Array flexible temperature-pressure sensor with high integration density and manufacturing method thereof

Abstract

The invention discloses an array flexible temperature-pressure sensor with high integration density. The array flexible temperature-pressure sensor comprises a plurality of temperature-pressure sensing units, a flexible supporting unit, a flexible top plate and a flexible bottom plate, a first patterned electrode and a second patterned electrode are deposited on the upper surface and the lower surface of the flexible supporting unit; the first patterned electrode comprises a plurality of transversely arranged electrodes, and the second patterned electrode comprises a plurality of longitudinally arranged electrodes; through holes are formed in the intersection points of the transversely arranged electrodes and the longitudinally arranged electrodes; the thermoelectric material is deposited on the side wall of the through hole to form a plurality of temperature and pressure sensing units in matrix arrangement; the temperature and pressure sensing unit is connected with the first patterned electrode and the second patterned electrode respectively; the flexible top plate and the flexible bottom plate are attached to the upper surface and the lower surface of the flexible supporting unit. Signal lines are welded to the two ends of each electrode. The high resolution brought by the high integration density of the sensor can test the distribution condition of external physical stimulation, and can be applied to the aspects of remote detection control, machine bionics and the like.

Description

Technical Field

[0001] The present invention belongs to the technical field of sensors, and relates to a high-integration-density array flexible temperature-pressure sensor and a manufacturing method thereof. Background Art

[0002] Electronic skin can have powerful sensing capabilities like human skin, and has broad application prospects in the field of wearable electronic devices. By covering it on the surface of human skin, prosthetics, or bionic robots, functions such as detecting the health status of the human body, collecting and feedback of medical device data, and real-time control can be achieved. However, the electronic skin that can achieve the functions of human skin not only requires a large number of sensors to monitor, test, and distinguish various external stimuli, such as simultaneously monitoring external pressure, temperature, humidity, slip sensation, etc.; but also requires various sensors to be miniaturized and matrixed to better distinguish smaller objects, approaching the resolution limit of human skin, and being able to achieve simultaneous detection of in-plane distributed physical stimuli and shape resolution of small objects. However, currently, most sensors have only a single sensing function, it is difficult to achieve multi-functional integration, and simple physical stacking is difficult to achieve miniaturization. Therefore, there is an urgent need for miniaturized sensors with multiple sensing functions and high inheritance density to form a sensing network, which is closer to the sensing function of human skin. Summary of the Invention

[0003] To solve the above technical problems, the object of the present invention is to provide a high-integration-density array flexible temperature-pressure sensor and a manufacturing method thereof. By combining magnetron sputtering thin film preparation technology, femtosecond laser micro-nano processing technology, physical mask template coating technology, ultraviolet ozone treatment technology, array reading and recognition technology, etc., the miniaturization and high-density integration of single-material dual sensors are realized.

[0004] The present invention provides a high-integration-density array flexible temperature-pressure sensor, including: a plurality of temperature-pressure sensing units arranged in a matrix, a flexible support unit, a flexible polyimide top plate, and a flexible polyimide bottom plate;

[0005] The flexible support unit is composed of a flexible PDMS or polyimide film, on the upper surface of which a first patterned electrode is deposited, and on the lower surface of which a second patterned electrode is deposited; the first patterned electrode is composed of a plurality of horizontally arranged electrodes, and the second patterned electrode is composed of a plurality of vertically arranged electrodes; through holes are provided at the intersections of the horizontally arranged electrodes and the vertically arranged electrodes, and a plurality of through hole arrays are arranged on the flexible support unit; thermoelectric materials are deposited on the side walls of each through hole to form a plurality of temperature and pressure sensing units arranged in a matrix; the temperature and pressure sensing units in each through hole are respectively connected to the corresponding horizontally arranged electrodes and vertically arranged electrodes; the flexible polyimide top plate and the flexible polyimide bottom plate are respectively closely attached to the upper and lower surfaces of the flexible support unit to protect the internal temperature and pressure sensing units, the first patterned electrode and the second patterned electrode; signal lines are welded to both ends of each electrode.

[0006] Further, the temperature and pressure sensing unit is an N-type or P-type thermoelectric unit.

