Memory component and electronic equipment

Abstract

The embodiment of the invention provides a memory component and electronic equipment, and relates to the technical field of memories. The memory component includes a first memory bank and a second memory bank. The second memory bank is stacked and fixed on one side of the first memory bank in the thickness direction, and the second memory bank is electrically connected with the first memory bank. The first memory bank is provided with an inserting part, the projection of the inserting part in the thickness direction of the first memory bank is located outside the projection of the second memory bank in the thickness direction of the first memory bank, and the inserting part is used for being inserted into a slot of a memory connector and electrically connected with the memory connector. And the second memory bank is electrically connected with the insertion part. Thus, one memory connector can be used for installing two memory banks, the number of the memory banks installed on the main board can be larger than that of the memory connectors, and the space, occupied by the multiple memory banks arranged on the main board, on the main board can be reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of memory, and in particular, to a memory component and an electronic device. Background Art

[0002] Memory can also be called internal memory, which is often electrically connected to the processor of an electronic device and can be used to temporarily store the operation data in the processor and the data exchanged with external memories such as hard disks. With the continuous improvement of the performance of electronic devices, the capacity requirement for the memory of electronic devices is also getting higher and higher. Generally, the capacity of the memory of an electronic device can be increased by increasing the number of memory modules of the electronic device.

[0003] In the related art, a memory module often needs to be plugged into a memory connector provided on the motherboard of an electronic device so that the memory module is electrically connected to the processor provided on the motherboard.

[0004] However, in the related art, a large number of memory connectors need to be provided on the motherboard, resulting in a large amount of space occupied on the motherboard.

[0005] Therefore, how to electrically connect a large number of memory modules within the limited space of the motherboard has become an urgent problem to be solved currently. Summary of the Invention

[0006] The embodiments of the present application provide a memory component and an electronic device, which can reduce the space occupied on the motherboard by a plurality of memory modules provided on the motherboard.

[0007] In a first aspect, the embodiments of the present application provide a memory component, including a first memory module and a second memory module. The second memory module is stacked and fixed on one side in the thickness direction of the first memory module, and the second memory module is electrically connected to the first memory module. The first memory module has a plugging portion, and the projection of the plugging portion along the thickness direction of the first memory module is located outside the projection of the second memory module along the thickness direction of the first memory module. The plugging portion is used to be plugged into the slot of a memory connector and is electrically connected to the memory connector. The second memory module is electrically connected to the plugging portion.

[0008] For the memory component provided by the embodiments of the present application, after the plugging portion is plugged into the slot of the memory connector, one memory connector can be used to electrically connect two memory modules, namely the first memory module and the second memory module, to the processor. In this way, the number of memory connectors of the electronic device can be less than the number of memory modules. When the number of memory connectors remains unchanged and the occupied motherboard space remains unchanged, more memory modules can be arranged on one motherboard; when the same number of memory modules is required, the number of memory connectors provided on the motherboard can be effectively reduced. After the number of memory connectors is reduced, the space occupied by the provided memory connectors on the motherboard can be reduced.

[0009] In addition, after the number of memory connectors is reduced, it is also beneficial to shorten the distance between the memory connector farthest from the processor and the processor, and can shorten the length of the motherboard trace connecting the memory connector farthest from the processor and the processor, which can improve the quality of the signal transmitted between the memory connector farthest from the processor and the processor.

[0010] In addition, the reduction in the number of memory connectors and the shortening of the length of the motherboard traces connecting the memory connectors are also beneficial to reducing the number of motherboard layers.

[0011] In a possible implementation, the first memory module includes a first circuit board, the second memory module includes a second circuit board and a second chip disposed on the second circuit board, and the second circuit board is stacked and fixed on one side in the thickness direction of the first circuit board. The first circuit board has a first set of electrical connection structures, and the first set of electrical connection structures is located on the surface of the first circuit board facing the second circuit board side. The first set of electrical connection structures is electrically connected to the first set of conductive contacts on the plug-in portion; the first set of conductive contacts is used to be electrically connected to the memory connector. The second circuit board has a second set of electrical connection structures, and the second set of electrical connection structures is located on the surface of the second circuit board facing the first circuit board side. The second set of electrical connection structures is electrically connected to the second chip. The first set of electrical connection structures is electrically connected to the second set of electrical connection structures, so that the second chip is electrically connected to the first set of conductive contacts through the second set of electrical connection structures and the first set of electrical connection structures.

[0012] In a possible implementation, the first set of electrical connection structures and the second set of electrical connection structures are disposed opposite to each other in the thickness direction of the first circuit board.

[0013] In a possible implementation, an elastic film is provided between the first set of electrical connection structures and the second set of electrical connection structures. The elastic film includes a conductive structure group and an insulating elastomer. At least part of the conductive structure group is disposed in the elastomer, and the elastomer clamps and fixes the conductive structure group in the elastomer. The elastomer is clamped and fixed by the first set of electrical connection structures and the second set of electrical connection structures, so that both ends of the conductive structure group in the thickness direction of the elastomer are electrically contacted with the first set of electrical connection structures and the second set of electrical connection structures respectively.

