Optical parameter measuring device and optical parameter measuring method

Abstract

The invention relates to an optical parameter measuring device and an optical parameter measuring method. The device comprises a measuring arm which is provided with a plurality of illuminance sensors; the rotating part is fixedly connected with one end of the measuring arm; the position adjusting assembly is connected with the rotating component; the processor is connected with the illuminance sensor, the rotating part and the position adjusting assembly, the processor is used for controlling the rotating part to drive the measuring arm to rotate, and the processor is used for controlling the position adjusting assembly to adjust the spatial position where the measuring arm is located. The processor is used for determining optical parameter information according to illuminance information collected by the illuminance sensor. According to the optical parameter measuring device, optical parameters in a large circular area can be measured by using the rotatable measuring arm, the illuminance sensor does not need to be moved repeatedly, the measuring time is shortened, and the measuring efficiency is improved.

Description

Technical Field

[0001] This application relates to the technical field of optical performance detection, and particularly to an optical parameter measurement device and an optical parameter measurement method. Background Art

[0002] With the development of society and the progress of technology, the surgical shadowless lamp has gradually become an indispensable part of surgeries. The surgical shadowless lamp can illuminate the surgical part of the patient, facilitating medical staff to observe the surgical wound of the patient. Through the irradiation of the surgical shadowless lamp, the shadow interference of external objects during the surgery is avoided. During the production process of the surgical shadowless lamp, quality inspection is required to determine whether its optical parameters meet the requirements. In related technologies, an optical parameter measurement device is used to perform quality inspection on the surgical shadowless lamp. When obtaining optical parameter information, generally a single illuminance sensor is used, and then the illuminance sensor is moved manually or by an automatic mechanical device to obtain illuminance data on multiple optical planes, thereby determining the optical parameter information of the surgical shadowless lamp. However, this method requires repeated movement of the illuminance sensor during the measurement process, resulting in a long measurement time and low measurement efficiency. Summary of the Invention

[0003] Based on this, it is necessary to provide an optical parameter measurement device and an optical parameter measurement method with relatively high measurement efficiency for the above technical problems.

[0004] In a first aspect, this application provides an optical parameter measurement device, including: a measurement arm, on which a plurality of illuminance sensors are arranged; a rotating component, fixedly connected to one end of the measurement arm; a position adjustment component, connecting the rotating component; a processor, respectively connecting the illuminance sensors, the rotating component, and the position adjustment component. The processor is used to control the rotating component to drive the measurement arm to rotate, the processor is used to control the position adjustment component to adjust the spatial position of the measurement arm, and the processor is used to determine optical parameter information according to the illuminance information collected by the illuminance sensors.

[0005] In one embodiment, the position adjustment component includes: a measurement platform, a vertical lead screw, and a vertical motor. The measurement platform is connected to the rotating component, the measurement platform is sleeved on the vertical lead screw, and the vertical motor is connected to the processor. The vertical motor is used to drive the vertical lead screw to rotate to control the vertical height of the measurement platform.

[0006] In one embodiment, the plurality of illuminance sensors are arranged on the same straight line, and the adjacent two illuminance sensors are arranged at a preset distance.

[0007] In one embodiment, the rotating component includes: a horizontal motor, which is connected to the processor and is used to drive the measurement arm to rotate under the control of the processor.

[0008] In a second aspect, the present application further provides an optical parameter measurement method, which is applied to the optical parameter measurement device described in the embodiments of the first aspect. The method includes:

[0009] Obtain the illuminance information detected by the illuminance sensor at different rotation angles and different vertical heights of the measurement arm to obtain spatial illuminance information; determine the three-dimensional space illuminance distribution information based on the spatial illuminance information; and determine the optical parameter information according to the three-dimensional space illuminance distribution information.

[0010] In one embodiment, the step of obtaining the illuminance information detected by the illuminance sensor at different rotation angles and different vertical heights of the measurement arm to obtain spatial illuminance information includes: obtaining the illuminance information detected by the illuminance sensor when the measurement arm rotates one week at a preset vertical height to obtain planar illuminance information; and obtaining the spatial illuminance information according to the planar illuminance information at different preset vertical heights.

[0011] In one embodiment, the step of obtaining the spatial illuminance information according to the illuminance information detected by the illuminance sensor at different rotation angles and different vertical heights of the measurement arm includes: obtaining the illuminance information detected by the illuminance sensor when the measurement arm moves vertically at a preset speed and rotates at a preset angle to obtain the spatial illuminance information.

