Liquid cooling heat dissipation assembly and server device comprising same
By designing liquid-cooled heat dissipation components, using the combination of cold plates, thermally conductive metal parts and heat pipes, the problem of low heat dissipation efficiency of traditional air-cooled servers is solved, and efficient heat dissipation of the central processor and voltage regulator is achieved, improving the stability and service life of the system.
Patent Information
- Application Number
- CN202510273708.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-07
- Publication Date
- 2025-05-30
AI Technical Summary
The traditional air-cooled server has the problems of high energy consumption, high noise and low heat dissipation efficiency, especially in environments with high power consumption CPUs and voltage regulators.
A liquid-cooled heat dissipation assembly is designed to contact the central processing unit through the cold plate, and transfer the heat from the voltage regulator to the cold plate through the thermally conductive metal parts and heat pipes, and finally remove the heat through the coolant.
It realizes synchronous effective heat dissipation of the central processor and voltage regulator. Compared with air-cooled cooling, the liquid-cooled heat dissipation components have better thermal conductivity, can cope with high-power components, and the system is more stable and has a longer service life.
Smart Images
Figure CN120066218A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of servers, and particularly to a liquid cooling heat dissipation component and a server device including the same. Background Art
[0002] With the continuous development of artificial intelligence (AI), AI products emerge in an endless stream, and the market's demand for computing power is increasing day by day. In order to improve the instruction cycle, the performance of the server must be correspondingly improved. However, the chip computing power of high-performance servers is usually accompanied by higher power consumption, and high-performance chips require more efficient heat dissipation methods.
[0003] In recent years, countries around the world have actively promoted energy conservation and carbon reduction, making the energy consumption problem of data centers a major concern. Traditional air-cooled servers mainly rely on high-speed rotating fans to cool internal heat-generating components. However, this heat dissipation method not only has high energy consumption, high noise, but also low heat dissipation efficiency. Among them, in traditional servers, the central processing unit (CPU) is usually the main high-power heat-generating component, and in an environment of high-power consumption CPUs, the power supply module responsible for stable power supply (such as a voltage regulator, VR) usually also generates more heat.
[0004] Therefore, how to effectively solve the heat dissipation problems of the CPU and its power supply module has become an important direction in the current research on server heat dissipation technology. Summary of the Invention
[0005] Based on this, in view of the above problems, it is necessary to provide a liquid cooling heat dissipation component and a server device including the same, so as to solve the problems of high energy consumption, high noise and low heat dissipation efficiency of the air-cooled server in the prior art.
[0006] The technical solution is as follows:
[0007] In a first aspect, this application provides a liquid cooling heat dissipation component for cooling a central processing unit and at least one voltage regulator. The liquid cooling heat dissipation component includes:
[0008] A cold plate for thermally contacting the central processing unit and allowing a coolant to flow through;
[0009] At least one heat-conducting metal piece for thermally contacting the at least one voltage regulator; and
[0010] At least one heat pipe, with both ends of the at least one heat pipe being thermally coupled to the cold plate and the at least one heat-conducting metal piece respectively.
[0011] The technical solution is further described below:
[0012] In one of the embodiments, the at least one heat-conducting metal piece is a copper block.
[0013] In one embodiment, it further includes at least one heat-conducting pad, wherein the at least one heat-conducting pad is used to be disposed between the at least one heat-conducting metal piece and the at least one voltage regulator.
[0014] In one embodiment, the number of the at least one voltage regulator is multiple, the number of the at least one heat-conducting metal piece is multiple, and the number of the at least one heat pipe is multiple.
[0015] In one embodiment, the cold plate includes a plate body, a liquid inlet joint and a liquid outlet joint. The plate body is used to be in thermal contact with the central processing unit and has a fluid chamber. The liquid inlet joint and the liquid outlet joint are disposed on the plate body and are in fluid communication with the fluid chamber. The liquid inlet joint is used to be in fluid communication with a heat exchanger through a liquid inlet pipe, and the liquid outlet joint is used to be in fluid communication with the heat exchanger through a liquid outlet pipe.