[0007] Further, the temperature and pressure sensing unit uses an inorganic thermoelectric material, which can simultaneously give corresponding signal feedback to temperature and pressure stimuli, and is directly deposited on the side walls of the through holes of the flexible support unit to ensure good flexibility; the upper end of the temperature and pressure sensing unit is connected to the first patterned electrode, and the lower end of the temperature and pressure sensing unit is connected to the second patterned electrode.

[0008] Further, the inorganic thermoelectric material uses Bi 2 Te 3 -based, SnSe-based, Ag 2 Se-based materials.

[0009] The present invention also provides a manufacturing method for a high-integration-density array flexible temperature-pressure sensor, including:

[0010] Step 1: Use a mask deposition technique to deposit a plurality of horizontally distributed electrodes on the upper surface of the flexible support unit to form a first patterned electrode;

[0011] Step 2: Adopt the same method as in Step 1, and use a mask deposition technique to deposit a plurality of vertically distributed electrodes on the lower surface of the flexible support unit to form a second patterned electrode; the number of vertically distributed electrodes is the same as that of horizontally distributed electrodes;

[0012] Step 3: Adopt a femtosecond laser processing technique to fabricate through holes with flat side walls at the intersections of the horizontally arranged electrodes and the vertically arranged electrodes, and a plurality of through hole arrays are arranged on the flexible support unit;

[0013] Step 4: Adopt a mask deposition technique to deposit an inorganic thermoelectric material in the processed through-holes, and control the deposition of the inorganic thermoelectric material on the side walls and vicinity of the through-holes to ensure that the upper and lower ends of the temperature and pressure sensing units can be respectively connected and conductively connected to the first patterned electrode and the second patterned electrode, and finally form a plurality of temperature and pressure sensing units arranged in a matrix;

[0014] Step 5: Use an ultraviolet ozone treatment technique to bond the flexible polyimide top plate and the flexible polyimide bottom plate to the upper and lower surfaces of the flexible support unit respectively to ensure tight fitting together;

[0015] Step 6: Weld signal lines at both ends of each electrode to fabricate a micro flexible temperature-pressure sensor.

[0016] Further, the specific steps of Step 1 are as follows:

[0017] Step 1.1: Fabricate a patterned mask for depositing electrodes;

[0018] Step 1.2: Closely fit the patterned mask to the flexible support unit;

[0019] Step 1.3: Use magnetron sputtering to deposit multiple laterally distributed electrodes.

[0020] Further, the specific steps of Step 3 are as follows:

[0021] Step 3.1: According to the crossing positions of the laterally arranged electrodes and the longitudinally arranged electrodes, draw a matrix processing pattern for the part to be removed on the flexible support unit;

[0022] Step 3.2: Closely fit the flexible support unit on the processing displacement table, and ensure that the surface of the flexible support unit is flat and perpendicular to the femtosecond incident light beam;

[0023] Step 3.3: Based on the matrix processing pattern, use a low-power incident light and a galvanometer processing platform for sweeping;

[0024] Step 3.4: Adjust the vertical displacement table every time after sweeping to ensure that the femtosecond laser focus is located on the flexible support unit;

[0025] Step 3.5: Repeat the sweeping multiple times until penetration, and complete the processing of multiple through-holes arranged in a matrix on the flexible support unit.

[0026] Further, the specific steps of Step 4 are as follows:

[0027] Step 4.1: Fabricate a patterned mask for depositing the temperature and pressure sensing units;

[0028] Step 4.2: Closely fit the patterned mask to the flexible support unit and align the through-holes;

[0029] Step 4.3: Uniformly deposit inorganic thermoelectric materials on the sidewalls of the through-holes of the flexible support unit with the mask template pasted, to form multiple temperature and pressure sensing units arranged in a matrix. The upper and lower ends of each temperature and pressure sensing unit are respectively connected and conducted with the first patterned electrode and the second patterned electrode.

[0030] Further, the inorganic thermoelectric material is Bi 2 Te 3 -based, SnSe-based, Ag 2 Se-based materials; the flexible support unit is made of flexible PDMS or polyimide film.

[0031] Further, the inorganic thermoelectric material can simultaneously respond to temperature and pressure.

