Server

Abstract

The invention discloses a server, and relates to the technical field of mechanism design, and the server comprises a case; the hard disk backboard is arranged in the case, and at least two links are arranged on the hard disk backboard; the at least two flexible circuit boards are connected to the hard disk backboard, and each flexible circuit board is in communication connection with one link; and at least two main boards, wherein each main board is in communication connection with one flexible circuit board. The at least two mainboards are connected through the flexible circuit board, dual homing of the hard disk is achieved, data loss caused when any mainboard breaks down is avoided, data safety is improved, connection operation is simple, and the defects that due to the fact that the number of cables is large, wiring is tedious, installation is difficult, the cables block wind, and heat dissipation is affected can be overcome. The server provided by the invention can overcome the problems of easy data loss, tedious wiring, difficult installation and easy influence on heat dissipation of the server in the related technology, can improve the security of the data, is simple to install, and is helpful for improving the heat dissipation effect of the server.

Description

Technical Field

[0001] This application relates to the technical field of mechanism design, and particularly to a server. Background Art

[0002] With the rapid development of the artificial intelligence and big data industries, the requirement for the data reliability of hard disks is getting higher and higher. The hard disk backplane is connected to the main board through cables, so that the main board manages the hard disks.

[0003] However, in related technologies, the hard disk backplane is usually single-homed, that is, the hard disk backplane is managed by one main board. This means that when the main board fails, there is a risk of data loss, which is not conducive to improving data security and cannot meet the needs of industries with high requirements for data security. Summary of the Invention

[0004] This application provides a server to at least solve the problem of the risk of data loss when the main board of the server in related technologies fails.

[0005] This application provides a server, including: A chassis; A hard disk backplane, disposed inside the chassis, and at least two links are provided on the hard disk backplane; At least two flexible printed circuit boards, connected to the hard disk backplane, and each flexible printed circuit board is communicatively connected to one link; At least two main boards, and each main board is communicatively connected to one flexible printed circuit board.

[0006] Through this application, since at least two links are provided on the hard disk backplane, and each link is connected to a flexible printed circuit board, at least two main boards are connected through the flexible printed circuit board. A single dual-homed hard disk can divide X4 signals, split the X4 signals into two 1:1 X2 signals, and the two X2 signals are respectively connected to two main boards through two flexible printed circuit boards, thereby realizing the dual-homing of the hard disk, avoiding data loss when any main board fails, and thus improving data security, and being applicable to the usage requirements of high-security industries such as banks and securities.

[0007] On this basis, the flexible printed circuit board itself is a thin sheet with a thickness of a few tenths of a millimeter. Therefore, the flexible printed circuit board itself occupies a small volume, has less blockage in the height direction inside the server, and has a simple connection with the hard disk backplane, and can overcome the defects of cumbersome wiring, difficult installation, and cable wind blocking and affecting heat dissipation caused by a large amount of cables.

[0008] Secondly, in the related art, the amount of signals that need to be transmitted by the hard disk backplane is large, and the hard disk backplane is connected to the motherboard through a cable. Therefore, a connector for connecting the cable needs to be provided, resulting in a relatively large volume of the hard disk backplane itself, which is likely to affect the ventilation and heat dissipation inside the chassis. In the embodiments of the present application, the flexible printed circuit board is connected to the hard disk backplane by co-pressing. The flexible printed circuit board can replace the hard disk backplane to achieve part of the signal interaction function, and the connection between the flexible printed circuit board and the hard disk backplane does not need to be realized through a connector. Thus, the number of connectors on the hard disk backplane and the number of signals that need to be transmitted by the hard disk backplane are reduced. Furthermore, it helps to reduce the size of the hard disk backplane and the number of layers of the hard disk backplane, helps to improve the heat dissipation inside the chassis, and reduces the manufacturing cost of the hard disk backplane.

[0009] Therefore, the server of the present application can overcome the problems existing in the servers in the related art, such as easy data loss, cumbersome wiring, difficult installation and easy influence on heat dissipation. It can improve the data security, and the installation is simple, which helps to enhance the heat dissipation effect of the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0011] Figure 1 Schematic diagram of a hard disk backplane, a flexible printed circuit board, a horizontal backplane and a motherboard of a server provided by an embodiment of the present application; Figure 2 For Figure 1 Schematic diagram of the interaction relationship among the hard disk backplane, the flexible printed circuit board, the horizontal backplane and the motherboard shown; Figure 3 Schematic diagram of a hard disk backplane of a server according to an embodiment of the present application; Figure 4 Schematic diagram of the connection part between a hard disk backplane and a flexible printed circuit board of a server according to an embodiment of the present application; Figure 5 Schematic diagram of a horizontal backplane and a motherboard of a server according to an embodiment of the present application; Figure 6 Schematic diagram of a hard disk backplane, a flexible printed circuit board, a horizontal backplane and a motherboard of a server according to an embodiment of the present application; Figure 7 Enlarged view of the connection part between a flexible printed circuit board and a fixing member of a server according to an embodiment of the present application; Figure 8 Enlarged view of a fixing member of a server according to an embodiment of the present application.

[0012] Among them, the above-mentioned drawings include the following reference numerals: 1. Hard disk backplane; 101. Backplane signal layer; 1011. Third sub-layer; 1012. Fourth sub-layer; 102. Backplane power layer; 103. Board body; 104. First hard disk connector; 105. Hard disk interface adapter board; 106. Second hard disk connector; 2. Flexible printed circuit board; 201. Flexible board signal layer; 2011. First sub-layer; 2012. Second sub-layer; 202. Flexible board power layer; 203. Through hole; 3. Main board; 301. Second connector; 302. Guide groove; 4. Horizontal backplane; 401. First connector; 402. Backplane body; 403. Third connector; 404. Guide protrusion; 405. Horizontal board signal layer; 4051. Fifth sub-layer; 4052. Sixth sub-layer; 406. Horizontal board power layer; 5. Fixing member; 501. Fixing member body; 5011. First folding plate; 5012. Second folding plate; 5013. Reinforcing rib; 502. First connecting portion; 503. Mounting surface; 504. Second connecting portion. Detailed implementation manners

[0013] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0014] It should be noted that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. The terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular", and "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, and the acceptable deviation range of approximate parallelism can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, and the acceptable deviation range of approximate perpendicularity can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of any one of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0015] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the following further describes the present application in detail with reference to the attached Figure 1 to the attached Figure 8 drawings and specific embodiments.

[0016] In the related art, the hard disk backplane 1 and the motherboard 3 are connected by a large number of cables. Connecting through cables has problems such as cumbersome wiring and difficult installation. Moreover, as the number of front window disks and the disk speed of the server increase, the amount of cables used also increases. This not only causes a large area of the cables to block the wind, but also makes it difficult to achieve the dual-homing of the hard disk backplane 1. As a result, in the related art, the hard disk backplane 1 can only be connected to one motherboard 3, that is, the hard disk backplane 1 is single-homed, and there is a risk of system downtime and data loss caused by the failure of the motherboard 3.