[0012] In one embodiment, the optical parameter information includes: the maximum central illuminance. The step of determining the optical parameter information according to the three-dimensional space illuminance distribution information includes: determining the planar illuminance distribution information at different vertical heights according to the three-dimensional space illuminance distribution information; determining the central illuminance according to the planar illuminance distribution information; and screening out the maximum value based on the central illuminance at different vertical heights to obtain the maximum central illuminance.

[0013] In one embodiment, the step of determining the central illuminance according to the planar illuminance distribution information includes: determining the extreme position on the horizontal axis according to the projection data of the planar illuminance distribution information on the horizontal axis; determining the extreme position on the vertical axis according to the projection data of the planar illuminance distribution information on the vertical axis; and using the illuminance values located at the extreme position on the horizontal axis and the extreme position on the vertical axis as the central illuminance.

[0014] In one embodiment, the optical parameter information further includes at least one of: spot diameter, spot distribution uniformity, and light column depth.

[0015] The above optical parameter measurement device and optical parameter measurement method set multiple illuminance sensors on the measurement arm, then fixedly connect one end of the measurement arm to the rotating component, and connect the rotating component through the position adjustment component. When measuring the optical parameters, the controller can drive the measurement arm to rotate through the rotating component, so as to complete the detection of the optical signal in the circular area. Moreover, the spatial position of the measurement arm is adjusted through the position adjustment component, so as to complete the detection of the optical signal in the circular areas at different positions. The optical parameter measurement device of the present application can complete the measurement of the optical parameters in a relatively large circular area by using a rotatable measurement arm, without repeatedly moving the illuminance sensor, thus improving the measurement efficiency. Description of the Drawings

[0016] Figure 1 Schematic diagram of the optical parameter measurement device in one embodiment;

[0017] Figure 2 Schematic flowchart of the optical parameter measurement method in one embodiment;

[0018] Figure 3 Schematic flowchart of obtaining the spatial illuminance information in one embodiment;

[0019] Figure 4 Schematic flowchart of obtaining the spatial illuminance information in another embodiment;

[0020] Figure 5 Schematic diagram of the measurement arm rotating measurement in one embodiment;

[0021] Figure 6 Schematic diagram of the illuminance distribution in one embodiment;

[0022] Figure 7 Schematic diagram of the three-dimensional space illuminance distribution in one embodiment;

[0023] Figure 8 Schematic flowchart of obtaining the maximum central illuminance in one embodiment;

[0024] Figure 9 Schematic flowchart of determining the central illuminance in one embodiment;

[0025] Figure 10 Schematic diagram of one-dimensional projection according to the plane illuminance distribution information in one embodiment;

[0026] Figure 11 Schematic diagram of the light column depth parameter curve in one embodiment.

[0027] Description of the reference numerals:

[0028] Measuring arm 110, illuminance sensor 111, rotating member 120, position adjustment assembly 130, processor 140, measuring platform 131, vertical lead screw 132, vertical motor 133. Detailed implementation mode

[0029] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. Embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the specification of this application herein are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0031] It can be understood that the terms "first", "second", etc. used in this application can be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from another element.

[0032] Spatial relationship terms such as "under", "below", "lower", "beneath", "above", "upper", etc. can be used herein to describe the relationship between an element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientation shown in the figure, spatial relationship terms also include different orientations of the device during use and operation. For example, if the device in the drawing is flipped, the element or feature described as "under other elements" or "beneath it" or "under it" will be oriented "above" other elements or features. Therefore, the exemplary terms "under" and "beneath" can include both the upper and lower orientations. In addition, the device can also include other orientations (such as rotating 90 degrees or other orientations), and the spatial description language used herein is accordingly interpreted.

[0033] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediate element. In addition, "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc. if there is an electrical signal or data transmission between the connected objects.

[0034] As used herein, the singular forms "a", "an" and "the" may also include the plural forms unless the context clearly dictates otherwise. It should also be understood that the terms "comprising", "including" or "having" and the like specify the presence of the stated features, wholes, steps, operations, components, parts or combinations thereof, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the related listed items.

