Ultrasonic phased array transducer based on dynamic focusing and application thereof

By adopting dynamic focus technology in ultrasonic phased array transducers, the problem of low efficiency of traditional ultrasonic detection in large-sized rods is solved, and efficient and fast detection results are achieved, which is suitable for the rapid detection needs of industrial production.

CN120064470APending Publication Date: 2025-05-30NCS TESTING TECHNOLOGY CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202510410645.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-02
Publication Date
2025-05-30

AI Technical Summary

Technical Problem

Traditional ultrasonic detection is inefficient in large-scale rod detection and has a small scanning pitch, making it difficult to meet the rapid detection needs of industrial production.

Method used

The ultrasonic phased array transducer based on dynamic focus is adopted, and the phased array dynamic focus function is used to realize the probe coverage width of 135mm, the detection pitch is maximum 135mm, the detection linear speed is 2m to 7.2m/min, and the flat bottom hole with a depth range of 200mm can be detected.

Benefits of technology

It significantly improves the detection efficiency, the detection speed is dozens of times faster than conventional ultrasound, and can conduct efficient inspection within a deeper range, suitable for rapid detection of large-scale bars.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120064470A_ABST
    Figure CN120064470A_ABST
Patent Text Reader

Abstract

The invention provides an ultrasonic phased array transducer based on dynamic focusing and application thereof, and belongs to the technical field of ultrasonic detection. The invention comprises: a probe housing; the phased array wafer unit is arranged in the probe shell; each phased array wafer unit is formed by arranging 128 phased array wafers according to an array, each phased array wafer is 8 mm long and 1 mm wide, the distance between every two adjacent phased array wafers is 0.5 mm, 8 phased array wafers in the circumferential direction form a group, and 16 groups of phased array wafers are arranged in the axial direction. The phased array dynamic focusing function is utilized, the detectable depth range is 200 mm, the probe coverage width is 135 mm, the maximum detection screw pitch can be 135 mm, the detection linear speed is 2-7.2 m / min (dozens of times faster than conventional ultrasonic detection), and the detection sensitivity is 0.8 flat-bottomed hole.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to the technical field of ultrasonic testing, and in particular to an ultrasonic phased array transducer based on dynamic focusing and its application in rapid testing of large-sized bars. Background Art

[0002] Traditional piezoelectric ultrasonic sensors generate ultrasonic waves based on the piezoelectric effect of piezoelectric crystals. Ultrasonic waves must pass through an acoustic coupling medium such as water or oil to enter the workpiece to be inspected. In the inspection of large-sized bars, it is necessary to detect a flat-bottomed hole with a diameter of 0.8 mm and a coverage depth of 200 mm. Conventional ultrasonic usually uses a focused probe to divide areas. Different probes are used to detect defects in different depth ranges to meet the detection of 0.8 mm flat-bottomed hole defects within 0 - 200 mm. Moreover, the detection scanning speed is very slow, and the scanning pitch is less than 1 mm. For industrial production, such detection efficiency is very low, greatly increasing the production cost of enterprises.

[0003] With the development of microelectronics technology and computer technology, and the maturity of ultrasonic phased array detection technology, therefore, there is an urgent need to invent an ultrasonic phased array sensor for rapid detection of large-sized bars, which can increase the detection coverage range of the sensor by dynamically adjusting the probe focal length. Summary of the Invention

[0004] In view of this, to solve the technical problem of low detection efficiency caused by the small scanning pitch of conventional ultrasonic, on the one hand, the present invention provides an ultrasonic phased array transducer based on dynamic focusing. By using the dynamic focusing function of the phased array, it can detect a depth range of 200 mm, the probe coverage width is 135 mm, the maximum detection pitch can be 135 mm, the detection linear speed is 2 m - 7.2 m / min (dozens of times faster than conventional ultrasonic detection), and the detection sensitivity is 0.8 flat-bottomed hole.