[0014] In a possible implementation, the first set of electrical connection structures includes a plurality of first electrical connection structures, and the second set of electrical connection structures includes a plurality of second electrical connection structures that correspond one-to-one to the plurality of first electrical connection structures. The conductive structure group includes a plurality of spaced-apart conductive structures. Each conductive structure is at least partially disposed within the elastomer, and each conductive structure is clamped and fixed by the elastomer. Each first electrical connection structure and the corresponding second electrical connection structure clamp and fix the elastomer, and each first electrical connection structure and the corresponding second electrical connection structure are in electrical contact with at least one conductive structure at both ends in the thickness direction of the elastomer. The conductive structures with which each first electrical connection structure and the corresponding second electrical connection structure are in electrical contact are spaced apart from other first electrical connection structures and second electrical connection structures.

[0015] In a possible implementation, each conductive structure includes a plurality of conductors distributed in the thickness direction of the elastomer. In the same conductive structure, each conductor is in electrical contact with an adjacent conductor. Each first electrical connection structure and the corresponding second electrical connection structure are respectively in electrical contact with two conductors at both ends of the conductive structure in the thickness direction of the elastomer.

[0016] In a possible implementation, the distance between two adjacent conductive structures is less than the distance between two adjacent first electrical connection structures.

[0017] In a possible implementation, the first memory module includes a first chip, and the first chip is mounted on a first circuit board. The first set of conductive contacts includes a first conductive contact and a second conductive contact. The first conductive contact and the second conductive contact are both electrically connected to the second memory module, and the second conductive contact is also electrically connected to the first chip.

[0018] In a possible implementation, the plug-in portion has a second set of conductive contacts. The second set of conductive contacts is electrically connected to the first chip of the first memory module, and the second set of conductive contacts is used to be electrically connected to a memory connector.

[0019] In a second aspect, an embodiment of the present application provides an electronic device, including a main board, a memory connector, and the memory component in any of the above embodiments. The memory connector is mounted on the main board, and the memory connector has a slot. The plug-in portion of the memory component is plugged into the slot.

[0020] It should be understood that the implementation and beneficial effects of the above-mentioned multiple aspects or any possible implementation manner of the present application can be referred to each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic diagram of an electronic device provided by an embodiment of the present application;

[0022] Figure 2A schematic plan view of a memory connector and a processor of an electronic device provided by an embodiment of the present application, installed on a main board;

[0023] Figure 3 A schematic diagram of another electronic device provided by an embodiment of the present application;

[0024] Figure 4 A schematic diagram of a memory connector installed on a main board provided by an embodiment of the present application;

[0025] Figure 5 A schematic plan view of a memory connector and a processor of yet another electronic device provided by an embodiment of the present application, installed on a main board;

[0026] Figure 6 A schematic diagram of a first memory module provided by an embodiment of the present application;

[0027] Figure 7 A schematic diagram of a second memory module provided by an embodiment of the present application;

[0028] Figure 8 A schematic diagram of the connection between a first circuit board and a second circuit board of a memory component provided by an embodiment of the present application;

[0029] Figure 9 A schematic plan view of an elastic film provided by an embodiment of the present application;

[0030] Figure 10 A schematic diagram of an elastic film when no external force is applied, provided by an embodiment of the present application;

[0031] Figure 11 A schematic diagram of the connection between a first circuit board and a second circuit board of another memory component provided by an embodiment of the present application;

[0032] Figure 12 A schematic diagram of another elastic film when no external force is applied, provided by an embodiment of the present application.

[0033] Explanation of reference numerals:

[0034] 110, connection base; 111, threaded hole; 120, assembly hole;

[0035] 200, main board;

[0036] 210, main board trace; 211, first group of main board traces; 2111, first main board trace; 2112, second main board trace; 212, second group of main board traces;

[0037] 300, processor;

[0038] 400, memory module;

[0039] 500. Memory connector;

[0040] 510. Slot; 520. First group of conductive elastic pieces; 521. First conductive elastic piece; 522. Second conductive elastic piece; 530. Second group of conductive elastic pieces;

[0041] 600. Memory component;

[0042] 610. First memory module; 611. First circuit board; 6111. Plugging part; 612. First chip; 613. First group of first circuit board traces; 614. Second group of first circuit board traces; 615. Third group of first circuit board traces;

[0043] 620. Second memory module; 621. Second circuit board; 622. Second chip; 623. Second circuit board traces;

[0044] 710. First group of conductive contact pieces; 711. First conductive contact piece; 712. Second conductive contact piece; 720. Second group of conductive contact pieces; 730. First group of electrical connection structures; 731. First electrical connection structure; 740. Second group of electrical connection structures; 741. Second electrical connection structure;

[0045] 800. Elastic film;

[0046] 810. Elastomer; 820. Conductive structure group; 821. Conductive structure; 8211. Conductor. Detailed implementation manners

[0047] The terms used in the implementation manners part of this application are only used to explain the specific embodiments of this application, rather than intended to limit this application. The implementation manners of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0048] The embodiments of this application provide an electronic device, which may include but is not limited to a computer, a server, etc. The embodiments of this application take the electronic device as a server as an example for illustration, and this server may include but is not limited to a rack server, a blade server, etc.

[0049] Figure 1 Schematic diagram of an electronic device provided by the embodiments of this application.