[0016] In a second aspect, the present application provides a server device, including:
[0017] A main board;
[0018] A central processing unit disposed on the main board;
[0019] At least one voltage regulator disposed on the main board; and
[0020] A liquid cooling heat dissipation assembly, including:
[0021] A cold plate in thermal contact with the central processing unit and used for a coolant to flow through;
[0022] At least one heat-conducting metal piece in thermal contact with the at least one voltage regulator; and
[0023] At least one heat pipe, with two ends of the at least one heat pipe being thermally coupled to the cold plate and the at least one heat-conducting metal piece respectively.
[0024] In one embodiment, the at least one heat-conducting metal piece is a copper block.
[0025] In one embodiment, the liquid cooling heat dissipation assembly further includes at least one heat-conducting pad, and the at least one heat-conducting pad is disposed between the at least one heat-conducting metal piece and the at least one voltage regulator.
[0026] In one embodiment, the number of the at least one voltage regulator is multiple, the number of the at least one heat-conducting metal piece is multiple, and the number of the at least one heat pipe is multiple.
[0027] In one embodiment, the cold plate includes a plate body, an inlet connector, and an outlet connector. The plate body is in thermal contact with the central processing unit and has a fluid chamber. The inlet connector and the outlet connector are disposed on the plate body and are in fluid communication with the fluid chamber. The inlet connector is in fluid communication with a heat exchanger through an inlet pipe, and the outlet connector is in fluid communication with the heat exchanger through an outlet pipe.
[0028] The above liquid cooling heat dissipation component and the server device including the same can effectively dissipate heat from the central processing unit and the voltage regulator through an integrated liquid cooling heat dissipation component design. Among them, the cold plate is in thermal contact with the central processing unit, and the heat generated by the voltage regulator is transferred to the cold plate through a heat conducting metal part and a heat pipe. Finally, the heat of the central processing unit and the voltage regulator is taken away together by the coolant in the cold plate, so as to realize the synchronous and effective heat dissipation of the liquid cooling heat dissipation component for the central processing unit and the voltage regulator. Description of the Drawings
[0029] Figure 1 It is a partial three-dimensional structural schematic diagram of the server device in an embodiment of the present application.
[0030] Figure 2 is Figure 1 the side view structural schematic diagram of the server device in
[0031] Description of the Reference Numerals:
[0032] 1. Server device; 7. Voltage regulator; 8. Central processing unit; 9. Motherboard; 10. Liquid cooling heat dissipation component; 11. Cold plate; 12. Heat conducting metal part; 13. Heat conducting pad; 14. Heat pipe; 110. Plate body; 111. Inlet connector; 112. Outlet connector; P1. Inlet pipe; P2. Outlet pipe. Detailed Embodiments
[0033] In order to make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed embodiments of the present application in conjunction with the drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.
[0034] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings. These are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.
[0035] In addition, if there are terms such as "first" and "second", these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, if there is a term "plurality", the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.
[0036] In the present application, unless otherwise clearly specified and limited, if there are terms such as "mounted", "connected", "connected to", "fixed", etc., these terms should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0037] In the present application, unless otherwise clearly specified and limited, if there is a description such as a first feature being "above" or "below" a second feature, the meaning may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "under" the second feature may be that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower horizontal height than the second feature.
[0038] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If present, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are only for illustrative purposes and do not represent the only implementation.
[0039] Please refer to Figure 1 and Figure 2 , Figure 1 , which is a partial three-dimensional structural schematic diagram of a server device in an embodiment of the present application, and Figure 2 is Figure 1 the side view structural schematic diagram of the server device in
[0040] The server device 1 of this embodiment includes a main board 9, a central processing unit 8, a plurality of voltage regulators 7, and a liquid cooling heat dissipation component 10. The central processing unit 8 and the voltage regulators 7 are both disposed on the main board 9. The liquid cooling heat dissipation component 10 is used to cool the central processing unit 8 and the voltage regulators 7.
