Burning test method, device and equipment and computer program product

Abstract

The invention provides a burning test method, device and equipment and a computer program product, and relates to the technical field of tests.The method comprises the steps that chip burning test information is obtained, and the chip burning test information comprises the SN code range and batch; sN codes are burnt on the chips in batches, a burning log is generated, the SN codes are located in an SN code threshold interval, and the burning log is used for recording the burnt SN codes; and when it is determined that the SN codes of the chips are not repeated according to the burning log, it is determined that burning of the batches of chips is completed. According to the technical scheme provided by the invention, the burning test efficiency can be improved.

Description

Technical Field

[0001] This application relates to the field of testing technologies, and in particular, to a programming test method, apparatus, device, and computer program product. Background Art

[0002] A serial number (SN) is a unique identification code composed of a series of numbers, used to identify information such as the production batch, production date, and manufacturer of an item. It is an important identity recognition and authentication tool for chips and can quickly locate chips during after-sales service and exception handling. In the existing process of programming and testing chips, it is usually the tester who manually verifies whether the SN codes are repeated, resulting in low programming test efficiency. Summary of the Invention

[0003] In view of this, embodiments of this application provide a programming test method, apparatus, device, and computer program product to improve the programming test efficiency.

[0004] To achieve the above objective, in a first aspect, embodiments of this application provide a programming test method, which includes: obtaining chip programming test information, where the chip programming test information includes an SN code range and a batch.

[0005] Programming SN codes for the chips in the batch and generating a programming log, where the SN codes are within the SN code threshold range, and the programming log is used to record the programmed SN codes.

[0006] When it is determined according to the programming log that the SN codes of each chip do not repeat, it is determined that the programming of the chips in the batch is completed.

[0007] In a possible implementation manner of the first aspect, the obtaining of the chip programming test information includes:

[0008] Obtaining the identification code corresponding to the test production order;

[0009] Scanning the identification code to obtain the chip programming test information in the test production order.

[0010] In a possible implementation manner of the first aspect, the method further includes:

[0011] When all SN codes within the SN code range are programmed on the chips in the batch, if there are still chips in the batch that have not been programmed with SN codes, it is determined that the chips in the batch are defective products.

[0012] In a possible implementation manner of the first aspect, the method further includes:

[0013] In the case where the SN codes of the chips in the batch are repeated, determine the number of unused SN codes in the SN code threshold range according to the burning log;

[0014] When the number of unused SN codes is greater than or equal to the number of target chips, re-burn each of the target chips with the unused SN codes, where the target chips are the chips with repeated SN codes.

[0015] In a possible implementation manner of the first aspect, the method further includes:

[0016] When the number of unused SN codes is less than the number of target chips, if the number of target chips is less than the first threshold, determine the target chips as defective products; if the number of target chips is greater than or equal to the first threshold, re-burn the target chips according to a spare SN code range that does not overlap with the SN code range.

[0017] In a possible implementation manner of the first aspect, the chip burning test information further includes a test program, and the method further includes:

[0018] Test the chips in the batch according to the test program and generate a test record file;

[0019] Determine the yield rate of the chips in the batch according to the test record file.

[0020] In a possible implementation manner of the first aspect, in the case where the yield rate is lower than the second threshold, perform yield control on the chips in the batch.

[0021] In a second aspect, an embodiment of the present application provides a burning test device, and the device includes:

[0022] An acquisition module, configured to acquire chip burning test information, where the chip burning test information includes an SN code range and a batch;

[0023] A processing module, configured to burn SN codes for the chips in the batch and generate a burning log, where the SN codes are within the SN code threshold range, and the burning log is used to record the burned SN codes;

[0024] A determination module, configured to determine that the burning of the chips in the batch is completed when it is determined according to the burning log that the SN codes of the chips do not appear repeatedly.

[0025] In a possible implementation manner of the second aspect, the acquiring the chip burning test information includes:

[0026] Acquire the identification code corresponding to the test production order;

[0027] Scan the identification code to obtain the chip programming test information in the test production order.

[0028] In a possible implementation manner of the second aspect, the determining module is further configured to:

[0029] When all the SN codes within the SN code range are programmed on the chips of this batch, if there are still chips in this batch of chips that have not been programmed with SN codes, determine that the chips of this batch are defective products.