[0017] In the related art, a hard disk connector is provided on the front side of the hard disk backplane 1, and the hard disk connector is used to plug in a hard disk. The rear side of the hard disk backplane 1 is used to be plugged into the main board 3, so as to realize the interconnection between the main board 3 and the hard disk.

[0018] However, since the hard disk backplane 1 needs to transmit a large amount of signals, there are a large number of traces on the hard disk backplane 1, and a large number of connectors need to be provided on the hard disk backplane 1, resulting in a large size and a large number of layers of the hard disk backplane 1, causing a large size occupied by the hard disk backplane 1 in the width direction, affecting the ventilation and heat dissipation in the chassis. Even if holes are opened on the surface of the hard disk backplane 1, due to the limited size of the holes on the surface of the hard disk backplane 1, the heat dissipation effect is still not ideal. In addition, since the hard disk backplane 1 needs to transmit a large amount of signals, the trace link on the hard disk backplane 1 is long, the signal attenuates significantly on the hard disk backplane 1, and it is difficult to improve the signal transmission efficiency on the hard disk backplane 1. Only by relying on the upgrade of large-size backplane materials can the signal transmission quality be improved, and the cost investment is relatively high.

[0019] As Figure 1 and Figure 6 shown, an embodiment of the present application provides a server. The server includes a chassis, a hard disk backplane 1, at least two flexible printed circuit boards 2, and at least two main boards 3.

[0020] Wherein, the hard disk backplane 1 is arranged in the chassis, and at least two links are provided on the hard disk backplane 1. At least two flexible printed circuit boards 2 are connected to the hard disk backplane 1, and each flexible printed circuit board 2 is communicatively connected to one link. Each main board 3 is communicatively connected to one flexible printed circuit board 2.

[0021] Through the present application, since at least two links are provided on the hard disk backplane 1, and each link is connected to one flexible printed circuit board 2, at least two main boards 3 are connected through the flexible printed circuit board 2. A single dual-homed hard disk can divide the X4 signal, split the X4 signal into two 1:1 X2 signals, and the two X2 signals are respectively connected to the two main boards 3 through the two flexible printed circuit boards 2, thereby realizing the dual-homing of the hard disk, avoiding data loss when any one of the main boards 3 fails, thereby improving the data security, and being applicable to the usage requirements of high-security industries such as banks and securities.

[0022] On this basis, the flexible printed circuit board 2 itself is a thin sheet with a thickness of a few tenths of a millimeter. Therefore, the flexible printed circuit board 2 itself occupies a small volume, has less obstruction in the height direction inside the server, and has a simple connection with the hard disk backplane 1, and can overcome the defects caused by a large amount of cables, such as cumbersome wiring, difficult installation, and cable blocking, affecting heat dissipation, etc.

[0023] Secondly, in the related art, the hard disk backplane 1 needs to transmit a large amount of signals, and the hard disk backplane 1 is connected to the motherboard 3 through a cable. Therefore, a connector for connecting the cable needs to be provided, resulting in a relatively large volume of the hard disk backplane 1 itself, which is likely to affect the ventilation and heat dissipation inside the chassis. In the embodiment of the present application, the flexible printed circuit board 2 is connected to the hard disk backplane 1 by co-pressing. The flexible printed circuit board 2 can replace the hard disk backplane 1 to implement part of the signal interaction function, and the connection between the flexible printed circuit board 2 and the hard disk backplane 1 does not need to be realized through a connector. Thus, the number of connectors on the hard disk backplane 1 and the number of signals that the hard disk backplane 1 needs to transmit are reduced, which helps to reduce the size of the hard disk backplane 1 and the number of layers of the hard disk backplane 1, helps to improve the heat dissipation inside the chassis, and reduces the manufacturing cost of the hard disk backplane 1.

[0024] Therefore, the server of the present application can overcome the problems of easy data loss, cumbersome wiring, difficult installation and easy heat dissipation influence existing in the servers in the related art, can improve the data security, and has simple installation, which helps to improve the heat dissipation effect of the server.

[0025] Among them, the X4 signal and the X2 signal refer to the number of signal channels in the PCIe (Peripheral Component Interconnect Express) interface. The X4 signal indicates that there are 4 signal channels in the PCIe interface. The PCIe interface with the X4 signal has a relatively high bandwidth and data transmission rate and is suitable for devices that require high bandwidth. The X2 signal indicates that there are 2 signal channels in the PCIe interface. The PCIe interface with the X2 signal has a relatively low bandwidth and data transmission rate, but can still meet the needs of some devices.

[0026] It should be noted that in the embodiment of the present application, the numbers of the flexible printed circuit board 2 and the motherboard 3 are not limited and can be adaptively adjusted according to the usage requirements of the server. Exemplarily, in a preferred embodiment, there are two flexible printed circuit boards 2 and two motherboards 3 respectively. The dual-processor server is equipped with two processors, which can process more tasks simultaneously, provide double processing power, and perform better in processing complex calculations and resource-intensive applications, such as data-intensive processes, virtualization, high-performance computing and other scenarios. The two independent processors can more effectively allocate the workload, reduce resource contention, improve the overall system performance, and achieve better multitasking capabilities. On this basis, the motherboard 3 of the dual-processor server usually has more memory slots and expansion slots, and can support more memory and expansion cards, such as PCIe slots, SATA interfaces, etc., which is convenient for connecting various external devices and expansion cards to meet the needs of different application scenarios.

[0027] Among them, communication connection refers to the communication between connected devices through the transmission interaction of signals. The communication connection methods include wired connection and wireless connection. Wired connection includes the use of physical media such as network cables and optical fibers for connection. For example, computers can be connected to switches or routers via network cables to achieve communication within a local area network. Wireless connection refers to the use of radio waves for communication, such as Wi-Fi, Bluetooth, Zigbee, etc. Wireless connection is flexible and convenient, and is suitable for mobile devices and environments where wiring is difficult.

[0028] In one embodiment, the flexible printed circuit board 2 (FPC for short) is a highly reliable and excellently flexible printed circuit board made of a flexible insulating substrate, and has the characteristics of high wiring density, light weight, thin thickness, and good bendability.

[0029] In one embodiment, the flexible circuit board 2 is preferably made of a substrate material with high ductility, and the thickness of the flexible circuit board 2 is reduced by controlling the number of layers of the flexible circuit board 2, and the rigidity of the flexible circuit board 2 is reduced.

[0030] Exemplarily, the substrate material of the flexible circuit board 2 is preferably, but not limited to, polyimide, polyester, polytetrafluoroethylene, polyethylene naphthalate, and liquid crystal display polymer.

[0031] In one embodiment, the routing direction inside the flexible circuit board 2 is preferably set to be consistent with the extension direction of the flexible circuit board 2, so as to avoid the crossing of the routing inside the flexible circuit board 2 as much as possible, which can ensure that the stress distribution of the conductor during the bending process is more uniform, and can reduce problems such as wire breakage and damage caused by stress concentration, thereby improving the flexibility and bending times of the flexible board, extending its service life, and better adapting to the bending usage scenarios.