[0035] In one embodiment, as Figure 1 shown, an optical parameter measurement device is provided, including: a measurement arm 110, a rotating member 120, a position adjustment assembly 130, and a processor 140. A plurality of illuminance sensors 111 are provided on the measurement arm 110; the rotating member 120 is fixedly connected to one end of the measurement arm 110; the position adjustment assembly 130 is connected to the rotating member 120; the processor 140 is respectively connected to the illuminance sensors 111, the rotating member 120, and the position adjustment assembly 130. The processor 140 is configured to control the rotating member 120 to drive the measurement arm 110 to rotate, the processor 140 is configured to control the position adjustment assembly 130 to adjust the spatial position of the measurement arm 110, and the processor 140 is configured to determine optical parameter information based on the illuminance information collected by the illuminance sensors 111.

[0036] Specifically, the measurement arm 110 is generally arranged in a cuboid structure. A plurality of illuminance sensors 111 are provided on the upper surface of the measurement arm 110. Each illuminance sensor 111 is communicatively connected to the processor 140. The illuminance sensors 111 are configured to detect the illuminance information emitted by the surgical shadowless lamp and send the detected illuminance information to the processor 140. One end of the measurement arm 110 is fixedly connected to the rotating member 120. Preferably, the end of the measurement arm 110 is fixedly connected to the rotating member 120, and the measurement arm 110 can rotate around the connection point between the rotating member 120 and the measurement arm 110. The position adjustment end of the position adjustment assembly 130 is connected to the rotating member 120 and is used to adjust the vertical or horizontal position of the rotating member 120. Correspondingly, the spatial position of the measurement arm 110 is adjusted simultaneously. It can be understood that the measurement arm 110 can complete the detection of the illuminance information in the horizontal direction by rotating in the horizontal direction. Therefore, the position adjustment assembly 130 can only adjust the position of the measurement arm 110 in the vertical direction, so as to complete the detection of the illuminance information within a certain vertical height range. The position adjustment assembly 130 can also adjust the shape of the measurement arm 110 in the non-working state. For example, the measurement arm 110 can be vertically placed along its length direction, which can further reduce the space occupied by the measurement arm 110 in the horizontal direction.

[0037] When measuring the optical parameters of the surgical shadowless lamp, the processor 140 can move the measuring arm 110 to a certain vertical height through the position adjustment component 130, and then drive the measuring arm 110 to rotate one week through the rotating component 120. During the rotation of the measuring arm 110, the illuminance sensor 111 detects the illuminance information in real time, so as to complete the detection of the illuminance information of the circular area at the current vertical height. Then, the processor 140 moves the measuring arm 110 to other vertical heights through the position adjustment component 130 and re-detects the illuminance information. By repeating the above steps, the detection of the illuminance information within a certain vertical height range can be completed. According to the detected illuminance information, the processor 140 can calculate the corresponding optical parameter information through the built-in algorithm. The optical parameter information may include: maximum central illuminance, spot diameter, spot distribution uniformity, shadowless rate, light column depth, etc.

[0038] For the above optical parameter measuring device, by arranging a plurality of illuminance sensors 111 on the measuring arm 110, one end of the measuring arm 110 is fixedly connected to the rotating component 120, and the rotating component 120 is connected through the position adjustment component 130. When measuring the optical parameters, the controller can drive the measuring arm 110 to rotate through the rotating component 120, so as to complete the detection of the optical signal in the circular area. Moreover, the spatial position of the measuring arm 110 is adjusted through the position adjustment component 130, so as to complete the detection of the optical signal in the circular areas at different positions. The optical parameter measuring device of the embodiment of the present application can complete the measurement of the optical parameters in a larger circular area by using the rotatable measuring arm 110 and the illuminance sensors 111 arranged on the measuring arm 110, without repeatedly moving the illuminance sensors 111, thus improving the measurement efficiency.

[0039] In one embodiment, as Figure 1 shown, the position adjustment component 130 includes: a measuring platform 131, a vertical lead screw 132 and a vertical motor 133. The measuring platform 131 is connected to the rotating component 120. The measuring platform 131 is sleeved on the vertical lead screw 132. The vertical motor 133 is connected to the processor 140. The vertical motor 133 is used to drive the vertical lead screw 132 to rotate to control the vertical height of the measuring platform 131.