[0050] In an embodiment of the present application, the electronic device may include a main board 200, a processor 300, a memory connector 500, and a memory module 400. The processor 300 and the memory connector 500 are installed on the main board 200, and the memory connector 500 is electrically connected to the processor 300. Specifically, the main board 200 has main board traces 210, and the memory connector 500 is electrically connected to the processor 300 through the main board traces 210. The memory connector 500 is used for plugging in the memory module 400, so that the memory module 400 can be electrically connected to the processor 300 through the memory connector 500 and the main board traces 210.

[0051] It should be noted that the main board 200 is a circuit board, and the main board traces 210 are printed circuits on the main board 200 for conducting electricity.

[0052] Exemplarily, the memory module 400 may be a dynamic random access memory (DRAM).

[0053] Exemplarily, the memory connector 500 may be a dual inline memory modules (DIMM) connector.

[0054] Exemplarily, the processor 300 may be mounted on the main board 200 by surface mount technology (SMT) to be electrically connected to the main board traces 210 of the main board 200.

[0055] Figure 2 It is a schematic plan view of the installation of a memory connector and a processor of an electronic device provided in an embodiment of the present application on a main board.

[0056] As Figure 2 shown, multiple memory connectors 500 may be installed on the main board 200, and each memory connector 500 can be electrically connected to the processor 300 through the main board traces 210.

[0057] One, two, three, four or more processors 300 may be installed on the main board 200, and each memory connector 500 is electrically connected to at least one processor 300.

[0058] In related technologies, the number of memory connectors of an electronic device is greater than or equal to the number of memory modules. Each memory module is plugged into a memory connector, and each memory connector is used to electrically connect a memory module to a processor. As the performance of the electronic device continues to improve, the demand for the memory capacity of the electronic device is also increasing. In order to electrically connect a relatively large number of memory modules to the processor so that the electronic device has a large memory capacity, it is often necessary to arrange a relatively large number of memory connectors on the motherboard. However, the relatively large number of memory connectors arranged on the surface of the motherboard will occupy a large amount of space on the motherboard. In addition, since the memory connectors need to be arranged in sequence on the surface of the motherboard, when the number of memory connectors is relatively large, some memory connectors will be relatively far from the processor, and the length of the motherboard traces required to connect the memory connectors far from the processor is relatively long, which will cause the quality of the signals transmitted between the memory connectors far from the processor and the processor to be poor. In addition, the relatively large number of memory connectors and the relatively long motherboard traces will occupy a large amount of space on the wiring layer of the motherboard, which easily leads to a relatively large number of motherboard layers.

[0059] Figure 3 Schematic diagram of another electronic device provided by an embodiment of the present application.

[0060] Based on this, as Figure 3 shown, in an embodiment of the present application, the electronic device includes a memory component 600. The memory component 600 includes two stacked memory modules, which are a first memory module 610 and a second memory module 620 respectively. The second memory module 620 is stacked and fixed on one side in the thickness direction of the first memory module 610, and the second memory module 620 is electrically connected to the first memory module 610. The first memory module 610 has a plugging portion 6111, and the projection of the plugging portion 6111 along the thickness direction of the first memory module 610 is located outside the projection of the second memory module 620 along the thickness direction of the first memory module 610. The memory connector 500 has a slot 510, and the slot 510 is provided on the side of the memory connector 500 away from the motherboard 200. The plugging portion 6111 is used to be plugged into the slot 510 of the memory connector 500 and is electrically connected to the memory connector 500, and the second memory module 620 is electrically connected to the plugging portion 6111.

[0061] In this way, after the insertion part 6111 is inserted into the slot 510 of the memory connector 500, the first memory module 610 can be electrically connected to the memory connector 500. The second memory module 620 stacked on the first memory module 610 can be electrically connected to the memory connector 500 through the insertion part 6111 of the first memory module 610. At this time, the stacked first memory module 610 and the second memory module 620 can be electrically connected to the memory connector 500 inserted by the first memory module 610, so as to be electrically connected to the processor 300 through the memory connector 500. That is to say, one memory connector 500 can be used to electrically connect two memory modules to the processor 300. In this way, the number of memory connectors 500 of the electronic device can be less than the number of memory modules 400. When the number of memory connectors 500 remains unchanged and the occupied mainboard space remains unchanged, more memory modules can be arranged on one mainboard; in the case of the same number of memory modules required, the number of memory connectors 500 provided on the mainboard 200 can be effectively reduced. For example, when the processor 300 needs to be electrically connected to 10 memory modules, 5 memory connectors 500 can be provided on the mainboard 200, and each memory connector 500 is inserted with a memory component 600 including a first memory module 610 and a second memory module 620 to meet the requirement that the processor 300 is electrically connected to 10 memory modules. After the number of memory connectors 500 is reduced, the space of the mainboard 200 occupied by the provided memory connectors 500 can be reduced. In addition, after the number of memory connectors 500 is reduced, it is also beneficial to shorten the distance between the memory connector 500 farthest from the processor 300 and the processor 300, and the length of the mainboard trace 210 connecting the memory connector 500 farthest from the processor 300 and the processor 300 can be shortened, and the quality of the signal transmitted between the memory connector 500 farthest from the processor 300 and the processor 300 can be improved. In addition, the reduction in the number of memory connectors 500 and the shortening of the length of the mainboard trace 210 connecting the memory connectors 500 are also beneficial to reducing the number of layers of the mainboard 200.