[0032] It should be noted that, in the present application, the internal routing direction of the flexible circuit board 2 is consistent with the extension direction of the flexible circuit board 2, which means that the overall extension trend of the routing inside the flexible circuit board 2 is consistent with the extension direction of the flexible circuit board 2, and a small amount of angles formed between the routing direction and the extension direction of the flexible circuit board 2 does not affect its falling within the protection scope of the present application.

[0033] In one embodiment, Figure 2 As shown, each link of the hard disk backplane 1 includes a backplane signal layer 101 and a backplane power layer 102 that are stacked, and the flexible circuit board 2 correspondingly includes a flexible board signal layer 201 and a flexible board power layer 202 .

[0034] By setting it like this, the two links on the hard disk backplane 1 can split the X4 signal into two 1:1 X2 signals. The backplane signal layer 101 in each link can be connected to the flexible board signal layer 201, and the backplane power layer 102 can be connected to the flexible board power layer 202, thus facilitating the connection between the hard disk backplane 1 and the flexible circuit board 2.

[0035] In one embodiment, as Figure 2 shown, the flexible board signal layer 201 includes a first sub-layer 2011 and a second sub-layer 2012 which are stacked.

[0036] In this application, by adjusting the width of the flexible circuit board 2, the number of interactive signals and the current-carrying capacity are increased. Through the reasonable allocation of the number of layers of the flexible circuit board 2, it can be ensured that the width of the flexible circuit board 2 itself is appropriate, without affecting the heat dissipation inside the chassis, and it will not affect its flexibility due to the excessive thickness of the flexible circuit board 2 itself, reducing the risk of damage to the flexible circuit board 2 during the bending process.

[0037] Setting the flexible board signal layer 201 to include the first sub-layer 2011 and the second sub-layer 2012 can ensure that the width of the flexible circuit board 2 is less than the size of the chassis in the width direction, so as to avoid the flexible circuit board 2 affecting the ventilation and heat dissipation inside the chassis, and the thickness of the flexible circuit board 2 can be within 0.36 mm to ensure the flexibility of the flexible circuit board 2.

[0038] It should be noted that in the description of this application, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the said features.

[0039] In one embodiment, the backplane signal layer 101 includes a third sub-layer 1011 and a fourth sub-layer 1012, and the third sub-layer 1011 and the fourth sub-layer 1012 can be respectively connected to the first sub-layer 2011 and the second sub-layer 2012.

[0040] As a transformable implementation manner, in an embodiment not shown in the drawings, the flexible board signal layer 201 can also be adaptively adjusted according to the complexity of the circuit. When the circuit is relatively simple, the flexible board signal layer 201 can also be set to one layer, and when the circuit complexity is relatively high, the flexible board signal layer 201 can also be set to multiple layers.

[0041] In one embodiment, the flexible board power layer 202 is provided between the first sub-layer 2011 and the second sub-layer 2012.

[0042] By setting it like this, the middle flexible board power layer 202 can serve as an electromagnetic shielding layer, which can reduce the mutual interference between the first sub-layer 2011 and the second sub-layer 2012, and improve the quality and stability of signal transmission. Moreover, the first sub-layer 2011, the flexible board power layer 202, and the second sub-layer 2012 can form a symmetric structure. Through reasonable layout, when the circuit board is bent and folded, the relative positions of the first sub-layer 2011, the flexible board power layer 202, and the second sub-layer 2012 can be kept stable, reducing problems such as signal transmission interruption or unstable power supply caused by bending, and improving the reliability of the flexible printed circuit board 2.

[0043] Among them, the first sub-layer 2011 and the second sub-layer 2012 can be used for routing high-speed signals, and the flexible board power layer 202 can be used for routing high-speed signals.

[0044] As a transformable embodiment, in an embodiment not shown in one of the drawings, the first sub-layer 2011 and the second sub-layer 2012 are adjacent, and the flexible board power layer 202 is disposed on the upper side or the lower side of the first sub-layer 2011 and the second sub-layer 2012.

[0045] In one embodiment, along the thickness direction of the flexible printed circuit board 2, the conductive structures in the first sub-layer 2011, the flexible board power layer 202, and the second sub-layer 2012 are arranged in a staggered manner.

[0046] By making the distribution areas of the conductive structures in the first sub-layer 2011, the flexible board power layer 202, and the second sub-layer 2012 different, the thickness of the laminated mixed pressure can be further reduced, thereby ensuring the flexibility of the flexible printed circuit board 2 and reducing the risk of damage to the flexible printed circuit board 2 during the bending process.

[0047] On this basis, in terms of electrical performance, by distributing the conductive structures in a staggered manner, the transmission path of electromagnetic signals can be changed, and the influence of electromagnetic interference can be reduced. This is particularly important for the transmission of high-frequency signals, which can improve the integrity and stability of signals. The staggered distribution of conductive structures can reduce reflections and crosstalk during signal transmission, and improve the quality and speed of signal transmission.

[0048] Secondly, the staggered distribution of the conductive structures can make the stress distribution between the conductive structure layers more uniform when the flexible printed circuit board 2 is bent or folded, reduce the risk of conductive structure fracture, improve the flexibility and durability of the flexible printed circuit board 2, and during the process of repeated bending or folding, the staggered distribution of the conductive structures can better withstand mechanical stress, reduce fatigue damage, and extend the service life of the flexible printed circuit board 2.

[0049] In one embodiment, the conductive structure can be selected as copper foil, but it is not limited thereto. Exemplarily, in an embodiment not shown in one of the drawings, the conductive structure can also be made of materials such as aluminum, nickel, gold, silver, copper alloy, nickel alloy, or graphene.

[0050] In one embodiment, the thicknesses of the first sub-layer 2011 and the second sub-layer 2012 are d1, where d1 ≤ 0.13 mm.

[0051] The thickness of the flexible board power supply layer 202 is d2, where d2 ≤ 0.1 mm.

[0052] The thickness of the flexible printed circuit board 2 is d3, where d3 ≤ 0.36 mm.

[0053] When the thicknesses of the first sub-layer 2011, the second sub-layer 2012, the flexible board power supply layer 202, and the flexible printed circuit board 2 are within the above ranges, the flexibility of the flexible printed circuit board 2 can be maximally ensured, and the self-rigidity of the flexible printed circuit board 2 can be reduced.

[0054] In one embodiment, as Figure 1 and Figure 6 shown, the server further includes a horizontal backplane 4. A first connector 401 is provided on the horizontal backplane 4, and a second connector 301 is provided on the main board 3. The first connector 401 is plugged into the second connector 301, and the flexible printed circuit board 2 is communicatively connected to the main board 3 through the horizontal backplane 4.

[0055] The horizontal backplane 4 itself can be co-pressed and connected to the flexible printed circuit board 2 to simplify the connection process between the flexible board and the horizontal backplane 4. The horizontal backplane 4 itself can be hot-pluggably connected to the main board 3 through the first connector 401.