[0032] A high-integration-density array flexible temperature-pressure sensor and its manufacturing method of the present invention have at least the following beneficial effects:

[0033] 1. The temperature and pressure sensing units adopted by the present invention can use various inorganic materials such as Bi 2 Te 3 -based, SnSe-based, Ag 2 Se-based, etc., which can meet the requirements of testing in different temperature ranges and different sensing ranges.

[0034] 2. The high-integration-density micro flexible temperature-pressure sensor of the present invention adopts 10 patterned electrodes horizontally distributed on the upper surface and 10 patterned electrodes vertically distributed on the lower surface. By reading the signals through the electrode cross on the upper and lower surfaces, the signal reading of 100 device units distributed in a matrix can be realized, and the signal reading under miniaturization and high integration density can be realized, which is convenient for testing and analyzing the temperature and pressure distribution.

[0035] 3. The high-integration-density micro flexible temperature-pressure sensor of the present invention is jointly processed by femtosecond laser and galvanometer platform, with a small heat-affected zone, can realize high-precision micro-nano processing, and can realize the miniaturization of the sensor.

[0036] 4. The high-integration-density micro flexible temperature-pressure sensor of the present invention deposits inorganic thermoelectric materials on the sidewalls of the through-holes of the flexible substrate, can realize out-of-plane sensing, has a wider application space, and can improve the sensing sensitivity by regulating the inorganic thermoelectric materials.

[0037] 5. All components used in the high-integration-density micro flexible temperature-pressure sensor of the present invention are prepared with flexible materials, so that it can better fit the curved surface and can realize the temperature and pressure sensing on the surfaces of various complex curved objects. Description of the Drawings

[0038] Figure 1 It is a schematic structural diagram of a high-integration-density array flexible temperature-pressure sensor of the present invention;

[0039] 1 - Flexible polyimide top plate, 2 - First patterned electrode, 3 - Temperature and pressure sensing unit, 4 - Flexible support unit, 5 - Second patterned electrode, 6 - Flexible polyimide bottom plate, 41 - Through hole. Specific embodiments

[0040] The design concept of the present invention is as follows:

[0041] In the fields of intelligent medicine, Internet of Things, AI intelligent robots, etc., in order to achieve the detection, recording, and analysis of external physical stimuli (pressure, temperature) and its own conditions, specific temperature-pressure sensors are required. This not only requires the sensor to have good flexibility, but also requires the sensor to be miniaturized and highly integrated to achieve more accurate measurement of data and surface distribution. The present invention uses inorganic thermoelectric materials for dual sensing of temperature and pressure, and realizes miniaturization through femtosecond laser processing. It not only has excellent performance, but also has a greatly reduced size. However, there are three problems in realizing dual sensing of temperature and pressure with a single inorganic thermoelectric material. First, due to the too small size of a single sensing unit, it is difficult to fabricate the sensor; second, due to the intrinsic brittleness of inorganic thermoelectric materials with good performance, they cannot adapt to large-strain scenarios, and most inorganic flexible thermoelectric materials are planar, which is not conducive to constructing the required temperature difference. Third, the large number and high density of integration make the arrangement of signal electrodes very complicated and affect the device density of integration.

[0042] For the first problem mentioned above, femtosecond laser and galvanometer platform are used to perform micro-nano processing on the required support substrate, which can achieve more refined processing and higher processing accuracy. Using magnetron sputtering technology, the required inorganic thermoelectric thin film material can be deposited more uniformly on the prepared support substrate. For the second problem mentioned above, magnetron sputtering technology is used to deposit inorganic thermoelectric materials on flexible substrates such as flexible PDMS or polyimide films to meet the flexible requirements. At the same time, by designing and using different inorganic thermoelectric materials (such as Bi2Te3-based, SnSe-based, Ag2Se-based and other inorganic thermoelectric materials), the design corresponding to different strain degrees and temperature sensing sensitivities can be achieved. At the same time, the support substrate processed by femtosecond laser enables the inorganic thermoelectric material to be easily deposited on the side wall of the substrate during deposition to achieve out-of-plane sensing, and can better maintain the out-of-plane temperature difference. For the third problem mentioned above, through a reasonable device array layout, the signal electrodes are divided into a first patterned electrode and a second patterned electrode. The two electrodes are respectively connected to the upper and lower sides of the sensor device on the upper and lower surfaces of the support substrate. At the same time, the first patterned electrode and the second patterned electrode are distributed at 90°. There are ten on each of the upper and lower surfaces, so as to realize the measurement of the devices at each matrix point through the combination test of the electrodes on different upper and lower surfaces.

