 into an electrocaloric refrigeration electrode region 11 and a piezoelectric drive electrode region 12. Among them, the electrocaloric refrigeration electrode region 11 corresponds to the piezoelectric refrigeration region, and the piezoelectric drive electrode region 12 corresponds to the piezoelectric displacement region. The electrocaloric refrigeration device 520 further includes an external power supply, and the external power supply is used for: applying a positive electric field to the electrocaloric refrigeration electrode region 11 and the piezoelectric drive electrode region 12 to cause displacements in the first direction in the piezoelectric displacement region and the piezoelectric refrigeration region; or, removing the electric field in the electrocaloric refrigeration electrode region, the piezoelectric refrigeration region of the piezoelectric functional film layer 4 absorbs heat, and at the same time, applying a reverse electric field to the piezoelectric drive electrode region 12 to cause the piezoelectric displacement region to drive the heat-absorbing piezoelectric refrigeration region to generate a displacement in the second direction.

[0171] Corresponding to the two different functional units of the piezoelectric refrigeration region and the piezoelectric displacement region, different electric fields need to be applied to the electrodes to stimulate different functional effects. Therefore, the first electrode layer 1 is provided with electrode gaps 13, so that the first electrode layer 1 is separated to form an electrocaloric refrigeration electrode region 11 corresponding to the piezoelectric refrigeration region and a piezoelectric drive electrode region 12 corresponding to the piezoelectric displacement region, and different electric fields are applied to the electrocaloric refrigeration electrode region 11 and the second electrode layer 2 and the piezoelectric drive electrode region 12 and the second electrode layer 2 to achieve the stimulation of different functional effects. Taking Figures 13 to 15 as an example, a positive electric field is applied to the electrocaloric refrigeration electrode region 11 and the piezoelectric drive electrode region 12, so that the piezoelectric displacement region and the piezoelectric refrigeration region generate displacements in the first direction, that is, Figure 14 move upward in the figure, the electrocaloric element 100 releases heat and adheres to the heat receiving end 300; the electric field of the electrocaloric refrigeration motor region is removed, the piezoelectric refrigeration region of the piezoelectric functional film layer 4 absorbs heat, and at the same time, a reverse electric field is applied to the piezoelectric drive electrode region 12, so that the piezoelectric displacement region drives the heat-absorbing piezoelectric refrigeration region to generate a displacement in the second direction, that is, Figure 15 move downward in the figure, and the electrocaloric element 100 absorbs heat and adheres to the cold receiving end 400.

[0172] The above description and the drawings fully illustrate the embodiments of the present disclosure so that those skilled in the art can practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, the individual components and functions are optional, and the order of operations may vary. Some parts and features of some embodiments may be included in or replace parts and features of other embodiments. The embodiments of the present disclosure are not limited to the structures already described and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electrocaloric spray heat exchange component, characterized in that, it comprises: a nozzle device, including a housing, the housing is provided with an inlet for a heat exchange working medium and a spray port for the heat exchange working medium, and the housing encloses a distribution cavity close to the inlet for the heat exchange working medium and a spray cavity close to the spray port for the heat exchange working medium and communicating with the distribution cavity; and, an electrocaloric refrigeration device, alternately generating heat and cold, wherein, an accommodation cavity communicating with the spray cavity is further arranged in the housing, and at least part of the electrocaloric refrigeration device is arranged in the accommodation cavity, so that the heat exchange working medium sprayed from the spray cavity exchanges heat with the heat or cold generated by the electrocaloric refrigeration device.

2. The electrocaloric spray heat exchange component according to claim 1, characterized in that, the spray cavity comprises a first spray cavity and a second spray cavity, wherein, the accommodation cavity is arranged between the first spray cavity and the second spray cavity.

3. The electrocaloric spray heat exchange component according to claim 2, characterized in that, the second spray cavity is arranged on the periphery of the first spray cavity.

4. The electrocaloric spray heat exchange component according to claim 3, characterized in that, the housing comprises a first spray housing enclosing the first spray cavity and a second spray housing enclosing the second spray cavity, wherein, the first spray housing is provided with one or more first spray members facing the accommodation cavity, the first spray members are provided with a plurality of first spray ports, the second spray housing is provided with one or more second spray members facing the accommodation cavity, and the second spray members are provided with a plurality of second spray ports.

5. The electrocaloric spray heat exchange component according to claim 4, characterized in that, the first spray member and the second spray member are arranged opposite to each other.

6. The electrocaloric spray heat exchange component according to claim 2, characterized in that, the interior of the housing further comprises an accommodation top plate arranged at the top of the accommodation cavity, and, the accommodation top plate is arranged between the first spray cavity and the second spray cavity.

7. The electrocaloric spray heat exchange component according to claim 1, characterized in that, it further comprises: a guide vane, arranged in the distribution cavity, for guiding the heat exchange working medium entering from the inlet of the heat exchange working medium to the spray cavity.

8. The electrocaloric spray heat exchange component according to claim 1, characterized in that, the electrocaloric refrigeration device comprises a spray front end arranged in the accommodation cavity and a spray end corresponding to the spray front end, wherein, the electrocaloric spray heat exchange component comprises a plurality of obliquely arranged electrocaloric refrigeration devices, and the spray ends of the plurality of electrocaloric refrigeration devices are in a converging shape.

9. The electrocaloric spray heat exchange component according to any one of claims 1 to 8, characterized in that, the electrocaloric refrigeration device comprises an electrocaloric refrigeration chip, and the electrocaloric refrigeration chip comprises: an electrocaloric element, including a first electrode layer, a second electrode layer, and a piezoelectric functional film layer, the piezoelectric functional film layer is arranged between the first electrode layer and the second electrode layer, the piezoelectric functional film layer comprises a piezoelectric refrigeration area and a piezoelectric displacement area formed by partitioning the piezoelectric film layer, and the piezoelectric displacement area is used to drive the piezoelectric refrigeration area to generate displacement; a heat receiving end, for receiving the heat of the electrocaloric element; and, a cold receiving end, for receiving the cold of the electrocaloric element.

10. A heat exchange system, characterized in that, it comprises the electrocaloric spray heat exchange component according to any one of claims 1 to 9.