[0056] By setting it in this way, the hot-pluggable connection between the horizontal backplane 4 and the main board 3 can be realized. When the main board 3 fails and needs to be maintained, the faulty main board 3 can be maintained without powering off the device, ensuring that data is not lost, and thus improving the stability of the data.

[0057] The horizontal backplane 4 is a circuit board for connecting the main board 3 and the flexible printed circuit board 2. The horizontal backplane 4 is usually made of a rigid material and has a certain hardness and strength, which can provide stable support for the connection. At the same time, the horizontal backplane 4 is connected to the flexible printed circuit board 2, and using the bendable characteristics of the flexible printed circuit board 2, it is convenient to make connections and wire in different spatial layouts and adapt to the internal structures of various complex electronic devices. The horizontal backplane 4 is designed with printed circuits for signal transmission and power distribution.

[0058] It should be noted that in the embodiments of the present application, the plane where the horizontal backplane 4 is located is set to be parallel to the plane where the main board 3 is located. Exemplarily, in most cases, the server is placed horizontally, the plane where the main board 3 is located is parallel to the horizontal plane, and the plane where the horizontal backplane 4 is located is also set to be parallel to the horizontal plane.

[0059] As a convertible implementation mode, in an embodiment not shown in the accompanying drawings, the server is a vertical server. In this case, the mainboard 3 extends in the vertical direction, and the horizontal backplane 4 is also configured to extend in the vertical direction, which does not affect its falling within the scope of protection required by this application.

[0060] The type and specification of the first connector 401 are determined according to specific application requirements. For example, in an optional embodiment, the first connector 401 and the second connector 301 are high-density connectors.

[0061] Exemplarily, in an optional embodiment, the first connector 401 is a high-density male connector, and the second connector 301 is a high-density female connector. As a convertible implementation, in an embodiment not shown in the drawings, the first connector 401 and the second connector 301 can be pin header connectors, socket connectors or other specially designed connectors to ensure reliable electrical connection and mechanical fixation. As a convertible implementation, in an embodiment not shown in the drawings, the flexible circuit board 2 is connected to a first connector 401 , and the first connector 401 is plugged into the second connector 301 .

[0062] For example, at this time, a ZIF connector may be optionally connected to the flexible circuit board 2. ZIF (Zero Insertion Force) plug-in is to connect the flexible circuit board and the main board 3 through a socket with a clamp. When inserting or removing the flexible circuit board, no additional insertion force is required, because the design of the clamp can automatically clamp or release the gold finger of the flexible circuit board.

[0063] As another convertible implementation, in an embodiment not shown in the drawings, the flexible circuit board 2 and the horizontal backplane 4 are connected via a pin header connector. The pin header connector is a common board-to-board connector, which realizes electrical connection between the flexible circuit board 2 and the horizontal backplane 4 by welding pin headers and female headers on the flexible circuit board 2 and the horizontal backplane 4. This connector has the advantages of reliable connection and stable signal transmission, and is suitable for occasions with high requirements for signal transmission quality.

[0064] As a convertible implementation, in an embodiment not shown in the accompanying drawings, the flexible circuit board 2 and the horizontal backplane 4 can also be connected using HDI (high density interconnect) technology, and electrical conduction between the flexible circuit board 2 and the horizontal backplane 4 can be achieved by connecting between layers.

[0065] In a preferred embodiment, a buffer pad and a spacer layer are provided between the flexible circuit board and the connector of the main board 3 to prevent damage to the flexible circuit board or the main board 3 by the connector. The buffer pad can be made of a soft material such as a foam pad, and the spacer layer can be made of a smooth material such as a plastic layer to prevent the connector from scratching the flexible circuit board or generating fine particles.

[0066] As a transformable implementation, in an embodiment not shown in another drawing, the flexible printed circuit board 2 is directly laminated and connected to the main board 3 to form a rigid-flexible combination board. This structure can improve the overall strength and stability of the circuit board while ensuring flexible connection, and reduce deformation and damage during hot plugging.

[0067] In one embodiment, as Figure 5 shown, the horizontal backplane 4 includes a backplane body 402, a third connector 403, and a connecting wire.

[0068] Among them, at least three links are provided on the backplane body 402. The at least three links include a first link, a second link, and a third link. The first link is communicatively connected to the flexible printed circuit board 2. The second link and the third link are connected between the first link of the main board 3 and the main board 3. The third connector 403 is connected to the backplane body 402 and is communicatively connected to the second link and the third link. The third connectors 403 of two horizontal backplanes 4 can be communicatively connected through a connecting wire.

[0069] The third connector 403 can be used to realize signal and power interconnection between two horizontal backplanes 4. By using the third connector 403 to replace the flexible printed circuit board 2 and the hard disk backplane 1 for interconnection, the signal and power lines inside the flexible printed circuit board 2 can be reduced, thereby reducing the width and thickness of the flexible printed circuit board 2 to ensure the flexibility of the flexible printed circuit board 2 while avoiding blocking the ventilation and heat dissipation inside the chassis by the flexible printed circuit board 2.

[0070] On this basis, when one of the horizontal backplanes 4 or one of the main boards 3 fails, the signal of the faulty horizontal backplane 4 or main board 3 can be transmitted to the intact horizontal backplane 4 and main board 3 through the third connector 403 and the connecting wire. Thus, the interaction between the hard disk and the main board 3 is realized by means of the intact horizontal backplane 4 and main board 3, and an alarm is given for the failure of the main board 3 or the horizontal backplane 4, thereby realizing redundant design of signals and power supply, ensuring data security, and reminding the operator to repair the faulty horizontal backplane 4 and main board 3 in time.

[0071] In addition, the third connector 403 can also ensure that when there are problems with the power supply and key signal interconnection of any one of the horizontal backplanes 4, redundant design of signals and power supply can be realized through the interconnection cable between the two horizontal backplanes 4.

[0072] Exemplarily, in an alternative embodiment, the third link and the fourth link respectively include a horizontal board signal layer 405 and a horizontal board power layer 406. The horizontal board signal layer 405 includes a fifth sub-layer 4051 and a sixth sub-layer 4052.

[0073] As an alternative implementation, in an embodiment not shown in a drawing, the connection between the two horizontal backplanes 4 is achieved through a flexible connector, and both ends of the flexible connector are compression-connected to one horizontal backplane 4 each.

[0074] In one embodiment, a guiding convex portion 404 is provided on one of the horizontal backplane 4 and the main board 3, and a guiding groove 302 is provided on the other of the horizontal backplane 4 and the main board 3.

[0075] By setting like this, during the process of the first connector 401 of the horizontal backplane 4 being inserted into the second connector 301 of the main board 3, the guiding convex portion 404 can be inserted into the guiding groove 302 and guide the first connector 401 to align with the second connector 301, so as to achieve the blind plug connection between the horizontal backplane 4 and the main board 3.