[0040] Specifically, the position adjustment component 130 in this embodiment has the function of adjusting the vertical height. The measurement platform 131 is horizontally arranged. One end of the measurement platform 131 is connected to the rotating component 120, and the other end of the measurement platform 131 is sleeved on the vertical lead screw 132. The vertical lead screw 132 and the measurement platform 131 can be a ball screw mechanism, a lead screw nut mechanism or a screw drive mechanism, which can convert the rotational motion of the vertical lead screw 132 into the linear motion of the measurement platform 131, so that the measurement platform 131 moves in the vertical direction. The vertical motor 133 can be connected to the vertical lead screw 132 through a transmission gear. The vertical motor 133 is used to rotate under the control of the processor 140, so as to drive the vertical lead screw 132 to rotate. When it is necessary to adjust the vertical height of the measurement arm 110, the processor 140 controls the vertical motor 133 to rotate in a certain direction, and then the vertical motor 133 drives the vertical lead screw 132 to rotate through the transmission gear. When the vertical lead screw 132 rotates, the measurement platform 131 will move in the vertical height, so as to adjust the spatial position of the measurement arm 110 in the vertical height. In some other embodiments, the position adjustment component 130 can use components such as a robotic arm, and the position adjustment component 130 can also have the function of adjusting the horizontal position of the measurement arm 110.

[0041] In one embodiment, multiple illuminance sensors 111 are arranged on the same straight line, and the adjacent two illuminance sensors 111 are arranged at a preset distance. Specifically, in this embodiment, multiple illuminance sensors 111 are arranged in a straight line on the measurement arm 110 and are only arranged in one row. In some other embodiments, multiple illuminance sensors 111 can also be arranged in multiple rows, and each row is arranged along the radius of the circular area formed when the measurement arm 110 rotates. When multiple illuminance sensors 111 are arranged on the same straight line, the adjacent two illuminance sensors 111 are arranged at a preset distance, that is, the positions of the illuminance sensors 111 on the measurement arm 110 are evenly distributed. In some other embodiments, the distance between the adjacent two illuminance sensors 111 can gradually decrease along the position close to the rotation center, so as to collect more illuminance information of the center of the circular area formed when the measurement arm 110 rotates.

[0042] In one embodiment, the rotating component 120 includes: a horizontal motor, the horizontal motor is connected to the processor 140, and the horizontal motor is used to drive the measurement arm 110 to rotate under the control of the processor 140. Specifically, in this embodiment, the rotating shaft of the horizontal motor is fixedly connected to one end of the measurement arm 110, and the main body of the horizontal motor is fixedly connected to the position adjustment component 130. By arranging a horizontal motor in the rotating component 120, the processor 140 can obtain the rotation angle of the rotating shaft of the horizontal motor, which is convenient for positioning the current spatial position of the measurement arm 110.

[0043] In one embodiment, the present application further provides an optical parameter measurement method, which is applied to the optical parameter measurement device in the above embodiment. The implementation solution for solving the problem provided by this method is similar to the implementation solution described in the above device. Therefore, the specific limitations in one or more embodiments of the optical parameter measurement method provided below can refer to the limitations on the optical parameter measurement device in the foregoing text, and will not be elaborated herein.

[0044] In one embodiment, as Figure 2 shown, an optical parameter measurement method is provided. Taking the case where this method is applied to the Figure 1 processor 140 in as an example, the method includes the following steps:

[0045] Step S210, obtain the illuminance information detected by the illuminance sensor at different rotation angles and different vertical heights of the measurement arm to obtain spatial illuminance information.

[0046] Specifically, when the optical parameter measurement device needs to detect the optical parameter information of the surgical shadowless lamp, the controller will rotate the measurement arm 110 by controlling the rotating component 120, and at the same time adjust the vertical height of the measurement arm 110 through the position adjustment component 130. It can be understood that the illuminance information at this time includes the vertical height, rotation angle of the measurement arm 110, and the illuminance value corresponding to the rotation angle.

[0047] Step S220, determine the three-dimensional space illuminance distribution information based on the spatial illuminance information.

[0048] Specifically, the collected spatial illuminance information is discrete data. At this time, through an interpolation algorithm (such as linear interpolation, polynomial interpolation, etc.), the illuminance values at different rotation angles and different vertical heights can be converted into the illuminance distribution in the three-dimensional space, so as to obtain the three-dimensional space illuminance distribution information.

[0049] Step S230, determine the optical parameter information according to the three-dimensional space illuminance distribution information.

