Server

Abstract

A server comprises a shell, a circuit board, at least one main heat source, at least one secondary heat source and at least one radiator. The shell is provided with a bottom plate. The circuit board is arranged on the bottom plate and is provided with a bottom surface and a top surface which are opposite to each other. The bottom surface faces the bottom plate. The at least one main heat source is arranged on the bottom surface. At least one primary heat source is disposed on the top surface. The calorific value of the at least one secondary heat source is less than that of the at least one main heat source. The at least one radiator is disposed on the base plate and thermally coupled to the at least one main heat source.

Description

Technical Field

[0001] The present invention relates to a server, in particular to a server with a main heat source disposed on the bottom surface of a circuit board. Background Art

[0002] With the advent of the big data era and the continuous development of cloud technology, the requirements for high-performance servers in all walks of life are getting higher and higher, and the amount of data to be processed by servers is becoming increasingly huge, resulting in a significant increase in the heat flux density and heat generation of servers. Therefore, the heat dissipation problem needs to be solved urgently.

[0003] Generally speaking, a server can dissipate heat through an air-cooling system. However, the current heat dissipation efficiency of high-power electronic components in the server is still insufficient, which will affect the operation of the server. Therefore, how to improve the heat dissipation efficiency of high-power electronic components in the server is one of the problems that researchers should solve. Summary of the Invention

[0004] The present invention aims to provide a server to improve the heat dissipation efficiency of the heat sources in the server.

[0005] A server provided by an embodiment of the present invention includes a housing, a circuit board, at least one main heat source, at least one secondary heat source, and at least one radiator. The housing has a bottom plate. The circuit board is disposed on the bottom plate and has a bottom surface and a top surface facing away from each other. The bottom surface faces the bottom plate. At least one main heat source is disposed on the bottom surface. At least one secondary heat source is disposed on the top surface. The heat generation amount of at least one secondary heat source is less than that of at least one main heat source. At least one radiator is disposed on the bottom plate and is thermally coupled to at least one main heat source.

[0006] According to the server of the above embodiment, since these main heat sources and these secondary heat sources are respectively disposed on the bottom surface and the top surface of the circuit board, these main heat sources are far away from these secondary heat sources, so as to distinguish a dedicated heat dissipation area for these main heat sources. Therefore, these main heat sources can have more space to dissipate heat, so as to avoid the heat generated by these main heat sources and these secondary heat sources concentrating in one place and being difficult to dissipate. In this way, the heat dissipation efficiency of the main heat sources in the server can be improved.

[0007] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and provide a further explanation of the scope of the patent application of the present invention. Brief Description of the Drawings

[0008] Figure 1 Is a perspective view of a server according to an embodiment of the present invention.

[0009] Figure 2 Is Figure 1 an exploded view of the server.

[0010] Figure 3 For Figure 1 Schematic cross-sectional view of the server

[0011] Figure 4 For Figure 1 Schematic perspective view of the radiator of the server

[0012] Figure 5 For Figure 1 Schematic perspective view of the radiator of the server omitting the heat conducting substrate

[0013] Explanation of the reference numerals in the drawings:

[0014] 10: Server; 11: Housing; 111: Bottom plate; 112: Air inlet; 113: Air outlet; 12: Tray; 121, 121A: First relief opening; 13: Circuit board; 131: Bottom surface; 132: Top surface; 14: Main heat source; 15: Sub heat source; 16: Secondary heat source; 17: Radiator; 171: Heat conducting substrate; 1711: Second relief opening; 1712: Protrusion; 172: Fins; 173: Heat pipe; 174: First heat conducting member; 175: Second heat conducting member; 18: Fan;; 19: Current limiting plate; 191: Current limiting hole; 110: Flow guiding member Detailed implementation manners

[0015] Please refer to Figures 1 to 3 . Figure 1 Schematic perspective view of the server according to the embodiment of the present invention Figure 2 For Figure 1 Exploded view of the server Figure 3 For Figure 1 Schematic cross-sectional view of the server

[0016] The server 10 of this embodiment includes a housing 11, a tray 12, a circuit board 13, a plurality of main heat sources 14, a plurality of sub heat sources 15, a plurality of secondary heat sources 16, a plurality of radiators 17 and a plurality of fans 18. The housing 11 has a bottom plate 111. The tray 12 is disposed inside the housing 11 and bears the circuit board 13. The circuit board 13 has a bottom surface 131 and a top surface 132 which face away from each other. The bottom surface 131 faces the bottom plate 111

[0017] These main heat sources 14 are, for example, CPU chips. These secondary heat sources 15 are, for example, electronic components such as VR MOS chips. These main heat sources 14 and these secondary heat sources 15 are disposed on the bottom surface 131. These tertiary heat sources 16 are, for example, low-power electronic components such as DIMMs and, for example, capacitors and inductors with relatively high heights, and are disposed on the top surface 132. That is to say, these main heat sources 14, these secondary heat sources 15, and these tertiary heat sources 16 are respectively disposed on opposite sides of the circuit board 13, that is, these main heat sources 14, these secondary heat sources 15, and these tertiary heat sources 16 are arranged in layers, and these main heat sources 14 and these secondary heat sources 15 are located on the bottom side (lower layer) of the circuit board 13. Among them, the heat generation amount of these tertiary heat sources 16 is less than the heat generation amount of these main heat sources 14. These radiators 17 are disposed on the bottom plate 111 and are respectively thermally coupled to these main heat sources 14 and these secondary heat sources 15.