[0076] Among them, the guiding convex portion 404 is preferably but not limited to a guiding pin or a guiding needle. In one embodiment, the guiding groove 302 is formed on the inner circumference of a bushing. As an alternative implementation, in an embodiment not shown in a drawing, the guiding groove 302 can be directly formed on the horizontal backplane 4 or the main board 3.

[0077] In one embodiment, the guiding convex portion 404 is formed on the horizontal backplane 4, and the guiding groove 302 is formed on the main board 3.

[0078] As an alternative implementation, in an embodiment not shown in a drawing, the guiding convex portion 404 is formed on the main board 3, and the guiding groove 302 is formed on the horizontal backplane 4.

[0079] In one embodiment, the guiding convex portions 404 are arranged in pairs on the horizontal backplane 4 and are respectively arranged on both sides of the first connector 401; the guiding grooves 302 are arranged in pairs on the main board 3 and are respectively arranged on both sides of the second connector 301.

[0080] By setting like this, it can be avoided that the horizontal backplane 4 tilts during the process of being inserted into the main board 3, and the blind plug connection between the horizontal backplane 4 and the main board 3 can be achieved, thereby ensuring that the horizontal backplane 4 can be quickly and accurately docked with the main board 3, reducing the time required for the insertion operation, helping to improve the assembly efficiency of the server, and avoiding multiple insertion attempts caused by misalignment of the insertion, reducing the connection efficiency, and even causing damage to the connector.

[0081] In one embodiment, the guiding convex portions 404 are provided at both sides of the horizontal backplane 4 in the vertical direction. As an alternative embodiment, in an embodiment not shown in a drawing, the guiding convex portions 404 may also be provided at both sides of the horizontal backplane 4 in the horizontal direction.

[0082] In one embodiment, the guiding grooves 302 are provided at both sides of the main board 3 in the vertical direction. As an alternative embodiment, in an embodiment not shown in a drawing, the guiding grooves 302 may also be provided at both sides of the horizontal backplane 4 in the horizontal direction.

[0083] In one embodiment, at least two main board trays spaced apart in the vertical direction are further provided in the server, and one main board 3 can be fixedly provided on each main board tray.

[0084] The horizontal backplane 4 may be optionally plugged into the main board 3 and limited to the main board tray.

[0085] As an alternative embodiment, in an embodiment not shown in a drawing, the horizontal backplane 4 is limited by a separate limiting bracket, or is fixed to the chassis by a limiting member such as a buckle or a clip to ensure the stability of the horizontal backplane 4.

[0086] In one embodiment, the hard disk backplane 1 includes a board body 103, a first hard disk connector 104, a hard disk interface adapter board 105, and a second hard disk connector 106.

[0087] Among them, the first hard disk connector 104 is provided on the board body 103 and can be plugged into the first hard disk. The hard disk interface adapter board 105 is connected to the first hard disk connector 104. The second hard disk connector 106 is connected to the hard disk interface adapter board 105 and can be plugged into the second hard disk.

[0088] The interaction between the hard disk and the hard disk backplane 1 is realized by the insertion of the hard disk and the hard disk connector. Different types of hard disks need to be inserted into different types of hard disk connectors. The first connector 401 is provided on the hard disk backplane 1 of this embodiment, and the first connector 401 is transferred to the second hard disk connector 106 through the hard disk interface adapter board 105, so that a hard disk backplane 1 can be plugged into two types of hard disks, thereby expanding the applicable range of the hard disk backplane 1 and reducing the development volume of a hard disk backplane 1.

[0089] As an alternative embodiment, in an embodiment not shown in a drawing, only one type of hard disk connector is provided on the hard disk backplane 1 and is suitable for being plugged into one type of hard disk.

[0090] Exemplarily, when configuring a U.2 NVME SSD (i.e., a solid-state drive with a U.2 interface and the NVMe protocol), a U.2 connector (SFF-8639 connector) can be optionally connected to the hard disk backplane 1. It is an interface standard for high-speed serial connections in servers and storage systems, supporting the PCIe and SAS protocols).

[0091] When configuring an EDSFF SSD (Enterprise and Data Center SSD Form Factor, a solid-state drive with a form factor standard for enterprise and data center storage), an EDSFF connector can be optionally connected to the hard disk backplane 1.

[0092] In one embodiment, as Figure 3 shown, the first hard disk connector 104 is a U.2 connector, and the second hard disk connector 106 is an EDSFF connector.

[0093] By setting it in this way, the hard disk backplane 1 of the embodiment of the present application can be applicable to both traditional U.2 hard disks and the new generation of hard disks based on the EDSFF specification, such as E3.S / L hard disks, etc., and can meet the usage requirements of the vast majority of hard disks on the market.

[0094] On this basis, the U.2 connector is connected to the EDSFF connector through a U.2 connector to EDSFF connector interface adapter board. Since the size of the EDSFF connector is smaller than that of the U.2 connector, the EDSFF mating connector is placed on the hard disk backplane 1, which helps to reduce the cost of the hard disk backplane 1 and avoid occupying the ventilation area inside the chassis. On this basis, the EDSFF connector can currently meet the PCIE6.0 transmission requirements, which is more conducive to subsequent rate evolution.

[0095] Among them, the connection between the U.2 connector and the U.2 connector to EDSFF connector interface adapter board, and the connection between the U.2 connector to EDSFF connector interface adapter board and the EDSFF connector are preferably but not limited to welded connections.

[0096] In one embodiment, the U.2 connector usually has a specific pin arrangement and interface shape, and the U.2 connector to EDSFF connector interface adapter board is designed with a corresponding interface for receiving the U.2 connector. Insert the U.2 connector into the corresponding interface of the U.2 connector to EDSFF connector interface adapter board to ensure accurate pin correspondence to achieve physical connection.

[0097] In one embodiment, the other end of the U.2 connector to EDSFF connector interface adapter board is generally designed with an interface that matches the EDSFF connector. Docking the interface of the adapter board with the EDSFF connector to ensure that the shapes and pin arrangements of the interfaces are consistent to achieve physical connection.

[0098] As a transformable embodiment, in an embodiment not shown in one of the drawings, an EDSFF connector may be optionally connected to the board body 103, the EDSFF connector is connected to the EDSFF to U.2 connector interface adapter board, and the U.2 connector is connected to the EDSFF to U.2 connector interface adapter board.

[0099] In one embodiment, as Figure 7 and Figure 8 shown, a fixing portion is provided inside the chassis, the fixing portion is located on one side of the flexible circuit board 2, and the server further includes a fixing member 5.

[0100] The fixing member 5 includes a fixing member main body 501, a first connecting portion 502, and a mounting surface 503.

[0101] Among them, the first connecting portion 502 is formed on the fixing member main body 501 for connecting to the fixing portion. The mounting surface 503 is formed on the fixing member main body 501. A second connecting portion 504 is formed on the mounting surface 503. The second connecting portion 504 is used for connecting the flexible circuit board 2. In the direction from the hard disk backplane 1 to the motherboard 3, the mounting surface 503 is inclined towards the direction close to the corresponding motherboard 3, as Figure 6 and Figure 8 shown, the acute angle A formed between the mounting surface 503 and the horizontal plane is less than 30°.