[0050] Specifically, after obtaining the three-dimensional space illuminance distribution information, the processor 140 can calculate the optical parameter information according to the built-in algorithm. Among them, the optical parameter information may include: maximum central illuminance, spot diameter, spot distribution uniformity, shadowless rate, light column depth, etc.

[0051] The above optical parameter measurement method uses a rotatable and liftable measurement arm 110, and collects the illuminance through the illuminance sensor 111 provided on the measurement arm 110, thereby determining the illuminance distribution information in the three-dimensional space, so as to conveniently complete the collection of the illuminance in the three-dimensional space, and determine the optical parameter information according to the illuminance distribution information in the three-dimensional space. During the process of measuring the optical parameters, there is no need to repeatedly move the illuminance sensor, which reduces the measurement time and improves the measurement efficiency.

[0052] In one embodiment, as Figure 3 shown, in step S210, the step of obtaining the illuminance information detected by the illuminance sensor at different rotation angles and different vertical heights of the measurement arm to obtain the spatial illuminance information includes:

[0053] Step S211, obtaining the illuminance information detected by the illuminance sensor when the measurement arm rotates one week at a preset vertical height to obtain the planar illuminance information.

[0054] Specifically, in this embodiment, first, the illuminance information detected by the illuminance sensor 111 when the measurement arm 110 rotates one week at a preset vertical height is obtained, and it is used as the planar illuminance information. It can be understood that in the planar illuminance information, the vertical height is the preset vertical height, and there are differences in the rotation angle and the illuminance value corresponding to the rotation angle.

[0055] Step S212, obtaining the spatial illuminance information according to the planar illuminance information at different preset vertical heights.

[0056] Specifically, after the planar illuminance information at the preset vertical height is detected, the vertical height of the measurement arm 110 is adjusted by the position adjustment component 130, and then the planar illuminance information at the current vertical height is collected. By repeatedly executing the above steps in a loop, the planar illuminance information at different preset vertical heights can be obtained. The adjustment range of the preset vertical height can be set arbitrarily according to the measurement requirements of the optical parameters. To improve the comprehensiveness of the optical parameter measurement, the larger the adjustment range of the preset vertical height is set, the better.

[0057] As Figure 4As shown in the figure, it is a schematic flow chart of obtaining spatial illuminance information in a specific embodiment. When the optical parameter measurement device starts up, the measurement platform 131 is moved to the lowest vertical height through the position adjustment component 130. Correspondingly, the measurement arm 110 is also at the initial rotation angle. At this time, the illuminance value measured currently is read through the illuminance sensor 111 on the measurement arm 110. Then the measurement arm 110 is rotated to the next angle, and the measured illuminance value is read until the measurement arm 110 completes one full rotation. At this time, the illuminance distribution of the plane where the current measurement platform 131 is located can be obtained, that is, the plane illuminance information at the current vertical height. Then the measurement platform 131 is moved to the next vertical height, and the above steps are repeated to complete the measurement of the illuminance distribution of the plane where it is located at the next vertical height until the measurement platform 131 reaches the highest vertical height. At this time, the illuminance distribution in the three-dimensional space can be obtained, that is, the spatial illuminance information.

[0058] As Figure 5 shown in the figure, it is a schematic diagram of the rotation measurement of the measurement arm 110. A plurality of illuminance sensors 111 are arranged on the measurement arm 110. The illuminance sensors 111 can obtain the illuminance at their positions in real time. The installation positions of these illuminance sensors 111 are predetermined, and the distance of each illuminance sensor 111 from the rotation center is L p (p = 1, 2, …, N), where p is the p-th sensor. During the measurement process, the processor 140 controls the rotation component 120 to rotate according to the preset step angle, and at the same time drives the measurement arm 110 to rotate. Each time the measurement arm 110 steps a certain angle to reach the position θ i (i = 1, 2, …, N), the processor 140 simultaneously obtains the currently measured illuminance value. After the measurement arm 110 rotates one full circle, the illuminance at multiple positions within the rotation coverage range of the measurement arm 110 can be obtained, so as to obtain the plane illuminance information E (θi,p) , where θ i is the rotation angle of the measurement arm 110, and p is the p-th sensor of the measurement arm 110. In some other embodiments, for the convenience of parameter calculation, through interpolation algorithms (such as linear interpolation, polynomial interpolation, etc.), the illuminance information obtained at different rotation angles is converted into the illuminance distribution E on the XY plane (x,y) , as Figure 6 shown in the figure. The processor 140 controls the position adjustment component 130 to change the vertical height h of the measurement arm 110 at a preset step height j (j = 1, 2, …, H). After the measurement is completed at all vertical heights, the spatial illuminance information E (θi,p,h) can be obtained. Then, interpolation processing is performed on the plane illuminance information at different vertical heights, and it is converted into the illuminance distribution on the XY plane, and the three-dimensional space illuminance distribution information E can be obtained(x,y,h) , the three-dimensional space illuminance distribution information is as Figure 7 shown. Finally, the optical parameter information can be determined according to the three-dimensional space illuminance distribution information.