[0005] To achieve the above object, the present invention provides the following technical solutions: An ultrasonic phased array transducer based on dynamic focusing, comprising: A probe housing; A phased array wafer unit, disposed within the probe housing; The phased array wafer unit is composed of 128 phased array wafers arranged in an array. Each phased array wafer is 8 mm long and 1 mm wide, and the spacing between adjacent phased array wafers is 0.5 mm. Eight phased array wafers in the circumferential direction are a group, and 16 groups are arranged axially.

[0006] Preferably, the circumferential coverage width of the phased array wafer unit is 8 mm, the axial length is 135 mm, and the detection pitch reaches 135 mm.

[0007] Preferably, a backing is provided inside the probe housing to reduce the backscattering of the wafer.

[0008] Preferably, the probe housing is made of stainless steel.

[0009] On the other hand, the present invention also provides the application of the above ultrasonic phased array transducer based on dynamic focusing in the rapid detection of large-sized bars.

[0010] The ultrasonic phased array transducer based on dynamic focusing provided by the present invention uses the phased array dynamic focusing function for detection. Compared with the prior art, it has the following beneficial effects: The detectable depth range is 200 mm: It can effectively detect in a relatively deep range and is suitable for various industrial application scenarios, such as the application in the rapid detection of large-sized bars, etc.

[0011] The probe coverage width is 135 mm: A larger probe coverage width means that a larger area can be covered in one scan, reducing the need for multiple scans and improving the detection efficiency.

[0012] The maximum detection pitch can be 135 mm: A larger pitch means a larger distance between adjacent wave peaks or wave valleys, which is suitable for application scenarios that require rapid scanning of a large range.

[0013] The detection linear speed is 2 m to 7.2 m / min (dozens of times faster than conventional ultrasonic detection): This speed range is significantly higher than the speed of conventional ultrasonic detection (usually dozens of centimeters per minute), greatly improving the detection efficiency and being particularly suitable for large-scale production or rapid screening requirements.

[0014] The detection sensitivity is 0.8 flat-bottom hole: This sensitivity index indicates that the transducer can detect very small defects, such as a flat-bottom hole with a diameter of 0.8 mm, ensuring high-precision detection.

[0015] Based on the dynamic focusing function, the present invention can set multiple focal points in one scan to achieve high-resolution imaging of defects at different depths. Dynamic focusing enables the system to adjust the direction and focal position of the beam in real time during the detection process to ensure the best focusing state throughout the detection range. The dynamic focusing function not only improves the detection accuracy but also significantly enhances the detection efficiency and is suitable for the detection of materials with complex shapes and different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the phased array wafer arrangement; Figure 3 It is the detection effect diagram of the flat-bottom hole in Example 1; Figure 4 Effect diagram of flat hole detection for Example 2; Figure 5 Effect diagram of flat hole detection for Example 3; In the figure, 1 is the probe housing; 2 is the phased array wafer unit; 21 is the phased array wafer. Specific embodiments

[0017] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0018] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "top / bottom end", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0019] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "provided with", "sheathed / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0020] As Figure 1-2 shown, the present invention provides an ultrasonic phased array transducer based on dynamic focusing, including: Probe housing 1; Phased array wafer unit 2, disposed inside the probe housing 1; The phased array wafer unit 2 is composed of 128 phased array wafers 21 arranged in an array. Each phased array wafer 21 is 8 mm long and 1 mm wide, and the distance between adjacent phased array wafers 21 is 0.5 mm. Eight of the phased array wafers 21 in the circumferential direction are a group, and 16 groups are arranged axially. The total length of the probe is 16×8 + 0.5×15 = 135.5 mm, and the length of the probe array element is the detection pitch.

[0021] In the present invention, the circumferential coverage width of the phased array wafer unit 2 is 8 mm, the axial length is 135.5 mm, and the detection pitch reaches 135.5 mm.

[0022] Phased array ultrasound is an advanced non-destructive testing technology that uses a probe array composed of multiple small array elements (in the present invention, each wafer constitutes an array element) to transmit and receive ultrasonic waves. Each array element can independently control the time delay (i.e., phase) of its transmission and reception. By adjusting these time delays, the direction and focal position of the ultrasonic beam can be changed.