[0102] By setting it in this way, the fixing member 5 can be connected to the fixing portion through the first connecting portion 502 and thus fixed inside the server chassis. On this basis, the flexible circuit board 2 can be connected to the mounting surface 503 through the second connecting portion 504 and fit with the surface of the mounting surface 503, which not only improves the reliability of fixing the flexible circuit board 2, but also can guide the direction of the flexible circuit board 2 by means of the mounting surface 503. When the angle of the acute angle formed between the mounting surface 503 and the horizontal plane is set to be less than 30°, it can ensure that the maximum opening angle of the flexible circuit board 2 is less than 30°, minimizing the stress concentration caused by the bending of the flexible circuit board.

[0103] In one embodiment, the first connecting portion 502 is a buckle, and mounting holes are formed on the flexible circuit board 2. The buckle can pass through the mounting holes of the flexible circuit board 2 to limit the flexible circuit board 2.

[0104] It should be noted that in the embodiments of the present application, the number of the first connecting portions 502 is not limited, and it is based on ensuring reliable connection between the fixing member 5 and the fixing portion.

[0105] Exemplarily, in a preferred embodiment, the number of the first connecting portions 502 is at least two, which can ensure that the fixing member 5 is reliably fixed on the fixing portion. The fixing member 5 is not likely to shake under the action of external force, and it will not affect the installation efficiency of the fixing member 5 due to too many fixing members 5, nor increase the installation cost of the fixing member 5.

[0106] It should be noted that in the embodiments of the present application, the number of the second connecting portions 504 is not limited, and it is based on ensuring reliable connection between the flexible circuit board 2 and the fixing member 5.

[0107] Exemplarily, in an alternative embodiment, the number of the second connecting portions 504 is two, and they are arranged at intervals along the extending direction of the flexible circuit board 2, which can reliably fix the flexible circuit board 2, ensure that the shape of the flexible circuit board 2 is consistent with the mounting surface 503, and prevent the flexible circuit board 2 from shaking after being connected to the fixing member 5. Moreover, it will not cause excessive occupation of the area of the flexible circuit board 2 due to too many connecting portions, nor increase the manufacturing cost of the fixing member 5.

[0108] In a preferred embodiment, when the fixing member 5 is connected to the fixing portion, the two second connecting portions 504 are arranged at intervals in the horizontal direction. By setting like this, it is convenient to control the inclination angle of the mounting surface 503, and further ensure that when the flexible circuit board 2 is connected to the mounting surface 503, the acute angle between the flexible circuit board 2 and the horizontal plane is less than 30°.

[0109] As an alternative implementation, in an embodiment not shown in a drawing, the connection between the flexible circuit board 2 and the fixing member 5 can also be selected as bonding or the like.

[0110] The second connecting portion 504 is a connection hole.

[0111] The fastener can pass through the fixing portion and the connection hole, so as to realize reliable connection between the fixing member 5 and the fixing portion.

[0112] As an alternative implementation, in an embodiment not shown in some drawings, the connection between the fixing portion and the fixing member 5 can also be selected as riveting, clamping or bonding or the like.

[0113] As a convertible implementation, in an embodiment not shown in the drawings, a first connection hole and a second connection hole connected to each other are formed on the fixing member 5, the aperture of the first connection hole is larger than the aperture of the second connection hole, and the second connection hole is formed on the convex bulge. The first connection hole of the fixing member 5 can be sleeved on the I-shaped nail on the side wall of the chassis, and then the fixing member 5 is moved to make the I-shaped nail slide into the second connection hole, and the convex bulge can be abutted against the convex head of the I-shaped nail, and the fixing member 5 is pressed against the side wall of the chassis.

[0114] In an optional embodiment, the fixing element body 501 includes a first folding plate 5011 and a second folding plate 5012 .

[0115] The mounting surface 503 is formed on the first folding plate 5011. The second folding plate 5012 is arranged at an angle with the first folding plate 5011, and the second connecting portion is formed on the second folding plate 5012.

[0116] In an optional embodiment, the fixing body 501 further includes a reinforcing rib 5013. The reinforcing rib 5013 is connected between the first folding plate 5011 and the second folding plate 5012. The reinforcing rib 5013 can be used to enhance the structural strength of the fixing body 501.

[0117] In an optional embodiment, the fixing portion is a side wall of the chassis, the fixing members 5 are arranged in pairs and are respectively connected to the two side walls of the chassis, and each pair of fixing members 5 can be connected to the flexible circuit board 2 on both sides of the flexible circuit board 2.

[0118] By such an arrangement, the fixing member 5 can be connected to the flexible circuit board 2 on both sides of the flexible circuit board 2, thereby reliably limiting the flexible circuit board 2 and avoiding vibration from affecting the reliability of the operation of the flexible circuit board 2. The fixing member 5 is connected to the side wall of the chassis, and there is no need to add other components in the chassis, which helps to reduce the number of parts in the server and can avoid increasing the wind resistance in the chassis due to the addition of a fixing part.

[0119] As a convertible implementation, in an embodiment not shown in the drawings, the fixing portion is independently provided and connected to the bottom and / or side wall of the chassis.

[0120] As a changeable implementation, in another embodiment not shown in the drawings, the fixing member 5 is only provided on one side of the flexible circuit board 2 .

[0121] In an optional embodiment, at least two main boards 3 are arranged at intervals in the vertical direction, and the flexible circuit boards 2 are arranged in pairs and are respectively connected to the top and bottom of the hard disk backplane 1 assembly.

[0122] By setting it in this way, it can be ensured that the flexible circuit board 2 does not occupy the space on the left and right sides of the chassis, so as to ensure that hard disks can be placed in the entire width direction of the chassis and maximize the number of hard disks.

[0123] On this basis, the two flexible circuit boards 2 are respectively connected to the hard disk backplane 1 at the top and bottom of the hard disk backplane 1, which can ensure the overall smooth transition of the flexible circuit board 2, avoid large-angle bending of the flexible circuit board 2 during the extension process, avoid breakage of the flexible circuit board 2, and ensure the reliability of the flexible circuit board 2.

[0124] In one embodiment, as Figure 6 shown, the bottom height of the hard disk backplane 1 is lower than the corresponding horizontal backplane 4, and the top height of the hard disk backplane 1 is higher than the corresponding horizontal backplane 4. Along the direction from the hard disk backplane 1 to the horizontal backplane 4, the top flexible circuit board 2 is bent downward, and the bottom flexible circuit board 2 is bent upward.

[0125] As a variable implementation manner, in an embodiment not shown in the drawings, the hard disk backplane 1 can also be set such that both the top height and the bottom height are higher than the corresponding horizontal backplane 4, or both the top height and the bottom height are lower than the corresponding horizontal backplane 4.