[0030] In a possible implementation manner of the second aspect, the determining module is further configured to:

[0031] When the SN codes of the chips in this batch appear repeatedly, determine the number of unused SN codes in the SN code threshold range according to the programming log;

[0032] In a possible implementation manner of the second aspect, after the determining module determines that the number of unused SN codes is greater than or equal to the number of target chips,

[0033] The processing module is further configured to: reprogram each of the target chips with the unused SN codes, where the target chips are the chips with repeated SN codes.

[0034] In a possible implementation manner of the second aspect, the determining module is further configured to: when the number of unused SN codes is less than the number of target chips, if the number of target chips is less than the first threshold, determine the target chips as defective products;

[0035] After the processing module determines that the number of target chips is greater than or equal to the first threshold, the processing module is further configured to: reprogram the target chips according to the spare SN code range, where the spare SN code range does not overlap with the SN code range.

[0036] In a possible implementation manner of the second aspect, the chip programming test information further includes a test program, and the processing module is further configured to: test the chips of this batch according to the test program and generate a test record file;

[0037] The determining module is further configured to: determine the yield rate of the chips of this batch according to the test record file.

[0038] In a possible implementation manner of the second aspect, the processing module is further configured to: perform yield control on the chips of this batch when the yield rate is lower than the second threshold.

[0039] In a third aspect, an embodiment of the present application provides a programming test device, including: a memory and a processor, where the memory is used to store a computer program; the processor is used to execute the method described in the above first aspect or any one of the embodiments of the first aspect when calling the computer program.

[0040] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, it implements the method described in the above first aspect or any one of the embodiments of the first aspect.

[0041] In a fifth aspect, an embodiment of the present application provides a computer program product, when the computer program product runs on a programming test device, it causes the programming test device to execute the method described in any one of the above first aspects.

[0042] The programming test method provided by the embodiment of the present application includes: obtaining chip programming test information, where the chip programming test information includes the SN code range and batch; programming the SN code for the chips in the batch and generating a programming log, where the SN code is within the SN code threshold range, and the programming log is used to record the programmed SN codes; when it is determined according to the programming log that the SN codes of each chip do not appear repeatedly, it is determined that the programming of the chips in the batch is completed. By this method, manual operations can be reduced, thereby improving the programming test efficiency.

[0043] For the above second aspect to fifth aspect, the beneficial effects can refer to the beneficial effects brought by the above first aspect and each possible embodiment of the first aspect, and will not be elaborated here. Description of the Drawings

[0044] Figure 1 It is a schematic flowchart of the first programming test method provided by the embodiment of the present application;

[0045] Figure 2 It is a schematic flowchart of obtaining chip programming test information provided by the embodiment of the present application;

[0046] Figure 3 It is a schematic flowchart of the second programming test method provided by the embodiment of the present application;

[0047] Figure 4 It is a schematic structural diagram of the programming test device provided by the embodiment of the present application;

[0048] Figure 5 It is a schematic structural diagram of the programming test device provided by the embodiment of the present application. Detailed Embodiments

[0049] The embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application. The terms used in the implementation part of the embodiments of the present application are only used to explain the specific embodiments of the present application, rather than intended to limit the present application. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.

[0050] When the programming test device performs a programming test, it can be implemented according to Figure 1 the method shown. Figure 1 It is a schematic flowchart of the first programming test method provided by the embodiments of the present application. As Figure 1 shown, the method includes the following steps:

[0051] Step S110, obtain chip programming test information.

[0052] In some embodiments, the chip programming test information can be received by the programming test device from other devices through wired or wireless connections. The chip programming test information can include the SN code range and batch. Among them, the SN code range can be represented in decimal, and the SN code range can be provided by the customer or set by the manufacturer. For the convenience of description, hereinafter, the case where the SN code range is provided by the customer will be taken as an example for description, in order to customize a chip product that better meets the customer's expectations, thereby improving customer satisfaction and market competitiveness.

[0053] Figure 2 It is a schematic flowchart of obtaining chip programming test information provided by the embodiments of the present application. As Figure 2 shown, step S110 may include:

[0054] Step S111, obtain the identification code corresponding to the test production order.

[0055] The test production order can be generated through an Enterprise Resource Planning (ERP) system. In some embodiments, the programming test device can receive the test production order generated by the ERP system through data interaction. In the embodiments of the present application, the identification code is a coding method that can be identified by scanning, and can be a two-dimensional code or a bar code. The identification code can correspond to the test production order one by one. Exemplarily, the identification code can be integrated on the test production order to simplify the process.