[0059] In one embodiment, in step S210, the step of obtaining the illuminance information detected by the illuminance sensor at different rotation angles and different vertical heights of the measuring arm to obtain the spatial illuminance information includes: obtaining the illuminance information detected by the illuminance sensor when the measuring arm moves vertically at a preset speed and rotates at a preset angle to obtain the spatial illuminance information.

[0060] Specifically, in this embodiment, the processor 140 controls the measuring arm 110 to vertically rise or fall at a preset speed v through the position adjustment component 130. At the same time, the measuring arm 110 is controlled to rotate at a preset angle θ i (i = 1, 2, …, N). At this time, the height information is included in the illuminance information detected by the illuminance sensor 111. In this case, the obtained spatial illuminance information is E (θi,p,h＝vt) , where t is the time when the measuring arm 110 moves from the initial position. After obtaining the spatial illuminance information, through the interpolation algorithm, it can be converted into the illuminance distribution E (x,y,h) in the three-dimensional space, that is, the three-dimensional space illuminance distribution information. The amount of data of the spatial illuminance information collected in this embodiment is small, but the data collection efficiency is high.

[0061] In one embodiment, as Figure 8 shown, the optical parameter information includes: the maximum central illuminance. In step S230, the step of determining the optical parameter information according to the three-dimensional space illuminance distribution information includes:

[0062] Step S231, determining the plane illuminance distribution information at different vertical heights according to the three-dimensional space illuminance distribution information.

[0063] Specifically, after the processor 140 calculates the three-dimensional space illuminance distribution information E (x,y,h) , the plane illuminance distribution information E j at different vertical heights h (x,y,hj) (j = 1, 2, …, H) can be determined according to the three-dimensional space illuminance distribution information. It can be understood that the three-dimensional space illuminance distribution information includes the plane illuminance distribution information at continuous vertical heights.

[0064] Step S232, determining the central illuminance according to the plane illuminance distribution information. Specifically, after obtaining the plane illuminance distribution information, select the maximum value of the illuminance in the plane illuminance distribution information and use it as the central illuminance. It can be understood that a central illuminance can be determined according to the plane illuminance distribution information at different vertical heights.

[0065] Step S233: Screen out the maximum value based on the central illuminance at different vertical heights to obtain the maximum central illuminance. Specifically, after calculating the central illuminance at different vertical heights, screen out the maximum value from all the central illuminances and use it as the maximum central illuminance.

[0066] In one embodiment, as Figure 9 shown, in step S232, the steps of determining the central illuminance according to the planar illuminance distribution information include:

[0067] Step S234: Determine the extreme position on the horizontal axis according to the projection data of the planar illuminance distribution information on the horizontal axis.

[0068] Step S235: Determine the extreme position on the vertical axis according to the projection data of the planar illuminance distribution information on the vertical axis;

[0069] Step S236: Use the illuminance values at the extreme position on the horizontal axis and the extreme position on the vertical axis as the central illuminance.

[0070] Specifically, in this embodiment, after obtaining the planar illuminance distribution information E j at the vertical height h (x,y,hj) , project it in the X direction and the Y direction respectively, and one-dimensional projection data P(X) and P(Y) of the planar illuminance distribution information can be obtained, as Figure 10 shown. Then, according to the projection data P(X) of the planar illuminance distribution information on the horizontal axis, the extreme position X peak on the horizontal axis can be determined through one-dimensional extreme value calculation; according to the projection data P(Y) of the planar illuminance distribution information on the vertical axis, the extreme position Y peak on the vertical axis can be determined through one-dimensional extreme value calculation. Among them, (X peak , Y peak ) is the center of the light spot on this plane. Correspondingly, the central illuminance on this plane is the illuminance values at the extreme position on the horizontal axis and the extreme position on the vertical axis, that is, E (Xpeak,Ypeak,hj) . Through the above steps, the central illuminance E (x,y,hj) of the planar illuminance distribution information E (Xpeak,Ypeak,hj) at all vertical heights is obtained, and the maximum value is screened out from them. This maximum value is the maximum central illuminance E c of the surgical shadowless lamp. The vertical height corresponding to this maximum value is denoted as h c . The optical plane at this height is the optical plane where the maximum central illuminance E c is located. The planar illuminance distribution information of this optical plane is E (x,y,hc) , as Figure 7 shown.