[0043] Based on the above design guiding ideology, the present invention has successfully fabricated a high-integration-density array flexible temperature-pressure sensor and its manufacturing method, which can basically realize the sensing function of temperature and pressure and array distribution measurement.

[0044] The following will combine the drawings and embodiments to elaborate in detail on a high-integration-density array flexible temperature-pressure sensor and its manufacturing method of the present invention.

[0045] As Figure 1 shown, a high-integration-density array flexible temperature-pressure sensor of the present invention includes: a plurality of temperature-pressure sensing units 3 arranged in a matrix, a flexible support unit 4, a flexible polyimide top plate 1 and a flexible polyimide bottom plate 6.

[0046] The flexible support unit 4 is composed of a flexible PDMS or polyimide film, on the upper surface of which a first patterned electrode 2 is deposited, and on the lower surface of which a second patterned electrode 5 is deposited. The first patterned electrode 2 is composed of a plurality of laterally arranged electrodes, and the second patterned electrode 5 is composed of a plurality of longitudinally arranged electrodes. Through holes 41 are provided at the intersections of the laterally arranged electrodes and the longitudinally arranged electrodes, and a plurality of through holes 41 are arranged in an array on the flexible support unit 4. Thermoelectric materials are deposited on the side walls of each through hole 41 to form a plurality of temperature and pressure sensing units 3 arranged in a matrix. The temperature and pressure sensing units 3 in each through hole 41 are respectively connected to the corresponding laterally arranged electrodes and longitudinally arranged electrodes. The flexible polyimide top plate 1 and the flexible polyimide bottom plate 6 are respectively closely attached to the upper and lower surfaces of the flexible support unit 4 to protect the internal temperature and pressure sensing units 3, the first patterned electrode 2 and the second patterned electrode 5. Signal lines are welded to both ends of each electrode.

[0047] In specific implementation, the temperature and pressure sensing unit is an N-type or P-type thermoelectric unit. The N-type or P-type thermoelectric units are attached to the side walls of the corresponding through holes of the flexible support unit 4 in an array. The second patterned electrode 5 on the lower surface of the flexible support unit 4 is connected to the lower ends of each temperature and pressure sensing unit 3. The second patterned electrode 5 is composed of 10 longitudinally arranged electrodes, and each longitudinally arranged electrode is connected to the lower ends of 10 temperature and pressure sensing units 3. The first patterned electrode 2 on the upper surface of the flexible support unit 4 is composed of 10 laterally arranged electrodes. The laterally arranged electrodes are perpendicular to the longitudinally arranged electrodes and are connected to the upper ends of each temperature and pressure sensing unit 3. By reading the signals through the intersection of the 10 patterned electrodes distributed horizontally on the upper surface and the 10 patterned electrodes distributed vertically on the lower surface, the signal reading of 100 device units distributed in a matrix can be realized, and the signal reading under miniaturization and high integration density can be realized, which is convenient for testing and analyzing the temperature and pressure distribution.

[0048] In specific implementation, the temperature and pressure sensing unit 3 uses an inorganic thermoelectric material, specifically Bi 2 Te 3 -based, SnSe-based, Ag 2 Se-based materials. It can simultaneously have corresponding signal feedback to temperature and pressure stimuli, and is directly deposited on the side walls of the through holes of the flexible support unit to ensure good flexibility.

[0049] In specific implementation, the through hole is a rectangular through hole, and thermoelectric materials are deposited on the 4 side walls of the through hole to form a temperature and pressure sensing unit with a rectangular hollow structure.

[0050] A manufacturing method of an array flexible temperature-pressure sensor with a high integration density according to the present invention includes the following steps:

[0051] Step 1: Deposit multiple horizontally distributed electrodes on the upper surface of the flexible support unit 4 by using a mask deposition technique to form the first patterned electrode 2. Specifically:

[0052] Step 1.1: Fabricate a patterned mask for depositing the electrodes.