[0056] By using the ERP system to generate the test production order in the embodiments of the present application, misjudgment and mistakes caused by problems such as information silos or untimely statistics can be reduced, and it helps the manufacturer to make timely adjustments according to the production plan and production progress, so as to improve production efficiency.

[0057] Step S112: Scan the identification code to obtain the chip burning test information in the test production order.

[0058] After receiving the test production order, the burning test device can scan the identification code through a preset scanning program to obtain the chip burning test information in the test production order. Compared with the existing method of using a handheld scanning gun to scan the identification code, in the embodiment of the present application, the identification code is scanned through the scanning program. On the one hand, this can eliminate the need to set up a scanning gun, reduce costs, and simplify the structure of the burning test device. On the other hand, this can improve the scanning efficiency and thus improve the burning test efficiency.

[0059] Step S120: Burn the SN code for this batch of chips and generate a burning log.

[0060] In some embodiments, after obtaining the batch number and the SN code range, the burning test device can execute a preset burning program and burn the SN code at a preset position of each chip. In some other embodiments, the chip burning test information may further include burning program information. After obtaining the burning program information, the burning test device can call the burning program according to the burning program information to reduce the risk of incorrect program calls.

[0061] The SN codes burned on each chip can all be within the SN code range. The burning test device can randomly generate and burn the SN code without exceeding the SN code range. In some embodiments, the burning test device can also generate the SN code in sequence within the SN code range. For example, after obtaining the SN code range, the first SN code generated by the burning test device can be the starting value of the SN code range. For the sake of easy description, hereinafter, the example of the burning test device generating the SN code in sequence will be used for illustration.

[0062] After scanning the identification code, the burning test device can automatically fill in the information in the burning log according to the chip burning test information, such as the batch number and the first generated SN code, so as to achieve efficient form filling and information entry, and reduce the occurrence of filling errors and omissions caused by manual filling.

[0063] The burning log can also record the SN codes that have been burned for this batch for easy statistics. It can be understood that the burning log can also include the SN codes that have been burned for chips in other batches, so as to facilitate the subsequent identification of mixed chips in other batches.

[0064] Considering that during the programming process of the chips in this batch, if there are situations such as component loss or programming failure when programming the SN code, it will lead to waste of SN codes. Furthermore, after all the SN codes within the SN code range are programmed onto the chips in this batch, there are still blank chips (chips without programmed SN codes), that is, the situation of insufficient SN codes occurs. In one possible implementation, in the case of insufficient SN codes, in addition to stopping the programming, the chips in this batch can be determined as defective products, and the chips without programmed SN codes can be picked out for programming remediation after the customer provides an alternative SN code range. This can not only ensure that the SN code of each chip is unique, reduce the situation of missed programming, but also reduce the occurrence of SN code out-of-range situations.

[0065] Step S130: When it is determined according to the programming log that the SN codes of each chip do not repeat, it is determined that the programming of the chips in this batch is completed.

[0066] There are various reasons for duplicate programming of SN codes. Exemplarily, when the programming test equipment has a machine exception during the programming stage and causes component jamming and stops, the programming test equipment needs to restart a new batch. In the prior art, usually, manual filling of SN codes is performed to instruct the programming test equipment to continue programming according to the SN code. However, manual filling is not only inefficient but also may result in filling errors, causing the same SN code to be programmed onto multiple chips.

[0067] To reduce the situation of duplicate programming of SN codes, after the SN codes of the chips in this batch are programmed, it can be determined according to the programming log whether there are target chips among the chips in this batch, where the target chips are the chips with duplicate SN codes.

[0068] In an alternative implementation, when the SN codes of the chips in this batch are found to be duplicate, the number of unused SN codes in the SN code threshold range can be determined according to the programming log. When the number of unused SN codes is greater than or equal to the number of target chips, the unused SN codes are used to reprogram each target chip to ensure that the SN codes of each chip in this batch are unique.

[0069] When the number of unused SN codes is less than the number of target chips, that is, when the number of unused SN codes is fewer than the number of target chips, if the number of target chips is less than the first threshold, the target chips can be determined as defective products. If the number of target chips is greater than or equal to the first threshold, the target chips can be reprogrammed according to the alternative SN code range, where the alternative SN code range can be the SN code range newly provided by the customer, and the alternative SN code range does not overlap with the SN code range. The size of the first threshold can be set according to actual needs.