[0071] In one embodiment, the optical parameter information further includes at least one of: spot diameter, spot distribution uniformity, and light column depth. The calculation methods of the above several types of optical parameter information are described in detail below.

[0072] The maximum central illuminance E is calculated through the above steps c The plane illuminance distribution information E where it is located (x,y,hc) , and the spot center position (X peak , Y peak , h c ). By calculating the illuminance point where the illuminance value of this optical plane reaches 10% × E c , the distance from the position of this illuminance point to the spot center position (X peak , Y peak , h c ) is the spot diameter D 10 ; similarly, by calculating the illuminance point where the illuminance value of this optical plane reaches 50% × E c , the distance from the position of this illuminance point to the spot center position (X peak , Y peak , h c ) is the spot diameter D 50 . After calculating the spot diameter D 10 , the spot distribution uniformity D SD can be calculated, where the spot distribution uniformity D SD is the mean square deviation of the illuminance values of all positions in this optical plane whose distance to the spot center position (X peak , Y peak , h c ) is less than 1 / 2D 10 . By obtaining the central illuminance E (Xpeak,Ypeak,h) under all optical planes and plotting them into a light column depth parameter curve graph as shown in Figure 11 , the light column depth L c where the central illuminance reaches 20% or 60% of the maximum central illuminance E Depth = h 2 - h 1 can be conveniently calculated on this curve graph.

[0073] It should be understood that although the steps in the flowcharts involved in the above-described embodiments are sequentially shown according to the arrows, these steps are not necessarily executed sequentially in the order indicated by the arrows. Unless clearly stated herein, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-described embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily executed at the same moment, but can be executed at different moments, and the execution order of these steps or stages is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or steps or stages in other steps.

[0074] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor 140, the following steps are implemented: obtaining illuminance information detected by an illuminance sensor at different rotation angles and different vertical heights of a measuring arm to obtain spatial illuminance information; determining three-dimensional space illuminance distribution information based on the spatial illuminance information; and determining optical parameter information according to the three-dimensional space illuminance distribution information.

[0075] In one embodiment, when the computer program is executed by the processor 140, the following steps are further implemented: obtaining illuminance information detected by the illuminance sensor when the measuring arm rotates one week at a preset vertical height to obtain planar illuminance information; and obtaining spatial illuminance information according to the planar illuminance information at different preset vertical heights.

[0076] In one embodiment, when the computer program is executed by the processor 140, the following steps are further implemented: obtaining illuminance information detected by the illuminance sensor when the measuring arm moves vertically at a preset speed and rotates at a preset angle to obtain spatial illuminance information.

[0077] In one embodiment, when the computer program is executed by the processor 140, the following steps are further implemented: determining planar illuminance distribution information at different vertical heights according to the three-dimensional space illuminance distribution information; determining central illuminance according to the planar illuminance distribution information; and screening out the maximum value based on the central illuminance at different vertical heights to obtain the maximum central illuminance.

[0078] In one embodiment, when the computer program is executed by the processor 140, the following steps are further implemented: determining the extreme position on the horizontal axis according to the projection data of the planar illuminance distribution information on the horizontal axis; determining the extreme position on the vertical axis according to the projection data of the planar illuminance distribution information on the vertical axis; and using the illuminance values at the extreme position on the horizontal axis and the extreme position on the vertical axis as the central illuminance.

[0079] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, database, or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memories. Non-volatile memory can include Read-Only Memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc. The databases involved in the embodiments provided in this application can include at least one of relational databases and non-relational databases. Non-relational databases can include distributed databases based on blockchain, etc., without limitation. The processor 140 involved in the embodiments provided in this application can be a general-purpose processor, central processing unit, graphics processing unit, digital signal processor, programmable logic device, data processing logic device based on quantum computing, etc., without limitation.