[0018] Please also refer to Figure 4 and Figure 5 . Figure 4 is Figure 1 a perspective view of the radiator of the server. Figure 5 is Figure 1 a perspective view of the radiator of the server omitting the heat conducting substrate.

[0019] Specifically, each radiator 17 includes a heat conducting substrate 171, a fin 172, a plurality of heat pipes 173, a plurality of first heat conducting members 174, and a plurality of second heat conducting members 175. The fin 172 and these heat pipes 173 are disposed on the heat conducting substrate 171. Among them, these heat pipes 173 are, for example, arranged in layers on the heat conducting substrate 171, but are not limited thereto. The tray 12 has a plurality of first relief openings 121, 121A, and the heat conducting substrate 171 has a plurality of second relief openings 1711. These second relief openings 1711 respectively correspond to these first relief openings 121. These main heat sources 14 pass through these first relief openings 121 and these second relief openings 1711 and are thermally coupled to these heat pipes 173.

[0020] In this embodiment, the heat conducting substrate 171 has a plurality of protrusions 1712, and these secondary heat sources 15 pass through these first relief openings 121A and are respectively thermally coupled to these protrusions 1712. Among them, since the height of these secondary heat sources 15 is less than the height of these main heat sources 14, by providing these protrusions 1712, the radiator 17 can be more closely thermally coupled to these secondary heat sources 15.

[0021] The first heat conducting members 174 are, for example, heat conducting interface materials such as heat conducting glue and are, for example, thermally coupled between these main heat sources 14 and these heat pipes 173. The second heat conducting members 175 are, for example, heat conducting gaskets and are, for example, thermally coupled between these secondary heat sources 15 and these protrusions 1712.

[0022] The housing 11 has an air inlet 112 and an air outlet 113. The air inlet 112 is used for a cooling air flow to flow into the housing 11 to cool these main heat sources 14 and these secondary heat sources 16, and the air outlet 113 is used for the cooling air flow to flow out of the housing 11. These fans 18 are in the form of exhaust fans 18 for example, and are arranged at the air outlet 113. When the cooling air flow flows into the housing 11 from the air inlet 112, it can flow through these main heat sources 14 and these secondary heat sources 16 for cooling, and then the cooling air flow is drawn out of the housing 11 from the air outlet 113 through these fans 18.

[0023] In this embodiment, since these main heat sources 14 and these secondary heat sources 16 are respectively arranged on the bottom surface 131 and the top surface 132 of the circuit board 13, these main heat sources 14 can be made to be far away from these secondary heat sources 16, so as to distinguish a dedicated heat dissipation area for these main heat sources 14. Therefore, these main heat sources 14 can have more space for heat dissipation, so as to avoid the heat generated by these main heat sources 14 and these secondary heat sources 16 concentrating in one place and being difficult to dissipate. In this way, the heat dissipation efficiency of the main heat sources 14 in the server 10 can be improved.

[0024] In this embodiment, the server 10 may further include two flow limiting plates 19. The two flow limiting plates 19 are arranged between the air inlet 112 and these secondary heat sources 16. Specifically, one of the two flow limiting plates 19 is arranged at a position of the housing 11 close to the air inlet 112, and the other of the two flow limiting plates 19 is arranged on the top surface 132 of the circuit board 13. Wherein, the material of the flow limiting plate 19 is metal for example.

[0025] Each flow limiting plate 19 has a plurality of flow limiting holes 191. These flow limiting holes 191 are used to limit the flow rate of the cooling air flow flowing through these secondary heat sources 16. In this way, part of the cooling air flow can be made to flow through these main heat sources 14 instead. Since the heat dissipation capacity required by these main heat sources 14 is higher than that required by these secondary heat sources 16, by arranging the flow limiting plates 19, a larger flow rate of the cooling air flow can be distributed to flow through these main heat sources 14, thereby improving the heat dissipation capacity for these main heat sources 14.

[0026] In this embodiment, the server 10 may further include a plurality of guiding members 110. These guiding members 110 are blocks for example, and are arranged on the top surface 132 of the circuit board 13. By arranging these guiding members 110, the flow path of the cooling air flow can be blocked and changed to guide the cooling air flow to flow towards these secondary heat sources 16. In this way, these secondary heat sources 16 can be cooled more precisely.

[0027] In this embodiment, the server 10 includes a tray 12, and the tray 12 carries the circuit board 13, but is not limited thereto. In other embodiments, the server may not include a tray, and the circuit board is arranged on a bottom plate for example.