[0070] Through the above embodiments, in the programming and testing process, it is no longer necessary to manually check whether the SN codes are repeated and whether they are within the SN code range, which can greatly reduce the manual time, simplify the operation of manually judging SN codes, and thus reduce the risk of errors and omissions caused by manual checking.

[0071] The chip programming and testing information may further include information such as model, internal planned order number, testing process, and testing program. Figure 3 The schematic diagram of the method flow of the second programming and testing method provided by the embodiment of the present application is shown as Figure 3 shown. The programming and testing method may further include step S140, step S150, and step S160. Among them, step S140 and step S150 may be executed after step S120 and before step S130.

[0072] Step S140: Test the chips of this batch according to the test program and generate a test record file.

[0073] After the programming and testing device scans and identifies the code, it can perform a function test on the functions of the chips of this batch according to the test program, and record the test results on the test record file. Among them, the file name of the test record file may be named according to the model, internal planned order number, and SN code range for easy distinction. The test record file may be a single file or may be divided into multiple files according to different test results. The test record file may be saved in the form of Excel, and specifically, it may be selected according to actual needs. The embodiments of the present application do not make special restrictions on this.

[0074] Step S150: Determine the yield rate of the chips of this batch according to the test record file.

[0075] After the function test is completed, the yield rate of the chips can be determined. For example, the programming and testing device can determine the yield rate of the chips of this batch according to the ratio of the number of chips with normal functions in the test record file to the total number of chips of this batch.

[0076] In a possible implementation manner, after step S130, the programming and testing method provided by the present application may further include step S160.

[0077] Step S160: Perform yield control on the chips of this batch when the yield rate is lower than the second threshold.

[0078] The programming test device can determine that the chips of this batch meet the yield requirement when the yield is greater than or equal to the second threshold. Among them, the size of the yield requirement and the second threshold can be provided by the customer or set by the manufacturer according to actual needs, and the embodiments of the present application do not make special restrictions on this. In some embodiments, when the yield is lower than the second threshold, the programming test device can control the yield of the chips of this batch to prevent the chips of this batch from entering the subsequent process.

[0079] In an alternative implementation, taking the example that the test record files are divided into multiple files according to different test results, the BIN 1 file can record the chips with normal functions in the chip test results, the BIN 2 file can record the chips with failed function 1 in the chip test results, and the BIN 3 file can record the chips with failed function 2 in the chip test results. Each BIN file can be input into the Manufacturing Execution System (MES) of the manufacturing enterprise. When the yield does not meet the second threshold, the MES system can control the chips of this batch. Through the above implementation, not only can the test results of each chip in each batch be monitored through the MES system for subsequent traceability and data analysis, but also the yield of the chips in each batch can be controlled according to the yield to prevent the chips of the batches that do not meet the yield requirement from entering the subsequent process.

[0080] The embodiments of the present application provide a programming test method, which includes: obtaining chip programming test information, where the chip programming test information includes the SN code range and the batch; programming the SN code for the chips of the batch and generating a programming log, where the SN code is within the SN code threshold range, and the programming log is used to record the programmed SN codes; when it is determined according to the programming log that the SN codes of each chip do not appear repeatedly, it is determined that the programming of the chips of the batch is completed. This can effectively reduce the operation of manually checking data, thereby improving the efficiency of the programming test.

[0081] Those skilled in the art can understand that the above embodiments are exemplary and not used to limit the present application. Where possible, the execution order of one or several of the above steps can be adjusted, or selective combination can be performed to obtain one or more other embodiments. Those skilled in the art can arbitrarily select and combine from the above steps, and all those that do not deviate from the essence of the solution of the present application fall within the protection scope of the present application.

[0082] Based on the same inventive concept, as an implementation of the above method, an embodiment of the present application provides a programming test device. The device embodiment corresponds to the foregoing method embodiment. For the convenience of reading, the details in the foregoing method embodiment will not be repeated one by one in this device embodiment. However, it should be clear that the device in this embodiment can correspondingly implement all the contents in the foregoing method embodiment.

[0083] Figure 4 FIG. is a schematic structural diagram of the programming test device provided by the embodiment of the present application. As Figure 4 shown, the device provided in this embodiment includes:

[0084] An acquisition module 110, configured to acquire chip programming test information, where the chip programming test information includes an SN code range and a batch;

[0085] A processing module 120, configured to program the SN codes of the chips in the batch and generate a programming log. Among them, the SN codes are within the SN code threshold range, and the programming log is used to record the programmed SN codes;

[0086] A determination module 130, configured to determine that the programming of the chips in the batch is completed when it is determined according to the programming log that the SN codes of each chip do not appear repeatedly.