[0062] In an embodiment of the present application, the first memory module 610 includes a first circuit board 611. The second memory module 620 is stacked on one side of the first circuit board 611 in the thickness direction, and the second memory module 620 is fixedly connected to the first circuit board 611. The first circuit board 611 has a plug-in portion 6111. The plug-in portion 6111 has a first group of conductive contacts 710, and the first group of conductive contacts 710 is electrically connected to the second memory module 620. The first group of conductive contacts 710 is used for electrically connecting to a memory connector, so that the second memory module 620 stacked on the first circuit board 611 is electrically connected to the memory connector 500 through the plug-in portion 6111. Specifically, the memory connector 500 includes a first group of conductive elastic pieces 520 disposed in the slot 510. The first group of conductive elastic pieces 520 is electrically connected to the processor 300 through the main board trace 210. The plug-in portion 6111 is used for plugging into the slot 510, and the first group of conductive contacts 710 is used for making electrical contact with the first group of conductive elastic pieces 520.

[0063] It should be noted that the conductive contacts on the plug-in portion 6111 are mostly gold-colored and arranged in a finger shape, so they are often called gold fingers. The plug-in portion 6111 is often called the gold finger connection portion.

[0064] Exemplarily, the main board 200 has a first group of main board traces 211 electrically connected to the first group of conductive elastic pieces 520, and the first group of conductive elastic pieces 520 is electrically connected to the processor 300 through the first group of main board traces 211.

[0065] Exemplarily, the second memory module 620 can be electrically connected to the first group of conductive contacts 710 through a lead group disposed outside the first memory module 610 and the second memory module 620. For example, one end of the lead group can be welded to the first group of conductive contacts 710, and the other end can be welded to the second memory module 620.

[0066] In an embodiment of the present application, the first memory module 610 further includes a first chip 612. The first chip 612 is installed on the first circuit board 611, and the first chip 612 is electrically connected to the first circuit board 611. The second memory module 620 includes a second circuit board 621 and a second chip 622. The second chip 622 is installed on the second circuit board 621, and the second chip 622 is electrically connected to the second circuit board 621. The second circuit board 621 is stacked on one side of the first circuit board 611 in the thickness direction, the second circuit board 621 is fixedly connected to the first circuit board 611, and the second chip 622 is electrically connected to the first group of conductive contacts 710.

[0067] Exemplarily, the first chip 612 can be mounted on the first circuit board 611 through a surface mounting process to be electrically connected to the first circuit board 611. The second chip 622 can be mounted on the second circuit board 621 through a surface mounting process to be electrically connected to the second circuit board 621. The first chip 612 and the second chip 622 can be memory particles.

[0068] Exemplarily, the first circuit board 611 and the second circuit board 621 are electrically connected, and the second chip 622 can be electrically connected to the first set of conductive contacts 710 through the first circuit board 611 and the second circuit board 621.

[0069] Exemplarily, the first chip 612 is provided on the surface of the side of the first circuit board 611 facing away from the second circuit board 621.

[0070] Exemplarily, the first chip 612 is provided on the surface of the side of the first circuit board 611 facing the second circuit board 621.

[0071] Exemplarily, the second chip 622 is provided on the surface of the side of the second circuit board 621 facing away from the first circuit board 611.

[0072] Exemplarily, the second chip 622 is provided on the surface of the side of the second circuit board 621 facing the first circuit board 611.

[0073] In some possible implementation manners, at least some of the conductive contacts in the first set of conductive contacts 710 are electrically connected to the first chip 612.

[0074] In this way, the first memory module 610 and the second memory module 620 can share at least some of the conductive contacts in the first set of conductive contacts 710, and the number of conductive contacts provided on the plug-in portion 6111 can be reduced.

[0075] The signals through which the processor 300 interacts with the first memory module 610 and the second memory module 620 respectively can be transmitted through the conductive contacts on the first set of conductive contacts 710 shared by the first memory module 610 and the second memory module 620.

[0076] Figure 4 It is a schematic diagram of a memory connector provided by an embodiment of the present application mounted on a main board. Figure 5 It is a plan schematic diagram of a memory connector and a processor provided by an embodiment of the present application mounted on a main board. Figure 6 It is a schematic diagram of a first memory module provided by an embodiment of the present application.

[0077] Such as Figures 4 - 6As shown, in some possible embodiments, the first set of conductive contacts 710 includes a first conductive contact 711 and a second conductive contact 712. Both the first conductive contact 711 and the second conductive contact 712 are electrically connected to the second memory module 620, and the second conductive contact 712 is also electrically connected to the first chip 612. The first set of conductive springs 520 includes a first conductive spring 521 and a second conductive spring 522. The first conductive spring 521 is configured to make electrical contact with the first conductive contact 711, and the second conductive spring 522 is configured to make electrical contact with the second conductive contact 712.