[0053] Step 1.2: Closely attach the patterned mask to the flexible support unit.

[0054] Step 1.3: Deposit multiple horizontally distributed electrodes by using magnetron sputtering.

[0055] Step 2: Use the same method as in Step 1. Deposit multiple vertically distributed electrodes on the lower surface of the flexible support unit 4 by using a mask deposition technique to form the second patterned electrode 5. The number of vertically distributed electrodes is the same as that of the horizontally distributed electrodes.

[0056] During specific implementation, cut a polyimide film or a PDMS film with a thickness of 100 um - 300 um into a 20 mm × 20 mm square sheet. Then attach a pre-prepared stainless steel mask to the cut polyimide film or PDMS film, and use magnetron sputtering technology to deposit Cr / Pt or Cr / Au electrodes on its upper and lower surfaces to form the first patterned electrode 2 and the second patterned electrode 5, where the thickness of the electrode layer is 100 nm - 300 nm.

[0057] Step 3: Use a femtosecond laser processing technology to fabricate through-holes 41 with flat sidewalls at the intersection points of the horizontally arranged electrodes and the vertically arranged electrodes. Multiple through-hole arrays are arranged on the flexible support unit 4. Specifically:

[0058] Step 3.1: According to the intersection positions of the horizontally arranged electrodes and the vertically arranged electrodes, draw a matrix processing pattern of the part to be removed on the flexible support unit.

[0059] Step 3.2: Closely attach the flexible support unit to the processing displacement stage, and ensure that the surface of the flexible support unit is flat and perpendicular to the femtosecond incident light beam.

[0060] Step 3.3: Based on the matrix processing pattern, use a low-power incident light and perform sweeping using a galvanometer processing platform.

[0061] Step 3.4: Adjust the vertical displacement stage every time after one sweep to ensure that the femtosecond laser focus is on the flexible support unit.

[0062] Step 3.5: Repeat the sweeping multiple times until penetration, and complete the processing of multiple matrices of through-holes arranged on the flexible support unit.

[0063] Step 4: Using the mask deposition technique, deposit inorganic thermoelectric materials in the processed through-holes, and control the deposition of the inorganic thermoelectric materials on the side walls and vicinity of the through-holes to ensure that the upper and lower ends of the temperature and pressure sensing units can be respectively connected and conductively connected to the first patterned electrode and the second patterned electrode, finally forming a plurality of temperature and pressure sensing units arranged in a matrix. Specifically:

[0064] Step 4.1: Fabricate a patterned mask for depositing the temperature and pressure sensing units.

[0065] Step 4.2: Closely attach the patterned mask to the flexible support unit and align the through-holes.

[0066] Step 4.3: Uniformly deposit inorganic thermoelectric materials on the side walls of the through-holes of the flexible support unit with the mask attached, forming a plurality of temperature and pressure sensing units arranged in a matrix. The upper and lower ends of each temperature and pressure sensing unit are respectively connected and conductively connected to the first patterned electrode and the second patterned electrode.

[0067] The inorganic thermoelectric material can respond to both temperature and pressure, specifically using Bi 2 Te 3 -based, SnSe-based, Ag 2 Se-based materials.

[0068] Step 5: Use the ultraviolet ozone treatment technique to bond the flexible polyimide top plate and the flexible polyimide bottom plate to the upper and lower surfaces of the flexible support unit respectively to ensure they are closely attached together.

[0069] Specifically in implementation, deposit 80 nm of SiO 2 on the lower surface of the flexible polyimide top plate 1 and the upper surface of the flexible polyimide bottom plate 6 using the mask deposition technique. Use the ultraviolet ozone treatment technique to treat the lower surface of the flexible polyimide top plate 1, the upper surface of the flexible polyimide bottom plate 6, and the upper and lower surfaces of the flexible support unit 4. After aligning and attaching the flexible polyimide top plate 1, the flexible support unit 4, and the flexible polyimide bottom plate 6, apply a pressure of 1000 Pa and heat in an oven at 100 °C for 30 min to achieve irreversible bonding.