[0041] The liquid cooling heat dissipation component 10 may include a cold plate 11, a plurality of heat-conducting metal parts 12, a plurality of heat-conducting pads 13, and a plurality of heat pipes 14.
[0042] The cold plate 11 is in thermal contact with the central processing unit 8 and is used for a coolant to flow through. Specifically, for example, the cold plate 11 may include a plate body 110, an inlet joint 111, and an outlet joint 112. The plate body 110 is in thermal contact with the central processing unit 8, and a fluid chamber is provided inside the plate body 110. The inlet joint 111 and the outlet joint 112 are disposed on the plate body 110 and are both in fluid communication with the fluid chamber of the plate body 110. The inlet joint 111 can be in fluid communication with a coolant distribution unit (Coolant Distribution Unit, CDU, not shown) through an inlet pipe P1, and the outlet joint 112 can be in fluid communication with the coolant distribution unit through an outlet pipe P2. Thereby, a cooling circuit can be formed to effectively dissipate the heat of the central processing unit 8. The coolant distribution unit may include, for example, a heat exchanger, which is used to cool the coolant. Among them, the material of the cold plate 11 is, for example, copper, but the present invention is not limited thereto.
[0043] These heat-conducting metal parts 12 are in thermal contact with these voltage regulators 7. Among them, these heat-conducting metal parts 12 are, for example, copper blocks, but the present invention is not limited thereto. In this embodiment, these heat-conducting pads 13 are respectively disposed between these heat-conducting metal parts 12 and these voltage regulators 7, so that these heat-conducting metal parts 12 can be in thermal contact with these voltage regulators 7 through these heat-conducting pads 13. Among them, the heat-conducting pads are optional, and the present invention is not limited thereto.
[0044] Both ends of these heat pipes 14 are respectively thermally coupled to the plate body 110 of the cold plate 11 and these heat-conducting metal parts 12. Thereby, the heat generated by the voltage regulator 7 can be transferred to the cold plate 11 in a heat conduction manner through the heat-conducting pads 13, the heat-conducting metal parts 12, and the heat pipes 14. Then, through the cooling circuit jointly formed by the cold plate 11 and the coolant distribution unit, the heat transferred to the cold plate 11 is taken away, so as to realize the synchronous and effective heat dissipation of the central processing unit 8 and the voltage regulator 7. Among them, these heat pipes 14 are, for example, heat pipes with high heat-conducting performance, but the present invention is not limited thereto.
[0045] The present invention is not limited to the number of heat-conducting metal parts and heat pipes. In different embodiments of the present invention, the number of heat-conducting metal parts and heat pipes can be adjusted to be single or multiple according to actual design requirements.
[0046] The liquid-cooling heat dissipation component and the server device including the same in the above embodiment can effectively dissipate heat from the central processing unit and the voltage regulator simultaneously through the integrated liquid-cooling heat dissipation component design scheme. Among them, the cold plate is in thermal contact with the central processing unit, and the heat generated by the voltage regulator is transferred to the cold plate through the heat-conducting metal parts and the heat pipes, and finally the heat of the central processing unit and the voltage regulator is taken away together by the coolant in the cold plate, so as to realize the synchronous and effective heat dissipation of the liquid-cooling heat dissipation component for the central processing unit and the voltage regulator.
[0047] In addition, compared with the traditional server using air-cooling, the liquid-cooling heat dissipation component and the server device including the same in the present application adopt a liquid-cooling scheme, and its heat-conducting performance is 15 to 25 times that of the air-cooling scheme, which can achieve heat dissipation with a higher heat flux density, can cope with high-power central processing units and voltage regulators, and has more stable performance and a longer service life.
[0048] Moreover, compared with the traditional server using air-cooling, the liquid-cooling heat dissipation component and the server device including the same in the present application have a more compact liquid-cooling system design, and rely on liquid flow for heat dissipation, are not limited by space, and have a better heat dissipation effect.