[0023] Dynamic focusing mechanism Electronic control: The phased array system adjusts the time delays of each array element through an electronic control system, so that the focal position of the ultrasonic beam is continuously adjusted during propagation.

[0024] Multi-focus imaging: During a single scan, the system can set multiple foci at different depths, thereby achieving high-resolution imaging of defects at different depths.

[0025] Real-time adjustment: Since phased array technology allows real-time adjustment of the beam direction and focal position, the focus at different depths can be quickly switched during the same detection process, improving the detection efficiency and accuracy.

[0026] The above-mentioned ultrasonic phased array transducer based on dynamic focusing provided by the present invention can ensure that the ultrasonic beam always maintains the best focusing state at defects at different depths based on the dynamic focusing function, thereby improving the detection resolution and sensitivity. This is especially useful for detecting materials with complex shapes and different thicknesses, and can detect tiny defects or cracks.

[0027] The multi-focus imaging ability of phased array ultrasound enables it to perform effective detection over a large range, reducing the need for multiple probe position adjustments and improving the detection efficiency.

[0028] The above-mentioned ultrasonic phased array transducer based on dynamic focusing provided by the present invention is applicable to various industrial fields, such as aerospace, automotive manufacturing, oil and gas pipelines, etc., and is especially suitable for occasions requiring high precision and reliability, and is particularly suitable for the application of the company in the rapid detection of large-sized bars.

[0029] The above-mentioned ultrasonic phased array transducer based on dynamic focusing provided by the present invention, based on the composition of its phased array wafer unit 2, can ensure that the detection depth range reaches 200 mm, the probe coverage width is 135 mm, the maximum detection pitch can be 135 mm, the detection linear speed is 2 m to 7.2 m / min (dozens of times faster than conventional ultrasonic detection), and the detection sensitivity is 0.8 flat-bottom hole.

[0030] In the present invention, a backing is provided inside the probe housing 1, preferably located behind the phased array wafer unit 2, for reducing the backscattering of the wafer and improving the quality of the detection signal. Specifically: Reducing interference: The backing material can absorb the ultrasonic waves reflected from the back of the wafer, preventing these reflected waves from entering the wafer again, thereby reducing noise and interference signals.

[0031] Improving the signal-to-noise ratio: By reducing backscattering, the backing helps improve the signal-to-noise ratio of the detection signal, making the detection results clearer and more accurate.

[0032] Optimizing the focusing performance: The backing can also improve the energy distribution of ultrasonic waves, ensuring that the energy is concentrated in the direction where detection is required, and further optimizing the dynamic focusing performance.

[0033] In the present invention, the material of the probe housing 1 is stainless steel. Stainless steel has excellent corrosion resistance and can remain stable in various harsh environments. This is very important for ultrasonic phased array transducers used in industrial environments, especially in environments with moisture, salt spray or chemical substances. Stainless steel can effectively prevent the housing from rusting and corroding, and extend the service life of the equipment.

[0034] Stainless steel material has high mechanical strength and wear resistance, and can withstand large external pressures and impacts. This makes the probe not easily damaged during the detection process. Especially when facing complex workpieces or uneven surfaces, the stainless steel housing can provide better protection.

[0035] Stainless steel can still maintain the stability of its physical and chemical properties at high or low temperatures, and will not deform or fail due to temperature changes. This is particularly important for ultrasonic testing equipment that needs to work under different temperature conditions.

[0036] Stainless steel material has a good shielding effect on electromagnetic waves, which can reduce the influence of external electromagnetic interference on ultrasonic signals and ensure the accuracy and reliability of detection results.

[0037] Stainless steel material has good machinability and can be processed by various processes such as cutting, welding, and grinding. This enables the probe housing 1 to be customized according to specific requirements while ensuring manufacturing precision and quality.