[0070] Step 6: Weld signal lines to both ends of each electrode to fabricate a micro flexible temperature-pressure sensor.

[0071] Through the above steps, the required high-integration-density array flexible temperature-pressure sensor can be successfully fabricated. The sensor prepared by this method has good flexibility and temperature-pressure distribution resolution, and is expected to play an important role in fields such as remote detection and control, human-computer interaction, and machine bionics.

[0072] The content of the present invention is further explained or illustrated by the following examples.

[0073] Example 1: Bionic Skin for Robots

[0074] By pasting the high-integration-density array micro flexible temperature-pressure sensors of the present invention on the bionic fingers of a humanoid robot, the ability of human fingers to sense temperature and pressure can be achieved. Moreover, the distribution of temperature and pressure can also be sensed, and then the shape and temperature distribution of the touched object can be sensed. When the bionic manipulator touches small objects (such as rice grains, screws, etc.), the external computing circuit can detect, record and analyze the voltage change signals and resistance change signals generated by each micro temperature sensing unit when touching the object, so as to obtain the corresponding induced temperature values and pressure values at each dot matrix. By analyzing the results of the array distribution, the shape and temperature distribution of the touched object can be obtained. In industrial automation, it can complete dangerous or complex tasks, such as destroying items, picking up or reorganizing parts; in the medical field, it assists surgical robots to complete micro operations, imitating the accuracy and flexibility of the human hand; in the field of service robots, it is used for item classification, placement and cleaning tasks in the home environment.

[0075] Example 2: Intelligent Medical Health Detection

[0076] By pasting the high-integration-density micro flexible temperature-pressure sensors of the present invention at the prosthetic wearing position, in the monitoring of the prosthetic wearing fit, the human muscle pressure distribution and temperature distribution information of the wearing part can be collected in real time through the high-density array sensors, so as to provide a scientific basis for evaluating the fit of the prosthetic. This technology can help the medical team dynamically understand the muscle state of the patient when wearing the prosthetic, including whether there is excessive pressure or poor temperature distribution, so as to optimize the prosthetic design and wearing plan. Through real-time monitoring, the comfort, functionality of the prosthetic and the patient's use experience can be effectively improved, and at the same time, the risk of complications caused by improper wearing of the prosthetic can be reduced, providing a high-precision and high-efficiency solution for intelligent medical health detection.

[0077] The above are only the preferred embodiments of the present invention, and are not intended to limit the idea of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high integration density array flexible temperature-pressure sensor, characterized in that: include: A plurality of temperature and pressure sensing units, a flexible support unit, a flexible polyimide top plate and a flexible polyimide bottom plate arranged in a matrix; The flexible support unit is composed of a flexible PDMS or polyimide film, with a first patterned electrode deposited on its upper surface and a second patterned electrode deposited on its lower surface; the first patterned electrode is composed of a plurality of transversely arranged electrodes, and the second patterned electrode is composed of a plurality of longitudinally arranged electrodes; through holes are provided at the intersections of the transversely arranged electrodes and the longitudinally arranged electrodes, and a plurality of through hole arrays are arranged on the flexible support unit; thermoelectric materials are deposited on the side walls of each through hole to form a plurality of temperature and pressure sensing units arranged in a matrix; the temperature and pressure sensing units in each through hole are respectively connected to the corresponding transversely arranged electrodes and longitudinally arranged electrodes; the flexible polyimide top plate and the flexible polyimide bottom plate are respectively tightly attached to the upper and lower surfaces of the flexible support unit to protect the internal temperature and pressure sensing units, the first patterned electrode and the second patterned electrode; signal lines are respectively welded at both ends of each electrode.

2. The high integration density array flexible temperature-pressure sensor according to claim 1, characterized in that: The temperature and pressure sensing unit is an N-type or P-type thermoelectric unit.

3. The micro flexible temperature-pressure sensor with high integration density as claimed in claim 1 or 2, characterized in that: The temperature and pressure sensing unit adopts inorganic thermoelectric materials, which can provide corresponding signal feedback for temperature and pressure stimulation at the same time. It is directly deposited on the side wall of the through hole of the flexible support unit to ensure good flexibility; the upper end of the temperature and pressure sensing unit is connected to the first patterned electrode, and the lower end of the temperature and pressure sensing unit is connected to the second patterned electrode.