[0078] In this way, the signals for the processor 300 to interact with the first memory module 610 and the second memory module 620 can be transmitted through the second conductive spring 522 and the second conductive contact 712, and the signals for the processor 300 to exchange data with the second memory module 620 alone can be transmitted through the first conductive spring 521 and the first conductive contact 711. This can reduce the number of conductive contacts provided on the insertion portion 6111, and the signals for the processor 300 to exchange data with the second memory module 620 alone are not easily interfered with.

[0079] In an example where the first set of conductive springs 520 is electrically connected to the processor 300 through the first set of mainboard traces 211, the first set of mainboard traces 211 includes a first mainboard trace 2111 and a second mainboard trace 2112. The first conductive spring 521 is electrically connected to the processor 300 through the first mainboard trace 2111, and the second conductive spring 522 is electrically connected to the processor 300 through the second mainboard trace 2112.

[0080] Exemplarily, the second mainboard trace 2112 may include data lines and address lines shared by the first memory module 610 and the second memory module 620.

[0081] In some possible embodiments, the insertion portion 6111 further has a second set of conductive contacts 720, and the second set of conductive contacts 720 is electrically connected to the first chip 612 of the first memory module 610. The memory connector 500 further includes a second set of conductive springs 530 disposed in the slot 510, and the second set of conductive contacts 720 is configured to make electrical contact with the second set of conductive springs 530.

[0082] In this way, the signals for the processor 300 to transmit data with the first memory module 610 alone can be transmitted through the second set of conductive springs 530 and the second set of conductive contacts 720, and the signals for the processor 300 to exchange data with the first memory module 610 alone are not easily interfered with.

[0083] Exemplarily, the mainboard 200 has a second set of mainboard traces 212 electrically connected to the second set of conductive springs 530, and the second set of conductive springs 530 is electrically connected to the processor 300 through the second set of mainboard traces 212.

[0084] Figure 7 Schematic diagram of a second memory module provided by an embodiment of the present application.

[0085] As Figure 7 shown, and referring to Figure 5 、 Figure 6 , in some possible implementation manners, the first circuit board 611 has a first set of electrical connection structures 730. The first set of electrical connection structures 730 is located on the surface of the first circuit board 611 facing the second circuit board 621. The first set of electrical connection structures 730 is electrically connected to the first set of conductive contacts 710. The second circuit board 621 has a second set of electrical connection structures 740. The second set of electrical connection structures 740 is located on the surface of the second circuit board 621 facing the first circuit board 611. The second set of electrical connection structures 740 is electrically connected to the second chip 622. The first set of electrical connection structures 730 is electrically connected to the second set of electrical connection structures 740, so that the first set of conductive contacts 710 is electrically connected to the second chip 622 through the first set of electrical connection structures 730 and the second set of electrical connection structures 740. In this way, it is convenient to realize the electrical connection between the second chip 622 and the first set of conductive contacts 710, and the structure of the electrical connection between the second chip 622 and the first set of conductive contacts 710 is relatively simple.

[0086] Exemplarily, the electrical connection structures in the first set of electrical connection structures 730 may include, but are not limited to, pads, solder balls, solder columns, pins, conductive bumps, etc.

[0087] Exemplarily, the electrical connection structures in the second set of electrical connection structures 740 may include, but are not limited to, pads, solder balls, solder columns, pins, conductive bumps, etc.

[0088] Exemplarily, the first circuit board 611 has first circuit board traces. The first circuit board traces are conductive lines printed on the first circuit board 611. Specifically, the first circuit board 611 has a first set of first circuit board traces 613 electrically connected to the first set of conductive contacts 710. The first set of conductive contacts 710 is electrically connected to the first set of electrical connection structures 730 through the first set of first circuit board traces 613.

[0089] In some examples where the plugging portion 6111 further has a second set of conductive contacts 720, the first circuit board 611 further has a second set of first circuit board traces 614 electrically connected to the second set of conductive contacts 720. The second set of conductive contacts 720 is electrically connected to the first chip 612 through the second set of first circuit board traces 614.

[0090] In some examples where the first group of conductive contacts 710 includes the first conductive contacts 711 and the second conductive contacts 712 , the first circuit board 611 further has a third group of first circuit board traces 615 , and the second conductive contacts 712 are electrically connected to the first chip 612 via the third group of first circuit board traces 615 .

[0091] Exemplarily, the second circuit board 621 has a second circuit board trace 623 , which is a conductive line printed on the second circuit board 621 , and the second set of electrical connection structures 740 is electrically connected to the second chip 622 via the second circuit board trace 623 .

[0092] Exemplarily, the first group of electrical connection structures 730 and the second group of electrical connection structures 740 may be electrically connected via a lead group disposed outside the first memory bar 610 and the second memory bar 620 .

[0093] Exemplarily, the first group of electrical connection structures 730 and the second group of electrical connection structures 740 may be welded to electrically connect the first group of electrical connection structures 730 and the second group of electrical connection structures 740 .

[0094] In some possible implementations, the first group of electrical connection structures 730 and the second group of electrical connection structures 740 are disposed opposite to each other in the thickness direction of the first circuit board 611, and the first group of electrical connection structures 730 and the second group of electrical connection structures 740 are in electrical contact. The first circuit board 611 and the second circuit board 621 are detachably connected.