[0087] In a possible implementation manner, acquiring the chip programming test information includes:

[0088] Acquiring an identification code corresponding to the test production order;

[0089] Scanning the identification code to obtain the chip programming test information in the test production order.

[0090] In a possible implementation manner, the determination module 130 is further configured to:

[0091] When all the SN codes within the SN code range are programmed on the chips in the batch, if there are still chips in the batch that have not been programmed with SN codes, it is determined that the chips in the batch are defective products.

[0092] In a possible implementation manner, the determination module 130 is further configured to:

[0093] When the SN codes of the chips in the batch appear repeatedly, determining the number of unused SN codes in the SN code threshold range according to the programming log;

[0094] In a possible implementation manner, after the determination module 130 determines that the number of unused SN codes is greater than or equal to the number of target chips,

[0095] The processing module 120 is further configured to: reprogram each target chip with the unused SN codes, where the target chips are the chips with repeated SN codes.

[0096] In a possible implementation manner, the determining module 130 is further configured to: when the number of unused SN codes is less than the number of target chips, if the number of target chips is less than the first threshold, determine the target chips as defective products;

[0097] After the processing module 120 determines that the number of target chips is greater than or equal to the first threshold, the processing module is further configured to: re-program the target chips according to the spare SN code range, and the spare SN code range does not overlap with the SN code range.

[0098] In a possible implementation manner, the chip programming test information further includes a test program, and the processing module 120 is further configured to: test the chips of this batch according to the test program, and generate a test record file;

[0099] The determining module 130 is further configured to: determine the yield rate of the chips of this batch according to the test record file.

[0100] In a possible implementation manner, the processing module 120 is further configured to: perform yield control on the chips of this batch when the yield rate is lower than the second threshold.

[0101] The programming test provided in this embodiment can execute the above method embodiment, and its implementation principle and technical effect are similar, which will not be elaborated here.

[0102] Those skilled in the art can clearly understand that, for the convenience and conciseness of description, only the above-mentioned division of each functional unit and module is used as an example. In actual applications, the above functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of a software functional unit. In addition, the specific names of each functional unit and module are only for the convenience of mutual distinction and do not limit the protection scope of the present application. The specific working processes of the units and modules in the above system can refer to the corresponding processes in the foregoing method embodiments, which will not be elaborated here.

[0103] Based on the same inventive concept, an embodiment of the present application also provides a programming test device. Figure 5 The structure diagram of the programming test device provided in the embodiment of the present application is as Figure 5As shown in the figure, the programming test device provided in this embodiment includes: a memory 210 and a processor 220. The memory 210 is used to store a computer program. The processor 220 is used to execute the method described in the above method embodiment when calling the computer program.

[0104] The programming test device provided in this embodiment can execute the above method embodiment, and its implementation principle and technical effect are similar, so details are not described here.

[0105] This application embodiment also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the method described in the above method embodiment is implemented.

[0106] This application embodiment also provides a computer program product. When the computer program product runs on the programming test device, the programming test device is enabled to execute the method described in the above method embodiment.

[0107] In the above embodiment, it can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the processes or functions described in the embodiments of this application are generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium or transmitted through the computer-readable storage medium. The computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center in a wired (such as coaxial cable, optical fiber, digital subscriber line) or wireless (such as infrared, wireless, microwave, etc.) manner. The computer-readable storage medium can be any available medium that the computer can access or a data storage device such as a server or data center that includes one or more integrated available media. The available medium can be a magnetic medium (such as a floppy disk, hard disk, or magnetic tape), an optical medium (such as a DVD), or a semiconductor medium (such as a solid state disk (SSD)), etc.

[0108] Those of ordinary skill in the art can understand all or part of the processes in the above method embodiments. These processes can be completed by relevant hardware instructed by a computer program. The program can be stored in a computer-readable storage medium. When the program is executed, it can include the processes of the above method embodiments. The foregoing storage medium can include various media that can store program codes, such as ROM or random access memory RAM, magnetic disks, or optical discs.

[0109] In this application, the naming or numbering of steps does not mean that the steps in the method flow must be executed in the chronological / logical order indicated by the naming or numbering. The named or numbered process steps can be changed in the order of execution according to the technical purpose to be achieved, as long as the same or similar technical effects can be achieved.