[0080] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0081] The above-described embodiments only represent several implementation manners of this application. The description is relatively specific and detailed, but it should not be construed as a limitation on the patent scope of this application. It should be noted that for those of ordinary skill in the art, without departing from the concept of this application, several modifications and improvements can still be made, and these all belong to the protection scope of this application. Therefore, the protection scope of this application should be subject to the appended claims.

Claims

1. An optical parameter measurement device, characterized in that, it includes: a measurement arm (110) provided with a plurality of illuminance sensors (111) thereon; a rotating member (120) fixedly connected to one end of the measurement arm (110); a position adjustment assembly (130) connecting the rotating member (120); a processor (140) respectively connected to the illuminance sensors (111), the rotating member (120) and the position adjustment assembly (130), the processor (140) is configured to control the rotating member (120) to drive the measurement arm (110) to rotate, the processor (140) is configured to control the position adjustment assembly (130) to adjust the spatial position of the measurement arm (110), and the processor (140) is configured to determine optical parameter information according to the illuminance information collected by the illuminance sensors (111).

2. The optical parameter measurement device according to claim 1, characterized in that, the position adjustment assembly (130) includes: a measurement platform (131), a vertical lead screw (132) and a vertical motor (133), the measurement platform (131) is connected to the rotating member (120), the measurement platform (131) is sleeved on the vertical lead screw (132), the vertical motor (133) is connected to the processor (140), and the vertical motor (133) is configured to drive the vertical lead screw (132) to rotate to control the vertical height of the measurement platform (131).

3. The optical parameter measurement device according to claim 1, characterized in that, the plurality of illuminance sensors (111) are arranged on the same straight line, and the adjacent two illuminance sensors (111) are arranged at a preset distance interval.

4. The optical parameter measurement device according to claim 1, characterized in that, the rotating member (120) includes: a horizontal motor, the horizontal motor is connected to the processor (140), and the horizontal motor is configured to drive the measurement arm (110) to rotate under the control of the processor (140).

5. An optical parameter measurement method, characterized in that, applied to the optical parameter measurement device according to any one of claims 1 to 4, the method includes: obtaining the illuminance information detected by the illuminance sensors at different rotation angles and different vertical heights of the measurement arm to obtain spatial illuminance information; determining three-dimensional space illuminance distribution information based on the spatial illuminance information; determining optical parameter information according to the three-dimensional space illuminance distribution information.

6. The optical parameter measurement method according to claim 5, characterized in that, the step of obtaining the illuminance information detected by the illuminance sensors at different rotation angles and different vertical heights of the measurement arm to obtain spatial illuminance information includes: obtaining the illuminance information detected by the illuminance sensors when the measurement arm rotates one week at a preset vertical height to obtain planar illuminance information; Obtain the spatial illuminance information based on the planar illuminance information at different preset vertical heights.

7. The optical parameter measurement method according to claim 5, wherein, the step of obtaining the spatial illuminance information according to the illuminance information detected by the illuminance sensor when the measurement arm is at different rotation angles and different vertical heights includes: Obtain the illuminance information detected by the illuminance sensor when the measurement arm moves vertically at a preset speed and rotates at a preset angle, so as to obtain the spatial illuminance information.

8. The optical parameter measurement method according to claim 5, wherein, the optical parameter information includes: maximum central illuminance, and the step of determining the optical parameter information according to the three-dimensional spatial illuminance distribution information includes: Determine the planar illuminance distribution information at different vertical heights according to the three-dimensional spatial illuminance distribution information; Determine the central illuminance according to the planar illuminance distribution information; Based on the central illuminances at different vertical heights, screen out the maximum value to obtain the maximum central illuminance.

9. The optical parameter measurement method according to claim 8, wherein, the step of determining the central illuminance according to the planar illuminance distribution information includes: Determine the extreme position on the horizontal axis according to the projection data of the planar illuminance distribution information on the horizontal axis; Determine the extreme position on the vertical axis according to the projection data of the planar illuminance distribution information on the vertical axis; Take the illuminance values at the extreme position on the horizontal axis and the extreme position on the vertical axis as the central illuminance.

10. The optical parameter measurement method according to claim 8, wherein, the optical parameter information further includes at least one of: spot diameter, spot distribution uniformity, and light column depth.

Images