4. The micro flexible temperature-pressure sensor with high integration density as claimed in claim 3, characterized in that: The inorganic thermoelectric material adopts Bi2Te3-based, SnSe-based, and Ag2Se-based materials.

5. A method for manufacturing a high integration density array flexible temperature-pressure sensor, characterized in that: include: Step 1: Depositing a plurality of laterally distributed electrodes on the upper surface of the flexible support unit using a mask deposition technique to form a first patterned electrode; Step 2: using the same method as step 1, a plurality of longitudinally distributed electrodes are deposited on the lower surface of the flexible support unit using a mask deposition technique to form a second patterned electrode; the number of the longitudinally distributed electrodes is the same as the number of the transversely distributed electrodes; Step 3: Using femtosecond laser processing technology, a through hole with a smooth side wall is made at the intersection of the transversely arranged electrodes and the longitudinally arranged electrodes, and a plurality of through hole arrays are arranged on the flexible support unit; Step 4: using a mask deposition technique to deposit an inorganic thermoelectric material in the processed through hole, and controlling the inorganic thermoelectric material to be deposited on and near the sidewall of the through hole, so as to ensure that the upper end and the lower end of the temperature and pressure sensing unit can be connected and conducted with the first patterned electrode and the second patterned electrode respectively, and finally forming a plurality of temperature and pressure sensing units arranged in a matrix; Step 5: Use ultraviolet ozone treatment technology to bond the flexible polyimide top plate, the flexible polyimide bottom plate and the upper and lower surfaces of the flexible support unit respectively to ensure that they are closely attached together; Step 6: Solder signal wires at both ends of each electrode to make a miniature flexible temperature-pressure sensor.

6. The method for manufacturing a micro flexible temperature-pressure sensor with high integration density as claimed in claim 5, characterized in that: The step 1 is specifically as follows: Step 1.1: Making a patterned mask for depositing electrodes; Step 1.2: The patterned mask is tightly attached to the flexible support unit; Step 1.3: Deposit multiple laterally distributed electrodes using magnetron sputtering.

7. The method for manufacturing a micro flexible temperature-pressure sensor with high integration density as claimed in claim 5, characterized in that: The step 3 is specifically as follows: Step 3.1: Draw a matrix processing pattern of the portion to be removed on the flexible support unit according to the intersection position of the electrodes arranged horizontally and the electrodes arranged vertically; Step 3.2: Fit the flexible support unit tightly onto the processing translation stage, and ensure that the surface of the flexible support unit is flat and perpendicular to the incident femtosecond beam; Step 3.3: Based on the matrix processing pattern, use low-power incident light and use the galvanometer processing platform to sweep; Step 3.4: After each sweep, the vertical translation stage needs to be adjusted to ensure that the focus of the femtosecond laser is located on the flexible support unit; Step 3.5: Repeat the sweeping several times until penetration is achieved, and a plurality of through holes arranged in a matrix on the flexible support unit are processed.

8. The method for manufacturing a micro flexible temperature-pressure sensor with high integration density as claimed in claim 5, characterized in that: The step 4 is specifically as follows: Step 4.1: Making a patterned mask for depositing a temperature and pressure sensing unit; Step 4.2: Fit the patterned mask closely to the flexible support unit and align the through holes; Step 4.3: Evenly deposit inorganic thermoelectric material on the sidewalls of the through holes of the flexible support unit with the mask attached to form a plurality of temperature and pressure sensing units arranged in a matrix, wherein the upper and lower ends of each temperature and pressure sensing unit are respectively connected to the first patterned electrode and the second patterned electrode.

9. The method for manufacturing a micro flexible temperature-pressure sensor with high integration density as claimed in claim 8, characterized in that: The inorganic thermoelectric material adopts Bi2Te3-based, SnSe-based, and Ag2Se-based materials; the flexible support unit adopts flexible PDMS or polyimide film.

10. The method for manufacturing a micro flexible temperature-pressure sensor with high integration density as claimed in claim 8, characterized in that: The inorganic thermoelectric material can respond to temperature and pressure simultaneously.

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