[0110] In the above embodiments, the descriptions of the various embodiments have their own emphases. For parts not detailed or recorded in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0111] In the embodiments provided in this application, it should be understood that the disclosed devices / equipment and methods can be implemented in other ways. For example, the device / equipment embodiments described above are merely illustrative. For example, the division of the modules or units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection to each other can be through some interfaces. The indirect coupling or communication connection of the device or unit can be in electrical, mechanical or other forms.

[0112] It should be understood that when used in the specification and appended claims of this application, the term "comprising" indicates the presence of the described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or their combinations.

[0113] In the description of this application, unless otherwise specified, " / " means that the objects associated before and after are in an "or" relationship. For example, A / B can mean A or B. The "and / or" in this application is only a description of the association relationship of the associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. Among them, A and B can be singular or plural.

[0114] Moreover, in the description of this application, unless otherwise specified, "a plurality of" means two or more than two. "At least one of the following" or its similar expressions refer to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, or c can mean: a, b, c, a - b, a - c, b - c, or a - b - c, where a, b, c can be single or multiple.

[0115] As used in the specification of this application and the appended claims, the term "if" may be construed contextually as "when" or "once" or "in response to determining" or "in response to detecting". Similarly, the phrases "if determined" or "if [the described condition or event] is detected" may be construed contextually to mean "once determined" or "in response to determining" or "once [the described condition or event] is detected" or "in response to detecting [the described condition or event]".

[0116] In addition, in the description of the specification of this application and the appended claims, the terms "first", "second", "third", etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way may be interchanged where appropriate so that the embodiments described herein can be implemented in an order other than that shown or described herein.

[0117] The reference to "one embodiment" or "some embodiments" or the like described in the specification of this application means that a specific feature, structure, or characteristic described in connection with that embodiment is included in one or more embodiments of this application. Thus, statements such as "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments", etc. that appear in different places in this specification do not necessarily all refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in another way.

[0118] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A burning test method, characterized in that: include: Obtain chip burning test information, the chip burning test information including SN code range and batch; Burning SN codes for the batch of chips and generating a burning log, wherein the SN codes are within the SN code threshold interval, and the burning log is used to record the burned SN codes; When it is determined according to the burning log that the SN codes of the chips are not repeated, it is determined that the burning of the chips in the batch is completed.

2. The method according to claim 1, characterized in that The obtaining of chip burning test information includes: Get the identification code corresponding to the test production order; The identification code is scanned to obtain the chip burning test information in the test production order.

3. The method according to claim 1, characterized in that The method further comprises: In the case that all SN codes within the SN code range are burned on the chips of the batch, if there are chips in the batch without SN codes burned, the chips of the batch are determined to be defective.

4. The method according to claim 1, characterized in that: The method further comprises: In the case where the SN codes of the chips in the batch are repeated, determining the number of unused SN codes in the SN code threshold interval according to the burning log; When the number of unused SN codes is greater than or equal to the number of target chips, each of the target chips is reprogrammed using the unused SN codes, and the target chips are chips with repeated SN codes.

5. The method according to claim 4, characterized in that The method further comprises: When the number of unused SN codes is less than the number of target chips, if the number of target chips is less than a first threshold, the target chip is determined to be a defective product; if the number of target chips is greater than or equal to the first threshold, the target chip is re-burned according to a spare SN code range, and the spare SN code range does not overlap with the SN code range.

6. The method according to any one of claims 1 to 5, characterized in that: The chip burning test information also includes a test program, and the method also includes: Testing the batch of chips according to the test program and generating a test record file; The yield rate of the batch of chips is determined according to the test record file.

7. The method according to claim 6, characterized in that When the yield rate is lower than the second threshold, the yield rate of the batch of chips is controlled.

8. A burning test device, characterized in that: include: An acquisition module is used to acquire chip burning test information, wherein the chip burning test information includes SN code range and batch; A processing module, used for burning SN codes for the batch of chips and generating a burning log, wherein the SN codes are within the SN code threshold interval, and the burning log is used for recording the burned SN codes; The determination module is used to determine that the burning of the batch of chips is completed when it is determined according to the burning log that the SN codes of the chips are not repeated.

9. A burning test device, characterized in that: include: A memory and a processor, wherein the memory is used to store a computer program; and the processor is used to execute the method according to any one of claims 1 to 7 when calling the computer program.

10. A computer program product, characterized in that The computer program product comprises a computer program, and when the computer program is executed by a processor, the burn-in test method according to any one of claims 1 to 7 is implemented.

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