[0126] As a variable implementation manner, in an embodiment not shown in one of the drawings, the two flexible circuit boards 2 are respectively connected to the hard disk backplane 1 on the left and right sides of the hard disk backplane 1.

[0127] In an alternative embodiment, through holes 203 are formed on the flexible circuit board 2.

[0128] When the flexible circuit board 2 is bent, stress concentration will occur in the bending area. Opening the through holes 203 can disperse the stress to the periphery of the through holes 203, reduce the degree of stress concentration, and thus reduce the risk of the circuit board breaking due to excessive stress during the bending process. On this basis, the through holes 203 can also provide a certain deformation space for the material of the flexible circuit board 2 during bending, enabling the material to better adapt to the shape change during the bending process and reducing the fracture phenomenon caused by limited material deformation, thereby improving the reliability of the flexible circuit board 2. Secondly, during the process of opening the through holes 203, some defects inside the material of the flexible circuit board 2, such as impurities and air bubbles, can be removed, thereby improving the quality and uniformity of the material and reducing the fracture hidden danger caused by internal defects of the material. In addition, the through holes 203 themselves can be used for the passage of air flow, which helps with ventilation and heat dissipation inside the chassis.

[0129] In a preferred embodiment, the through holes 203 are formed in the bending area of the flexible circuit board 2, thereby improving the reliability of the flexible circuit board 2 while avoiding occupying the space for routing on the flexible circuit board 2.

[0130] As a transformable embodiment, in an embodiment not shown in one of the drawings, the through holes 203 are spaced apart and distributed across the entire flexible printed circuit board 2.

[0131] In one embodiment, the through holes 203 are formed in the middle of the flexible printed circuit board 2 and are spaced along the length direction of the flexible printed circuit board 2.

[0132] It should be noted that in the embodiments of the present application, the shape of the through holes 203 is not limited. Exemplarily, in an alternative embodiment, the through holes 203 are waist-shaped holes. As a transformable embodiment, in some embodiments not shown in the drawings, the through holes 203 can also be selected as circular holes, square holes, oval holes, trapezoidal holes or irregular-shaped holes, etc.

[0133] In one embodiment, as Figure 4 shown, the hard disk backplane 1 is press-fitted and connected to the flexible printed circuit board 2. By setting it in this way, the hard disk backplane 1 can be processed integrally with the flexible printed circuit board 2 by co-laminating during the processing stage, greatly simplifying the connection process between the hard disk backplane 1 and the flexible printed circuit board 2.

[0134] On this basis, since the flexible printed circuit board 2 has good flexibility and bendability and can adapt to different installation environments and space requirements, after being co-laminated and connected to the hard disk backplane 1, it can better adapt to the small vibrations and displacements during the operation of the hard disk, reducing the situation of unstable or interrupted signal transmission caused by vibrations and ensuring the continuity and reliability of data transmission.

[0135] When the flexible printed circuit board 2 and the hard disk backplane 1 are co-laminated and connected, through reasonable wiring and electromagnetic shielding design, the influence of electromagnetic interference on signal transmission can be effectively reduced, the quality and stability of signal transmission can be improved, and the phenomena of data transmission errors and packet loss can be reduced. In addition, the co-laminated connection between the flexible printed circuit board 2 and the hard disk backplane 1 can reduce the complexity of connection points and wiring, thereby saving space and reducing costs. At the same time, the co-laminated connection can also improve production efficiency and product quality, reducing the scrap rate and rework rate during the production process. During equipment maintenance and upgrade, the design of the co-laminated connection between the flexible printed circuit board 2 and the hard disk backplane 1 makes it more convenient to replace or repair components. Due to the bendability of the flexible printed circuit board 2, when replacing or repairing components, it is not necessary to disassemble and re-wire the entire circuit board, and only the part that needs to be replaced or repaired needs to be operated, reducing the maintenance difficulty and cost and improving the maintainability and upgradability of the equipment.

[0136] In one embodiment, rigid-flexible bonding parts are respectively provided in the upper and lower parts of the hard disk backplane 1, and the hard disk backplane 1 is co-laminated and connected to the flexible printed circuit board 2 through the rigid-flexible bonding parts.

[0137] The flexible circuit board 2 is connected to the end of the hard disk backplane 1, which can reduce reflection, crosstalk and other problems in the signal transmission process, make the signal transmission more stable, reduce signal attenuation, improve transmission quality, reduce data transmission errors, and have better electromagnetic compatibility. It can better control electromagnetic radiation and anti-interference capabilities, reduce the impact of electromagnetic interference on signal transmission, and enable the hard disk system to work stably even in a complex electromagnetic environment.

[0138] As a convertible implementation, the connection between the flexible circuit board 2 and the hard disk backplane 1 can be selected as a welding connection or a connection of a board-to-board connector.

[0139] For example, in an embodiment not shown in the drawings, the flexible circuit board 2 and the hard disk backplane 1 are connected via a pin header connector. The pin header connector is a common board-to-board connector, which realizes electrical connection between the flexible circuit board 2 and the hard disk backplane 1 by welding pin headers and female headers on the flexible circuit board 2 and the hard disk backplane 1. This connector has the advantages of reliable connection and stable signal transmission, and is suitable for occasions with high requirements for signal transmission quality.

[0140] As a convertible implementation, in an embodiment not shown in the accompanying drawings, the flexible circuit board 2 and the hard disk backplane 1 can also be connected using HDI (high density interconnect) technology, and electrical conduction between the flexible circuit board 2 and the hard disk backplane 1 is achieved by connecting between layers.

[0141] It should be noted that the flexible circuit board 2 in the embodiment of the present application is first processed into one piece with the hard disk backplane 1 during the processing, and then when the hard disk backplane 1 and the flexible circuit board 2 are installed, the flexible circuit board 2 is fixed on the fixing member 5 and the bending angle of the flexible circuit board 2 is ensured.

[0142] In one embodiment, a wind cooling mechanism is also provided in the server, and the hard disk backplane 1 can be optionally provided upstream or downstream of the wind outlet direction of the wind cooling mechanism. When the hard disk backplane 1 is placed upstream of the blowing direction, the cold air can first flow through the hard disk backplane 1 to take away the heat generated by the hard disk, and then flow to other components, such as the central processing unit, memory, etc. This can improve the heat dissipation efficiency of the entire system and prevent the hard disk from experiencing performance degradation or failure due to overheating.

[0143] In one embodiment, the server further includes a hard disk, and the hard disk can be plugged into the hard disk backplane 1 .