[0049] Furthermore, for traditional servers that only use air cooling, the central processing unit and voltage regulator are often difficult points for heat dissipation and often participate in fan speed control, thus becoming risk points for heat dissipation control. The liquid cooling component in this application and the server device containing it can greatly cover the heat sources on the motherboard with its liquid cooling design, which can well solve this problem and thus reduce the power consumption of the system fan.
[0050] When performing simulation tests on the liquid cooling component and the server device containing it in the above embodiments, the inlet temperature of the coolant is set to 40°C, the flow rate is 1.2 L / min, and system simulation is performed. Among them, the power consumption of the central processing unit (CPU) is 600W, and the power consumption of the voltage regulator (VR) is 98.142W. The simulation results show that the highest temperature of the central processing unit is 67.7°C, which is lower than the specification requirement of 72°C, and the temperature of the voltage regulator is 79.7°C, which is also lower than the specification requirement of 90°C. It can be seen that the simulation results meet the specification requirements of each component and have sufficient margins.
[0051] The above-described embodiments only represent several implementation manners of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of this application, several modifications and improvements can still be made, and these all belong to the protection scope of this application. Therefore, the protection scope of the patent of this application shall be subject to the appended claims.
Claims
1. A liquid cooling heat dissipation assembly for cooling a central processing unit and at least one voltage regulator, characterized in that: The liquid cooling heat dissipation component comprises: A cold plate for thermally contacting the CPU and for circulating a cooling liquid; at least one heat-conducting metal member for thermally contacting the at least one voltage regulator; and At least one heat pipe, two ends of which are thermally coupled to the cold plate and the at least one heat-conducting metal member respectively.
2. The liquid cooling heat dissipation assembly according to claim 1, characterized in that: The at least one heat-conducting metal piece is a copper block.
3. The liquid cooling heat dissipation assembly according to claim 1, characterized in that: The device further comprises at least one thermally conductive pad, wherein the at least one thermally conductive pad is used to be arranged between the at least one thermally conductive metal member and the at least one voltage regulator.
4. The liquid cooling heat dissipation assembly according to claim 1, characterized in that: There are multiple voltage regulators, multiple heat-conducting metal parts, and multiple heat pipes.
5. The liquid cooling heat dissipation assembly according to claim 1, characterized in that: The cold plate includes a plate body, a liquid inlet joint and a liquid outlet joint. The plate body is used for thermally contacting the central processing unit and has a fluid chamber. The liquid inlet joint and the liquid outlet joint are arranged on the plate body and fluidically connected to the fluid chamber. The liquid inlet joint is used for fluidly connecting to a heat exchanger through a liquid inlet pipe, and the liquid outlet joint is used for fluidly connecting to the heat exchanger through a liquid outlet pipe.
6. A server device, characterized in that: include: A motherboard; A central processing unit, disposed on the mainboard; At least one voltage regulator, disposed on the mainboard; as well as A liquid cooling heat dissipation assembly, comprising: a cold plate in thermal contact with the CPU and for circulating a cooling fluid; at least one heat-conducting metal member in thermal contact with the at least one voltage regulator; and At least one heat pipe, two ends of which are thermally coupled to the cold plate and the at least one heat-conducting metal member respectively.
7. The server device according to claim 6, characterized in that: The at least one heat-conducting metal piece is a copper block.
8. The server device according to claim 6, characterized in that: The liquid cooling heat dissipation assembly further includes at least one thermal conductive pad, and the at least one thermal conductive pad is disposed between the at least one thermal conductive metal member and the at least one voltage regulator.
9. The server device according to claim 6, characterized in that: There are multiple voltage regulators, multiple heat-conducting metal parts, and multiple heat pipes.
10. The server device according to claim 6, characterized in that: The cold plate includes a plate body, a liquid inlet joint and a liquid outlet joint. The plate body is in thermal contact with the central processing unit and has a fluid chamber. The liquid inlet joint and the liquid outlet joint are arranged on the plate body and are fluidically connected to the fluid chamber. The liquid inlet joint is fluidically connected to a heat exchanger through a liquid inlet pipe, and the liquid outlet joint is fluidically connected to the heat exchanger through a liquid outlet pipe.