[0028] In this embodiment, the number of the main heat source 14, the secondary heat source 15, the tertiary heat source 16, the first relief openings 121 and 121A, the second relief opening 1711, and the radiator 17 is multiple, but not limited thereto. In other embodiments, the number of the main heat source, the secondary heat source, the tertiary heat source, the first relief opening, the second relief opening, and the radiator may also be only one.

[0029] In this embodiment, the number of the heat pipes 173 of each radiator 17 is multiple, but not limited thereto. In other embodiments, the number of the heat pipes may also be only one.

[0030] In this embodiment, each radiator 17 includes heat pipes 173, but not limited thereto. In other embodiments, the heat pipes may be replaced with heat pipes.

[0031] In this embodiment, the number of the convex portions 1712 of each radiator 17 is multiple, but not limited thereto. In other embodiments, the number of the convex portions may also be only one, as long as the number of the convex portions can correspond to the number of the secondary heat sources.

[0032] In this embodiment, the number of the first heat conducting member 174 and the second heat conducting member 175 is multiple, but not limited thereto. In other embodiments, the number of the first heat conducting member and the second heat conducting member may also be only one.

[0033] In this embodiment, the number of the current limiting plates 19 is two, and one of the two current limiting plates 19 is disposed at the housing 11 near the air inlet 112, and the other of the two current limiting plates 19 is disposed on the top surface 132 of the circuit board 13, but not limited thereto. In other embodiments, the number of the current limiting plates may also be only one, and the current limiting plate is disposed at the housing near the air inlet or on the top surface of the circuit board, or the number of the current limiting plates may also be more than three.

[0034] In this embodiment, the number of the fans 18 is multiple, but not limited thereto. In other embodiments, the number of the fans may also be only one.

[0035] For the server according to the above embodiment, since these main heat sources and these tertiary heat sources are respectively disposed on the bottom surface and the top surface of the circuit board, these main heat sources can be separated from these tertiary heat sources, so as to distinguish the heat dissipation area exclusive to these main heat sources. Therefore, these main heat sources can have more space for heat dissipation, so as to prevent the heat generated by these main heat sources and these tertiary heat sources from concentrating in one place and being difficult to dissipate. In this way, the heat dissipation efficiency of the main heat sources in the server can be improved.

[0036] Although the above-mentioned embodiments of the present invention are disclosed as above, they are not intended to limit the present invention. Any person skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification.

Claims

1. A server, characterized in that: include: A housing having a bottom plate; A circuit board is disposed on the bottom plate and has a bottom surface and a top surface opposite to each other, wherein the bottom surface faces the bottom plate; at least one main heat source disposed on the bottom surface; At least one primary heat source is disposed on the top surface, and the calorific value of the at least one primary heat source is less than the calorific value of the at least one main heat source; as well as At least one heat sink is disposed on the bottom plate and thermally coupled to the at least one main heat source.

2. The server according to claim 1, characterized in that: The server further comprises a tray, which is arranged in the housing and carries the circuit board.

3. The server according to claim 2, characterized in that: The tray has at least one first clearance opening, and the at least one main heat source is disposed through the at least one first clearance opening.

4. The server according to claim 3, characterized in that: The at least one radiator includes a heat-conducting substrate, a fin and at least one heat pipe, wherein the fin and the at least one heat pipe are arranged on the heat-conducting substrate, and the heat-conducting substrate has a second clearance opening, wherein the second clearance opening corresponds to the at least one first clearance opening, and the at least one main heat source is arranged through the second clearance opening and is thermally coupled to the at least one heat pipe.

5. The server according to claim 4, characterized in that: The server further comprises at least one auxiliary heat source, the at least one auxiliary heat source is arranged on the bottom surface, and the heat conductive substrate has at least one protrusion, and the at least one auxiliary heat source is thermally coupled to the at least one protrusion.

6. The server according to claim 5, characterized in that: The at least one heat sink also includes at least one first heat conductor and at least one second heat conductor, wherein the at least one first heat conductor is thermally coupled between the at least one main heat source and the at least one heat pipe, and the at least one second heat conductor is thermally coupled between the at least one auxiliary heat source and the at least one protrusion.

7. The server according to claim 1, characterized in that: The shell further has an air inlet and an air outlet. The air inlet is used for allowing a heat dissipation airflow to flow into the shell, and the air outlet is used for allowing the heat dissipation airflow to flow out of the shell.

8. The server according to claim 7, characterized in that: The server further includes at least one flow limiting plate, which is disposed between the air inlet and the at least one primary heat source and has a plurality of flow limiting holes, and the plurality of flow limiting holes are used to limit the flow of the heat dissipating airflow passing through the at least one primary heat source.

9. The server according to claim 7, characterized in that: The server further includes at least one fan, and the at least one fan is disposed at the air outlet.

10. The server according to claim 1, characterized in that: The server further includes at least one air guide, and the at least one air guide is disposed on the top surface to guide a heat dissipation airflow toward the at least one primary heat source.

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