[0144] In summary, the server of the embodiment of the present application has the following beneficial effects: 1. The server of the embodiment of the present application realizes dual ownership of hard disks through the flexible circuit board 2, which has more advantages in improving production convenience, optimizing heat dissipation of the whole machine, and reducing single point failures compared with the solution through hard board connection or cable connection; 2. In the server according to the embodiment of the present application, the flexible printed circuit board 2 and the horizontal backplane 4 can replace the hard disk to implement the function of partial signal interaction, thereby reducing the signal complexity of the hard disk backplane 1, and further helping to reduce the size and number of layers of the hard disk backplane 1. This not only reduces the air resistance of the whole machine system, but also avoids the defects caused by all signals being integrated on the hard disk backplane 1, such as too long trace links on the hard disk backplane 1, large signal attenuation, which is not conducive to improving signal transmission efficiency, and high failure rate. Moreover, it is not necessary to rely on the upgrade of large-size backplane materials to improve the signal transmission quality, which helps to reduce the input cost of the hard disk backplane 1; 3. The server according to the embodiment of the present application provides a hard disk adapter board design solution, which converts the U.2 interface into an EDSFF interface, so that the EDSFF backplane can be compatible with U.2 hard disks and EDSFF hard disks, reducing the types of hard disk backplane 1 development and the development workload of the hard disk backplane 1; 4. The server according to the embodiment of the present application provides a signal layering and interconnection solution for the hard disk backplane 1, the flexible printed circuit board 2, and the horizontal backplane 4, realizing signal redundancy design layering inside the board card.

[0145] 5. And a fixing member 5 for fixing the flexible printed circuit board 2 is provided, which can ensure the fixing reliability of the flexible printed circuit board 2 and ensure that the maximum opening angle of the flexible printed circuit board 2 is less than 30°, minimizing the stress concentration caused by the bending of the flexible printed circuit board 2.

[0146] The above has introduced in detail a server provided by the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope required by the present invention.

Claims

1. A server, characterized in that: include: Chassis; A hard disk backplane (1) is arranged in the chassis, and at least two links are arranged on the hard disk backplane (1); At least two flexible circuit boards (2) are connected to the hard disk backplane (1), and each of the flexible circuit boards (2) is communicatively connected to one of the links; At least two main boards (3), each of the main boards (3) being communicatively connected to one of the flexible circuit boards (2).

2. The server according to claim 1, characterized in that: Each link of the hard disk backplane (1) comprises a backplane signal layer (101) and a backplane power layer (102) which are stacked, and the flexible circuit board (2) correspondingly comprises a flexible board signal layer (201) and a flexible board power layer (202).

3. The server according to claim 2, characterized in that: The flexible board signal layer (201) comprises a first sublayer (2011) and a second sublayer (2012) which are stacked.

4. The server according to claim 3, characterized in that: The flexible board power supply layer (202) is arranged between the first sub-layer (2011) and the second sub-layer (2012).

5. The server according to claim 3, characterized in that: Along the thickness direction of the flexible circuit board (2), the conductive structures in the first sublayer (2011), the flexible board power supply layer (202) and the second sublayer (2012) are staggered.

6. The server according to claim 3, characterized in that: The thickness of the first sublayer (2011) and the second sublayer (2012) is d1, d1≤0.13 mm; and / or, The thickness of the flexible board power supply layer (202) is d2, d2≤0.1 mm; and / or, The thickness of the flexible circuit board (2) is d3, d3≤0.36 mm.

7. The server according to any one of claims 1 to 6, characterized in that: Also includes: A horizontal backplane (4), wherein a first connector (401) is provided on the horizontal backplane (4), and a second connector (301) is provided on the mainboard (3), the first connector (401) and the second connector (301) are plugged together, and the flexible circuit board (2) is communicatively connected with the mainboard (3) via the horizontal backplane (4).

8. The server according to claim 7, characterized in that: The horizontal back plate (4) comprises: A backplane body (402) is provided with at least three links, the at least three links comprising a first link, a second link and a third link, the first link being communicatively connected to the flexible circuit board (2), the second link and the third link being connected between the first link of the mainboard (3) and the mainboard (3); The third connector (403) is connected to the backplane body (402) and is in communication connection with the second link and the third link: A connection line, through which the third connectors (403) of the two horizontal backplanes (4) can be communicatively connected.

9. The server according to claim 7, characterized in that: A guide protrusion (404) is provided on one of the horizontal back plate (4) and the main plate (3), and a guide groove (302) is provided on the other of the horizontal back plate (4) and the main plate (3).

10. The server according to claim 9, characterized in that The guide protrusions (404) are arranged in pairs on the horizontal back plate (4) and are respectively arranged on both sides of the first connector (401); the guide grooves (302) are arranged in pairs on the main board (3) and are respectively arranged on both sides of the second connector (301).

11. The server according to any one of claims 1 to 6, characterized in that: The hard disk backplane (1) comprises: Board body(103); A first hard disk connector (104), provided on the board body (103) and capable of being plugged into a first hard disk; A hard disk interface adapter board (105), connected to the first hard disk connector (104); The second hard disk connector (106) is connected to the hard disk interface adapter board (105) and can be plugged into a second hard disk.

12. The server according to claim 11, characterized in that The first hard disk connector (104) is a U.2 connector, and the second hard disk connector (106) is an EDSFF connector.

13. The server according to any one of claims 1 to 6, characterized in that: A fixing portion is provided in the chassis, and the fixing portion is located on one side of the flexible circuit board (2). The server further comprises a fixing member (5), comprising: The fixing body (501); A first connecting portion (502), formed on the fixing element body (501), and used for connecting to the fixing portion; A mounting surface (503) is formed on the fixing body (501), and a second connecting portion (504) is formed on the mounting surface (503), wherein the second connecting portion (504) is used to connect the flexible circuit board (2), and in the direction from the hard disk backplane (1) to the main board (3), the mounting surface (503) is inclined in a direction close to the corresponding main board (3), and an acute angle formed between the mounting surface (503) and a horizontal plane is less than 30°.

14. The server according to claim 13, characterized in that: The first connecting portion (502) is a buckle, and a mounting hole is formed on the flexible circuit board (2); and / or, The second connecting portion (504) is a connecting hole.

15. The server according to claim 13, characterized in that: The fixing element body (501) comprises: a first folding plate (5011), the mounting surface (503) being formed on the first folding plate (5011); The second folding plate (5012) is arranged at an angle with the first folding plate (5011), and the second connecting portion is formed on the second folding plate (5012).

16. The server according to claim 15, characterized in that The fixing element body (501) further comprises: A reinforcing rib (5013) is connected between the first folding plate (5011) and the second folding plate (5012).

17. The server according to claim 13, characterized in that: The fixing portion is a side wall of the chassis, the fixing members (5) are arranged in pairs and are respectively connected to the side walls on both sides of the chassis, and each pair of the fixing members (5) can be connected to the flexible circuit board (2) at both sides of the flexible circuit board (2).

18. The server according to any one of claims 1 to 6, characterized in that: At least two of the main boards (3) are arranged at intervals in the vertical direction, and the flexible circuit boards (2) are arranged in pairs and are respectively connected to the top and bottom of the hard disk backplane (1) assembly.

19. The server according to any one of claims 1 to 6, characterized in that: A through hole (203) is formed on the flexible circuit board (2).

20. The server according to any one of claims 1 to 6, characterized in that: The hard disk backplane (1) is press-connected with the flexible circuit board (2).

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