[0095] In this way, it is convenient to disassemble and replace the second memory stick 620 on the first memory stick 610 as needed, so as to adjust the memory capacity of the electronic device.

[0096] Exemplarily, a plurality of connection seats 110 may be provided on the first circuit board 611, and the connection seats 110 are provided on the side of the first circuit board 611 facing the second circuit board 621. A threaded hole 111 may be provided on the end of each connection seat 110 facing away from the first circuit board 611. The second circuit board 621 is provided with assembly holes 120 corresponding to the threaded holes 111 one by one. The assembly holes 120 are through holes. The first circuit board 611 and the second circuit board 621 can be threadedly connected by threaded fasteners passing through the threaded holes 111 and the corresponding assembly holes 120, so that the first circuit board 611 and the second circuit board 621 can be detachably connected.

[0097] Exemplarily, the first circuit board 611 and the second circuit board 621 may be fixed by a snap-fit ​​structure.

[0098] Exemplarily, the connection structure of at least one of the first set of electrical connection structures 730 and the second set of electrical connection structures 740 is an elastic conductive member. For example, it can be a conductive elastic sheet. After the first circuit board 611 and the second circuit board 621 are fixed, the first set of electrical connection structures 730 abuts against the second set of electrical connection structures 740, so that the first set of electrical connection structures 730 is in electrical contact with the second set of electrical connection structures 740.

[0099] Figure 8 Schematic diagram of the connection between the first circuit board and the second circuit board of a memory component provided by an embodiment of the present application. Figure 9 Planar schematic diagram of an elastic film provided by an embodiment of the present application.

[0100] As Figure 8 、 Figure 9 shown, in some possible implementation manners, an elastic film 800 is provided between the first set of electrical connection structures 730 and the second set of electrical connection structures 740. The elastic film 800 includes a conductive structure group 820 and an insulating elastic body 810. At least a part of the conductive structure group 820 is disposed within the elastic body 810, so that a part of the conductive structure group 820 is coated by the elastic body 810. The elastic body 810 is clamped and fixed through the part of the conductive structure group 820 located within the elastic body 810. The elastic body 810 is clamped and fixed by the first set of electrical connection structures 730 and the second set of electrical connection structures 740, so that both ends of the conductive structure group 820 in the thickness direction of the elastic body 810 are in electrical contact with the first set of electrical connection structures 730 and the second set of electrical connection structures 740 respectively, such that the first set of electrical connection structures 730 is in electrical contact with the second set of electrical connection structures 740 through the conductive structure group 820.

[0101] In this way, the elastic film 800 can be clamped by the first set of electrical connection structures 730 and the second set of electrical connection structures 740, so that the first set of electrical connection structures 730 is in electrical contact with the second set of electrical connection structures 740 through the conductive structure group 820. After being clamped, the elastic body 810 is not easily movable, which can make the electrical connection between the first set of electrical connection structures 730 and the second set of electrical connection structures 740 stable after the first circuit board 611 and the second circuit board 621 are fixed. In addition, the disassembly and assembly of the first memory module 610 and the second memory module 620 are also relatively easy.

[0102] Exemplarily, both sides in the thickness direction of the elastic body 810 also abut against the first circuit board 611 and the second circuit board 621, and the elastic body 810 is clamped and fixed by the first circuit board 611, the second circuit board 621, the first set of electrical connection structures 730 and the second set of electrical connection structures 740.

[0103] Exemplarily, the material forming the elastic body 810 may include one or more of the following: silica gel, rubber, etc.

[0104] In some possible embodiments, the first set of electrical connection structures 730 includes a plurality of first electrical connection structures 731. The second set of electrical connection structures 740 includes a plurality of second electrical connection structures 741 that correspond one-to-one to the plurality of first electrical connection structures 731. Each first electrical connection structure 731 and the corresponding second electrical connection structure 741 are disposed opposite to each other in the thickness direction of the first circuit board 611. The conductive structure group 820 includes a plurality of spaced-apart conductive structures 821. Each conductive structure 821 is at least partially disposed within the elastomer 810 such that a portion of each conductive structure 821 is coated by the elastomer 810, and each conductive structure 821 is pressed and fixed by the elastomer 810. Each first electrical connection structure 731 and the corresponding second electrical connection structure 741 clamp and fix the elastomer 810. Each first electrical connection structure 731 and the corresponding second electrical connection structure 741 are in electrical contact with two ends of at least one conductive structure 821 in the thickness direction of the elastomer 810, such that each first electrical connection structure 731 and the corresponding second electrical connection structure 741 are in electrical contact through at least one conductive structure 821. The conductive structures 821 with which each first electrical connection structure 731 and the corresponding second electrical connection structure 741 are in electrical contact are spaced apart from other first electrical connection structures 731 and second electrical connection structures 741.

[0105] In this way, it is convenient to electrically connect each first electrical connection structure 731 to the corresponding second electrical connection structure 741 respectively, and short circuits are not likely to occur between different first electrical connection structures 731.

[0106] Exemplarily, when the elastomer 810 is clamped by the first electrical connection structure 731 and the corresponding second electrical connection structure 741, two ends of the conductive structure 821 at the clamped position can penetrate through the surfaces on both sides in the thickness direction of the elastomer 810 to be in electrical contact with the first electrical connection structure 731 and the corresponding second electrical connection structure 741.