[0038] The surface of stainless steel is smooth and not easily adsorbs dust and dirt, which is convenient for daily cleaning and maintenance. In addition, the stainless steel material has a modern and strong appearance, enhancing the overall aesthetic degree of the equipment.

[0039] On the other hand, the present invention also provides an application of the above ultrasonic phased array transducer based on dynamic focusing in the rapid detection of large-sized bars.

[0040] Efficient and rapid non-destructive testing of large-sized bars is the key to ensuring product quality and production efficiency. Traditional testing methods are often slow and inefficient, and it is difficult to meet the needs of modern industry.

[0041] The ultrasonic phased array transducer based on dynamic focusing provided by the present invention can form multiple focal points at different depths of the bar by controlling the emission and reception times of different phased array wafers 21, thereby achieving high-resolution imaging. This is very effective for detecting internal defects (such as cracks, pores, inclusions, etc.).

[0042] According to the changes in the shape and size of the bar, the focusing position is dynamically adjusted to ensure the best detection effect throughout the detection process.

[0043] The present invention can achieve a detection linear speed of up to 7.2 m / min, which is significantly higher than that of traditional ultrasonic detection equipment. This greatly improves the detection efficiency and shortens the detection cycle without affecting the detection accuracy.

[0044] The present invention has a large coverage width (135 mm), allowing a wide area to be covered in one scan, reducing the need for multiple scans and further improving the detection speed.

[0045] In the present invention, 128 phased array wafers 21 are arranged in a specific array with a spacing of only 0.5 mm, which can achieve high lateral resolution and is suitable for detecting micro-defects. Especially in large-sized bars, this high resolution can detect fine internal structural changes and ensure the reliability of the detection results.

[0046] The following combines specific embodiments to illustrate the specific application of the above-mentioned ultrasonic phased array transducer based on dynamic focusing provided by the present invention in the rapid detection of large-sized bars.

[0047] Embodiment 1 As Figure 3 shown, the detection effect diagram of flat-bottomed holes at 178 mm (the diameter of the bar is 355 mm, the detection effect diagram of the central flat-bottomed hole, the scanning pitch is 120 mm, and the linear speed is 35 mm / s).

[0048] Embodiment 2 As Figure 4 shown, the detection effect diagram of flat-bottomed holes at 120 mm (the diameter of the bar is 236 mm, the detection effect diagram of the central flat-bottomed hole, the scanning pitch is 120 mm, and the linear speed is 45 mm / s).

[0049] Embodiment 3 As Figure 5 shown, the detection effect diagram of flat-bottomed holes at 52 mm (the diameter of the bar is 102 mm, the detection effect diagram of the central flat-bottomed hole, the scanning pitch is 120 mm, and the linear speed is 120 mm / s).

[0050] The above is only a preferred specific embodiment of the present invention; however, the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its improved concept, making equivalent substitutions or changes, shall be covered by the protection scope of the present invention.

Claims

1. An ultrasonic phased array transducer based on dynamic focusing, characterized in that: include: Probe housing; A phased array chip unit is disposed in the probe housing; The phased array chip unit is composed of 128 phased array chips arranged in an array, each of which is 8 mm long and 1 mm wide. The spacing between adjacent phased array chips is 0.5 mm. Eight phased array chips form a group in the circumferential direction, and 16 groups are arranged axially.

2. The ultrasonic phased array transducer based on dynamic focusing according to claim 1, characterized in that: The phased array chip unit has a circumferential coverage width of 8 mm, an axial length of 135 mm, and a detection pitch of 135 mm.

3. The ultrasonic phased array transducer based on dynamic focusing according to claim 1, characterized in that: A backing is arranged in the probe housing to reduce backscattering of the wafer.

4. An ultrasonic phased array transducer based on dynamic focusing according to any one of claims 1 to 3, characterized in that: The probe housing is made of stainless steel.

5. Application of an ultrasonic phased array transducer based on dynamic focusing according to any one of claims 1 to 4 in rapid detection of large-size bars.