[0107] Exemplarily, the plurality of first electrical connection structures 731 of the first set of electrical connection structures 730 may be arranged in an array.

[0108] Exemplarily, the material forming the conductive structure 821 may include one or more of the following: copper, silver, aluminum, copper alloy, aluminum alloy, graphite, etc.

[0109] Exemplarily, the resistance value of each conductive structure 821 is greater than or equal to 0.1 milliohm and less than or equal to 100 milliohms, so that the quality of the signal interacting between the first electrical connection structure 731 and the second electrical connection structure 741 is better.

[0110] In some possible embodiments, the distance between two adjacent conductive structures 821 is less than the distance between two adjacent first electrical connection structures 731.

[0111] In this way, it is convenient to implement that each first electrical connection structure 731 and the corresponding second electrical connection structure 741 are in electrical contact through at least one conductive structure 821, and short circuits are not likely to occur between different first electrical connection structures 731. In addition, the elastic film 800 can be used to make two sets of electrical connection structures with various different arrangements in electrical contact, and the versatility of the elastic film 800 is relatively good.

[0112] Exemplarily, the conductive structure 821 can be a conductive column extending along the thickness direction of the elastomer 810 at both ends.

[0113] In this way, the structure of the elastic film 800 can be relatively simple and it is relatively easy to manufacture.

[0114] Figure 10 This is a schematic diagram of an elastic film provided by an embodiment of the present application when no external force is applied.

[0115] As Figure 10 shown, when the conductive structure 821 is a conductive column, after the force applied to the elastomer 810 along the thickness direction of the elastomer 810 is eliminated, both ends of the conductive column in the thickness direction of the elastomer 810 are located inside the elastomer 810. When the elastomer 810 is squeezed by the first electrical connection structure 731 and the corresponding second electrical connection structure 741, both ends of the conductive column in the thickness direction of the elastomer 810 can extend out of the elastomer 810 to be in electrical contact with the first electrical connection structure 731 and the corresponding second electrical connection structure 741 respectively.

[0116] When the conductive structure 821 is a conductive column, the end faces of both ends of the conductive column can be arc surfaces or flat surfaces.

[0117] Exemplarily, mounting holes corresponding to the conductive columns are formed in the elastomer 810. The mounting holes are through holes, and the conductive columns are inserted into the corresponding mounting holes. The side walls of the conductive columns are clamped and fixed by the mounting holes. That is to say, the side walls of the conductive columns can squeeze the hole walls of the mounting holes where they are located, causing the hole walls of the mounting holes to deform. The elastic restoring force exerted by the hole walls of the mounting holes on the side walls of the conductive columns clamps and fixes the conductive columns. When the elastic film 800 is not subjected to an external force, both ends of the conductive column are located inside the mounting holes where they are located.

[0118] Figure 11 This is a schematic diagram of the connection between the first circuit board and the second circuit board of another memory component provided by an embodiment of the present application.

[0119] As Figure 11As shown, in some possible embodiments, each conductive structure 821 includes a plurality of conductors 8211 distributed along the thickness direction of the elastomer 810. In the same conductive structure 821, each conductor 8211 is in electrical contact with an adjacent conductor 8211. Each first electrical connection structure 731 and the corresponding second electrical connection structure 741 are respectively in electrical contact with two conductors 8211 at both ends of the conductive structure 821 in the thickness direction of the elastomer 810.

[0120] In this way, after all the conductors 8211 in the conductive structure 821 are electrically contacted in sequence, they can continue to be pressed by the elastic film 800. The conductors 8211 in the same conductive structure 821 can undergo misalignment movement, causing the thickness of the elastic film 800 to continue to decrease. During the process of the continuous decrease in the thickness of the elastic film 800, all the conductors 8211 in the conductive structure 821 can maintain electrical contact, so that the two conductors 8211 at both ends of the conductive structure 821 can maintain electrical conduction, enabling the size of the conductive structure 821 in the thickness direction of the elastomer 810 to be variable. In this way, when the distance between the first electrical connection structure 731 and the corresponding second electrical connection structure 741 changes to a certain extent, the first electrical connection structure 731 and the corresponding second electrical connection structure 741 can maintain electrical contact, and the stability of the electrical contact between the first electrical connection structure 731 and the corresponding second electrical connection structure 741 is relatively good. In addition, the elastic film 800 can electrically connect the first circuit board 611 and the second circuit board 621 with various intervals, and the versatility of the elastic film 800 is relatively good.

[0121] Figure 12 FIG. [FIGURE NUMBER] is a schematic diagram of another elastic film provided by an embodiment of the present application when no external force is applied.

[0122] As Figure 12 shown, in some examples, the elastomer 810 is used to provide a force for separating adjacent conductors 8211 in a conductive structure 821 after the force applied along the thickness direction of the elastomer 810 is eliminated, so that the adjacent two conductors 8211 are in an open state. When the elastic film 800 is not subjected to an external force, all the conductors 8211 in the same conductive structure 821 can be distributed at intervals in a longitudinal column along the thickness direction of the elastomer 810.

[0123] In the same conductive structure 821, when the elastic film 800 is not subjected to an external force, there is a gap between two adjacent conductors 8211 that is not filled with the elastomer 810. Parts of the two conductors 8211 at both ends of the conductive structure 821 may protrude from the surface of the elastomer 810, or the surface of the elastomer 810 has a window that exposes parts of the two conductors 8211 at both ends of the conductive structure 821.

[0124] Exemplarily, the surface of the conductor 8211 can be an arc surface.

[0125] In this way, it is convenient to maintain the misalignment movement of contact after two adjacent conductors 8211 come into contact.

[0126] Exemplarily, the conductor 8211 can be a sphere.

[0127] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "mounted", "connected", and "coupled" shall be construed in a broad sense. For example, it can be a fixed connection, or indirectly connected through an intermediate medium, or the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0128] The terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims, and the above drawings of the embodiments of the present application are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence.

[0129] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, and not to limit them; although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A memory component, characterized in that, it includes a first memory module and a second memory module; the second memory module is stacked and fixed on one side in the thickness direction of the first memory module, and the second memory module is electrically connected to the first memory module; the first memory module has a plug-in portion, and the projection of the plug-in portion along the thickness direction of the first memory module is located outside the projection of the second memory module along the thickness direction of the first memory module. The plug-in portion is used for plugging into a slot of a memory connector and is electrically connected to the memory connector; the second memory module is electrically connected to the plug-in portion.

2. The memory component according to claim 1, characterized in that, the first memory module includes a first circuit board, the second memory module includes a second circuit board and a second chip disposed on the second circuit board, and the second circuit board is stacked and fixed on one side in the thickness direction of the first circuit board; the first circuit board has a first set of electrical connection structures, and the first set of electrical connection structures is located on the surface of the first circuit board facing the second circuit board. The first set of electrical connection structures is electrically connected to a first set of conductive contacts on the plug-in portion; the first set of conductive contacts is used for electrically connecting to the memory connector; the second circuit board has a second set of electrical connection structures, and the second set of electrical connection structures is located on the surface of the second circuit board facing the first circuit board. The second set of electrical connection structures is electrically connected to the second chip; the first set of electrical connection structures is electrically connected to the second set of electrical connection structures, so that the second chip is electrically connected to the first set of conductive contacts through the second set of electrical connection structures and the first set of electrical connection structures.

3. The memory component according to claim 2, characterized in that, the first set of electrical connection structures and the second set of electrical connection structures are oppositely arranged in the thickness direction of the first circuit board.

4. The memory component according to claim 3, characterized in that, an elastic film is provided between the first set of electrical connection structures and the second set of electrical connection structures; the elastic film includes a conductive structure group and an insulating elastic body. At least part of the conductive structure group is disposed in the elastic body, and the elastic body clamps and fixes the conductive structure group in the elastic body; the elastic body is clamped and fixed by the first set of electrical connection structures and the second set of electrical connection structures, so that both ends of the conductive structure group in the thickness direction of the elastic body are in electrical contact with the first set of electrical connection structures and the second set of electrical connection structures respectively.

5. The memory component according to claim 4, characterized in that, the first set of electrical connection structures includes a plurality of first electrical connection structures, and the second set of electrical connection structures includes a plurality of second electrical connection structures corresponding to the plurality of first electrical connection structures one by one; the conductive structure group includes a plurality of spaced-apart conductive structures, each of the conductive structures is at least partially disposed in the elastic body, and each of the conductive structures is pressed and fixed by the elastic body; Each of the first electrical connection structures and the corresponding second electrical connection structures clamps and fixes the elastomer, and each of the first electrical connection structures and the corresponding second electrical connection structures is in electrical contact with at least one of the conductive structures at both ends in the thickness direction of the elastomer; The conductive structures with which each of the first electrical connection structures and the corresponding second electrical connection structures are in electrical contact are spaced apart from the other first electrical connection structures and second electrical connection structures.

6. The memory module according to claim 5, wherein, each of the conductive structures includes a plurality of conductors distributed in the thickness direction of the elastomer; in the same conductive structure, each of the conductors is in electrical contact with an adjacent conductor; each of the first electrical connection structures and the corresponding second electrical connection structures is in electrical contact with two of the conductors at both ends in the thickness direction of the conductive structure.

7. The memory module according to claim 5 or 6, wherein, the distance between two adjacent conductive structures is less than the distance between two adjacent first electrical connection structures.

8. The memory module according to any one of claims 2-7, wherein, the first memory module includes a first chip, and the first chip is mounted on the first circuit board; the first set of conductive contacts includes a first conductive contact and a second conductive contact, both the first conductive contact and the second conductive contact are electrically connected to the second memory module, and the second conductive contact is also electrically connected to the first chip.

9. The memory module according to any one of claims 1-8, wherein, the insertion portion has a second set of conductive contacts, the second set of conductive contacts is electrically connected to the first chip of the first memory module, and the second set of conductive contacts is used for electrical connection with the memory connector.

10. An electronic device, wherein, comprises a main board, a memory connector and a memory module according to any one of claims 1-9; the memory connector is mounted on the main board, and the memory connector has a slot; the insertion portion of the memory module is inserted into the slot.

Images